ICGOO在线商城 > 集成电路(IC) > 嵌入式 - 微控制器 > DSPIC33FJ128GP708A-I/PT
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DSPIC33FJ128GP708A-I/PT产品简介:
ICGOO电子元器件商城为您提供DSPIC33FJ128GP708A-I/PT由Microchip设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 DSPIC33FJ128GP708A-I/PT价格参考。MicrochipDSPIC33FJ128GP708A-I/PT封装/规格:嵌入式 - 微控制器, dsPIC 微控制器 IC dsPIC™ 33F 16-位 40 MIP 128KB(128K x 8) 闪存 80-TQFP(12x12)。您可以下载DSPIC33FJ128GP708A-I/PT参考资料、Datasheet数据手册功能说明书,资料中有DSPIC33FJ128GP708A-I/PT 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
描述 | IC DSC 16BIT 128KB FLASH 80TQFP数字信号处理器和控制器 - DSP, DSC 16Bit 40MIPS 128KB Flash |
EEPROM容量 | - |
产品分类 | |
I/O数 | 69 |
品牌 | Microchip Technology |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 嵌入式处理器和控制器,数字信号处理器和控制器 - DSP, DSC,Microchip Technology DSPIC33FJ128GP708A-I/PTdsPIC™ 33F |
数据手册 | http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en012562http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en543968 |
产品型号 | DSPIC33FJ128GP708A-I/PT |
PCN设计/规格 | http://www.microchip.com/mymicrochip/NotificationDetails.aspx?id=5624&print=view |
RAM容量 | 16K x 8 |
产品 | DSCs |
产品目录页面 | |
产品种类 | 数字信号处理器和控制器 - DSP, DSC |
供应商器件封装 | 80-TQFP(12x12) |
其它名称 | DSPIC33FJ128GP708AIPT |
包装 | 托盘 |
可编程输入/输出端数量 | 69 |
商标 | Microchip Technology |
处理器系列 | DSPIC33F |
外设 | AC'97,欠压检测/复位,DMA,I²S,POR,PWM,WDT |
安装风格 | SMD/SMT |
定时器数量 | 9 Timer |
封装 | Tray |
封装/外壳 | 80-TQFP |
封装/箱体 | TQFP-80 |
工作温度 | -40°C ~ 85°C |
工作电源电压 | 3 V to 3.6 V |
工厂包装数量 | 119 |
振荡器类型 | 内部 |
接口类型 | CAN/I2C/SPI/UART |
数据RAM大小 | 16 kB |
数据总线宽度 | 16 bit |
数据转换器 | A/D 24x10b/12b |
最大工作温度 | + 85 C |
最大时钟频率 | 40 MHz |
最小工作温度 | - 40 C |
标准包装 | 119 |
核心 | dsPIC |
核心处理器 | dsPIC |
核心尺寸 | 16-位 |
片上ADC | Yes |
特色产品 | http://www.digikey.com/cn/zh/ph/microchip/motor-control.html |
电压-电源(Vcc/Vdd) | 3 V ~ 3.6 V |
程序存储器大小 | 128 kB |
程序存储器类型 | Flash |
程序存储容量 | 128KB(128K x 8) |
类型 | dSPIC33 |
系列/芯体 | dSPIC33 |
输入/输出端数量 | 69 I/O |
连接性 | CAN, I²C, IrDA, LIN, SPI, UART/USART |
速度 | 40 MIP |
配用 | /product-detail/zh/DKSB1001B/876-1001-ND/2074102 |
dsPIC33FJXXXGPX06A/X08A/X10A 16-bit Digital Signal Controllers (up to 256 KB Flash and 30 KB SRAM) with Advanced Analog Operating Conditions Timers/Output Compare/Input Capture • 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS • Up to nine 16-bit timers/counters. Can pair up to make four 32-bit timers. • 3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS • Eight Output Compare modules configurable as Core: 16-bit dsPIC33F CPU timers/counters • Eight Input Capture modules • Code-efficient (C and Assembly) architecture • Two 40-bit wide accumulators Communication Interfaces • Single-cycle (MAC/MPY) with dual data fetch • Two UART modules (10 Mbps) • Single-cycle mixed-sign MUL plus hardware - With support for LIN 2.0 protocols and IrDA® divide • Two 4-wire SPI modules (15 Mbps) Clock Management • Up to two I2C™ modules (up to 1 Mbaud) with SMBus support • ±2% internal oscillator • Programmable PLLs and oscillator clock sources • Up to two Enhanced CAN (ECAN) modules (1Mbaud) with 2.0B support • Fail-Safe Clock Monitor (FSCM) • Data Converter Interface (DCI) module with I2S • Independent Watchdog Timer (WDT) codec support • Fast wake-up and start-up Input/Output Power Management • Sink/Source up to 10 mA (pin specific) for stan- • Low-power management modes (Sleep, Idle, dard VOH/VOL, up to 16 mA (pin specific) for Doze) non-standard VOH1 • Integrated Power-on Reset and Brown-out Reset • 5V-tolerant pins • 2.1 mA/MHz dynamic current (typical) • Selectable open drain, pull-ups, and pull-downs • 50 μA IPD current (typical) • Up to 5 mA overvoltage clamp current Advanced Analog Features • External interrupts on all I/O pins • Two ADC modules: Qualification and Class B Support - Configurable as 10-bit, 1.1 Msps with four • AEC-Q100 REVG (Grade 1 -40ºC to +125ºC) S&H or 12-bit, 500 ksps with one S&H • AEC-Q100 REVG (Grade 0 -40ºC to +150ºC) - 18 analog inputs on 64-pin devices and up to • Class B Safety Library, IEC 60730 32 analog inputs on 100-pin devices • Flexible and independent ADC trigger sources Debugger Development Support • In-circuit and in-application programming • Two program and two complex data breakpoints • IEEE 1149.2-compatible (JTAG) boundary scan • Trace and run-time watch Packages Type QFN TQFP TQFP TQFP Pin Count 64 64 80 100 Contact Lead/Pitch 0.50 0.50 0.50 0.40 I/O Pins 53 53 69 85 Dimensions 9x9x0.9 10x10x1 12x12x1 14x14x1 Note: All dimensions are in millimeters (mm) unless specified. 2009-2012 Microchip Technology Inc. DS70593D-page 1
dsPIC33FJXXXGPX06A/X08A/X10A dsPIC33F PRODUCT FAMILIES The device names, pin counts, memory sizes and peripheral availability of each family are listed below, The dsPIC33F General Purpose Family of devices followed by their pinout diagrams. areideal for a wide variety of 16-bit MCU embedded applications. The controllers with codec interfaces are well-suited for speech and audio processing applications. dsPIC33F General Purpose Family Controllers Device Pins PM(rKFeolbmagysrotaherm y) (KRbyAtMe)(1) 16-bit Timer nput Capture utput CompareStd. PWM CodecInterface ADC UART SPI 2IC™ EnhancedCAN™ (2)O Pins (Max) Packages I O I/ dsPIC33FJ64GP206A 64 64 8 9 8 8 1 1 ADC, 18 2 2 1 0 53 PT, MR ch dsPIC33FJ64GP306A 64 64 16 9 8 8 1 1 ADC, 18 2 2 2 0 53 PT, MR ch dsPIC33FJ64GP310A 100 64 16 9 8 8 1 1 ADC, 32 2 2 2 0 85 PF, PT ch dsPIC33FJ64GP706A 64 64 16 9 8 8 1 2 ADC, 18 2 2 2 2 53 PT, MR ch dsPIC33FJ64GP708A 80 64 16 9 8 8 1 2 ADC, 24 2 2 2 2 69 PT ch dsPIC33FJ64GP710A 100 64 16 9 8 8 1 2 ADC, 32 2 2 2 2 85 PF, PT ch dsPIC33FJ128GP206A 64 128 8 9 8 8 1 1 ADC, 18 2 2 1 0 53 PT, MR ch dsPIC33FJ128GP306A 64 128 16 9 8 8 1 1 ADC, 18 2 2 2 0 53 PT, MR ch dsPIC33FJ128GP310A 100 128 16 9 8 8 1 1 ADC, 32 2 2 2 0 85 PF, PT ch dsPIC33FJ128GP706A 64 128 16 9 8 8 1 2 ADC, 18 2 2 2 2 53 PT, MR ch dsPIC33FJ128GP708A 80 128 16 9 8 8 1 2 ADC, 24 2 2 2 2 69 PT ch dsPIC33FJ128GP710A 100 128 16 9 8 8 1 2 ADC, 32 2 2 2 2 85 PF, PT ch dsPIC33FJ256GP506A 64 256 16 9 8 8 1 1 ADC, 18 2 2 2 1 53 PT, MR ch dsPIC33FJ256GP510A 100 256 16 9 8 8 1 1 ADC, 32 2 2 2 1 85 PF, PT ch dsPIC33FJ256GP710A 100 256 30 9 8 8 1 2 ADC, 32 2 2 2 2 85 PF, PT ch Note 1: RAM size is inclusive of 2 Kbytes DMA RAM. 2: Maximum I/O pin count includes pins shared by the peripheral functions. DS70593D-page 2 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams 64-Pin QFN(1) = Pins are up to 5V tolerant 54 DD RR D7D64/3/ SDO/RG13SDI/RG12SCK/RG14G0G1F1F0 DD CAPC8/CN16/RC7/CN15/RC6/IC6/CN1C5/IC5/CN1C4/RD3C3/RD2C2/RD1 CCCRRRRVVOOOOOOO 64636261605958575655545352515049 COFS/RG15 1 48 PGEC2/SOSCO/T1CK/CN0/RC14 AN16/T2CK/T7CK/RC1 2 47 PGED2/SOSCI/T4CK/CN1/RC13 AN17/T3CK/T6CK/RC2 3 46 OC1/RD0 SCK2/CN8/RG6 4 45 IC4/INT4/RD11 SDI2/CN9/RG7 5 44 IC3/INT3/RD10 SDO2/CN10/RG8 6 43 IC2/U1CTS/INT2/RD9 MCLR 7 42 IC1/INT1/RD8 SS2/CN11/RG9 8 dsPIC33FJ64GP206A 41 VSS VSS 9 dsPIC33FJ128GP206A 40 OSC2/CLKO/RC15 VDD 10 39 OSC1/CLKIN/RC12 AN5/IC8/CN7/RB5 11 38 VDD AN4/IC7/CN6/RB4 12 37 SCL1/RG2 AN3/CN5/RB3 13 36 SDA1/RG3 AN2/SS1/CN4/RB2 14 35 U1RTS/SCK1/INT0/RF6 PGEC3/AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2 PGED3/AN0/VREF+/CN2/RB0 16 33 U1TX/SDO1/RF3 17181920212223242526272829303132 67 D S8901 S D234545 BB D SBB11 S D1111FF RRVVRRBBVVBBBBRR EC1/AN6/OCFA/PGED1/AN7/AAU2CTS/AN8/AN9/TMS/AN10/RTDO/AN11/R TCK/AN12/RTDI/AN13/RU2RTS/AN14/R5/OCFB/CN12/RU2RX/CN17/U2TX/CN18/ PG AN1 Note1: The metal plane at the bottom of the device is not connected to any pins and should be connected to VSS externally. 2009-2012 Microchip Technology Inc. DS70593D-page 3
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 64-Pin QFN(1) = Pins are up to 5V tolerant 54 DD RR D7D64/3/ SDO/RG13SDI/RG12SCK/RG14G0G1F1F0 DD CAPC8/CN16/RC7/CN15/RC6/IC6/CN1C5/IC5/CN1C4/RD3C3/RD2C2/RD1 CCCRRRRVVOOOOOOO 64636261605958575655545352515049 COFS/RG15 1 48 PGEC2/SOSCO/T1CK/CN0/RC14 AN16/T2CK/T7CK/RC1 2 47 PGED2/SOSCI/T4CK/CN1/RC13 AN17/T3CK/T6CK/RC2 3 46 OC1/RD0 SCK2/CN8/RG6 4 45 IC4/INT4/RD11 SDI2/CN9/RG7 5 44 IC3/INT3/RD10 SDO2/CN10/RG8 6 43 IC2/U1CTS/INT2/RD9 MCLR 7 42 IC1/INT1/RD8 dsPIC33FJ64GP306A SS2/CN11/RG9 8 41 VSS VSS 9 dsPIC33FJ128GP306A 40 OSC2/CLKO/RC15 VDD 10 39 OSC1/CLKIN/RC12 AN5/IC8/CN7/RB5 11 38 VDD AN4/IC7/CN6/RB4 12 37 SCL1/RG2 AN3/CN5/RB3 13 36 SDA1/RG3 AN2/SS1/CN4/RB2 14 35 U1RTS/SCK1/INT0/RF6 PGEC3/AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2 PGED3/AN0/VREF+/CN2/RB0 16 33 U1TX/SDO1/RF3 17181920212223242526272829303132 67 D S8901 S D234545 BB D SBB11 S D1111FF PGEC1/AN6/OCFA/RPGED1/AN7/RAVAVU2CTS/AN8/RAN9/RTMS/AN10/RBTDO/AN11/RBVVTCK/AN12/RBTDI/AN13/RBU2RTS/AN14/RBAN15/OCFB/CN12/RBU2RX/SDA2/CN17/RU2TX/SCL2/CN18/R Note1: The metal plane at the bottom of the device is not connected to any pins and should be connected to VSS externally. DS70593D-page 4 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 64-Pin QFN(1) = Pins are up to 5V tolerant 54 DD RR D7D64/3/ SDO/RG13SDI/RG12SCK/RG14G0G11TX/RF11RX/RF0 DD CAPC8/CN16/RC7/CN15/RC6/IC6/CN1C5/IC5/CN1C4/RD3C3/RD2C2/RD1 CCCRRCCVVOOOOOOO 64636261605958575655545352515049 COFS/RG15 1 48 PGEC2/SOSCO/T1CK/CN0/RC14 AN16/T2CK/T7CK/RC1 2 47 PGED2/SOSCI/T4CK/CN1/RC13 AN17/T3CK/T6CK/RC2 3 46 OC1/RD0 SCK2/CN8/RG6 4 45 IC4/INT4/RD11 SDI2/CN9/RG7 5 44 IC3/INT3/RD10 SDO2/CN10/RG8 6 43 IC2/U1CTS/INT2/RD9 MCLR 7 42 IC1/INT1/RD8 SS2/CN11/RG9 8 dsPIC33FJ256GP506A 41 VSS VSS 9 40 OSC2/CLKO/RC15 VDD 10 39 OSC1/CLKIN/RC12 AN5/IC8/CN7/RB5 11 38 VDD AN4/IC7/CN6/RB4 12 37 SCL1/RG2 AN3/CN5/RB3 13 36 SDA1/RG3 AN2/SS1/CN4/RB2 14 35 U1RTS/SCK1/INT0/RF6 PGEC3/AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2 PGED3/AN0/VREF+/CN2/RB0 16 33 U1TX/SDO1/RF3 17181920212223242526272829303132 67 D S8901 S D234545 BB D SBB11 S D1111FF PGEC1/AN6/OCFA/RPGED1/AN7/RAVAVU2CTS/AN8/RAN9/RTMS/AN10/RBTDO/AN11/RBVVTCK/AN12/RBTDI/AN13/RBU2RTS/AN14/RBAN15/OCFB/CN12/RBU2RX/SDA2/CN17/RU2TX/SCL2/CN18/R Note1: The metal plane at the bottom of the device is not connected to any pins and should be connected to VSS externally. 2009-2012 Microchip Technology Inc. DS70593D-page 5
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 64-Pin QFN(1) = Pins are up to 5V tolerant 54 DD RR D7D64/3/ SDO/RG13SDI/RG12SCK/RG142RX/RG02TX/RG11TX/RF11RX/RF0 DD CAPC8/CN16/RC7/CN15/RC6/IC6/CN1C5/IC5/CN1C4/RD3C3/RD2C2/RD1 CCCCCCCVVOOOOOOO 64636261605958575655545352515049 COFS/RG15 1 48 PGEC2/SOSCO/T1CK/CN0/RC14 AN16/T2CK/T7CK/RC1 2 47 PGED2/SOSCI/T4CK/CN1/RC13 AN17/T3CK/T6CK/RC2 3 46 OC1/RD0 SCK2/CN8/RG6 4 45 IC4/INT4/RD11 SDI2/CN9/RG7 5 44 IC3/INT3/RD10 SDO2/CN10/RG8 6 43 IC2/U1CTS/INT2/RD9 MCLR 7 42 IC1/INT1/RD8 SS2/CN11/RG9 8 dsPIC33FJ64GP706A 41 VSS VSS 9 dsPIC33FJ128GP706A 40 OSC2/CLKO/RC15 VDD 10 39 OSC1/CLKIN/RC12 AN5/IC8/CN7/RB5 11 38 VDD AN4/IC7/CN6/RB4 12 37 SCL1/RG2 AN3/CN5/RB3 13 36 SDA1/RG3 AN2/SS1/CN4/RB2 14 35 U1RTS/SCK1/INT0/RF6 PGEC3/AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2 PGED3/AN0/VREF+/CN2/RB0 16 33 U1TX/SDO1/RF3 17181920212223242526272829303132 67 D S8901 S D234545 BB D SBB11 S D1111FF PGEC1/AN6/OCFA/RPGED1/AN7/RAVAVU2CTS/AN8/RAN9/RTMS/AN10/RBTDO/AN11/RBVVTCK/AN12/RBTDI/AN13/RBU2RTS/AN14/RBAN15/OCFB/CN12/RBU2RX/SDA2/CN17/RU2TX/SCL2/CN18/R Note1: The metal plane at the bottom of the device is not connected to any pins and should be connected to VSS externally. DS70593D-page 6 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 64-Pin TQFP = Pins are up to 5V tolerant 54 DD RR D7D64/3/ SDO/RG13SDI/RG12SCK/RG14G0G1F1F0 DD CAPC8/CN16/RC7/CN15/RC6/IC6/CN1C5/IC5/CN1C4/RD3C3/RD2C2/RD1 CCCRRRRVVOOOOOOO 4321098765432109 6666655555555554 COFS/RG15 1 48 PGEC2/SOSCO/T1CK/CN0/RC14 AN16/T2CK/T7CK/RC1 2 47 PGED2/SOSCI/T4CK/CN1/RC13 AN17/T3CK/T6CK/RC2 3 46 OC1/RD0 SCK2/CN8/RG6 4 45 IC4/INT4/RD11 SDI2/CN9/RG7 5 44 IC3/INT3/RD10 SDO2/CN10/RG8 6 43 IC2/U1CTS/INT2/RD9 MCLR 7 42 IC1/INT1/RD8 SS2/CN11/RG9 8 dsPIC33FJ64GP206A 41 VSS VSS 9 dsPIC33FJ128GP206A 40 OSC2/CLKO/RC15 VDD 10 39 OSC1/CLKIN/RC12 AN5/IC8/CN7/RB5 11 38 VDD AN4/IC7/CN6/RB4 12 37 SCL1/RG2 AN3/CN5/RB3 13 36 SDA1/RG3 AN2/SS1/CN4/RB2 14 35 U1RTS/SCK1/INT0/RF6 PGEC3/AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2 PGED3/AN0/VREF+/CN2/RB0 16 33 U1TX/SDO1/RF3 7890123456789012 1112222222222333 6 D S8901 S D234545 B D SBB11 S D1111FF R VVRRBBVVBBBBRR PGEC1/AN6/OCFA/PGED1/AN7/RB7AAU2CTS/AN8/AN9/TMS/AN10/RTDO/AN11/R TCK/AN12/RTDI/AN13/RU2RTS/AN14/RAN15/OCFB/CN12/RU2RX/CN17/U2TX/CN18/ 2009-2012 Microchip Technology Inc. DS70593D-page 7
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 64-Pin TQFP = Pins are up to 5V tolerant 54 DD RR D7D64/3/ SDO/RG13SDI/RG12SCK/RG14G0G1F1F0 DD CAPC8/CN16/RC7/CN15/RC6/IC6/CN1C5/IC5/CN1C4/RD3C3/RD2C2/RD1 CCCRRRRVVOOOOOOO 4321098765432109 6666655555555554 COFS/RG15 1 48 PGEC2/SOSCO/T1CK/CN0/RC14 AN16/T2CK/T7CK/RC1 2 47 PGED2/SOSCI/T4CK/CN1/RC13 AN17/T3CK/T6CK/RC2 3 46 OC1/RD0 SCK2/CN8/RG6 4 45 IC4/INT4/RD11 SDI2/CN9/RG7 5 44 IC3/INT3/RD10 SDO2/CN10/RG8 6 43 IC2/U1CTS/INT2/RD9 MCLR 7 42 IC1/INT1/RD8 dsPIC33FJ64GP306A SS2/CN11/RG9 8 41 VSS VSS 9 dsPIC33FJ128GP306A 40 OSC2/CLKO/RC15 VDD 10 39 OSC1/CLKIN/RC12 AN5/IC8/CN7/RB5 11 38 VDD AN4/IC7/CN6/RB4 12 37 SCL1/RG2 AN3/CN5/RB3 13 36 SDA1/RG3 AN2/SS1/CN4/RB2 14 35 U1RTS/SCK1/INT0/RF6 PGEC3/AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2 PGED3/AN0/VREF+/CN2/RB0 16 33 U1TX/SDO1/RF3 7890123456789012 1112222222222333 6 D S8901 S D234545 B D SBB11 S D1111FF R VVRRBBVVBBBBRR PGEC1/AN6/OCFA/PGED1/AN7/RB7AAU2CTS/AN8/AN9/TMS/AN10/RTDO/AN11/R TCK/AN12/RTDI/AN13/RU2RTS/AN14/RAN15/OCFB/CN12/RU2RX/SDA2/CN17/U2TX/SCL2/CN18/ DS70593D-page 8 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 64-Pin TQFP = Pins are up to 5V tolerant 54 DD RR D7D64/3/ SDO/RG13SDI/RG12SCK/RG14G0G11TX/RF11RX/RF0 DD CAPC8/CN16/RC7/CN15/RC6/IC6/CN1C5/IC5/CN1C4/RD3C3/RD2C2/RD1 CCCRRCCVVOOOOOOO 4321098765432109 6666655555555554 COFS/RG15 1 48 PGEC2/SOSCO/T1CK/CN0/RC14 AN16/T2CK/T7CK/RC1 2 47 PGED2/SOSCI/T4CK/CN1/RC13 AN17/T3CK/T6CK/RC2 3 46 OC1/RD0 SCK2/CN8/RG6 4 45 IC4/INT4/RD11 SDI2/CN9/RG7 5 44 IC3/INT3/RD10 SDO2/CN10/RG8 6 43 IC2/U1CTS/INT2/RD9 MCLR 7 42 IC1/INT1/RD8 SS2/CN11/RG9 8 dsPIC33FJ256GP506A 41 VSS VSS 9 40 OSC2/CLKO/RC15 VDD 10 39 OSC1/CLKIN/RC12 AN5/IC8/CN7/RB5 11 38 VDD AN4/IC7/CN6/RB4 12 37 SCL1/RG2 AN3/CN5/RB3 13 36 SDA1/RG3 AN2/SS1/CN4/RB2 14 35 U1RTS/SCK1/INT0/RF6 PGEC3/AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2 PGED3/AN0/VREF+/CN2/RB0 16 33 U1TX/SDO1/RF3 7890123456789012 1112222222222333 6 D S8901 S D234545 B D SBB11 S D1111FF R VVRRBBVVBBBBRR PGEC1/AN6/OCFA/PGED1/AN7/RB7AAU2CTS/AN8/AN9/TMS/AN10/RTDO/AN11/R TCK/AN12/RTDI/AN13/RU2RTS/AN14/RAN15/OCFB/CN12/RU2RX/SDA2/CN17/U2TX/SCL2/CN18/ 2009-2012 Microchip Technology Inc. DS70593D-page 9
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 64-Pin TQFP = Pins are up to 5V tolerant 54 DD RR D7D64/3/ SDO/RG13SDI/RG12SCK/RG142RX/RG02TX/RG11TX/RF11RX/RF0 DD CAPC8/CN16/RC7/CN15/RC6/IC6/CN1C5/IC5/CN1C4/RD3C3/RD2C2/RD1 CCCCCCCVVOOOOOOO 4321098765432109 6666655555555554 COFS/RG15 1 48 PGEC2/SOSCO/T1CK/CN0/RC14 AN16/T2CK/T7CK/RC1 2 47 PGED2/SOSCI/T4CK/CN1/RC13 AN17/T3CK/T6CK/RC2 3 46 OC1/RD0 SCK2/CN8/RG6 4 45 IC4/INT4/RD11 SDI2/CN9/RG7 5 44 IC3/INT3/RD10 SDO2/CN10/RG8 6 43 IC2/U1CTS/INT2/RD9 MCLR 7 42 IC1/INT1/RD8 dsPIC33FJ64GP706A SS2/CN11/RG9 8 41 VSS VSS 9 dsPIC33FJ128GP706A 40 OSC2/CLKO/RC15 VDD 10 39 OSC1/CLKIN/RC12 AN5/IC8/CN7/RB5 11 38 VDD AN4/IC7/CN6/RB4 12 37 SCL1/RG2 AN3/CN5/RB3 13 36 SDA1/RG3 AN2/SS1/CN4/RB2 14 35 U1RTS/SCK1/INT0/RF6 PGEC3/AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2 PGED3/AN0/VREF+/CN2/RB0 16 33 U1TX/SDO1/RF3 7890123456789012 1112222222222333 6 D S8901 S D234545 B D SBB11 S D1111FF R VVRRBBVVBBBBRR PGEC1/AN6/OCFA/PGED1/AN7/RB7AAU2CTS/AN8/AN9/TMS/AN10/RTDO/AN11/R TCK/AN12/RTDI/AN13/RU2RTS/AN14/RAN15/OCFB/CN12/RU2RX/SDA2/CN17/U2TX/SCL2/CN18/ DS70593D-page 10 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 80-Pin TQFP = Pins are up to 5V tolerant CSDO/RG13 CSDI/RG12 CSCK/RG14 AN23/CN23/RA7 AN22/CN22/RA6C2RX/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VCAP OC8/CN16/RD7 OC7/CN15/RD6 OC6/CN14/RD5OC5/CN13/RD4 IC6/CN19/RD13 IC5/RD12 OC4/RD3 OC3/RD2 OC2/RD1 0 9 8 7 6 5 4 3 2 1 0 9 8 7 6 5 4 3 2 1 8 7 7 7 7 7 7 7 7 7 7 6 6 6 6 6 6 6 6 6 COFS/RG15 1 60 PGEC2/SOSCO/T1CK/CN0/RC14 AN16/T2CK/T7CK/RC1 2 59 PGED2/SOSCI/CN1/RC13 AN17/T3CK/T6CK/RC2 3 58 OC1/RD0 AN18/T4CK/T9CK/RC3 4 57 IC4/RD11 AN19/T5CK/T8CK/RC4 5 56 IC3/RD10 SCK2/CN8/RG6 6 55 IC2/RD9 SDI2/CN9/RG7 7 54 IC1/RD8 SDO2/CN10/RG8 8 53 SDA2/INT4/RA3 MCLR 9 52 SCL2/INT3/RA2 SS2/CN11/RG9 10 dsPIC33FJ64GP708A 51 VSS VSS 11 dsPIC33FJ128GP708A 50 OSC2/CLKO/RC15 VDD 12 49 OSC1/CLKIN/RC12 TMS/AN20/INT1/RA12 13 48 VDD TDO/AN21/INT2/RA13 14 47 SCL1/RG2 AN5/CN7/RB5 15 46 SDA1/RG3 AN4/CN6/RB4 16 45 SCK1/INT0/RF6 AN3/CN5/RB3 17 44 SDI1/RF7 AN2/SS1/CN4/RB2 18 43 SDO1/RF8 PGEC3/AN1/CN3/RB1 19 42 U1RX/RF2 PGED3/AN0/CN2/RB0 20 41 U1TX/RF3 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 0 2 2 2 2 2 2 2 2 2 3 3 3 3 3 3 3 3 3 3 4 PGEC1/AN6/OCFA/RB6 PGED1/AN7/RB7 V-/RA9REF V+/RA10REF AVDD AVSS U2CTS/AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD TCK/AN12/RB12 TDI/AN13/RB13 U2RTS/AN14/RB14 AN15/OCFB/CN12/RB15 IC7/U1CTS/CN20/RD14 IC8/U1RTS/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5 2009-2012 Microchip Technology Inc. DS70593D-page 11
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 100-Pin TQFP = Pins are up to 5V tolerant AN28/RE4AN27/RE3AN26/RE2CSDO/RG13CSDI/RG12CSCK/RG14AN25/RE1AN24/RE0AN23/CN23/RA7AN22/CN22/RA6RG0RG1RF1RF0VDDVCAPOC8/CN16/RD7OC7/CN15/RD6OC6/CN14/RD5OC5/CN13/RD4IC6/CN19/RD13IC5/RD12OC4/RD3OC3/RD2OC2/RD1 0987654321098765432109876 0999999999988888888887777 1 COFS/RG15 1 75 VSS VDD 2 74 PGEC2/SOSCO/T1CK/CN0/RC14 AN29/RE5 3 73 PGED2/SOSCI/CN1/RC13 AN30/RE6 4 72 OC1/RD0 AN31/RE7 5 71 IC4/RD11 AN16/T2CK/T7CK/RC1 6 70 IC3/RD10 AN17/T3CK/T6CK/RC2 7 69 IC2/RD9 AN18/T4CK/T9CK/RC3 8 68 IC1/RD8 AN19/T5CK/T8CK/RC4 9 67 INT4/RA15 SCK2/CN8/RG6 10 66 INT3/RA14 SDI2/CN9/RG7 11 65 VSS SDO2/CN10/RG8 12 64 OSC2/CLKO/RC15 MCLR 13 dsPIC33FJ64GP310A 63 OSC1/CLKIN/RC12 SS2/CN11/RG9 14 dsPIC33FJ128GP310A 62 VDD VSS 15 61 TDO/RA5 VDD 16 60 TDI/RA4 TMS/RA0 17 59 SDA2/RA3 AN20/INT1/RA12 18 58 SCL2/RA2 AN21/INT2/RA13 19 57 SCL1/RG2 AN5/CN7/RB5 20 56 SDA1/RG3 AN4/CN6/RB4 21 55 SCK1/INT0/RF6 AN3/CN5/RB3 22 54 SDI1/RF7 AN2/SS1/CN4/RB2 23 53 SDO1/RF8 PGEC3/AN1/CN3/RB1 24 52 U1RX/RF2 PGED3/AN0/CN2/RB0 25 51 U1TX/RF3 6789012345678901234567890 2222333333333344444444445 PGEC1/AN6/OCFA/RB6PGED1/AN7/RB7V-/RA9REFV+/RA10REFAVDDAVSSAN8/RB8AN9/RB9AN10/RB10AN11/RB11VSSVDDTCK/RA1U2RTS/RF13U2CTS/RF12AN12/RB12AN13/RB13AN14/RB14AN15/OCFB/CN12/RB15VSSVDDIC7/U1CTS/CN20/RD14IC8/U1RTS/CN21/RD15U2RX/CN17/RF4U2TX/CN18/RF5 DS70593D-page 12 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 100-Pin TQFP = Pins are up to 5V tolerant AN28/RE4AN27/RE3AN26/RE2CSDO/RG13CSDI/RG12CSCK/RG14AN25/RE1AN24/RE0AN23/CN23/RA7AN22/CN22/RA6RG0RG1C1TX/RF1C1RX/RF0VDDVCAPOC8/CN16/RD7OC7/CN15/RD6OC6/CN14/RD5OC5/CN13/RD4IC6/CN19/RD13IC5/RD12OC4/RD3OC3/RD2OC2/RD1 0987654321098765432109876 0999999999988888888887777 1 COFS/RG15 1 75 VSS VDD 2 74 PGEC2/SOSCO/T1CK/CN0/RC14 AN29/RE5 3 73 PGED2/SOSCI/CN1/RC13 AN30/RE6 4 72 OC1/RD0 AN31/RE7 5 71 IC4/RD11 AN16/T2CK/T7CK/RC1 6 70 IC3/RD10 AN17/T3CK/T6CK/RC2 7 69 IC2/RD9 AN18/T4CK/T9CK/RC3 8 68 IC1/RD8 AN19/T5CK/T8CK/RC4 9 67 INT4/RA15 SCK2/CN8/RG6 10 66 INT3/RA14 SDI2/CN9/RG7 11 65 VSS SDO2/CN10/RG8 12 64 OSC2/CLKO/RC15 MCLR 13 dsPIC33FJ256GP510A 63 OSC1/CLKIN/RC12 SS2/CN11/RG9 14 62 VDD VSS 15 61 TDO/RA5 VDD 16 60 TDI/RA4 TMS/RA0 17 59 SDA2/RA3 AN20/INT1/RA12 18 58 SCL2/RA2 AN21/INT2/RA13 19 57 SCL1/RG2 AN5/CN7/RB5 20 56 SDA1/RG3 AN4/CN6/RB4 21 55 SCK1/INT0/RF6 AN3/CN5/RB3 22 54 SDI1/RF7 AN2/SS1/CN4/RB2 23 53 SDO1/RF8 PGEC3/AN1/CN3/RB1 24 52 U1RX/RF2 PGED3/AN0/CN2/RB0 25 51 U1TX/RF3 6789012345678901234567890 2222333333333344444444445 PGEC1/AN6/OCFA/RB6PGED1/AN7/RB7V-/RA9REFV+/RA10REFAVDDAVSSAN8/RB8AN9/RB9AN10/RB10AN11/RB11VSSVDD TCK/RA1U2RTS/RF13U2CTS/RF12AN12/RB12AN13/RB13AN14/RB14AN15/OCFB/CN12/RB15VSSVDDIC7/U1CTS/CN20/RD14IC8/U1RTS/CN21/RD15U2RX/CN17/RF4U2TX/CN18/RF5 2009-2012 Microchip Technology Inc. DS70593D-page 13
dsPIC33FJXXXGPX06A/X08A/X10A Pin Diagrams (Continued) 100-Pin TQFP = Pins are up to 5V tolerant AN28/RE4AN27/RE3AN26/RE2CSDO/RG13CSDI/RG12CSCK/RG14AN25/RE1AN24/RE0AN23/CN23/RA7AN22/CN22/RA6C2RX/RG0C2TX/RG1C1TX/RF1C1RX/RF0VDDVCAPOC8/CN16/RD7OC7/CN15/RD6OC6/CN14/RD5OC5/CN13/RD4IC6/CN19/RD13IC5/RD12OC4/RD3OC3/RD2OC2/RD1 0987654321098765432109876 0999999999988888888887777 1 COFS/RG15 1 75 VSS VDD 2 74 PGEC2/SOSCO/T1CK/CN0/RC14 AN29/RE5 3 73 PGED2/SOSCI/CN1/RC13 AN30/RE6 4 72 OC1/RD0 AN31/RE7 5 71 IC4/RD11 AN16/T2CK/T7CK/RC1 6 70 IC3/RD10 AN17/T3CK/T6CK/RC2 7 69 IC2/RD9 AN18/T4CK/T9CK/RC3 8 68 IC1/RD8 AN19/T5CK/T8CK/RC4 9 67 INT4/RA15 SCK2/CN8/RG6 10 66 INT3/RA14 SDI2/CN9/RG7 11 65 VSS SDO2/CN10/RG8 12 dsPIC33FJ64GP710A 64 OSC2/CLKO/RC15 MCLR 13 dsPIC33FJ128GP710A 63 OSC1/CLKIN/RC12 SS2/CN11/RG9 14 dsPIC33FJ256GP710A 62 VDD VSS 15 61 TDO/RA5 VDD 16 60 TDI/RA4 TMS/RA0 17 59 SDA2/RA3 AN20/INT1/RA12 18 58 SCL2/RA2 AN21/INT2/RA13 19 57 SCL1/RG2 AN5/CN7/RB5 20 56 SDA1/RG3 AN4/CN6/RB4 21 55 SCK1/INT0/RF6 AN3/CN5/RB3 22 54 SDI1/RF7 AN2/SS1/CN4/RB2 23 53 SDO1/RF8 PGEC3/AN1/CN3/RB1 24 52 U1RX/RF2 PGED3/AN0/CN2/RB0 25 51 U1TX/RF3 6789012345678901234567890 2222333333333344444444445 PGEC1/AN6/OCFA/RB6PGED1/AN7/RB7V-/RA9REFV+/RA10REFAVDDAVSSAN8/RB8AN9/RB9AN10/RB10AN11/RB11VSSVDDTCK/RA1U2RTS/RF13U2CTS/RF12AN12/RB12AN13/RB13AN14/RB14AN15/OCFB/CN12/RB15VSSVDDIC7/U1CTS/CN20/RD14IC8/U1RTS/CN21/RD15U2RX/CN17/RF4U2TX/CN18/RF5 DS70593D-page 14 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Table of Contents dsPIC33F Product Families...................................................................................................................................................................2 1.0 Device Overview........................................................................................................................................................................19 2.0 Guidelines for Getting Started with 16-Bit Digital Signal Controllers..........................................................................................23 3.0 CPU............................................................................................................................................................................................27 4.0 Memory Organization.................................................................................................................................................................39 5.0 Flash Program Memory..............................................................................................................................................................77 6.0 Reset .........................................................................................................................................................................................83 7.0 Interrupt Controller.....................................................................................................................................................................89 8.0 Direct Memory Access (DMA)..................................................................................................................................................135 9.0 Oscillator Configuration............................................................................................................................................................145 10.0 Power-Saving Features............................................................................................................................................................155 11.0 I/O Ports...................................................................................................................................................................................163 12.0 Timer1......................................................................................................................................................................................167 13.0 Timer2/3, Timer4/5, Timer6/7 and Timer8/9 ............................................................................................................................169 14.0 Input Capture............................................................................................................................................................................175 15.0 Output Compare.......................................................................................................................................................................177 16.0 Serial Peripheral Interface (SPI)...............................................................................................................................................181 17.0 Inter-Integrated Circuit™ (I2C™)..............................................................................................................................................187 18.0 Universal Asynchronous Receiver Transmitter (UART)...........................................................................................................195 19.0 Enhanced CAN (ECAN™) Module...........................................................................................................................................201 20.0 Data Converter Interface (DCI) Module....................................................................................................................................229 21.0 10-Bit/12-Bit Analog-to-Digital Converter (ADC)......................................................................................................................237 22.0 Special Features......................................................................................................................................................................251 23.0 Instruction Set Summary..........................................................................................................................................................259 24.0 Development Support...............................................................................................................................................................267 25.0 Electrical Characteristics..........................................................................................................................................................271 26.0 High Temperature Electrical Characteristics............................................................................................................................321 27.0 DC and AC Device Characteristics Graphs..............................................................................................................................331 28.0 Packaging Information..............................................................................................................................................................335 Appendix A: Migrating from dsPIC33FJXXXGPX06/X08/X10 Devices to dsPIC33FJXXXGPX06A/X08A/X10A Devices................347 Appendix B: Revision History.............................................................................................................................................................348 Index................................................................................................................................................................................................. 353 The Microchip Web Site.....................................................................................................................................................................357 Customer Change Notification Service..............................................................................................................................................357 Customer Support..............................................................................................................................................................................357 Reader Response..............................................................................................................................................................................358 Product Identification System............................................................................................................................................................359 2009-2012 Microchip Technology Inc. DS70593D-page 15
dsPIC33FJXXXGPX06A/X08A/X10A TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We wel- come your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS70593D-page 16 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Referenced Sources This device data sheet is based on the following individual chapters of the “dsPIC33F/PIC24H Family Reference Manual”. These documents should be considered as the general reference for the operation of a particular module or device feature. Note: To access the documents listed below, browse to the documentation section of the dsPIC33FJ256GP710A product page on the Microchip web site (www.microchip.com) or select a family reference manual section from the following list. In addition to parameters, features, and other documentation, the resulting page provides links to the related family reference manual sections. • Section 1. “Introduction” (DS70197) • Section 2. “CPU” (DS70204) • Section 3. “Data Memory” (DS70202) • Section 4. “Program Memory” (DS70203) • Section 5. “Flash Programming” (DS70191) • Section 6. “Interrupts” (DS70184) • Section 7. “Oscillator” (DS70186) • Section 8. “Reset” (DS70192) • Section 9. “Watchdog Timer and Power-Saving Modes” (DS70196) • Section 10. “I/O Ports” (DS70193) • Section 11. “Timers” (DS70205) • Section 12. “Input Capture” (DS70198) • Section 13. “Output Compare” (DS70209) • Section 16. “Analog-to-Digital Converter (ADC)” (DS70183) • Section 17. “UART” (DS70188) • Section 18. “Serial Peripheral Interface (SPI)” (DS70206) • Section 19. “Inter-Integrated Circuit™ (I2C™)” (DS70195) • Section 20. “Data Converter Interface (DCI)” (DS70288) • Section 21. “Enhanced Controller Area Network (ECAN™)” (DS70185) • Section 22. “Direct Memory Access (DMA)” (DS70182) • Section 23. “CodeGuard™ Security” (DS70199) • Section 24. “Programming and Diagnostics” (DS70207) • Section 25. “Device Configuration” (DS70194) 2009-2012 Microchip Technology Inc. DS70593D-page 17
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 18 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 1.0 DEVICE OVERVIEW This feature makes the family suitable for a wide variety of high-performance digital signal control applications. Note: This data sheet summarizes the features The device is pin compatible with the PIC24H family of of the dsPIC33FJXXXGPX06A/X08A/ devices, and also share a very high degree of X10A family of devices. However, it is not compatibility with the dsPIC30F family devices. This intended to be a comprehensive allows for easy migration between device families as may reference source. To complement the be necessitated by the specific functionality, information in this data sheet, refer to the computational resource and system cost requirements of latest family reference sections of the the application. “dsPIC33F/PIC24H Family Reference The dsPIC33FJXXXGPX06A/X08A/X10A device fam- Manual”, which are available from the ily employs a powerful 16-bit architecture that seam- Microchip web site (www.microchip.com). lessly integrates the control features of a Microcontroller (MCU) with the computational capabili- This document contains device specific information for ties of a Digital Signal Processor (DSP). The resulting the following devices: functionality is ideal for applications that rely on • dsPIC33FJ64GP206A high-speed, repetitive computations, as well as control. • dsPIC33FJ64GP306A The DSP engine, dual 40-bit accumulators, hardware • dsPIC33FJ64GP310A support for division operations, barrel shifter, 17 x 17 • dsPIC33FJ64GP706A multiplier, a large array of 16-bit working registers and • dsPIC33FJ64GP708A a wide variety of data addressing modes, together • dsPIC33FJ64GP710A provide the dsPIC33FJXXXGPX06A/X08A/X10A Central Processing Unit (CPU) with extensive • dsPIC33FJ128GP206A mathematical processing capability. Flexible and • dsPIC33FJ128GP306A deterministic interrupt handling, coupled with a • dsPIC33FJ128GP310A powerful array of peripherals, renders the • dsPIC33FJ128GP706A dsPIC33FJXXXGPX06A/X08A/X10A devices suitable • dsPIC33FJ128GP708A for control applications. Further, Direct Memory Access (DMA) enables overhead-free transfer of data between • dsPIC33FJ128GP710A several peripherals and a dedicated DMA RAM. • dsPIC33FJ256GP506A Reliable, field programmable Flash program memory • dsPIC33FJ256GP510A ensures scalability of applications that use • dsPIC33FJ256GP710A dsPIC33FJXXXGPX06A/X08A/X10A devices. The dsPIC33FJXXXGPX06A/X08A/X10A General Figure1-1 illustrates a general block diagram of the Purpose Family of device includes devices with a wide various core and peripheral modules in the range of pin counts (64, 80 and 100), different program dsPIC33FJXXXGPX06A/X08A/X10A family of devices. memory sizes (64 Kbytes, 128 Kbytes and 256 Kbytes) Table1-1 provides the functions of the various pins and different RAM sizes (8 Kbytes, 16 Kbytes and illustrated in the pinout diagrams. 30Kbytes). 2009-2012 Microchip Technology Inc. DS70593D-page 19
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 1-1: dsPIC33FJXXXGPX06A/X08A/X10A GENERAL BLOCK DIAGRAM PSV and Table Data Access Control Block Y Data Bus Interrupt X Data Bus PORTA Controller 16 8 16 16 16 DMA Data Latch Data Latch RAM 23 PCU PCH PCL X RAM Y RAM 23 PORTB Program Counter Stack Loop Address Address Control Control Latch Latch Logic Logic DMA 16 23 Controller 16 16 PORTC Address Generator Units Address Latch Program Memory EA MUX PORTD Data Latch ROM Latch 24 16 16 a at Instruction D Decode and al Control Instruction Reg er Lit 16 PORTE Control Signals to Various Blocks DSP Engine OSC2/CLKO Timing Power-up OSC1/CLKI Generation Timer PORTF Oscillator 16 x 16 FRC/LPRC Start-up Timer W Register Array Oscillators Divide Support Power-on 16 Reset Precision Band Gap Watchdog Reference Timer PORTG Brown-out 16-bit ALU Voltage Reset Regulator 16 VCAP VDD, VSS MCLR Timers OC/ DCI ADC1,2 ECAN1,2 1-9 PWM1-8 IC1-8 CN1-23 SPI1,2 I2C1,2 UART1,2 Note: Not all pins or features are implemented on all device pinout configurations. See the “Pin Diagrams” section for the specific pins and features present on each device. DS70593D-page 20 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 1-1: PINOUT I/O DESCRIPTIONS Pin Buffer Pin Name Description Type Type AN0-AN31 I Analog Analog input channels. AVDD P P Positive supply for analog modules. This pin must be connected at all times. AVSS P P Ground reference for analog modules. CLKI I ST/CMOS External clock source input. Always associated with OSC1 pin function. CLKO O — Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always associated with OSC2 pin function. CN0-CN23 I ST Input change notification inputs. Can be software programmed for internal weak pull-ups on all inputs. COFS I/O ST Data Converter Interface frame synchronization pin. CSCK I/O ST Data Converter Interface serial clock input/output pin. CSDI I ST Data Converter Interface serial data input pin. CSDO O — Data Converter Interface serial data output pin. C1RX I ST ECAN1 bus receive pin. C1TX O — ECAN1 bus transmit pin. C2RX I ST ECAN2 bus receive pin. C2TX O — ECAN2 bus transmit pin. PGED1 I/O ST Data I/O pin for programming/debugging communication channel 1. PGEC1 I ST Clock input pin for programming/debugging communication channel 1. PGED2 I/O ST Data I/O pin for programming/debugging communication channel 2. PGEC2 I ST Clock input pin for programming/debugging communication channel 2. PGED3 I/O ST Data I/O pin for programming/debugging communication channel 3. PGEC3 I ST Clock input pin for programming/debugging communication channel 3. IC1-IC8 I ST Capture inputs 1 through 8. INT0 I ST External interrupt 0. INT1 I ST External interrupt 1. INT2 I ST External interrupt 2. INT3 I ST External interrupt 3. INT4 I ST External interrupt 4. MCLR I/P ST Master Clear (Reset) input. This pin is an active-low Reset to the device. OCFA I ST Compare Fault A input (for Compare Channels 1, 2, 3 and 4). OCFB I ST Compare Fault B input (for Compare Channels 5, 6, 7 and 8). OC1-OC8 O — Compare outputs 1 through 8. OSC1 I ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. OSC2 I/O — Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. RA0-RA7 I/O ST PORTA is a bidirectional I/O port. RA9-RA10 I/O ST RA12-RA15 I/O ST RB0-RB15 I/O ST PORTB is a bidirectional I/O port. RC1-RC4 I/O ST PORTC is a bidirectional I/O port. RC12-RC15 I/O ST RD0-RD15 I/O ST PORTD is a bidirectional I/O port. RE0-RE7 I/O ST PORTE is a bidirectional I/O port. RF0-RF8 I/O ST PORTF is a bidirectional I/O port. RF12-RF13 I/O ST Legend: CMOS = CMOS compatible input or output; Analog = Analog input; P = Power ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input 2009-2012 Microchip Technology Inc. DS70593D-page 21
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Buffer Pin Name Description Type Type RG0-RG3 I/O ST PORTG is a bidirectional I/O port. RG6-RG9 I/O ST RG12-RG15 I/O ST SCK1 I/O ST Synchronous serial clock input/output for SPI1. SDI1 I ST SPI1 data in. SDO1 O — SPI1 data out. SS1 I/O ST SPI1 slave synchronization or frame pulse I/O. SCK2 I/O ST Synchronous serial clock input/output for SPI2. SDI2 I ST SPI2 data in. SDO2 O — SPI2 data out. SS2 I/O ST SPI2 slave synchronization or frame pulse I/O. SCL1 I/O ST Synchronous serial clock input/output for I2C1. SDA1 I/O ST Synchronous serial data input/output for I2C1. SCL2 I/O ST Synchronous serial clock input/output for I2C2. SDA2 I/O ST Synchronous serial data input/output for I2C2. SOSCI I ST/CMOS 32.768 kHz low-power oscillator crystal input; CMOS otherwise. SOSCO O — 32.768 kHz low-power oscillator crystal output. TMS I ST JTAG Test mode select pin. TCK I ST JTAG test clock input pin. TDI I ST JTAG test data input pin. TDO O — JTAG test data output pin. T1CK I ST Timer1 external clock input. T2CK I ST Timer2 external clock input. T3CK I ST Timer3 external clock input. T4CK I ST Timer4 external clock input. T5CK I ST Timer5 external clock input. T6CK I ST Timer6 external clock input. T7CK I ST Timer7 external clock input. T8CK I ST Timer8 external clock input. T9CK I ST Timer9 external clock input. U1CTS I ST UART1 clear to send. U1RTS O — UART1 ready to send. U1RX I ST UART1 receive. U1TX O — UART1 transmit. U2CTS I ST UART2 clear to send. U2RTS O — UART2 ready to send. U2RX I ST UART2 receive. U2TX O — UART2 transmit. VDD P — Positive supply for peripheral logic and I/O pins. VCAP P — CPU logic flter capacitor connection. VSS P — Ground reference for logic and I/O pins. VREF+ I Analog Analog voltage reference (high) input. VREF- I Analog Analog voltage reference (low) input. Legend: CMOS = CMOS compatible input or output; Analog = Analog input; P = Power ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input DS70593D-page 22 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 2.0 GUIDELINES FOR GETTING 2.2 Decoupling Capacitors STARTED WITH 16-BIT The use of decoupling capacitors on every pair of DIGITAL SIGNAL power supply pins, such as VDD, VSS, AVDD and CONTROLLERS AVSS is required. Consider the following criteria when using decoupling Note1: This data sheet summarizes the features capacitors: of the dsPIC33FJXXXGPX06A/X08A/ • Value and type of capacitor: Recommendation X10A family of devices. It is not intended of 0.1 µF (100 nF), 10-20V. This capacitor should to be a comprehensive reference source. be a low-ESR and have resonance frequency in To complement the information in this the range of 20MHz and higher. It is data sheet, refer to the “dsPIC33F/ recommended that ceramic capacitors be used. PIC24H Family Reference Manual”. Please see the Microchip web site • Placement on the printed circuit board: The (www.microchip.com) for the latest decoupling capacitors should be placed as close dsPIC33F/PIC24H Family Reference to the pins as possible. It is recommended to Manual sections. place the capacitors on the same side of the board as the device. If space is constricted, the 2: Some registers and associated bits capacitor can be placed on another layer on the described in this section may not be PCB using a via; however, ensure that the trace available on all devices. Refer to length from the pin to the capacitor is within Section4.0 “Memory Organization” in one-quarter inch (6mm) in length. this data sheet for device-specific register • Handling high frequency noise: If the board is and bit information. experiencing high frequency noise, upward of tens of MHz, add a second ceramic-type capacitor 2.1 Basic Connection Requirements in parallel to the above described decoupling capacitor. The value of the second capacitor can Getting started with the dsPIC33FJXXXGPX06A/ be in the range of 0.01µF to 0.001µF. Place this X08A/X10A family of 16-bit Digital Signal Controllers second capacitor next to the primary decoupling (DSCs) requires attention to a minimal set of device pin capacitor. In high-speed circuit designs, consider connections before proceeding with development. The implementing a decade pair of capacitances as following is a list of pin names, which must always be close to the power and ground pins as possible. connected: For example, 0.1 µF in parallel with 0.001 µF. • All VDD and VSS pins • Maximizing performance: On the board layout (see Section2.2 “Decoupling Capacitors”) from the power supply circuit, run the power and • All AVDD and AVSS pins (regardless if ADC module return traces to the decoupling capacitors first, is not used) and then to the device pins. This ensures that the (see Section2.2 “Decoupling Capacitors”) decoupling capacitors are first in the power chain. • VCAP Equally important is to keep the trace length (see Section2.3 “CPU Logic Filter Capacitor between the capacitor and the power pins to a Connection (VCAP)”) minimum thereby reducing PCB track inductance. • MCLR pin (see Section2.4 “Master Clear (MCLR) Pin”) • PGECx/PGEDx pins used for In-Circuit Serial Programming™ (ICSP™) and debugging purposes (see Section2.5 “ICSP Pins”) • OSC1 and OSC2 pins when external oscillator source is used (see Section2.6 “External Oscillator Pins”) Additionally, the following pins may be required: • VREF+/VREF- pins used when external voltage reference for ADC module is implemented Note: The AVDD and AVSS pins must be connected independent of the ADC voltage reference source. 2009-2012 Microchip Technology Inc. DS70593D-page 23
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 2-1: RECOMMENDED The placement of this capacitor should be close to the MINIMUM CONNECTION VCAP. It is recommended that the trace length not exceed one-quarter inch (6 mm). Refer to Section22.2 0.1 µF “On-Chip Voltage Regulator” for details. 10 µF Ceramic VDD Tantalum 2.4 Master Clear (MCLR) Pin R CAP VDD VSS The MCLR pin provides for two specific device R1 V functions: MCLR • Device Reset C • Device programming and debugging dsPIC33F During device programming and debugging, the VSS VDD resistance and capacitance that can be added to the pin must be considered. Device programmers and 0.1 µF VDD D S VSS 0.1 µF debuggers drive the MCLR pin. Consequently, Ceramic VD VS DD SS Ceramic specific voltage levels (VIH and VIL) and fast signal A A V V transitions must not be adversely affected. Therefore, 0.1 µF 0.1 µF specific values of R and C will need to be adjusted Ceramic Ceramic based on the application and PCB requirements. L1(1) For example, as shown in Figure2-2, it is recommended that the capacitor C, be isolated from Note 1: As an option, instead of a hard-wired connection, an inductor (L1) can be substituted between VDD and the MCLR pin during programming and debugging AVDD to improve ADC noise rejection. The inductor operations. impedance should be less than 1 and the inductor capacity greater than 10 mA. Place the components shown in Figure2-2 within one-quarter inch (6mm) from the MCLR pin. Where: FCNV f = -------------- (i.e., ADC conversion rate/2) FIGURE 2-2: EXAMPLE OF MCLR PIN 2 CONNECTIONS 1 f = ----------------------- 2 LC VDD 1 2 L = ---------------------- 2f C R(1) R1(2) MCLR 2.2.1 TANK CAPACITORS JP dsPIC33F On boards with power traces running longer than six inches in length, it is suggested to use a tank capacitor C for integrated circuits including DSCs to supply a local power source. The value of the tank capacitor should be determined based on the trace resistance that con- Note 1: R 10k is recommended. A suggested nects the power supply source to the device, and the starting value is 10k. Ensure that the MCLR maximum current drawn by the device in the applica- pin VIH and VIL specifications are met. tion. In other words, select the tank capacitor so that it 2: R1 470 will limit any current flowing into meets the acceptable voltage sag at the device. Typical MCLR from the external capacitor C, in the values range from 4.7µF to 47µF. event of MCLR pin breakdown, due to Electrostatic Discharge (ESD) or Electrical 2.3 CPU Logic Filter Capacitor Overstress (EOS). Ensure that the MCLR pin Connection (VCAP) VIH and VIL specifications are met. A low-ESR (< 5 Ohms) capacitor is required on the VCAP pin, which is used to stabilize the voltage regulator output voltage. The VCAP pin must not be connected to VDD, and must have a capacitor between 4.7µF and 10 µF, 16V connected to ground. The type can be ceramic or tantalum. Refer to Section25.0 “Electrical Characteristics” for additional information. DS70593D-page 24 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 2.5 ICSP Pins 2.6 External Oscillator Pins The PGECx and PGEDx pins are used for In-Circuit Many DSCs have options for at least two oscillators: a Serial Programming™ (ICSP™) and debugging pur- high-frequency primary oscillator and a low-frequency poses. It is recommended to keep the trace length secondary oscillator (refer to Section9.0 “Oscillator between the ICSP connector and the ICSP pins on the Configuration” for details). device as short as possible. If the ICSP connector is The oscillator circuit should be placed on the same expected to experience an ESD event, a series resistor side of the board as the device. Also, place the is recommended, with the value in the range of a few oscillator circuit close to the respective oscillator pins, tens of Ohms, not to exceed 100 Ohms. not exceeding one-half inch (12mm) distance Pull-up resistors, series diodes, and capacitors on the between them. The load capacitors should be placed PGECx and PGEDx pins are not recommended as they next to the oscillator itself, on the same side of the will interfere with the programmer/debugger communi- board. Use a grounded copper pour around the cations to the device. If such discrete components are oscillator circuit to isolate them from surrounding an application requirement, they should be removed circuits. The grounded copper pour should be routed from the circuit during programming and debugging. directly to the MCU ground. Do not run any signal Alternatively, refer to the AC/DC characteristics and traces or power traces inside the ground pour. Also, if timing requirements information in the “dsPIC33F/ using a two-sided board, avoid any traces on the PIC24H Flash Programming Specification” (DS70152) other side of the board where the crystal is placed. A for information on capacitive loading limits and pin input suggested layout is shown in Figure2-3. voltage high (VIH) and input low (VIL) requirements. FIGURE 2-3: SUGGESTED PLACEMENT Ensure that the “Communication Channel Select” (i.e., PGECx/PGEDx pins) programmed into the device OF THE OSCILLATOR matches the physical connections for the ICSP to CIRCUIT MPLAB® ICD 3 or MPLAB REAL ICE™. For more information on ICD 3 and REAL ICE Main Oscillator connection requirements, refer to the following 13 documents that are available on the Microchip web Guard Ring 14 site. 15 • “Using MPLAB® ICD 3 In-Circuit Debugger” Guard Trace (poster) DS51765 16 • “MPLAB® ICD 3 Design Advisory” DS51764 Secondary 17 • “MPLAB® REAL ICE™ In-Circuit Emulator User’s Oscillator 18 Guide” DS51616 19 • “Using MPLAB® REAL ICE™” (poster) DS51749 20 2009-2012 Microchip Technology Inc. DS70593D-page 25
