Metal Film Thermosensitive Chip Resistors Metal Film Thermosensitive Chip Resistors 0402, 0603, 0805 Type: ERAW, V, S ■ Features ● Suitable for temperature correction circuits ● Temperature coeffi cient value 1500 to 3900 (cid:1)10–6/°C ● High performance Quick response to temp era ture change ● Linearity Excellent linear resistance valu e change in wide temperature range (–40 °C to +125 °C) ● High reliability, High density placing ● Small size and lightweight for PWB size reduction and lightweight products ● Suitable for both refl ow and flo w soldering ● Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2145 ● RoHS compliant ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 E R A S 1 5 J 1 0 3 V ProductCode Size,PowerRating ResistanceTolerance PackagingMethods MetalFilm Type:inches PowerRating Code Tol. Code Packaging Type ChipResistors W:0402 0.031W J ±5% PunchedCarrierTaping V:0603 0.063W X 2mmpitch,10,000pcs. ERAW S:0805 0.1W PunchedCarrierTaping ERAV V 4mmpitch,5,000pcs. ERAS TemperatureCoefficientofResistance ResistanceValue Code ((cid:1)10–6/°C) Type Thefirsttwodigitsaresignificantfiguresof 15 1500 ERAV,ERAS resistanceandthethirdonedenotesnumberof 27 2700 ERAW,ERAV,ERAS zerosfollowing.Decimalpointisexpressedby“R”. 33 3300 ERAW,ERAV,ERAS (ex.)103:10k(cid:2) 6R8:6.8(cid:2) 39 3900 ERAV,ERAS ■ ■ Construction Dimensions in mm (not to scale) L Protectivecoating a Aluminasubstrate Electrode(Inner) W (1) t b Electrode Type Dimensions (mm) Mass (Weight) (Between) (inches) L W a b t [g/1000 pcs.] ERAW 1.00±0.07 0.50±0.05 0.15±0.10 0.25±0.07 0.35±0.05 0.6 (0402) ERAV 1.60±0.20 0.80±0.20 0.30±0.20 0.30±0.20 0.45±0.10 2 (0603) ERAS 2.00±0.20 1.25±0.10 0.40±0.25 0.40±0.25 0.50±0.10 4 (0805) Thermosensitive Electrode(Outer) element 1) Marking Temperture Coeffi cient value : 2 signifi cant fi gure (cid:1)100 (cid:1)10–6/°C ERAW type is no marking. Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Oct. 2010

Metal Film Thermosensitive Chip Resistors ■ Ratings Standard Specific ation(1) Power Rating Re sist ance Standard Type T.C.R. (inched) at 70 °C T.C.R. Resistance Tolerance Tolerance Resistance (W) ((cid:1)10–6/°C)(2) Range ((cid:2)) (%) Values ERAW 2700 43 to 1 k 0.031 ±10 % ±5 E12 (0402) 3300 22 to 390 1500 10 to 10 k ±200 (cid:1)10-6/°C ERAV 2700 43 to 3.3 k 0.063 ±5 E12 (0603) 3300 22 to 1.2 k ±10 % 3900 7.5 to 390 1500 10 to 10 k ±200 (cid:1)10-6/°C ERAS 2700 43 to 5.1 k 0.1 ±5 E12 (0805) 3300 22 to 1.8 k ±10 % 3900 6.2 to 470 (1) Please ask us when resistors other than standard spec i fi ca tion shown in the above table are needed. (2) T.C.R.= { R75-R25(cid:1) 1 (cid:1) 106 } (cid:1) 10–6/°C R25: Re sist ance value at reference temperature 25 °C R25 75–25 R75: Re sist ance value at temperature 75 °C Power Derating Curve 120 70°C For resistors operated in ambient 100 temp er a tures above 70 °C, power rating (%) 80 d shall be derated in accordance with the a o 60 L fi gure on the right. ed 40 at R 20 125°C Category Temperature Range 0 –40 °C to +125 °C –40 –20 0 20 40 60 80 100 120 140 AmbientTemperature(°C) ■ Typical Linearity of Resistance Change 60 50 %) e( 40 3900(cid:1)10–6/°C(ppm/°C) g an 30 2700(cid:1)10–6/°C(ppm/°C) h C 20 ce 1500(cid:1)10–6/°C(ppm/°C) an 10 st si 0 e R –10 –20 –30 –40 –25 0 25 50 75 100 125 AmbientTemperature(°C) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Sep. 2010

