Thick Film Chip Resistors Thick Film Chip Resistors 01005, 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 Type: ERJ XG, 1G, 2G, 3G, 6G, 8G, 14, 12, 12Z, 1T ■ Features ● Small size and lightweight ● High reliability Metal glaze thick fil m resistive element and three layers of electrodes ● Compatible with placement machines Taping packaging available ● Suitable for both reflo w and fl ow sol deri ng ● Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B ■Explanation of Part Numbers ● ERJXGE, 1GE, 2GE, 3GE, 6GE, 8GE, 14, 12, 12Z, 1T Series, ±5 % type 1 2 3 4 5 6 7 8 9 10 11 12 E R J 3 G E Y J 1 0 2 V ProductCode Size,PowerRating Marking ResistanceTolerance PackagingMethods ThickFilm Type:inches PowerR. Code Marking Code Tolerance Code Packaging ChipResistors XGE:01005 0.031W Y ValueMarkingon J ±5% Y P2rmesmsedpiCtcahrr,ie2r0T0a0p0inpgcs. 1GE:0201 0.05W blackside 0 Jumper (OnlyXGEtype) 2GE:0402 0.063W ✽Nil Nomarking PressedCarrierTaping 3GE:0603 0.1W C 2mmpitch,15000pcs. 6GE:0805 0.125W ResistanceValue (Only1GEtype) 8GE:1206 0.25W Thefirsttwodigitsaresignificantfiguresofresistanceand PunchedCarrierTaping 14:1210 0.25W thethirdonedenotesnumberofzerosfollowing. X 2mmpitch,10000pcs. (Only2GEtype) 12:1812 0.5W DecimalPointisexpressedbyRas4.7=4R7. 12Z:2010 0.5W JumperisexpressedbyR00. V PunchedCarrierTaping (Only3GE,6GE,8GEtype) 1T:2512 1W EmbossedCarrierTaping U (Only14,12,12Z,1Ttype) ✽ When omitted, the rest of the P/N factors shall be moved up respectively. (Only XGE, 1GE, 2GE type) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2005

Thick Film Chip Resistors ■Construction ■Dimensions in mm (not to scale) L a W Protectivecoating Aluminasubstrate Electrode(Inner) t b Type Dimensions (mm) Mass (Weight) (inches) L W a b t (g/1000 pcs.) ERJXG 0.40±0.02 0.20±0.02 0.10±0.03 0.10±0.03 0.13±0.02 0.04 (01005) ERJ1G 0.60±0.03 0.30±0.03 0.10±0.05 0.15±0.05 0.23±0.03 0.15 Electrode (0201) (Between) ERJ2G 1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05 0.8 (0402) ERJ3G 1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2 (0603) –0.05 ERJ6G 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4 (0805) ERJ8G 3.20+0.05 1.60+0.05 0.50±0.20 0.50±0.20 0.60±0.10 10 (1206) –0.20 –0.15 Thickfilm Electrode(Outer) E(1R21J104) 3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16 resistiveelement ERJ12 4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27 (1812) ERJ12Z 5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27 (2010) ERJ1T 6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45 (2512) ■ Ratings <For Resistor> Limiting Element Maximum Overload Resistance Resistance T.C.R. Category Temperature Type Power Rating Voltage (Maximum Voltage(2) Tolerance Range [(cid:2)10–6/°C Range (Operating (inches) at 70 °C (W) Temperature Range) RCWV)(1) (V) (V) (%) ((cid:1)) (ppm/°C)] (°C) ERJXG <100 (cid:1):±300 (01005) 0.031 15 30 ±5 10 to 1 M (E24) 100 (cid:1)<:±200 –55 to +125 ERJ1G 0.05 15 30 ±5 1 to 10 M (E24) –55 to +125 (0201) ERJ2G <10 (cid:1): 0.063 50 100 ±5 1 to 10 M (E24) –55 to +155 (0402) –100 to +600 ERJ3G 0.1 50 100 ±5 1 to 10 M (E24) –55 to +155 (0603) ERJ6G 0.125 150 200 ±5 1 to 10 M (E24) –55 to +155 (0805) ERJ8G 10 (cid:1) to 1 M(cid:1): 0.25 200 400 ±5 1 to 10 M (E24) –55 to +125 (1206) ±200 ERJ14 0.25 200 400 ±5 1 to 10 M (E24) –55 to +125 (1210) ERJ12 0.5 200 400 ±5 1 to 10 M (E24) –55 to +125 (1812) ERJ12Z 1 M(cid:1)<: (2010) 0.5 200 400 ±5 1 to 10 M (E24) –400 to +150 –55 to +125 ERJ1T 1 200 400 ±5 1 to 1 M (E24) –55 to +125 (2512) (1) Rated Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=(cid:3)Power Rating (cid:2) Res is tance Values, or Limiting Element Voltage (max. RCWV) list ed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be de term ined from SOTV=2.5(cid:2)Power Rating or max. Over load Volt age list ed above whiche ve r less. <For Jumper> Power Derating Curve Type Rated Current Maximum Overl oad Current (inches) (A) (A) For resistors operated in ambient temperatures above ERJ1G (0201) 0.5 1 70 °C, power rating shall be derated in accordance ERJ2G (0402) with the fi gure below. 1 2 ERJ3G (0603) –55°C 70°C 100 ERJ6G (0805) %)80 ERJ8G (1206) ad(60 EEERRRJJJ111422Z (((112280111200))) 2 4 RatedLo24000 XG,1G,2G,14,12,121Z2,15T°C3G,165G5,°8CG –60 –40–20 0 20 40 60 80 100120140160180 ERJ1T (2512) AmbientTemperature(°C) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2005