dsPIC33FJXXXGPX06A/X08A/X10A 2.7 Oscillator Value Conditions on Device Start-up If the PLL of the target device is enabled and configured for the device start-up oscillator, the maximum oscillator source frequency must be limited to 8MHz for start-up with PLL enabled to comply with device PLL start-up conditions. This means that if the external oscillator frequency is outside this range, the application must start-up in the FRC mode first. The default PLL settings after a POR with an oscillator frequency outside this range will violate the device operating speed. Once the device powers up, the application firmware can initialize the PLL SFRs, CLKDIV and PLLDBF to a suitable value, and then perform a clock switch to the Oscillator + PLL clock source. Note that clock switching must be enabled in the device Configuration word. 2.8 Configuration of Analog and Digital Pins During ICSP Operations If MPLAB ICD 3 or REAL ICE is selected as a debug- ger, it automatically initializes all of the A/D input pins (ANx) as “digital” pins, by setting all bits in the ADPCFG and ADPCFG2 registers. The bits in the registers that correspond to the A/D pins that are initialized by ICD 3 or REAL ICE, must not be cleared by the user application firmware; otherwise, communication errors will result between the debugger and the device. If your application needs to use certain A/D pins as analog input pins during the debug session, the user application must clear the corresponding bits in the ADPCFG and ADPCFG2 registers during initialization of the ADC module. When ICD 3 or REAL ICE is used as a programmer, the user application firmware must correctly configure the ADPCFG and ADPCFG2 registers. Automatic initialization of these registers is only done during debugger operation. Failure to correctly configure the register(s) will result in all A/D pins being recognized as analog input pins, resulting in the port value being read as a logic ‘0’, which may affect user application functionality. 2.9 Unused I/Os Unused I/O pins should be configured as outputs and driven to a logic-low state. Alternatively, connect a 1k to 10k resistor between VSS and the unused pins. DS70593D-page 26 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 3.0 CPU dent Address Generation Unit (AGU). The MCU class of instructions operates solely through the X memory AGU, Note1: This data sheet summarizes the features which accesses the entire memory map as one linear data of the dsPIC33FJXXXGPX06A/X08A/ space. Certain DSP instructions operate through the X and X10A family of devices. However, it is not Y AGUs to support dual operand reads, which splits the intended to be a comprehensive refer- data address space into two parts. The X and Y data space ence source. To complement the infor- boundary is device-specific. mation in this data sheet, refer to Section Overhead-free circular buffers (Modulo Addressing mode) 2. “CPU” (DS70204) in the “dsPIC33F/ are supported in both X and Y address spaces. The Modulo PIC24H Family Reference Manual”, Addressing removes the software boundary checking over- which is available from the Microchip web head for DSP algorithms. Furthermore, the X AGU circular site (www.microchip.com). addressing can be used with any of the MCU class of 2: Some registers and associated bits instructions. The X AGU also supports Bit-Reversed described in this section may not be Addressing to greatly simplify input or output data available on all devices. Refer to reordering for radix-2 FFT algorithms. Section4.0 “Memory Organization” in The upper 32 Kbytes of the data space memory map can this data sheet for device-specific register optionally be mapped into program space at any 16K pro- and bit information. gram word boundary defined by the 8-bit Program Space Visibility Page (PSVPAG) register. The program to data The dsPIC33FJXXXGPX06A/X08A/X10A CPU module space mapping feature lets any instruction access program has a 16-bit (data) modified Harvard architecture with an space as if it were data space. The data space also includes enhanced instruction set, including significant support for 2 Kbytes of DMA RAM, which is primarily used for DMA DSP. The CPU has a 24-bit instruction word with a variable data transfers, but may be used as general purpose RAM. length opcode field. The Program Counter (PC) is 23bits wide and addresses up to 4M x 24 bits of user program 3.2 DSP Engine Overview memory space. The actual amount of program memory implemented varies by device. A single-cycle instruction The DSP engine features a high-speed, 17-bit by 17-bit prefetch mechanism is used to help maintain throughput multiplier, a 40-bit ALU, two 40-bit saturating accumula- and provides predictable execution. All instructions execute tors and a 40-bit bidirectional barrel shifter. The barrel in a single cycle, with the exception of instructions that shifter is capable of shifting a 40-bit value, up to 16 bits change the program flow, the double word move (MOV.D) right or left, in a single cycle. The DSP instructions operate instruction and the table instructions. Overhead-free pro- seamlessly with all other instructions and have been gram loop constructs are supported using the DO and designed for optimal real-time performance. The MAC REPEAT instructions, both of which are interruptible at any instruction and other associated instructions can concur- point. rently fetch two data operands from memory while multi- plying two W registers and accumulating and optionally The dsPIC33FJXXXGPX06A/X08A/X10A devices have saturating the result in the same cycle. This instruction sixteen, 16-bit working registers in the programmer’s functionality requires that the RAM memory data space be model. Each of the working registers can serve as a data, split for these instructions and linear for all others. Data address or address offset register. The 16th working regis- space partitioning is achieved in a transparent and flexible ter (W15) operates as a software Stack Pointer (SP) for manner through dedicating certain working registers to interrupts and calls. each address space. The dsPIC33FJXXXGPX06A/X08A/X10A instruction set has two classes of instructions: MCU and DSP. These two 3.3 Special MCU Features instruction classes are seamlessly integrated into a single The dsPIC33FJXXXGPX06A/X08A/X10A features a CPU. The instruction set includes many addressing modes 17-bit by 17-bit, single-cycle multiplier that is shared by and is designed for optimum C compiler efficiency. For most both the MCU ALU and DSP engine. The multiplier can instructions, the dsPIC33FJXXXGPX06A/X08A/X10A is perform signed, unsigned and mixed-sign multiplication. capable of executing a data (or program data) memory Using a 17-bit by 17-bit multiplier for 16-bit by 16-bit mul- read, a working register (data) read, a data memory write tiplication not only allows you to perform mixed-sign multi- and a program (instruction) memory read per instruction plication, it also achieves accurate results for special cycle. As a result, three parameter instructions can be sup- operations, such as (-1.0) x (-1.0). ported, allowing A + B = C operations to be executed in a single cycle. The dsPIC33FJXXXGPX06A/X08A/X10A supports 16/16 and 32/16 divide operations, both fractional and integer. A block diagram of the CPU is shown in Figure3-1. The All divide instructions are iterative operations. They must programmer’s model for the dsPIC33FJXXXGPX06A/ be executed within a REPEAT loop, resulting in a total exe- X08A/X10A is shown in Figure3-2. cution time of 19 instruction cycles. The divide operation can be interrupted during any of those 19cycles without 3.1 Data Addressing Overview loss of data. The data space can be addressed as 32K words or A 40-bit barrel shifter is used to perform up to a 16-bit, left 64Kbytes and is split into two blocks, referred to as X and or right shift in a single cycle. The barrel shifter can be used Y data memory. Each memory block has its own indepen- by both MCU and DSP instructions. 2009-2012 Microchip Technology Inc. DS70593D-page 27
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 3-1: dsPIC33FJXXXGPX06A/X08A/X10A CPU CORE BLOCK DIAGRAM PSV and Table Data Access Control Block Y Data Bus Interrupt X Data Bus Controller 8 16 16 16 16 Data Latch Data Latch 23 DMA 23 PCU PCH PCL X RAM Y RAM RAM 16 Program Counter Stack Loop Address Address Control Control Latch Latch Logic Logic 23 16 16 DMA Address Latch Address Generator Units Controller Program Memory EA MUX Data Latch ROM Latch 24 16 16 a at Instruction D Decode and al Control Instruction Reg er Lit 16 Control Signals to Various Blocks DSP Engine 16 x 16 W Register Array Divide Support 16 16-bit ALU 16 To Peripheral Modules DS70593D-page 28 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 3-2: dsPIC33FJXXXGPX06A/X08A/X10A PROGRAMMER’S MODEL D15 D0 W0/WREG PUSH.S Shadow W1 DO Shadow W2 W3 Legend W4 DSP Operand W5 Registers W6 W7 Working Registers W8 W9 DSP Address Registers W10 W11 W12/DSP Offset W13/DSP Write Back W14/Frame Pointer W15/Stack Pointer SPLIM Stack Pointer Limit Register AD39 AD31 AD15 AD0 DSP AccA Accumulators AccB PC22 PC0 0 Program Counter 7 0 TBLPAG Data Table Page Address 7 0 PSVPAG Program Space Visibility Page Address 15 0 RCOUNT REPEAT Loop Counter 15 0 DCOUNT DO Loop Counter 22 0 DOSTART DO Loop Start Address 22 DOEND DO Loop End Address 15 0 CORCON Core Configuration Register OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C STATUS Register SRH SRL 2009-2012 Microchip Technology Inc. DS70593D-page 29
dsPIC33FJXXXGPX06A/X08A/X10A 3.4 CPU Control Registers CPU control registers include: • SR: CPU Status Register • CORCON: Core Control Register REGISTER 3-1: SR: CPU STATUS REGISTER R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0 OA OB SA(1) SB(1) OAB SAB DA DC bit 15 bit 8 R/W-0(2) R/W-0(3) R/W-0(3) R-0 R/W-0 R/W-0 R/W-0 R/W-0 IPL<2:0>(2) RA N OV Z C bit 7 bit 0 Legend: C = Clear only bit R = Readable bit U = Unimplemented bit, read as ‘0’ S = Set only bit W = Writable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 OA: Accumulator A Overflow Status bit 1 = Accumulator A overflowed 0 = Accumulator A has not overflowed bit 14 OB: Accumulator B Overflow Status bit 1 = Accumulator B overflowed 0 = Accumulator B has not overflowed bit 13 SA: Accumulator A Saturation ‘Sticky’ Status bit(1) 1 = Accumulator A is saturated or has been saturated at some time 0 = Accumulator A is not saturated bit 12 SB: Accumulator B Saturation ‘Sticky’ Status bit(1) 1 = Accumulator B is saturated or has been saturated at some time 0 = Accumulator B is not saturated bit 11 OAB: OA || OB Combined Accumulator Overflow Status bit 1 = Accumulators A or B have overflowed 0 = Neither Accumulators A or B have overflowed bit 10 SAB: SA || SB Combined Accumulator ‘Sticky’ Status bit 1 = Accumulators A or B are saturated or have been saturated at some time in the past 0 = Neither Accumulator A or B are saturated Note: This bit may be read or cleared (not set). Clearing this bit will clear SA and SB. bit 9 DA: DO Loop Active bit 1 = DO loop in progress 0 = DO loop not in progress Note 1: This bit may be read or cleared (not set). 2: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3>=1. 3: The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>). DS70593D-page 30 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 3-1: SR: CPU STATUS REGISTER bit 8 DC: MCU ALU Half Carry/Borrow bit 1 = A carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized data) of the result occurred 0 = No carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized data) of the result occurred bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2) 111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled 110 = CPU Interrupt Priority Level is 6 (14) 101 = CPU Interrupt Priority Level is 5 (13) 100 = CPU Interrupt Priority Level is 4 (12) 011 = CPU Interrupt Priority Level is 3 (11) 010 = CPU Interrupt Priority Level is 2 (10) 001 = CPU Interrupt Priority Level is 1 (9) 000 = CPU Interrupt Priority Level is 0 (8) bit 4 RA: REPEAT Loop Active bit 1 = REPEAT loop in progress 0 = REPEAT loop not in progress bit 3 N: MCU ALU Negative bit 1 = Result was negative 0 = Result was non-negative (zero or positive) bit 2 OV: MCU ALU Overflow bit This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the magnitude which causes the sign bit to change state. 1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred bit 1 Z: MCU ALU Zero bit 1 = An operation which affects the Z bit has set it at some time in the past 0 = The most recent operation which affects the Z bit has cleared it (i.e., a non-zero result) bit 0 C: MCU ALU Carry/Borrow bit 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: This bit may be read or cleared (not set). 2: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3>=1. 3: The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>). 2009-2012 Microchip Technology Inc. DS70593D-page 31
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 3-2: CORCON: CORE CONTROL REGISTER U-0 U-0 U-0 R/W-0 R/W-0 R-0 R-0 R-0 — — — US EDT(1) DL<2:0> bit 15 bit 8 R/W-0 R/W-0 R/W-1 R/W-0 R/C-0 R/W-0 R/W-0 R/W-0 SATA SATB SATDW ACCSAT IPL3(2) PSV RND IF bit 7 bit 0 Legend: C = Clear only bit R = Readable bit W = Writable bit -n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared ‘x = Bit is unknown U = Unimplemented bit, read as ‘0’ bit 15-13 Unimplemented: Read as ‘0’ bit 12 US: DSP Multiply Unsigned/Signed Control bit 1 = DSP engine multiplies are unsigned 0 = DSP engine multiplies are signed bit 11 EDT: Early DO Loop Termination Control bit(1) 1 = Terminate executing DO loop at end of current loop iteration 0 = No effect bit 10-8 DL<2:0>: DO Loop Nesting Level Status bits 111 = 7 DO loops active • • • 001 = 1 DO loop active 000 = 0 DO loops active bit 7 SATA: AccA Saturation Enable bit 1 = Accumulator A saturation enabled 0 = Accumulator A saturation disabled bit 6 SATB: AccB Saturation Enable bit 1 = Accumulator B saturation enabled 0 = Accumulator B saturation disabled bit 5 SATDW: Data Space Write from DSP Engine Saturation Enable bit 1 = Data space write saturation enabled 0 = Data space write saturation disabled bit 4 ACCSAT: Accumulator Saturation Mode Select bit 1 = 9.31 saturation (super saturation) 0 = 1.31 saturation (normal saturation) bit 3 IPL3: CPU Interrupt Priority Level Status bit 3(2) 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less bit 2 PSV: Program Space Visibility in Data Space Enable bit 1 = Program space visible in data space 0 = Program space not visible in data space bit 1 RND: Rounding Mode Select bit 1 = Biased (conventional) rounding enabled 0 = Unbiased (convergent) rounding enabled bit 0 IF: Integer or Fractional Multiplier Mode Select bit 1 = Integer mode enabled for DSP multiply ops 0 = Fractional mode enabled for DSP multiply ops Note 1: This bit will always read as ‘0’. 2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level. DS70593D-page 32 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 3.5 Arithmetic Logic Unit (ALU) 3.6 DSP Engine The dsPIC33FJXXXGPX06A/X08A/X10A ALU is 16 The DSP engine consists of a high-speed, bits wide and is capable of addition, subtraction, bit 17-bitx17-bit multiplier, a barrel shifter and a 40-bit shifts and logic operations. Unless otherwise adder/subtracter (with two target accumulators, round mentioned, arithmetic operations are 2’s complement and saturation logic). in nature. Depending on the operation, the ALU may The dsPIC33FJXXXGPX06A/X08A/X10A is a sin- affect the values of the Carry (C), Zero (Z), Negative gle-cycle, instruction flow architecture; therefore, concur- (N), Overflow (OV) and Digit Carry (DC) Status bits in rent operation of the DSP engine with MCU instruction the SR register. The C and DC Status bits operate as flow is not possible. However, some MCU ALU and DSP Borrow and Digit Borrow bits, respectively, for engine resources may be used concurrently by the same subtraction operations. instruction (e.g., ED, EDAC). The ALU can perform 8-bit or 16-bit operations, The DSP engine also has the capability to perform depending on the mode of the instruction that is used. inherent accumulator-to-accumulator operations which Data for the ALU operation can come from the W require no additional data. These instructions are ADD, register array, or data memory, depending on the SUB and NEG. addressing mode of the instruction. Likewise, output data from the ALU can be written to the W register array The DSP engine has various options selected through or a data memory location. various bits in the CPU Core Control register (CORCON), as listed below: Refer to the “16-bit MCU and DSC Programmer’s Ref- erence Manual” (DS70157) for information on the SR • Fractional or integer DSP multiply (IF) bits affected by each instruction. • Signed or unsigned DSP multiply (US) The dsPIC33FJXXXGPX06A/X08A/X10A CPU • Conventional or convergent rounding (RND) incorporates hardware support for both multiplication • Automatic saturation on/off for AccA (SATA) and division. This includes a dedicated hardware • Automatic saturation on/off for AccB (SATB) multiplier and support hardware for 16-bit-divisor • Automatic saturation on/off for writes to data division. memory (SATDW) 3.5.1 MULTIPLIER • Accumulator Saturation mode selection (ACCSAT) Using the high-speed 17-bit x 17-bit multiplier of the DSP Table3-1 provides a summary of DSP instructions. A engine, the ALU supports unsigned, signed or mixed-sign block diagram of the DSP engine is shown in operation in several MCU multiplication modes: Figure3-3. • 16-bit x 16-bit signed • 16-bit x 16-bit unsigned TABLE 3-1: DSP INSTRUCTIONS • 16-bit signed x 5-bit (literal) unsigned SUMMARY • 16-bit unsigned x 16-bit unsigned Algebraic ACC Write • 16-bit unsigned x 5-bit (literal) unsigned Instruction Operation Back • 16-bit unsigned x 16-bit signed CLR A = 0 Yes • 8-bit unsigned x 8-bit unsigned ED A = (x – y)2 No 3.5.2 DIVIDER EDAC A = A + (x – y)2 No MAC A = A + (x•y) Yes The divide block supports 32-bit/16-bit and 16-bit/16-bit signed and unsigned integer divide operations with the MAC A = A + x2 No following data sizes: MOVSAC No change in A Yes • 32-bit signed/16-bit signed divide MPY A = x• y No • 32-bit unsigned/16-bit unsigned divide MPY A = x2 No • 16-bit signed/16-bit signed divide MPY.N A = – x•y No • 16-bit unsigned/16-bit unsigned divide MSC A = A – x•y Yes The quotient for all divide instructions ends up in W0 and the remainder in W1. 16-bit signed and unsigned DIV instructions can specify any W register for both the 16-bit divisor (Wn) and any W register (aligned) pair (W(m + 1):Wm) for the 32-bit dividend. The divide algorithm takes one cycle per bit of divisor, so both 32-bit/16-bit and 16-bit/16-bit instructions take the same number of cycles to execute. 2009-2012 Microchip Technology Inc. DS70593D-page 33
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 3-3: DSP ENGINE BLOCK DIAGRAM S a 40 40-bit Accumulator A 40 Round t 16 40-bit Accumulator B u Logic r Carry/Borrow Out a t Saturate e Adder Carry/Borrow In Negate 40 40 40 Barrel 16 Shifter 40 us B a at D Sign-Extend X s u B a 32 16 at Zero Backfill D Y 32 33 17-bit Multiplier/Scaler 16 16 To/From W Array DS70593D-page 34 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 3.6.1 MULTIPLIER 3.6.2.1 Adder/Subtracter, Overflow and Saturation The 17-bit x 17-bit multiplier is capable of signed or unsigned operation and can multiplex its output using a The adder/subtracter is a 40-bit adder with an optional scaler to support either 1.31 fractional (Q31) or 32-bit zero input into one side, and either true, or complement integer results. Unsigned operands are zero-extended data into the other input. In the case of addition, the into the 17th bit of the multiplier input value. Signed Carry/Borrow input is active-high and the other input is operands are sign-extended into the 17th bit of the true data (not complemented), whereas in the case of multiplier input value. The output of the 17-bit x 17-bit subtraction, the Carry/Borrow input is active-low and multiplier/scaler is a 33-bit value which is the other input is complemented. The adder/subtracter sign-extended to 40 bits. Integer data is inherently generates Overflow Status bits, SA/SB and OA/OB, represented as a signed two’s complement value, which are latched and reflected in the STATUS where the Most Significant bit (MSb) is defined as a register: sign bit. Generally speaking, the range of an N-bit two’s • Overflow from bit 39: this is a catastrophic complement integer is -2N-1 to 2N-1 - 1. For a 16-bit overflow in which the sign of the accumulator is integer, the data range is -32768 (0x8000) to 32767 destroyed. (0x7FFF) including 0. For a 32-bit integer, the data • Overflow into guard bits 32 through 39: this is a range is -2,147,483,648 (0x80000000) to recoverable overflow. This bit is set whenever all 2,147,483,647 (0x7FFF FFFF). the guard bits are not identical to each other. When the multiplier is configured for fractional The adder has an additional saturation block which multiplication, the data is represented as a two’s controls accumulator data saturation, if selected. It complement fraction, where the MSb is defined as a uses the result of the adder, the Overflow Status bits sign bit and the radix point is implied to lie just after the described above and the SAT<A:B> (CORCON<7:6>) sign bit (QX format). The range of an N-bit two’s and ACCSAT (CORCON<4>) mode control bits to complement fraction with this implied radix point is -1.0 to (1 - 21-N). For a 16-bit fraction, the Q15 data range is determine when and to what value to saturate. -1.0 (0x8000) to 0.999969482 (0x7FFF) including 0 Six STATUS register bits have been provided to and has a precision of 3.01518x10-5. In Fractional support saturation and overflow; they are: mode, the 16x 16 multiply operation generates a 1.31 • OA: AccA overflowed into guard bits product which has a precision of 4.65661 x 10-10. • OB: AccB overflowed into guard bits The same multiplier is used to support the MCU • SA: AccA saturated (bit 31 overflow and satura- multiply instructions which include integer 16-bit tion) signed, unsigned and mixed sign multiplies. or The MUL instruction may be directed to use byte or AccA overflowed into guard bits and saturated (bit word sized operands. Byte operands will direct a 16-bit 39 overflow and saturation) result, and word operands will direct a 32-bit result to • SB: AccB saturated (bit 31 overflow and satura- the specified register(s) in the W array. tion) or 3.6.2 DATA ACCUMULATORS AND AccB overflowed into guard bits and saturated (bit ADDER/SUBTRACTER 39 overflow and saturation) The data accumulator consists of a 40-bit adder/ • OAB: Logical OR of OA and OB subtracter with automatic sign extension logic. It can • SAB: Logical OR of SA and SB select one of two accumulators (A or B) as its The OA and OB bits are modified each time data pre-accumulation source and post-accumulation passes through the adder/subtracter. When set, they destination. For the ADD and LAC instructions, the data indicate that the most recent operation has overflowed to be accumulated or loaded can be optionally scaled into the accumulator guard bits (bits 32 through 39). via the barrel shifter prior to accumulation. The OA and OB bits can also optionally generate an arithmetic warning trap when set and the corresponding Overflow Trap Flag Enable bits (OVATE, OVBTE) in the INTCON1 register (refer to Section7.0 “Interrupt Controller”) are set. This allows the user to take immediate action, for example, to correct system gain. 2009-2012 Microchip Technology Inc. DS70593D-page 35
dsPIC33FJXXXGPX06A/X08A/X10A The SA and SB bits are modified each time data 3.6.2.2 Accumulator ‘Write Back’ passes through the adder/subtracter, but can only be The MAC class of instructions (with the exception of cleared by the user. When set, they indicate that the MPY, MPY.N, ED and EDAC) can optionally write a accumulator has overflowed its maximum range (bit 31 rounded version of the high word (bits 31 through 16) for 32-bit saturation or bit 39 for 40-bit saturation) and of the accumulator that is not targeted by the instruction will be saturated (if saturation is enabled). When into data space memory. The write is performed across saturation is not enabled, SA and SB default to bit 39 the X bus into combined X and Y address space. The overflow and, thus, indicate that a catastrophic following addressing modes are supported: overflow has occurred. If the COVTE bit in the INTCON1 register is set, SA and SB bits will generate • W13, Register Direct: an arithmetic warning trap when saturation is disabled. The rounded contents of the non-target accumulator are written into W13 as a The Overflow and Saturation Status bits can optionally 1.15fraction. be viewed in the STATUS Register (SR) as the logical • [W13]+ = 2, Register Indirect with Post-Increment: OR of OA and OB (in bit OAB) and the logical OR of SA The rounded contents of the non-target and SB (in bit SAB). This allows programmers to check accumulator are written into the address pointed one bit in the STATUS register to determine if either to by W13 as a 1.15 fraction. W13 is then accumulator has overflowed, or one bit to determine if incremented by 2 (for a word write). either accumulator has saturated. This would be useful for complex number arithmetic which typically uses 3.6.2.3 Round Logic both the accumulators. The round logic is a combinational block which The device supports three Saturation and Overflow performs a conventional (biased) or convergent modes: (unbiased) round function during an accumulator write • Bit 39 Overflow and Saturation: (store). The Round mode is determined by the state of When bit 39 overflow and saturation occurs, the the RND bit in the CORCON register. It generates a saturation logic loads the maximally positive 9.31 16-bit, 1.15 data value which is passed to the data (0x7FFFFFFFFF), or maximally negative 9.31 space write saturation logic. If rounding is not indicated value (0x8000000000), into the target accumulator. by the instruction, a truncated 1.15 data value is stored The SA or SB bit is set and remains set until and the least significant word is simply discarded. cleared by the user. This is referred to as ‘super Conventional rounding zero-extends bit 15 of the saturation’ and provides protection against errone- accumulator and adds it to the ACCxH word (bits 16 ous data or unexpected algorithm problems (e.g., through 31 of the accumulator). If the ACCxL word gain calculations). (bits0 through 15 of the accumulator) is between • Bit 31 Overflow and Saturation: 0x8000 and 0xFFFF (0x8000 included), ACCxH is When bit 31 overflow and saturation occurs, the incremented. If ACCxL is between 0x0000 and 0x7FFF, saturation logic then loads the maximally positive ACCxH is left unchanged. A consequence of this 1.31 value (0x007FFFFFFF), or maximally nega- algorithm is that over a succession of random rounding tive 1.31 value (0x0080000000), into the target operations, the value tends to be biased slightly accumulator. The SA or SB bit is set and remains positive. set until cleared by the user. When this Saturation Convergent (or unbiased) rounding operates in the mode is in effect, the guard bits are not used (so same manner as conventional rounding, except when the OA, OB or OAB bits are never set). ACCxL equals 0x8000. In this case, the Least • Bit 39 Catastrophic Overflow: Significant bit (bit16 of the accumulator) of ACCxH is The bit 39 Overflow Status bit from the adder is examined. If it is ‘1’, ACCxH is incremented. If it is ‘0’, used to set the SA or SB bit, which remains set ACCxH is not modified. Assuming that bit 16 is until cleared by the user. No saturation operation effectively random in nature, this scheme removes any is performed and the accumulator is allowed to rounding bias that may accumulate. overflow (destroying its sign). If the COVTE bit in the INTCON1 register is set, a catastrophic over- The SAC and SAC.R instructions store either a flow can initiate a trap exception. truncated (SAC), or rounded (SAC.R) version of the contents of the target accumulator to data memory via the X bus, subject to data saturation (see Section3.6.2.4 “Data Space Write Saturation”). For the MAC class of instructions, the accumulator write-back operation will function in the same manner, addressing combined MCU (X and Y) data space though the X bus. For this class of instructions, the data is always subject to rounding. DS70593D-page 36 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 3.6.2.4 Data Space Write Saturation 3.6.3 BARREL SHIFTER In addition to adder/subtracter saturation, writes to data The barrel shifter is capable of performing up to 16-bit space can also be saturated but without affecting the arithmetic or logic right shifts, or up to 16-bit left shifts contents of the source accumulator. The data space in a single cycle. The source can be either of the two write saturation logic block accepts a 16-bit, 1.15 DSP accumulators or the X bus (to support multi-bit fractional value from the round logic block as its input, shifts of register or memory data). together with overflow status from the original source The shifter requires a signed binary value to determine (accumulator) and the 16-bit round adder. These inputs both the magnitude (number of bits) and direction of the are combined and used to select the appropriate 1.15 shift operation. A positive value shifts the operand right. fractional value as output to write to data space A negative value shifts the operand left. A value of ‘0’ memory. does not modify the operand. If the SATDW bit in the CORCON register is set, data The barrel shifter is 40 bits wide, thereby obtaining a (after rounding or truncation) is tested for overflow and 40-bit result for DSP shift operations and a 16-bit result adjusted accordingly, For input data greater than for MCU shift operations. Data from the X bus is 0x007FFF, data written to memory is forced to the presented to the barrel shifter between bit positions 16 maximum positive 1.15 value, 0x7FFF. For input data to 31 for right shifts, and between bit positions 0 to 16 less than 0xFF8000, data written to memory is forced for left shifts. to the maximum negative 1.15 value, 0x8000. The Most Significant bit of the source (bit 39) is used to determine the sign of the operand being tested. If the SATDW bit in the CORCON register is not set, the input data is always passed through unmodified under all conditions. 2009-2012 Microchip Technology Inc. DS70593D-page 37
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 38 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 4.0 MEMORY ORGANIZATION 4.1 Program Address Space The program address memory space of the Note: This data sheet summarizes the features dsPIC33FJXXXGPX06A/X08A/X10A devices is 4M of the dsPIC33FJXXXGPX06A/X08A/ instructions. The space is addressable by a 24-bit X10A family of devices. However, it is not value derived from either the 23-bit Program Counter intended to be a comprehensive refer- (PC) during program execution, or from table operation ence source. To complement the informa- or data space remapping as described in Section4.6 tion in this data sheet, refer to Section 3. “Interfacing Program and Data Memory Spaces”. “Data Memory” (DS70202) and Section 4. “Program Memory” (DS70203) in the User access to the program memory space is restricted “dsPIC33F/PIC24H Family Reference to the lower half of the address range (0x000000 to Manual”, which are available from the 0x7FFFFF). The exception is the use of TBLRD/TBLWT Microchip web site (www.microchip.com). operations, which use TBLPAG<7> to permit access to the Configuration bits and Device ID sections of the The dsPIC33FJXXXGPX06A/X08A/X10A architecture configuration memory space. Memory usage for the features separate program and data memory spaces dsPIC33FJXXXGPX06A/X08A/X10A of devices is and buses. This architecture also allows the direct shown in Figure4-1. access of program memory from the data space during code execution. FIGURE 4-1: PROGRAM MEMORY FOR dsPIC33FJXXXGPX06A/X08A/X10A DEVICES dsPIC33FJ64GPXXXA dsPIC33FJ128GPXXXA dsPIC33FJ256GPXXXA GOTO Instruction GOTO Instruction GOTO Instruction 0x000000 Reset Address Reset Address Reset Address 0x000002 0x000004 Interrupt Vector Table Interrupt Vector Table Interrupt Vector Table 0x0000FE Reserved Reserved Reserved 0x000100 0x000104 Alternate Vector Table Alternate Vector Table Alternate Vector Table 0x0001FE 0x000200 User Program Flash Memory e Spac (22K instructions) FUlsaesrh PMroegmraomry FUlsaesrh PMroegmraomry 00xx0000AACBF00E y (44K instructions) (88K instructions) or m e 0x0157FE M 0x015800 er Us Unimplemented (Read ‘0’s) Unimplemented (Read ‘0’s) 0x02ABFE 0x02AC00 Unimplemented (Read ‘0’s) 0x7FFFFE 0x800000 Reserved Reserved Reserved e c a p S y 0xF7FFFE or Device Configuration Device Configuration Device Configuration 0xF80000 m e Registers Registers Registers 0xF80017 M 0xF80010 n o ati ur Reserved Reserved Reserved g nfi o C 0xFEFFFE 0xFF0000 DEVID (2) DEVID (2) DEVID (2) 0xFFFFFE Note: Memory areas are not shown to scale. 2009-2012 Microchip Technology Inc. DS70593D-page 39
dsPIC33FJXXXGPX06A/X08A/X10A 4.1.1 PROGRAM MEMORY 4.1.2 INTERRUPT AND TRAP VECTORS ORGANIZATION All dsPIC33FJXXXGPX06A/X08A/X10A devices The program memory space is organized in reserve the addresses between 0x00000 and word-addressable blocks. Although it is treated as 0x000200 for hard-coded program execution vectors. 24bits wide, it is more appropriate to think of each A hardware Reset vector is provided to redirect code address of the program memory as a lower and upper execution from the default value of the PC on device word, with the upper byte of the upper word being Reset to the actual start of code. A GOTO instruction is unimplemented. The lower word always has an even programmed by the user at 0x000000, with the actual address, while the upper word has an odd address address for the start of code at 0x000002. (Figure4-2). dsPIC33FJXXXGPX06A/X08A/X10A devices also Program memory addresses are always word-aligned have two interrupt vector tables, located from on the lower word, and addresses are incremented or 0x000004 to 0x0000FF and 0x000100 to 0x0001FF. decremented by two during code execution. This These vector tables allow each of the many device arrangement also provides compatibility with data interrupt sources to be handled by separate Interrupt memory space addressing and makes it possible to Service Routines (ISRs). A more detailed discussion of access data in the program memory space. the interrupt vector tables is provided in Section7.1 “Interrupt Vector Table”. FIGURE 4-2: PROGRAM MEMORY ORGANIZATION msw most significant word least significant word PC Address Address (lsw Address) 23 16 8 0 0x000001 00000000 0x000000 0x000003 00000000 0x000002 0x000005 00000000 0x000004 0x000007 00000000 0x000006 Program Memory Instruction Width ‘Phantom’ Byte (read as ‘0’) DS70593D-page 40 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 4.2 Data Address Space All word accesses must be aligned to an even address. Misaligned word data fetches are not supported, so The dsPIC33FJXXXGPX06A/X08A/X10A CPU has a care must be taken when mixing byte and word separate 16-bit wide data memory space. The data operations, or translating from 8-bit MCU code. If a space is accessed using separate Address Generation misaligned read or write is attempted, an address error Units (AGUs) for read and write operations. Data trap is generated. If the error occurred on a read, the memory maps of devices with different RAM sizes are instruction underway is completed; if it occurred on a shown in Figure4-3 through Figure4-5. write, the instruction will be executed but the write does All Effective Addresses (EAs) in the data memory space not occur. In either case, a trap is then executed, are 16 bits wide and point to bytes within the data space. allowing the system and/or user to examine the This arrangement gives a data space address range of machine state prior to execution of the address Fault. 64Kbytes or 32Kwords. The lower half of the data All byte loads into any W register are loaded into the memory space (that is, when EA<15> = 0) is used for Least Significant Byte. The Most Significant Byte is not implemented memory addresses, while the upper half modified. (EA<15> = 1) is reserved for the Program Space A sign-extend instruction (SE) is provided to allow Visibility area (see Section4.6.3 “Reading Data from users to translate 8-bit signed data to 16-bit signed Program Memory Using Program Space Visibility”). values. Alternatively, for 16-bit unsigned data, users dsPIC33FJXXXGPX06A/X08A/X10A devices imple- can clear the MSb of any W register by executing a ment a total of up to 30Kbytes of data memory. Should zero-extend (ZE) instruction on the appropriate an EA point to a location outside of this area, an all-zero address. word or byte will be returned. 4.2.3 SFR SPACE 4.2.1 DATA SPACE WIDTH The first 2Kbytes of the Near Data Space, from 0x0000 The data memory space is organized in byte to 0x07FF, is primarily occupied by Special Function addressable, 16-bit wide blocks. Data is aligned in data Registers (SFRs). These are used by the memory and registers as 16-bit words, but all data dsPIC33FJXXXGPX06A/X08A/X10A core and periph- space EAs resolve to bytes. The Least Significant eral modules for controlling the operation of the device. Bytes (LSBs) of each word have even addresses, while SFRs are distributed among the modules that they the Most Significant Bytes (MSBs) have odd control, and are generally grouped together by module. addresses. Much of the SFR space contains unused addresses; 4.2.2 DATA MEMORY ORGANIZATION these are read as ‘0’. A complete listing of implemented AND ALIGNMENT SFRs, including their addresses, is shown in Table4-1 through Table4-34. To maintain backward compatibility with PIC® MCU devices and improve data space memory usage Note: The actual set of peripheral features and efficiency, the dsPIC33FJXXXGPX06A/X08A/X10A interrupts varies by the device. Please instruction set supports both word and byte operations. refer to the corresponding device tables As a consequence of byte accessibility, all effective and pinout diagrams for device-specific address calculations are internally scaled to step information. through word-aligned memory. For example, the core recognizes that Post-Modified Register Indirect 4.2.4 NEAR DATA SPACE Addressing mode [Ws++] will result in a value of Ws +1 The 8-Kbyte area between 0x0000 and 0x1FFF is for byte operations and Ws + 2 for word operations. referred to as the Near Data Space. Locations in this Data byte reads will read the complete word that space are directly addressable via a 13-bit absolute contains the byte, using the LSb of any EA to determine address field within all memory direct instructions. which byte to select. The selected byte is placed onto Additionally, the whole data space is addressable using the LSb of the data path. That is, data memory and MOV instructions, which support Memory Direct registers are organized as two parallel byte-wide Addressing mode with a 16-bit address field, or by entities with shared (word) address decode but using Indirect Addressing mode using a working separate write lines. Data byte writes only write to the register as an Address Pointer. corresponding side of the array or register which matches the byte address. 2009-2012 Microchip Technology Inc. DS70593D-page 41
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 4-3: DATA MEMORY MAP FOR dsPIC33FJXXXGPX06A/X08A/X10A DEVICES WITH 8 KBS RAM MSB LSB Address 16 bits Address MSB LSB 0x0001 0x0000 2 Kbyte SFR Space SFR Space 0x07FF 0x07FE 0x0801 0x0800 8 Kbyte X Data RAM (X) Near Data Space 8 Kbyte 0x17FF 0x17FE SRAM Space 0x1801 0x1800 Y Data RAM (Y) 0x1FFF 0x1FFE 0x2001 0x2000 DMA RAM 0x27FF 0x27FE 0x2801 0x2800 0x8001 0x8000 X Data Optionally Unimplemented (X) Mapped into Program Memory 0xFFFF 0xFFFE DS70593D-page 42 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 4-4: DATA MEMORY MAP FOR dsPIC33FJXXXGPX06A/X08A/X10A DEVICES WITH 16 KBS RAM LSB MSB Address Address 16 bits MSB LSB 0x0001 0x0000 2 Kbyte SFR Space SFR Space 0x07FF 0x07FE 8 Kbyte 0x0801 0x0800 Near Data Space X Data RAM (X) 0x1FFF 0x1FFE 16 Kbyte 0x27FF 0x27FE SRAM Space 0x2801 0x2800 Y Data RAM (Y) 0x3FFF 0x3FFE 0x4001 0x4000 DMA RAM 0x47FF 0x47FE 0x4801 0x4800 0x8001 0x8000 X Data Unimplemented (X) Optionally Mapped into Program Memory 0xFFFF 0xFFFE 2009-2012 Microchip Technology Inc. DS70593D-page 43
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 4-5: DATA MEMORY MAP FOR dsPIC33FJXXXGPX06A/X08A/X10A DEVICES WITH 30 KBS RAM MSB LSB Address 16 bits Address MSB LSB 0x0001 0x0000 2 Kbyte SFR Space SFR Space 0x07FF 0x07FE 8 Kbyte 0x0801 0x0800 Near Data Space X Data RAM (X) 30 Kbyte SRAM Space 0x47FF 0x47FE 0x4801 0x4800 Y Data RAM (Y) 0x77FF 0x77FE 0x7800 0x7800 DMA RAM 0x7FFF 0x7FFE 0x8001 0x8000 Optionally X Data Mapped Unimplemented (X) into Program Memory 0xFFFF 0xFFFE DS70593D-page 44 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 4.2.5 X AND Y DATA SPACES 4.2.6 DMA RAM The core has two data spaces, X and Y. These data Every dsPIC33FJXXXGPX06A/X08A/X10A device spaces can beconsidered either separate (for some contains 2 Kbytes of dual ported DMA RAM located at DSP instructions), or as one unified linear address the end of Y data space. Memory locations is part of Y range (for MCU instructions). The data spaces are data RAM and is in the DMA RAM space are accessible accessed using two Address Generation Units (AGUs) simultaneously by the CPU and the DMA controller and separate data paths. This feature allows certain module. DMA RAM is utilized by the DMA controller to instructions to concurrently fetch two words from RAM, store data to be transferred to various peripherals using thereby enabling efficient execution of DSP algorithms DMA, as well as data transferred from various such as Finite Impulse Response (FIR) filtering and peripherals using DMA. The DMA RAM can be Fast Fourier Transform (FFT). accessed by the DMA controller without having to steal cycles from the CPU. The X data space is used by all instructions and supports all addressing modes. There are separate When the CPU and the DMA controller attempt to read and write data buses for X data space. The X read concurrently write to the same DMA RAM location, the data bus is the read data path for all instructions that hardware ensures that the CPU is given precedence in view data space as combined X and Y address space. accessing the DMA RAM location. Therefore, the DMA It is also the X data prefetch path for the dual operand RAM provides a reliable means of transferring DMA DSP instructions (MAC class). data without ever having to stall the CPU. The Y data space is used in concert with the X data Note: DMA RAM can be used for general space by the MAC class of instructions (CLR, ED, purpose data storage if the DMA function EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide is not required in an application. two concurrent data read paths. Both the X and Y data spaces support Modulo Addressing mode for all instructions, subject to addressing mode restrictions. Bit-Reversed Addressing mode is only supported for writes to X data space. All data memory writes, including in DSP instructions, view data space as combined X and Y address space. The boundary between the X and Y data spaces is device-dependent and is not user-programmable. All effective addresses are 16 bits wide and point to bytes within the data space. Therefore, the data space address range is 64 Kbytes, or 32K words, though the implemented memory locations vary by device. 2009-2012 Microchip Technology Inc. DS70593D-page 45
D TABLE 4-1: CPU CORE REGISTERS MAP d S 705 SFR Name SFR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All s 9 Addr Resets P 3 D -p WREG0 0000 Working Register 0 xxxx I ag WREG1 0002 Working Register 1 xxxx C e 4 WREG2 0004 Working Register 2 xxxx 3 6 WREG3 0006 Working Register 3 xxxx 3 WREG4 0008 Working Register 4 xxxx F WREG5 000A Working Register 5 xxxx WREG6 000C Working Register 6 xxxx J WREG7 000E Working Register 7 xxxx X WREG8 0010 Working Register 8 xxxx X WREG9 0012 Working Register 9 xxxx WREG10 0014 Working Register 10 xxxx X WREG11 0016 Working Register 11 xxxx G WREG12 0018 Working Register 12 xxxx WREG13 001A Working Register 13 xxxx P WREG14 001C Working Register 14 xxxx X WREG15 001E Working Register 15 0800 0 SPLIM 0020 Stack Pointer Limit Register xxxx ACCAL 0022 Accumulator A Low Word Register 0000 6 ACCAH 0024 Accumulator A High Word Register 0000 A ACCAU 0026 Accumulator A Upper Word Register 0000 / ACCBL 0028 Accumulator B Low Word Register 0000 X ACCBH 002A Accumulator B High Word Register 0000 0 ACCBU 002C Accumulator B Upper Word Register 0000 8 PCL 002E Program Counter Low Word Register 0000 PCH 0030 — — — — — — — — Program Counter High Byte Register 0000 A TBLPAG 0032 — — — — — — — — Table Page Address Pointer Register 0000 / PSVPAG 0034 — — — — — — — — Program Memory Visibility Page Address Pointer Register 0000 X RCOUNT 0036 Repeat Loop Counter Register xxxx 1 20 DCOUNT 0038 DCOUNT<15:0> xxxx 0 0 DOSTARTL 003A DOSTARTL<15:1> 0 xxxx 9-2 DOSTARTH 003C — — — — — — — — — — DOSTARTH<5:0> 00xx A 0 1 DOENDL 003E DOENDL<15:1> 0 xxxx 2 M DOENDH 0040 — — — — — — — — — — DOENDH 00xx icro SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 ch CORCON 0044 — — — US EDT DL<2:0> SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0020 ip T MODCON 0046 XMODEN YMODEN — — BWM<3:0> YWM<3:0> XWM<3:0> 0000 e XMODSRT 0048 XS<15:1> 0 xxxx c hn XMODEND 004A XE<15:1> 1 xxxx o lo YMODSRT 004C YS<15:1> 0 xxxx g y YMODEND 004E YE<15:1> 1 xxxx Inc Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. .
