Precision Thick Film Chip Resistors Precision Thick Film Chip Resistors ERJ G: 01005, 0201 ERJ R: 0201, 0402, 0603, 0805 ERJ E : 0603, 0805, 1206, 1210, 1812, 2010, 2512 Type: ERJ XG, 1G ERJ 1R, 2R, 3R, 6R ERJ 3E, 6E, 8E, 14, 12, 1T ■ Features ● Small size and lightweight ● Low Resistance Tolerance ● High reliability ERJXG, 1G, 2R, 3E, 6E, 8E, 14, 12, 1T Series.....±1 % Metal glaze thick fil m resistive element and three ERJ1R, 2R, 3R, 6R Series .............................. ±0.5 % layers of electrodes ● Reference Standards ● Compatible with placement machines IEC 60115-8, JIS C 5201-8 Taping packaging available ● Suitable for both refl ow and flo w soldering ■ Explanation of Part Numbers ✽ For existing customers, we continue to use the three-digit resistance code in the part numbers. ● ERJ1R, 2R, 3R, 6R Series, ±0.5 % type 1 2 3 4 5 6 7 8 9 10 11 12 E R J 3 R B D 1 0 0 2 V ProductCode Size,PowerRating T.C.R.Marking ResistanceTolerance PackagingMethods ThickFilm Type:inches PowerR. Code T.C.R. Code Tolerance Code Packaging Type ChipResistors 1R:0201 0.05W ±50(cid:1)10–6/˚C(ppm/˚C) D ±0.5% PressedCarrierTaping H C ERJ1R 2R:0402 0.063W (1R,2R) 2mmpitch 3R:0603 0.063W ±50(cid:1)10–6/˚C(ppm/˚C) PunchedCarrierTaping B X ERJ2R 6R:0805 0.1W (3R,6R) 2mmpitch ±100(cid:1)10–6/˚C(ppm/˚C) PunchedCarrierTaping ERJ3R K (1R,2R) V 4mmpitch ERJ6R ±100(cid:1)10–6/˚C(ppm/˚C) E (3R,6R) ResistanceValue✽ Thefirstthreedigitsaresignificantfiguresofresistance andthelastonedenotesnumberofzerosfollowing. Example: 1002(cid:1)10k(cid:2) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2008

Precision Thick Film Chip Resistors ● ERJXG, 1G Series, ±1 % type 1 2 3 4 5 6 7 8 9 10 11 12 E R J 1 G E F 1 0 0 2 C ProductCode Size,PowerRating ResistanceTolerance ResistanceValue PackagingMethods ThickFilm Type:inches PowerR. Code Tolerance Thefirstthreedigitsaresignificant Code Packaging Type ChipResistors XGN:01005 0.031W F ±1% figuresofresistanceandthelast PressedCarrierTaping 1GE:0201 0.050W onedenotesnumberofzeros Y 2mmpitch,20000pcs.ERJXGN PressedCarrierTaping C ERJ1GE 2mmpitch,15000pcs. ● ERJ2R, 3E, 6E, 8E, 14, 12, 1T Series, ±1 % type 1 2 3 4 5 6 7 8 9 10 11 12 E R J 8 E N F 1 0 0 2 V ProductCode Size,PowerRating Marking ResistanceTolerance PackagingMethods ThickFilm Type:inches PowerR. Code Marking Code Tolerance Code Packaging Type ChipResistors 2R:0402 0.1W Nomarking F ±1% PunchedCarrierTaping K X ERJ2R 3E:0603 0.1W (2R,3E) 2mmpitch 6E:0805 0.125W 4digitmarking ERJ3E 8E:1206 0.25W N (6E,8E,14,12,1T) V PunchedCarrierTaping ERJ6E 4mmpitch 14:1210 0.5W 4digitmarking ERJ8E S 12:1812 0.75W [12(2010inches)] ERJ14 EmbossedCarrierTaping 12:2010 0.75W U ERJ12 4mmpitch 1T:2512 1W ERJ1T ResistanceValue✽ Thefirstthreedigitsaresignificantfiguresofresistance andthe4thonedenotesnumberofzerosfollowing. ■ ■ Construction Dimensions in mm (not to scale) L a W Protectivecoating t b Aluminasubstrate Type Dimensions (mm) Mass (Weight) Electrode(Inner) (inches) L W a b t [g/1000 pcs.] ERJXG 0.40±0.02 0.20±0.02 0.10±0.03 0.10±0.03 0.13±0.02 0.04 (01005) ERJ1G, 1R 0.60±0.03 0.30±0.03 0.10±0.05 0.15±0.05 0.23±0.03 0.15 (0201) ERJ2R(cid:1) 1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05 0.8 Electrode (0402) (Between) E(0R6J033R)(cid:1) 1.60±0.15 0.80+–00..1055 0.30±0.20 0.30±0.15 0.45±0.10 2 ERJ6R(cid:1) 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4 (0805) E(0R6J033E)K 1.60±0.15 0.80+–00..1055 0.30±0.20 0.30±0.15 0.45±0.10 2 Thickfilm resistiveelement Electrode(Outer) E(0R8J065E)N 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4 E(1R2J086E)N 3.20+–00..0250 1.60+–00..1055 0.50±0.20 0.50±0.20 0.60±0.10 10 ERJ14N 3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16 (1210) ERJ12N 4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27 (1812) ERJ12S 5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27 (2010) ERJ1TN 6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45 (2512) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Oct. 2008

