Metal Film Chip Resistors, Rectangular Type Metal Film Chip Resistors, Rectangular Type 0603, 0805, 1210 Type:ERA 3Y, 6Y, 14 ■ Features ● Small size and lightweight ● High reliability Low T.C.R. & current noise, excellent non-linearity ● Suitable for both refl ow and fl ow sol der ing ● Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2133A ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 E R A 3 Y E B 1 0 2 V ProductCode Size,PowerRating TemperatureCoefficient ResistanceTolerance PackagingMethods MetalFilm Type:inches PowerRating Code T.C.R. Code Tolerance Code Packaging Type ChipResistors 3Y:0603 W E ±25(cid:1)10–6/°C(ppm/°C) B ±0.1% V PunchedCarrierTaping ERA3Y 6Y:0805 W H ±50(cid:1)10–6/°C(ppm/°C) D ±0.5% 4mmpitch ERA6Y EmbossedCarrierTaping 14:1210 0.25W K ±100(cid:1)10–6/°C(ppm/°C) U 4mmpitch ERA14 ResistanceValue Thefirsttwodigitsaresignificantfiguresofresistance andthethirdonedenotesnumberofzerosfollowing. ■ ■ Construction Dimensions in mm (not to scale) Protectivecoating L a Electrode(Inner) Aluminasubstrate W t b Electrode (Between) Type Dimensions (mm) Mass (Weight) (inches) L W a b t [g/1000 pcs.] ERA3Y 1.60±0.20 0.80±0.20 0.30±0.20 0.30±0.20 0.45±0.10 2 (0603) Highreliability metalfilm Electrode(Outer) ERA6Y 2.00±0.20 1.25±0.10 0.40±0.25 0.40±0.25 0.50±0.10 4 (0805) ERA14 3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16 (1210) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2008

Metal Film Chip Resistors, Rectangular Type ■ Ratings Limiting Element Maximum Overload Resistance Resistance T.C.R. Category Temperature Type Power Rating Voltage (Maximum Voltage(2) Tolerance Range(3) [(cid:1)10–6/°C Range (Operating (inches) at 70 °C (W) Temperature Range) RCWV)(1) (V) (V) (%) ((cid:2)) (ppm/°C)] (°C) 10 to 91 (E24) ± 50 ERA3Y ±0.5 100 to 33 k (E24) ± 25 75 150 (0603) 36 k to 330 k (E24) ± 100 ±0.1 100 to 33 k (E24) ± 25 10 to 91 (E24) ± 50 ERA6Y ±0.5 100 to 100 k (E24) ± 25 –55 to +125 100 200 (0805) 110 k to 1 M (E24) ±1 00 ±0.1 100 to 100 k (E24) ± 25 10 to 91 (E24) ± 50 ERA14 ±0.5 0.25 150 300 100 to 200 k (E24) ± 25 (1210) ±0.1 100 to 200 k (E24) ± 25 (1) Rated Continuous Working Voltage (RCWV) shall be de term ined from RCWV=(cid:3)Rated Power (cid:1) Re sis tance Values, or Limiting Element Voltage (max. RCWV) list ed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=2.5 (cid:1) Power Rating or max. Overl oad Volta ge liste d above whiche v er less. (3) E96 series resistance values are also available. Please contact us for details. Part Number of E96 series is shown ERA3E. , ERA6E. –55°C 70°C Power Derating Curve 100 For resistors operated in ambient temperatures above %) 80 70 °C, power rating shall be derated in acc ord ance d( 60 a with the fi gure on the right. Lo d 40 e at R 20 125°C 0 –60 –40 –20 0 20 40 60 80 100 120 140 160 180 AmbientTemperature(°C) ■ Packaging Methods (Taping) ● Standard Quantity Type Kind of Taping Pitch (P) Quantity 1 ERA3Y Punched Carrier Taping 4 mm 5000 pcs./reel ERA6Y ERA14 Embossed Carrier Taping 4 mm 5000 pcs./reel ● Punched Carrier Taping ● Taping Reel T Sprockethole Compartment φD0 φC E A F W φB B T Chipcomponent P1 P2 P0 Taperunningdirection φA W Type A B W F E Type φA φB φC Dimensions 3Y 1.10±0.10 1.90±0.10 Dimensions 3Y (mm) 6Y 1.65±0.15 2.50±0.20 8.00±0.20 3.50±0.05 1.75±0.10 (mm) 6Y 180.0+–30.0 60 min. 13.0±1.0 14 2.80±0..203.50±0.20 14 Type P1 P2 P0 φD0 T Type W T Dimensions 3Y 0.70±0.05 Dimensions 3Y (mm) 6Y 4.00±0.10 2.00±0.05 4.00±0.10 1.50+–00.10 0.84±0.05 (mm) 6Y 9.0±1.0 11.4±1.0 14 1.00±0.10 14 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. May. 2006

