ICGOO在线商城 > 电阻器 > 芯片电阻 - 表面安装 > ERJ-2GEJ183X
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ERJ-2GEJ183X产品简介:
ICGOO电子元器件商城为您提供ERJ-2GEJ183X由Panasonic Corporation设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 ERJ-2GEJ183X价格参考¥0.07-¥0.07。Panasonic CorporationERJ-2GEJ183X封装/规格:芯片电阻 - 表面安装, 18 kOhms ±5% 0.1W,1/10W 厚膜 芯片电阻 0402(1005 公制) 汽车级 AEC-Q200 厚膜。您可以下载ERJ-2GEJ183X参考资料、Datasheet数据手册功能说明书,资料中有ERJ-2GEJ183X 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | RES 18K OHM 1/10W 5% 0402 SMD厚膜电阻器 - SMD 0402 18Kohms 5% Tol |
产品分类 | |
品牌 | Panasonic |
产品手册 | |
产品图片 | |
rohs | RoHS 合规性豁免无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 薄膜电阻器,厚膜电阻器 - SMD,Panasonic ERJ-2GEJ183XERJ |
数据手册 | http://industrial.panasonic.com/www-cgi/jvcr13pz.cgi?E+PZ+3+AOA0001+ERJ2GEJ183X+7+WW |
产品型号 | ERJ-2GEJ183X |
产品 | Thick Film Resistors SMD |
产品目录绘图 | |
产品目录页面 | |
产品种类 | 厚膜电阻器 - SMD |
供应商器件封装 | 0402 |
其它名称 | P18KJDKR |
功率(W) | 0.1W,1/10W |
功率额定值 | 100 mW |
包装 | Digi-Reel® |
商标 | Panasonic |
外壳代码-in | 0402 |
外壳代码-mm | 1005 |
外壳宽度 | 0.5 mm |
外壳长度 | 1 mm |
外壳高度 | 0.35 mm |
大小/尺寸 | 0.039" 长 x 0.020" 宽(1.00mm x 0.50mm) |
容差 | 5 % |
封装 | Reel |
封装/外壳 | 0402(1005 公制) |
封装/箱体 | 0402 (1005 metric) |
工作温度范围 | - 55 C to + 155 C |
工具箱 | /product-detail/zh/CR7A-KIT/CR7A-KIT-ND/251435/product-detail/zh/CR7-KIT/CR7-KIT-ND/161332 |
工厂包装数量 | 10000 |
成分 | 厚膜 |
标准包装 | 1 |
温度系数 | 200 PPM / C |
特性 | 获得 AEC-Q200 汽车认证 |
电压额定值 | 50 V |
电阻 | 18 kOhms |
电阻(Ω) | 18k |
端子数 | 2 |
类型 | Thick Film Resistors SMD |
系列 | ERJ |
高度 | 0.016"(0.40mm) |
Thick Film Chip Resistors Thick Film Chip Resistors Type: ERJ XG, 1G, 2G, 3G, 6G, 8G, 14, 12, 12Z, 1T Features ● Small size and lightweight ● High reliability Metal glaze thick fi lm resistive element and three layers of electrodes ● Compatible with placement machines Taping packaging available ● Suitable for both refl ow and fl ow sold er ing ● Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B ● AEC-Q200 qualifi ed (Exemption ERJXG) ● RoHS compliant ■ As for Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers ● ERJXGN, 1GN, 2GE, 3GE, 6GE, 8GE, 14, 12, 12Z, 1T Type, ±5 % 1 2 3 4 5 6 7 8 9 10 11 12 E R J 3 G E Y J 1 0 2 V Product Code Size, Power Rating Marking Resistance Tolerance Packaging Methods Thick Film Code Inch Power R. Code Marking Code Tolerance Code Packaging Part No. Chip Resistors XGN 01005 0.031 W Y Value Marking on J ±5 % Y PWr8ePss2e, d2 0C,0a0rr0ie pr cTsa.ping 1GN 0201 0.05 W black side 0 Jumper ERJXGN 2GE 0402 0.1 W ✽Nil No marking U Embossed Carrier Taping W4P1, 40,000 pcs. 3GE 0603 0.1 W 6GE 0805 0.125 W Resistance Value C P2 rmesmse pdit cCha,r r1ie5r,0 T0a0p ipncgs . ERJ1GN 8GE 1206 0.25 W The first two digits are significant figures of resistance and 14 1210 0.5 W the third one denotes number of zeros following. X Punched Carrier Taping 2 mm pitch, 10,000 pcs. 12 1812 0.75 W Decimal Point is expressed by R as 4.7 = 4R7. ERJ2GE 12Z 2010 0.75 W Jumper is expressed by R00. Y Punched Carrier Taping 2 mm pitch, 20,000 pcs. 1T 2512 1 W ERJ3GE Punched Carrier Taping V ERJ6GE 4 mm pitch, 5,000 pcs. ✽ When omitted, the rest of the P/N factors shall be moved up respectively. ERJ8GE (Only XGN, 1GN, 2GE type) ERJ14 Embossed Carrier Taping ERJ12 4 mm pitch, 5,000 pcs. U ERJ12Z Embossed Carrier Taping ERJ1T 4 mm pitch, 4,000 pcs. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 07 Aug. 2018
