Doc No. TT4-EA-11559 Revision. 3 Product Standards Zener Diode DZ2J1800L DZ2J1800L Silicon epitaxial planar type Unit: mm For constant voltage / For surge absorption circuit 1.25 0.13 0.35 2  Features  Excellent rising characteristics of zener current Iz  Low zener operating resistance Rz 75 ..  Halogen-free / RoHS compliant 12 (EU RoHS / UL-94 V-0 / MSL:Level 1 compliant) 1  Marking Symbol: YJ or YU 0.5 0.7  Packaging Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard) 1. Cathode 2. Anode  Absolute Maximum Ratings Ta = 25 C Panasonic SMini2-F5-B Parameter Symbol Rating Unit JEITA SC-90A Repetitive peak forward current IFRM 200 mA Code ― Total power dissipation *1 PT 200 mW Electrostatic discharge *2 ESD 8 kV Junction temperature Tj 150 C Internal Connection Operating ambient temperature Topr -40 to +85 C 2 Storage temperature Tstg -55 to +150 C Note) *1 Mounted on glass epoxy print board ( 45 mm  45 mm  1 mm ) Solder in ( Recommended land pattern ) *2 Test method : IEC61000_4_2 ( C = 150 pF, R = 330 , Contact discharge : 10 times ) 1  Electrical Characteristics Ta = 25 C  3 C Parameter Symbol Conditions Min Typ Max Unit Forward voltage VF IF = 10 mA 1.0 V Zener voltage *1, *2 VZ IZ = 5 mA 17.10 18.90 V Zener operating resistance RZ IZ = 5 mA 60  Zener rise operating resistance RZK IZ = 0.5 mA 80  Reverse current IR VR = 13 V 0.05 A Temperature coefficient of zener voltage *3 SZ IZ = 5 mA 17.2 mV/C Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes. 2. Absolute frequency of input and output is 5 MHz. 3. *1 The temperature must be controlled 25 C for VZ mesurement. VZ value measured at other temperature must be adjusted to VZ (25 C). *2 VZ guaranted 20 ms after current flow Rank classification *3 Tj = 25 C to 150 C Code M 0 Rank M No-rank VZ 17.55 to 18.45 17.10 to 18.90 Marking symbol YU YJ Page 1 of 4 Established :2009-10-14 Revised :2013-07-12

Doc No. TT4-EA-11559 Revision. 3 Product Standards Zener Diode DZ2J1800L Technical Data ( reference ) PT - Ta IF - VF 250 1.E+00 W) Mounted on glass epoxy print board. Ta = 25 °C ation PT (m 125000 BSooaldredr siniz e: l:a 4n5d mpamtt e×r n45 mm x 1 mm ent IF (A) 11..EE--0021 sip urr 1.E-03 s c er di 100 ard 1.E-04 w w al po 50 For 1.E-05 ot T 0 1.E-06 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Ambient temperature Ta (°C) Forward voltage VF (V) IZ - VZ IR - VR 1.E-01 1.E-06 Ta = 25 °C 1.E-07 nt IZ (A)11..EE--0032 25 °C Ta = 125 °C ent IR (A)1.E-08 urre curr1.E-09 c1.E-04 e ner ers1.E-10 Ze1.E-05 -40 °C 85 °C Rev 1.E-11 1.E-06 1.E-12 5 10 15 20 25 30 0 3 6 9 12 15 Zener voltage VZ (V) Reverse voltage VR (V) RZ - IZ SZ - IZ 100 25 Z ) Ta = 25 °C ener 20 R z ance ent of V/°C) 15 st cim esi 10 effiZ ( perating r arature covoltage S 10 o p ener Tem 5 Z 1 0 0.0001 0.001 0.01 0.1 0 2 4 6 8 10 Zener current IZ (A) Zener current IZ (mA) Page 2 of 4 Established :2009-10-14 Revised :2013-07-12

Doc No. TT4-EA-11559 Revision. 3 Product Standards Zener Diode DZ2J1800L Technical Data ( reference ) Rth- t Ct - VR 20 1000 pF) 18 Ta = 25 °C W) (1) ce Ct ( 1146 f = 1 MHz Rth (°C/ 100 Rth(j-l) = 80 °C/W (2) an 12 e cit 10 nc a a ap 8 sist c e 10 Terminal 246 Thermal r ((BS12oo)) aldNMredoor nu si-nnihz tee:e ald:a t 4n os5dnin mpgkalmatts e×sr ne4p5o mxym p xri n1t mbomard. 0 1 0 3 6 9 12 15 0.001 0.01 0.1 1 10 100 1000 Reverse voltage VR (V) Time t (s) PZSM - tw 100 er Ta = 25 °C w o p ge W) surM ( 10 e S sZ etitive reverssipation P 1 epdi n-r o N 0.1 100 1000 10000 Pulse width tw (μs) Page 3 of 4 Established :2009-10-14 Revised :2013-07-12

Doc No. TT4-EA-11559 Revision. 3 Product Standards Zener Diode DZ2J1800L SMini2-F5-B Unit: mm 1.25±0.10 +0.05 0.35±0.05 0.13-0.02 2 1 2 . . 0 0 ± ± 7 5 . . 1 2 ) ° 5 1 ( 1 . 0.50±0.05 ±0 0 to 0.05 4 . 0 (5°) 1 . 0 ± ) 7 5 . 1 0 . 0 (  Land Pattern (Reference) (Unit: mm) 0.9 9 . 0 4 . 2 9 . 0 1.1 Page 4 of 4 Established :2009-10-14 Revised :2013-07-12

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If anyof theproductsor technicalinformationdescribedinthisbook is tobe exported or provided to non-residents, the lawsandregulationsoftheexportingcountry,especially,thosewithregardtosecurityexportcontrol,mustbeobserved. (2)Thetechnicalinformationdescribedinthisbookisintendedonlytoshowthemaincharacteristicsandapplicationcircuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical informationde-scribedinthisbook. (3) The products described in this book are intended to be used for general applications (such as office equipment, communicationsequipment,measuringinstrumentsandhouseholdappliances),orforspecificapplicationsasexpressly statedinthisbook. Please consult with our sales staff in advance for information on the following applications, moreover please exchange documentsseparatelyontermsofuseetc.:Specialapplications(suchasforin-vehicleequipment,airplanes,aerospace, automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardizelifeorharmthehumanbody. Unlessexchangingdocumentsontermsofuseetc.inadvance,itistobeunderstoodthatourcompanyshallnotbeheld responsiblefor anydamageincurred asaresult of or inconnection with your usingthe productsdescribed inthisbook foranyspecialapplication. (4) The products and product specifications described in this book are subject to change without notice for modification and/orimprovement.Atthefinalstageofyourdesign,purchasing,oruseoftheproducts,therefore,askforthemostup- to-dateProductStandardsinadvancetomakesurethatthelatestspecificationssatisfyyourrequirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions(operatingpowersupplyvoltageandoperatingenvironmentetc.).Especially,pleasebecarefulnottoexceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other- wise,wewillnotbeliableforanydefectwhichmayariselaterinyourequipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arrestingthespreadoffireorpreventingglitcharerecommendedinordertopreventphysicalinjury,fire,socialdamages, forexample,byusingtheproducts. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do notguaranteequalityfordisassembledproductsortheproductre-mountedafterremovingfromthemountingboard. Whenusingproductsforwhichdamp-proofpackingisrequired,satisfytheconditions,suchasshelflifeandtheelapsed timesincefirstopeningthepackages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of requestfromtheresaledestination,pleaseunderstandthatcustomerswillbeartheburden. (8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. No.010618