TABLE 4-1: CPU CORE REGISTERS MAP (CONTINUED) 2 0 SFR All 0 SFR Name Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 9 Addr Resets -2 01 XBREV 0050 BREN XB<14:0> xxxx 2 M DISICNT 0052 — — Disable Interrupts Counter Register xxxx ic BSRAM 0750 — — — — — — — — — — — — — IW_BSR IR_BSR RL_BSR 0000 roc SSRAM 0752 — — — — — — — — — — — — — IW_SSR IR_SSR RL_SSR 0000 h ip Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. T e c h n d o log s y In P c . I C 3 3 F J X X X G P X 0 6 A / X 0 8 A D S 7 / 0 X 5 9 3D 1 -pa 0 g e A 4 7
D TABLE 4-2: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJXXXGPX10A DEVICES d S 70593 NSaFmRe ASdFdRr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ReAslel ts sP D -p CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 I a C ge CNEN2 0062 — — — — — — — — CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000 48 CNPU1 0068 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 3 CNPU2 006A — — — — — — — — CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 3 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. F J X TABLE 4-3: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJXXXGPX08A DEVICES X NSaFmRe ASdFdRr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ReAslel ts X G CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 CNEN2 0062 — — — — — — — — — — CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000 P CNPU1 0068 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 X CNPU2 006A — — — — — — — — — — CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 0 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. 6 A TABLE 4-4: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJXXXGPX06A DEVICES / X SFR SFR All Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets 0 8 CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 A CNEN2 0062 — — — — — — — — — — CN21IE CN20IE — CN18IE CN17IE CN16IE 0000 CNPU1 0068 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 /X CNPU2 006A — — — — — — — — — — CN21PUE CN20PUE — CN18PUE CN17PUE CN16PUE 0000 1 20 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. 0 0 9-2 A 0 1 2 M ic ro c h ip T e c h n o lo g y In c .
TABLE 4-5: INTERRUPT CONTROLLER REGISTER MAP 2 0 0 SFR SFR All 9 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 -2 Name Addr Resets 0 1 2 INTCON1 0080 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE SFTACERR DIV0ERR DMACERR MATHERR ADDRERR STKERR OSCFAIL — 0000 M ic INTCON2 0082 ALTIVT DISI — — — — — — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000 roc IFS0 0084 — DMA1IF AD1IF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF T2IF OC2IF IC2IF DMA0IF T1IF OC1IF IC1IF INT0IF 0000 h ip IFS1 0086 U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF DMA2IF IC8IF IC7IF AD2IF INT1IF CNIF — MI2C1IF SI2C1IF 0000 T e IFS2 0088 T6IF DMA4IF — OC8IF OC7IF OC6IF OC5IF IC6IF IC5IF IC4IF IC3IF DMA3IF C1IF C1RXIF SPI2IF SPI2EIF 0000 c hn IFS3 008A — — DMA5IF DCIIF DCIEIF — — C2IF C2RXIF INT4IF INT3IF T9IF T8IF MI2C2IF SI2C2IF T7IF 0000 d o log IFS4 008C — — — — — — — — C2TXIF C1TXIF DMA7IF DMA6IF — U2EIF U1EIF — 0000 s y In IEC0 0094 — DMA1IE AD1IE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE T2IE OC2IE IC2IE DMA0IE T1IE OC1IE IC1IE INT0IE 0000 P c. IEC1 0096 U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE DMA2IE IC8IE IC7IE AD2IE INT1IE CNIE — MI2C1IE SI2C1IE 0000 I IEC2 0098 T6IE DMA4IE — OC8IE OC7IE OC6IE OC5IE IC6IE IC5IE IC4IE IC3IE DMA3IE C1IE C1RXIE SPI2IE SPI2EIE 0000 C IEC3 009A — — DMA5IE DCIIE DCIEIE — — C2IE C2RXIE INT4IE INT3IE T9IE T8IE MI2C2IE SI2C2IE T7IE 0000 3 IEC4 009C — — — — — — — — C2TXIE C1TXIE DMA7IE DMA6IE — U2EIE U1EIE — 0000 3 IPC0 00A4 — T1IP<2:0> — OC1IP<2:0> — IC1IP<2:0> — INT0IP<2:0> 4444 F IPC1 00A6 — T2IP<2:0> — OC2IP<2:0> — IC2IP<2:0> — DMA0IP<2:0> 4444 J IPC2 00A8 — U1RXIP<2:0> — SPI1IP<2:0> — SPI1EIP<2:0> — T3IP<2:0> 4444 X IPC3 00AA — — — — — DMA1IP<2:0> — AD1IP<2:0> — U1TXIP<2:0> 0444 X IPC4 00AC — CNIP<2:0> — — — — — MI2C1IP<2:0> — SI2C1IP<2:0> 4044 IPC5 00AE — IC8IP<2:0> — IC7IP<2:0> — AD2IP<2:0> — INT1IP<2:0> 4444 X IPC6 00B0 — T4IP<2:0> — OC4IP<2:0> — OC3IP<2:0> — DMA2IP<2:0> 4444 G IPC7 00B2 — U2TXIP<2:0> — U2RXIP<2:0> — INT2IP<2:0> — T5IP<2:0> 4444 P IPC8 00B4 — C1IP<2:0> — C1RXIP<2:0> — SPI2IP<2:0> — SPI2EIP<2:0> 4444 IPC9 00B6 — IC5IP<2:0> — IC4IP<2:0> — IC3IP<2:0> — DMA3IP<2:0> 4444 X IPC10 00B8 — OC7IP<2:0> — OC6IP<2:0> — OC5IP<2:0> — IC6IP<2:0> 4444 0 IPC11 00BA — T6IP<2:0> — DMA4IP<2:0> — — — — — OC8IP<2:0> 4404 6 IPC12 00BC — T8IP<2:0> — MI2C2IP<2:0> — SI2C2IP<2:0> — T7IP<2:0> 4444 A IPC13 00BE — C2RXIP<2:0> — INT4IP<2:0> — INT3IP<2:0> — T9IP<2:0> 4444 / IPC14 00C0 — DCIEIP<2:0> — — — — — — — — — C2IP<2:0> 4004 X IPC15 00C2 — — — — — — — — — DMA5IP<2:0> — DCIIP<2:0> 0044 0 IPC16 00C4 — — — — — U2EIP<2:0> — U1EIP<2:0> — — — — 0440 8 IPC17 00C6 — C2TXIP<2:0> — C1TXIP<2:0> — DMA7IP<2:0> — DMA6IP<2:0> 4444 A D S INTTREG 00E0 — — — — ILR<3:0> — VECNUM<6:0> 0000 7 / 05 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. X 9 3D 1 -pa 0 g e A 4 9
D TABLE 4-6: TIMER REGISTER MAP d S 70 SFR SFR All s 59 Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets P 3 D -p TMR1 0100 Timer1 Register 0000 I a C g PR1 0102 Period Register 1 FFFF e 5 T1CON 0104 TON — TSIDL — — — — — — TGATE TCKPS<1:0> — TSYNC TCS — 0000 3 0 TMR2 0106 Timer2 Register 0000 3 TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only) xxxx F TMR3 010A Timer3 Register 0000 J PR2 010C Period Register 2 FFFF X PR3 010E Period Register 3 FFFF X T2CON 0110 TON — TSIDL — — — — — — TGATE TCKPS<1:0> T32 — TCS — 0000 X T3CON 0112 TON — TSIDL — — — — — — TGATE TCKPS<1:0> — — TCS — 0000 TMR4 0114 Timer4 Register 0000 G TMR5HLD 0116 Timer5 Holding Register (for 32-bit operations only) xxxx P TMR5 0118 Timer5 Register 0000 X PR4 011A Period Register 4 FFFF 0 PR5 011C Period Register 5 FFFF 6 T4CON 011E TON — TSIDL — — — — — — TGATE TCKPS<1:0> T32 — TCS — 0000 T5CON 0120 TON — TSIDL — — — — — — TGATE TCKPS<1:0> — — TCS — 0000 A TMR6 0122 Timer6 Register 0000 / X TMR7HLD 0124 Timer7 Holding Register (for 32-bit operations only) xxxx TMR7 0126 Timer7 Register 0000 0 PR6 0128 Period Register 6 FFFF 8 PR7 012A Period Register 7 FFFF A T6CON 012C TON — TSIDL — — — — — — TGATE TCKPS<1:0> T32 — TCS — 0000 / X T7CON 012E TON — TSIDL — — — — — — TGATE TCKPS<1:0> — — TCS — 0000 TMR8 0130 Timer8 Register 0000 1 20 TMR9HLD 0132 Timer9 Holding Register (for 32-bit operations only) xxxx 0 0 9-2 TMR9 0134 Timer9 Register 0000 A 0 1 PR8 0136 Period Register 8 FFFF 2 M PR9 0138 Period Register 9 FFFF ic ro T8CON 013A TON — TSIDL — — — — — — TGATE TCKPS<1:0> T32 — TCS — 0000 c h T9CON 013C TON — TSIDL — — — — — — TGATE TCKPS<1:0> — — TCS — 0000 ip T Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. e c h n o lo g y In c .
TABLE 4-7: INPUT CAPTURE REGISTER MAP 2 0 0 SFR All 9 SFR Name Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 -2 Addr Resets 0 1 2 IC1BUF 0140 Input 1 Capture Register xxxx M ic IC1CON 0142 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 roc IC2BUF 0144 Input 2 Capture Register xxxx h ip IC2CON 0146 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 T e IC3BUF 0148 Input 3 Capture Register xxxx c hn IC3CON 014A — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 d o log IC4BUF 014C Input 4 Capture Register xxxx s y In IC4CON 014E — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 P c. IC5BUF 0150 Input 5 Capture Register xxxx I IC5CON 0152 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 C IC6BUF 0154 Input 6 Capture Register xxxx 3 IC6CON 0156 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 3 IC7BUF 0158 Input 7 Capture Register xxxx F IC7CON 015A — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 J IC8BUF 015C Input 8 Capture Register xxxx X IC8CON 015E — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 X Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. X G P X 0 6 A / X 0 8 A D S 7 / 0 X 5 9 3D 1 -pa 0 g e A 5 1
D d S TABLE 4-8: OUTPUT COMPARE REGISTER MAP 70 s 5 SFR All 93 SFR Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets P D -pa OC1RS 0180 Output Compare 1 Secondary Register xxxx IC g e OC1R 0182 Output Compare 1 Register xxxx 5 3 2 OC1CON 0184 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 3 OC2RS 0186 Output Compare 2 Secondary Register xxxx F OC2R 0188 Output Compare 2 Register xxxx J OC2CON 018A — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 X OC3RS 018C Output Compare 3 Secondary Register xxxx OC3R 018E Output Compare 3 Register xxxx X OC3CON 0190 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 X OC4RS 0192 Output Compare 4 Secondary Register xxxx G OC4R 0194 Output Compare 4 Register xxxx OC4CON 0196 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 P OC5RS 0198 Output Compare 5 Secondary Register xxxx X OC5R 019A Output Compare 5 Register xxxx 0 OC5CON 019C — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 6 OC6RS 019E Output Compare 6 Secondary Register xxxx A OC6R 01A0 Output Compare 6 Register xxxx / OC6CON 01A2 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 X OC7RS 01A4 Output Compare 7 Secondary Register xxxx 0 OC7R 01A6 Output Compare 7 Register xxxx 8 OC7CON 01A8 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 A OC8RS 01AA Output Compare 8 Secondary Register xxxx / OC8R 01AC Output Compare 8 Register xxxx X OC8CON 01AE — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 1 20 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. 0 0 9-2 A 0 1 2 M ic ro c h ip T e c h n o lo g y In c .
TABLE 4-9: I2C1 REGISTER MAP 2 009 SFR Name ASdFdRr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ReAslel ts -2 01 I2C1RCV 0200 — — — — — — — — Receive Register 0000 2 M I2C1TRN 0202 — — — — — — — — Transmit Register 00FF icro I2C1BRG 0204 — — — — — — — Baud Rate Generator Register 0000 ch I2C1CON 0206 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000 ip T I2C1STAT 0208 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 e c I2C1ADD 020A — — — — — — Address Register 0000 h n d o I2C1MSK 020C — — — — — — Address Mask Register 0000 log Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. s y In P c . TABLE 4-10: I2C2 REGISTER MAP I C SFR All SFR Name Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Addr Resets 3 I2C2RCV 0210 — — — — — — — — Receive Register 0000 3 I2C2TRN 0212 — — — — — — — — Transmit Register 00FF F I2C2BRG 0214 — — — — — — — Baud Rate Generator Register 0000 J I2C2CON 0216 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000 X I2C2STAT 0218 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 X I2C2ADD 021A — — — — — — Address Register 0000 X I2C2MSK 021C — — — — — — Address Mask Register 0000 G Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. P X 0 6 A / X 0 8 A D S 7 / 0 X 5 9 3D 1 -pa 0 g e A 5 3
D d S TABLE 4-11: UART1 REGISTER MAP 70 s 5 SFR All 93 SFR Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets P D -p U1MODE 0220 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD URXINV BRGH PDSEL<1:0> STSEL 0000 I a C ge U1STA 0222 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA 0110 5 3 4 U1TXREG 0224 — — — — — — — UART Transmit Register xxxx U1RXREG 0226 — — — — — — — UART Receive Register 0000 3 U1BRG 0228 Baud Rate Generator Prescaler 0000 F Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. J X TABLE 4-12: UART2 REGISTER MAP X SFR SFR All Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 X Name Addr Resets G U2MODE 0230 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD URXINV BRGH PDSEL<1:0> STSEL 0000 U2STA 0232 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA 0110 P U2TXREG 0234 — — — — — — — UART Transmit Register xxxx X U2RXREG 0236 — — — — — — — UART Receive Register 0000 0 U2BRG 0238 Baud Rate Generator Prescaler 0000 6 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. A TABLE 4-13: SPI1 REGISTER MAP / X SFR SFR All Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets 0 8 SPI1STAT 0240 SPIEN — SPISIDL — — — — — — SPIROV — — — — SPITBF SPIRBF 0000 A SPI1CON1 0242 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE<2:0> PPRE<1:0> 0000 SPI1CON2 0244 FRMEN SPIFSD FRMPOL — — — — — — — — — — — FRMDLY — 0000 / X SPI1BUF 0248 SPI1 Transmit and Receive Buffer Register 0000 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. 1 20 0 0 9-2 TABLE 4-14: SPI2 REGISTER MAP A 0 12 M SFR Name ASdFdRr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ReAslel ts ic ro SPI2STAT 0260 SPIEN — SPISIDL — — — — — — SPIROV — — — — SPITBF SPIRBF 0000 c hip SPI2CON1 0262 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE<2:0> PPRE<1:0> 0000 T SPI2CON2 0264 FRMEN SPIFSD FRMPOL — — — — — — — — — — — FRMDLY — 0000 e c h SPI2BUF 0268 SPI2 Transmit and Receive Buffer Register 0000 n olo Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. g y In c .
TABLE 4-15: ADC1 REGISTER MAP 2 0 All 0 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 9 Resets -2 01 ADC1BUF0 0300 ADC Data Buffer 0 xxxx 2 M AD1CON1 0320 ADON — ADSIDL ADDMABM — AD12B FORM<1:0> SSRC<2:0> — SIMSAM ASAM SAMP DONE 0000 ic ro AD1CON2 0322 VCFG<2:0> — — CSCNA CHPS<1:0> BUFS — SMPI<3:0> BUFM ALTS 0000 c h AD1CON3 0324 ADRC — — SAMC<4:0> ADCS<7:0> 0000 ip T AD1CHS123 0326 — — — — — CH123NB<1:0> CH123SB — — — — — CH123NA<1:0> CH123SA 0000 e ch AD1CHS0 0328 CH0NB — — CH0SB<4:0> CH0NA — — CH0SA<4:0> 0000 n d ology AADD11PPCCFFGGHL(1) 003322CA PPCCFFGG3115 PPCCFFGG3104 PPCCFFGG2193 PPCCFFGG2182 PPCCFFGG2117 PPCCFFGG2160 PPCCFFGG295 PPCCFFGG284 PPCCFFGG273 PPCCFFGG262 PPCCFFGG251 PPCCFFGG240 PPCCFFGG139 PPCCFFGG128 PPCCFFGG117 PPCCFFGG106 00000000 s Inc AD1CSSH(1) 032E CSS31 CSS30 CSS29 CSS28 CSS27 CSS26 CSS25 CSS24 CSS23 CSS22 CSS21 CSS20 CSS19 CSS18 CSS17 CSS16 0000 P . AD1CSSL 0330 CSS15 CSS14 CSS13 CSS12 CSS11 CSS10 CSS9 CSS8 CSS7 CSS6 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 0000 I C AD1CON4 0332 — — — — — — — — — — — — — DMABL<2:0> 0000 3 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Note 1: Not all ANx inputs are available on all devices. See the device pin diagrams for available ANx inputs. 3 F TABLE 4-16: ADC2 REGISTER MAP J All X File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets X ADC2BUF0 0340 ADC Data Buffer 0 xxxx X AD2CON1 0360 ADON — ADSIDL ADDMABM — AD12B FORM<1:0> SSRC<2:0> — SIMSAM ASAM SAMP DONE 0000 G AD2CON2 0362 VCFG<2:0> — — CSCNA CHPS<1:0> BUFS — SMPI<3:0> BUFM ALTS 0000 AD2CON3 0364 ADRC — — SAMC<4:0> ADCS<7:0> 0000 P AD2CHS123 0366 — — — — — CH123NB<1:0> CH123SB — — — — — CH123NA<1:0> CH123SA 0000 X AD2CHS0 0368 CH0NB — — — CH0SB<3:0> CH0NA — — — CH0SA<3:0> 0000 0 Reserved 036A — — — — — — — — — — — — — — — — 0000 6 AD2PCFGL 036C PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 A Reserved 036E — — — — — — — — — — — — — — — — 0000 AD2CSSL 0370 CSS15 CSS14 CSS13 CSS12 CSS11 CSS10 CSS9 CSS8 CSS7 CSS6 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 0000 / X AD2CON4 0372 — — — — — — — — — — — — — DMABL<2:0> 0000 0 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. 8 A D S 7 / 0 X 5 9 3D 1 -pa 0 g e A 5 5
D TABLE 4-17: DMA REGISTER MAP d S 7059 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ReAslel ts sP 3 D -p DMA0CON 0380 CHEN SIZE DIR HALF NULLW — — — — — AMODE<1:0> — — MODE<1:0> 0000 I ag DMA0REQ 0382 FORCE — — — — — — — — IRQSEL<6:0> 0000 C e 5 DMA0STA 0384 STA<15:0> 0000 3 6 DMA0STB 0386 STB<15:0> 0000 3 DMA0PAD 0388 PAD<15:0> 0000 F DMA0CNT 038A — — — — — — CNT<9:0> 0000 J DMA1CON 038C CHEN SIZE DIR HALF NULLW — — — — — AMODE<1:0> — — MODE<1:0> 0000 X DMA1REQ 038E FORCE — — — — — — — — IRQSEL<6:0> 0000 X DMA1STA 0390 STA<15:0> 0000 DMA1STB 0392 STB<15:0> 0000 X DMA1PAD 0394 PAD<15:0> 0000 G DMA1CNT 0396 — — — — — — CNT<9:0> 0000 P DMA2CON 0398 CHEN SIZE DIR HALF NULLW — — — — — AMODE<1:0> — — MODE<1:0> 0000 X DMA2REQ 039A FORCE — — — — — — — — IRQSEL<6:0> 0000 DMA2STA 039C STA<15:0> 0000 0 DMA2STB 039E STB<15:0> 0000 6 DMA2PAD 03A0 PAD<15:0> 0000 A DMA2CNT 03A2 — — — — — — CNT<9:0> 0000 / X DMA3CON 03A4 CHEN SIZE DIR HALF NULLW — — — — — AMODE<1:0> — — MODE<1:0> 0000 DMA3REQ 03A6 FORCE — — — — — — — — IRQSEL<6:0> 0000 0 DMA3STA 03A8 STA<15:0> 0000 8 DMA3STB 03AA STB<15:0> 0000 A DMA3PAD 03AC PAD<15:0> 0000 / DMA3CNT 03AE — — — — — — CNT<9:0> 0000 X DMA4CON 03B0 CHEN SIZE DIR HALF NULLW — — — — — AMODE<1:0> — — MODE<1:0> 0000 1 20 DMA4REQ 03B2 FORCE — — — — — — — — IRQSEL<6:0> 0000 0 0 9-2 DMA4STA 03B4 STA<15:0> 0000 A 01 DMA4STB 03B6 STB<15:0> 0000 2 M DMA4PAD 03B8 PAD<15:0> 0000 icro DMA4CNT 03BA — — — — — — CNT<9:0> 0000 ch DMA5CON 03BC CHEN SIZE DIR HALF NULLW — — — — — AMODE<1:0> — — MODE<1:0> 0000 ip T DMA5REQ 03BE FORCE — — — — — — — — IRQSEL<6:0> 0000 e c DMA5STA 03C0 STA<15:0> 0000 h n o DMA5STB 03C2 STB<15:0> 0000 lo gy DMA5PAD 03C4 PAD<15:0> 0000 In Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. c .
TABLE 4-17: DMA REGISTER MAP (CONTINUED) 2 0 0 All 9 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 -2 Resets 0 12 DMA5CNT 03C6 — — — — — — CNT<9:0> 0000 M DMA6CON 03C8 CHEN SIZE DIR HALF NULLW — — — — — AMODE<1:0> — — MODE<1:0> 0000 ic ro DMA6REQ 03CA FORCE — — — — — — — — IRQSEL<6:0> 0000 c h ip DMA6STA 03CC STA<15:0> 0000 Te DMA6STB 03CE STB<15:0> 0000 c hn DMA6PAD 03D0 PAD<15:0> 0000 d o log DMA6CNT 03D2 — — — — — — CNT<9:0> 0000 s y In DMA7CON 03D4 CHEN SIZE DIR HALF NULLW — — — — — AMODE<1:0> — — MODE<1:0> 0000 P c DMA7REQ 03D6 FORCE — — — — — — — — IRQSEL<6:0> 0000 . I DMA7STA 03D8 STA<15:0> 0000 C DMA7STB 03DA STB<15:0> 0000 3 DMA7PAD 03DC PAD<15:0> 0000 3 DMA7CNT 03DE — — — — — — CNT<9:0> 0000 F DMACS0 03E0 PWCOL7 PWCOL6 PWCOL5 PWCOL4 PWCOL3 PWCOL2 PWCOL1 PWCOL0 XWCOL7 XWCOL6 XWCOL5 XWCOL4 XWCOL3 XWCOL2 XWCOL1 XWCOL0 0000 J DMACS1 03E2 — — — — LSTCH<3:0> PPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0 0000 X DSADR 03E4 DSADR<15:0> 0000 Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. X X G P X 0 6 A / X 0 8 A D S 7 / 0 X 5 9 3D 1 -pa 0 g e A 5 7
DS T ABLE 4-18: ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 0 OR 1 FOR dsPIC33FJXXXGP506A/51A0/706A/708A/710A DEVICES ONLY d 70 s 5 All 9 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 P 3 Resets D -pa C1CTRL1 0400 — — CSIDL ABAT — REQOP<2:0> OPMODE<2:0> — CANCAP — — WIN 0480 IC g e 5 C1CTRL2 0402 — — — — — — — — — — — DNCNT<4:0> 0000 3 8 C1VEC 0404 — — — FILHIT<4:0> — ICODE<6:0> 0000 3 C1FCTRL 0406 DMABS<2:0> — — — — — — — — FSA<4:0> 0000 F C1FIFO 0408 — — FBP<5:0> — — FNRB<5:0> 0000 J C1INTF 040A — — TXBO TXBP RXBP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF — FIFOIF RBOVIF RBIF TBIF 0000 X C1INTE 040C — — — — — — — — IVRIE WAKIE ERRIE — FIFOIE RBOVIE RBIE TBIE 0000 C1EC 040E TERRCNT<7:0> RERRCNT<7:0> 0000 X C1CFG1 0410 — — — — — — — — SJW<1:0> BRP<5:0> 0000 X C1CFG2 0412 — WAKFIL — — — SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0000 G C1FEN1 0414 FLTEN15 FLTEN14 FLTEN13 FLTEN12 FLTEN11 FLTEN10 FLTEN9 FLTEN8 FLTEN7 FLTEN6 FLTEN5 FLTEN4 FLTEN3 FLTEN2 FLTEN1 FLTEN0 FFFF P C1FMSKSEL1 0418 F7MSK<1:0> F6MSK<1:0> F5MSK<1:0> F4MSK<1:0> F3MSK<1:0> F2MSK<1:0> F1MSK<1:0> F0MSK<1:0> 0000 C1FMSKSEL2 041A F15MSK<1:0> F14MSK<1:0> F13MSK<1:0> F12MSK<1:0> F11MSK<1:0> F10MSK<1:0> F9MSK<1:0> F8MSK<1:0> 0000 X Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. 0 6 TABLE 4-19: ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 0 FOR dsPIC33FJXXXGP506A/510A/706A/708A/710A DEVICES ONLY A All File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets / X 0400- See definition when WIN = x 0 041E 8 C1RXFUL1 0420 RXFUL15 RXFUL14 RXFUL13 RXFUL12 RXFUL11 RXFUL10 RXFUL9 RXFUL8 RXFUL7 RXFUL6 RXFUL5 RXFUL4 RXFUL3 RXFUL2 RXFUL1 RXFUL0 0000 A C1RXFUL2 0422 RXFUL31 RXFUL30 RXFUL29 RXFUL28 RXFUL27 RXFUL26 RXFUL25 RXFUL24 RXFUL23 RXFUL22 RXFUL21 RXFUL20 RXFUL19 RXFUL18 RXFUL17 RXFUL16 0000 C1RXOVF1 0428 RXOVF15 RXOVF14 RXOVF13 RXOVF12 RXOVF11 RXOVF10 RXOVF9 RXOVF8 RXOVF7 RXOVF6 RXOVF5 RXOVF4 RXOVF3 RXOVF2 RXOVF1 RXOVF0 0000 / X C1RXOVF2 042A RXOVF31 RXOVF30 RXOVF29 RXOVF28 RXOVF27 RXOVF26 RXOVF25 RXOVF24 RXOVF23 RXOVF22 RXOVF21 RXOVF20 RXOVF19 RXOVF18 RXOVF17 RXOVF16 0000 C1TR01CON 0430 TXEN1 TXABT1 TXLARB1 TXERR1 TXREQ1 RTREN1 TX1PRI<1:0> TXEN0 TXABAT0 TXLARB0 TXERR0 TXREQ0 RTREN0 TX0PRI<1:0> 0000 1 200 C1TR23CON 0432 TXEN3 TXABT3 TXLARB3 TXERR3 TXREQ3 RTREN3 TX3PRI<1:0> TXEN2 TXABAT2 TXLARB2 TXERR2 TXREQ2 RTREN2 TX2PRI<1:0> 0000 0 9-2 C1TR45CON 0434 TXEN5 TXABT5 TXLARB5 TXERR5 TXREQ5 RTREN5 TX5PRI<1:0> TXEN4 TXABAT4 TXLARB4 TXERR4 TXREQ4 RTREN4 TX4PRI<1:0> 0000 A 0 1 C1TR67CON 0436 TXEN7 TXABT7 TXLARB7 TXERR7 TXREQ7 RTREN7 TX7PRI<1:0> TXEN6 TXABAT6 TXLARB6 TXERR6 TXREQ6 RTREN6 TX6PRI<1:0> xxxx 2 M C1RXD 0440 Received Data Word xxxx ic ro C1TXD 0442 Transmit Data Word xxxx c hip Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. T e c h n o lo g y In c .
2 TABLE 4-20: ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 1 FOR dsPIC33FJXXXGP506A/510A/706A/708A/710A DEVICES ONLY 0 0 9-2 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ReAslel ts 0 1 2 M 0044010E- See definition when WIN = x ic ro C1BUFPNT1 0420 F3BP<3:0> F2BP<3:0> F1BP<3:0> F0BP<3:0> 0000 c h ip C1BUFPNT2 0422 F7BP<3:0> F6BP<3:0> F5BP<3:0> F4BP<3:0> 0000 Te C1BUFPNT3 0424 F11BP<3:0> F10BP<3:0> F9BP<3:0> F8BP<3:0> 0000 c hn C1BUFPNT4 0426 F15BP<3:0> F14BP<3:0> F13BP<3:0> F12BP<3:0> 0000 d o log C1RXM0SID 0430 SID<10:3> SID<2:0> — MIDE — EID<17:16> xxxx s y In C1RXM0EID 0432 EID<15:8> EID<7:0> xxxx P c C1RXM1SID 0434 SID<10:3> SID<2:0> — MIDE — EID<17:16> xxxx . I C1RXM1EID 0436 EID<15:8> EID<7:0> xxxx C C1RXM2SID 0438 SID<10:3> SID<2:0> — MIDE — EID<17:16> xxxx 3 C1RXM2EID 043A EID<15:8> EID<7:0> xxxx 3 C1RXF0SID 0440 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx F C1RXF0EID 0442 EID<15:8> EID<7:0> xxxx J C1RXF1SID 0444 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx X C1RXF1EID 0446 EID<15:8> EID<7:0> xxxx C1RXF2SID 0448 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx X C1RXF2EID 044A EID<15:8> EID<7:0> xxxx X C1RXF3SID 044C SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx G C1RXF3EID 044E EID<15:8> EID<7:0> xxxx P C1RXF4SID 0450 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx C1RXF4EID 0452 EID<15:8> EID<7:0> xxxx X C1RXF5SID 0454 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx 0 C1RXF5EID 0456 EID<15:8> EID<7:0> xxxx 6 C1RXF6SID 0458 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx A C1RXF6EID 045A EID<15:8> EID<7:0> xxxx / C1RXF7SID 045C SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx X C1RXF7EID 045E EID<15:8> EID<7:0> xxxx 0 C1RXF8SID 0460 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx 8 C1RXF8EID 0462 EID<15:8> EID<7:0> xxxx A DS C1RXF9SID 0464 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx 7 / 0 C1RXF9EID 0466 EID<15:8> EID<7:0> xxxx X 5 93D C1RXF10SID 0468 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx 1 -pa C1RXF10EID 046A EID<15:8> EID<7:0> xxxx 0 g Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. e A 5 9
TABLE 4-20: ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 1 FOR dsPIC33FJXXXGP506A/510A/706A/708A/710A DEVICES ONLY D d S 70 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All s 5 Resets 9 P 3 D C1RXF11SID 046C SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx -p I a C1RXF11EID 046E EID<15:8> EID<7:0> xxxx C g e 6 C1RXF12SID 0470 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx 3 0 C1RXF12EID 0472 EID<15:8> EID<7:0> xxxx 3 C1RXF13SID 0474 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx F C1RXF13EID 0476 EID<15:8> EID<7:0> xxxx J C1RXF14SID 0478 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx X C1RXF14EID 047A EID<15:8> EID<7:0> xxxx C1RXF15SID 047C SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx X C1RXF15EID 047E EID<15:8> EID<7:0> xxxx X Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. G P X 0 6 A / X 0 8 A / X 1 20 0 0 9-2 A 0 1 2 M ic ro c h ip T e c h n o lo g y In c .
2 T ABLE 4-21: ECAN2 REGISTER MAP WHEN C2CTRL1.WIN = 0 OR 1 FOR dsPIC33FJXXXGP706A/708A/710A DEVICES ONLY 0 09-2 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ReAslel ts 0 1 2 C2CTRL1 0500 — — CSIDL ABAT — REQOP<2:0> OPMODE<2:0> — CANCAP — — WIN 0480 M ic C2CTRL2 0502 — — — — — — — — — — — DNCNT<4:0> 0000 roc C2VEC 0504 — — — FILHIT<4:0> — ICODE<6:0> 0000 h ip T C2FCTRL 0506 DMABS<2:0> — — — — — — — — FSA<4:0> 0000 ec C2FIFO 0508 — — FBP<5:0> — — FNRB<5:0> 0000 h n C2INTF 050A — — TXBO TXBP RXBP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF — FIFOIF RBOVIF RBIF TBIF 0000 d o log C2INTE 050C — — — — — — — — IVRIE WAKIE ERRIE — FIFOIE RBOVIE RBIE TBIE 0000 s y In C2EC 050E TERRCNT<7:0> RERRCNT<7:0> 0000 P c . C2CFG1 0510 — — — — — — — — SJW<1:0> BRP<5:0> 0000 I C2CFG2 0512 — WAKFIL — — — SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0000 C C2FEN1 0514 FLTEN15 FLTEN14 FLTEN13 FLTEN12 FLTEN11 FLTEN10 FLTEN9 FLTEN8 FLTEN7 FLTEN6 FLTEN5 FLTEN4 FLTEN3 FLTEN2 FLTEN1 FLTEN0 FFFF 3 C2FMSKSEL1 0518 F7MSK<1:0> F6MSK<1:0> F5MSK<1:0> F4MSK<1:0> F3MSK<1:0> F2MSK<1:0> F1MSK<1:0> F0MSK<1:0> 0000 3 C2FMSKSEL2 051A F15MSK<1:0> F14MSK<1:0> F13MSK<1:0> F12MSK<1:0> F11MSK<1:0> F10MSK<1:0> F9MSK<1:0> F8MSK<1:0> 0000 F Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. J X TABLE 4-22: ECAN2 REGISTER MAP WHEN C2CTRL1.WIN = 0 FOR dsPIC33FJXXXGP706A/708A/710A DEVICES ONLY X All File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets X 0500- See definition when WIN = x G 051E P C2RXFUL1 0520 RXFUL15 RXFUL14 RXFUL13 RXFUL12 RXFUL11 RXFUL10 RXFUL9 RXFUL8 RXFUL7 RXFUL6 RXFUL5 RXFUL4 RXFUL3 RXFUL2 RXFUL1 RXFUL0 0000 C2RXFUL2 0522 RXFUL31 RXFUL30 RXFUL29 RXFUL28 RXFUL27 RXFUL26 RXFUL25 RXFUL24 RXFUL23 RXFUL22 RXFUL21 RXFUL20 RXFUL19 RXFUL18 RXFUL17 RXFUL16 0000 X C2RXOVF1 0528 RXOVF15 RXOVF14 RXOVF13 RXOVF12 RXOVF11 RXOVF10 RXOVF09 RXOVF08 RXOVF7 RXOVF6 RXOVF5 RXOVF4 RXOVF3 RXOVF2 RXOVF1 RXOVF0 0000 0 C2RXOVF2 052A RXOVF31 RXOVF30 RXOVF29 RXOVF28 RXOVF27 RXOVF26 RXOVF25 RXOVF24 RXOVF23 RXOVF22 RXOVF21 RXOVF20 RXOVF19 RXOVF18 RXOVF17RXOVF16 0000 6 C2TR01CON 0530 TXEN1 TX TX TX TX RTREN1 TX1PRI<1:0> TXEN0 TX TX TX TX RTREN0 TX0PRI<1:0> 0000 A ABAT1 LARB1 ERR1 REQ1 ABAT0 LARB0 ERR0 REQ0 C2TR23CON 0532 TXEN3 TX TX TX TX RTREN3 TX3PRI<1:0> TXEN2 TX TX TX TX RTREN2 TX2PRI<1:0> 0000 / X ABAT3 LARB3 ERR3 REQ3 ABAT2 LARB2 ERR2 REQ2 C2TR45CON 0534 TXEN5 TX TX TX TX RTREN5 TX5PRI<1:0> TXEN4 TX TX TX TX RTREN4 TX4PRI<1:0> 0000 0 ABAT5 LARB5 ERR5 REQ5 ABAT4 LARB4 ERR4 REQ4 8 C2TR67CON 0536 TXEN7 TX TX TX TX RTREN7 TX7PRI<1:0> TXEN6 TX TX TX TX RTREN6 TX6PRI<1:0> xxxx A D ABAT7 LARB7 ERR7 REQ7 ABAT6 LARB6 ERR6 REQ6 S 7 C2RXD 0540 Recieved Data Word xxxx / 0 X 5 9 C2TXD 0542 Transmit Data Word xxxx 3D Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. 1 -pa 0 g e A 6 1
D TABLE 4-23: ECAN2 REGISTER MAP WHEN C2CTRL1.WIN = 1 FOR dsPIC33FJXXXGP706A/708A/710A DEVICES ONLY d S 70 All s 5 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 9 Resets P 3 D -p 0500 See definition when WIN = x I a - C g e 051E 6 3 2 C2BUFPNT1 0520 F3BP<3:0> F2BP<3:0> F1BP<3:0> F0BP<3:0> 0000 3 C2BUFPNT2 0522 F7BP<3:0> F6BP<3:0> F5BP<3:0> F4BP<3:0> 0000 F C2BUFPNT3 0524 F11BP<3:0> F10BP<3:0> F9BP<3:0> F8BP<3:0> 0000 C2BUFPNT4 0526 F15BP<3:0> F14BP<3:0> F13BP<3:0> F12BP<3:0> 0000 J C2RXM0SID 0530 SID<10:3> SID<2:0> — MIDE — EID<17:16> xxxx X C2RXM0EID 0532 EID<15:8> EID<7:0> xxxx X C2RXM1SID 0534 SID<10:3> SID<2:0> — MIDE — EID<17:16> xxxx X C2RXM1EID 0536 EID<15:8> EID<7:0> xxxx G C2RXM2SID 0538 SID<10:3> SID<2:0> — MIDE — EID<17:16> xxxx C2RXM2EID 053A EID<15:8> EID<7:0> xxxx P C2RXF0SID 0540 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx X C2RXF0EID 0542 EID<15:8> EID<7:0> xxxx 0 C2RXF1SID 0544 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx 6 C2RXF1EID 0546 EID<15:8> EID<7:0> xxxx A C2RXF2SID 0548 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx / C2RXF2EID 054A EID<15:8> EID<7:0> xxxx X C2RXF3SID 054C SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx 0 C2RXF3EID 054E EID<15:8> EID<7:0> xxxx 8 C2RXF4SID 0550 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx A C2RXF4EID 0552 EID<15:8> EID<7:0> xxxx C2RXF5SID 0554 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx / X C2RXF5EID 0556 EID<15:8> EID<7:0> xxxx 1 20 C2RXF6SID 0558 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx 0 0 C2RXF6EID 055A EID<15:8> EID<7:0> xxxx 9-2 C2RXF7SID 055C SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx A 0 12 C2RXF7EID 055E EID<15:8> EID<7:0> xxxx M ic C2RXF8SID 0560 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx ro C2RXF8EID 0562 EID<15:8> EID<7:0> xxxx c h ip C2RXF9SID 0564 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx Te C2RXF9EID 0566 EID<15:8> EID<7:0> xxxx c hn C2RXF10SID 0568 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx o lo Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. g y In c .
TABLE 4-23: ECAN2 REGISTER MAP WHEN C2CTRL1.WIN = 1 FOR dsPIC33FJXXXGP706A/708A/710A DEVICES ONLY (CONTINUED) 2 0 0 All 9 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 -2 Resets 0 12 C2RXF10EID 056A EID<15:8> EID<7:0> xxxx M C2RXF11SID 056C SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx ic ro C2RXF11EID 056E EID<15:8> EID<7:0> xxxx c h ip C2RXF12SID 0570 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx Te C2RXF12EID 0572 EID<15:8> EID<7:0> xxxx c hn C2RXF13SID 0574 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx d o log C2RXF13EID 0576 EID<15:8> EID<7:0> xxxx s y In C2RXF14SID 0578 SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx P c. C2RXF14EID 057A EID<15:8> EID<7:0> xxxx I C2RXF15SID 057C SID<10:3> SID<2:0> — EXIDE — EID<17:16> xxxx C C2RXF15EID 057E EID<15:8> EID<7:0> xxxx 3 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. 3 F J X X X G P X 0 6 A / X 0 8 A D S 7 / 0 X 5 9 3D 1 -pa 0 g e A 6 3
D TABLE 4-24: DCI REGISTER MAP d S 70593 NSaFmRe Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State sP D -p DCICON1 0280 DCIEN — DCISIDL — DLOOP CSCKD CSCKE COFSD UNFM CSDOM DJST — — — COFSM1 COFSM0 0000 0000 0000 0000 I a C ge DCICON2 0282 — — — — BLEN1 BLEN0 — COFSG<3:0> — WS<3:0> 0000 0000 0000 0000 6 3 4 DCICON3 0284 — — — — BCG<11:0> 0000 0000 0000 0000 DCISTAT 0286 — — — — SLOT3 SLOT2 SLOT1 SLOT0 — — — — ROV RFUL TUNF TMPTY 0000 0000 0000 0000 3 TSCON 0288 TSE15 TSE14 TSE13 TSE12 TSE11 TSE10 TSE9 TSE8 TSE7 TSE6 TSE5 TSE4 TSE3 TSE2 TSE1 TSE0 0000 0000 0000 0000 F RSCON 028C RSE15 RSE14 RSE13 RSE12 RSE11 RSE10 RSE9 RSE8 RSE7 RSE6 RSE5 RSE4 RSE3 RSE2 RSE1 RSE0 0000 0000 0000 0000 J RXBUF0 0290 Receive Buffer #0 Data Register 0000 0000 0000 0000 X RXBUF1 0292 Receive Buffer #1 Data Register 0000 0000 0000 0000 X RXBUF2 0294 Receive Buffer #2 Data Register 0000 0000 0000 0000 X RXBUF3 0296 Receive Buffer #3 Data Register 0000 0000 0000 0000 G TXBUF0 0298 Transmit Buffer #0 Data Register 0000 0000 0000 0000 TXBUF1 029A Transmit Buffer #1 Data Register 0000 0000 0000 0000 P TXBUF2 029C Transmit Buffer #2 Data Register 0000 0000 0000 0000 X TXBUF3 029E Transmit Buffer #3 Data Register 0000 0000 0000 0000 0 Legend: — = unimplemented, read as ‘0’. Note 1: Refer to the “dsPIC33F/PIC24H Family Reference Manual” for descriptions of register bit fields. 6 A TABLE 4-25: PORTA REGISTER MAP(1) / X All File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets 0 TRISA 02C0 TRISA15 TRISA14 TRISA13 TRISA12 — TRISA10 TRISA9 — TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 F6FF 8 PORTA 02C2 RA15 RA14 RA13 RA12 — RA10 RA9 — RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xxxx A LATA 02C4 LATA15 LATA14 LATA13 LATA12 — LATA10 LATA9 — LATA7 LATA6 LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 xxxx / ODCA(2) 06C0 ODCA15 ODCA14 — — — — — — — — ODCA5 ODCA4 ODCA3 ODCA2 ODCA1 ODCA0 0000 X Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices. 1 20 Note 1: The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams. 0 0 9-2 TABLE 4-26: PORTB REGISTER MAP(1) A 0 1 2 M File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All ic Resets ro ch TRISB 02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 FFFF ip T PORTB 02C8 RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx e c LATB 02CA LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 xxxx h no Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices. lo Note 1: The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams. g y In c .
2 TABLE 4-27: PORTC REGISTER MAP(1) 0 09-2 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ReAslel ts 0 1 2 TRISC 02CC TRISC15 TRISC14 TRISC13 TRISC12 — — — — — — — TRISC4 TRISC3 TRISC2 TRISC1 — F01E M ic PORTC 02CE RC15 RC14 RC13 RC12 — — — — — — — RC4 RC3 RC2 RC1 — xxxx roc LATC 02D0 LATC15 LATC14 LATC13 LATC12 — — — — — — — LATC4 LATC3 LATC2 LATC1 — xxxx h ip Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices. Te Note 1: The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams. c h n d o TABLE 4-28: PORTD REGISTER MAP(1) log s y Inc File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ReAslel ts P . I TRISD 02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 FFFF C PORTD 02D4 RD15 RD14 RD13 RD12 RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx 3 LATD 02D6 LATD15 LATD14 LATD13 LATD12 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 xxxx 3 ODCD 06D2 ODCD15 ODCD14 ODCD13 ODCD12 ODCD11 ODCD10 ODCD9 ODCD8 ODCD7 ODCD6 ODCD5 ODCD4 ODCD3 ODCD2 ODCD1 ODCD0 0000 F Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices. Note 1: The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams. J X TABLE 4-29: PORTE REGISTER MAP(1) X File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All X Resets G TRISE 02D8 — — — — — — — — TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 00FF PORTE 02DA — — — — — — — — RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 xxxx P LATE 02DC — — — — — — — — LATE7 LATE6 LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 xxxx X Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices. 0 Note 1: The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams. 6 TABLE 4-30: PORTF REGISTER MAP(1) A / File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets X TRISF 02DE — — TRISF13 TRISF12 — — — TRISF8 TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 31FF 0 PORTF 02E0 — — RF13 RF12 — — — RF8 RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 xxxx 8 LATF 02E2 — — LATF13 LATF12 — — — LATF8 LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 xxxx A D S ODCF 06DE — — ODCF13 ODCF12 — — — ODCF8 ODCF7 ODCF6 ODCF5 ODCF4 ODCF3 ODCF2 ODCF1 ODCF0 0000 7 / 0 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices. X 5 9 Note 1: The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams. 3D 1 -pa 0 g e A 6 5
D TABLE 4-31: PORTG REGISTER MAP(1) d S 70593 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ReAslel ts sP D -p TRISG 02E4 TRISG15 TRISG14 TRISG13 TRISG12 — — TRISG9 TRISG8 TRISG7 TRISG6 — — TRISG3 TRISG2 TRISG1 TRISG0 F3CF I a C ge PORTG 02E6 RG15 RG14 RG13 RG12 — — RG9 RG8 RG7 RG6 — — RG3 RG2 RG1 RG0 xxxx 66 LATG 02E8 LATG15 LATG14 LATG13 LATG12 — — LATG9 LATG8 LATG7 LATG6 — — LATG3 LATG2 LATG1 LATG0 xxxx 3 ODCG 06E4 ODCG15 ODCG14 ODCG13 ODCG12 — — ODCG9 ODCG8 ODCG7 ODCG6 — — ODCG3 ODCG2 ODCG1 ODCG0 0000 3 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices. F Note 1: The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams. J X TABLE 4-32: SYSTEM CONTROL REGISTER MAP X All File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets X RCON 0740 TRAPR IOPUWR — — — — — VREGS EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR xxxx(1) G OSCCON 0742 — COSC<2:0> — NOSC<2:0> CLKLOCK — LOCK — CF — LPOSCEN OSWEN 0300(2) P CLKDIV 0744 ROI DOZE<2:0> DOZEN FRCDIV<2:0> PLLPOST<1:0> — PLLPRE<4:0> 3040 X PLLFBD 0746 — — — — — — — PLLDIV<8:0> 0030 0 OSCTUN 0748 — — — — — — — — — — TUN<5:0> 0000 6 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Note 1: RCON register Reset values dependent on type of Reset. A 2: OSCCON register Reset values dependent on the FOSC Configuration bits and by type of Reset. / X TABLE 4-33: NVM REGISTER MAP 0 File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All 8 Resets A NVMCON 0760 WR WREN WRERR — — — — — — ERASE — — NVMOP<3:0> 0000(1) / NVMKEY 0766 — — — — — — — — NVMKEY<7:0> 0000 X Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. 1 20 Note 1: Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset. 0 0 9-2 TABLE 4-34: PMD REGISTER MAP A 0 1 2 All M File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Resets ic roc PMD1 0770 T5MD T4MD T3MD T2MD T1MD — — DCIMD I2C1MD U2MD U1MD SPI2MD SPI1MD C2MD C1MD AD1MD 0000 h ip PMD2 0772 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD OC8MD OC7MD OC6MD OC5MD OC4MD OC3MD OC2MD OC1MD 0000 T e PMD3 0774 T9MD T8MD T7MD T6MD — — — — — — — — — — I2C2MD AD2MD 0000 c hn Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. o lo g y In c .
