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  • 型号: DZ2707500L
  • 制造商: Panasonic Corporation
  • 库位|库存: xxxx|xxxx
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DZ2707500L产品简介:

ICGOO电子元器件商城为您提供DZ2707500L由Panasonic Corporation设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 DZ2707500L价格参考。Panasonic CorporationDZ2707500L封装/规格:二极管 - 齐纳 - 单, Zener Diode 7.5V 120mW ±5% 表面贴装 SSS迷你型2-F4-B。您可以下载DZ2707500L参考资料、Datasheet数据手册功能说明书,资料中有DZ2707500L 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

DIODE ZENER 7.5V 120MW SSSMINI2稳压二极管 7.5V 5% 120mW FLT LD 0.6x1.4mm

产品分类

单二极管/齐纳分离式半导体

品牌

Panasonic Electronic Components - Semiconductor ProductsPanasonic

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

二极管与整流器,稳压二极管,Panasonic DZ2707500L-

数据手册

http://industrial.panasonic.com/www-cgi/jvcr13pz.cgi?E+SC+4+CDH7004+DZ27075+8+WW

产品型号

DZ2707500LDZ2707500L

不同If时的电压-正向(Vf)

1V @ 10mA

不同 Vr时的电流-反向漏电流

100nA @ 5V

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=26113

产品种类

稳压二极管

供应商器件封装

SSS迷你型2-F4-B

其它名称

DZ2707500LCT

功率-最大值

120mW

功率耗散

120 mW

包装

剪切带 (CT)

商标

Panasonic

安装类型

表面贴装

安装风格

SMD/SMT

容差

±5%

封装

Reel

封装/外壳

2-SMD,扁平引线

封装/箱体

SSSMini2-F4-B

工作温度

-

工厂包装数量

10000

最大反向漏泄电流

100 nA

最大工作温度

+ 150 C

最大齐纳阻抗

20 Ohms

标准包装

1

正向电压下降

1 V at 10 mA

电压-齐纳(标称值)(Vz)

7.5V

电压容差

5 %

电压温度系数

3.9 mV/C

配置

Single

阻抗(最大值)(Zzt)

20 欧姆

齐纳电压

7.5 V

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PDF Datasheet 数据手册内容提取

Doc No. TT4-EA-12342 Revision. 3 Product Standards Zener Diode DZ2707500L DZ2707500L Silicon epitaxial planar type Unit: mm For constant voltage / For surge absorption circuit 0.6 0.13 DZ2S075 in SSSMini2 type package 2  Features  Excellent rising characteristics of zener current Iz  Low zener operating resistance Rz 04  Halogen-free / RoHS compliant 1.1. (EU RoHS / UL-94 V-0 / MSL:Level 1 compliant) 1  Marking Symbol: HJ 0.27 0.52  Packaging Embossed type (Thermo-compression sealing) : 10 000 pcs / reel (standard) 1. Cathode 2. Anode  Absolute Maximum Ratings Ta = 25 C Panasonic SSSMini2-F4-B Parameter Symbol Rating Unit JEITA SC-104A Repetitive peak forward current IFRM 200 mA Code SOD-723 Total power dissipation *1 PT 120 mW Electrostatic discharge *2 ESD ±8 kV Junction temperature Tj 150 °C Internal Connection Operating ambient temperature Topr -40 to +85 °C 2 Storage temperature Tstg -55 to +150 °C Note)*1: Mounted on glass epoxy print board. ( 45 mm x 45 mm x 1 mm) Solder in ( 0.4 mm x 0.3 mm) *2: Test method:IEC61000_4_2(C = 150 pF,R = 330 , Contact discharge:10 times) 1  Electrical Characteristics Ta = 25 C  3 C Parameter Symbol Conditions Min Typ Max Unit Forward voltage VF IF = 10 mA 1.0 V Zener voltage *1, *2 VZ IZ = 5 mA 7.13 7.88 V Zener operating resistance RZ IZ = 5 mA 20  Zener rise operating resistance RZK IZ = 0.5 mA 60  Reverse current IR VR = 5.0 V 0.1 μA Temperature coefficient of zener voltage *3 SZ IZ = 5 mA 3.9 mV/°C Note)1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes. 2. Absolute frequency of input and output is 5 MHz. 3. *1 The temperature must be controlled 25°C for VZ mesurement. VZ value measured at other temperature must be adjusted to VZ (25°C) *2 VZ guaranted 20 ms after current flow. *3 Tj = 25°C to 150°C Page 1 of 4 Established :2010-02-10 Revised :2013-08-28