Thick Film Chip Resistors Construction Dimensions in mm (not to scale) L a Protective coating W Alumina substrate Electrode (Inner) t b Dimensions (mm) Mass (Weight) Part No. L W a b t (g/1000 pcs.) ERJXG 0.40±0.02 0.20±0.02 0.10±0.03 0.10±0.03 0.13±0.02 0.04 Electrode ERJ1G 0.60±0.03 0.30±0.03 0.10±0.05 0.15±0.05 0.23±0.03 0.15 (Between) ERJ2G 1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05 0.8 ERJ3G 1.60±0.15 0.80+–00..1055 0.30±0.20 0.30±0.15 0.45±0.10 2 ERJ6G 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4 ERJ8G 3.20+–00..2005 1.60+–00..0155 0.50±0.20 0.50±0.20 0.60±0.10 10 ERJ14 3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16 Thick film Electrode (Outer) resistive element ERJ12 4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27 ERJ12Z 5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27 ERJ1T 6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45 Ratings [For Resistor] Power Rating (3) Limiting Element Maximum Overload Resistance Resistance Category Part No. T.C.R. AEC-Q200 at 70 °C Voltage (1) Voltage (2) Tolerance Range Temperature Range (inch size) (×10–6/°C) Grade (W) (V) (V) (%) (Ω) (°C) <10 Ω : –100 to +600 ERJXG 0.031 15 30 ±5 1 to 1M (E24) 10 Ω to 100 Ω : ±300 –55 to +125 – (01005) 100 Ω ≤ : ±200 ERJ1G 0.05 25 50 ±5 1 to 10M (E24) –55 to +125 Grade 1 (0201) ERJ2G 0.1 50 100 ±5 1 to 10M (E24) –55 to +155 Grade 0 (0402) ERJ3G <10 Ω: 0.1 75 150 ±5 1 to 10M (E24) –55 to +155 Grade 0 (0603) –100 to +600 ERJ6G 0.125 150 200 ±5 1 to 10M (E24) –55 to +155 Grade 0 (0805) ERJ8G 10 Ω to 1M Ω: 0.25 200 400 ±5 1 to 10M (E24) –55 to +155 Grade 0 (1206) ±200 ERJ14 0.5 200 400 ±5 1 to 10M (E24) –55 to +155 Grade 0 (1210) ERJ12 1M Ω<: 0.75 200 500 ±5 1 to 10M (E24) –55 to +155 Grade 0 (1812) –400 to +150 ERJ12Z 0.75 200 500 ±5 1 to 10M (E24) –55 to +155 Grade 0 (2010) ERJ1T 1 200 500 ±5 1 to 1M (E24) –55 to +155 Grade 0 (2512) (1) Rated Continuous Working Voltage (RCWV) shall be det er mined from RCWV=√Power Rating × Re sis tance Values, or Limiting Element Voltage liste d above, whichever less. (2) Overload Test Voltage (OTV) shall be determined from OTV=Specified Magnification (refer to performance) × RCWV or Maximum Overload Voltage listed above, whichever less. (3) Use it on the condition that the case temperature is below the upper category temperature. [For Jumper] Power Derating Curve Part No. Rated Current Maximum Over load Current (1) For resistors operated in ambient temperatures above (inch size) (A) (A) 70 °C, power rating shall be derated in accordance ERJXG (01005) with the figure below. 0.5 1 ERJ1G (0201) ERJ2G (0402) 1 2 –55 °C 70 °C ERJ3G (0603) 100 EERRJJ68GG ((01280065)) ad (%)6800 21G4,, 132G, ,1 62GZ,, 18TG, o EEERRRJJJ111422 Z (((112280111002))) 2 4 Rated L24000 XG,1 12G5 °C 155 °C –60 –40–20 0 20 40 60 80 100120140160180 ERJ1T (2512) Ambient Temperature (°C) (1) Overload test current Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 07 Aug. 2018
Thick Film Chip Resistors Perfomance Performance Requirements Test Item Test Conditions Resistor type Jumper type Within Specifi ed Resistance 50m Ω or less 20 °C Tolerance Within Specifi ed T. C. R. 50m Ω or less +25 °C/+155 °C (ERJXG, ERJ1G : +25 °C/+125 °C) T. C. R. Rated Voltage × 2.5, 5 s Overload ±2% 50m Ω or less Jumper type : Max. Overload Current, 5 s Resistance to Soldering Heat ±1% 50m Ω or less 270 °C, 10 s Rapid Change of –55 °C (30min.) / +155 °C (ERJXG, ERJ1G : +125 °C) (30min.), ±1% 50m Ω or less Temperature 100 cycles High Temperature ±1% 50m Ω or less +155 °C (ERJXG, ERJ1G : +125 °C) , 1000 h Exposure Damp Heat, Steady State ±1% 50m Ω or less 60 °C, 90% to 95 %RH, 1000 h 60 °C, 90% to 95 %RH, Rated Voltage (Jumper type: Rated Current), Load Life in Humidity ±3% 50m Ω or less 1.5 h ON/0.5 h OFF cycle, 1000 h 70 °C, Rated Voltage(Jumper type: Rated Current), Endurance at 70 °C ±3% 50m Ω or less 1.5 h ON/0.5 h OFF cycle, 1000 h Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 07 Aug. 2018