4.2.7 SOFTWARE STACK FIGURE 4-6: CALL STACK FRAME 2 0 09 In addition to its use as a working register, the W15 register in the 0x0000 15 0 -2 dsPIC33FJXXXGPX06A/X08A/X10A devices is also used as a software Stack 0 1 Pointer. The Stack Pointer always points to the first available free word and 2 M grows from lower to higher addresses. It pre-decrements for stack pops and s icroch paonsyt -CinAcLrLem inesnttrsu cfotiro snt,a cthke p uMsShbe so, fa sth seh oPwCn iisn zFeigrou-reex4te-6n.d Feodr ab ePfoCr ep utshhe dpuurisnhg, Towarddress ip Te ensuring that the MSb is always clear. ows er Ad PC<15:0> W15 (before CALL) chnolog Note: Aco nPcCa tepnuashte sd uthrein gS ReLx creegpitsiotenr ptor othcees MsiSnbg Stack GrHigh 00000<0F0re0e0 WPoCr<d2>2:16> W15 (after CALL) ds y of the PC prior to the push. In POP : [--W15] P c. The Stack Pointer Limit register (SPLIM) associated with the Stack Pointer sets PUSH: [W15++] I an upper address boundary for the stack. SPLIM is uninitialized at Reset. As is C the case for the Stack Pointer, SPLIM<0> is forced to ‘0’ because all stack oper- 3 ations must be word-aligned. Whenever an EA is generated using W15 as a 3 source or destination pointer, the resulting address is compared with the value F in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are equal and a push operation is performed, a stack error trap will not occur. The J stack error trap will occur on a subsequent push operation. Thus, for example, X if it is desirable to cause a stack error trap when the stack grows beyond X address 0x2000 in RAM, initialize the SPLIM with the value 0x1FFE. X Similarly, a Stack Pointer underflow (stack error) trap is generated when the G Stack Pointer address is found to be less than 0x0800. This prevents the stack from interfering with the Special Function Register (SFR) space. P A write to the SPLIM register should not be immediately followed by an indirect X read operation using W15. 0 4.2.8 DATA RAM PROTECTION FEATURE 4.3 Instruction Addressing Modes 6 A The dsPIC33F product family supports Data RAM protection features which The addressing modes in Table4-35 form the basis of the addressing modes enable segments of RAM to be protected when used in conjunction with Boot optimized to support the specific features of individual instructions. The /X and Secure Code Segment Security. BSRAM (Secure RAM segment for BS) is addressing modes provided in the MAC class of instructions are somewhat dif- 0 accessible only from the Boot Segment Flash code when enabled. SSRAM ferent from those in the other instruction types. (Secure RAM segment for RAM) is accessible only from the Secure Segment 8 Flash code when enabled. See Table4-1 for an overview of the BSRAM and 4.3.1 FILE REGISTER INSTRUCTIONS A D S SSRAM SFRs. 7 Most file register instructions use a 13-bit address field (f) to directly address / 0 X 5 9 data present in the first 8192 bytes of data memory (Near Data Space). Most 3D file register instructions employ a working register, W0, which is denoted as 1 -pa WREG in these instructions. The destination is typically either the same file reg- 0 g e A 6 7
dsPIC33FJXXXGPX06A/X08A/X10A ister or WREG (with the exception of the MUL instruc- Operand 2 can be a W register, fetched from data tion), which writes the result to a register or register memory, or a 5-bit literal. The result location can be pair. The MOV instruction allows additional flexibility and either a W register or a data memory location. The can access the entire data space. following addressing modes are supported by MCU instructions: 4.3.2 MCU INSTRUCTIONS • Register Direct The 3-operand MCU instructions are of the form: • Register Indirect Operand 3 = Operand 1 <function> Operand 2 • Register Indirect Post-Modified where: • Register Indirect Pre-Modified Operand 1 is always a working register (i.e., the • 5-bit or 10-bit Literal addressing mode can only be register direct) which is Note: Not all instructions support all the referred to as Wb. addressing modes given above. Individual instructions may support different subsets of these addressing modes. TABLE 4-35: FUNDAMENTAL ADDRESSING MODES SUPPORTED Addressing Mode Description File Register Direct The address of the file register is specified explicitly. Register Direct The contents of a register are accessed directly. Register Indirect The contents of Wn forms the EA. Register Indirect Post-Modified The contents of Wn forms the EA. Wn is post-modified (incremented or decremented) by a constant value. Register Indirect Pre-Modified Wn is pre-modified (incremented or decremented) by a signed constant value to form the EA. Register Indirect with Register Offset The sum of Wn and Wb forms the EA. Register Indirect with Literal Offset The sum of Wn and a literal forms the EA. 4.3.3 MOVE AND ACCUMULATOR • Register Indirect with Literal Offset INSTRUCTIONS • 8-bit Literal Move instructions and the DSP accumulator class of • 16-bit Literal instructions provide a greater degree of addressing Note: Not all instructions support all the flexibility than other instructions. In addition to the Addressing modes given above. Addressing modes supported by most MCU Individual instructions may support instructions, move and accumulator instructions also different subsets of these Addressing support Register Indirect with Register Offset modes. Addressing mode, also referred to as Register Indexed mode. 4.3.4 MAC INSTRUCTIONS Note: For the MOV instructions, the Addressing The dual source operand DSP instructions (CLR, ED, mode specified in the instruction can differ EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred for the source and destination EA. to as MAC instructions, utilize a simplified set of However, the 4-bit Wb (Register Offset) addressing modes to allow the user to effectively field is shared between both source and manipulate the data pointers through register indirect destination (but typically only used by tables. one). The 2-source operand prefetch registers must be In summary, the following Addressing modes are members of the set {W8, W9, W10, W11}. For data supported by move and accumulator instructions: reads, W8 and W9 are always directed to the X RAGU and W10 and W11 will always be directed to the Y • Register Direct AGU. The effective addresses generated (before and • Register Indirect • Register Indirect Post-modified • Register Indirect Pre-modified • Register Indirect with Register Offset (Indexed) DS70593D-page 68 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A after modification) must, therefore, be valid addresses 4.4.1 START AND END ADDRESS within X data space for W8 and W9 and Y data space The Modulo Addressing scheme requires that a starting for W10 and W11. and ending address be specified and loaded into the Note: Register Indirect with Register Offset 16-bit Modulo Buffer Address registers: XMODSRT, Addressing mode is only available for W9 XMODEND, YMODSRT and YMODEND (see (in X space) and W11 (in Y space). Table4-1). In summary, the following addressing modes are Note: Y space Modulo Addressing EA supported by the MAC class of instructions: calculations assume word sized data (LSb of every EA is always clear). • Register Indirect • Register Indirect Post-Modified by 2 • Register Indirect Post-Modified by 4 • Register Indirect Post-Modified by 6 • Register Indirect with Register Offset (Indexed) 4.3.5 OTHER INSTRUCTIONS Besides the various addressing modes outlined above, some instructions use literal constants of various sizes. For example, BRA (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas the DISI instruction uses a 14-bit unsigned literal field. In some instructions, such as ADD Acc, the source of an operand or result is implied by the opcode itself. Certain operations, such as NOP, do not have any operands. 4.4 Modulo Addressing Modulo Addressing mode is a method of providing an automated means to support circular data buffers using hardware. The objective is to remove the need for software to perform data address boundary checks when executing tightly looped code, as is typical in many DSP algorithms. Modulo Addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). One circular buffer can be supported in each of the X (which also provides the pointers into program space) and Y data spaces. Modulo Addressing can operate on any W register pointer. However, it is not advisable to use W14 or W15 for Modulo Addressing since these two registers are used as the Stack Frame Pointer and Stack Pointer, respectively. In general, any particular circular buffer can only be configured to operate in one direction as there are certain restrictions on the buffer start address (for incre- menting buffers), or end address (for decrementing buffers), based upon the direction of the buffer. The only exception to the usage restrictions is for buffers which have a power-of-2 length. As these buffers satisfy the start and end address criteria, they may operate in a bidirectional mode (i.e., address boundary checks will be performed on both the lower and upper address boundaries). 2009-2012 Microchip Technology Inc. DS70593D-page 69
dsPIC33FJXXXGPX06A/X08A/X10A The length of a circular buffer is not directly specified. It operate with Modulo Addressing. If XWM = 15, XRAGU is determined by the difference between the and X WAGU Modulo Addressing is disabled. Similarly, if corresponding start and end addresses. The maximum YWM = 15, Y AGU Modulo Addressing is disabled. possible length of the circular buffer is 32K words The X Address Space Pointer W register (XWM), to (64Kbytes). which Modulo Addressing is to be applied, is stored in MODCON<3:0> (see Table4-1). Modulo Addressing is 4.4.2 W ADDRESS REGISTER enabled for X data space when XWM is set to any value SELECTION other than ‘15’ and the XMODEN bit is set at The Modulo and Bit-Reversed Addressing Control MODCON<15>. register, MODCON<15:0>, contains enable flags as well The Y Address Space Pointer W register (YWM) to as a W register field to specify the W Address registers. which Modulo Addressing is to be applied is stored in The XWM and YWM fields select which registers will MODCON<7:4>. Modulo Addressing is enabled for Y data space when YWM is set to any value other than ‘15’ and the YMODEN bit is set at MODCON<14>. FIGURE 4-7: MODULO ADDRESSING OPERATION EXAMPLE Byte Address MOV #0x1100, W0 MOV W0, XMODSRT ;set modulo start address MOV #0x1163, W0 MOV W0, MODEND ;set modulo end address 0x1100 MOV #0x8001, W0 MOV W0, MODCON ;enable W1, X AGU for modulo MOV #0x0000, W0 ;W0 holds buffer fill value MOV #0x1110, W1 ;point W1 to buffer DO AGAIN, #0x31 ;fill the 50 buffer locations MOV W0, [W1++] ;fill the next location AGAIN: INC W0, W0 ;increment the fill value 0x1163 Start Addr = 0x1100 End Addr = 0x1163 Length = 0x0032 words DS70593D-page 70 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 4.4.3 MODULO ADDRESSING If the length of a bit-reversed buffer is M = 2N bytes, APPLICABILITY the last ‘N’ bits of the data buffer start address must be zeros. Modulo Addressing can be applied to the Effective Address (EA) calculation associated with any W XB<14:0> is the Bit-Reversed Address modifier, or register. It is important to realize that the address ‘pivot point’, which is typically a constant. In the case of boundaries check for addresses less than, or greater an FFT computation, its value is equal to half of the FFT than, the upper (for incrementing buffers) and lower (for data buffer size. decrementing buffers) boundary addresses (not just Note: All bit-reversed EA calculations assume equal to). Address changes may, therefore, jump word sized data (LSb of every EA is beyond boundaries and still be adjusted correctly. always clear). The XB value is scaled Note: The modulo corrected effective address is accordingly to generate compatible (byte) written back to the register only when addresses. Pre-Modify or Post-Modify Addressing When enabled, Bit-Reversed Addressing is only mode is used to compute the effective executed for Register Indirect with Pre-Increment or address. When an address offset (e.g., Post-Increment Addressing and word sized data writes. [W7+W2]) is used, Modulo Address It will not function for any other addressing mode or for correction is performed but the contents of byte sized data and normal addresses are generated the register remain unchanged. instead. When Bit-Reversed Addressing is active, the W Address Pointer is always added to the address 4.5 Bit-Reversed Addressing modifier (XB) and the offset associated with the Regis- ter Indirect Addressing mode is ignored. In addition, as Bit-Reversed Addressing mode is intended to simplify word sized data is a requirement, the LSb of the EA is data re-ordering for radix-2 FFT algorithms. It is ignored (and always clear). supported by the X AGU for data writes only. Note: Modulo Addressing and Bit-Reversed The modifier, which may be a constant value or register Addressing should not be enabled contents, is regarded as having its bit order reversed. The together. In the event that the user address source and destination are kept in normal order. attempts to do so, Bit-Reversed Address- Thus, the only operand requiring reversal is the modifier. ing will assume priority when active for the 4.5.1 BIT-REVERSED ADDRESSING X WAGU and X WAGU Modulo Addressing will be disabled. However, Modulo IMPLEMENTATION Addressing will continue to function in the X Bit-Reversed Addressing mode is enabled when: RAGU. 1. BWM bits (W register selection) in the If Bit-Reversed Addressing has already been enabled MODCON register are any value other than ‘15’ by setting the BREN bit (XBREV<15>), a write to the (the stack cannot be accessed using XBREV register should not be immediately followed by Bit-Reversed Addressing). an indirect read operation using the W register that has 2. The BREN bit is set in the XBREV register. been designated as the bit-reversed pointer. 3. The addressing mode used is Register Indirect with Pre-Increment or Post-Increment. 2009-2012 Microchip Technology Inc. DS70593D-page 71
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 4-8: BIT-REVERSED ADDRESS EXAMPLE Sequential Address b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 0 Bit Locations Swapped Left-to-Right Around Center of Binary Value b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4 0 Bit-Reversed Address Pivot Point XB = 0x0008 for a 16-Word Bit-Reversed Buffer TABLE 4-36: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY) Normal Address Bit-Reversed Address A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 8 0 0 1 0 2 0 1 0 0 4 0 0 1 1 3 1 1 0 0 12 0 1 0 0 4 0 0 1 0 2 0 1 0 1 5 1 0 1 0 10 0 1 1 0 6 0 1 1 0 6 0 1 1 1 7 1 1 1 0 14 1 0 0 0 8 0 0 0 1 1 1 0 0 1 9 1 0 0 1 9 1 0 1 0 10 0 1 0 1 5 1 0 1 1 11 1 1 0 1 13 1 1 0 0 12 0 0 1 1 3 1 1 0 1 13 1 0 1 1 11 1 1 1 0 14 0 1 1 1 7 1 1 1 1 15 1 1 1 1 15 DS70593D-page 72 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 4.6 Interfacing Program and Data 4.6.1 ADDRESSING PROGRAM SPACE Memory Spaces Since the address ranges for the data and program spaces are 16 and 24 bits, respectively, a method is The dsPIC33FJXXXGPX06A/X08A/X10A architecture needed to create a 23-bit or 24-bit program address uses a 24-bit wide program space and a 16-bit wide from 16-bit data registers. The solution depends on the data space. The architecture is also a modified Harvard interface method to be used. scheme, meaning that data can also be present in the program space. To use this data successfully, it must For table operations, the 8-bit Table Page register be accessed in a way that preserves the alignment of (TBLPAG) is used to define a 32Kword region within information in both spaces. the program space. This is concatenated with a 16-bit EA to arrive at a full 24-bit program space address. In Aside from normal execution, the this format, the Most Significant bit of TBLPAG is used dsPIC33FJXXXGPX06A/X08A/X10A architecture pro- to determine if the operation occurs in the user memory vides two methods by which program space can be (TBLPAG<7> = 0) or the configuration memory accessed during operation: (TBLPAG<7> = 1). • Using table instructions to access individual bytes For remapping operations, the 8-bit Program Space or words anywhere in the program space Visibility register (PSVPAG) is used to define a • Remapping a portion of the program space into 16Kword page in the program space. When the Most the data space (Program Space Visibility) Significant bit of the EA is ‘1’, PSVPAG is concatenated Table instructions allow an application to read or write with the lower 15 bits of the EA to form a 23-bit program to small areas of the program memory. This capability space address. Unlike table operations, this limits makes the method ideal for accessing data tables that remapping operations strictly to the user memory area. need to be updated from time to time. It also allows Table4-37 and Figure4-9 show how the program EA is access to all bytes of the program word. The created for table operations and remapping accesses remapping method allows an application to access a from the data EA. Here, P<23:0> refers to a program large block of data on a read-only basis, which is ideal space word, whereas D<15:0> refers to a data space for look ups from a large table of static data. It can only word. access the least significant word of the program word. TABLE 4-37: PROGRAM SPACE ADDRESS CONSTRUCTION Access Program Space Address Access Type Space <23> <22:16> <15> <14:1> <0> Instruction Access User 0 PC<22:1> 0 (Code Execution) 0xx xxxx xxxx xxxx xxxx xxx0 TBLRD/TBLWT User TBLPAG<7:0> Data EA<15:0> (Byte/Word Read/Write) 0xxx xxxx xxxx xxxx xxxx xxxx Configuration TBLPAG<7:0> Data EA<15:0> 1xxx xxxx xxxx xxxx xxxx xxxx Program Space Visibility User 0 PSVPAG<7:0> Data EA<14:0>(1) (Block Remap/Read) 0 xxxx xxxx xxx xxxx xxxx xxxx Note 1: Data EA<15> is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of the address is PSVPAG<0>. 2009-2012 Microchip Technology Inc. DS70593D-page 73
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 4-9: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION Program Counter(1) 0 Program Counter 0 23 bits EA 1/0 Table Operations(2) 1/0 TBLPAG 8 bits 16 bits 24 bits Select 1 EA 0 Program Space Visibility(1) 0 PSVPAG (Remapping) 8 bits 15 bits 23 bits User/Configuration Byte Select Space Select Note1: The LSb of program space addresses is always fixed as ‘0’ in order to maintain word alignment of data in the program and data spaces. 2: Table operations are not required to be word-aligned. Table read operations are permitted in the configuration memory space. DS70593D-page 74 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 4.6.2 DATA ACCESS FROM PROGRAM • TBLRDH (Table Read High): In Word mode, it MEMORY USING TABLE maps the entire upper word of a program address INSTRUCTIONS (P<23:16>) to a data address. Note that D<15:8>, the ‘phantom byte’, will always be ‘0’. The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the lower word of any In Byte mode, it maps the upper or lower byte of address within the program space without going the program word to D<7:0> of the data address, through data space. The TBLRDH and TBLWTH as above. Note that the data will always be ‘0’ instructions are the only method to read or write the when the upper ‘phantom’ byte is selected (Byte upper 8bits of a program space word as data. Select = 1). The PC is incremented by two for each successive In a similar fashion, two table instructions, TBLWTH 24-bit program word. This allows program memory and TBLWTL, are used to write individual bytes or addresses to directly map to data space addresses. words to a program space address. The details of Program memory can thus be regarded as two 16-bit their operation are explained in Section5.0 “Flash word wide address spaces, residing side by side, each Program Memory”. with the same address range. TBLRDL and TBLWTL For all table operations, the area of program memory access the space which contains the least significant space to be accessed is determined by the Table Page data word and TBLRDH and TBLWTH access the space register (TBLPAG). TBLPAG covers the entire program which contains the upper data byte. memory space of the device, including user and Two table instructions are provided to move byte or configuration spaces. When TBLPAG<7> = 0, the table word sized (16-bit) data to and from program space. page is located in the user memory space. When Both function as either byte or word operations. TBLPAG<7> = 1, the page is located in configuration space. • TBLRDL (Table Read Low): In Word mode, it maps the lower word of the program space location (P<15:0>) to a data address (D<15:0>). In Byte mode, either the upper or lower byte of the lower program word is mapped to the lower byte of a data address. The upper byte is selected when Byte Select is ‘1’; the lower byte is selected when it is ‘0’. FIGURE 4-10: ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS Program Space TBLPAG 02 23 15 0 0x000000 23 16 8 0 00000000 00000000 0x020000 00000000 0x030000 00000000 ‘Phantom’ Byte TBLRDH.B (Wn<0> = 0) TBLRDL.B (Wn<0> = 1) TBLRDL.B (Wn<0> = 0) TBLRDL.W The address for the table operation is determined by the data EA within the page defined by the TBLPAG register. 0x800000 Only read operations are shown; write operations are also valid in the user memory area. 2009-2012 Microchip Technology Inc. DS70593D-page 75
dsPIC33FJXXXGPX06A/X08A/X10A 4.6.3 READING DATA FROM PROGRAM 24-bit program word are used to contain the data. The MEMORY USING PROGRAM SPACE upper 8 bits of any program space location used as VISIBILITY data should be programmed with ‘1111 1111’ or ‘0000 0000’ to force a NOP. This prevents possible The upper 32Kbytes of data space may optionally be issues should the area of code ever be accidentally mapped into any 16Kword page of the program space. executed. This option provides transparent access of stored constant data from the data space without the need to Note: PSV access is temporarily disabled during use special instructions (i.e., TBLRDL/H). table reads/writes. Program space access through the data space occurs For operations that use PSV and are executed outside if the Most Significant bit of the data space EA is ‘1’ and a REPEAT loop, the MOV and MOV.D instructions program space visibility is enabled by setting the PSV require one instruction cycle in addition to the specified bit in the Core Control register (CORCON<2>). The execution time. All other instructions require two location of the program memory space to be mapped instruction cycles in addition to the specified execution into the data space is determined by the Program time. Space Visibility Page register (PSVPAG). This 8-bit For operations that use PSV, which are executed inside register defines any one of 256 possible pages of a REPEAT loop, there will be some instances that 16Kwords in program space. In effect, PSVPAG require two instruction cycles in addition to the functions as the upper 8 bits of the program memory specified execution time of the instruction: address, with the 15 bits of the EA functioning as the lower bits. Note that by incrementing the PC by 2 for • Execution in the first iteration each program memory word, the lower 15 bits of data • Execution in the last iteration space addresses directly map to the lower 15 bits in the • Execution prior to exiting the loop due to an corresponding program space addresses. interrupt Data reads to this area add an additional cycle to the • Execution upon re-entering the loop after an instruction being executed, since two program memory interrupt is serviced fetches are required. Any other iteration of the REPEAT loop will allow the Although each data space address, 8000h and higher, instruction accessing data, using PSV, to execute in a maps directly into a corresponding program memory single cycle. address (see Figure4-11), only the lower 16bits of the FIGURE 4-11: PROGRAM SPACE VISIBILITY OPERATION When CORCON<2> = 1 and EA<15> = 1: Program Space Data Space PSVPAG 23 15 0 02 0x000000 0x0000 Data EA<14:0> 0x010000 0x018000 The data in the page designated by PSVPAG is mapped into the upper half of the data memory 0x8000 space... PSV Area ...while the lower 15 bits of the EA specify an exact address within 0xFFFF the PSV area. This corresponds exactly to the same lower 15 bits of the actual program space address. 0x800000 DS70593D-page 76 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 5.0 FLASH PROGRAM MEMORY Master Clear (MCLR). This allows customers to manu- facture boards with unprogrammed devices and then Note1: This data sheet summarizes the features program the digital signal controller just before shipping of the dsPIC33FJXXXGPX06A/X08A/ the product. This also allows the most recent firmware X10A family of devices. However, it is not or a custom firmware to be programmed. intended to be a comprehensive refer- RTSP is accomplished using TBLRD (table read) and ence source. To complement the infor- TBLWT (table write) instructions. With RTSP, the user mation in this data sheet, refer to Section can write program memory data either in blocks or 5. “Flash Programming” (DS70191) in ‘rows’ of 64 instructions (192 bytes) at a time or a single the “dsPIC33F/PIC24H Family program memory word, and erase program memory in Reference Manual”, which is available blocks or ‘pages’ of 512 instructions (1536 bytes) at a from the Microchip web site time. (www.microchip.com). 2: Some registers and associated bits 5.1 Table Instructions and Flash described in this section may not be Programming available on all devices. Refer to Section4.0 “Memory Organization” in Regardless of the method used, all programming of this data sheet for device-specific register Flash memory is done with the table read and table and bit information. write instructions. These allow direct read and write access to the program memory space from the data The dsPIC33FJXXXGPX06A/X08A/X10A devices con- memory while the device is in normal operating mode. tain internal Flash program memory for storing and The 24-bit target address in the program memory is executing application code. The memory is readable, formed using bits<7:0> of the TBLPAG register and the writable and erasable during normal operation over the Effective Address (EA) from a W register specified in entire VDD range. the table instruction, as shown in Figure5-1. Flash memory can be programmed in two ways: The TBLRDL and the TBLWTL instructions are used to • In-Circuit Serial Programming™ (ICSP™) read or write to bits<15:0> of program memory. programming capability TBLRDL and TBLWTL can access program memory in • Run-Time Self-Programming (RTSP) both Word and Byte modes. ICSP allows a dsPIC33FJXXXGPX06A/X08A/X10A The TBLRDH and TBLWTH instructions are used to read device to be serially programmed while in the end or write to bits<23:16> of program memory. TBLRDH application circuit. This is simply done with two lines for and TBLWTH can also access program memory in Word programming clock and programming data (one of the or Byte mode. alternate programming pin pairs: PGECx/PGEDx), and three other lines for power (VDD), ground (VSS) and FIGURE 5-1: ADDRESSING FOR TABLE REGISTERS 24 bits Using 0 Program Counter 0 Program Counter Working Reg EA Using 1/0 TBLPAG Reg Table Instruction 8 bits 16 bits User/Configuration Byte Space Select 24-bit EA Select 2009-2012 Microchip Technology Inc. DS70593D-page 77
dsPIC33FJXXXGPX06A/X08A/X10A 5.2 RTSP Operation For example, if the device is operating at +125°C, the FRC accuracy will be ±5%. If the TUN<5:0> bits (see The dsPIC33FJXXXGPX06A/X08A/X10A Flash pro- Register9-4) are set to ‘b111111, the minimum row gram memory array is organized into rows of 64 write time is equal to Equation5-2. instructions or 192 bytes. RTSP allows the user to erase a page of memory, which consists of eight rows EQUATION 5-2: MINIMUM ROW WRITE (512 instructions) at a time, and to program one row or TIME one word at a time. Table25-12 illustrates typical erase and programming times. The 8-row erase pages and 11064 Cycles single row write rows are edge-aligned, from the begin- T =----------------------------------------------------------------------------------------------=1.435ms RW 7.37 MHz1+0.051–0.00375 ning of program memory, on boundaries of 1536 bytes and 192 bytes, respectively. The program memory implements holding buffers that The maximum row write time is equal to Equation5-3. can contain 64 instructions of programming data. Prior to the actual programming operation, the write data EQUATION 5-3: MAXIMUM ROW WRITE must be loaded into the buffers in sequential order. The TIME instruction words loaded must always be from a group of 64 boundary. 11064 Cycles The basic sequence for RTSP programming is to set up TRW =7---.--3---7--- --M-----H----z-----------1-----–----0---.--0---5--------------1----–-----0---.-0----0--3----7--5-----=1.586ms a Table Pointer, then do a series of TBLWT instructions to load the buffers. Programming is performed by setting the control bits in the NVMCON register. A total Setting the WR bit (NVMCON<15>) starts the of 64 TBLWTL and TBLWTH instructions are required operation, and the WR bit is automatically cleared to load the instructions. when the operation is finished. All of the table write operations are single-word writes (two instruction cycles) because only the buffers are 5.4 Control Registers written. A programming cycle is required for programming each row. The two SFRs that are used to read and write the program Flash memory are: 5.3 Programming Operations • NVMCON: Flash Memory Control Register • NVMKEY: Non-Volatile Memory Key Register A complete programming sequence is necessary for programming or erasing the internal Flash in RTSP The NVMCON register (Register5-1) controls which mode. The processor stalls (waits) until the blocks are to be erased, which memory type is to be programming operation is finished. programmed and the start of the programming cycle. The programming time depends on the FRC accuracy NVMKEY (Register5-2) is a write-only register that is (see Table25-19) and the value of the FRC Oscillator used for write protection. To start a programming or Tuning register (see Register9-4). Use the following erase sequence, the user must consecutively write 0x55 formula to calculate the minimum and maximum values and 0xAA to the NVMKEY register. Refer to Section5.3 for the Row Write Time, Page Erase Time and Word “Programming Operations” for further details. Write Cycle Time parameters (see Table25-12). EQUATION 5-1: PROGRAMMING TIME T -------------------------------------------------------------------------------------------------------------------------- 7.37 MHzFRC Accuracy%FRC Tuning% DS70593D-page 78 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R E GISTER 5-1: NVMCON: FLASH MEMORY CONTROL REGISTER R/SO-0(1) R/W-0(1) R/W-0(1) U-0 U-0 U-0 U-0 U-0 WR WREN WRERR — — — — — bit 15 bit 8 U-0 R/W-0(1) U-0 U-0 R/W-0(1) R/W-0(1) R/W-0(1) R/W-0(1) — ERASE — — NVMOP<3:0>(2) bit 7 bit 0 Legend: SO = Settable only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 WR: Write Control bit 1 = Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete 0 = Program or erase operation is complete and inactive bit 14 WREN: Write Enable bit 1 = Enable Flash program/erase operations 0 = Inhibit Flash program/erase operations bit 13 WRERR: Write Sequence Error Flag bit 1 = An improper program or erase sequence attempt or termination has occurred (bit is set automatically on any set attempt of the WR bit) 0 = The program or erase operation completed normally bit 12-7 Unimplemented: Read as ‘0’ bit 6 ERASE: Erase/Program Enable bit 1 = Perform the erase operation specified by NVMOP<3:0> on the next WR command 0 = Perform the program operation specified by NVMOP<3:0> on the next WR command bit 5-4 Unimplemented: Read as ‘0’ bit 3-0 NVMOP<3:0>: NVM Operation Select bits(2) If ERASE = 1: 1111 = Memory bulk erase operation 1110 = Reserved 1101 = Erase General Segment 1100 = Erase Secure Segment 1011 = Reserved 0011 = No operation 0010 = Memory page erase operation 0001 = No operation 0000 = Erase a single Configuration register byte If ERASE = 0: 1111 = No operation 1110 = Reserved 1101 = No operation 1100 = No operation 1011 = Reserved 0011 = Memory word program operation 0010 = No operation 0001 = Memory row program operation 0000 = Program a single Configuration register byte Note 1: These bits can only be reset on POR. 2: All other combinations of NVMOP<3:0> are unimplemented. 2009-2012 Microchip Technology Inc. DS70593D-page 79
dsPIC33FJXXXGPX06A/X08A/X10A R E GISTER 5-2: NVMKEY: NON-VOLATILE MEMORY KEY REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0 NVMKEY<7:0> bit 7 bit 0 Legend: SO = Settable only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7-0 NVMKEY<7:0>: Key Register (Write Only) bits DS70593D-page 80 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 5.4.1 PROGRAMMING ALGORITHM FOR 4. Write the first 64 instructions from data RAM into FLASH PROGRAM MEMORY the program memory buffers (see Example5-2). 5. Write the program block to Flash memory: The user can program one row of program Flash memory at a time. To do this, it is necessary to erase a) Set the NVMOP bits to ‘0001’ to configure the 8-row erase page that contains the desired row. for row programming. Clear the ERASE bit The general process is: and set the WREN bit. b) Write 0x55 to NVMKEY. 1. Read eight rows of program memory (512instructions) and store in data RAM. c) Write 0xAA to NVMKEY. 2. Update the program data in RAM with the d) Set the WR bit. The programming cycle desired new data. begins and the CPU stalls for the duration of the write cycle. When the write to Flash 3. Erase the block (see Example5-1): memory is done, the WR bit is cleared a) Set the NVMOP bits (NVMCON<3:0>) to automatically. ‘0010’ to configure for block erase. Set the 6. Repeat steps 4 and 5, using the next available ERASE bit (NVMCON<6>) and the WREN 64 instructions from the block in data RAM by bit (NVMCON<14>). incrementing the value in TBLPAG, until all b) Write the starting address of the page to be 512instructions are written back to Flash memory. erased into the TBLPAG and W registers. For protection against accidental operations, the write c) Write 0x55 to NVMKEY. initiate sequence for NVMKEY must be used to allow d) Write 0xAA to NVMKEY. any erase or program operation to proceed. After the e) Set the WR bit (NVMCON<15>). The erase programming command has been executed, the user cycle begins and the CPU stalls for the must wait for the programming time until programming duration of the erase cycle. When the erase is is complete. The two instructions following the start of done, the WR bit is cleared automatically. the programming sequence should be NOPs, as shown in Example5-3. EXAMPLE 5-1: ERASING A PROGRAM MEMORY PAGE ; Set up NVMCON for block erase operation MOV #0x4042, W0 ; MOV W0, NVMCON ; Initialize NVMCON ; Init pointer to row to be ERASED MOV #tblpage(PROG_ADDR), W0 ; MOV W0, TBLPAG ; Initialize PM Page Boundary SFR MOV #tbloffset(PROG_ADDR), W0 ; Initialize in-page EA[15:0] pointer TBLWTL W0, [W0] ; Set base address of erase block DISI #5 ; Block all interrupts with priority <7 ; for next 5 instructions MOV #0x55, W0 MOV W0, NVMKEY ; Write the 55 key MOV #0xAA, W1 ; MOV W1, NVMKEY ; Write the AA key BSET NVMCON, #WR ; Start the erase sequence NOP ; Insert two NOPs after the erase NOP ; command is asserted 2009-2012 Microchip Technology Inc. DS70593D-page 81
dsPIC33FJXXXGPX06A/X08A/X10A EXAMPLE 5-2: LOADING THE WRITE BUFFERS ; Set up NVMCON for row programming operations MOV #0x4001, W0 ; MOV W0, NVMCON ; Initialize NVMCON ; Set up a pointer to the first program memory location to be written ; program memory selected, and writes enabled MOV #0x0000, W0 ; MOV W0, TBLPAG ; Initialize PM Page Boundary SFR MOV #0x6000, W0 ; An example program memory address ; Perform the TBLWT instructions to write the latches ; 0th_program_word MOV #LOW_WORD_0, W2 ; MOV #HIGH_BYTE_0, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 1st_program_word MOV #LOW_WORD_1, W2 ; MOV #HIGH_BYTE_1, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 2nd_program_word MOV #LOW_WORD_2, W2 ; MOV #HIGH_BYTE_2, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch • • • ; 63rd_program_word MOV #LOW_WORD_31, W2 ; MOV #HIGH_BYTE_31, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch EXAMPLE 5-3: INITIATING A PROGRAMMING SEQUENCE DISI #5 ; Block all interrupts with priority <7 ; for next 5 instructions MOV #0x55, W0 MOV W0, NVMKEY ; Write the 55 key MOV #0xAA, W1 ; MOV W1, NVMKEY ; Write the AA key BSET NVMCON, #WR ; Start the erase sequence NOP ; Insert two NOPs after the NOP ; erase command is asserted DS70593D-page 82 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 6.0 RESET A simplified block diagram of the Reset module is shown in Figure6-1. Note1: This data sheet summarizes the features Any active source of Reset will make the SYSRST of the dsPIC33FJXXXGPX06A/X08A/ signal active. Many registers associated with the CPU X10A family of devices. However, it is not and peripherals are forced to a known Reset state. intended to be a comprehensive refer- Most registers are unaffected by a Reset; their status is ence source. To complement the infor- unknown on POR and unchanged by all other Resets. mation in this data sheet, refer to Section 8. “Reset” (DS70192) in the “dsPIC33F/ Note: Refer to the specific peripheral or CPU PIC24H Family Reference Manual”, section of this manual for register Reset which is available from the Microchip web states. site (www.microchip.com). All types of device Reset will set a corresponding status 2: Some registers and associated bits bit in the RCON register to indicate the type of Reset described in this section may not be (see Register6-1). A POR will clear all bits, except for available on all devices. Refer to the POR bit (RCON<0>), that are set. The user can set Section4.0 “Memory Organization” in or clear any bit at any time during code execution. The this data sheet for device-specific register RCON bits only serve as status bits. Setting a particular and bit information. Reset status bit in software does not cause a device Reset to occur. The Reset module combines all Reset sources and controls the device Master Reset Signal, SYSRST. The The RCON register also has other bits associated with following is a list of device Reset sources: the Watchdog Timer and device power-saving states. The function of these bits is discussed in other sections • POR: Power-on Reset of this manual. • BOR: Brown-out Reset Note: The status bits in the RCON register • MCLR: Master Clear Pin Reset should be cleared after they are read so • SWR: RESET Instruction that the next RCON register value after a • WDT: Watchdog Timer Reset device Reset will be meaningful. • TRAPR: Trap Conflict Reset • IOPUWR: Illegal Opcode and Uninitialized W Register Reset FIGURE 6-1: RESET SYSTEM BLOCK DIAGRAM RESET Instruction Glitch Filter MCLR WDT Module Sleep or Idle BOR Internal Regulator SYSRST VDD VDD Rise POR Detect Trap Conflict Illegal Opcode Uninitialized W Register 2009-2012 Microchip Technology Inc. DS70593D-page 83
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 6-1: RCON: RESET CONTROL REGISTER(1) R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 R/W-0 TRAPR IOPUWR — — — — — VREGS(3) bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 EXTR SWR SWDTEN(2) WDTO SLEEP IDLE BOR POR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 TRAPR: Trap Reset Flag bit 1 = A Trap Conflict Reset has occurred 0 = A Trap Conflict Reset has not occurred bit 14 IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit 1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an Address Pointer caused a Reset 0 = An illegal opcode or uninitialized W Reset has not occurred bit 13-9 Unimplemented: Read as ‘0’ bit 8 VREGS: Voltage Regulator Standby During Sleep bit(3) 1 = Voltage Regulator is active during Sleep mode 0 = Voltage Regulator goes into standby mode during Sleep bit 7 EXTR: External Reset (MCLR) Pin bit 1 = A Master Clear (pin) Reset has occurred 0 = A Master Clear (pin) Reset has not occurred bit 6 SWR: Software Reset (Instruction) Flag bit 1 = A RESET instruction has been executed 0 = A RESET instruction has not been executed bit 5 SWDTEN: Software Enable/Disable of WDT bit(2) 1 = WDT is enabled 0 = WDT is disabled bit 4 WDTO: Watchdog Timer Time-out Flag bit 1 = WDT time-out has occurred 0 = WDT time-out has not occurred bit 3 SLEEP: Wake-up from Sleep Flag bit 1 = Device has been in Sleep mode 0 = Device has not been in Sleep mode bit 2 IDLE: Wake-up from Idle Flag bit 1 = Device was in Idle mode 0 = Device was not in Idle mode bit 1 BOR: Brown-out Reset Flag bit 1 = A Brown-out Reset has occurred 0 = A Brown-out Reset has not occurred Note 1: All of the Reset status bits may be set or cleared in software. Setting one of these bits in software does not cause a device Reset. 2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the SWDTEN bit setting. 3: For dsPIC33FJ256GPX06A/X08A/X10A devices, this bit is unimplemented and reads back programmed value. DS70593D-page 84 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 6-1: RCON: RESET CONTROL REGISTER(1) (CONTINUED) bit 0 POR: Power-on Reset Flag bit 1 = A Power-on Reset has occurred 0 = A Power-on Reset has not occurred Note 1: All of the Reset status bits may be set or cleared in software. Setting one of these bits in software does not cause a device Reset. 2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the SWDTEN bit setting. 3: For dsPIC33FJ256GPX06A/X08A/X10A devices, this bit is unimplemented and reads back programmed value. 2009-2012 Microchip Technology Inc. DS70593D-page 85
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 6-1: RESET FLAG BIT OPERATION Flag Bit Setting Event Clearing Event TRAPR (RCON<15>) Trap conflict event POR, BOR IOPUWR (RCON<14>) Illegal opcode or uninitialized POR, BOR W register access EXTR (RCON<7>) MCLR Reset POR SWR (RCON<6>) RESET instruction POR, BOR WDTO (RCON<4>) WDT time-out PWRSAV instruction, POR, BOR SLEEP (RCON<3>) PWRSAV #SLEEP instruction POR, BOR IDLE (RCON<2>) PWRSAV #IDLE instruction POR, BOR BOR (RCON<1>) BOR, POR — POR (RCON<0>) POR — Note: All Reset flag bits may be set or cleared by the user software. 6.1 Clock Source Selection at Reset 6.2 Device Reset Times If clock switching is enabled, the system clock source at The Reset times for various types of device Reset are device Reset is chosen, as shown in Table6-2. If clock summarized in Table6-3. The system Reset signal, switching is disabled, the system clock source is always SYSRST, is released after the POR and PWRT delay selected according to the oscillator Configuration bits. times expire. Refer to Section9.0 “Oscillator Configuration” for The time at which the device actually begins to execute further details. code also depends on the system oscillator delays, which include the Oscillator Start-up Timer (OST) and TABLE 6-2: OSCILLATOR SELECTION VS the PLL lock time. The OST and PLL lock times occur TYPE OF RESET (CLOCK in parallel with the applicable SYSRST delay times. SWITCHING ENABLED) The FSCM delay determines the time at which the Reset Type Clock Source Determinant FSCM begins to monitor the system clock source after the SYSRST signal is released. POR Oscillator Configuration bits BOR (FNOSC<2:0>) MCLR COSC Control bits WDTR (OSCCON<14:12>) SWR DS70593D-page 86 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 6-3: RESET DELAY TIMES FOR VARIOUS DEVICE RESETS System Clock FSCM Reset Type Clock Source SYSRST Delay See Notes Delay Delay POR EC, FRC, LPRC TPOR + TSTARTUP + TRST — — 1, 2, 3 ECPLL, FRCPLL TPOR + TSTARTUP + TRST TLOCK TFSCM 1, 2, 3, 5, 6 XT, HS, SOSC TPOR + TSTARTUP + TRST TOST TFSCM 1, 2, 3, 4, 6 XTPLL, HSPLL TPOR + TSTARTUP + TRST TOST + TLOCK TFSCM 1, 2, 3, 4, 5, 6 BOR EC, FRC, LPRC TSTARTUP + TRST — — 3 ECPLL, FRCPLL TSTARTUP + TRST TLOCK TFSCM 3, 5, 6 XT, HS, SOSC TSTARTUP + TRST TOST TFSCM 3, 4, 6 XTPLL, HSPLL TSTARTUP + TRST TOST + TLOCK TFSCM 3, 4, 5, 6 MCLR Any Clock TRST — — 3 WDT Any Clock TRST — — 3 Software Any Clock TRST — — 3 Illegal Opcode Any Clock TRST — — 3 Uninitialized W Any Clock TRST — — 3 Trap Conflict Any Clock TRST — — 3 Note 1: TPOR = Power-on Reset delay (10 s nominal). 2: TSTARTUP = Conditional POR delay of 20s nominal (if on-chip regulator is enabled) or 64ms nominal Power-up Timer delay (if regulator is disabled). TSTARTUP is also applied to all returns from powered-down states, including waking from Sleep mode, only if the regulator is enabled. 3: TRST = Internal state Reset time (20 s nominal). 4: TOST = Oscillator Start-up Timer. A 10-bit counter counts 1024 oscillator periods before releasing the oscillator clock to the system. 5: TLOCK = PLL lock time (20 s nominal). 6: TFSCM = Fail-Safe Clock Monitor delay (100 s nominal). 6.2.1 POR AND LONG OSCILLATOR 6.2.2.1 FSCM Delay for Crystal and PLL START-UP TIMES Clock Sources The oscillator start-up circuitry and its associated delay When the system clock source is provided by a crystal timers are not linked to the device Reset delays that oscillator and/or the PLL, a small delay, TFSCM, is auto- occur at power-up. Some crystal circuits (especially matically inserted after the POR and PWRT delay low-frequency crystals) have a relatively long start-up times. The FSCM does not begin to monitor the system time. Therefore, one or more of the following conditions clock source until this delay expires. The FSCM delay is possible after SYSRST is released: time is nominally 500 s and provides additional time for the oscillator and/or PLL to stabilize. In most cases, • The oscillator circuit has not begun to oscillate. the FSCM delay prevents an oscillator failure trap at a • The Oscillator Start-up Timer has not expired (if a device Reset when the PWRT is disabled. crystal oscillator is used). • The PLL has not achieved a lock (if PLL is used). 6.3 Special Function Register Reset The device will not begin to execute code until a valid States clock source has been released to the system. Therefore, the oscillator and PLL start-up delays must Most of the Special Function Registers (SFRs) associ- be considered when the Reset delay time must be ated with the CPU and peripherals are reset to a known. particular value at a device Reset. The SFRs are grouped by their peripheral or CPU function and their 6.2.2 FAIL-SAFE CLOCK MONITOR Reset values are specified in each section of this manual. (FSCM) AND DEVICE RESETS The Reset value for each SFR does not depend on the If the FSCM is enabled, it begins to monitor the system type of Reset, with the exception of two registers. The clock source when SYSRST is released. If a valid clock Reset value for the Reset Control register, RCON, source is not available at this time, the device depends on the type of device Reset. The Reset value automatically switches to the FRC oscillator and the for the Oscillator Control register, OSCCON, depends user can switch to the desired crystal oscillator in the on the type of Reset and the programmed values of the Trap Service Routine. oscillator Configuration bits in the FOSC Configuration register. 2009-2012 Microchip Technology Inc. DS70593D-page 87
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 88 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 7.0 INTERRUPT CONTROLLER 7.1.1 ALTERNATE VECTOR TABLE The Alternate Interrupt Vector Table (AIVT) is located Note1: This data sheet summarizes the features after the IVT, as shown in Figure7-1. Access to the of the dsPIC33FJXXXGPX06A/X08A/ AIVT is provided by the ALTIVT control bit X10A family of devices. However, it is not (INTCON2<15>). If the ALTIVT bit is set, all interrupt intended to be a comprehensive and exception processes use the alternate vectors reference source. To complement the instead of the default vectors. The alternate vectors are information in this data sheet, refer to organized in the same manner as the default vectors. Section 6. “Interrupts” (DS70184) in the “dsPIC33F/PIC24H Family The AIVT supports debugging by providing a means to Reference Manual”, which is available switch between an application and a support from the Microchip web site environment without requiring the interrupt vectors to (www.microchip.com). be reprogrammed. This feature also enables switching between applications for evaluation of different 2: Some registers and associated bits software algorithms at run time. If the AIVT is not described in this section may not be needed, the AIVT should be programmed with the available on all devices. Refer to same addresses used in the IVT. Section4.0 “Memory Organization” in this data sheet for device-specific register 7.2 Reset Sequence and bit information. A device Reset is not a true exception because the The dsPIC33FJXXXGPX06A/X08A/X10A interrupt interrupt controller is not involved in the Reset process. controller reduces the numerous peripheral interrupt The dsPIC33FJXXXGPX06A/X08A/X10A device request signals to a single interrupt request signal to clears its registers in response to a Reset, which forces the dsPIC33FJXXXGPX06A/X08A/X10A CPU. It has the PC to zero. The digital signal controller then begins the following features: program execution at location 0x000000. The user • Up to eight processor exceptions and software programs a GOTO instruction at the Reset address traps which redirects program execution to the appropriate • Seven user-selectable priority levels start-up routine. • Interrupt Vector Table (IVT) with up to 118 vectors Note: Any unimplemented or unused vector • A unique vector for each interrupt or exception locations in the IVT and AIVT should be source programmed with the address of a default • Fixed priority within a specified user priority level interrupt handler routine that contains a • Alternate Interrupt Vector Table (AIVT) for debug RESET instruction. support • Fixed interrupt entry and return latencies 7.1 Interrupt Vector Table The Interrupt Vector Table is shown in Figure7-1. The IVT resides in program memory, starting at location 000004h. The IVT contains 126 vectors consisting of eightnon-maskable trap vectors plus up to 118 sources of interrupt. In general, each interrupt source has its own vector. Each interrupt vector contains a 24-bit wide address. The value programmed into each interrupt vector location is the starting address of the associated Interrupt Service Routine (ISR). Interrupt vectors are prioritized in terms of their natural priority; this priority is linked to their position in the vector table. All other things being equal, lower addresses have a higher natural priority. For example, the interrupt associated with vector 0 will take priority over interrupts at any other vector address. dsPIC33FJXXXGPX06A/X08A/X10A devices imple- ment up to 67 unique interrupts and five non-maskable traps. These are summarized in Table7-1 and Table7-2. 2009-2012 Microchip Technology Inc. DS70593D-page 89
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 7-1: dsPIC33FJXXXGPX06A/X08A/X10A INTERRUPT VECTOR TABLE Reset – GOTO Instruction 0x000000 Reset – GOTO Address 0x000002 Reserved 0x000004 Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector DMA Error Trap Vector Reserved Reserved Interrupt Vector 0 0x000014 Interrupt Vector 1 ~ ~ ~ Interrupt Vector 52 0x00007C Interrupt Vector Table (IVT)(1) Interrupt Vector 53 0x00007E ority Interrupt ~Vector 54 0x000080 Pri ~ der ~ Or Interrupt Vector 116 0x0000FC al Interrupt Vector 117 0x0000FE atur Reserved 0x000100 N Reserved 0x000102 g n Reserved si a Oscillator Fail Trap Vector e cr Address Error Trap Vector e D Stack Error Trap Vector Math Error Trap Vector DMA Error Trap Vector Reserved Reserved Interrupt Vector 0 0x000114 Interrupt Vector 1 ~ ~ ~ Alternate Interrupt Vector Table (AIVT)(1) Interrupt Vector 52 0x00017C Interrupt Vector 53 0x00017E Interrupt Vector 54 0x000180 ~ ~ ~ Interrupt Vector 116 Interrupt Vector 117 0x0001FE Start of Code 0x000200 Note 1: See Table7-1 for the list of implemented interrupt vectors. DS70593D-page 90 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 7-1: INTERRUPT VECTORS Interrupt Vector Request (IRQ) IVT Address AIVT Address Interrupt Source Number Number 8 0 0x000014 0x000114 INT0 – External Interrupt 0 9 1 0x000016 0x000116 IC1 – Input Capture 1 10 2 0x000018 0x000118 OC1 – Output Compare 1 11 3 0x00001A 0x00011A T1 – Timer1 12 4 0x00001C 0x00011C DMA0 – DMA Channel 0 13 5 0x00001E 0x00011E IC2 – Input Capture 2 14 6 0x000020 0x000120 OC2 – Output Compare 2 15 7 0x000022 0x000122 T2 – Timer2 16 8 0x000024 0x000124 T3 – Timer3 17 9 0x000026 0x000126 SPI1E – SPI1 Error 18 10 0x000028 0x000128 SPI1 – SPI1 Transfer Done 19 11 0x00002A 0x00012A U1RX – UART1 Receiver 20 12 0x00002C 0x00012C U1TX – UART1 Transmitter 21 13 0x00002E 0x00012E ADC1 – ADC 1 22 14 0x000030 0x000130 DMA1 – DMA Channel 1 23 15 0x000032 0x000132 Reserved 24 16 0x000034 0x000134 SI2C1 – I2C1 Slave Events 25 17 0x000036 0x000136 MI2C1 – I2C1 Master Events 26 18 0x000038 0x000138 Reserved 27 19 0x00003A 0x00013A Change Notification Interrupt 28 20 0x00003C 0x00013C INT1 – External Interrupt 1 29 21 0x00003E 0x00013E ADC2 – ADC 2 30 22 0x000040 0x000140 IC7 – Input Capture 7 31 23 0x000042 0x000142 IC8 – Input Capture 8 32 24 0x000044 0x000144 DMA2 – DMA Channel 2 33 25 0x000046 0x000146 OC3 – Output Compare 3 34 26 0x000048 0x000148 OC4 – Output Compare 4 35 27 0x00004A 0x00014A T4 – Timer4 36 28 0x00004C 0x00014C T5 – Timer5 37 29 0x00004E 0x00014E INT2 – External Interrupt 2 38 30 0x000050 0x000150 U2RX – UART2 Receiver 39 31 0x000052 0x000152 U2TX – UART2 Transmitter 40 32 0x000054 0x000154 SPI2E – SPI2 Error 41 33 0x000056 0x000156 SPI1 – SPI1 Transfer Done 42 34 0x000058 0x000158 C1RX – ECAN1 Receive Data Ready 43 35 0x00005A 0x00015A C1 – ECAN1 Event 44 36 0x00005C 0x00015C DMA3 – DMA Channel 3 45 37 0x00005E 0x00015E IC3 – Input Capture 3 46 38 0x000060 0x000160 IC4 – Input Capture 4 47 39 0x000062 0x000162 IC5 – Input Capture 5 48 40 0x000064 0x000164 IC6 – Input Capture 6 49 41 0x000066 0x000166 OC5 – Output Compare 5 50 42 0x000068 0x000168 OC6 – Output Compare 6 51 43 0x00006A 0x00016A OC7 – Output Compare 7 52 44 0x00006C 0x00016C OC8 – Output Compare 8 53 45 0x00006E 0x00016E Reserved 2009-2012 Microchip Technology Inc. DS70593D-page 91