Thick Film Chip Resistors ■ Packaging Methods (Taping) ● Standard Quantity Type Kind of Taping Pitch (P) Quantity 1 ERJXG 20000 pcs./reel Pressed Carrier Taping ERJ1G 2 mm 15000 pcs./reel ERJ2G 10000 pcs./reel ERJ3G Punched Carrier Taping ERJ6G ERJ8G 5000 pcs./reel ERJ14 4 mm ERJ12 Embossed Carrier Taping ERJ12Z ERJ1T 4000 pcs./reel ● Carrier Tape (Unit : mm) Pressed Carrier Punched Carrier Embossed Carrier P1 P2 P0 fD0 E F W B T T T A P1 (2mmpitch) fD1(OnlyEmboss) Type A B W F E P P P fD T fD 1 2 0 0 1 ERJXG 0.25±0.03 0.45±0.03 0.31±0.05 – ERJ1G 0.38±0.05 0.68±0.05 2.00±0.10 0.42±0.05 – ERJ2G 0.70±0.05 1.20±0.05 0.52±0.05 – 8.00±0.20 ERJ3G 1.10±0.10 1.90±0.10 3.50±0.05 0.70±0.05 – ERJ6G 1.65±0.15 2.50±0.20 – 1.75±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0.84±0.05 ERJ8G 2.00±0.15 3.60±0.20 −0 – ERJ14 2.80±0.20 3.50±0.20 8.00±0.30 4.00±0.10 1.0+0.10 −0 ERJ12 3.50±0.20 4.80±0.20 1.00±0.10 ERJ12Z 2.80±0.20 5.30±0.20 12.00±0.30 5.50±0.20 1.5 min. ERJ1T 3.60±0.20 6.90±0.20 ● Taping Reel (Unit : mm) Type fA fB fC W T T ERJXG ERJ1G ERJ2G fC ERJ3G 9.0±1.0 11.4±1.0 Bf ERJ6G 180.0+0 60 min. 13.0±1.0 ERJ8G –3.0 ERJ14 ERJ12 fA W ERJ12Z 13.0±1.0 15.4±2.0 ERJ1T Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2005

Thick Film Chip Resistors ■ Recommended Land Pattern In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sold er amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W). Type Dimensions (mm) (inches) a b c ChipResistor ERJXG(01005) 0.15 to 0.20 0.5 to 0.7 0.20 to 0.25 ERJ1G(0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 ERJ2G(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 c ERJ3G(0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 ERJ6G(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 ERJ8G(1206) 2 to 2.4 4.4 to 5 1.2 to 1.8 a ERJ14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 b ERJ12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 ERJ12Z(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8 ERJ1T(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5 ■ Recommended Soldering Conditions Recommendations and precautions are described below. ●Recommended soldering conditions for reflo w · Reflo w soldering shall be performed a maximum of two times. · Please contact us for additional information when For soldering (Example : Sn/Pb) used in conditions other than those specifie d. · Please measure the temperature of the terminals Temperature Time and study every kind of solder and printed circuit Preheating 140 °C to 160 °C 60 s to 120 s board for solderability bef ore ac tu al use. Main heating Above 200 °C 30 s to 40 s Peak Peak 235 ± 5 °C max. 10 s ure Preheating For lead-free soldering (Example : Sn/Ag/Cu) at er Temperature Time p m Heating Preheating 150 °C to 180 °C 60 s to 120 s e T Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ●Recommended soldering conditions for flo w For soldering For lead-free soldering Temperature Time Temperature Time Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER3 of this catalog. 1. Take measures against mechanical stress during and after mounting of Thick Film Chip Resistors (herea f ter called the resistors) so as not to damage their electrodes and protective coatings. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, fin ish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sist ors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2005

Safety Precautions (Common precautions for Fixed Resistors) (cid:127) When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specific ations with us in advance. The design and specific ations in this catalog are subject to change without prior notice. (cid:127) Do not use the products beyond the specifi cations described in this catalog. (cid:127) This catalog explains the quality and performance of the products as individual components. Be fore use, check and evaluate their operations when installed in your products. (cid:127) Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to vehicles (au to mob ile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating app lia nc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equipm ent. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use (cid:127) These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipment, home electric ap plia nc es, offi ce equipment, information and com mu ni ca tion equipment) (cid:127) These products are not intended for use in the following special conditions. Bef ore using the products, care full y check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. In an environment where strong static electricity or electromagnetic waves exist 5. In an environment where these products cause dew condensation 6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials (cid:127) These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. (cid:127) Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating comp o nents. Do not mount or place heat-generating comp on ents or infl ammables, such as vinyl-coated wires, near these products . (cid:127) Note that non-cleaning solder, halogen-based highly active flu x, or water-soluble flu x may deteriorate the performance or reliability of the products. (cid:127) Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 ° C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their elect ri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tapi ng mat er i als) may be def ormed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Mar. 2005 – ER3 –