Precision Thick Film Chip Resistors ■ Ratings <±0.5 %> Limiting Element Maximum Overload Resistance Resistance T.C.R. Category Temperature Type Power Rating Voltage (Maximum Voltage(2) Tolerance Range [(cid:1)10–6/°C Range (Operating (inches) at 70 °C (W) Temperature Range) RCWV)(1) (V) (V) (%) ((cid:2)) (ppm/°C)] (°C) ERJ1RH 1 k to 100 k 0.05 15 30 ±0.5 ±50 –55 to +125 (0201) (E24, E96) ERJ1RK 100 to 976 0.05 15 30 ±0.5 ±100 –55 to +125 (0201) (E24, E96) ERJ2RH 100 to 100 k 0.063 50 100 ±0.5 ±50 –55 to +125 (0402) (E24, E96) 10 to 97.6 ERJ2RK 0.063 50 100 ±0.5 102 k to 1 M ±100 –55 to +125 (0402) (E24, E96) ERJ3RB 100 to 100 k 0.063 50 100 ±0.5 ±50 –55 to +125 (0603) (E24, E96) 10 to 97.6 ERJ3RE 0.063 50 100 ±0.5 102 k to 1 M ±100 –55 to +125 (0603) (E24, E96) ERJ6RB 100 to 100 k 0.1 150 200 ±0.5 ±50 –55 to +125 (0805) (E24, E96) 10 to 97.6 ERJ6RE 0.1 150 200 ±0.5 102 k to 1 M ±100 –55 to +125 (0805) (E24, E96) <±1 %> Limiting Element Maximum Overload Resistance Resistance T.C.R. Category Temperature Type Power Rating Voltage (Maximum Voltage(2) Tolerance Range [(cid:1)10–6/°C Range (Operating (inches) at 70 °C (W) Temperature Range) RCWV)(1) (V) (V) (%) ((cid:2)) (ppm/°C)] (°C) ERJXG 10 to 1 M <100 (cid:2) : ±300 (01005) 0.031 15 30 ±1 (E24, E96) 100 (cid:2) < : ±200 –55 to +125 ERJ1G 10 to 1 M(3) 0.05 25 50 ±1 ±200 –55 to +125 (0201) (E24, E96) ERJ2RK 10 to 1 M 0.1 50 100 ±1 ±100 –55 to +155 (0402) (E24, E96) ERJ3EK 10 to 1 M 0.1 75 150 ±1 ±100 –55 to +155 (0603) (E24, E96) ERJ6EN 10 to 2.2 M 0.125 150 200 ±1 ±100 –55 to +155 (0805) (E24, E96) ERJ8EN 10 to 2.2 M 0.25 200 400 ±1 ±100 –55 to +155 (1206) (E24, E96) ERJ14N 10 to 1 M 0.5 200 400 ±1 ±100 –55 to +155 (1210) (E24, E96) ERJ12N 10 to 1 M 0.75 200 500 ±1 ±100 –55 to +155 (1812) (E24, E96) ERJ12S 10 to 1 M 0.75 200 500 ±1 ±100 –55 to +155 (2010) (E24, E96) ERJ1TN 10 to 1 M 1 200 500 ±1 ±100 –55 to +155 (2512) (E24, E96) (1) Rated Continuous Working Voltage (RCWV) shall be det erm ined from RCWV=(cid:3)Power Rating (cid:1) Res is tance Values, or Limiting Element Voltage (max. RCWV) list ed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=2.5 (cid:1) Power Rating or max. Over load Volt age list ed above whichever less. (3) Please contact us when you need a type with a resistance of less than 10 (cid:2). –55°C 70°C Power Derating Curve 100 For resistors operated in ambient temperatures above %) 80 70 °C, power rating shall be derated in ac cor dance d( 60 2RK,3E,6E,8E, with the fi gure on the right. oa 14,12,1T L d 40 e XG,1G,1R,2RH, Rat 20 2RK,3R,6R 125°C 155°C 0 –60 –40 –20 0 20 40 60 80 100 120 140 160 180 AmbientTemperature(°C) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Jul. 2008