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 7-1: INTERRUPT VECTORS (CONTINUED) Interrupt Vector Request (IRQ) IVT Address AIVT Address Interrupt Source Number Number 54 46 0x000070 0x000170 DMA4 – DMA Channel 4 55 47 0x000072 0x000172 T6 – Timer6 56 48 0x000074 0x000174 T7 – Timer7 57 49 0x000076 0x000176 SI2C2 – I2C2 Slave Events 58 50 0x000078 0x000178 MI2C2 – I2C2 Master Events 59 51 0x00007A 0x00017A T8 – Timer8 60 52 0x00007C 0x00017C T9 – Timer9 61 53 0x00007E 0x00017E INT3 – External Interrupt 3 62 54 0x000080 0x000180 INT4 – External Interrupt 4 63 55 0x000082 0x000182 C2RX – ECAN2 Receive Data Ready 64 56 0x000084 0x000184 C2 – ECAN2 Event 65 57 0x000086 0x000186 Reserved 66 58 0x000088 0x000188 Reserved 67 59 0x00008A 0x00018A DCIE – DCI Error 68 60 0x00008C 0x00018C DCID – DCI Transfer Done 69 61 0x00008E 0x00018E DMA5 – DMA Channel 5 70 62 0x000090 0x000190 Reserved 71 63 0x000092 0x000192 Reserved 72 64 0x000094 0x000194 Reserved 73 65 0x000096 0x000196 U1E – UART1 Error 74 66 0x000098 0x000198 U2E – UART2 Error 75 67 0x00009A 0x00019A Reserved 76 68 0x00009C 0x00019C DMA6 – DMA Channel 6 77 69 0x00009E 0x00019E DMA7 – DMA Channel 7 78 70 0x0000A0 0x0001A0 C1TX – ECAN1 Transmit Data Request 79 71 0x0000A2 0x0001A2 C2TX – ECAN2 Transmit Data Request 80-125 72-117 0x0000A4-0x0000FE 0x0001A4-0x0001FE Reserved TABLE 7-2: TRAP VECTORS Vector Number IVT Address AIVT Address Trap Source 0 0x000004 0x000104 Reserved 1 0x000006 0x000106 Oscillator Failure 2 0x000008 0x000108 Address Error 3 0x00000A 0x00010A Stack Error 4 0x00000C 0x00010C Math Error 5 0x00000E 0x00010E DMA Error Trap 6 0x000010 0x000110 Reserved 7 0x000012 0x000112 Reserved DS70593D-page 92 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 7.3 Interrupt Control and Status The IPC registers are used to set the interrupt priority Registers level for each source of interrupt. Each user interrupt source can be assigned to one of eight priority levels. dsPIC33FJXXXGPX06A/X08A/X10A devices imple- The INTTREG register contains the associated ment a total of 30 registers for the interrupt controller: interrupt vector number and the new CPU interrupt • INTCON1 priority level, which are latched into vector number • INTCON2 (VECNUM<6:0>) and Interrupt level bits (ILR<3:0>) in • IFS0 through IFS4 the INTTREG register. The new interrupt priority level is the priority of the pending interrupt. • IEC0 through IEC4 • IPC0 through IPC17 The interrupt sources are assigned to the IFSx, IECx and IPCx registers in the same sequence that they are • INTTREG listed in Table7-1. For example, the INT0 (External Global interrupt control functions are controlled from Interrupt 0) is shown as having vector number 8 and a INTCON1 and INTCON2. INTCON1 contains the natural order priority of 0. Thus, the INT0IF bit is found Interrupt Nesting Disable (NSTDIS) bit as well as the in IFS0<0>, the INT0IE bit in IEC0<0>, and the INT0IP control and status flags for the processor trap sources. bits in the first position of IPC0 (IPC0<2:0>). The INTCON2 register controls the external interrupt Although they are not specifically part of the interrupt request signal behavior and the use of the Alternate control hardware, two of the CPU Control registers Interrupt Vector Table. contain bits that control interrupt functionality. The CPU The IFS registers maintain all of the interrupt request STATUS register, SR, contains the IPL<2:0> bits flags. Each source of interrupt has a Status bit, which is (SR<7:5>). These bits indicate the current CPU set by the respective peripherals or external signal and interrupt priority level. The user can change the current is cleared via software. CPU priority level by writing to the IPL bits. The IEC registers maintain all of the interrupt enable The CORCON register contains the IPL3 bit which, bits. These control bits are used to individually enable together with IPL<2:0>, also indicates the current CPU interrupts from the peripherals or external signals. priority level. IPL3 is a read-only bit so that trap events cannot be masked by the user software. All Interrupt registers are described in Register7-1 through Register7-32. 2009-2012 Microchip Technology Inc. DS70593D-page 93
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-1: SR: CPU STATUS REGISTER(1) R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0 OA OB SA SB OAB SAB DA DC bit 15 bit 8 R/W-0(3) R/W-0(3) R/W-0(3) R-0 R/W-0 R/W-0 R/W-0 R/W-0 IPL2(2) IPL1(2) IPL0(2) RA N OV Z C bit 7 bit 0 Legend: C = Clear only bit R = Readable bit U = Unimplemented bit, read as ‘0’ S = Set only bit W = Writable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2) 111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled 110 = CPU Interrupt Priority Level is 6 (14) 101 = CPU Interrupt Priority Level is 5 (13) 100 = CPU Interrupt Priority Level is 4 (12) 011 = CPU Interrupt Priority Level is 3 (11) 010 = CPU Interrupt Priority Level is 2 (10) 001 = CPU Interrupt Priority Level is 1 (9) 000 = CPU Interrupt Priority Level is 0 (8) Note 1: For complete register details, see Register3-1. 2: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3>=1. 3: The IPL<2:0> Status bits are read-only when NSTDIS (INTCON1<15>) = 1. REGISTER 7-2: CORCON: CORE CONTROL REGISTER(1) U-0 U-0 U-0 R/W-0 R/W-0 R-0 R-0 R-0 — — — US EDT DL<2:0> bit 15 bit 8 R/W-0 R/W-0 R/W-1 R/W-0 R/C-0 R/W-0 R/W-0 R/W-0 SATA SATB SATDW ACCSAT IPL3(2) PSV RND IF bit 7 bit 0 Legend: C = Clear only bit R = Readable bit W = Writable bit -n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared ‘x = Bit is unknown U = Unimplemented bit, read as ‘0’ bit 3 IPL3: CPU Interrupt Priority Level Status bit 3(2) 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less Note 1: For complete register details, see Register3-2. 2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level. DS70593D-page 94 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-3: INTCON1: INTERRUPT CONTROL REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 SFTACERR DIV0ERR DMACERR MATHERR ADDRERR STKERR OSCFAIL — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 NSTDIS: Interrupt Nesting Disable bit 1 = Interrupt nesting is disabled 0 = Interrupt nesting is enabled bit 14 OVAERR: Accumulator A Overflow Trap Flag bit 1 = Trap was caused by overflow of Accumulator A 0 = Trap was not caused by overflow of Accumulator A bit 13 OVBERR: Accumulator B Overflow Trap Flag bit 1 = Trap was caused by overflow of Accumulator B 0 = Trap was not caused by overflow of Accumulator B bit 12 COVAERR: Accumulator A Catastrophic Overflow Trap Flag bit 1 = Trap was caused by catastrophic overflow of Accumulator A 0 = Trap was not caused by catastrophic overflow of Accumulator A bit 11 COVBERR: Accumulator B Catastrophic Overflow Trap Flag bit 1 = Trap was caused by catastrophic overflow of Accumulator B 0 = Trap was not caused by catastrophic overflow of Accumulator B bit 10 OVATE: Accumulator A Overflow Trap Enable bit 1 = Trap overflow of Accumulator A 0 = Trap disabled bit 9 OVBTE: Accumulator B Overflow Trap Enable bit 1 = Trap overflow of Accumulator B 0 = Trap disabled bit 8 COVTE: Catastrophic Overflow Trap Enable bit 1 = Trap on catastrophic overflow of Accumulator A or B enabled 0 = Trap disabled bit 7 SFTACERR: Shift Accumulator Error Status bit 1 = Math error trap was caused by an invalid accumulator shift 0 = Math error trap was not caused by an invalid accumulator shift bit 6 DIV0ERR: Arithmetic Error Status bit 1 = Math error trap was caused by a divide by zero 0 = Math error trap was not caused by a divide by zero bit 5 DMACERR: DMA Controller Error Status bit 1 = DMA controller error trap has occurred 0 = DMA controller error trap has not occurred bit 4 MATHERR: Arithmetic Error Status bit 1 = Math error trap has occurred 0 = Math error trap has not occurred 2009-2012 Microchip Technology Inc. DS70593D-page 95
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-3: INTCON1: INTERRUPT CONTROL REGISTER 1 (CONTINUED) bit 3 ADDRERR: Address Error Trap Status bit 1 = Address error trap has occurred 0 = Address error trap has not occurred bit 2 STKERR: Stack Error Trap Status bit 1 = Stack error trap has occurred 0 = Stack error trap has not occurred bit 1 OSCFAIL: Oscillator Failure Trap Status bit 1 = Oscillator failure trap has occurred 0 = Oscillator failure trap has not occurred bit 0 Unimplemented: Read as ‘0’ DS70593D-page 96 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-4: INTCON2: INTERRUPT CONTROL REGISTER 2 R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0 ALTIVT DISI — — — — — — bit 15 bit 8 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — INT4EP INT3EP INT2EP INT1EP INT0EP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ALTIVT: Enable Alternate Interrupt Vector Table bit 1 = Use alternate vector table 0 = Use standard (default) vector table bit 14 DISI: DISI Instruction Status bit 1 = DISI instruction is active 0 = DISI instruction is not active bit 13-5 Unimplemented: Read as ‘0’ bit 4 INT4EP: External Interrupt 4 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 3 INT3EP: External Interrupt 3 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 2 INT2EP: External Interrupt 2 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 1 INT1EP: External Interrupt 1 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 0 INT0EP: External Interrupt 0 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge 2009-2012 Microchip Technology Inc. DS70593D-page 97
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-5: IFS0: INTERRUPT FLAG STATUS REGISTER 0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — DMA1IF AD1IF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 T2IF OC2IF IC2IF DMA01IF T1IF OC1IF IC1IF INT0IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14 DMA1IF: DMA Channel 1 Data Transfer Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 13 AD1IF: ADC1 Conversion Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 U1TXIF: UART1 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 U1RXIF: UART1 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 SPI1IF: SPI1 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 SPI1EIF: SPI1 Fault Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 T3IF: Timer3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 T2IF: Timer2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 OC2IF: Output Compare Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 IC2IF: Input Capture Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 DMA01IF: DMA Channel 0 Data Transfer Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 T1IF: Timer1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred DS70593D-page 98 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-5: IFS0: INTERRUPT FLAG STATUS REGISTER 0 (CONTINUED) bit 2 OC1IF: Output Compare Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 IC1IF: Input Capture Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 INT0IF: External Interrupt 0 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred 2009-2012 Microchip Technology Inc. DS70593D-page 99
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-6: IFS1: INTERRUPT FLAG STATUS REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF DMA21IF bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 IC8IF IC7IF AD2IF INT1IF CNIF — MI2C1IF SI2C1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 U2TXIF: UART2 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 14 U2RXIF: UART2 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 13 INT2IF: External Interrupt 2 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 T5IF: Timer5 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 T4IF: Timer4 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 OC4IF: Output Compare Channel 4 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 OC3IF: Output Compare Channel 3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 DMA21IF: DMA Channel 2 Data Transfer Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 IC8IF: Input Capture Channel 8 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 IC7IF: Input Capture Channel 7 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 AD2IF: ADC2 Conversion Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 INT1IF: External Interrupt 1 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred DS70593D-page 100 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-6: IFS1: INTERRUPT FLAG STATUS REGISTER 1 (CONTINUED) bit 3 CNIF: Input Change Notification Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 Unimplemented: Read as ‘0’ bit 1 MI2C1IF: I2C1 Master Events Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred 2009-2012 Microchip Technology Inc. DS70593D-page 101
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-7: IFS2: INTERRUPT FLAG STATUS REGISTER 2 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 T6IF DMA4IF — OC8IF OC7IF OC6IF OC5IF IC6IF bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IC5IF IC4IF IC3IF DMA3IF C1IF C1RXIF SPI2IF SPI2EIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 T6IF: Timer6 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 14 DMA4IF: DMA Channel 4 Data Transfer Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 13 Unimplemented: Read as ‘0’ bit 12 OC8IF: Output Compare Channel 8 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 OC7IF: Output Compare Channel 7 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 OC6IF: Output Compare Channel 6 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 OC5IF: Output Compare Channel 5 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 IC6IF: Input Capture Channel 6 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 IC5IF: Input Capture Channel 5 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 IC4IF: Input Capture Channel 4 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 IC3IF: Input Capture Channel 3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 DMA3IF: DMA Channel 3 Data Transfer Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 C1IF: ECAN1 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred DS70593D-page 102 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-7: IFS2: INTERRUPT FLAG STATUS REGISTER 2 (CONTINUED) bit 2 C1RXIF: ECAN1 Receive Data Ready Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 SPI2IF: SPI2 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 SPI2EIF: SPI2 Error Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred 2009-2012 Microchip Technology Inc. DS70593D-page 103
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-8: IFS3: INTERRUPT FLAG STATUS REGISTER 3 U-0 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 — — DMA5IF DCIIF DCIEIF — — C2IF bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 C2RXIF INT4IF INT3IF T9IF T8IF MI2C2IF SI2C2IF T7IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 DMA5IF: DMA Channel 5 Data Transfer Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 DCIIF: DCI Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 DCIEIF: DCI Error Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10-9 Unimplemented: Read as ‘0’ bit 8 C2IF: ECAN2 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 C2RXIF: ECAN2 Receive Data Ready Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 INT4IF: External Interrupt 4 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 INT3IF: External Interrupt 3 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 T9IF: Timer9 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 T8IF: Timer8 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 MI2C2IF: I2C2 Master Events Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 SI2C2IF: I2C2 Slave Events Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 T7IF: Timer7 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred DS70593D-page 104 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-9: IFS4: INTERRUPT FLAG STATUS REGISTER 4 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 C2TXIF C1TXIF DMA7IF DMA6IF — U2EIF U1EIF — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 C2TXIF: ECAN2 Transmit Data Request Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 C1TXIF: ECAN1 Transmit Data Request Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 DMA7IF: DMA Channel 7 Data Transfer Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 DMA6IF: DMA Channel 6 Data Transfer Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 Unimplemented: Read as ‘0’ bit 2 U2EIF: UART2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 U1EIF: UART1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 Unimplemented: Read as ‘0’ 2009-2012 Microchip Technology Inc. DS70593D-page 105
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-10: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — DMA1IE AD1IE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 T2IE OC2IE IC2IE DMA0IE T1IE OC1IE IC1IE INT0IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14 DMA1IE: DMA Channel 1 Data Transfer Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 13 AD1IE: ADC1 Conversion Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 U1TXIE: UART1 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 U1RXIE: UART1 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 SPI1IE: SPI1 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 SPI1EIE: SPI1 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 T3IE: Timer3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 T2IE: Timer2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 OC2IE: Output Compare Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 IC2IE: Input Capture Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 DMA0IE: DMA Channel 0 Data Transfer Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 T1IE: Timer1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled DS70593D-page 106 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-10: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 (CONTINUED) bit 2 OC1IE: Output Compare Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 1 IC1IE: Input Capture Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 INT0IE: External Interrupt 0 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled 2009-2012 Microchip Technology Inc. DS70593D-page 107
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-11: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE DMA2IE bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 IC8IE IC7IE AD2IE INT1IE CNIE — MI2C1IE SI2C1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 U2TXIE: UART2 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 14 U2RXIE: UART2 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 13 INT2IE: External Interrupt 2 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 T5IE: Timer5 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 T4IE: Timer4 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 OC4IE: Output Compare Channel 4 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 OC3IE: Output Compare Channel 3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 DMA2IE: DMA Channel 2 Data Transfer Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 IC8IE: Input Capture Channel 8 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 IC7IE: Input Capture Channel 7 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 AD2IE: ADC2 Conversion Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 INT1IE: External Interrupt 1 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled DS70593D-page 108 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-11: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1 (CONTINUED) bit 3 CNIE: Input Change Notification Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 Unimplemented: Read as ‘0’ bit 1 MI2C1IE: I2C1 Master Events Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 SI2C1IE: I2C1 Slave Events Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled 2009-2012 Microchip Technology Inc. DS70593D-page 109
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-12: IEC2: INTERRUPT ENABLE CONTROL REGISTER 2 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 T6IE DMA4IE — OC8IE OC7IE OC6IE OC5IE IC6IE bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IC5IE IC4IE IC3IE DMA3IE C1IE C1RXIE SPI2IE SPI2EIE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 T6IE: Timer6 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 14 DMA4IE: DMA Channel 4 Data Transfer Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 13 Unimplemented: Read as ‘0’ bit 12 OC8IE: Output Compare Channel 8 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 OC7IE: Output Compare Channel 7 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 OC6IE: Output Compare Channel 6 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 OC5IE: Output Compare Channel 5 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 IC6IE: Input Capture Channel 6 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 IC5IE: Input Capture Channel 5 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 IC4IE: Input Capture Channel 4 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 IC3IE: Input Capture Channel 3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 DMA3IE: DMA Channel 3 Data Transfer Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 C1IE: ECAN1 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled DS70593D-page 110 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-12: IEC2: INTERRUPT ENABLE CONTROL REGISTER 2 (CONTINUED) bit 2 C1RXIE: ECAN1 Receive Data Ready Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 1 SPI2IE: SPI2 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 SPI2EIE: SPI2 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled 2009-2012 Microchip Technology Inc. DS70593D-page 111
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-13: IEC3: INTERRUPT ENABLE CONTROL REGISTER 3 U-0 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 — — DMA5IE DCIIE DCIEIE — — C2IE bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 C2RXIE INT4IE INT3IE T9IE T8IE MI2C2IE SI2C2IE T7IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 DMA5IE: DMA Channel 5 Data Transfer Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 DCIIE: DCI Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 DCIEIE: DCI Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10-9 Unimplemented: Read as ‘0’ bit 8 C2IE: ECAN2 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 C2RXIE: ECAN2 Receive Data Ready Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 INT4IE: External Interrupt 4 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 INT3IE: External Interrupt 3 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 T9IE: Timer9 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 T8IE: Timer8 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 MI2C2IE: I2C2 Master Events Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 1 SI2C2IE: I2C2 Slave Events Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 T7IE: Timer7 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled DS70593D-page 112 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-14: IEC4: INTERRUPT ENABLE CONTROL REGISTER 4 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 C2TXIE C1TXIE DMA7IE DMA6IE — U2EIE U1EIE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 C2TXIE: ECAN2 Transmit Data Request Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 C1TXIE: ECAN1 Transmit Data Request Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 DMA7IE: DMA Channel 7 Data Transfer Complete Enable Status bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 DMA6IE: DMA Channel 6 Data Transfer Complete Enable Status bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 Unimplemented: Read as ‘0’ bit 2 U2EIE: UART2 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 1 U1EIE: UART1 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 Unimplemented: Read as ‘0’ 2009-2012 Microchip Technology Inc. DS70593D-page 113
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-15: IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T1IP<2:0> — OC1IP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC1IP<2:0> — INT0IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 T1IP<2:0>: Timer1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 INT0IP<2:0>: External Interrupt 0 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70593D-page 114 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-16: IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T2IP<2:0> — OC2IP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC2IP<2:0> — DMA0IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 T2IP<2:0>: Timer2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 DMA0IP<2:0>: DMA Channel 0 Data Transfer Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled 2009-2012 Microchip Technology Inc. DS70593D-page 115
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-17: IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — U1RXIP<2:0> — SPI1IP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — SPI1EIP<2:0> — T3IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 SPI1IP<2:0>: SPI1 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 SPI1EIP<2:0>: SPI1 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 T3IP<2:0>: Timer3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70593D-page 116 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-18: IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3 U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0 — — — — — DMA1IP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — AD1IP<2:0> — U1TXIP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-11 Unimplemented: Read as ‘0’ bit 10-8 DMA1IP<2:0>: DMA Channel 1 Data Transfer Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 AD1IP<2:0>: ADC1 Conversion Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled 2009-2012 Microchip Technology Inc. DS70593D-page 117
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-19: IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — CNIP<2:0> — — — — bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — MI2C1IP<2:0> — SI2C1IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 CNIP<2:0>: Change Notification Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11-7 Unimplemented: Read as ‘0’ bit 6-4 MI2C1IP<2:0>: I2C1 Master Events Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70593D-page 118 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-20: IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC8IP<2:0> — IC7IP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — AD2IP<2:0> — INT1IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 AD2IP<2:0>: ADC2 Conversion Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 INT1IP<2:0>: External Interrupt 1 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled 2009-2012 Microchip Technology Inc. DS70593D-page 119
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-21: IPC6: INTERRUPT PRIORITY CONTROL REGISTER 6 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T4IP<2:0> — OC4IP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — OC3IP<2:0> — DMA2IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 T4IP<2:0>: Timer4 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC4IP<2:0>: Output Compare Channel 4 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 OC3IP<2:0>: Output Compare Channel 3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 DMA2IP<2:0>: DMA Channel 2 Data Transfer Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70593D-page 120 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-22: IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — U2TXIP<2:0> — U2RXIP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — INT2IP<2:0> — T5IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 U2TXIP<2:0>: UART2 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 U2RXIP<2:0>: UART2 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 INT2IP<2:0>: External Interrupt 2 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 T5IP<2:0>: Timer5 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled 2009-2012 Microchip Technology Inc. DS70593D-page 121
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-23: IPC8: INTERRUPT PRIORITY CONTROL REGISTER 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — C1IP<2:0> — C1RXIP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — SPI2IP<2:0> — SPI2EIP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 C1IP<2:0>: ECAN1 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 C1RXIP<2:0>: ECAN1 Receive Data Ready Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 SPI2IP<2:0>: SPI2 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 SPI2EIP<2:0>: SPI2 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70593D-page 122 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-24: IPC9: INTERRUPT PRIORITY CONTROL REGISTER 9 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC5IP<2:0> — IC4IP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC3IP<2:0> — DMA3IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 IC5IP<2:0>: Input Capture Channel 5 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 IC4IP<2:0>: Input Capture Channel 4 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC3IP<2:0>: Input Capture Channel 3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 DMA3IP<2:0>: DMA Channel 3 Data Transfer Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled 2009-2012 Microchip Technology Inc. DS70593D-page 123
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-25: IPC10: INTERRUPT PRIORITY CONTROL REGISTER 10 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — OC7IP<2:0> — OC6IP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — OC5IP<2:0> — IC6IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 OC7IP<2:0>: Output Compare Channel 7 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC6IP<2:0>: Output Compare Channel 6 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 OC5IP<2:0>: Output Compare Channel 5 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 IC6IP<2:0>: Input Capture Channel 6 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70593D-page 124 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-26: IPC11: INTERRUPT PRIORITY CONTROL REGISTER 11 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T6IP<2:0> — DMA4IP<2:0> bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0 — — — — — OC8IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 T6IP<2:0>: Timer6 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 DMA4IP<2:0>: DMA Channel 4 Data Transfer Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 OC8IP<2:0>: Output Compare Channel 8 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled 2009-2012 Microchip Technology Inc. DS70593D-page 125
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-27: IPC12: INTERRUPT PRIORITY CONTROL REGISTER 12 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T8IP<2:0> — MI2C2IP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — SI2C2IP<2:0> — T7IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 T8IP<2:0>: Timer8 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 MI2C2IP<2:0>: I2C2 Master Events Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 SI2C2IP<2:0>: I2C2 Slave Events Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 T7IP<2:0>: Timer7 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70593D-page 126 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-28: IPC13: INTERRUPT PRIORITY CONTROL REGISTER 13 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — C2RXIP<2:0> — INT4IP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — INT3IP<2:0> — T9IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 C2RXIP<2:0>: ECAN2 Receive Data Ready Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 INT4IP<2:0>: External Interrupt 4 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 INT3IP<2:0>: External Interrupt 3 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 T9IP<2:0>: Timer9 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled 2009-2012 Microchip Technology Inc. DS70593D-page 127
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-29: IPC14: INTERRUPT PRIORITY CONTROL REGISTER 14 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — DCIEIP<2:0> — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0 — — — — — C2IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 DCIEIP<2:0>: DCI Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11-3 Unimplemented: Read as ‘0’ bit 2-0 C2IP<2:0>: ECAN2 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70593D-page 128 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-30: IPC15: INTERRUPT PRIORITY CONTROL REGISTER 15 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — DMA5IP<2:0> — DCIIP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-7 Unimplemented: Read as ‘0’ bit 6-4 DMA5IP<2:0>: DMA Channel 5 Data Transfer Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 DCIIP<2:0>: DCI Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled 2009-2012 Microchip Technology Inc. DS70593D-page 129
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 7-31: IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16 U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0 — — — — — U2EIP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — U1EIP<2:0> — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-11 Unimplemented: Read as ‘0’ bit 10-8 U2EIP<2:0>: UART2 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 U1EIP<2:0>: UART1 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’ DS70593D-page 130 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-32: IPC17: INTERRUPT PRIORITY CONTROL REGISTER 17 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — C2TXIP<2:0> — C1TXIP<2:0> bit 15 bit 8 U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — DMA7IP<2:0> — DMA6IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 C2TXIP<2:0>: ECAN2 Transmit Data Request Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 C1TXIP<2:0>: ECAN1 Transmit Data Request Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 DMA7IP<2:0>: DMA Channel 7 Data Transfer Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 DMA6IP<2:0>: DMA Channel 6 Data Transfer Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled 2009-2012 Microchip Technology Inc. DS70593D-page 131
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 7-33: INTTREG: INTERRUPT CONTROL AND STATUS REGISTER U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0 — — — — ILR<3:0> bit 15 bit 8 U-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 — VECNUM<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 Unimplemented: Read as ‘0’ bit 11-8 ILR<3:0>: New CPU Interrupt Priority Level bits 1111 = CPU Interrupt Priority Level is 15 • • • 0001 = CPU Interrupt Priority Level is 1 0000 = CPU Interrupt Priority Level is 0 bit 7 Unimplemented: Read as ‘0’ bit 6-0 VECNUM<6:0>: Vector Number of Pending Interrupt bits 0111111 = Interrupt Vector pending is number 135 • • • 0000001 = Interrupt Vector pending is number 9 0000000 = Interrupt Vector pending is number 8 DS70593D-page 132 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 7.4 Interrupt Setup Procedures 7.4.3 TRAP SERVICE ROUTINE A Trap Service Routine (TSR) is coded like an ISR, 7.4.1 INITIALIZATION except that the appropriate trap status flag in the To configure an interrupt source: INTCON1 register must be cleared to avoid re-entry into the TSR. 1. Set the NSTDIS bit (INTCON1<15>) if nested interrupts are not desired. 7.4.4 INTERRUPT DISABLE 2. Select the user-assigned priority level for the All user interrupts can be disabled using the following interrupt source by writing the control bits in the procedure: appropriate IPCx register. The priority level will depend on the specific application and type of 1. Push the current SR value onto the software interrupt source. If multiple priority levels are not stack using the PUSH instruction. desired, the IPCx register control bits for all 2. Force the CPU to priority level 7 by inclusive enabled interrupt sources may be programmed ORing the value OEh with SRL. to the same non-zero value. To enable user interrupts, the POP instruction may be Note: At a device Reset, the IPCx registers are used to restore the previous SR value. initialized, such that all user interrupt Note that only user interrupts with a priority level of 7 or sources are assigned to priority level 4. less can be disabled. Trap sources (level 8-level 15) 3. Clear the interrupt flag status bit associated with cannot be disabled. the peripheral in the associated IFSx register. The DISI instruction provides a convenient way to 4. Enable the interrupt source by setting the disable interrupts of priority levels 1-6 for a fixed period interrupt enable control bit associated with the of time. Level 7 interrupt sources are not disabled by source in the appropriate IECx register. the DISI instruction. 7.4.2 INTERRUPT SERVICE ROUTINE The method that is used to declare an ISR and initialize the IVT with the correct vector address will depend on the programming language (i.e., C or assembler) and the language development toolsuite that is used to develop the application. In general, the user must clear the interrupt flag in the appropriate IFSx register for the source of interrupt that the ISR handles. Otherwise, the ISR will be re-entered immediately after exiting the routine. If the ISR is coded in assembly language, it must be terminated using a RETFIE instruction to unstack the saved PC value, SRL value and old CPU priority level. 2009-2012 Microchip Technology Inc. DS70593D-page 133
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 134 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 8.0 DIRECT MEMORY ACCESS TABLE 8-1: PERIPHERALS WITH DMA (DMA) SUPPORT Peripheral IRQ Number Note1: This data sheet summarizes the features INT0 0 of the dsPIC33FJXXXGPX06A/X08A/ Input Capture 1 1 X10A family of devices. However, it is not intended to be a comprehensive refer- Input Capture 2 5 ence source. To complement the infor- Output Compare 1 2 mation in this data sheet, refer to Section Output Compare 2 6 22. “Direct Memory Access (DMA)” Timer2 7 (DS70182) in the “dsPIC33F/PIC24H Timer3 8 Family Reference Manual”, which is SPI1 10 available from the Microchip web site SPI2 33 (www.microchip.com). UART1 Reception 11 2: Some registers and associated bits UART1 Transmission 12 described in this section may not be UART2 Reception 30 available on all devices. Refer to UART2 Transmission 31 Section4.0 “Memory Organization” in ADC1 13 this data sheet for device-specific register ADC2 21 and bit information. DCI 60 Direct Memory Access (DMA) is a very efficient ECAN1 Reception 34 mechanism of copying data between peripheral SFRs ECAN1 Transmission 70 (e.g., UART Receive register, Input Capture 1 buffer), ECAN2 Reception 55 and buffers or variables stored in RAM, with minimal ECAN2 Transmission 71 CPU intervention. The DMA controller can The DMA controller features eight identical data automatically copy entire blocks of data without transfer channels. requiring the user software to read or write the peripheral Special Function Registers (SFRs) every Each channel has its own set of control and status reg- time a peripheral interrupt occurs. The DMA controller isters. Each DMA channel can be configured to copy uses a dedicated bus for data transfers and therefore, data either from buffers stored in dual port DMA RAM does not steal cycles from the code execution flow of to peripheral SFRs, or from peripheral SFRs to buffers the CPU. To exploit the DMA capability, the in DMA RAM. corresponding user buffers or variables must be The DMA controller supports the following features: located in DMA RAM. • Word or byte sized data transfers The dsPIC33FJXXXGPX06A/X08A/X10A peripherals • Transfers from peripheral to DMA RAM or DMA that can utilize DMA are listed in Table8-1 along with RAM to peripheral their associated Interrupt Request (IRQ) numbers. • Indirect Addressing of DMA RAM locations with or without automatic post-increment • Peripheral Indirect Addressing – In some peripherals, the DMA RAM read/write addresses may be partially derived from the peripheral • One-Shot Block Transfers – Terminating DMA transfer after one block transfer • Continuous Block Transfers – Reloading DMA RAM buffer start address after every block transfer is complete • Ping-Pong Mode – Switching between two DMA RAM start addresses between successive block transfers, thereby filling two buffers alternately • Automatic or manual initiation of block transfers • Each channel can select from 20 possible sources of data sources or destinations For each DMA channel, a DMA interrupt request is generated when a block transfer is complete. Alternatively, an interrupt can be generated when half of the block has been filled. 2009-2012 Microchip Technology Inc. DS70593D-page 135
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 8-1: TOP LEVEL SYSTEM ARCHITECTURE USING A DEDICATED TRANSACTION BUS Peripheral Indirect Address DMA Controller DMA SRAM DMA RAM MAntrol ChDaMnAnels PerRipehaedrayl 3 Do C PORT1 PORT2 CPU DMA SRAM X-Bus DMA DS Bus CPU Peripheral DS Bus CPU DMA CPU DMA Non-DMA DMA DMA CPU Ready Ready Ready Peripheral Peripheral 1 Peripheral 2 Note: CPU and DMA address buses are not shown for clarity. 8.1 DMAC Registers Each DMAC Channel x (x = 0, 1, 2, 3, 4, 5, 6 or 7) contains the following registers: • A 16-bit DMA Channel Control register (DMAxCON) • A 16-bit DMA Channel IRQ Select register (DMAxREQ) • A 16-bit DMA RAM Primary Start Address Offset register (DMAxSTA) • A 16-bit DMA RAM Secondary Start Address Offset register (DMAxSTB) • A 16-bit DMA Peripheral Address register (DMAxPAD) • A 10-bit DMA Transfer Count register (DMAxCNT) An additional pair of status registers, DMACS0 and DMACS1, are common to all DMAC channels. DS70593D-page 136 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 8-1: DMAxCON: DMA CHANNEL x CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 CHEN SIZE DIR HALF NULLW — — — bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 — — AMODE<1:0> — — MODE<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 CHEN: Channel Enable bit 1 = Channel enabled 0 = Channel disabled bit 14 SIZE: Data Transfer Size bit 1 = Byte 0 = Word bit 13 DIR: Transfer Direction bit (source/destination bus select) 1 = Read from DMA RAM address, write to peripheral address 0 = Read from peripheral address, write to DMA RAM address bit 12 HALF: Early Block Transfer Complete Interrupt Select bit 1 = Initiate block transfer complete interrupt when half of the data has been moved 0 = Initiate block transfer complete interrupt when all of the data has been moved bit 11 NULLW: Null Data Peripheral Write Mode Select bit 1 = Null data write to peripheral in addition to DMA RAM write (DIR bit must also be clear) 0 = Normal operation bit 10-6 Unimplemented: Read as ‘0’ bit 5-4 AMODE<1:0>: DMA Channel Operating Mode Select bits 11 = Reserved 10 = Peripheral Indirect Addressing mode 01 = Register Indirect without Post-Increment mode 00 = Register Indirect with Post-Increment mode bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 MODE<1:0>: DMA Channel Operating Mode Select bits 11 = One-Shot, Ping-Pong modes enabled (one block transfer from/to each DMA RAM buffer) 10 = Continuous, Ping-Pong modes enabled 01 = One-Shot, Ping-Pong modes disabled 00 = Continuous, Ping-Pong modes disabled 2009-2012 Microchip Technology Inc. DS70593D-page 137
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 8-2: DMAxREQ: DMA CHANNEL x IRQ SELECT REGISTER R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 FORCE(1) — — — — — — — bit 15 bit 8 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — IRQSEL6(2) IRQSEL5(2) IRQSEL4(2) IRQSEL3(2) IRQSEL2(2) IRQSEL1(2) IRQSEL0(2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 FORCE: Force DMA Transfer bit(1) 1 = Force a single DMA transfer (Manual mode) 0 = Automatic DMA transfer initiation by DMA request bit 14-7 Unimplemented: Read as ‘0’ bit 6-0 IRQSEL<6:0>: DMA Peripheral IRQ Number Select bits(2) 1111111 = DMAIRQ127 selected to be Channel DMAREQ • • • 0000000 = DMAIRQ0 selected to be Channel DMAREQ Note 1: The FORCE bit cannot be cleared by the user. The FORCE bit is cleared by hardware when the forced DMA transfer is complete. 2: Please see Table8-1 for a complete listing of IRQ numbers for all interrupt sources. DS70593D-page 138 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 8-3: DMAxSTA: DMA CHANNEL x RAM START ADDRESS OFFSET REGISTER A R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 STA<15:8> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 STA<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 STA<15:0>: Primary DMA RAM Start Address bits (source or destination) REGISTER 8-4: DMAxSTB: DMA CHANNEL x RAM START ADDRESS OFFSET REGISTER B R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 STB<15:8> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 STB<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 STB<15:0>: Secondary DMA RAM Start Address bits (source or destination) 2009-2012 Microchip Technology Inc. DS70593D-page 139
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 8-5: DMAxPAD: DMA CHANNEL x PERIPHERAL ADDRESS REGISTER(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PAD<15:8> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PAD<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 PAD<15:0>: Peripheral Address Register bits Note 1: If the channel is enabled (i.e., active), writes to this register may result in unpredictable behavior of the DMA channel and should be avoided. REGISTER 8-6: DMAxCNT: DMA CHANNEL x TRANSFER COUNT REGISTER(1) U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — CNT<9:8>(2) bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CNT<7:0>(2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-10 Unimplemented: Read as ‘0’ bit 9-0 CNT<9:0>: DMA Transfer Count Register bits(2) Note 1: If the channel is enabled (i.e., active), writes to this register may result in unpredictable behavior of the DMA channel and should be avoided. 2: Number of DMA transfers = CNT<9:0> + 1. DS70593D-page 140 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 8-7: DMACS0: DMA CONTROLLER STATUS REGISTER 0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 PWCOL7 PWCOL6 PWCOL5 PWCOL4 PWCOL3 PWCOL2 PWCOL1 PWCOL0 bit 15 bit 8 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 XWCOL7 XWCOL6 XWCOL5 XWCOL4 XWCOL3 XWCOL2 XWCOL1 XWCOL0 bit 7 bit 0 Legend: C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 PWCOL7: Channel 7 Peripheral Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 14 PWCOL6: Channel 6 Peripheral Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 13 PWCOL5: Channel 5 Peripheral Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 12 PWCOL4: Channel 4 Peripheral Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 11 PWCOL3: Channel 3 Peripheral Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 10 PWCOL2: Channel 2 Peripheral Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 9 PWCOL1: Channel 1 Peripheral Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 8 PWCOL0: Channel 0 Peripheral Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 7 XWCOL7: Channel 7 DMA RAM Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 6 XWCOL6: Channel 6 DMA RAM Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 5 XWCOL5: Channel 5 DMA RAM Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 4 XWCOL4: Channel 4 DMA RAM Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected 2009-2012 Microchip Technology Inc. DS70593D-page 141
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 8-7: DMACS0: DMA CONTROLLER STATUS REGISTER 0 (CONTINUED) bit 3 XWCOL3: Channel 3 DMA RAM Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 2 XWCOL2: Channel 2 DMA RAM Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 1 XWCOL1: Channel 1 DMA RAM Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected bit 0 XWCOL0: Channel 0 DMA RAM Write Collision Flag bit 1 = Write collision detected 0 = No write collision detected DS70593D-page 142 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 8-8: DMACS1: DMA CONTROLLER STATUS REGISTER 1 U-0 U-0 U-0 U-0 R-1 R-1 R-1 R-1 — — — — LSTCH<3:0> bit 15 bit 8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 PPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 Unimplemented: Read as ‘0’ bit 11-8 LSTCH<3:0>: Last DMA Channel Active bits 1111 = No DMA transfer has occurred since system Reset 1110-1000 = Reserved 0111 = Last data transfer was by DMA Channel 7 0110 = Last data transfer was by DMA Channel 6 0101 = Last data transfer was by DMA Channel 5 0100 = Last data transfer was by DMA Channel 4 0011 = Last data transfer was by DMA Channel 3 0010 = Last data transfer was by DMA Channel 2 0001 = Last data transfer was by DMA Channel 1 0000 = Last data transfer was by DMA Channel 0 bit 7 PPST7: Channel 7 Ping-Pong Mode Status Flag bit 1 = DMA7STB register selected 0 = DMA7STA register selected bit 6 PPST6: Channel 6 Ping-Pong Mode Status Flag bit 1 = DMA6STB register selected 0 = DMA6STA register selected bit 5 PPST5: Channel 5 Ping-Pong Mode Status Flag bit 1 = DMA5STB register selected 0 = DMA5STA register selected bit 4 PPST4: Channel 4 Ping-Pong Mode Status Flag bit 1 = DMA4STB register selected 0 = DMA4STA register selected bit 3 PPST3: Channel 3 Ping-Pong Mode Status Flag bit 1 = DMA3STB register selected 0 = DMA3STA register selected bit 2 PPST2: Channel 2 Ping-Pong Mode Status Flag bit 1 = DMA2STB register selected 0 = DMA2STA register selected bit 1 PPST1: Channel 1 Ping-Pong Mode Status Flag bit 1 = DMA1STB register selected 0 = DMA1STA register selected bit 0 PPST0: Channel 0 Ping-Pong Mode Status Flag bit 1 = DMA0STB register selected 0 = DMA0STA register selected 2009-2012 Microchip Technology Inc. DS70593D-page 143
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 8-9: DSADR: MOST RECENT DMA RAM ADDRESS R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 DSADR<15:8> bit 15 bit 8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 DSADR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 DSADR<15:0>: Most Recent DMA RAM Address Accessed by DMA Controller bits DS70593D-page 144 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 9.0 OSCILLATOR The dsPIC33FJXXXGPX06A/X08A/X10A oscillator CONFIGURATION system provides: • Various external and internal oscillator options as Note1: This data sheet summarizes the clock sources features of the dsPIC33FJXXXGPX06A/ • An on-chip PLL to scale the internal operating X08A/X10A family of devices. However, frequency to the required system clock frequency it is not intended to be a • The internal FRC oscillator can also be used with comprehensive reference source. To the PLL, thereby allowing full-speed operation complement the information in this data without any external clock generation hardware sheet, refer to Section 7. “Oscillator” • Clock switching between various clock sources (DS70186) in the “dsPIC33F/PIC24H Family Reference Manual”, which is • Programmable clock postscaler for system power available from the Microchip web site savings (www.microchip.com). • A Fail-Safe Clock Monitor (FSCM) that detects clock failure and takes fail-safe measures 2: Some registers and associated bits described in this section may not be • An Oscillator Control register (OSCCON) available on all devices. Refer to • Nonvolatile Configuration bits for main oscillator Section4.0 “Memory Organization” in selection this data sheet for device-specific register A simplified diagram of the oscillator system is shown and bit information. in Figure9-1. FIGURE 9-1: dsPIC33FJXXXGPX06A/X08A/X10A OSCILLATOR SYSTEM DIAGRAM Primary Oscillator OSC1 XT, HS, EC DOZE<2:0> S2 R(2) S3 XTPLL, HSPLL, S1 PLL(1) ECPLL, FRCPLL S1/S3 ZE FCY O OSC2 D POSCMD<1:0> FP(3) OsFcRillCator CDIV FRCDIVN S7 ÷ 2 R FOSC F FRCDIV<2:0> TUN<5:0> FRCDIV16 S6 ÷ 16 FRC S0 LPRC LPRC S5 Oscillator Secondary Oscillator SOSC SOSCO S4 LPOSCEN SOSCI Clock Fail Clock Switch Reset S7 NOSC<2:0> FNOSC<2:0> WDT, PWRT, FSCM Timer 1 Note 1: See Figure9-2 for PLL details. 2: If the Oscillator is used with XT or HS modes, an extended parallel resistor with the value of 1 M must be connected. 3: The term, FP refers to the clock source for all the peripherals, while FCY refers to the clock source for the CPU. Throughout this document FP and FCY are used interchangeably, except in the case of Doze mode. FP and FCY will be different when Doze mode is used in any ratio other than 1:1, which is the default. 2009-2012 Microchip Technology Inc. DS70593D-page 145
dsPIC33FJXXXGPX06A/X08A/X10A 9.1 CPU Clocking System Oscillator Mode Select Configuration bits, POSCMD<1:0> (FOSC<1:0>), select the oscillator There are seven system clock options provided by the source that is used at a Power-on Reset. The FRC dsPIC33FJXXXGPX06A/X08A/X10A: primary oscillator is the default (unprogrammed) • FRC Oscillator selection. • FRC Oscillator with PLL The Configuration bits allow users to choose between • Primary (XT, HS or EC) Oscillator twelve different clock modes, shown in Table9-1. • Primary Oscillator with PLL The output of the oscillator (or the output of the PLL if • Secondary (LP) Oscillator a PLL mode has been selected) FOSC is divided by 2 to • LPRC Oscillator generate the device instruction clock (FCY) and the peripheral clock time base (FP). FCY defines the • FRC Oscillator with postscaler operating speed of the device, and speeds up to 40 9.1.1 SYSTEM CLOCK SOURCES MHz are supported by the dsPIC33FJXXXGPX06A/ X08A/X10A architecture. The FRC (Fast RC) internal oscillator runs at a nominal frequency of 7.37 MHz. The user software can tune the Instruction execution speed or device operating FRC frequency. User software can optionally specify a frequency, FCY, is given by: factor (ranging from 1:2 to 1:256) by which the FRC EQUATION 9-1: DEVICE OPERATING clock frequency is divided. This factor is selected using FREQUENCY the FRCDIV<2:0> (CLKDIV<10:8>) bits. The primary oscillator can use one of the following as FOSC FCY = ------------- its clock source: 2 • XT (Crystal): Crystals and ceramic resonators in the range of 3 MHz to 10 MHz. The crystal is con- 9.1.3 PLL CONFIGURATION nected to the OSC1 and OSC2 pins. The primary oscillator and internal FRC oscillator can • HS (High-Speed Crystal): Crystals in the range of optionally use an on-chip PLL to obtain higher speeds 10 MHz to 40 MHz. The crystal is connected to of operation. The PLL provides a significant amount of the OSC1 and OSC2 pins. flexibility in selecting the device operating speed. A • EC (External Clock): External clock signal is block diagram of the PLL is shown in Figure9-2. directly applied to the OSC1 pin. The output of the primary oscillator or FRC, denoted as The secondary (LP) oscillator is designed for low power ‘FIN’, is divided down by a prescale factor (N1) of 2, 3, and uses a 32.768 kHz crystal or ceramic resonator. ... or 33 before being provided to the PLL’s Voltage The LP oscillator uses the SOSCI and SOSCO pins. Controlled Oscillator (VCO). The input to the VCO must be selected to be in the range of 0.8 MHz to 8 MHz. The LPRC (Low-Power RC) internal oscillator runs at a Since the minimum prescale factor is 2, this implies that nominal frequency of 32.768 kHz. It is also used as a FIN must be chosen to be in the range of 1.6 MHz to 16 reference clock by the Watchdog Timer (WDT) and MHz. The prescale factor ‘N1’ is selected using the Fail-Safe Clock Monitor (FSCM). PLLPRE<4:0> bits (CLKDIV<4:0>). The clock signals generated by the FRC and primary The PLL Feedback Divisor, selected using the oscillators can be optionally applied to an on-chip PLLDIV<8:0> bits (PLLFBD<8:0>), provides a factor ‘M’, Phase-Locked Loop (PLL) to provide a wide range of by which the input to the VCO is multiplied. This factor output frequencies for device operation. PLL must be selected such that the resulting VCO output configuration is described in Section9.1.3 “PLL frequency is in the range of 100 MHz to 200 MHz. Configuration”. The VCO output is further divided by a postscale factor The FRC frequency depends on the FRC accuracy ‘N2’. This factor is selected using the PLLPOST<1:0> (see Table25-19) and the value of the FRC Oscillator bits (CLKDIV<7:6>). ‘N2’ can be either 2, 4 or 8, and Tuning register (see Register9-4). must be selected such that the PLL output frequency 9.1.2 SYSTEM CLOCK SELECTION (FOSC) is in the range of 12.5 MHz to 80 MHz, which generates device operating speeds of 6.25-40 MIPS. The oscillator source that is used at a device Power-on Reset event is selected using Configuration bit settings. For a primary oscillator or FRC oscillator, output ‘FIN’, The oscillator Configuration bit settings are located in the the PLL output ‘FOSC’ is given by: Configuration registers in the program memory. (Refer to Section22.1 “Configuration Bits” for further details.) EQUATION 9-2: FOSC CALCULATION The Initial Oscillator Selection Configuration bits, M FNOSC<2:0> (FOSCSEL<2:0>), and the Primary FOSC = FINN-----1-------N-----2-- DS70593D-page 146 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A For example, suppose a 10 MHz crystal is being used, EQUATION 9-3: XT WITH PLL MODE with “XT with PLL” being the selected oscillator mode. EXAMPLE If PLLPRE<4:0> = 0, then N1 = 2. This yields a VCO input of 10/2 = 5 MHz, which is within the acceptable FOSC 11000000032 range of 0.8-8 MHz. If PLLDIV<8:0> = 0x1E, then FCY = ------2------- = 2---------------2--------2-------------- = 40 MIPS M = 32. This yields a VCO output of 5 x 32 = 160 MHz, which is within the 100-200 MHz range needed. If PLLPOST<1:0> = 0, then N2 = 2. This provides a Fosc of 160/2 = 80 MHz. The resultant device operating speed is 80/2 = 40 MIPS. FIGURE 9-2: dsPIC33FJXXXGPX06A/X08A/X10A PLL BLOCK DIAGRAM FVCO 0.8-8.0 MHz 12.5-80 MHz Here(1) 100H-2e0re0( 1M)Hz Here(1) Source (Crystal, External Clock or Internal RC) PLLPRE X VCO PLLPOST FOSC PLLDIV N1 N2 Divide by Divide by 2-33 M 2, 4, 8 Divide by 2-513 Note1: This frequency range must be satisfied at all times. TABLE 9-1: CONFIGURATION BIT VALUES FOR CLOCK SELECTION Oscillator Mode Oscillator Source POSCMD<1:0> FNOSC<2:0> See Note Fast RC Oscillator with Divide-by-N Internal xx 111 1, 2 (FRCDIVN) Fast RC Oscillator with Divide-by-16 Internal xx 110 1 (FRCDIV16) Low-Power RC Oscillator (LPRC) Internal xx 101 1 Secondary (Timer1) Oscillator (Sosc) Secondary xx 100 1 Primary Oscillator (HS) with PLL Primary 10 011 — (HSPLL) Primary Oscillator (XT) with PLL Primary 01 011 — (XTPLL) Primary Oscillator (EC) with PLL Primary 00 011 1 (ECPLL) Primary Oscillator (HS) Primary 10 010 — Primary Oscillator (XT) Primary 01 010 — Primary Oscillator (EC) Primary 00 010 1 Fast RC Oscillator with PLL (FRCPLL) Internal xx 001 1 Fast RC Oscillator (FRC) Internal xx 000 1 Note 1: OSC2 pin function is determined by the OSCIOFNC Configuration bit. 2: This is the default oscillator mode for an unprogrammed (erased) device. 2009-2012 Microchip Technology Inc. DS70593D-page 147
