Doc No. TT4-EA-12584 Revision. 4 Product Standards Zener Diode DZ3X062D0L DZ3X062D0L Silicon epitaxial planar type Unit: mm 2.9 For surge absorption circuit 0.4 0.16 3  Features  Excellent rising characteristics of zener current Iz  Low zener operating resistance Rz .5.8 12  Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL:Level 1 compliant) 1 2 1.1  Marking Symbol:01 (0.95)(0.95) 1.9  Packaging 1. Cathode1 Embossed type (Thermo-compression sealing) 3 000 pcs / reel (standard) 2. Cathode2 3. Anode1,2  Absolute Maximum Ratings Ta = 25 C Panasonic Mini3-G3-B Parameter Symbol Rating Unit JEITA SC-59A Total power dissipation *1 PT 200 mW Code TO-236AA/SOT-23 Electrostatic discharge *2 ESD ±10 kV Junction temperature Tj 150 °C Operating ambient temperature Topr -40 to +85 °C Internal Connection Storage temperature Tstg -55 to +150 °C Note) *1: Mounted on glass epoxy print board. ( 45 mm x 45 mm x 1 mm) 3 (2 Diode total) Solder in ( 1.0 mm x 1.0 mm) *2: Test method:IEC61000_4_2(C = 150 pF,R = 330 , Contact discharge:10 times) 1 2  Electrical Characteristics Ta = 25 C  3 C Parameter Symbol Conditions Min Typ Max Unit Forward voltage VF IF = 10 mA 1.0 V Zener voltage *1, *2 VZ IZ = 5 mA 5.89 6.51 V Zener operating resistance RZ IZ = 5 mA 50  Zener rise operating resistance RZK IZ = 0.5 mA 100  Reverse current IR VR = 4 V 0.2 μA Temperature coefficient of zener voltage *3 SZ IZ = 5 mA 2.3 mV/°C Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes. 2. *1: The temperature must be controlled 25°C for VZ mesurement. VZ value measured at other temperature must be adjusted to VZ (25°C) *2: VZ guaranted 20 ms after current flow. *3: Tj = 25°C to 150°C Page 1 of 4 Established :2010-05-17 Revised :2013-10-22

Doc No. TT4-EA-12584 Revision. 4 Product Standards Zener Diode DZ3X062D0L Technical Data ( reference ) PT - Ta IF - VF 250 1.E+00 W) Mounted on glass epoxy print board (2 diode total) Ta = 25 ℃ m Board size : 45 mm × 45 mm x 1 mm 1.E-01 T ( 200 Solder in : 1.0 mm x 1.0 mm A) ation P 150 ent IF ( 1.E-02 er dissip 100 ard curr 11..EE--0043 w w al po 50 For 1.E-05 ot T 0 1.E-06 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Ambient temperature Ta (°C) Forward voltage VF (V) IZ - VZ IR - VR 1.E-01 1.E-06 Ta = 25 ℃ 1.E-07 1.E-02 nt IZ (A)1.E-03 25 ℃ Ta = 125 ℃ ent IR (A)1.E-08 urre -40 ℃ 85 ℃ curr1.E-09 ner c1.E-04 erse 1.E-10 e v Z e 1.E-05 R 1.E-11 1.E-06 1.E-12 0 2 4 6 8 10 12 0 1 2 3 4 Zener voltage VZ (V) Reverse voltage VR (V) RZ - IZ SZ - IZ 100 5 Ta = 25 ℃ er n ) ze 3 ance RZ  10 cient of mV/°C) 1 ner operating resist 1 parature coeffivoltage SZ ( --31 e m Z e T 0.1 -5 0.0001 0.001 0.01 0.1 0 2 4 6 8 10 Zener current IZ (A) Zener current IZ (mA) Page 2 of 4 Established :2010-05-17 Revised :2013-10-22

Doc No. TT4-EA-12584 Revision. 4 Product Standards Zener Diode DZ3X062D0L Technical Data ( reference ) Rth- t Ct - VR 40 1000 F) 35 Ta = 25 ℃ e Ct (p 30 f = 1 MHz h (°C/W) 100 Rth(j-l) = 100 ℃/W (1) (2) nc 25 Rt cita 20 nce a a p st ca 15 esi nal 10 mal r 10 (1) Non-heat sink mi er (2) Mounted on glass epoxy print board. Ter 5 Th Board size : 45 mm × 45 mm x 1 mm Solder in : 1.0 mm x 1.0 mm 0 1 0 1 2 3 4 5 0.001 0.01 0.1 1 10 100 1000 Reverse voltage VR (V) Time t (s) PZSM - tw 100 Ta = 25 ℃ geW) surM ( e S sZ 10 evern P etitive rssipatio 1 Non-reppower di 0.1 100 1000 10000 Pulse width tw (μs) Page 3 of 4 Established :2010-05-17 Revised :2013-10-22

Doc No. TT4-EA-12584 Revision. 4 Product Standards Zener Diode DZ3X062D0L Mini3-G3-B Unit: mm +0.20 2.90-0.05 +0.10 +0.10 0.16-0.06 0.40-0.05 3 55 20 23 .. .. 00 00 +- +- 0 8 5 . . 2 1 ) ° 5 1 2 ( ) 2 5 . (0.95) (0.95) 6 0 . ± 0 4 1.9±0.1 ( 0. (10°) +0.21-0.1 +0.31-0.1 . . 1 1 1 . 0 o t 0 Land Pattern (Reference) (Unit: mm) 1.0 0 . 1 4 . 2 1.9 Page 4 of 4 Established :2010-05-17 Revised :2013-10-22

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If anyof theproductsor technicalinformationdescribedinthisbook is tobe exported or provided to non-residents, the lawsandregulationsoftheexportingcountry,especially,thosewithregardtosecurityexportcontrol,mustbeobserved. (2)Thetechnicalinformationdescribedinthisbookisintendedonlytoshowthemaincharacteristicsandapplicationcircuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical informationde-scribedinthisbook. (3) The products described in this book are intended to be used for general applications (such as office equipment, communicationsequipment,measuringinstrumentsandhouseholdappliances),orforspecificapplicationsasexpressly statedinthisbook. Please consult with our sales staff in advance for information on the following applications, moreover please exchange documentsseparatelyontermsofuseetc.:Specialapplications(suchasforin-vehicleequipment,airplanes,aerospace, automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardizelifeorharmthehumanbody. Unlessexchangingdocumentsontermsofuseetc.inadvance,itistobeunderstoodthatourcompanyshallnotbeheld responsiblefor anydamageincurred asaresult of or inconnection with your usingthe productsdescribed inthisbook foranyspecialapplication. (4) The products and product specifications described in this book are subject to change without notice for modification and/orimprovement.Atthefinalstageofyourdesign,purchasing,oruseoftheproducts,therefore,askforthemostup- to-dateProductStandardsinadvancetomakesurethatthelatestspecificationssatisfyyourrequirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions(operatingpowersupplyvoltageandoperatingenvironmentetc.).Especially,pleasebecarefulnottoexceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other- wise,wewillnotbeliableforanydefectwhichmayariselaterinyourequipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arrestingthespreadoffireorpreventingglitcharerecommendedinordertopreventphysicalinjury,fire,socialdamages, forexample,byusingtheproducts. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do notguaranteequalityfordisassembledproductsortheproductre-mountedafterremovingfromthemountingboard. Whenusingproductsforwhichdamp-proofpackingisrequired,satisfytheconditions,suchasshelflifeandtheelapsed timesincefirstopeningthepackages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of requestfromtheresaledestination,pleaseunderstandthatcustomerswillbeartheburden. (8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. No.010618