Metal Film Chip Resistors, Rectangular Type ■ Recommended Land Pattern In case of fl ow soldering, the land width must be smalle r than the Chip Resistor width to properly control the sol der amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflo w soldering, solder amount can be adjusted, there fore the land width should be set to 1.0 to 1.3 times chip resistor width (W). ChipResistor Type Dimensions (mm) (inches) a b c ERA3Y 0.7 to 0.9 2 to 2.2 0.8 to 1 c (0603) ERA6Y 1 to 1.4 3.2 to 3.8 0.9 to 1.4 (0805) a ERA14 b 2 to 2.4 4.4 to 5.0 1.8 to 2.8 (1210) ■ Recommended Soldering Conditions Recommendations and precautions are described below. ●Recommended soldering conditions for reflo w · Reflo w soldering shall be performed a maximum of two times. · Please contact us for additional information when For soldering (Example : Sn/Pb) used in conditions other than those specifie d. · Please measure the temperature of the terminals Temperature Time and study every kind of solder and printed circuit Preheating 140 °C to 160 °C 60 s to 120 s board for solderability bef ore ac tu al use. Main heating Above 200 °C 30 s to 40 s Peak Peak 235 ± 5 °C max. 10 s ure Preheating For lead-free soldering (Example : Sn/Ag/Cu) at er Temperature Time p m Heating Preheating 150 °C to 180 °C 60 s to 120 s e T Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ●Recommended soldering conditions for flo w For soldering For lead-free soldering Temperature Time Temperature Time Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER3 of this catalog. 1. Keep the rated power and ambient temperature within the specifie d derating curve. * When positioning and mounting Metal Film Chip Resistors (hereafter called the resistors), make allowance for the effect of heat generated through close contact between the resistors and neigh bori ng components and for the temperature rise of adjacent heat-generating components. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. When applying pulses to the resistors, keep the pulse peak within the rated voltage. 3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, fin ish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. When the resistors' protective coatings are chipped, fla wed, or removed, the characteristics of the resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 7. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. 9. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of im mer sion. Design and specifi cations are each subject to change without notice. Ask factory for the current technical specific ations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006

Safety Precautions (Common precautions for Fixed Resistors) (cid:127) When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specific ations with us in advance. The design and specific ations in this catalog are subject to change without prior notice. (cid:127) Do not use the products beyond the specifi cations described in this catalog. (cid:127) This catalog explains the quality and performance of the products as individual components. Bef ore use, check and evaluate their operations when installed in your products. (cid:127) Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to vehicles (aut o mob ile, train, vessel), traffic lights, medical equipment, aerospace equipment, elec tric heating ap plia nc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equipm ent. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use (cid:127) These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipment, home electric ap plia nc es, offi ce equipment, information and com mu ni ca tion equipment) (cid:127) These products are not intended for use in the following special conditions. Bef ore using the products, care ful ly check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO 2 2 3 2 2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials (cid:127) These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. (cid:127) Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating comp on ents. Do not mount or place heat-generating comp on ents or infl ammables, such as vinyl-coated wires, near these products . (cid:127) Note that non-cleaning solder, halogen-based highly active flu x, or water-soluble fl ux may deteriorate the performance or reliability of the products. (cid:127) Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 ° C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the fol lowi ng conditions. Otherwise, their elect ri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tapi ng mat e ri als) may be def ormed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO 2 2 3 2 2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Oct. 2007 – ER3 –