Micro Chip Fuse Micro Chip Fuse Type: ERBSE ERBSD ■ Features ● Small size ● Fast-acting and withstanding in-rush current characteristics ■ Approved Safety Standards ● UL248-14 : File No.E194052 ● c-UL(CSA)C22.2 No.248-14 : File No.E194052 ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 E R B S E 1 R 0 0 U ProductCode FusingCharacteristics Productshape RatedCurrent(A) Packaging Fast-actingand 1608size 0R25 0.25A 1R50 1.5A U Punchedcarriertaping MicroChipFuse S withstandingin-rush E (1.6mm(cid:1)0.8mm) 0R31 0.315A 2R00 2.0A current 1005size 0R37 0.375A 2R50 2.5A D (1.0mm(cid:1)0.5mm) 0R50 0.5A 3R00 3.0A 0R75 0.75A 4R00 4.0A 1R00 1.0A 5R00 5.0A 1R25 1.25A ■Construction ■Dimensions in mm (not to scale) Marking a FusingElement ProtectiveCoating CeramicCore Electrode t (Outer) L W Trimming Type Dimensions (mm) (inches) L W a t ERBSE 1.60±0.15 0.80±0.15 0.30±0.20 0.70 ±0.10 (0603) ERBSD 1.00±0.10 0.50±0.10 0.20±0.15 0.40 ±0.10 (0402) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Dec. 2007

Micro Chip Fuse ■ Ratings ● 1608 Size ERBSE(cid:1)R(cid:1)(cid:1)U Part No. 0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00 5R00 Rated Current (A) 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0 5.0 Marking Code F G H J K N O P S T Internal R (m(cid:1)) at 25 °C max. 370 245 155 120 90 60 48 36 28 20 Rated Current (cid:2)100 %/4 hours min. Fusing Current/Fusing Time Rated Current (cid:2)200 %/5 seconds max. (at 25 °C) Rated Current (cid:2)300 %/0.2 seconds max. Rated Voltage 32 VDC (Open Circuit Voltage) Interrupting Rating 50 A 35 A (at Rated Voltage) Category Temp. Range −40 °C to +100 °C (Operating Temp. Range) ● 1005 Size ERBSD(cid:1)R(cid:1)(cid:1)U Part No. 0R25 0R31 0R37 0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00 Rated Current (A) 0.25 0.315 0.375 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 Marking Code V X Y F G H J K N O P Internal R (m(cid:1)) at 25 °C max. 700 570 460 330 200 135 100 80 53 40 33 Rated Current (cid:2)100 %/4 hours min. Fusing Current/Fusing Time Rated Current (cid:2)200 %/5 seconds max. (at 25 °C) Rated Current (cid:2)300 %/0.2 seconds max. Rated Voltage 24 VDC (Open Circuit Voltage) Interrupting Rating 35 A (at Rated Voltage) Category Temp. Range −40 °C to +100 °C (Operating Temp. Range) Power Derating Curve 100 70°C • For Circuit, current rating shall be derated in 80 %) accordance with the fig ure on the right. d( 60 a • This current derating curve is for fusing Lo 40 d characteristics. Rate 20 100°C 0 –40 –20 0 20 40 60 80 100 120 140 AmbientTemperature(°C) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Dec. 2007