Surface Mount Resistors Safety precautions Safety Precautions (Common precautions for Surface Mount Resistors) The following are precautions for individual products. Please also refer to the common precautions for Fixed Resistors in this catalog. 1. Take measures against mechanical stress during and after mounting of Surface Mount Resistors (hereafter called the resistors) so as not to damage their electrodes and protective coatings. Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur. 2. Keep the rated power and ambient temperature within the specified derating curve. Some circuit boards, wiring patterns, temperatures of heat generated by adjacent components, or amb ie nt tem per a tures can become factors in the rise of the temperature of the res is tors, regardless of the level of power applied. Therefore, check the conditions before use and op ti mize them so as not to damage the boards and peripheral components. Make sure to contact us before using the resistors under special conditions. 3. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 4. Before using halogen-based or other high-activity flux, check the possible effects of the flux residues on the per for mance and reliability of the resistors. 5. When soldering with a soldering iron, never touch the resistors'bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.). 6. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder. 7. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 8. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 9. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. 10. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of imm er sion. 11. Transient voltage If there is a possibility that the transient phen om e non (significantly high voltage ap plied in a short time) may occ ur or that a high voltage pulse may be applied, make sure to evaluate and check the chara ct er is tics of Fixed Metal (Oxide) Film Resistors mounted on your product rather than only depending on the calculated pow er limit or steady-state conditions to complete the des ign or decide to use the resistors. 12. Do not apply excessive tension to the terminals. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Sep. 2014
Safety Precautions (Common precautions for Fixed Resistors) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipm ent where a defect in these products may cause the loss of human life or other significant dam age, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sing le fault (1) Precautions for use • These products are designed and manufactured for general and standard use in general elect ron ic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl, H S, NH , SO , or NO 2 2 3 2 2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products. • Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the performance or reliability of the products. • Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arr iv al at your company, provided that they remain packed as they were when delivered and stored at a temp er a ture of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl, H S, NH , SO , or NO 2 2 3 2 2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. 01 Sep. 2014
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