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 9-1: OSCCON: OSCILLATOR CONTROL REGISTER(1,3) U-0 R-0 R-0 R-0 U-0 R/W-y R/W-y R/W-y — COSC<2:0> — NOSC<2:0>(2) bit 15 bit 8 R/W-0 U-0 R-0 U-0 R/C-0 U-0 R/W-0 R/W-0 CLKLOCK — LOCK — CF — LPOSCEN OSWEN bit 7 bit 0 Legend: y = Value set from Configuration bits on POR C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 COSC<2:0>: Current Oscillator Selection bits (read-only) 111 = Fast RC oscillator (FRC) with Divide-by-N 110 = Fast RC oscillator (FRC) with Divide-by-16 101 = Low-Power RC oscillator (LPRC) 100 = Secondary oscillator (Sosc) 011 = Primary oscillator (XT, HS, EC) with PLL 010 = Primary oscillator (XT, HS, EC) 001 = Fast RC Oscillator (FRC) with Divide-by-N and PLL (FRCDIVN + PLL) 000 = Fast RC oscillator (FRC) bit 11 Unimplemented: Read as ‘0’ bit 10-8 NOSC<2:0>: New Oscillator Selection bits(2) 111 = Fast RC oscillator (FRC) with Divide-by-N 110 = Fast RC oscillator (FRC) with Divide-by-16 101 = Low-Power RC oscillator (LPRC) 100 = Secondary oscillator (Sosc) 011 = Primary oscillator (XT, HS, EC) with PLL 010 = Primary oscillator (XT, HS, EC) 001 = Fast RC Oscillator (FRC) with Divide-by-N and PLL (FRCDIVN + PLL) 000 = Fast RC oscillator (FRC) bit 7 CLKLOCK: Clock Lock Enable bit 1 = If (FCKSM0=1), then clock and PLL configurations are locked If (FCKSM0=0), then clock and PLL configurations may be modified 0 = Clock and PLL selections are not locked, configurations may be modified bit 6 Unimplemented: Read as ‘0’ bit 5 LOCK: PLL Lock Status bit (read-only) 1 = Indicates that PLL is in lock, or PLL start-up timer is satisfied 0 = Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled bit 4 Unimplemented: Read as ‘0’ bit 3 CF: Clock Fail Detect bit (read/clear by application) 1 = FSCM has detected clock failure 0 = FSCM has not detected clock failure bit 2 Unimplemented: Read as ‘0’ Note 1: Writes to this register require an unlock sequence. Refer to Section 7. “Oscillator” (DS70186) in the “dsPIC33F/PIC24H Family Reference Manual” for details. 2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted. This applies to clock switches in either direction. In these instances, the application must switch to FRC mode as a transition clock source between the two PLL modes. 3: This is register is reset only on a Power-on Reset (POR). DS70593D-page 148 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 9-1: OSCCON: OSCILLATOR CONTROL REGISTER(1,3) (CONTINUED) bit 1 LPOSCEN: Secondary (LP) Oscillator Enable bit 1 = Enable secondary oscillator 0 = Disable secondary oscillator bit 0 OSWEN: Oscillator Switch Enable bit 1 = Request oscillator switch to selection specified by NOSC<2:0> bits 0 = Oscillator switch is complete Note 1: Writes to this register require an unlock sequence. Refer to Section 7. “Oscillator” (DS70186) in the “dsPIC33F/PIC24H Family Reference Manual” for details. 2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted. This applies to clock switches in either direction. In these instances, the application must switch to FRC mode as a transition clock source between the two PLL modes. 3: This is register is reset only on a Power-on Reset (POR). 2009-2012 Microchip Technology Inc. DS70593D-page 149
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 9-2: CLKDIV: CLOCK DIVISOR REGISTER(2) R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 ROI DOZE<2:0> DOZEN(1) FRCDIV<2:0> bit 15 bit 8 R/W-0 R/W-1 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PLLPOST<1:0> — PLLPRE<4:0> bit 7 bit 0 Legend: y = Value set from Configuration bits on POR R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ROI: Recover on Interrupt bit 1 = Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1 0 = Interrupts have no effect on the DOZEN bit bit 14-12 DOZE<2:0>: Processor Clock Reduction Select bits 111 = FCY/128 110 = FCY/64 101 = FCY/32 100 = FCY/16 011 = FCY/8 (default) 010 = FCY/4 001 = FCY/2 000 = FCY/1 bit 11 DOZEN: DOZE Mode Enable bit(1) 1 = DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks 0 = Processor clock/peripheral clock ratio forced to 1:1 bit 10-8 FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits 111 = FRC divide by 256 110 = FRC divide by 64 101 = FRC divide by 32 100 = FRC divide by 16 011 = FRC divide by 8 010 = FRC divide by 4 001 = FRC divide by 2 000 = FRC divide by 1 (default) bit 7-6 PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as ‘N2’, PLL postscaler) 11 = Output/8 10 = Reserved 01 = Output/4 (default) 00 = Output/2 bit 5 Unimplemented: Read as ‘0’ bit 4-0 PLLPRE<4:0>: PLL Phase Detector Input Divider bits (also denoted as ‘N1’, PLL prescaler) 11111 = Input/33 • • • 00001 = Input/3 00000 = Input/2 (default) Note 1: This bit is cleared when the ROI bit is set and an interrupt occurs. 2: This is register is reset only on a Power-on Reset (POR). DS70593D-page 150 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 9-3: PLLFBD: PLL FEEDBACK DIVISOR REGISTER(1) U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0(1) — — — — — — — PLLDIV<8> bit 15 bit 8 R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 PLLDIV<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-9 Unimplemented: Read as ‘0’ bit 8-0 PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as ‘M’, PLL multiplier) 111111111 = 513 • • • 000110000 = 50 (default) • • • 000000010 = 4 000000001 = 3 000000000 = 2 Note 1: This is register is reset only on a Power-on Reset (POR). 2009-2012 Microchip Technology Inc. DS70593D-page 151
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 9-4: OSCTUN: FRC OSCILLATOR TUNING REGISTER(2) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — TUN<5:0>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-6 Unimplemented: Read as ‘0’ bit 5-0 TUN<5:0>: FRC Oscillator Tuning bits(1) 111111 = Center frequency - 0.375% (7.345 MHz) • • • 100001 = Center frequency - 11.625% (6.52 MHz) 100000 = Center frequency - 12% (6.49 MHz) 011111 = Center frequency + 11.625% (8.23 MHz) 011110 = Center frequency + 11.25% (8.20 MHz) • • • 000001 = Center frequency + 0.375% (7.40 MHz) 000000 = Center frequency (7.37 MHz nominal) Note 1: OSCTUN functionality has been provided to help customers compensate for temperature effects on the FRC frequency over a wide range of temperatures. The tuning step size is an approximation and is neither characterized nor tested. 2: This is register is reset only on a Power-on Reset (POR). DS70593D-page 152 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 9.2 Clock Switching Operation 2. If a valid clock switch has been initiated, the sta- tus bits, LOCK (OSCCON<5>) and CF Applications are free to switch between any of the four (OSCCON<3>) are cleared. clock sources (Primary, LP, FRC and LPRC) under 3. The new oscillator is turned on by the hardware software control at any time. To limit the possible side if it is not currently running. If a crystal oscillator effects that could result from this flexibility, must be turned on, the hardware waits until the dsPIC33FJXXXGPX06A/X08A/X10A devices have a Oscillator Start-up Timer (OST) expires. If the safeguard lock built into the switch process. new source is using the PLL, the hardware waits Note: Primary Oscillator mode has three different until a PLL lock is detected (LOCK = 1). submodes (XT, HS and EC) which are 4. The hardware waits for 10 clock cycles from the determined by the POSCMD<1:0> new clock source and then performs the clock Configuration bits. While an application switch. can switch to and from Primary Oscillator 5. The hardware clears the OSWEN bit to indicate a mode in software, it cannot switch successful clock transition. In addition, the NOSC between the different primary submodes bit values are transferred to the COSC status bits. without reprogramming the device. 6. The old clock source is turned off at this time, 9.2.1 ENABLING CLOCK SWITCHING with the exception of LPRC (if WDT or FSCM are enabled) or LP (if LPOSCEN remains set). To enable clock switching, the FCKSM1 Configuration bit in the Configuration register must be programmed to Note1: The processor continues to execute code ‘0’. (Refer to Section22.1 “Configuration Bits” for throughout the clock switching sequence. further details.) If the FCKSM1 Configuration bit is Timing sensitive code should not be unprogrammed (‘1’), the clock switching function and executed during this time. Fail-Safe Clock Monitor function are disabled. This is 2: Direct clock switches between any pri- the default setting. mary oscillator mode with PLL and FRC- The NOSC control bits (OSCCON<10:8>) do not PLL mode are not permitted. This applies control the clock selection when clock switching is to clock switches in either direction. In disabled. However, the COSC bits (OSCCON<14:12>) these instances, the application must reflect the clock source selected by the FNOSC switch to FRC mode as a transition clock Configuration bits. source between the two PLL modes. 3: Refer to Section 7. “Oscillator” The OSWEN control bit (OSCCON<0>) has no effect (DS70186) in the “dsPIC33F/PIC24H when clock switching is disabled. It is held at ‘0’ at all Family Reference Manual” for details. times. 9.2.2 OSCILLATOR SWITCHING SEQUENCE 9.3 Fail-Safe Clock Monitor (FSCM) At a minimum, performing a clock switch requires this The Fail-Safe Clock Monitor (FSCM) allows the device basic sequence: to continue to operate even in the event of an oscillator 1. If desired, read the COSC bits failure. The FSCM function is enabled by programming. (OSCCON<14:12>) to determine the current If the FSCM function is enabled, the LPRC internal oscillator source. oscillator runs at all times (except during Sleep mode) 2. Perform the unlock sequence to allow a write to and is not subject to control by the Watchdog Timer. the OSCCON register high byte. In the event of an oscillator failure, the FSCM 3. Write the appropriate value to the NOSC control generates a clock failure trap event and switches the bits (OSCCON<10:8>) for the new oscillator system clock over to the FRC oscillator. Then the source. application program can either attempt to restart the 4. Perform the unlock sequence to allow a write to oscillator or execute a controlled shutdown. The trap the OSCCON register low byte. can be treated as a warm Reset by simply loading the 5. Set the OSWEN bit to initiate the oscillator Reset address into the oscillator fail trap vector. switch. If the PLL multiplier is used to scale the system clock, Once the basic sequence is completed, the system the internal FRC is also multiplied by the same factor clock hardware responds automatically as follows: on clock failure. Essentially, the device switches to FRC with PLL on a clock failure. 1. The clock switching hardware compares the COSC status bits with the new value of the NOSC control bits. If they are the same, then the clock switch is a redundant operation. In this case, the OSWEN bit is cleared automatically and the clock switch is aborted. 2009-2012 Microchip Technology Inc. DS70593D-page 153
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 154 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 10.0 POWER-SAVING FEATURES 10.2 Instruction-Based Power-Saving Modes Note1: This data sheet summarizes the features of the dsPIC33FJXXXGPX06A/X08A/ dsPIC33FJXXXGPX06A/X08A/X10A devices have two X10A family of devices. However, it is not special power-saving modes that are entered through intended to be a comprehensive the execution of a special PWRSAV instruction. Sleep reference source. To complement the mode stops clock operation and halts all code information in this data sheet, refer to execution. Idle mode halts the CPU and code Section 9. “Watchdog Timer and execution, but allows peripheral modules to continue Power-Saving Modes” (DS70196) in operation. The assembly syntax of the PWRSAV the “dsPIC33F/PIC24H Family instruction is shown in Example10-1. Reference Manual”, which is available Note: SLEEP_MODE and IDLE_MODE are from the Microchip web site constants defined in the assembler (www.microchip.com). include file for the selected device. 2: Some registers and associated bits Sleep and Idle modes can be exited as a result of an described in this section may not be enabled interrupt, WDT time-out or a device Reset. When available on all devices. Refer to the device exits these modes, it is said to “wake-up”. Section4.0 “Memory Organization” in this data sheet for device-specific register 10.2.1 SLEEP MODE and bit information. Sleep mode has these features: The dsPIC33FJXXXGPX06A/X08A/X10A devices pro- • The system clock source is shut down. If an vide the ability to manage power consumption by selec- on-chip oscillator is used, it is turned off. tively managing clocking to the CPU and the peripherals. In general, a lower clock frequency and a • The device current consumption is reduced to a reduction in the number of circuits being clocked con- minimum, provided that no I/O pin is sourcing stitutes lower consumed power. current dsPIC33FJXXXGPX06A/X08A/X10A devices can • The Fail-Safe Clock Monitor does not operate manage power consumption in four different ways: during Sleep mode since the system clock source is disabled • Clock frequency • The LPRC clock continues to run in Sleep mode if • Instruction-based Sleep and Idle modes the WDT is enabled • Software-controlled Doze mode • The WDT, if enabled, is automatically cleared • Selective peripheral control in software prior to entering Sleep mode Combinations of these methods can be used to • Some device features or peripherals may continue selectively tailor an application’s power consumption to operate in Sleep mode. This includes items such while still maintaining critical application features, such as the input change notification on the I/O ports, or as timing-sensitive communications. peripherals that use an external clock input. Any peripheral that requires the system clock source for 10.1 Clock Frequency and Clock its operation is disabled in Sleep mode. Switching The device will wake-up from Sleep mode on any of these events: dsPIC33FJXXXGPX06A/X08A/X10A devices allow a wide range of clock frequencies to be selected under • Any interrupt source that is individually enabled application control. If the system clock configuration is • Any form of device Reset not locked, users can choose low-power or • A WDT time-out high-precision oscillators by simply changing the On wake-up from Sleep, the processor restarts with the NOSC bits (OSCCON<10:8>). The process of same clock source that was active when Sleep mode changing a system clock during operation, as well as was entered. limitations to the process, are discussed in more detail in Section9.0 “Oscillator Configuration”. EXAMPLE 10-1: PWRSAV INSTRUCTION SYNTAX PWRSAV #SLEEP_MODE ; Put the device into SLEEP mode PWRSAV #IDLE_MODE ; Put the device into IDLE mode 2009-2012 Microchip Technology Inc. DS70593D-page 155
dsPIC33FJXXXGPX06A/X08A/X10A 10.2.2 IDLE MODE Doze mode is enabled by setting the DOZEN bit (CLK- DIV<11>). The ratio between peripheral and core clock Idle mode has these features: speed is determined by the DOZE<2:0> bits (CLK- • The CPU stops executing instructions DIV<14:12>). There are eight possible configurations, • The WDT is automatically cleared from 1:1 to 1:128, with 1:1 being the default setting. • The system clock source remains active. By It is also possible to use Doze mode to selectively default, all peripheral modules continue to operate reduce power consumption in event-driven normally from the system clock source, but can applications. This allows clock-sensitive functions, also be selectively disabled (see Section10.4 such as synchronous communications, to continue “Peripheral Module Disable”). without interruption while the CPU idles, waiting for • If the WDT or FSCM is enabled, the LPRC also something to invoke an interrupt routine. Enabling the remains active automatic return to full-speed CPU operation on interrupts is enabled by setting the ROI bit (CLK- The device will wake from Idle mode on any of these DIV<15>). By default, interrupt events have no effect events: on Doze mode operation. • Any interrupt that is individually enabled For example, suppose the device is operating at • Any device Reset 20MIPS and the CAN module has been configured for • A WDT time-out 500 kbps based on this device operating speed. If the On wake-up from Idle, the clock is reapplied to the CPU device is now placed in Doze mode with a clock and instruction execution will begin (2-4 clock cycles frequency ratio of 1:4, the CAN module continues to later), starting with the instruction following the PWRSAV communicate at the required bit rate of 500 kbps, but instruction, or the first instruction in the ISR. the CPU now starts executing instructions at a frequency of 5 MIPS. 10.2.3 INTERRUPTS COINCIDENT WITH POWER SAVE INSTRUCTIONS 10.4 Peripheral Module Disable Any interrupt that coincides with the execution of a The Peripheral Module Disable (PMD) registers PWRSAV instruction is held off until entry into Sleep or provide a method to disable a peripheral module by Idle mode has completed. The device then wakes up stopping all clock sources supplied to that module. from Sleep or Idle mode. When a peripheral is disabled via the appropriate PMD control bit, the peripheral is in a minimum power 10.3 Doze Mode consumption state. The control and status registers associated with the peripheral are also disabled, so Generally, changing clock speed and invoking one of the writes to those registers will have no effect and read power-saving modes are the preferred strategies for values will be invalid. reducing power consumption. There may be circumstances, however, where this is not practical. For A peripheral module is only enabled if both the example, it may be necessary for an application to associated bit in the PMD register is cleared and the maintain uninterrupted synchronous communication, peripheral is supported by the specific dsPIC® DSC even while it is doing nothing else. Reducing system variant. If the peripheral is present in the device, it is clock speed may introduce communication errors, while enabled in the PMD register by default. using a power-saving mode may stop communications Note: If a PMD bit is set, the corresponding completely. module is disabled after a delay of Doze mode is a simple and effective alternative method 1instruction cycle. Similarly, if a PMD bit to reduce power consumption while the device is still is cleared, the corresponding module is executing code. In this mode, the system clock enabled after a delay of 1 instruction cycle continues to operate from the same source and at the (assuming the module control registers same speed. Peripheral modules continue to be are already configured to enable module clocked at the same speed, while the CPU clock speed operation). is reduced. Synchronization between the two clock domains is maintained, allowing the peripherals to access the SFRs while the CPU executes code at a slower rate. DS70593D-page 156 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 10-1: PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 T5MD T4MD T3MD T2MD T1MD — — DCIMD bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 I2C1MD U2MD U1MD SPI2MD SPI1MD C2MD C1MD AD1MD(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 T5MD: Timer5 Module Disable bit 1 = Timer5 module is disabled 0 = Timer5 module is enabled bit 14 T4MD: Timer4 Module Disable bit 1 = Timer4 module is disabled 0 = Timer4 module is enabled bit 13 T3MD: Timer3 Module Disable bit 1 = Timer3 module is disabled 0 = Timer3 module is enabled bit 12 T2MD: Timer2 Module Disable bit 1 = Timer2 module is disabled 0 = Timer2 module is enabled bit 11 T1MD: Timer1 Module Disable bit 1 = Timer1 module is disabled 0 = Timer1 module is enabled bit 10-9 Unimplemented: Read as ‘0’ bit 8 DCIMD: DCI Module Disable bit 1 = DCI module is disabled 0 = DCI module is enabled bit 7 I2C1MD: I2C1 Module Disable bit 1 = I2C1 module is disabled 0 = I2C1 module is enabled bit 6 U2MD: UART2 Module Disable bit 1 = UART2 module is disabled 0 = UART2 module is enabled bit 5 U1MD: UART1 Module Disable bit 1 = UART1 module is disabled 0 = UART1 module is enabled bit 4 SPI2MD: SPI2 Module Disable bit 1 = SPI2 module is disabled 0 = SPI2 module is enabled bit 3 SPI1MD: SPI1 Module Disable bit 1 = SPI1 module is disabled 0 = SPI1 module is enabled Note 1: PCFGx bits have no effect if ADC module is disabled by setting this bit. In this case all port pins multiplexed with ANx will be in Digital mode. 2009-2012 Microchip Technology Inc. DS70593D-page 157
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 10-1: PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1 (CONTINUED) bit 2 C2MD: ECAN2 Module Disable bit 1 = ECAN2 module is disabled 0 = ECAN2 module is enabled bit 1 C1MD: ECAN2 Module Disable bit 1 = ECAN1 module is disabled 0 = ECAN1 module is enabled bit 0 AD1MD: ADC1 Module Disable bit(1) 1 = ADC1 module is disabled 0 = ADC1 module is enabled Note 1: PCFGx bits have no effect if ADC module is disabled by setting this bit. In this case all port pins multiplexed with ANx will be in Digital mode. DS70593D-page 158 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 10-2: PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 OC8MD OC7MD OC6MD OC5MD OC4MD OC3MD OC2MD OC1MD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 IC8MD: Input Capture 8 Module Disable bit 1 = Input Capture 8 module is disabled 0 = Input Capture 8 module is enabled bit 14 IC7MD: Input Capture 7 Module Disable bit 1 = Input Capture 7 module is disabled 0 = Input Capture 7 module is enabled bit 13 IC6MD: Input Capture 6 Module Disable bit 1 = Input Capture 6 module is disabled 0 = Input Capture 6 module is enabled bit 12 IC5MD: Input Capture 5 Module Disable bit 1 = Input Capture 5 module is disabled 0 = Input Capture 5 module is enabled bit 11 IC4MD: Input Capture 4 Module Disable bit 1 = Input Capture 4 module is disabled 0 = Input Capture 4 module is enabled bit 10 IC3MD: Input Capture 3 Module Disable bit 1 = Input Capture 3 module is disabled 0 = Input Capture 3 module is enabled bit 9 IC2MD: Input Capture 2 Module Disable bit 1 = Input Capture 2 module is disabled 0 = Input Capture 2 module is enabled bit 8 IC1MD: Input Capture 1 Module Disable bit 1 = Input Capture 1 module is disabled 0 = Input Capture 1 module is enabled bit 7 OC8MD: Output Compare 8 Module Disable bit 1 = Output Compare 8 module is disabled 0 = Output Compare 8 module is enabled bit 6 OC7MD: Output Compare 4 Module Disable bit 1 = Output Compare 7 module is disabled 0 = Output Compare 7 module is enabled bit 5 OC6MD: Output Compare 6 Module Disable bit 1 = Output Compare 6 module is disabled 0 = Output Compare 6 module is enabled bit 4 OC5MD: Output Compare 5 Module Disable bit 1 = Output Compare 5 module is disabled 0 = Output Compare 5 module is enabled 2009-2012 Microchip Technology Inc. DS70593D-page 159
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 10-2: PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2 (CONTINUED) bit 3 OC4MD: Output Compare 4 Module Disable bit 1 = Output Compare 4 module is disabled 0 = Output Compare 4 module is enabled bit 2 OC3MD: Output Compare 3 Module Disable bit 1 = Output Compare 3 module is disabled 0 = Output Compare 3 module is enabled bit 1 OC2MD: Output Compare 2 Module Disable bit 1 = Output Compare 2 module is disabled 0 = Output Compare 2 module is enabled bit 0 OC1MD: Output Compare 1 Module Disable bit 1 = Output Compare 1 module is disabled 0 = Output Compare 1 module is enabled DS70593D-page 160 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 10-3: PMD3: PERIPHERAL MODULE DISABLE CONTROL REGISTER 3 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 T9MD T8MD T7MD T6MD — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — I2C2MD AD2MD(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 T9MD: Timer9 Module Disable bit 1 = Timer9 module is disabled 0 = Timer9 module is enabled bit 14 T8MD: Timer8 Module Disable bit 1 = Timer8 module is disabled 0 = Timer8 module is enabled bit 13 T7MD: Timer7 Module Disable bit 1 = Timer7 module is disabled 0 = Timer7 module is enabled bit 12 T6MD: Timer6 Module Disable bit 1 = Timer6 module is disabled 0 = Timer6 module is enabled bit 11-2 Unimplemented: Read as ‘0’ bit 1 I2C2MD: I2C2 Module Disable bit 1 = I2C2 module is disabled 0 = I2C2 module is enabled bit 0 AD2MD: AD2 Module Disable bit(1) 1 = AD2 module is disabled 0 = AD2 module is enabled Note 1: PCFGx bits have no effect if ADC module is disabled by setting this bit. In this case all port pins multiplexed with ANx will be in Digital mode. 2009-2012 Microchip Technology Inc. DS70593D-page 161
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 162 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 11.0 I/O PORTS has ownership of the output data and control signals of the I/O pin. The logic also prevents “loop through”, in Note1: This data sheet summarizes the features which a port’s digital output can drive the input of a of the dsPIC33FJXXXGPX06A/X08A/ peripheral that shares the same pin. Figure11-1 illus- X10A family of devices. However, it is not trates how ports are shared with other peripherals and intended to be a comprehensive refer- the associated I/O pin to which they are connected. ence source. To complement the When a peripheral is enabled and actively driving an information in this data sheet, refer to associated pin, the use of the pin as a general purpose Section 10. “I/O Ports” (DS70193) in output pin is disabled. The I/O pin may be read, but the the “dsPIC33F/PIC24H Family output driver for the parallel port bit will be disabled. If Reference Manual”, which is available from the Microchip web site a peripheral is enabled, but the peripheral is not (www.microchip.com). actively driving a pin, that pin may be driven by a port. 2: Some registers and associated bits All port pins have three registers directly associated described in this section may not be with their operation as digital I/O. The data direction available on all devices. Refer to register (TRISx) determines whether the pin is an input Section4.0 “Memory Organization” in or an output. If the data direction bit is a ‘1’, then the pin this data sheet for device-specific register is an input. All port pins are defined as inputs after a and bit information. Reset. Reads from the latch (LATx), read the latch. Writes to the latch, write the latch. Reads from the port All of the device pins (except VDD, VSS, MCLR and (PORTx), read the port pins, while writes to the port OSC1/CLKIN) are shared between the peripherals and pins, write the latch. the parallel I/O ports. All I/O input ports feature Schmitt Any bit and its associated data and control registers Trigger inputs for improved noise immunity. that are not valid for a particular device will be 11.1 Parallel I/O (PIO) Ports disabled. That means the corresponding LATx and TRISx registers and the port pins will read as zeros. A parallel I/O port that shares a pin with a peripheral is, in general, subservient to the peripheral. The When a pin is shared with another peripheral or peripheral’s output buffer data and control signals are function that is defined as an input only, it is provided to a pair of multiplexers. The multiplexers nevertheless regarded as a dedicated port because select whether the peripheral or the associated port there is no other competing source of outputs. An example is the INT4 pin. FIGURE 11-1: BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE Peripheral Module Output Multiplexers Peripheral Input Data Peripheral Module Enable I/O Peripheral Output Enable 1 Output Enable Peripheral Output Data 0 PIO Module 1 Output Data Read TRIS 0 Data Bus D Q I/O Pin WR TRIS CK TRIS Latch D Q WR LAT + WR PORT CK Data Latch Read LAT Input Data Read Port 2009-2012 Microchip Technology Inc. DS70593D-page 163
dsPIC33FJXXXGPX06A/X08A/X10A 11.2 Open-Drain Configuration 11.4 I/O Port Write/Read Timing In addition to the PORT, LAT and TRIS registers for One instruction cycle is required between a port data control, some port pins can also be individually direction change or port write operation and a read configured for either digital or open-drain output. This is operation of the same port. Typically, this instruction controlled by the Open-Drain Control register, ODCx, would be a NOP. associated with each port. Setting any of the bits configures the corresponding pin to act as an 11.5 Input Change Notification open-drain output. The input change notification function of the I/O ports The open-drain feature allows the generation of allows the dsPIC33FJXXXGPX06A/X08A/X10A outputs higher than VDD (e.g., 5V) on any desired 5V devices to generate interrupt requests to the processor tolerant pins by using external pull-up resistors. The in response to a change-of-state on selected input pins. maximum open-drain voltage allowed is the same as This feature is capable of detecting input the maximum VIH specification. change-of-states even in Sleep mode, when the clocks See the “Pin Diagrams” section for the available pins are disabled. Depending on the device pin count, there and their functionality. are up to 24 external signals (CN0 through CN23) that can be selected (enabled) for generating an interrupt 11.3 Configuring Analog Port Pins request on a change-of-state. There are four control registers associated with the CN The use of the ADxPCFGH, ADxPCFGL and TRIS module. The CNEN1 and CNEN2 registers contain the registers control the operation of the ADC port pins. CN interrupt enable (CNxIE) control bits for each of the The port pins that are desired as analog inputs must CN input pins. Setting any of these bits enables a CN have their corresponding TRIS bit set (input). If the interrupt for the corresponding pins. TRIS bit is cleared (output), the digital output level (VOH or VOL) is converted. Each CN pin also has a weak pull-up connected to it. The pull-ups act as a current source that is connected Clearing any bit in the ADxPCFGH or ADxPCFGL to the pin and eliminate the need for external resistors register configures the corresponding bit to be an when push button or keypad devices are connected. analog pin. This is also the Reset state of any I/O pin The pull-ups are enabled separately using the CNPU1 that has an analog (ANx) function associated with it. and CNPU2 registers, which contain the weak pull-up Note: In devices with two ADC modules, if the enable (CNxPUE) bits for each of the CN pins. Setting corresponding PCFG bit in either any of the control bits enables the weak pull-ups for the AD1PCFGH(L) and AD2PCFGH(L) is corresponding pins. cleared, the pin is configured as an analog Note: Pull-ups on change notification pins input. should always be disabled whenever the When reading the PORT register, all pins configured as port pin is configured as a digital output. analog input channels will read as cleared (a low level). Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins) can cause the input buffer to consume current that exceeds the device specifications. Note: The voltage on an analog input pin can be between -0.3V to (VDD + 0.3 V). EXAMPLE 11-1: PORT WRITE/READ EXAMPLE MOV 0xFF00, W0 ; Configure PORTB<15:8> as inputs MOV W0, TRISBB ; and PORTB<7:0> as outputs NOP ; Delay 1 cycle btss PORTB, #13 ; Next Instruction DS70593D-page 164 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 11.6 I/O Helpful Tips 4. Each CN pin has a configurable internal weak pull-up resistor. The pull-ups act as a current 1. In some cases, certain pins as defined in TABLE source connected to the pin, and eliminates the 25-9: “DC Characteristics: I/O Pin Input Speci- need for external resistors in certain applica- fications” under “Injection Current”, have internal tions. The internal pull-up is to ~(VDD-0.8) not protection diodes to VDD and VSS. The term VDD. This is still above the minimum VIH of “Injection Current” is also referred to as “Clamp CMOS and TTL devices. Current”. On designated pins, with sufficient exter- 5. When driving LEDs directly, the I/O pin can source nal current limiting precautions by the user, I/O pin or sink more current than what is specified in the input voltages are allowed to be greater or less VOH/IOH and VOL/IOL DC characteristic specifica- than the data sheet absolute maximum ratings tion. The respective IOH and IOL current rating only with nominal VDD with respect to the VSS and VDD applies to maintaining the corresponding output at supplies. Note that when the user application for- or above the VOH and at or below the VOL levels. ward biases either of the high or low side internal However, for LEDs unlike digital inputs of an exter- input clamp diodes, that the resulting current being nally connected device, they are not governed by injected into the device that is clamped internally the same minimum VIH/VIL levels. An I/O pin out- by the VDD and VSS power rails, may affect the put can safely sink or source any current less than ADC accuracy by four to six counts. that listed in the absolute maximum rating section 2. I/O pins that are shared with any analog input pin, of the data sheet. For example: (i.e., ANx), are always analog pins by default after any reset. Consequently, any pin(s) configured as VOH = 2.4v @ IOH = -8 mA and VDD = 3.3V an analog input pin, automatically disables the dig- The maximum output current sourced by any 8mA ital input pin buffer. As such, any attempt to read a I/O pin = 12 mA. digital input pin will always return a ‘0’ regardless LED source current < 12 mA is technically of the digital logic level on the pin if the analog pin permitted. Refer to the VOH/IOH graphs in is configured. To use a pin as a digital I/O pin on a Section25.0 “Electrical Characteristics” for shared ANx pin, the user application needs to con- additional information. figure the analog pin configuration registers in the ADC module, (i.e., ADxPCFGL, AD1PCFGH), by 11.7 I/O Resources setting the appropriate bit that corresponds to that I/O port pin to a ‘1’. On devices with more than one Many useful resources related to I/O are provided on ADC, both analog pin configurations for both ADC the main product page of the Microchip web site for the modules must be configured as a digital I/O pin for devices listed in this data sheet. This product page, that pin to function as a digital I/O pin. which can be accessed using this link, contains the latest updates and additional information. Note: Although it is not possible to use a digital input pin when its analog function is Note: In the event you are not able to access the enabled, it is possible to use the digital I/O product page using the link above, enter output function, TRISx = 0x0, while the this URL in your browser: analog function is also enabled. However, http://www.microchip.com/wwwproducts/ this is not recommended, particularly if the Devices.aspx?dDocName=en546064 analog input is connected to an external analog voltage source, which would cre- 11.7.1 KEY RESOURCES ate signal contention between the analog • Section 10. “I/O Ports” (DS70193) signal and the output pin driver. • Code Samples 3. Most I/O pins have multiple functions. Referring to • Application Notes the device pin diagrams in the data sheet, the pri- • Software Libraries orities of the functions allocated to any pins are • Webinars indicated by reading the pin name from left-to-right. The left most function name takes pre- • All related dsPIC33F/PIC24H Family Reference cedence over any function to its right in the naming Manuals Sections convention. For example: AN16/T2CK/T7CK/RC1. • Development Tools This indicates that AN16 is the highest priority in this example and will supersede all other functions to its right in the list. Those other functions to its right, even if enabled, would not work as long as any other function to its left was enabled. This rule applies to all of the functions listed for a given pin. 2009-2012 Microchip Technology Inc. DS70593D-page 165
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 166 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 12.0 TIMER1 Timer1 also supports these features: • Timer gate operation Note1: This data sheet summarizes the features • Selectable prescaler settings of the dsPIC33FJXXXGPX06A/X08A/ X10A family of devices. However, it is not • Timer operation during CPU Idle and Sleep intended to be a comprehensive modes reference source. To complement the • Interrupt on 16-bit Period register match or falling information in this data sheet, refer to edge of external gate signal Section 11. “Timers” (DS70205) in the Figure12-1 presents a block diagram of the 16-bit “dsPIC33F/PIC24H Family Reference timer module. Manual”, which is available from the To configure Timer1 for operation: Microchip web site (www.microchip.com). 1. Set the TON bit (= 1) in the T1CON register. 2: Some registers and associated bits 2. Select the timer prescaler ratio using the described in this section may not be TCKPS<1:0> bits in the T1CON register. available on all devices. Refer to 3. Set the Clock and Gating modes using the TCS Section4.0 “Memory Organization” in and TGATE bits in the T1CON register. this data sheet for device-specific register 4. Set or clear the TSYNC bit in T1CON to select and bit information. synchronous or asynchronous operation. 5. Load the timer period value into the PR1 The Timer1 module is a 16-bit timer, which can serve register. as the time counter for the real-time clock, or operate as a free-running interval timer/counter. Timer1 can 6. If interrupts are required, set the interrupt enable operate in three modes: bit, T1IE. Use the priority bits, T1IP<2:0>, to set the interrupt priority. • 16-bit Timer • 16-bit Synchronous Counter • 16-bit Asynchronous Counter FIGURE 12-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM TCKPS<1:0> TON 2 SOSCO/ 1x T1CK Gate Prescaler SOSCEN Sync 01 1, 8, 64, 256 SOSCI TCY 00 TGATE TGATE TCS 1 Q D Set T1IF Q CK 0 0 Reset TMR1 1 Sync Comparator TSYNC Equal PR1 2009-2012 Microchip Technology Inc. DS70593D-page 167
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 12-1: T1CON: TIMER1 CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON — TSIDL — — — — — bit 15 bit 8 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 — TGATE TCKPS<1:0> — TSYNC TCS — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 TON: Timer1 On bit 1 = Starts 16-bit Timer1 0 = Stops 16-bit Timer1 bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timer1 Gated Time Accumulation Enable bit When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3 Unimplemented: Read as ‘0’ bit 2 TSYNC: Timer1 External Clock Input Synchronization Select bit When TCS = 1: 1 = Synchronize external clock input 0 = Do not synchronize external clock input When TCS = 0: This bit is ignored. bit 1 TCS: Timer1 Clock Source Select bit 1 = External clock from pin T1CK (on the rising edge) 0 = Internal clock (FCY) bit 0 Unimplemented: Read as ‘0’ DS70593D-page 168 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 13.0 TIMER2/3, TIMER4/5, TIMER6/7 Note: For 32-bit operation, T3CON, T5CON, AND TIMER8/9 T7CON and T9CON control bits are ignored. Only T2CON, T4CON, T6CON Note1: This data sheet summarizes the fea- and T8CON control bits are used for setup tures of the dsPIC33FJXXXGPX06A/ and control. Timer2, Timer4, Timer6 and X08A/X10A family of devices. How- Timer8 clock and gate inputs are utilized ever, it is not intended to be a compre- for the 32-bit timer modules, but an hensive reference source. To interrupt is generated with the Timer3, complement the information in this data Timer5, Ttimer7 and Timer9 interrupt sheet, refer to Section 11. “Timers” flags. (DS70205) in the “dsPIC33F/PIC24H To configure Timer2/3, Timer4/5, Timer6/7 or Timer8/9 Family Reference Manual”, which is for 32-bit operation: available from the Microchip web site (www.microchip.com). 1. Set the corresponding T32 control bit. 2: Some registers and associated bits 2. Select the prescaler ratio for Timer2, Timer4, described in this section may not be Timer6 or Timer8 using the TCKPS<1:0> bits. available on all devices. Refer to 3. Set the Clock and Gating modes using the Section4.0 “Memory Organization” in corresponding TCS and TGATE bits. this data sheet for device-specific register 4. Load the timer period value. PR3, PR5, PR7 or and bit information. PR9 contains the most significant word of the value, while PR2, PR4, PR6 or PR8 contains the The Timer2/3, Timer4/5, Timer6/7 and Timer8/9 least significant word. modules are 32-bit timers, which can also be configured as four independent 16-bit timers with 5. If interrupts are required, set the interrupt enable selectable operating modes. bit, T3IE, T5IE, T7IE or T9IE. Use the priority bits, T3IP<2:0>, T5IP<2:0>, T7IP<2:0> or As a 32-bit timer, Timer2/3, Timer4/5, Timer6/7 and T9IP<2:0>, to set the interrupt priority. While Timer8/9 operate in three modes: Timer2, Timer4, Timer6 or Timer8 control the • Two Independent 16-bit Timers (e.g., Timer2 and timer, the interrupt appears as a Timer3, Timer5, Timer3) with all 16-bit operating modes (except Timer7 or Timer9 interrupt. Asynchronous Counter mode) 6. Set the corresponding TON bit. • Single 32-bit Timer The timer value at any point is stored in the register • Single 32-bit Synchronous Counter pair, TMR3:TMR2, TMR5:TMR4, TMR7:TMR6 or They also support these features: TMR9:TMR8. TMR3, TMR5, TMR7 or TMR9 always contains the most significant word of the count, while • Timer Gate Operation TMR2, TMR4, TMR6 or TMR8 contains the least • Selectable Prescaler Settings significant word. • Timer Operation during Idle and Sleep modes To configure any of the timers for individual 16-bit • Interrupt on a 32-bit Period Register Match operation: • Time Base for Input Capture and Output Compare 1. Clear the T32 bit corresponding to that timer. Modules (Timer2 and Timer3 only) 2. Select the timer prescaler ratio using the • ADC1 Event Trigger (Timer2/3 only) TCKPS<1:0> bits. • ADC2 Event Trigger (Timer4/5 only) 3. Set the Clock and Gating modes using the TCS Individually, all eight of the 16-bit timers can function as and TGATE bits. synchronous timers or counters. They also offer the 4. Load the timer period value into the PRx features listed above, except for the event trigger; this register. is implemented only with Timer2/3. The operating 5. If interrupts are required, set the interrupt enable modes and enabled features are determined by setting bit, TxIE. Use the priority bits, TxIP<2:0>, to set the appropriate bit(s) in the T2CON, T3CON, T4CON, the interrupt priority. T5CON, T6CON, T7CON, T8CON and T9CON 6. Set the TON bit. registers. T2CON, T4CON, T6CON and T8CON are shown in generic form in Register13-1. T3CON, A block diagram for a 32-bit timer pair (Timer4/5) T5CON, T7CON and T9CON are shown in example is shown in Figure13-1 and a timer (Timer4) Register13-2. operating in 16-bit mode example is shown in Figure13-2. For 32-bit timer/counter operation, Timer2, Timer4, Timer6 or Timer8 is the least significant word; Timer3, Note: Only Timer2 and Timer3 can trigger a Timer5, Timer7 or Timer9 is the most significant word DMA data transfer. of the 32-bit timers. 2009-2012 Microchip Technology Inc. DS70593D-page 169
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 13-1: TIMER2/3 (32-BIT) BLOCK DIAGRAM(1) TCKPS<1:0> TON 2 T2CK 1x Gate Prescaler Sync 01 1, 8, 64, 256 TCY 00 TGATE TGATE TCS 1 Q D Set T3IF Q CK 0 PR3 PR2 ADC Event Trigger(2) Equal Comparator MSb LSb TMR3 TMR2 Sync Reset 16 Read TMR2 Write TMR2 16 16 TMR3HLD 16 Data Bus<15:0> Note 1: The 32-bit timer control bit, T32, must be set for 32-bit timer/counter operation. All control bits are respective to the T2CON register. 2: The ADC event trigger is available only on Timer2/3. DS70593D-page 170 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 13-2: TIMER2 (16-BIT) BLOCK DIAGRAM TCKPS<1:0> TON 2 T2CK 1x Gate Prescaler Sync 01 1, 8, 64, 256 TGATE 00 TCY TCS 1 Q D TGATE Set T2IF Q CK 0 Reset TMR2 Sync Comparator Equal PR2 2009-2012 Microchip Technology Inc. DS70593D-page 171
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 13-1: TxCON (T2CON, T4CON, T6CON OR T8CON) CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON — TSIDL — — — — — bit 15 bit 8 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0 — TGATE TCKPS<1:0> T32 — TCS(1) — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 TON: Timerx On bit When T32 = 1: 1 = Starts 32-bit Timerx/y 0 = Stops 32-bit Timerx/y When T32 = 0: 1 = Starts 16-bit Timerx 0 = Stops 16-bit Timerx bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timerx Gated Time Accumulation Enable bit When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0>: Timerx Input Clock Prescale Select bits 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3 T32: 32-bit Timer Mode Select bit 1 = Timerx and Timery form a single 32-bit timer 0 = Timerx and Timery act as two 16-bit timers bit 2 Unimplemented: Read as ‘0’ bit 1 TCS: Timerx Clock Source Select bit(1) 1 = External clock from pin TxCK (on the rising edge) 0 = Internal clock (FCY) bit 0 Unimplemented: Read as ‘0’ Note 1: The TxCK pin is not available on all timers. Refer to the “Pin Diagrams” section for the available pins. DS70593D-page 172 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 13-2: TyCON (T3CON, T5CON, T7CON OR T9CON) CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON(1) — TSIDL(2) — — — — — bit 15 bit 8 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 — TGATE(1) TCKPS<1:0>(1) — — TCS(1,3) — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 TON: Timery On bit(1) 1 = Starts 16-bit Timery 0 = Stops 16-bit Timery bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit(2) 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timery Gated Time Accumulation Enable bit(1) When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0>: Timer3 Input Clock Prescale Select bits(1) 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3-2 Unimplemented: Read as ‘0’ bit 1 TCS: Timery Clock Source Select bit(1,3) 1 = External clock from pin TyCK (on the rising edge) 0 = Internal clock (FCY) bit 0 Unimplemented: Read as ‘0’ Note 1: When 32-bit operation is enabled (T2CON<3> = 1), these bits have no effect on Timery operation; all timer functions are set through T2CON. 2: When 32-bit timer operation is enabled (T32 = 1) in the Timer Control register (TxCON<3>), the TSIDL bit must be cleared to operate the 32-bit timer in Idle mode. 3: The TyCK pin is not available on all timers. Refer to the “Pin Diagrams” section for the available pins. 2009-2012 Microchip Technology Inc. DS70593D-page 173
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 174 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 14.0 INPUT CAPTURE • Capture timer value on every edge (rising and fall- ing) Note1: This data sheet summarizes the fea- • Prescaler Capture Event modes: tures of the dsPIC33FJXXXGPX06A/ - Capture timer value on every 4th rising X08A/X10A family of devices. How- edge of input at ICx pin ever, it is not intended to be a compre- - Capture timer value on every 16th rising hensive reference source. To edge of input at ICx pin complement the information in this data sheet, refer to Section 12. “Input Each input capture channel can select between one of Capture” (DS70198) in the “dsPIC33F/ two 16-bit timers (Timer2 or Timer3) for the time base. PIC24H Family Reference Manual”, The selected timer can use either an internal or exter- which is available from the Microchip nal clock. web site (www.microchip.com). Other operational features include: 2: Some registers and associated bits • Device wake-up from capture pin during CPU described in this section may not be Sleep and Idle modes available on all devices. Refer to Section4.0 “Memory Organization” in • Interrupt on input capture event this data sheet for device-specific register • 4-word FIFO buffer for capture values and bit information. - Interrupt optionally generated after 1, 2, 3 or 4 buffer locations are filled The input capture module is useful in applications requiring frequency (period) and pulse measurement. • Input capture can also be used to provide The dsPIC33FJXXXGPX06A/X08A/X10A devices additional sources of external interrupts support up to eight input capture channels. Note: Only IC1 and IC2 can trigger a DMA data The input capture module captures the 16-bit value of transfer. If DMA data transfers are required, the FIFO buffer size must be set the selected Time Base register when an event occurs at the ICx pin. The events that cause a capture event to 1 (ICI<1:0> = 00). are listed below in three categories: • Simple Capture Event modes: - Capture timer value on every falling edge of input at ICx pin - Capture timer value on every rising edge of input at ICx pin FIGURE 14-1: INPUT CAPTURE BLOCK DIAGRAM From 16-bit Timers TMRy TMRz 16 16 ICTMR 1 0 (ICxCON<7>) Prescaler Edge Detection Logic FIFO Counter and R/W (1, 4, 16) Clock Synchronizer Logic ICx Pin ICM<2:0> (ICxCON<2:0>) 3 Mode Select O F ICOV, ICBNE (ICxCON<4:3>) FI ICxBUF ICxI<1:0> Interrupt ICxCON Logic Set Flag ICxIF System Bus (in IFSn Register) Note: An ‘x’ in a signal, register or bit name denotes the number of the capture channel. 2009-2012 Microchip Technology Inc. DS70593D-page 175
dsPIC33FJXXXGPX06A/X08A/X10A 14.1 Input Capture Registers REGISTER 14-1: ICxCON: INPUT CAPTURE x CONTROL REGISTER U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 — — ICSIDL — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R-0, HC R-0, HC R/W-0 R/W-0 R/W-0 ICTMR(1) ICI<1:0> ICOV ICBNE ICM<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 ICSIDL: Input Capture Module Stop in Idle Control bit 1 = Input capture module will halt in CPU Idle mode 0 = Input capture module will continue to operate in CPU Idle mode bit 12-8 Unimplemented: Read as ‘0’ bit 7 ICTMR: Input Capture Timer Select bits(1) 1 = TMR2 contents are captured on capture event 0 = TMR3 contents are captured on capture event bit 6-5 ICI<1:0>: Select Number of Captures per Interrupt bits 11 = Interrupt on every fourth capture event 10 = Interrupt on every third capture event 01 = Interrupt on every second capture event 00 = Interrupt on every capture event bit 4 ICOV: Input Capture Overflow Status Flag bit (read-only) 1 = Input capture overflow occurred 0 = No input capture overflow occurred bit 3 ICBNE: Input Capture Buffer Empty Status bit (read-only) 1 = Input capture buffer is not empty, at least one more capture value can be read 0 = Input capture buffer is empty bit 2-0 ICM<2:0>: Input Capture Mode Select bits 111 = Input capture functions as interrupt pin only when device is in Sleep or Idle mode (Rising edge detect only, all other control bits are not applicable.) 110 = Unused (module disabled) 101 = Capture mode, every 16th rising edge 100 = Capture mode, every 4th rising edge 011 = Capture mode, every rising edge 010 = Capture mode, every falling edge 001 = Capture mode, every edge (rising and falling) (ICI<1:0> bits do not control interrupt generation for this mode.) 000 = Input capture module turned off DS70593D-page 176 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 15.0 OUTPUT COMPARE The output compare module can select either Timer2 or Timer3 for its time base. The module compares the Note1: This data sheet summarizes the fea- value of the timer with the value of one or two Compare tures of the dsPIC33FJXXXGPX06A/ registers depending on the operating mode selected. X08A/X10A families of devices. It is not The state of the output pin changes when the timer intended to be a comprehensive refer- value matches the Compare register value. The output ence source. To complement the infor- compare module generates either a single output mation in this data sheet, refer to pulse, or a sequence of output pulses, by changing the Section 13. “Output Compare” state of the output pin on the compare match events. (DS70209) of the “dsPIC33F/PIC24H The output compare module can also generate Family Reference Manual”, which is interrupts on compare match events. available from the Microchip web site The output compare module has multiple operating (www.microchip.com). modes: 2: Some registers and associated bits • Active-Low One-Shot mode described in this section may not be • Active-High One-Shot mode available on all devices. Refer to • Toggle mode Section4.0 “Memory Organization” in • Delayed One-Shot mode this data sheet for device-specific register • Continuous Pulse mode and bit information. • PWM mode without Fault Protection • PWM mode with Fault Protection FIGURE 15-1: OUTPUT COMPARE MODULE BLOCK DIAGRAM Set Flag bit OCxIF OCxRS Output S Q OCxR OCx Logic R 3 Output OCM<2:0> Output Enable Mode Select Enable Logic Comparator OCFA 0 1 OCTSEL 0 1 16 16 TMR2 TMR3 TMR2 TMR3 Rollover Rollover 2009-2012 Microchip Technology Inc. DS70593D-page 177