Micro Chip Fuse ■Fusing Characteristics (25 °C typical) ● I–t Characteristics ●10 TypeERBSE 0.5A 0.75A1.0A1.25A1.5A2.0A2.5A3.0A4.0A5.0A ● Typ10eERBSD 0.25A0.315A0.375A0.5A 0.75A1.0A1.25A1.5A2.0A2.5A3.0A 1 1 (s) (s) me 0.1 me 0.1 Ti Ti g g n n usi 0.01 usi0.01 F F 0.001 0.001 ✽ ReferenceOnly ✽ ReferenceOnly 0.0001 0.0001 0.1 1 10 100 0.1 1 10 100 FusingCurrent(A) FusingCurrent(A) ● I2t–t Characteristics ● TypeERBSE ● TypeERBSD 100 54..00AA 100 3.0A 3.0A 2.5A 2.5A 10 21..05AA 10 21..05AA 1.25A 1.25A 1.0A 1.0A 0.75A 0.75A 1 0.5A 1 0.5A 22t(As)I 0.1 22t(As)I 0.1 000...33271555AAA 0.01 0.01 0.001 0.001 ✽ ReferenceOnly ✽ ReferenceOnly 0.0001 0.0001 0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 t(s) t(s) ■ Packaging Methods ● Standard Quantity Type Kind of Taping Pitch (P) Quantity 1 ERBSE 4 mm 5000 pcs./ reel Punched Carrier Taping ERBSD 2 mm 10000 pcs./ reel ● Punched Carrier Taping ● Taping Reel T Sprockethole Compartment φD0 φC E A B FW φ B T Chipcomponent P1 P2 P0 Tapingrunningdirection φA W Type A B W F E φA φB φC W T Dimen Dimensions sions ERBSE 1.00±0.10 1.80±0.20 (mm) ERBSD 0.65±0.05 1.15±0.05 8.00±0.20 3.50±0.05 1.75±0.10 (mm) 180.0−+30.0 60 min. 13.0±1.0 9.0±1.0 11.4±1.0 Type P P P φD T Dimen 1 2 0 0 sions ERBSE 4.00±0.10 0.85±0.07 2.00±0.05 4.00±0.10 1.50+0.10 (mm) ERBSD 2.00±0.10 –0 0.60±0.07 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Dec. 2007

Micro Chip Fuse ■ Recommended Land Pattern Dimensions (mm) Type C A B C ERBSE 0.9 2.1 to 2.3 0.8 A ERBSD 0.6 1.4 to 1.6 0.5 B ■ Recommended Soldering Conditions Recommendations and precautions are described below. ●Recommended soldering conditions for reflo w ·Refl ow soldering shall be performed a maximum of two times. For soldering (Example : Sn/Pb) ·Please contact us for additional information when used in conditions other than those specifi ed. Temperature Time ·Please measure the temperature of the terminals and Preheating 140 °C to 160 °C 60 s to 120 s study every kind of solder and printed circuit board Main heating Above 200 °C 30 s to 40 s for solderability before actual use. Peak 235 ± 5 °C max. 10 s Peak For lead-free soldering (Example : Sn/Ag/Cu) ure Preheating Temperature Time erat Preheating 150 °C to 180 °C 60 s to 120 s p m Heating Main heating Above 230 °C 30 s to 40 s e T Peak max. 260 °C max. 10 s Time <Repair with hand soldering> ● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. ● Never touch this product with the tip of a soldering iron. Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog. 1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses) under normal conditions is within 70% of the rated current. 2. Do not continuously pass a current exceeding the rated current through the fuses. 3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take care not to cause unwanted fusing. Calculate the I2t value of the pulse and check the tolerance to the number of pulses according to the I2t-t characteristic curve before deciding to use the fuses. Before checking the tolerance, consult our sales staff in advance. 4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure that the abnormal current generated when a circuit abnormality occurs in your product is at least double or greater than the rated current of the fuses. In addition, ensure that the abnormal curr ent of your product does not exceed the maximum interrupting current of the fuses. 5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary side. 6. Ensure that the voltage applied to the fuses are within their rated voltage. 7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses on your products and carefully check and evaluate their operating temperature range. Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006

Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements]) (cid:127) When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specific ations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. (cid:127) Do not use the products beyond the specific ations described in this catalog. (cid:127) This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. (cid:127) Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signific ant dam age, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽Systems equipped with a protection circuit and a protection device ✽Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sing le fault (1) Precautions for use (cid:127) These products are designed and manufactured for general and standard use in general elect roni c equipment (e.g. AV equipment, home electric appliances, offic e equipment, information and communication equipment) (cid:127) These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl, H S, NH , SO , or NO 2 2 3 2 2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials (cid:127) These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. (cid:127) Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or infl ammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). (cid:127) Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. (cid:127) Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arr iva l at your company, provided that they remain packed as they were when delivered and stored at a tem pera ture of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the date of arrival at your company) The performance of EMI Filters is guaranteed for 6 months or a year from the out goi ng inspection date indicated on the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 % to 60 %. Check the guarantee period in the specifi cations. The performance of Thermal Cut offs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl, H S, NH , SO , or NO 2 2 3 2 2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Feb. 2006 – EX2 –