Photomicrosensor (Transmissive) EE-SX1108 Be sure to read Precautions on page24. ■ Dimensions ■ Features Note:All units are in millimeters unless otherwise indicated. (cid:129)Ultra-compact with a 5-mm-wide sensor and a 2-mm-wide slot. (cid:129)PCB surface mounting type. (cid:129)High resolution with a 0.3-mm-wide aperture. ■ Absolute Maximum Ratings (Ta = 25°C) Item Symbol Rated value Emitter Forward current I 25 mA F (seenote 1) Pulse forward cur- I 100 mA FP rent (seenote2) Reverse voltage V 5 V R Oaxpistical Detector Collector–Emitter VCEO 20 V voltage Emitter–Collector V 5 V ECO voltage Cross section AA Collector current I 20 mA C Recommended Collector dissipa- P 75 mW Internal Circuit Soldering Pattern tion C (seenote 1) Ambient tem- Operating Topr –30°C to 85°C perature Storage Tstg –40°C to 90°C Reflow soldering Tsol 255°C (see note 3) Terminal No. Name Manual soldering Tsol 350°C A Anode (see note 3) K Cathode Unless otherwise specified, the Note:1. Refer to the temperature rating chart if the ambient temper- C Collector tolerances are ±0.15 mm. ature exceeds 25°C. E Emitter 2. Duty: 1/100; Pulse width: 0.1 ms 3. Complete soldering within 10 seconds for reflow soldering and within 3 seconds for manual soldering. ■ Electrical and Optical Characteristics (Ta = 25°C) Item Symbol Value Condition Emitter Forward voltage V 1.1 V typ., 1.3 V max. I = 5 mA F F Reverse current I 10 μA max. V = 5 V R R Peak emission wavelength λ 940 nm typ. I = 20 mA P F Detector Light current I 50 μA min., 150 μA typ., I = 5 mA, V = 5 V L F CE 500 μA max. Dark current I 100 nA max. V = 10 V, 0 lx D CE Leakage current I --- --- LEAK Collector–Emitter saturated voltage V (sat) 0.1 V typ., 0.4 V max. I = 20 mA, I = 50 μA CE F L Peak spectral sensitivity wavelength λ 900 nm typ. --- P Rising time tr 10 μs typ. V = 5 V, R = 1 kΩ, CC L I = 100μA L Falling time tf 10 μs typ. V = 5 V, R = 1 kΩ, CC L I = 100μA L 32 EE-SX1108 Photomicrosensor (Transmissive)

■ Engineering Data Forward Current vs. Collector Forward Current vs. Forward Light Current vs. Forward Current Dissipation Temperature Rating Voltage Characteristics (Typical) Characteristics (Typical) Forward current I (mA)F ollector dissipation P (mW)C Forward current I (mA)F μLight current I (A)L TVaC E= = 2 55 °VC C Ambient temperature Ta (°C) Forward voltage VF (V) Forward current IF (mA) Light Current vs. Collector−Emitter Relative Light Current vs. Ambient Dark Current vs. Ambient Tem- Voltage Characteristics (Typical) Temperature Characteristics (Typical)perature Characteristics (Typical) Ta = 25°C %) μLight current I (A)L IIFF == 150 m mAA ative light current I (L VIFC =E 5= m5 AV Dark current I (nA)D VCE = 10 V VCE = 2 V el R Collector−Emitter voltage VCE (V) Ambient temperature Ta (°C) Ambient temperature Ta (°C) Response Time vs. Load Resist- Sensing Position Characteristics Sensing Position Characteristics ance Characteristics (Typical) (Typical) (Typical) s) VTaC C= = 2 55° VC %) IVFC =E 5= m5 AV %) IVFC =E 5= m5 AV μResponse time tr, tf ( Relative light current I (L Relative light current I (L Load resistance RL (kΩ) Distance d (mm) Distance d (mm) Response Time Measurement Circuit Input 90 % Output 10 % Input Output EE-SX1108 Photomicrosensor (Transmissive) 33

Unit: mm (inch) ■ Tape and Reel Reel 21±0.8 dia. 2±0.5 330±2 dia. 13± 0.5 dia. 80±1 dia. Product name Quantity Lot number 12.4+02 18.4 max. Tape 1.5 dia. Tape configuration Terminating part Parts mounted Leading part (40 mm min.) (400 mm min.) Empty Pull-out direction (40 mm min.) Tape quantity 2,000 pcs./reel 34 EE-SX1108 Photomicrosensor (Transmissive)

Precautions ■ Soldering Information Reflow soldering (cid:129)The following soldering paste is recommended: Melting temperature: 216 to 220°C Composition: Sn 3.5 Ag 0.75 Cu (cid:129)The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. (cid:129)Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered. 260°C max. 1 to 5°C/s 255°C max. 230°C max. ure 1 to 5°C/s 150 to 180°C at er p m Te 10 sec max. 120 sec 40 sec max. Time Manual soldering (cid:129)Use ”Sn 60” (60% tin and 40% lead) or solder with silver content. (cid:129)Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 300°C or below. (cid:129)Solder each point for a maximum of three seconds. (cid:129)After soldering, allow the product to return to room temperature before handling it. Storage To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30°C Humidity: 60% max. The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30°C at 80% maximum humidity. If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope. Baking If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use: Reel: 60°C for 24 hours or more Bulk: 80°C for 4 hours or more EE-SX1108 Photomicrosensor (Transmissive) 35