dsPIC33FJXXXGPX06A/X08A/X10A 15.1 Output Compare Modes application must disable the associated timer when writing to the Output Compare Control registers to Configure the Output Compare modes by setting the avoid malfunctions. appropriate Output Compare Mode (OCM<2:0>) bits in the Output Compare Control (OCxCON<2:0>) register. Note: See Section 13. “Output Compare” Table15-1 lists the different bit settings for the Output (DS70209) in the “dsPIC33F/PIC24H Compare modes. Figure15-2 illustrates the output Family Reference Manual” for OCxR and compare operation for various modes. The user OCxRS register restrictions. TABLE 15-1: OUTPUT COMPARE MODES OCM<2:0> Mode OCx Pin Initial State OCx Interrupt Generation 000 Module Disabled Controlled by GPIO register — 001 Active-Low One-Shot 0 OCx rising edge 010 Active-High One-Shot 1 OCx falling edge 011 Toggle Current output is maintained OCx rising and falling edge 100 Delayed One-Shot 0 OCx falling edge 101 Continuous Pulse 0 OCx falling edge 110 PWM without Fault Protection ‘0’, if OCxR is zero No interrupt ‘1’, if OCxR is non-zero 111 PWM with Fault Protection ‘0’, if OCxR is zero OCFA falling edge for OC1 to OC4 ‘1’, if OCxR is non-zero FIGURE 15-2: OUTPUT COMPARE OPERATION Output Compare Timer is Reset on Mode Enabled Period Match OCxRS TMRy OCxR Active-Low One-Shot (OCM = 001) Active-High One-Shot (OCM = 010) Toggle (OCM = 011) Delayed One-Shot (OCM = 100) Continuous Pulse (OCM = 101) PWM (OCM = 110 or 111) DS70593D-page 178 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 15-1: OCxCON: OUTPUT COMPARE x CONTROL REGISTER (x = 1, 2) U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 — — OCSIDL — — — — — bit 15 bit 8 U-0 U-0 U-0 R-0, HC R/W-0 R/W-0 R/W-0 R/W-0 — — — OCFLT OCTSEL OCM<2:0> bit 7 bit 0 Legend: HC = Hardware Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 OCSIDL: Stop Output Compare in Idle Mode Control bit 1 = Output Compare x halts in CPU Idle mode 0 = Output Compare x continues to operate in CPU Idle mode bit 12-5 Unimplemented: Read as ‘0’ bit 4 OCFLT: PWM Fault Condition Status bit 1 = PWM Fault condition has occurred (cleared in hardware only) 0 = No PWM Fault condition has occurred (this bit is only used when OCM<2:0> = 111) bit 3 OCTSEL: Output Compare Timer Select bit 1 = Timer3 is the clock source for Compare x 0 = Timer2 is the clock source for Compare x bit 2-0 OCM<2:0>: Output Compare Mode Select bits 111 = PWM mode on OCx, Fault pin enabled 110 = PWM mode on OCx, Fault pin disabled 101 = Initialize OCx pin low, generate continuous output pulses on OCx pin 100 = Initialize OCx pin low, generate single output pulse on OCx pin 011 = Compare event toggles OCx pin 010 = Initialize OCx pin high, compare event forces OCx pin low 001 = Initialize OCx pin low, compare event forces OCx pin high 000 = Output compare channel is disabled 2009-2012 Microchip Technology Inc. DS70593D-page 179
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 180 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 16.0 SERIAL PERIPHERAL The Serial Peripheral Interface (SPI) module is a INTERFACE (SPI) synchronous serial interface useful for communicating with other peripheral or microcontroller devices. These Note1: This data sheet summarizes the features peripheral devices may be serial EEPROMs, shift of the dsPIC33FJXXXGPX06A/X08A/ registers, display drivers, Analog-to-Digital Converters X10A family of devices. However, it is not (ADC), etc. The SPI module is compatible with SPI and intended to be a comprehensive refer- SIOP from Motorola®. ence source. To complement the infor- Note: In this section, the SPI modules are mation in this data sheet, refer to Section referred to together as SPIx, or 18. “Serial Peripheral Interface (SPI)” separately as SPI1 and SPI2. Special (DS70206) in the “dsPIC33F/PIC24H Function Registers will follow a similar Family Reference Manual”, which is notation. For example, SPIxCON refers to available from the Microchip web site the control register for the SPI1 or SPI2 (www.microchip.com). module. 2: Some registers and associated bits Each SPI module consists of a 16-bit shift register, described in this section may not be SPIxSR (where x = 1 or 2), used for shifting data in and available on all devices. Refer to out, and a buffer register, SPIxBUF. A control register, Section4.0 “Memory Organization” in SPIxCON, configures the module. Additionally, a status this data sheet for device-specific register register, SPIxSTAT, indicates various status conditions. and bit information. The serial interface consists of 4 pins: SDIx (serial data input), SDOx (serial data output), SCKx (shift clock input or output), and SSx (active-low slave select). In Master mode operation, SCK is a clock output but in Slave mode, it is a clock input. FIGURE 16-1: SPI MODULE BLOCK DIAGRAM SCKx 1:1 to 1:8 1:1/4/16/64 Secondary Primary FCY Prescaler Prescaler SSx Sync Control Select Control Clock Edge SPIxCON1<1:0> Shift Control SPIxCON1<4:2> SDOx Enable SDIx bit 0 Master Clock SPIxSR Transfer Transfer SPIxRXB SPIxTXB SPIxBUF Read SPIxBUF Write SPIxBUF 16 Internal Data Bus 2009-2012 Microchip Technology Inc. DS70593D-page 181
dsPIC33FJXXXGPX06A/X08A/X10A 16.1 SPI Helpful Tips 16.2 SPI Resources 1. In Frame mode, if there is a possibility that the Many useful resources related to SPI are provided on master may not be initialized before the slave: the main product page of the Microchip web site for the a) If FRMPOL (SPIxCON2<13>) = 1, use a devices listed in this data sheet. This product page, pull-down resistor on SSx. which can be accessed using this link, contains the latest updates and additional information. b) If FRMPOL = 0, use a pull-up resistor on SSx. Note: In the event you are not able to access the Note: This insures that the first frame product page using the link above, enter transmission after initialization is not this URL in your browser: shifted or corrupted. http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en546064 2. In non-framed 3-wire mode, (i.e., not using SSx from a master): 16.2.1 KEY RESOURCES a) If CKP (SPIxCON1<6>) = 1, always place a • Section 18. “Serial Peripheral Interface (SPI)” pull-up resistor on SSx. (DS70206) b) If CKP = 0, always place a pull-down • Code Samples resistor on SSx. • Application Notes Note: This will insure that during power-up and • Software Libraries initialization the master/slave will not lose • Webinars sync due to an errant SCK transition that would cause the slave to accumulate data • All related dsPIC33F/PIC24H Family Reference shift errors for both transmit and receive Manuals Sections appearing as corrupted data. • Development Tools 3. FRMEN (SPIxCON2<15>) = 1 and SSEN (SPIxCON1<7>) = 1 are exclusive and invalid. In Frame mode, SCKx is continuous and the Frame sync pulse is active on the SSx pin, which indicates the start of a data frame. Note: Not all third-party devices support Frame mode timing. Refer to the SPI electrical characteristics for details. 4. In Master mode only, set the SMP bit (SPIxCON1<9>) to a ‘1’ for the fastest SPI data rate possible. The SMP bit can only be set at the same time or after the MSTEN bit (SPIxCON1<5>) is set. 5. To avoid invalid slave read data to the master, the user’s master software must guarantee enough time for slave software to fill its write buf- fer before the user application initiates a master write/read cycle. It is always advisable to pre- load the SPIxBUF transmit register in advance of the next master transaction cycle. SPIxBUF is transferred to the SPI shift register and is empty once the data transmission begins. DS70593D-page 182 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 16.3 SPI Control Registers REGISTER 16-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 SPIEN — SPISIDL — — — — — bit 15 bit 8 U-0 R/C-0 U-0 U-0 U-0 U-0 R-0 R-0 — SPIROV — — — — SPITBF SPIRBF bit 7 bit 0 Legend: C = Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 SPIEN: SPIx Enable bit 1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins 0 = Disables module bit 14 Unimplemented: Read as ‘0’ bit 13 SPISIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 SPIROV: Receive Overflow Flag bit 1 = A new byte/word is completely received and discarded. The user software has not read the previous data in the SPIxBUF register 0 = No overflow has occurred bit 5-2 Unimplemented: Read as ‘0’ bit 1 SPITBF: SPIx Transmit Buffer Full Status bit 1 = Transmit not yet started, SPIxTXB is full 0 = Transmit started, SPIxTXB is empty Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB. Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR. bit 0 SPIRBF: SPIx Receive Buffer Full Status bit 1 = Receive complete, SPIxRXB is full 0 = Receive is not complete, SPIxRXB is empty Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB. Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB. 2009-2012 Microchip Technology Inc. DS70593D-page 183
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 16-2: SPIXCON1: SPIx CONTROL REGISTER 1 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — DISSCK DISSDO MODE16 SMP CKE(1) bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SSEN(3) CKP MSTEN SPRE<2:0>(2) PPRE<1:0>(2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12 DISSCK: Disable SCKx pin bit (SPI Master modes only) 1 = Internal SPI clock is disabled, pin functions as I/O 0 = Internal SPI clock is enabled bit 11 DISSDO: Disable SDOx pin bit 1 = SDOx pin is not used by module; pin functions as I/O 0 = SDOx pin is controlled by the module bit 10 MODE16: Word/Byte Communication Select bit 1 = Communication is word-wide (16 bits) 0 = Communication is byte-wide (8 bits) bit 9 SMP: SPIx Data Input Sample Phase bit Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time Slave mode: SMP must be cleared when SPIx is used in Slave mode. bit 8 CKE: SPIx Clock Edge Select bit(1) 1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6) 0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6) bit 7 SSEN: Slave Select Enable bit (Slave mode)(3) 1 = SSx pin used for Slave mode 0 = SSx pin not used by module. Pin controlled by port function bit 6 CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level; active state is a low level 0 = Idle state for clock is a low level; active state is a high level bit 5 MSTEN: Master Mode Enable bit 1 = Master mode 0 = Slave mode Note 1: The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed SPI modes (FRMEN = 1). 2: Do not set both Primary and Secondary prescalers to a value of 1:1. 3: This bit must be cleared when FRMEN = 1. DS70593D-page 184 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 16-2: SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED) bit 4-2 SPRE<2:0>: Secondary Prescale bits (Master mode)(2) 111 = Secondary prescale 1:1 110 = Secondary prescale 2:1 • • • 000 = Secondary prescale 8:1 bit 1-0 PPRE<1:0>: Primary Prescale bits (Master mode)(2) 11 = Primary prescale 1:1 10 = Primary prescale 4:1 01 = Primary prescale 16:1 00 = Primary prescale 64:1 Note 1: The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed SPI modes (FRMEN = 1). 2: Do not set both Primary and Secondary prescalers to a value of 1:1. 3: This bit must be cleared when FRMEN = 1. 2009-2012 Microchip Technology Inc. DS70593D-page 185
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 16-3: SPIxCON2: SPIx CONTROL REGISTER 2 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 FRMEN SPIFSD FRMPOL — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0 — — — — — — FRMDLY — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 FRMEN: Framed SPIx Support bit 1 = Framed SPIx support enabled (SSx pin used as frame sync pulse input/output) 0 = Framed SPIx support disabled bit 14 SPIFSD: Frame Sync Pulse Direction Control bit 1 = Frame sync pulse input (slave) 0 = Frame sync pulse output (master) bit 13 FRMPOL: Frame Sync Pulse Polarity bit 1 = Frame sync pulse is active-high 0 = Frame sync pulse is active-low bit 12-2 Unimplemented: Read as ‘0’ bit 1 FRMDLY: Frame Sync Pulse Edge Select bit 1 = Frame sync pulse coincides with first bit clock 0 = Frame sync pulse precedes first bit clock bit 0 Unimplemented: Read as ‘0’ This bit must not be set to ‘1’ by the user application. DS70593D-page 186 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 17.0 INTER-INTEGRATED 17.1 Operating Modes CIRCUIT™ (I2C™) The hardware fully implements all the master and slave functions of the I2C Standard and Fast mode Note1: This data sheet summarizes the features specifications, as well as 7 and 10-bit addressing. of the dsPIC33FJXXXGPX06A/X08A/ X10A family of devices. However, it is not The I2C module can operate either as a slave or a intended to be a comprehensive refer- master on an I2C bus. ence source. To complement the infor- The following types of I2C operation are supported: mation in this data sheet, refer to Section 19. “Inter-Integrated Circuit™ (I2C™)” • I2C slave operation with 7-bit addressing (DS70195) in the “dsPIC33F/PIC24H • I2C slave operation with 10-bit addressing Family Reference Manual”, which is • I2C master operation with 7-bit or 10-bit addressing available from the Microchip web site For details about the communication sequence in each (www.microchip.com). of these modes, please refer to the “dsPIC33F/PIC24H 2: Some registers and associated bits Family Reference Manual”. described in this section may not be available on all devices. Refer to Section4.0 “Memory Organization” in this data sheet for device-specific register and bit information. The Inter-Integrated Circuit (I2C) module provides complete hardware support for both Slave and Multi-Master modes of the I2C serial communication standard, with a 16-bit interface. The dsPIC33FJXXXGPX06A/X08A/X10A devices have up to two I2C interface modules, denoted as I2C1 and I2C2. Each I2C module has a 2-pin interface: the SCLx pin is clock and the SDAx pin is data. Each I2C module ‘x’ (x = 1 or 2) offers the following key features: • I2C interface supporting both master and slave operation • I2C Slave mode supports 7-bit and 10-bit addressing • I2C Master mode supports 7-bit and 10-bit addressing • I2C Port allows bidirectional transfers between master and slaves • Serial clock synchronization for I2C port can be used as a handshake mechanism to suspend and resume serial transfer (SCLREL control) • I2C supports multi-master operation; detects bus collision and will arbitrate accordingly 2009-2012 Microchip Technology Inc. DS70593D-page 187
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 17-1: I2C™ BLOCK DIAGRAM (X = 1 OR 2) Internal Data Bus I2CxRCV Read Shift SCLx Clock I2CxRSR LSb SDAx Address Match Match Detect Write I2CxMSK Write Read I2CxADD Read Start and Stop Bit Detect Write Start and Stop Bit Generation I2CxSTAT c gi Read o CDoellitseicotn ntrol L Write o C I2CxCON Acknowledge Generation Read Clock Stretching Write I2CxTRN LSb Read ShiftClock Reload Control Write BRG Down Counter I2CxBRG Read TCY/2 DS70593D-page 188 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 17.2 2C Resources 17.3 I2C Control Registers Many useful resources related to I2C are provided on I2CxCON and I2CxSTAT are control and status the main product page of the Microchip web site for the registers, respectively. The I2CxCON register is devices listed in this data sheet. This product page, readable and writable. The lower six bits of I2CxSTAT which can be accessed using this link, contains the are read-only. The remaining bits of the I2CSTAT are latest updates and additional information. read/write. Note: In the event you are not able to access the I2CxRSR is the shift register used for shifting data, product page using the link above, enter whereas I2CxRCV is the buffer register to which data this URL in your browser: bytes are written, or from which data bytes are read. http://www.microchip.com/wwwproducts/ I2CxRCV is the receive buffer. I2CxTRN is the transmit Devices.aspx?dDocName=en546064 register to which bytes are written during a transmit operation. 17.2.1 KEY RESOURCES The I2CxADD register holds the slave address. A • Section 11. “Inter-Integrated Circuit™ (I2C™)” status bit, ADD10, indicates 10-bit Address mode. The (DS70195) I2CxBRG acts as the Baud Rate Generator (BRG) reload value. • Code Samples • Application Notes In receive operations, I2CxRSR and I2CxRCV together form a double-buffered receiver. When I2CxRSR • Software Libraries receives a complete byte, it is transferred to I2CxRCV • Webinars and an interrupt pulse is generated. • All related dsPIC33F/PIC24H Family Reference Manuals Sections • Development Tools 2009-2012 Microchip Technology Inc. DS70593D-page 189
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 17-1: I2CxCON: I2Cx CONTROL REGISTER R/W-0 U-0 R/W-0 R/W-1 HC R/W-0 R/W-0 R/W-0 R/W-0 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit W = Writable bit HS = Set in hardware HC = Cleared in hardware -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 I2CEN: I2Cx Enable bit 1 = Enables the I2Cx module and configures the SDAx and SCLx pins as serial port pins 0 = Disables the I2Cx module. All I2C pins are controlled by port functions bit 14 Unimplemented: Read as ‘0’ bit 13 I2CSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters an Idle mode 0 = Continue module operation in Idle mode bit 12 SCLREL: SCLx Release Control bit (when operating as I2C slave) 1 = Release SCLx clock 0 = Hold SCLx clock low (clock stretch) If STREN = 1: Bit is R/W (i.e., software may write ‘0’ to initiate stretch and write ‘1’ to release clock). Hardware clear at beginning of slave transmission. Hardware clear at end of slave reception. If STREN = 0: Bit is R/S (i.e., software may only write ‘1’ to release clock). Hardware clear at beginning of slave transmission. bit 11 IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit 1 = IPMI mode is enabled; all addresses Acknowledged 0 = IPMI mode disabled bit 10 A10M: 10-bit Slave Address bit 1 = I2CxADD is a 10-bit slave address 0 = I2CxADD is a 7-bit slave address bit 9 DISSLW: Disable Slew Rate Control bit 1 = Slew rate control disabled 0 = Slew rate control enabled bit 8 SMEN: SMBus Input Levels bit 1 = Enable I/O pin thresholds compliant with SMBus specification 0 = Disable SMBus input thresholds bit 7 GCEN: General Call Enable bit (when operating as I2C slave) 1 = Enable interrupt when a general call address is received in the I2CxRSR (module is enabled for reception) 0 = General call address disabled bit 6 STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave) Used in conjunction with SCLREL bit. 1 = Enable software or receive clock stretching 0 = Disable software or receive clock stretching DS70593D-page 190 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 17-1: I2CxCON: I2Cx CONTROL REGISTER (CONTINUED) bit 5 ACKDT: Acknowledge Data bit (when operating as I2C master, applicable during master receive) Value that will be transmitted when the software initiates an Acknowledge sequence. 1 = Send NACK during Acknowledge 0 = Send ACK during Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (when operating as I2C master, applicable during master receive) 1 = Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit. Hardware clear at end of master Acknowledge sequence 0 = Acknowledge sequence not in progress bit 3 RCEN: Receive Enable bit (when operating as I2C master) 1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte 0 = Receive sequence not in progress bit 2 PEN: Stop Condition Enable bit (when operating as I2C master) 1 = Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence 0 = Stop condition not in progress bit 1 RSEN: Repeated Start Condition Enable bit (when operating as I2C master) 1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of master Repeated Start sequence 0 = Repeated Start condition not in progress bit 0 SEN: Start Condition Enable bit (when operating as I2C master) 1 = Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence 0 = Start condition not in progress 2009-2012 Microchip Technology Inc. DS70593D-page 191
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 17-2: I2CxSTAT: I2Cx STATUS REGISTER R-0 HSC R-0 HSC U-0 U-0 U-0 R/C-0 HS R-0 HSC R-0 HSC ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 bit 15 bit 8 R/C-0 HS R/C-0 HS R-0 HSC R/C-0 HSC R/C-0 HSC R-0 HSC R-0 HSC R-0 HSC IWCOL I2COV D_A P S R_W RBF TBF bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ C = Clear only bit R = Readable bit W = Writable bit HS = Set in hardware HSC = Hardware set/cleared -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ACKSTAT: Acknowledge Status bit (when operating as I2C master, applicable to master transmit operation) 1 = NACK received from slave 0 = ACK received from slave Hardware set or clear at end of slave Acknowledge. bit 14 TRSTAT: Transmit Status bit (when operating as I2C master, applicable to master transmit operation) 1 = Master transmit is in progress (8 bits + ACK) 0 = Master transmit is not in progress Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge. bit 13-11 Unimplemented: Read as ‘0’ bit 10 BCL: Master Bus Collision Detect bit 1 = A bus collision has been detected during a master operation 0 = No collision Hardware set at detection of bus collision. bit 9 GCSTAT: General Call Status bit 1 = General call address was received 0 = General call address was not received Hardware set when address matches general call address. Hardware clear at Stop detection. bit 8 ADD10: 10-Bit Address Status bit 1 = 10-bit address was matched 0 = 10-bit address was not matched Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection. bit 7 IWCOL: Write Collision Detect bit 1 = An attempt to write the I2CxTRN register failed because the I2C module is busy 0 = No collision Hardware set at occurrence of write to I2CxTRN while busy (cleared by software). bit 6 I2COV: Receive Overflow Flag bit 1 = A byte was received while the I2CxRCV register is still holding the previous byte 0 = No overflow Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software). bit 5 D_A: Data/Address bit (when operating as I2C slave) 1 = Indicates that the last byte received was data 0 = Indicates that the last byte received was device address Hardware clear at device address match. Hardware set by reception of slave byte. bit 4 P: Stop bit 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. DS70593D-page 192 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 17-2: I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED) bit 3 S: Start bit 1 = Indicates that a Start (or Repeated Start) bit has been detected last 0 = Start bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. bit 2 R_W: Read/Write Information bit (when operating as I2C slave) 1 = Read - indicates data transfer is output from slave 0 = Write - indicates data transfer is input to slave Hardware set or clear after reception of I2C device address byte. bit 1 RBF: Receive Buffer Full Status bit 1 = Receive complete, I2CxRCV is full 0 = Receive not complete, I2CxRCV is empty Hardware set when I2CxRCV is written with received byte. Hardware clear when software reads I2CxRCV. bit 0 TBF: Transmit Buffer Full Status bit 1 = Transmit in progress, I2CxTRN is full 0 = Transmit complete, I2CxTRN is empty Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission. 2009-2012 Microchip Technology Inc. DS70593D-page 193
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 17-3: I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — AMSK9 AMSK8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 AMSK7 AMSK6 AMSK5 AMSK4 AMSK3 AMSK2 AMSK1 AMSK0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-10 Unimplemented: Read as ‘0’ bit 9-0 AMSKx: Mask for Address Bit x Select bit 1 = Enable masking for bit x of incoming message address; bit match not required in this position 0 = Disable masking for bit x; bit match required in this position DS70593D-page 194 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 18.0 UNIVERSAL ASYNCHRONOUS The primary features of the UART module are: RECEIVER TRANSMITTER • Full-Duplex, 8 or 9-bit Data Transmission through the UxTX and UxRX pins (UART) • Even, Odd or No Parity Options (for 8-bit data) Note1: This data sheet summarizes the fea- • One or Two Stop bits tures of the dsPIC33FJXXXGPX06A/ • Hardware Flow Control Option with UxCTS and X08A/X10A family of devices. How- UxRTS pins ever, it is not intended to be a compre- • Fully Integrated Baud Rate Generator with 16-bit hensive reference source. To Prescaler complement the information in this data • Baud rates ranging from 10 Mbps to 38 bps at 40 sheet, refer to Section 17. “UART” MIPS (DS70188) in the “dsPIC33F/PIC24H • 4-deep First-In-First-Out (FIFO) Transmit Data Family Reference Manual”, which is Buffer available from the Microchip web site • 4-Deep FIFO Receive Data Buffer (www.microchip.com). • Parity, Framing and Buffer Overrun Error Detection 2: Some registers and associated bits • Support for 9-bit mode with Address Detect described in this section may not be (9th bit = 1) available on all devices. Refer to • Transmit and Receive Interrupts Section4.0 “Memory Organization” in • A Separate Interrupt for all UART Error Conditions this data sheet for device-specific register • Loopback mode for Diagnostic Support and bit information. • Support for Sync and Break Characters The Universal Asynchronous Receiver Transmitter • Supports Automatic Baud Rate Detection (UART) module is one of the serial I/O modules • IrDA® Encoder and Decoder Logic available in the dsPIC33FJXXXGPX06A/X08A/X10A • 16x Baud Clock Output for IrDA® Support device family. The UART is a full-duplex asynchronous A simplified block diagram of the UART is shown in system that can communicate with peripheral devices, Figure18-1. The UART module consists of the key such as personal computers, LIN, RS-232 and RS-485 important hardware elements: interfaces. The module also supports a hardware flow control option with the UxCTS and UxRTS pins and • Baud Rate Generator also includes an IrDA® encoder and decoder. • Asynchronous Transmitter • Asynchronous Receiver FIGURE 18-1: UART SIMPLIFIED BLOCK DIAGRAM Baud Rate Generator IrDA® Hardware Flow Control UxRTS/BCLK UxCTS UART Receiver UxRX UART Transmitter UxTX Note1: Both UART1 and UART2 can trigger a DMA data transfer. If U1TX, U1RX, U2TX or U2RX is selected as a DMA IRQ source, a DMA transfer occurs when the U1TXIF, U1RXIF, U2TXIF or U2RXIF bit gets set as a result of a UART1 or UART2 transmission or reception. 2: If DMA transfers are required, the UART TX/RX FIFO buffer must be set to a size of 1 byte/word (i.e., UTXISEL<1:0> = 00 and URXISEL<1:0> = 00). 2009-2012 Microchip Technology Inc. DS70593D-page 195
dsPIC33FJXXXGPX06A/X08A/X10A 18.1 UART Helpful Tips 18.2 UART Resources 1. In multi-node direct-connect UART networks, Many useful resources related to UART are provided UART receive inputs react to the on the main product page of the Microchip web site for complementary logic level defined by the the devices listed in this data sheet. This product page, URXINV bit (UxMODE<4>), which defines the which can be accessed using this link, contains the idle state, the default of which is logic high, (i.e., latest updates and additional information. URXINV = 0). Because remote devices do not Note: In the event you are not able to access the initialize at the same time, it is likely that one of product page using the link above, enter the devices, because the RX line is floating, will this URL in your browser: trigger a start bit detection and will cause the http://www.microchip.com/wwwproducts/ first byte received after the device has been ini- Devices.aspx?dDocName=en546064 tialized to be invalid. To avoid this situation, the user should use a pull-up or pull-down resistor 18.2.1 KEY RESOURCES on the RX pin depending on the value of the URXINV bit. • Section 17. “UART” (DS70188) a) If URXINV = 0, use a pull-up resistor on the • Code Samples RX pin. • Application Notes b) If URXINV = 1, use a pull-down resistor on • Software Libraries the RX pin. • Webinars 2. The first character received on a wake-up from • All related dsPIC33F/PIC24H Family Reference Sleep mode caused by activity on the UxRX pin Manuals Sections of the UART module will be invalid. In Sleep • Development Tools mode, peripheral clocks are disabled. By the time the oscillator system has restarted and stabilized from Sleep mode, the baud rate bit sampling clock relative to the incoming UxRX bit timing is no longer synchronized, resulting in the first character being invalid. This is to be expected. DS70593D-page 196 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 18.3 UART Control Registers REGISTER 18-1: UxMODE: UARTx MODE REGISTER R/W-0 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 UARTEN(1) — USIDL IREN(2) RTSMD — UEN<1:0> bit 15 bit 8 R/W-0 HC R/W-0 R/W-0 HC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WAKE LPBACK ABAUD URXINV BRGH PDSEL<1:0> STSEL bit 7 bit 0 Legend: HC = Hardware cleared R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 UARTEN: UARTx Enable bit(1) 1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0> 0 = UARTx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption minimal bit 14 Unimplemented: Read as ‘0’ bit 13 USIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12 IREN: IrDA® Encoder and Decoder Enable bit(2) 1 = IrDA® encoder and decoder enabled 0 = IrDA® encoder and decoder disabled bit 11 RTSMD: Mode Selection for UxRTS Pin bit 1 = UxRTS pin in Simplex mode 0 = UxRTS pin in Flow Control mode bit 10 Unimplemented: Read as ‘0’ bit 9-8 UEN<1:0>: UARTx Pin Enable bits 11 = UxTX, UxRX and BCLK pins are enabled and used; UxCTS pin controlled by port latches 10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used 01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches 00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins controlled by port latches bit 7 WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit 1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge; bit cleared in hardware on following rising edge 0 = No wake-up enabled bit 6 LPBACK: UARTx Loopback Mode Select bit 1 = Enable Loopback mode 0 = Loopback mode is disabled bit 5 ABAUD: Auto-Baud Enable bit 1 = Enable baud rate measurement on the next character - requires reception of a Sync field (55h) before other data; cleared in hardware upon completion 0 = Baud rate measurement disabled or completed Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for information on enabling the UART module for receive or transmit operation. 2: This feature is only available for the 16x BRG mode (BRGH=0). 2009-2012 Microchip Technology Inc. DS70593D-page 197
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 18-1: UxMODE: UARTx MODE REGISTER (CONTINUED) bit 4 URXINV: Receive Polarity Inversion bit 1 = UxRX Idle state is ‘0’ 0 = UxRX Idle state is ‘1’ bit 3 BRGH: High Baud Rate Enable bit 1 = BRG generates 4 clocks per bit period (4x baud clock, High-Speed mode) 0 = BRG generates 16 clocks per bit period (16x baud clock, Standard mode) bit 2-1 PDSEL<1:0>: Parity and Data Selection bits 11 = 9-bit data, no parity 10 = 8-bit data, odd parity 01 = 8-bit data, even parity 00 = 8-bit data, no parity bit 0 STSEL: Stop Bit Selection bit 1 = Two Stop bits 0 = One Stop bit Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for information on enabling the UART module for receive or transmit operation. 2: This feature is only available for the 16x BRG mode (BRGH=0). DS70593D-page 198 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 18-2: UxSTA: UARTx STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 U-0 R/W-0 HC R/W-0 R-0 R-1 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN(1) UTXBF TRMT bit 15 bit 8 R/W-0 R/W-0 R/W-0 R-1 R-0 R-0 R/C-0 R-0 URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA bit 7 bit 0 Legend: HC = Hardware cleared C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15,13 UTXISEL<1:0>: Transmission Interrupt Mode Selection bits 11 = Reserved; do not use 10 = Interrupt when a character is transferred to the Transmit Shift Register, and as a result, the transmit buffer becomes empty 01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit operations are completed 00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is at least one character open in the transmit buffer) bit 14 UTXINV: Transmit Polarity Inversion bit If IREN = 0: 1 = UxTX Idle state is ‘0’ 0 = UxTX Idle state is ‘1’ If IREN = 1: 1 = IrDA® encoded UxTX Idle state is ‘1’ 0 = IrDA® encoded UxTX Idle state is ‘0’ bit 12 Unimplemented: Read as ‘0’ bit 11 UTXBRK: Transmit Break bit 1 = Send Sync Break on next transmission - Start bit, followed by twelve ‘0’ bits, followed by Stop bit; cleared by hardware upon completion 0 = Sync Break transmission disabled or completed bit 10 UTXEN: Transmit Enable bit(1) 1 = Transmit enabled, UxTX pin controlled by UARTx 0 = Transmit disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled by port bit 9 UTXBF: Transmit Buffer Full Status bit (read-only) 1 = Transmit buffer is full 0 = Transmit buffer is not full, at least one more character can be written bit 8 TRMT: Transmit Shift Register Empty bit (read-only) 1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed) 0 = Transmit Shift Register is not empty, a transmission is in progress or queued bit 7-6 URXISEL<1:0>: Receive Interrupt Mode Selection bits 11 = Interrupt is set on UxRSR transfer making the receive buffer full (i.e., has 4 data characters) 10 = Interrupt is set on UxRSR transfer making the receive buffer 3/4 full (i.e., has 3 data characters) 0x = Interrupt is set when any character is received and transferred from the UxRSR to the receive buffer. Receive buffer has one or more characters Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for information on enabling the UART module for transmit operation. 2009-2012 Microchip Technology Inc. DS70593D-page 199
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 18-2: UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED) bit 5 ADDEN: Address Character Detect bit (bit 8 of received data=1) 1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect 0 = Address Detect mode disabled bit 4 RIDLE: Receiver Idle bit (read-only) 1 = Receiver is Idle 0 = Receiver is active bit 3 PERR: Parity Error Status bit (read-only) 1 = Parity error has been detected for the current character (character at the top of the receive FIFO) 0 = Parity error has not been detected bit 2 FERR: Framing Error Status bit (read-only) 1 = Framing error has been detected for the current character (character at the top of the receive FIFO) 0 = Framing error has not been detected bit 1 OERR: Receive Buffer Overrun Error Status bit (read/clear only) 1 = Receive buffer has overflowed 0 = Receive buffer has not overflowed. Clearing a previously set OERR bit (10 transition) will reset the receiver buffer and the UxRSR to the empty state bit 0 URXDA: Receive Buffer Data Available bit (read-only) 1 = Receive buffer has data, at least one more character can be read 0 = Receive buffer is empty Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for information on enabling the UART module for transmit operation. DS70593D-page 200 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 19.0 ENHANCED CAN (ECAN™) • Signaling via interrupt capabilities for all CAN receiver and transmitter error states MODULE • Programmable clock source Note1: This data sheet summarizes the fea- • Programmable link to input capture module (IC2 tures of the dsPIC33FJXXXGPX06A/ for both CAN1 and CAN2) for time-stamping and X08A/X10A family of devices. How- network synchronization ever, it is not intended to be a compre- • Low-power Sleep and Idle mode hensive reference source. To The CAN bus module consists of a protocol engine and complement the information in this data message buffering/control. The CAN protocol engine sheet, refer to Section 21. “Enhanced handles all functions for receiving and transmitting Controller Area Network (ECAN™)” messages on the CAN bus. Messages are transmitted (DS70185) in the “dsPIC33F/PIC24H by first loading the appropriate data registers. Status Family Reference Manual”, which is and errors can be checked by reading the appropriate available from the Microchip web site registers. Any message detected on the CAN bus is (www.microchip.com). checked for errors and then matched against filters to 2: Some registers and associated bits see if it should be received and stored in one of the described in this section may not be receive registers. available on all devices. Refer to 19.2 Frame Types Section4.0 “Memory Organization” in this data sheet for device-specific register The CAN module transmits various types of frames and bit information. which include data messages, or remote transmission requests initiated by the user, as other frames that are 19.1 Overview automatically generated for control purposes. The following frame types are supported: The Enhanced Controller Area Network (ECAN) mod- ule is a serial interface, useful for communicating with • Standard Data Frame: other CAN modules or microcontroller devices. This A standard data frame is generated by a node when interface/protocol was designed to allow communica- the node wishes to transmit data. It includes an tions within noisy environments. The 11-bit Standard Identifier (SID), but not an 18-bit dsPIC33FJXXXGPX06A/X08A/X10A devices contain Extended Identifier (EID). up to two ECAN modules. • Extended Data Frame: The CAN module is a communication controller imple- An extended data frame is similar to a standard data menting the CAN 2.0 A/B protocol, as defined in the frame, but also includes an extended identifier. BOSCH specification. The module will support CAN1.2, CAN 2.0A, CAN 2.0B Passive and CAN 2.0B Active • Remote Frame: versions of the protocol. The module implementation is It is possible for a destination node to request the a full CAN system. The CAN specification is not covered data from the source. For this purpose, the within this data sheet. The reader may refer to the destination node sends a remote frame with an iden- BOSCH CAN specification for further details. tifier that matches the identifier of the required data The module features are as follows: frame. The appropriate data source node will then send a data frame as a response to this remote • Implementation of the CAN protocol, CAN1.2, request. CAN2.0A and CAN2.0B • Standard and extended data frames • Error Frame: • 0-8 bytes data length An error frame is generated by any node that detects • Programmable bit rate up to 1 Mbit/sec a bus error. An error frame consists of two fields: an error flag field and an error delimiter field. • Automatic response to remote transmission requests • Overload Frame: • Up to eight transmit buffers with application speci- An overload frame can be generated by a node as a fied prioritization and abort capability (each buffer result of two conditions. First, the node detects a may contain up to 8 bytes of data) dominant bit during interframe space which is an ille- • Up to 32 receive buffers (each buffer may contain gal condition. Second, due to internal conditions, the up to 8 bytes of data) node is not yet able to start reception of the next • Up to 16 full (standard/extended identifier) message. A node may generate a maximum of two acceptance filters sequential overload frames to delay the start of the next message. • Three full acceptance filter masks • DeviceNet™ addressing support • Interframe Space: • Programmable wake-up functionality with Interframe space separates a proceeding frame (of integrated low-pass filter whatever type) from a following data or remote • Programmable Loopback mode supports self-test frame. operation 2009-2012 Microchip Technology Inc. DS70593D-page 201
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 19-1: ECAN™ MODULE BLOCK DIAGRAM RXF15 Filter RXF14 Filter RXF13 Filter RXF12 Filter RXF11 Filter DMA Controller RXF10 Filter RXF9 Filter RXF8 Filter TRB7 TX/RX Buffer Control Register RXF7 Filter TRB6 TX/RX Buffer Control Register RXF6 Filter TRB5 TX/RX Buffer Control Register RXF5 Filter TRB4 TX/RX Buffer Control Register RXF4 Filter TRB3 TX/RX Buffer Control Register RXF3 Filter TRB2 TX/RX Buffer Control Register RXF2 Filter RXM2 Mask TRB1 TX/RX Buffer Control Register RXF1 Filter RXM1 Mask TRB0 TX/RX Buffer Control Register RXF0 Filter RXM0 Mask Transmit Byte Message Assembly Sequencer Buffer Control CPU Configuration Bus Logic CAN Protocol Engine Interrupts CiTX(1) CiRX(1) Note 1: i = 1 or 2 refers to a particular ECAN™ module (ECAN1 or ECAN2). DS70593D-page 202 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 19.3 Modes of Operation The module can be programmed to apply a low-pass filter function to the CiRX input line while the module or The CAN module can operate in one of several operation the CPU is in Sleep mode. The WAKFIL bit modes selected by the user. These modes include: (CiCFG2<14>) enables or disables the filter. • Initialization Mode Note: Typically, if the CAN module is allowed to • Disable Mode transmit in a particular mode of operation • Normal Operation Mode and a transmission is requested • Listen Only Mode immediately after the CAN module has • Listen All Messages Mode been placed in that mode of operation, the • Loopback Mode module waits for 11 consecutive recessive bits on the bus before starting Modes are requested by setting the REQOP<2:0> bits transmission. If the user switches to (CiCTRL1<10:8>). Entry into a mode is Acknowledged Disable mode within this 11-bit period, by monitoring the OPMODE<2:0> bits then this transmission is aborted and the (CiCTRL1<7:5>). The module will not change the mode corresponding TXABT bit is set and and the OPMODE bits until a change in mode is TXREQ bit is cleared. acceptable, generally during bus Idle time, which is defined as at least 11 consecutive recessive bits. 19.3.3 NORMAL OPERATION MODE 19.3.1 INITIALIZATION MODE Normal Operation mode is selected when In the Initialization mode, the module will not transmit or REQOP<2:0>=000. In this mode, the module is receive. The error counters are cleared and the activated and the I/O pins will assume the CAN bus interrupt flags remain unchanged. The programmer will functions. The module will transmit and receive CAN have access to Configuration registers that are access bus messages via the CiTX and CiRX pins. restricted in other modes. The module will protect the 19.3.4 LISTEN ONLY MODE user from accidentally violating the CAN protocol through programming errors. All registers which control If the Listen Only mode is activated, the module on the the configuration of the module cannot be modified CAN bus is passive. The transmitter buffers revert to while the module is on-line. The CAN module will not the port I/O function. The receive pins remain inputs. be allowed to enter the Configuration mode while a For the receiver, no error flags or Acknowledge signals transmission is taking place. The Configuration mode are sent. The error counters are deactivated in this serves as a lock to protect the following registers: state. The Listen Only mode can be used for detecting the baud rate on the CAN bus. To use this, it is • All Module Control Registers necessary that there are at least two further nodes that • Baud Rate and Interrupt Configuration Registers communicate with each other. • Bus Timing Registers • Identifier Acceptance Filter Registers 19.3.5 LISTEN ALL MESSAGES MODE • Identifier Acceptance Mask Registers The module can be set to ignore all errors and receive 19.3.2 DISABLE MODE any message. The Listen All Messages mode is activated by setting REQOP<2:0> = ‘111’. In this In Disable mode, the module will not transmit or mode, the data which is in the message assembly buf- receive. The module has the ability to set the WAKIF bit fer, until the time an error occurred, is copied in the due to bus activity, however, any pending interrupts will receive buffer and can be read via the CPU interface. remain and the error counters will retain their value. 19.3.6 LOOPBACK MODE If the REQOP<2:0> bits (CiCTRL1<10:8>) = 001, the module will enter the Module Disable mode. If the module If the Loopback mode is activated, the module will is active, the module will wait for 11 recessive bits on the connect the internal transmit signal to the internal CAN bus, detect that condition as an Idle bus, then receive signal at the module boundary. The transmit accept the module disable command. When the and receive pins revert to their port I/O function. OPMODE<2:0> bits (CiCTRL1<7:5>)=001, that indicates whether the module successfully went into Module Disable mode. The I/O pins will revert to normal I/O function when the module is in the Module Disable mode. 2009-2012 Microchip Technology Inc. DS70593D-page 203
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-1: CiCTRL1: ECAN™ CONTROL REGISTER 1 U-0 U-0 R/W-0 R/W-0 r-0 R/W-1 R/W-0 R/W-0 — — CSIDL ABAT — REQOP<2:0> bit 15 bit 8 R-1 R-0 R-0 U-0 R/W-0 U-0 U-0 R/W-0 OPMODE<2:0> — CANCAP — — WIN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared r = Bit is Reserved bit 15-14 Unimplemented: Read as ‘0’ bit 13 CSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12 ABAT: Abort All Pending Transmissions bit 1 = Signal all transmit buffers to abort transmission 0 = Module will clear this bit when all transmissions are aborted bit 11 Reserved: Do not use bit 10-8 REQOP<2:0>: Request Operation Mode bits 111 = Set Listen All Messages mode 110 = Reserved - do not use 101 = Reserved - do not use 100 = Set Configuration mode 011 = Set Listen Only Mode 010 = Set Loopback mode 001 = Set Disable mode 000 = Set Normal Operation mode bit 7-5 OPMODE<2:0>: Operation Mode bits 111 = Module is in Listen All Messages mode 110 = Reserved 101 = Reserved 100 = Module is in Configuration mode 011 = Module is in Listen Only mode 010 = Module is in Loopback mode 001 = Module is in Disable mode 000 = Module is in Normal Operation mode bit 4 Unimplemented: Read as ‘0’ bit 3 CANCAP: CAN Message Receive Timer Capture Event Enable bit 1 = Enable input capture based on CAN message receive 0 = Disable CAN capture bit 2-1 Unimplemented: Read as ‘0’ bit 0 WIN: SFR Map Window Select bit 1 = Use filter window 0 = Use buffer window DS70593D-page 204 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-2: CiCTRL2: ECAN™ CONTROL REGISTER 2 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 R-0 R-0 R-0 R-0 R-0 — — — DNCNT<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-5 Unimplemented: Read as ‘0’ bit 4-0 DNCNT<4:0>: DeviceNet™ Filter Bit Number bits 11111 = Invalid selection • • • 10010 = Invalid selection 10001 = Compare up to data byte 3, bit 6 with EID<17> • • • 00001 = Compare up to data byte 1, bit 7 with EID<0> 00000 = Do not compare data bytes 2009-2012 Microchip Technology Inc. DS70593D-page 205
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-3: CiVEC: ECAN™ INTERRUPT CODE REGISTER U-0 U-0 U-0 R-0 R-0 R-0 R-0 R-0 — — — FILHIT<4:0> bit 15 bit 8 U-0 R-1 R-0 R-0 R-0 R-0 R-0 R-0 — ICODE<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 FILHIT<4:0>: Filter Hit Number bits 10000-11111 = Reserved 01111 = Filter 15 • • • 00001 = Filter 1 00000 = Filter 0 bit 7 Unimplemented: Read as ‘0’ bit 6-0 ICODE<6:0>: Interrupt Flag Code bits 1000101-1111111 = Reserved 1000100 = FIFO almost full interrupt 1000011 = Receiver overflow interrupt 1000010 = Wake-up interrupt 1000001 = Error interrupt 1000000 = No interrupt 0010000-0111111 = Reserved 0001111 = RB15 buffer Interrupt • • • 0001001 = RB9 buffer interrupt 0001000 = RB8 buffer interrupt 0000111 = TRB7 buffer interrupt 0000110 = TRB6 buffer interrupt 0000101 = TRB5 buffer interrupt 0000100 = TRB4 buffer interrupt 0000011 = TRB3 buffer interrupt 0000010 = TRB2 buffer interrupt 0000001 = TRB1 buffer interrupt 0000000 = TRB0 Buffer interrupt DS70593D-page 206 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-4: CiFCTRL: ECAN™ FIFO CONTROL REGISTER R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 DMABS<2:0> — — — — — bit 15 bit 8 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — FSA<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 DMABS<2:0>: DMA Buffer Size bits 111 = Reserved; do not use 110 = 32 buffers in DMA RAM 101 = 24 buffers in DMA RAM 100 = 16 buffers in DMA RAM 011 = 12 buffers in DMA RAM 010 = 8 buffers in DMA RAM 001 = 6 buffers in DMA RAM 000 = 4 buffers in DMA RAM bit 12-5 Unimplemented: Read as ‘0’ bit 4-0 FSA<4:0>: FIFO Area Starts with Buffer bits 11111 = RB31 buffer 11110 = RB30 buffer • • • 00001 = TRB1 buffer 00000 = TRB0 buffer 2009-2012 Microchip Technology Inc. DS70593D-page 207
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-5: CiFIFO: ECAN™ FIFO STATUS REGISTER U-0 U-0 R-0 R-0 R-0 R-0 R-0 R-0 — — FBP<5:0> bit 15 bit 8 U-0 U-0 R-0 R-0 R-0 R-0 R-0 R-0 — — FNRB<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13-8 FBP<5:0>: FIFO Write Buffer Pointer bits 011111 = RB31 buffer 011110 = RB30 buffer • • • 000001 = TRB1 buffer 000000 = TRB0 buffer bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 FNRB<5:0>: FIFO Next Read Buffer Pointer bits 011111 = RB31 buffer 011110 = RB30 buffer • • • 000001 = TRB1 buffer 000000 = TRB0 buffer DS70593D-page 208 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-6: CiINTF: ECAN™ INTERRUPT FLAG REGISTER U-0 U-0 R-0 R-0 R-0 R-0 R-0 R-0 — — TXBO TXBP RXBP TXWAR RXWAR EWARN bit 15 bit 8 R/C-0 R/C-0 R/C-0 U-0 R/C-0 R/C-0 R/C-0 R/C-0 IVRIF WAKIF ERRIF — FIFOIF RBOVIF RBIF TBIF bit 7 bit 0 Legend: C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 TXBO: Transmitter in Error State Bus Off bit 1 = Transmitter is in Bus Off state 0 = Transmitter is not in Bus Off state bit 12 TXBP: Transmitter in Error State Bus Passive bit 1 = Transmitter is in Bus Passive state 0 = Transmitter is not in Bus Passive state bit 11 RXBP: Receiver in Error State Bus Passive bit 1 = Receiver is in Bus Passive state 0 = Receiver is not in Bus Passive state bit 10 TXWAR: Transmitter in Error State Warning bit 1 = Transmitter is in Error Warning state 0 = Transmitter is not in Error Warning state bit 9 RXWAR: Receiver in Error State Warning bit 1 = Receiver is in Error Warning state 0 = Receiver is not in Error Warning state bit 8 EWARN: Transmitter or Receiver in Error State Warning bit 1 = Transmitter or receiver is in Error Warning state 0 = Transmitter or receiver is not in Error Warning state bit 7 IVRIF: Invalid Message Received Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 WAKIF: Bus Wake-up Activity Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 ERRIF: Error Interrupt Flag bit (multiple sources in CiINTF<13:8> register) 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 Unimplemented: Read as ‘0’ bit 3 FIFOIF: FIFO Almost Full Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 RBOVIF: RX Buffer Overflow Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 RBIF: RX Buffer Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 TBIF: TX Buffer Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred 2009-2012 Microchip Technology Inc. DS70593D-page 209
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-7: CiINTE: ECAN™ INTERRUPT ENABLE REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 IVRIE WAKIE ERRIE — FIFOIE RBOVIE RBIE TBIE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7 IVRIE: Invalid Message Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 WAKIE: Bus Wake-up Activity Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 ERRIE: Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 Unimplemented: Read as ‘0’ bit 3 FIFOIE: FIFO Almost Full Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 RBOVIE: RX Buffer Overflow Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 1 RBIE: RX Buffer Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 TBIE: TX Buffer Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled DS70593D-page 210 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-8: CiEC: ECAN™ TRANSMIT/RECEIVE ERROR COUNT REGISTER R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 TERRCNT<7:0> bit 15 bit 8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 RERRCNT<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 TERRCNT<7:0>: Transmit Error Count bits bit 7-0 RERRCNT<7:0>: Receive Error Count bits 2009-2012 Microchip Technology Inc. DS70593D-page 211
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-9: CiCFG1: ECAN™ BAUD RATE CONFIGURATION REGISTER 1 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SJW<1:0> BRP<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 Unimplemented: Read as ‘0’ bit 7-6 SJW<1:0>: Synchronization Jump Width bits 11 = Length is 4 x TQ 10 = Length is 3 x TQ 01 = Length is 2 x TQ 00 = Length is 1 x TQ bit 5-0 BRP<5:0>: Baud Rate Prescaler bits 11 1111 = TQ = 2 x 64 x 1/FCAN • • • 00 0010 = TQ = 2 x 3 x 1/FCAN 00 0001 = TQ = 2 x 2 x 1/FCAN 00 0000 = TQ = 2 x 1 x 1/FCAN DS70593D-page 212 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-10: CiCFG2: ECAN™ BAUD RATE CONFIGURATION REGISTER 2 U-0 R/W-x U-0 U-0 U-0 R/W-x R/W-x R/W-x — WAKFIL — — — SEG2PH<2:0> bit 15 bit 8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14 WAKFIL: Select CAN bus Line Filter for Wake-up bit 1 = Use CAN bus line filter for wake-up 0 = CAN bus line filter is not used for wake-up bit 13-11 Unimplemented: Read as ‘0’ bit 10-8 SEG2PH<2:0>: Phase Buffer Segment 2 bits 111 = Length is 8 x TQ 000 = Length is 1 x TQ bit 7 SEG2PHTS: Phase Segment 2 Time Select bit 1 = Freely programmable 0 = Maximum of SEG1PH bits or Information Processing Time (IPT), whichever is greater bit 6 SAM: Sample of the CAN bus Line bit 1 = Bus line is sampled three times at the sample point 0 = Bus line is sampled once at the sample point bit 5-3 SEG1PH<2:0>: Phase Buffer Segment 1 bits 111 = Length is 8 x TQ 000 = Length is 1 x TQ bit 2-0 PRSEG<2:0>: Propagation Time Segment bits 111 = Length is 8 x TQ 000 = Length is 1 x TQ 2009-2012 Microchip Technology Inc. DS70593D-page 213
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-11: CiFEN1: ECAN™ ACCEPTANCE FILTER ENABLE REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 FLTEN15 FLTEN14 FLTEN13 FLTEN12 FLTEN11 FLTEN10 FLTEN9 FLTEN8 bit 15 bit 8 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 FLTEN7 FLTEN6 FLTEN5 FLTEN4 FLTEN3 FLTEN2 FLTEN1 FLTEN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 FLTENn: Enable Filter n to Accept Messages bits 1 = Enable Filter n 0 = Disable Filter n DS70593D-page 214 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-12: CiBUFPNT1: ECAN™ FILTER 0-3 BUFFER POINTER REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F3BP<3:0> F2BP<3:0> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F1BP<3:0> F0BP<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 F3BP<3:0>: RX Buffer Written when Filter 3 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 11-8 F2BP<3:0>: RX Buffer Written when Filter 2 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 7-4 F1BP<3:0>: RX Buffer Written when Filter 1 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 3-0 F0BP<3:0>: RX Buffer Written when Filter 0 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 2009-2012 Microchip Technology Inc. DS70593D-page 215