Metal Film Thermosensitive Chip Resistors ■ Packaging Methods (Taping) ● Standard Quantity Type Kind of Taping Pitch (P) Quantity 1 ERAW 2 mm 10000 pcs./reel ERAV Punched Carrier Taping 4 mm 5000 pcs./reel ERAS ● Carrier Tape (Unit : mm) Punched Carrier φD0 P1 P2 P0 E F W B T A P1 (2mmpitch) Type A B W F E P P P φD T 1 2 0 0 ERAW 0.67±0.05 1.17±0.05 2.00±0.10 0.52±0.05 ERAV 1.10±0.10 1.19±0.10 8.00±0.20 3.50±0.05 1.75±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0.70±0.05 4.00±0.10 –0 ERAS 1.65±0.15 2.50±0.20 0.84±0.05 ● Taping Reel (Unit : mm) Type φA φN φC W W 1 2 ERAW ERAV 180.0+0 60+1.0 13.0±0.2 9.0+1.0 11.4±1.0 –1.5 –0 –0 φC ERAS N φ W1 φA W2 ■ Attention This product has high temperature coeffi cient. When mea sur ing resistance, the resistance value can change due to Joule Heating. Therefore, the meas ur ing current shall be very small in order to prevent the resistance value from changing. (For example, when the resistor is used at RCWV, temperature of the re sist or rise about 15 °C and the resistance value rise a few percents.) Resistance value may also change due to the ambient tem per a ture. Resistance value is measured at 25 °C. ■ Recommended Land Pattern Anexample of a land pattern to Metal Film Thermosensitive Chip Resistors is shown below. Example Dimensions (mm) ChipResistor Type (inch size) a b c ERAW 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 c (0402) ERAV 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0 (0603) a ERAS 1.0 to 1.4 3.2 to 3.8 0.9 to 1.4 (0805) b Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Sep. 2010

Metal Film Thermosensitive Chip Resistors ■ Recommended Soldering Conditions Recommendations and precautions are described below. ●Recommended soldering conditions for reflo w · Reflo w soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specifie d. For soldering (Example : Sn/Pb) · Please measure the temperature of the terminals Temperature Time and study every kind of solder and printed circuit Preheating 140 °C to 160 °C 60 s to 120 s board for solderability bef ore ac tu al use. Main heating Above 200 °C 30 s to 40 s Peak Peak 235 ± 5 °C max. 10 s ure Preheating For lead-free soldering (Example : Sn/Ag/Cu) at er Temperature Time p m Heating e Preheating 150 °C to 180 °C 60 s to 120 s T Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ●Recommended soldering conditions for flo w For soldering For lead-free soldering Temperature Time Temperature Time Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER2 of this catalog. 1. Keep the rated power and ambient temperature within the specifie d derating curve. * When positioning and mounting Metal Film Thermosensitive Chip Resistors (hereafter called the resistors), make allowance for the effect of heat generated through close contact between the resistors and neigh bori ng components and for the temperature rise of adjacent heat-generating components. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. When applying pulses to the resistors, keep the pulse peak within the rated voltage. 3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, fin ish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. When the resistors' protective coatings are chipped, fla wed, or removed, the characteristics of the resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 7. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. 9. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of im mer sion. Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Sep. 2010

Safety Precautions (Common precautions for Fixed Resistors) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. • Do not use the products beyond the specifi cations described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipm ent where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sing le fault (1) Precautions for use • These products are designed and manufactured for general and standard use in general elect roni c equipment (e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment) • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl, H S, NH , SO , or NO 2 2 3 2 2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or infl ammables, such as vinyl-coated wires, near these products. • Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the performance or reliability of the products. • Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arr iv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl, H S, NH , SO , or NO 2 2 3 2 2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. 01 Aug. 2012 – 2 –