Doc No. TT4-EA-12342 Revision. 3 Product Standards Zener Diode DZ2707500L Technical Data ( reference ) PT - Ta IF - VF 200 1.E+00 W) Mounted on glass epoxy print board. Ta = 25 °C ation PT (m 150 BSooaldredr siniz e: 0: .445 m mmm x × 0 .435 m mmm x 1 mm ent IF (A) 11..EE--0021 sip 100 urr 1.E-03 s c er di ard 1.E-04 w w po 50 or al F 1.E-05 ot T 0 1.E-06 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Ambient temperature Ta (°C) Forward voltage VF (V) IZ - VZ IR - VR 1.E-01 1.E-06 Ta = 25 °C 1.E-07 urrent IZ (A) 11..EE--0032 25-4 °0C °C T85a °=C 125 °C current IR (A)11..EE--0098 ner c 1.E-04 erse 1.E-10 e v Z e 1.E-05 R 1.E-11 1.E-06 1.E-12 0 2 4 6 8 10 12 0 1 2 3 4 5 Zener voltage VZ (V) Reverse voltage VR (V) RZ-IZ SZ - IZ 10 8 RZ ) Ta = 25 °C zener 6 operating resistance arature coefficient of voltage SZ (mV/°C) 024 er mp Zen Te -2 1 -4 0.0001 0.001 0.01 0.1 0 2 4 6 8 10 Zener current IZ (A) Zener current IZ (mA) Page 2 of 4 Established :2010-02-10 Revised :2013-08-28

Doc No. TT4-EA-12342 Revision. 3 Product Standards Zener Diode DZ2707500L Technical Data ( reference ) Rth- t Ct - VR 40 1000 (1) pF) 35 Ta = 25 °C W) Rth(j-l) = 100 °C/W ce Ct ( 2350 f = 1 MHz Rth (°C/ 100 (2) an e cit 20 nc a a p st a 15 si erminal c 150 Thermal re 10 ((B12o)) aNMrdoo nus-nihzteee ad: t 4 os5nin mgklmas ×s e4p5o mxym p xri n1t mbomard. T Solder in : 0.4 mm x 0.3 mm 0 1 0 1 2 3 4 5 0.001 0.01 0.1 1 10 100 1000 Reverse voltage VR (V) Time t (s) PZSM - tw 100 er Ta = 25 °C w o p ge W) surM ( 10 e S sZ etitive reverssipation P 1 epdi n-r o N 0.1 100 1000 10000 Pulse width tw (μs) Page 3 of 4 Established :2010-02-10 Revised :2013-08-28

Doc No. TT4-EA-12342 Revision. 3 Product Standards Zener Diode DZ2707500L SSSMini2-F4-B Unit: mm 0.60±0.05 +0.05 0.13-0.02 2 5 5 0 0 . . 0 0 ± ± 0 0 0 4 . . 1 1 ) ° 5 1 ( 5 +0.05 0 0.27-0.03 0. ± 0 2 . 0 (5°) 3 0 . 0 ± 2 5 . 0 5 0 . 0 ) 7 o 2 t . 0 0 (  Land Pattern (Reference) (Unit: mm) 0.4 3 . 0 3 . 1 3 . 0 Page 4 of 4 Established :2010-02-10 Revised :2013-08-28

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If anyof theproductsor technicalinformationdescribedinthisbook is tobe exported or provided to non-residents, the lawsandregulationsoftheexportingcountry,especially,thosewithregardtosecurityexportcontrol,mustbeobserved. (2)Thetechnicalinformationdescribedinthisbookisintendedonlytoshowthemaincharacteristicsandapplicationcircuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical informationde-scribedinthisbook. (3) The products described in this book are intended to be used for general applications (such as office equipment, communicationsequipment,measuringinstrumentsandhouseholdappliances),orforspecificapplicationsasexpressly statedinthisbook. Please consult with our sales staff in advance for information on the following applications, moreover please exchange documentsseparatelyontermsofuseetc.:Specialapplications(suchasforin-vehicleequipment,airplanes,aerospace, automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardizelifeorharmthehumanbody. Unlessexchangingdocumentsontermsofuseetc.inadvance,itistobeunderstoodthatourcompanyshallnotbeheld responsiblefor anydamageincurred asaresult of or inconnection with your usingthe productsdescribed inthisbook foranyspecialapplication. (4) The products and product specifications described in this book are subject to change without notice for modification and/orimprovement.Atthefinalstageofyourdesign,purchasing,oruseoftheproducts,therefore,askforthemostup- to-dateProductStandardsinadvancetomakesurethatthelatestspecificationssatisfyyourrequirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions(operatingpowersupplyvoltageandoperatingenvironmentetc.).Especially,pleasebecarefulnottoexceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other- wise,wewillnotbeliableforanydefectwhichmayariselaterinyourequipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arrestingthespreadoffireorpreventingglitcharerecommendedinordertopreventphysicalinjury,fire,socialdamages, forexample,byusingtheproducts. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do notguaranteequalityfordisassembledproductsortheproductre-mountedafterremovingfromthemountingboard. Whenusingproductsforwhichdamp-proofpackingisrequired,satisfytheconditions,suchasshelflifeandtheelapsed timesincefirstopeningthepackages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of requestfromtheresaledestination,pleaseunderstandthatcustomerswillbeartheburden. (8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. No.010618