Precision Thick Film Chip Resistors ■ Packaging Methods (Taping) ● Standard Quantity Type Kind of Taping Pitch (P) Quantity 1 ERJXG 20000 pcs./reel Pressed Carrier Taping ERJ1G, ERJ1R 2 mm 15000 pcs./reel ERJ2RH, ERJ2RK 10000 pcs./reel ERJ3R(cid:1), ERJ3EK Punched Carrier Taping ERJ6R(cid:1), ERJ6EN ERJ8EN 5000 pcs./reel ERJ14N 4 mm ERJ12N Embossed Carrier Taping ERJ12S ERJ1TN 4000 pcs./reel ● Carrier Tape (Unit : mm) Pressed Carrier Punched Carrier Embossed Carrier P1 P2 P0 φD0 E F W B T T T A P1 (2mmpitch) φD1(OnlyEmboss) Type A B W F E P P P φD T φD 1 2 0 0 1 ERJXG 0.24±0.03 0.45±0.03 0.31±0.05 – ERJ1G, ERJ1R 0.38±0.05 0.68±0.05 2.00±0.10 0.42±0.05 – ERJ2RH, ERJ2RK 0.67±0.05 1.17±0.05 0.52±0.05 – 8.00±0.20 ERJ3R(cid:1), ERJ3EK 1.10±0.10 1.90±0.10 3.50±0.05 0.70±0.05 – ERJ6R(cid:1), ERJ6EN 1.65±0.15 2.50±0.20 – 1.75±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0.84±0.05 ERJ8EN 2.00±0.15 3.60±0.20 −0 – ERJ14N 2.80±0.20 3.50±0.20 8.00±0.30 4.00±0.10 1.0+0.10 −0 ERJ12N 3.50±0.20 4.80±0.20 1.00±0.10 ERJ12S 2.80±0.20 5.30±0.20 12.00±0.30 5.50±0.20 1.5 min. ERJ1TN 3.60±0.20 6.90±0.20 ● Taping Reel (Unit : mm) Type φA φB φC W T ERJXG T ERJ1G, ERJ1R ERJ2RH, ERJ2RK φC ERJ3R(cid:1), ERJ3EK 9.0±1.0 11.4±1.0 φB ERJ6R(cid:1), ERJ6EN 180.0+0 60 min. 13.0±1.0 –3.0 ERJ8EN ERJ14N φA W ERJ12N ERJ12S 13.0±1.0 15.4±2.0 ERJ1TN Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006

Precision Thick Film Chip Resistors ■ Recommended Land Pattern In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sold er amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W). Dimensions (mm) Type (inches) ChipResistor a b c ERJXG (01005) 0.15 to 0.2 0.5 to 0.7 0.20 to 0.25 ERJ1G, 1R (0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 c ERJ2R (0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 ERJ3R, 3EK (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 ERJ6R, 6EN (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 a ERJ8EN (1206) 2 to 2.4 4.4 to 5 1.2 to 1.8 b ERJ14N (1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 ERJ12N (1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 ERJ12S (2010) 3.6 to 4 6.2 to 7 1.8 to 2.8 ERJ1TN (2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5 ■ Recommended Soldering Conditions Recommendations and precautions are described below. ●Recommended soldering conditions for reflo w · Refl ow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specifie d. For soldering (Example : Sn/Pb) · Please measure the temperature of the terminals Temperature Time and study every kind of solder and printed circuit Preheating 140 °C to 160 °C 60 s to 120 s board for solderability bef ore ac tu al use. Main heating Above 200 °C 30 s to 40 s Peak 235 ± 5 °C max. 10 s Peak ure Preheating For lead-free soldering (Example : Sn/Ag/Cu) at er Temperature Time p m Heating Preheating 150 °C to 180 °C 60 s to 120 s e T Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ●Recommended soldering conditions for flo w For soldering For lead-free soldering Temperature Time Temperature Time Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER2 of this catalog. 1. Take measures against mechanical stress during and after mounting of Precision Thick Film Chip Resistors (herea f ter called the resistors) so as not to damage their electrodes and protective coatings. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, fin ish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Othe r wise, the re sist ors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006

Safety Precautions (Common precautions for Fixed Resistors) (cid:127) When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specific ations with us in advance. The design and specific ations in this catalog are subject to change without prior notice. (cid:127) Do not use the products beyond the specifi cations described in this catalog. (cid:127) This catalog explains the quality and performance of the products as individual components. Bef ore use, check and evaluate their operations when installed in your products. (cid:127) Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to vehicles (aut o mob ile, train, vessel), traffic lights, medical equipment, aerospace equipment, elec tric heating ap plia nc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equipm ent. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use (cid:127) These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipment, home electric ap plia nc es, offi ce equipment, information and com mu ni ca tion equipment) (cid:127) These products are not intended for use in the following special conditions. Bef ore using the products, care ful ly check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO 2 2 3 2 2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials (cid:127) These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. (cid:127) Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating comp on ents. Do not mount or place heat-generating comp on ents or infl ammables, such as vinyl-coated wires, near these products . (cid:127) Note that non-cleaning solder, halogen-based highly active flu x, or water-soluble fl ux may deteriorate the performance or reliability of the products. (cid:127) Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 ° C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the fol lowi ng conditions. Otherwise, their elect ri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tapi ng mat e ri als) may be def ormed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO 2 2 3 2 2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Oct. 2007 – ER3 –