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-13: CiBUFPNT2: ECAN™ FILTER 4-7 BUFFER POINTER REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F7BP<3:0> F6BP<3:0> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F5BP<3:0> F4BP<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 F7BP<3:0>: RX Buffer Written when Filter 7 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 11-8 F6BP<3:0>: RX Buffer Written when Filter 6 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 7-4 F5BP<3:0>: RX Buffer Written when Filter 5 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 3-0 F4BP<3:0>: RX Buffer Written when Filter 4 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 DS70593D-page 216 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-14: CiBUFPNT3: ECAN™ FILTER 8-11 BUFFER POINTER REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F11BP<3:0> F10BP<3:0> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F9BP<3:0> F8BP<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 F11BP<3:0>: RX Buffer Written when Filter 11 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 11-8 F10BP<3:0>: RX Buffer Written when Filter 10 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 7-4 F9BP<3:0>: RX Buffer Written when Filter 9 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 3-0 F8BP<3:0>: RX Buffer Written when Filter 8 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 2009-2012 Microchip Technology Inc. DS70593D-page 217
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-15: CiBUFPNT4: ECAN™ FILTER 12-15 BUFFER POINTER REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F15BP<3:0> F14BP<3:0> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F13BP<3:0> F12BP<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 F15BP<3:0>: RX Buffer Written when Filter 15 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 11-8 F14BP<3:0>: RX Buffer Written when Filter 14 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 7-4 F13BP<3:0>: RX Buffer Written when Filter 13 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 bit 3-0 F12BP<3:0>: RX Buffer Written when Filter 12 Hits bits 1111 = Filter hits received in RX FIFO buffer 1110 = Filter hits received in RX Buffer 14 • • • 0001 = Filter hits received in RX Buffer 1 0000 = Filter hits received in RX Buffer 0 DS70593D-page 218 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-16: CiRXFnSID: ECAN™ ACCEPTANCE FILTER n STANDARD IDENTIFIER (n = 0, 1,..., 15) R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x SID<10:3> bit 15 bit 8 R/W-x R/W-x R/W-x U-0 R/W-x U-0 R/W-x R/W-x SID<2:0> — EXIDE — EID<17:16> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-5 SID<10:0>: Standard Identifier bits 1 = Message address bit SIDx must be ‘1’ to match filter 0 = Message address bit SIDx must be ‘0’ to match filter bit 4 Unimplemented: Read as ‘0’ bit 3 EXIDE: Extended Identifier Enable bit If MIDE = 1 then: 1 = Match only messages with extended identifier addresses 0 = Match only messages with standard identifier addresses If MIDE = 0 then: Ignore EXIDE bit. bit 2 Unimplemented: Read as ‘0’ bit 1-0 EID<17:16>: Extended Identifier bits 1 = Message address bit EIDx must be ‘1’ to match filter 0 = Message address bit EIDx must be ‘0’ to match filter REGISTER 19-17: CiRXFnEID: ECAN™ ACCEPTANCE FILTER n EXTENDED IDENTIFIER (n = 0, 1,..., 15) R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<15:8> bit 15 bit 8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 EID<15:0>: Extended Identifier bits 1 = Message address bit EIDx must be ‘1’ to match filter 0 = Message address bit EIDx must be ‘0’ to match filter 2009-2012 Microchip Technology Inc. DS70593D-page 219
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-18: CiFMSKSEL1: ECAN™ FILTER 7-0 MASK SELECTION REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F7MSK<1:0> F6MSK<1:0> F5MSK<1:0> F4MSK<1:0> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F3MSK<1:0> F2MSK<1:0> F1MSK<1:0> F0MSK<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 F7MSK<1:0>: Mask Source for Filter 7 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 13-12 F6MSK<1:0>: Mask Source for Filter 6 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 11-10 F5MSK<1:0>: Mask Source for Filter 5 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 9-8 F4MSK<1:0>: Mask Source for Filter 4 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 7-6 F3MSK<1:0>: Mask Source for Filter 3 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 5-4 F2MSK<1:0>: Mask Source for Filter 2 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 3-2 F1MSK<1:0>: Mask Source for Filter 1 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 1-0 F0MSK<1:0>: Mask Source for Filter 0 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask DS70593D-page 220 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-19: CiFMSKSEL2: ECAN™ FILTER 15-8 MASK SELECTION REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F15MSK<1:0> F14MSK<1:0> F13MSK<1:0> F12MSK<1:0> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 F11MSK<1:0> F10MSK<1:0> F9MSK<1:0> F8MSK<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 F15MSK<1:0>: Mask Source for Filter 15 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 13-12 F14MSK<1:0>: Mask Source for Filter 14 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 11-10 F13MSK<1:0>: Mask Source for Filter 13 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 9-8 F12MSK<1:0>: Mask Source for Filter 12 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 7-6 F11MSK<1:0>: Mask Source for Filter 11 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 5-4 F10MSK<1:0>: Mask Source for Filter 10 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 3-2 F9MSK<1:0>: Mask Source for Filter 9 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask bit 1-0 F8MSK<1:0>: Mask Source for Filter 8 bit 11 = Reserved; do not use 10 = Acceptance Mask 2 registers contain mask 01 = Acceptance Mask 1 registers contain mask 00 = Acceptance Mask 0 registers contain mask 2009-2012 Microchip Technology Inc. DS70593D-page 221
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 19-20: CiRXMnSID: ECAN™ ACCEPTANCE FILTER MASK n STANDARD IDENTIFIER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x SID<10:3> bit 15 bit 8 R/W-x R/W-x R/W-x U-0 R/W-x U-0 R/W-x R/W-x SID<2:0> — MIDE — EID<17:16> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-5 SID<10:0>: Standard Identifier bits 1 = Include bit SIDx in filter comparison 0 = Bit SIDx is don’t care in filter comparison bit 4 Unimplemented: Read as ‘0’ bit 3 MIDE: Identifier Receive Mode bit 1 = Match only message types (standard or extended address) that correspond to EXIDE bit in filter 0 = Match either standard or extended address message if filters match (i.e., if (Filter SID) = (Message SID) or if (Filter SID/EID) = (Message SID/EID)) bit 2 Unimplemented: Read as ‘0’ bit 1-0 EID<17:16>: Extended Identifier bits 1 = Include bit EIDx in filter comparison 0 = Bit EIDx is don’t care in filter comparison REGISTER 19-21: CiRXMnEID: ECAN™ ACCEPTANCE FILTER MASK n EXTENDED IDENTIFIER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<15:8> bit 15 bit 8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 EID<15:0>: Extended Identifier bits 1 = Include bit EIDx in filter comparison 0 = Bit EIDx is don’t care in filter comparison DS70593D-page 222 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-22: CiRXFUL1: ECAN™ RECEIVE BUFFER FULL REGISTER 1 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 RXFUL15 RXFUL14 RXFUL13 RXFUL12 RXFUL11 RXFUL10 RXFUL9 RXFUL8 bit 15 bit 8 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 RXFUL7 RXFUL6 RXFUL5 RXFUL4 RXFUL3 RXFUL2 RXFUL1 RXFUL0 bit 7 bit 0 Legend: C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 RXFUL15:RXFUL0: Receive Buffer n Full bits 1 = Buffer is full (set by module) 0 = Buffer is empty (clear by application software) REGISTER 19-23: CiRXFUL2: ECAN™ RECEIVE BUFFER FULL REGISTER 2 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 RXFUL31 RXFUL30 RXFUL29 RXFUL28 RXFUL27 RXFUL26 RXFUL25 RXFUL24 bit 15 bit 8 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 RXFUL23 RXFUL22 RXFUL21 RXFUL20 RXFUL19 RXFUL18 RXFUL17 RXFUL16 bit 7 bit 0 Legend: C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 RXFUL31:RXFUL16: Receive Buffer n Full bits 1 = Buffer is full (set by module) 0 = Buffer is empty (clear by application software) 2009-2012 Microchip Technology Inc. DS70593D-page 223
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-24: CiRXOVF1: ECAN™ RECEIVE BUFFER OVERFLOW REGISTER 1 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 RXOVF15 RXOVF14 RXOVF13 RXOVF12 RXOVF11 RXOVF10 RXOVF9 RXOVF8 bit 15 bit 8 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 RXOVF7 RXOVF6 RXOVF5 RXOVF4 RXOVF3 RXOVF2 RXOVF1 RXOVF0 bit 7 bit 0 Legend: C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 RXOVF15:RXOVF0: Receive Buffer n Overflow bits 1 = Module pointed a write to a full buffer (set by module) 0 = Overflow is cleared (clear by application software) REGISTER 19-25: CiRXOVF2: ECAN™ RECEIVE BUFFER OVERFLOW REGISTER 2 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 RXOVF31 RXOVF30 RXOVF29 RXOVF28 RXOVF27 RXOVF26 RXOVF25 RXOVF24 bit 15 bit 8 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 RXOVF23 RXOVF22 RXOVF21 RXOVF20 RXOVF19 RXOVF18 RXOVF17 RXOVF16 bit 7 bit 0 Legend: C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 RXOVF31:RXOVF16: Receive Buffer n Overflow bits 1 = Module pointed a write to a full buffer (set by module) 0 = Overflow is cleared (clear by application software) DS70593D-page 224 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-26: CiTRmnCON: ECAN™ TX/RX BUFFER m CONTROL REGISTER (m = 0,2,4,6; n = 1,3,5,7) R/W-0 R-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 TXENn TXABTn TXLARBn TXERRn TXREQn RTRENn TXnPRI<1:0> bit 15 bit 8 R/W-0 R-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 TXENm TXABTm(1) TXLARBm(1) TXERRm(1) TXREQm RTRENm TXmPRI<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-8 See Definition for Bits 7-0, Controls Buffer n bit 7 TXENm: TX/RX Buffer Selection bit 1 = Buffer TRBn is a transmit buffer 0 = Buffer TRBn is a receive buffer bit 6 TXABTm: Message Aborted bit(1) 1 = Message was aborted 0 = Message completed transmission successfully bit 5 TXLARBm: Message Lost Arbitration bit(1) 1 = Message lost arbitration while being sent 0 = Message did not lose arbitration while being sent bit 4 TXERRm: Error Detected During Transmission bit(1) 1 = A bus error occurred while the message was being sent 0 = A bus error did not occur while the message was being sent bit 3 TXREQm: Message Send Request bit Setting this bit to ‘1’ requests sending a message. The bit will automatically clear when the message is successfully sent. Clearing the bit to ‘0’ while set will request a message abort. bit 2 RTRENm: Auto-Remote Transmit Enable bit 1 = When a remote transmit is received, TXREQ will be set 0 = When a remote transmit is received, TXREQ will be unaffected bit 1-0 TXmPRI<1:0>: Message Transmission Priority bits 11 = Highest message priority 10 = High intermediate message priority 01 = Low intermediate message priority 00 = Lowest message priority Note 1: This bit is cleared when TXREQ is set. 2009-2012 Microchip Technology Inc. DS70593D-page 225
dsPIC33FJXXXGPX06A/X08A/X10A Note: The buffers, SID, EID, DLC, Data Field and Receive Status registers are located in DMA RAM. REGISTER 19-27: CiTRBnSID: ECAN™ BUFFER n STANDARD IDENTIFIER (n = 0, 1,..., 31) U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — SID<10:6> bit 15 bit 8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x SID<5:0> SRR IDE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-2 SID<10:0>: Standard Identifier bits bit 1 SRR: Substitute Remote Request bit 1 = Message will request remote transmission 0 = Normal message bit 0 IDE: Extended Identifier bit 1 = Message will transmit extended identifier 0 = Message will transmit standard identifier REGISTER 19-28: CiTRBnEID: ECAN™ BUFFER n EXTENDED IDENTIFIER (n = 0, 1,..., 31) U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x — — — — EID<17:14> bit 15 bit 8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<13:6> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 Unimplemented: Read as ‘0’ bit 11-0 EID<17:6>: Extended Identifier bits DS70593D-page 226 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-29: CiTRBnDLC: ECAN™ BUFFER n DATA LENGTH CONTROL (n = 0, 1,..., 31) R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<5:0> RTR RB1 bit 15 bit 8 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — RB0 DLC<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-10 EID<5:0>: Extended Identifier bits bit 9 RTR: Remote Transmission Request bit 1 = Message will request remote transmission 0 = Normal message bit 8 RB1: Reserved Bit 1 User must set this bit to ‘0’ per CAN protocol. bit 7-5 Unimplemented: Read as ‘0’ bit 4 RB0: Reserved Bit 0 User must set this bit to ‘0’ per CAN protocol. bit 3-0 DLC<3:0>: Data Length Code bits REGISTER 19-30: CiTRBnDm: ECAN™ BUFFER n DATA FIELD BYTE m (n = 0, 1,..., 31; m = 0, 1,..., 7)(1) R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x TRBnDm<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-0 TRBnDm<7:0>: Data Field Buffer ‘n’ Byte ‘m’ bits Note 1: The Most Significant Byte contains byte (m + 1) of the buffer. 2009-2012 Microchip Technology Inc. DS70593D-page 227
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 19-31: CiTRBnSTAT: ECAN™ RECEIVE BUFFER n STATUS (n = 0, 1,..., 31) U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — FILHIT<4:0> bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 FILHIT<4:0>: Filter Hit Code bits (only written by module for receive buffers, unused for transmit buffers) Encodes number of filter that resulted in writing this buffer. bit 7-0 Unimplemented: Read as ‘0’ DS70593D-page 228 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 20.0 DATA CONVERTER transmitted. The CSDO pin is tri-stated, or driven to ‘0’, INTERFACE (DCI) MODULE during CSCK periods when data is not transmitted depending on the state of the CSDOM control bit. This allows other devices to place data on the serial bus Note1: This data sheet summarizes the features during transmission periods not used by the DCI of the dsPIC33FJXXXGPX06A/X08A/ X10A family of devices. However, it is not module. intended to be a comprehensive refer- 20.2.3 CSDI PIN ence source. To complement the infor- mation in this data sheet, refer to Section The Serial Data Input (CSDI) pin is configured as an 20. “Data Converter Interface (DCI)” input only pin when the module is enabled. (DS70288) in the “dsPIC33F/PIC24H Family Reference Manual”, which is 20.2.3.1 COFS Pin available from the Microchip web site The Codec Frame Synchronization (COFS) pin is used (www.microchip.com). to synchronize data transfers that occur on the CSDO 2: Some registers and associated bits and CSDI pins. The COFS pin may be configured as an described in this section may not be input or an output. The data direction for the COFS pin available on all devices. Refer to is determined by the COFSD control bit in the Section4.0 “Memory Organization” in DCICON1 register. this data sheet for device-specific register The DCI module accesses the shadow registers while and bit information. the CPU is in the process of accessing the memory mapped buffer registers. 20.1 Module Introduction 20.2.4 BUFFER DATA ALIGNMENT The dsPIC33FJXXXGPX06A/X08A/X10A Data Con- verter Interface (DCI) module allows simple interfacing Data values are always stored left justified in the of devices, such as audio coder/decoders (Codecs), buffers since most Codec data is represented as a ADC and D/A converters. The following interfaces are signed 2’s complement fractional number. If the supported: received word length is less than 16 bits, the unused Least Significant bits in the Receive Buffer registers are • Framed Synchronous Serial Transfer (Single or set to ‘0’ by the module. If the transmitted word length Multi-Channel) is less than 16bits, the unused LSbs in the Transmit • Inter-IC Sound (I2S) Interface Buffer register are ignored by the module. The word • AC-Link Compliant mode length setup is described in subsequent sections of this document. The DCI module provides the following general features: 20.2.5 TRANSMIT/RECEIVE SHIFT • Programmable word size up to 16 bits REGISTER • Supports up to 16 time slots, for a maximum The DCI module has a 16-bit shift register for shifting frame size of 256 bits serial data in and out of the module. Data is shifted in/ • Data buffering for up to 4 samples without CPU out of the shift register, MSb first, since audio PCM data overhead is transmitted in signed 2’s complement format. 20.2 Module I/O Pins 20.2.6 DCI BUFFER CONTROL The DCI module contains a buffer control unit for There are four I/O pins associated with the module. transferring data between the shadow buffer memory When enabled, the module controls the data direction and the Serial Shift register. The buffer control unit is a of each of the four pins. simple 2-bit address counter that points to word loca- 20.2.1 CSCK PIN tions in the shadow buffer memory. For the receive memory space (high address portion of DCI buffer The CSCK pin provides the serial clock for the DCI memory), the address counter is concatenated with a module. The CSCK pin may be configured as an input ‘0’ in the MSb location to form a 3-bit address. For the or output using the CSCKD control bit in the DCICON1 transmit memory space (high portion of DCI buffer SFR. When configured as an output, the serial clock is memory), the address counter is concatenated with a provided by the dsPIC33FJXXXGPX06A/X08A/X10A. ‘1’ in the MSb location. When configured as an input, the serial clock must be provided by an external device. Note: The DCI buffer control unit always accesses the same relative location in the 20.2.2 CSDO PIN transmit and receive buffers, so only one The Serial Data Output (CSDO) pin is configured as an address counter is provided. output only pin when the module is enabled. The CSDO pin drives the serial bus whenever data is to be 2009-2012 Microchip Technology Inc. DS70593D-page 229
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 20-1: DCI MODULE BLOCK DIAGRAM BCG Control bits SCKD Sample Rate FOSC/4 CSCK Generator FSD Word Size Selection bits Frame Frame Length Selection bits Synchronization COFS DCI Mode Selection bits Generator s u B a at D bit Receive Buffer 6- Registers w/Shadow 1 DCI Buffer Control Unit 15 0 Transmit Buffer DCI Shift Register CSDI Registers w/Shadow CSDO DS70593D-page 230 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 20-1: DCICON1: DCI CONTROL REGISTER 1 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 DCIEN — DCISIDL — DLOOP CSCKD CSCKE COFSD bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 UNFM CSDOM DJST — — — COFSM<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 DCIEN: DCI Module Enable bit 1 = Module is enabled 0 = Module is disabled bit 14 Unimplemented: Read as ‘0’ bit 13 DCISIDL: DCI Stop in Idle Control bit 1 = Module will halt in CPU Idle mode 0 = Module will continue to operate in CPU Idle mode bit 12 Unimplemented: Read as ‘0’ bit 11 DLOOP: Digital Loopback Mode Control bit 1 = Digital Loopback mode is enabled. CSDI and CSDO pins internally connected 0 = Digital Loopback mode is disabled bit 10 CSCKD: Sample Clock Direction Control bit 1 = CSCK pin is an input when DCI module is enabled 0 = CSCK pin is an output when DCI module is enabled bit 9 CSCKE: Sample Clock Edge Control bit 1 = Data changes on serial clock falling edge, sampled on serial clock rising edge 0 = Data changes on serial clock rising edge, sampled on serial clock falling edge bit 8 COFSD: Frame Synchronization Direction Control bit 1 = COFS pin is an input when DCI module is enabled 0 = COFS pin is an output when DCI module is enabled bit 7 UNFM: Underflow Mode bit 1 = Transmit last value written to the transmit registers on a transmit underflow 0 = Transmit ‘0’s on a transmit underflow bit 6 CSDOM: Serial Data Output Mode bit 1 = CSDO pin will be tri-stated during disabled transmit time slots 0 = CSDO pin drives ‘0’s during disabled transmit time slots bit 5 DJST: DCI Data Justification Control bit 1 = Data transmission/reception is begun during the same serial clock cycle as the frame synchronization pulse 0 = Data transmission/reception is begun one serial clock cycle after frame synchronization pulse bit 4-2 Unimplemented: Read as ‘0’ bit 1-0 COFSM<1:0>: Frame Sync Mode bits 11 = 20-bit AC-Link mode 10 = 16-bit AC-Link mode 01 = I2S Frame Sync mode 00 = Multi-Channel Frame Sync mode 2009-2012 Microchip Technology Inc. DS70593D-page 231
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 20-2: DCICON2: DCI CONTROL REGISTER 2 U-0 U-0 U-0 U-0 R/W-0 R/W-0 U-0 R/W-0 — — — — BLEN<1:0> — COFSG3 bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 COFSG<2:0> — WS<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 Unimplemented: Read as ‘0’ bit 11-10 BLEN<1:0>: Buffer Length Control bits 11 = Four data words will be buffered between interrupts 10 = Three data words will be buffered between interrupts 01 = Two data words will be buffered between interrupts 00 = One data word will be buffered between interrupts bit 9 Unimplemented: Read as ‘0’ bit 8-5 COFSG<3:0>: Frame Sync Generator Control bits 1111 = Data frame has 16 words • • • 0010 = Data frame has 3 words 0001 = Data frame has 2 words 0000 = Data frame has 1 word bit 4 Unimplemented: Read as ‘0’ bit 3-0 WS<3:0>: DCI Data Word Size bits 1111 = Data word size is 16 bits • • • 0100 = Data word size is 5 bits 0011 = Data word size is 4 bits 0010 = Invalid Selection. Do not use. Unexpected results may occur 0001 = Invalid Selection. Do not use. Unexpected results may occur 0000 = Invalid Selection. Do not use. Unexpected results may occur DS70593D-page 232 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 20-3: DCICON3: DCI CONTROL REGISTER 3 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — — BCG<11:8> bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BCG<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 Unimplemented: Read as ‘0’ bit 11-0 BCG<11:0>: DCI Bit Clock Generator Control bits 2009-2012 Microchip Technology Inc. DS70593D-page 233
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 20-4: DCISTAT: DCI STATUS REGISTER U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0 — — — — SLOT<3:0> bit 15 bit 8 U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0 — — — — ROV RFUL TUNF TMPTY bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 Unimplemented: Read as ‘0’ bit 11-8 SLOT<3:0>: DCI Slot Status bits 1111 = Slot #15 is currently active • • • 0010 = Slot #2 is currently active 0001 = Slot #1 is currently active 0000 = Slot #0 is currently active bit 7-4 Unimplemented: Read as ‘0’ bit 3 ROV: Receive Overflow Status bit 1 = A receive overflow has occurred for at least one receive register 0 = A receive overflow has not occurred bit 2 RFUL: Receive Buffer Full Status bit 1 = New data is available in the receive registers 0 = The receive registers have old data bit 1 TUNF: Transmit Buffer Underflow Status bit 1 = A transmit underflow has occurred for at least one transmit register 0 = A transmit underflow has not occurred bit 0 TMPTY: Transmit Buffer Empty Status bit 1 = The transmit registers are empty 0 = The transmit registers are not empty DS70593D-page 234 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 20-5: RSCON: DCI RECEIVE SLOT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RSE15 RSE14 RSE13 RSE12 RSE11 RSE10 RSE9 RSE8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RSE7 RSE6 RSE5 RSE4 RSE3 RSE2 RSE1 RSE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 RSE<15:0>: Receive Slot Enable bits 1 = CSDI data is received during the individual time slot n 0 = CSDI data is ignored during the individual time slot n REGISTER 20-6: TSCON: DCI TRANSMIT SLOT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 TSE15 TSE14 TSE13 TSE12 TSE11 TSE10 TSE9 TSE8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 TSE7 TSE6 TSE5 TSE4 TSE3 TSE2 TSE1 TSE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 TSE<15:0>: Transmit Slot Enable Control bits 1 = Transmit buffer contents are sent during the individual time slot n 0 = CSDO pin is tri-stated or driven to logic ‘0’, during the individual time slot, depending on the state of the CSDOM bit 2009-2012 Microchip Technology Inc. DS70593D-page 235
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 236 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 21.0 10-BIT/12-BIT Depending on the particular device pinout, the ADC ANALOG-TO-DIGITAL can have up to 32 analog input pins, designated AN0 through AN31. In addition, there are two analog input CONVERTER (ADC) pins for external voltage reference connections. These voltage reference inputs may be shared with other Note1: This data sheet summarizes the fea- analog input pins. The actual number of analog input tures of the dsPIC33FJXXXGPX06A/ pins and external voltage reference input configuration X08A/X10A family of devices. How- will depend on the specific device. ever, it is not intended to be a compre- hensive reference source. To A block diagram of the ADC is shown in Figure21-1. complement the information in this data sheet, refer to Section 16. “Ana- 21.2 ADC Initialization log-to-Digital Converter (ADC)” (DS70183) in the “dsPIC33F/PIC24H The following configuration steps should be performed. Family Reference Manual”, which is 1. Configure the ADC module: available from the Microchip web site a) Select port pins as analog inputs (www.microchip.com). (ADxPCFGH<15:0> or ADxPCFGL<15:0>). 2: Some registers and associated bits b) Select voltage reference source to match described in this section may not be expected range on analog inputs available on all devices. Refer to (ADxCON2<15:13>). Section4.0 “Memory Organization” in c) Select the analog conversion clock to match this data sheet for device-specific register desired data rate with processor clock and bit information. (ADxCON3<7:0>). The dsPIC33FJXXXGPX06A/X08A/X10A devices d) Determine how many S/H channels will be have up to 32 ADC input channels. These devices also used (ADxCON2<9:8> and have up to 2 ADC modules (ADCx, where ‘x’ = 1 or 2), ADxPCFGH<15:0> or ADxPCFGL<15:0>). each with its own set of Special Function Registers. e) Select the appropriate sample/conversion sequence (ADxCON1<7:5> and The AD12B bit (ADxCON1<10>) allows each of the ADxCON3<12:8>). ADC modules to be configured by the user as either a f) Select how conversion results are presented 10-bit, 4-sample/hold ADC (default configuration) or a in the buffer (ADxCON1<9:8>). 12-bit, 1-sample/hold ADC. g) Turn on ADC module (ADxCON1<15>). Note: The ADC module needs to be disabled 2. Configure ADC interrupt (if required): before modifying the AD12B bit. a) Clear the ADxIF bit. b) Select ADC interrupt priority. 21.1 Key Features 21.3 ADC and DMA The 10-bit ADC configuration has the following key features: If more than one conversion result needs to be buffered • Successive Approximation (SAR) conversion before triggering an interrupt, DMA data transfers can be used. Both ADC1 and ADC2 can trigger a DMA data • Conversion speeds of up to 1.1 Msps transfer. If ADC1 or ADC2 is selected as the DMA IRQ • Up to 32 analog input pins source, a DMA transfer occurs when the AD1IF or • External voltage reference input pins AD2IF bit gets set as a result of an ADC1 or ADC2 • Simultaneous sampling of up to four analog input sample conversion sequence. pins The SMPI<3:0> bits (ADxCON2<5:2>) are used to • Automatic Channel Scan mode select how often the DMA RAM buffer pointer is • Selectable conversion trigger source incremented. • Selectable Buffer Fill modes The ADDMABM bit (ADxCON1<12>) determines how • Four result alignment options (signed/unsigned, the conversion results are filled in the DMA RAM buffer fractional/integer) area being used for ADC. If this bit is set, DMA buffers • Operation during CPU Sleep and Idle modes are written in the order of conversion. The module will The 12-bit ADC configuration supports all the above provide an address to the DMA channel that is the same as the address used for the non-DMA features, except: stand-alone buffer. If the ADDMABM bit is cleared, then • In the 12-bit configuration, conversion speeds of DMA buffers are written in Scatter/Gather mode. The up to 500 ksps are supported module will provide a scatter/gather address to the • There is only 1 sample/hold amplifier in the 12-bit DMA channel, based on the index of the analog input configuration, so simultaneous sampling of and the size of the DMA buffer. multiple channels is not supported. 2009-2012 Microchip Technology Inc. DS70593D-page 237
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 21-1: ADCx MODULE BLOCK DIAGRAM AN0 ANy(3) S/H0 CHANNEL SCAN + CH0SB<4:0> CH0SA<4:0> - CH0 CSCNA AN1 VREFL CH0NA CH0NB AN0 VREF+(1)AVDDVREF-(1)AVSS AN3 S/H1 + CH123SA CH123SB - CH1(2) AN6 AN9 VCFG<2:0> VREFL VREFH VREFL CH123NA CH123NB SAR ADC ADC1BUF0 AN1 AN4 S/H2 + CH123SACH123SB - CH2(2) AN7 AN10 VREFL CH123NA CH123NB AN2 AN5 S/H3 + CH123SA CH123SB CH3(2) - AN8 AN11 VREFL CH123NA CH123NB Alternate Input Selection Note 1: VREF+, VREF- inputs can be multiplexed with other analog inputs. 2: Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation. 3: For 64-pin devices, y = 17; for 80-pin devices, y = 23; for 100-pin devices, y = 31; for ADC2, y = 15. DS70593D-page 238 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 21-2: ADC CONVERSION CLOCK PERIOD BLOCK DIAGRAM ADxCON3<15> ADC Internal RC Clock(2) 1 TAD ADxCON3<5:0> 0 6 ADC Conversion TCY Clock Multiplier TOSC(1) X2 1, 2, 3, 4, 5,..., 64 Note 1: Refer to Figure9-2 for the derivation of FOSC when the PLL is enabled. If the PLL is not used, FOSC is equal to the clock source frequency. TOSC = 1/FOSC. 2: See the ADC electrical specifications for the exact RC clock value. 2009-2012 Microchip Technology Inc. DS70593D-page 239
dsPIC33FJXXXGPX06A/X08A/X10A 21.4 ADC Helpful Tips 21.5 ADC Resources 1. The SMPI<3:0> (AD1CON2<5:2>) control bits: Many useful resources related to ADC are provided on a) Determine when the ADC interrupt flag is the main product page of the Microchip web site for the set and an interrupt is generated if enabled. devices listed in this data sheet. This product page, which can be accessed using this link, contains the b) When the CSCNA bit (AD1CON2<10>) is latest updates and additional information. set to ‘1’, determines when the ADC analog scan channel list defined in the AD1CSSL/ Note: In the event you are not able to access the AD1CSSH registers starts over from the product page using the link above, enter beginning. this URL in your browser: c) On devices without a DMA peripheral, http://www.microchip.com/wwwproducts/ determines when ADC result buffer pointer Devices.aspx?dDocName=en546064 to ADC1BUF0-ADC1BUFF, gets reset back to the beginning at ADC1BUF0. 21.5.1 KEY RESOURCES 2. On devices without a DMA module, the ADC has • Section 16. “Analog-to-Digital Converter 16 result buffers. ADC conversion results are (ADC)” (DS70183) stored sequentially in ADC1BUF0-ADC1BUFF • Code Samples regardless of which analog inputs are being • Application Notes used subject to the SMPI<3:0> bits (AD1CON2<5:2>) and the condition described • Software Libraries in 1c above. There is no relationship between • Webinars the ANx input being measured and which ADC • All related dsPIC33F/PIC24H Family Reference buffer (ADC1BUF0-ADC1BUFF) that the Manuals Sections conversion results will be placed in. • Development Tools 3. On devices with a DMA module, the ADC mod- ule has only 1 ADC result buffer, (i.e., ADC1BUF0), per ADC peripheral and the ADC conversion result must be read either by the CPU or DMA controller before the next ADC conversion is complete to avoid overwriting the previous value. 4. The DONE bit (AD1CON1<0>) is only cleared at the start of each conversion and is set at the completion of the conversion, but remains set indefinitely even through the next sample phase until the next conversion begins. If application code is monitoring the DONE bit in any kind of software loop, the user must consider this behavior because the CPU code execution is faster than the ADC. As a result, in manual sam- ple mode, particularly where the users code is setting the SAMP bit (AD1CON1<1>), the DONE bit should also be cleared by the user application just before setting the SAMP bit. 5. On devices with two ADC modules, the ADCxPCFG registers for both ADC modules must be set to a logic ‘1’ to configure a target I/O pin as a digital I/O pin. Failure to do so means that any alternate digital input function will always see only a logic ‘0’ as the digital input buffer is held in Disable mode. DS70593D-page 240 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 21-1: ADxCON1: ADCx CONTROL REGISTER 1 (where x = 1 or 2) R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 ADON — ADSIDL ADDMABM — AD12B FORM<1:0> bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/C-0 HC,HS HC, HS SSRC<2:0> — SIMSAM ASAM SAMP DONE bit 7 bit 0 Legend: HC = Cleared by hardware HS = Set by hardware C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ADON: ADC Operating Mode bit 1 = ADC module is operating 0 = ADC is off bit 14 Unimplemented: Read as ‘0’ bit 13 ADSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12 ADDMABM: DMA Buffer Build Mode bit 1 = DMA buffers are written in the order of conversion. The module will provide an address to the DMA channel that is the same as the address used for the non-DMA stand-alone buffer 0 = DMA buffers are written in Scatter/Gather mode. The module will provide a scatter/gather address to the DMA channel, based on the index of the analog input and the size of the DMA buffer bit 11 Unimplemented: Read as ‘0’ bit 10 AD12B: 10-Bit or 12-Bit Operation Mode bit 1 = 12-bit, 1-channel ADC operation 0 = 10-bit, 4-channel ADC operation bit 9-8 FORM<1:0>: Data Output Format bits For 10-bit operation: 11 = Signed fractional (DOUT = sddd dddd dd00 0000, where s = .NOT.d<9>) 10 = Fractional (DOUT = dddd dddd dd00 0000) 01 = Signed integer (DOUT = ssss sssd dddd dddd, where s = .NOT.d<9>) 00 = Integer (DOUT = 0000 00dd dddd dddd) For 12-bit operation: 11 = Signed fractional (DOUT = sddd dddd dddd 0000, where s = .NOT.d<11>) 10 = Fractional (DOUT = dddd dddd dddd 0000) 01 = Signed Integer (DOUT = ssss sddd dddd dddd, where s = .NOT.d<11>) 00 = Integer (DOUT = 0000 dddd dddd dddd) bit 7-5 SSRC<2:0>: Sample Clock Source Select bits 111 = Internal counter ends sampling and starts conversion (auto-convert) 110 = Reserved 101 = Reserved 100 = GP timer (Timer5 for ADC1, Timer3 for ADC2) compare ends sampling and starts conversion 011 = Reserved 010 = GP timer (Timer3 for ADC1, Timer5 for ADC2) compare ends sampling and starts conversion 001 = Active transition on INT0 pin ends sampling and starts conversion 000 = Clearing sample bit ends sampling and starts conversion bit 4 Unimplemented: Read as ‘0’ 2009-2012 Microchip Technology Inc. DS70593D-page 241
dsPIC33FJXXXGPX06A/X08A/X10A REGISTER 21-1: ADxCON1: ADCx CONTROL REGISTER 1 (where x = 1 or 2) (CONTINUED) bit 3 SIMSAM: Simultaneous Sample Select bit (only applicable when CHPS<1:0> = 01 or 1x) When AD12B = 1, SIMSAM is: U-0, Unimplemented, Read as ‘0’ 1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x); or Samples CH0 and CH1 simultaneously (when CHPS<1:0> = 01) 0 = Samples multiple channels individually in sequence bit 2 ASAM: ADC Sample Auto-Start bit 1 = Sampling begins immediately after last conversion. SAMP bit is auto-set 0 = Sampling begins when SAMP bit is set bit 1 SAMP: ADC Sample Enable bit 1 = ADC sample/hold amplifiers are sampling 0 = ADC sample/hold amplifiers are holding If ASAM = 0, software may write ‘1’ to begin sampling. Automatically set by hardware if ASAM = 1. If SSRC = 000, software may write ‘0’ to end sampling and start conversion. If SSRC 000, automatically cleared by hardware to end sampling and start conversion. bit 0 DONE: ADC Conversion Status bit 1 = ADC conversion cycle is completed 0 = ADC conversion not started or in progress Automatically set by hardware when ADC conversion is complete. Software may write ‘0’ to clear DONE status (software not allowed to write ‘1’). Clearing this bit will NOT affect any operation in prog- ress. Automatically cleared by hardware at start of a new conversion. DS70593D-page 242 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 21-2: ADxCON2: ADCx CONTROL REGISTER 2 (where x = 1 or 2) R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 VCFG<2:0> — — CSCNA CHPS<1:0> bit 15 bit 8 R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BUFS — SMPI<3:0> BUFM ALTS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 VCFG<2:0>: Converter Voltage Reference Configuration bits VREF+ VREF- 000 AVDD AVSS 001 External VREF+ AVSS 010 AVDD External VREF- 011 External VREF+ External VREF- 1xx AVDD Avss bit 12-11 Unimplemented: Read as ‘0’ bit 10 CSCNA: Scan Input Selections for CH0+ during Sample A bit 1 = Scan inputs 0 = Do not scan inputs bit 9-8 CHPS<1:0>: Selects Channels Utilized bits When AD12B = 1, CHPS<1:0> is: U-0, Unimplemented, Read as ‘0’ 1x = Converts CH0, CH1, CH2 and CH3 01 = Converts CH0 and CH1 00 = Converts CH0 bit 7 BUFS: Buffer Fill Status bit (only valid when BUFM = 1) 1 = ADC is currently filling second half of buffer, user should access data in first half 0 = ADC is currently filling first half of buffer, user should access data in second half bit 6 Unimplemented: Read as ‘0’ bit 5-2 SMPI<3:0>: Selects Increment Rate for DMA Addresses bits or number of sample/conversion operations per interrupt 1111 = Increments the DMA address or generates interrupt after completion of every 16th sample/ conversion operation 1110 = Increments the DMA address or generates interrupt after completion of every 15th sample/ conversion operation • • • 0001 = Increments the DMA address or generates interrupt after completion of every 2nd sample/ conversion operation 0000 = Increments the DMA address or generates interrupt after completion of every sample/conver- sion operation bit 1 BUFM: Buffer Fill Mode Select bit 1 = Starts filling first half of buffer on first interrupt and second half of the buffer on next interrupt 0 = Always starts filling buffer from the beginning bit 0 ALTS: Alternate Input Sample Mode Select bit 1 = Uses channel input selects for Sample A on first sample and Sample B on next sample 0 = Always uses channel input selects for Sample A 2009-2012 Microchip Technology Inc. DS70593D-page 243
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 21-3: ADxCON3: ADCx CONTROL REGISTER 3 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADRC — — SAMC<4:0>(1) bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADCS<7:0>(2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ADRC: ADC Conversion Clock Source bit 1 = ADC internal RC clock 0 = Clock derived from system clock bit 14-13 Unimplemented: Read as ‘0’ bit 12-8 SAMC<4:0>: Auto Sample Time bits(1) 11111 = 31 TAD • • • 00001 = 1 TAD 00000 = 0 TAD bit 7-0 ADCS<7:0>: ADC Conversion Clock Select bits(2) 11111111 = Reserved • • • 01000000 = Reserved 00111111 = TCY · (ADCS<7:0> + 1) = 64 · TCY = TAD • • • 00000010 = TCY · (ADCS<7:0> + 1) = 3 · TCY = TAD 00000001 = TCY · (ADCS<7:0> + 1) = 2 · TCY = TAD 00000000 = TCY · (ADCS<7:0> + 1) = 1 · TCY = TAD Note 1: This bit only used if ADxCON1<7:5> (SSRC<2:0>) = 111. 2: This bit is not used if ADxCON3<15> (ADRC) = 1. DS70593D-page 244 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 21-4: ADxCON4: ADCx CONTROL REGISTER 4 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — — — — — DMABL<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-3 Unimplemented: Read as ‘0’ bit 2-0 DMABL<2:0>: Selects Number of DMA Buffer Locations per Analog Input bits 111 = Allocates 128 words of buffer to each analog input 110 = Allocates 64 words of buffer to each analog input 101 = Allocates 32 words of buffer to each analog input 100 = Allocates 16 words of buffer to each analog input 011 = Allocates 8 words of buffer to each analog input 010 = Allocates 4 words of buffer to each analog input 001 = Allocates 2 words of buffer to each analog input 000 = Allocates 1 word of buffer to each analog input 2009-2012 Microchip Technology Inc. DS70593D-page 245
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 21-5: ADxCHS123: ADCx INPUT CHANNEL 1, 2, 3 SELECT REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — — — — — CH123NB<1:0> CH123SB bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — — — — — CH123NA<1:0> CH123SA bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-11 Unimplemented: Read as ‘0’ bit 10-9 CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for Sample B bits When AD12B = 1, CHxNB is: U-0, Unimplemented, Read as ‘0’ 11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11 10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8 0x = CH1, CH2, CH3 negative input is VREF- bit 8 CH123SB: Channel 1, 2, 3 Positive Input Select for Sample B bit When AD12B = 1, CHxSB is: U-0, Unimplemented, Read as ‘0’ 1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5 0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2 bit 7-3 Unimplemented: Read as ‘0’ bit 2-1 CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for Sample A bits When AD12B = 1, CHxNA is: U-0, Unimplemented, Read as ‘0’ 11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11 10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8 0x = CH1, CH2, CH3 negative input is VREF- bit 0 CH123SA: Channel 1, 2, 3 Positive Input Select for Sample A bit When AD12B = 1, CHxSA is: U-0, Unimplemented, Read as ‘0’ 1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5 0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2 DS70593D-page 246 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 21-6: ADxCHS0: ADCx INPUT CHANNEL 0 SELECT REGISTER R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CH0NB — — CH0SB<4:0>(1) bit 15 bit 8 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CH0NA — — CH0SA<4:0>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 CH0NB: Channel 0 Negative Input Select for Sample B bit Same definition as bit 7. bit 14-13 Unimplemented: Read as ‘0’ bit 12-8 CH0SB<4:0>: Channel 0 Positive Input Select for Sample B bits(1) 11111 = Channel 0 positive input is AN31 11110 = Channel 0 positive input is AN30 • • • 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 bit 7 CH0NA: Channel 0 Negative Input Select for Sample A bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VREF- bit 6-5 Unimplemented: Read as ‘0’ bit 4-0 CH0SA<4:0>: Channel 0 Positive Input Select for Sample A bits(1) 11111 = Channel 0 positive input is AN31 11110 = Channel 0 positive input is AN30 • • • 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 Note 1: ADC2 can only select AN0 through AN15 as positive input. 2009-2012 Microchip Technology Inc. DS70593D-page 247
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 21-7: ADxCSSH: ADCx INPUT SCAN SELECT REGISTER HIGH(1,2) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSS31 CSS30 CSS29 CSS28 CSS27 CSS26 CSS25 CSS24 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSS23 CSS22 CSS21 CSS20 CSS19 CSS18 CSS17 CSS16 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 CSS<31:16>: ADC Input Scan Selection bits 1 = Select ANx for input scan 0 = Skip ANx for input scan Note1: On devices without 32 analog inputs, all ADxCSSH bits may be selected by user. However, inputs selected for scan without a corresponding input on device will convert VREFL. 2: CSSx = ANx, where x = 16 through 31. REGISTER 21-8: ADxCSSL: ADCx INPUT SCAN SELECT REGISTER LOW(1,2) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSS15 CSS14 CSS13 CSS12 CSS11 CSS10 CSS9 CSS8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSS7 CSS6 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 CSS<15:0>: ADC Input Scan Selection bits 1 = Select ANx for input scan 0 = Skip ANx for input scan Note 1: On devices without 16 analog inputs, all ADxCSSL bits may be selected by user. However, inputs selected for scan without a corresponding input on device will convert VREF-. 2: CSSx = ANx, where x = 0 through 15. DS70593D-page 248 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A R EGISTER 21-9: AD1PCFGH: ADC1 PORT CONFIGURATION REGISTER HIGH(1,2,3,4) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG31 PCFG30 PCFG29 PCFG28 PCFG27 PCFG26 PCFG25 PCFG24 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG23 PCFG22 PCFG21 PCFG20 PCFG19 PCFG18 PCFG17 PCFG16 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 PCFG<31:16>: ADC Port Configuration Control bits 1 = Port pin in Digital mode, port read input enabled, ADC input multiplexer connected to AVSS 0 = Port pin in Analog mode, port read input disabled, ADC samples pin voltage Note1: On devices without 32 analog inputs, all PCFG bits are R/W by user. However, PCFG bits are ignored on ports without a corresponding input on device. 2: ADC2 only supports analog inputs AN0-AN15; therefore, no ADC2 port Configuration register exists. 3: PCFGx = ANx, where x = 16 through 31. 4: PCFGx bits have no effect if ADC module is disabled by setting ADxMD bit in the PMDx register. In this case all port pins multiplexed with ANx will be in Digital mode. REGISTER 21-10: ADxPCFGL: ADCx PORT CONFIGURATION REGISTER LOW(1,2,3,4) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-0 PCFG<15:0>: ADC Port Configuration Control bits 1 = Port pin in Digital mode, port read input enabled, ADC input multiplexer connected to AVSS 0 = Port pin in Analog mode, port read input disabled, ADC samples pin voltage Note 1: On devices without 16 analog inputs, all PCFG bits are R/W by user. However, PCFG bits are ignored on ports without a corresponding input on device. 2: On devices with two analog-to-digital modules, both AD1PCFGL and AD2PCFGL will affect the configuration of port pins multiplexed with AN0-AN15. 3: PCFGx = ANx, where x = 0 through 15. 4: PCFGx bits have no effect if ADC module is disabled by setting ADxMD bit in the PMDx register. In this case all port pins multiplexed with ANx will be in Digital mode 2009-2012 Microchip Technology Inc. DS70593D-page 249
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 250 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 22.0 SPECIAL FEATURES 22.1 Configuration Bits Note1: This data sheet summarizes the features dsPIC33FJXXXGPX06A/X08A/X10A devices provide of the dsPIC33FJXXXGPX06A/X08A/ nonvolatile memory implementation for device X10A family of devices. However, it is not configuration bits. Refer to Section 25. “Device Con- intended to be a comprehensive refer- figuration” (DS70194) of the “dsPIC33F/PIC24H ence source. To complement the infor- Family Reference Manual”, for more information on this mation in this data sheet, refer to Section implementation. 23. “CodeGuard™ Security” The Configuration bits can be programmed (read as (DS70199), Section 24. “Programming ‘0’), or left unprogrammed (read as ‘1’), to select and Diagnostics” (DS70207), and Sec- various device configurations. These bits are mapped tion 25. “Device Configuration” starting at program memory location 0xF80000. (DS70194) in the “dsPIC33F/PIC24H Family Reference Manual”, which are The device Configuration register map is shown in available from the Microchip web site Table22-1. (www.microchip.com). The individual Configuration bit descriptions for the 2: Some registers and associated bits Configuration registers are shown in Table22-2. described in this section may not be Note that address 0xF80000 is beyond the user program available on all devices. Refer to memory space. In fact, it belongs to the configuration Section4.0 “Memory Organization” in memory space (0x800000-0xFFFFFF) which can only be this data sheet for device-specific register accessed using table reads and table writes. and bit information. dsPIC33FJXXXGPX06A/X08A/X10A devices include the following features intended to maximize application flexibility and reliability, and minimize cost through elim- ination of external components: • Flexible Configuration • Watchdog Timer (WDT) • Code Protection and CodeGuard™ Security • JTAG Boundary Scan Interface • In-Circuit Serial Programming™ (ICSP™) • In-Circuit Emulation TABLE 22-1: DEVICE CONFIGURATION REGISTER MAP Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0xF80000 FBS RBS<1:0> — — BSS<2:0> BWRP 0xF80002 FSS RSS<1:0> — — SSS<2:0> SWRP 0xF80004 FGS — — — — — GSS1 GSS0 GWRP 0xF80006 FOSCSEL IESO Reserved(2) — — — FNOSC<2:0> 0xF80008 FOSC FCKSM<1:0> — — — OSCIOFNC POSCMD<1:0> 0xF8000A FWDT FWDTEN WINDIS PLLKEN(3) WDTPRE WDTPOST<3:0> 0xF8000C FPOR Reserved(4) — — FPWRT<2:0> 0xF8000E FICD Reserved(1) JTAGEN — — — ICS<1:0> 0xF80010 FUID0 User Unit ID Byte 0 0xF80012 FUID1 User Unit ID Byte 1 0xF80014 FUID2 User Unit ID Byte 2 0xF80016 FUID3 User Unit ID Byte 3 Legend: — = unimplemented bit, read as ‘0’. Note1: These bits are reserved for use by development tools and must be programmed as ‘1’. 2: When read, this bit returns the current programmed value. 3: This bit is unimplemented on dsPIC33FJ64GPX06A/X08A/X10A and dsPIC33FJ128GPX06A/X08A/X10A devices and reads as ‘0’. 4: These bits are reserved and always read as ‘1’. 2009-2012 Microchip Technology Inc. DS70593D-page 251
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 22-2: CONFIGURATION BITS DESCRIPTION RTSP Bit Field Register Description Effect BWRP FBS Immediate Boot Segment Program Flash Write Protection 1 = Boot segment may be written 0 = Boot segment is write-protected BSS<2:0> FBS Immediate Boot Segment Program Flash Code Protection Size X11 = No Boot program Flash segment Boot space is 1K IW less VS 110 = Standard security; boot program Flash segment starts at End of VS, ends at 0007FEh 010 = High security; boot program Flash segment starts at End of VS, ends at 0007FEh Boot space is 4K IW less VS 101 = Standard security; boot program Flash segment starts at End of VS, ends at 001FFEh 001 = High security; boot program Flash segment starts at End of VS, ends at 001FFEh Boot space is 8K IW less VS 100 = Standard security; boot program Flash segment starts at End of VS, ends at 003FFEh 000 = High security; boot program Flash segment starts at End of VS, ends at 003FFEh RBS<1:0> FBS Immediate Boot Segment RAM Code Protection 11 = No Boot RAM defined 10 = Boot RAM is 128 Bytes 01 = Boot RAM is 256 Bytes 00 = Boot RAM is 1024 Bytes SWRP FSS Immediate Secure Segment Program Flash Write Protection 1 = Secure segment may be written 0 = Secure segment is write-protected DS70593D-page 252 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 22-2: CONFIGURATION BITS DESCRIPTION (CONTINUED) RTSP Bit Field Register Description Effect SSS<2:0> FSS Immediate Secure Segment Program Flash Code Protection Size (FOR 128K and 256K DEVICES) X11 = No Secure program Flash segment Secure space is 8K IW less BS 110 = Standard security; secure program Flash segment starts at End of BS, ends at 0x003FFE 010 = High security; secure program Flash segment starts at End of BS, ends at 0x003FFE Secure space is 16K IW less BS 101 = Standard security; secure program Flash segment starts at End of BS, ends at 0x007FFE 001 = High security; secure program Flash segment starts at End of BS, ends at 0x007FFE Secure space is 32K IW less BS 100 = Standard security; secure program Flash segment starts at End of BS, ends at 0x00FFFE 000 = High security; secure program Flash segment starts at End of BS, ends at 0x00FFFE (FOR 64K DEVICES) X11 = No Secure program Flash segment Secure space is 4K IW less BS 110 = Standard security; secure program Flash segment starts at End of BS, ends at 0x001FFE 010 = High security; secure program Flash segment starts at End of BS, ends at 0x001FFE Secure space is 8K IW less BS 101 = Standard security; secure program Flash segment starts at End of BS, ends at 0x003FFE 001 = High security; secure program Flash segment starts at End of BS, ends at 0x003FFE Secure space is 16K IW less BS 100 = Standard security; secure program Flash segment starts at End of BS, ends at 007FFEh 000 = High security; secure program Flash segment starts at End of BS, ends at 0x007FFE RSS<1:0> FSS Immediate Secure Segment RAM Code Protection 11 = No Secure RAM defined 10 = Secure RAM is 256 Bytes less BS RAM 01 = Secure RAM is 2048 Bytes less BS RAM 00 = Secure RAM is 4096 Bytes less BS RAM GSS<1:0> FGS Immediate General Segment Code-Protect bit 11 = User program memory is not code-protected 10 = Standard security; general program Flash segment starts at End of SS, ends at EOM 0x = High security; general program Flash segment starts at End of SS, ends at EOM 2009-2012 Microchip Technology Inc. DS70593D-page 253
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 22-2: CONFIGURATION BITS DESCRIPTION (CONTINUED) RTSP Bit Field Register Description Effect GWRP FGS Immediate General Segment Write-Protect bit 1 = User program memory is not write-protected 0 = User program memory is write-protected IESO FOSCSEL Immediate Two-speed Oscillator Start-up Enable bit 1 = Start-up device with FRC, then automatically switch to the user-selected oscillator source when ready 0 = Start-up device with user-selected oscillator source FNOSC<2:0> FOSCSEL If clock Initial Oscillator Source Selection bits switch is 111 = Internal Fast RC (FRC) oscillator with postscaler enabled, 110 = Internal Fast RC (FRC) oscillator with divide-by-16 RTSP 101 = LPRC oscillator effect is 100 = Secondary (LP) oscillator on any 011 = Primary (XT, HS, EC) oscillator with PLL device 010 = Primary (XT, HS, EC) oscillator Reset; 001 = Internal Fast RC (FRC) oscillator with PLL otherwise, 000 = FRC oscillator Immediate FCKSM<1:0> FOSC Immediate Clock Switching Mode bits 1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled 01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled 00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled OSCIOFNC FOSC Immediate OSC2 Pin Function bit (except in XT and HS modes) 1 = OSC2 is clock output 0 = OSC2 is general purpose digital I/O pin POSCMD<1:0> FOSC Immediate Primary Oscillator Mode Select bits 11 = Primary oscillator disabled 10 = HS Crystal Oscillator mode 01 = XT Crystal Oscillator mode 00 = EC (External Clock) mode FWDTEN FWDT Immediate Watchdog Timer Enable bit 1 = Watchdog Timer always enabled (LPRC oscillator cannot be disabled. Clearing the SWDTEN bit in the RCON register will have no effect.) 0 = Watchdog Timer enabled/disabled by user software (LPRC can be dis- abled by clearing the SWDTEN bit in the RCON register) WINDIS FWDT Immediate Watchdog Timer Window Enable bit 1 = Watchdog Timer in Non-Window mode 0 = Watchdog Timer in Window mode PLLKEN FWDT Immediate PLL Lock Enable bit 1 = Clock switch to PLL source will wait until the PLL lock signal is valid. 0 = Clock switch will not wait for the PLL lock signal. WDTPRE FWDT Immediate Watchdog Timer Prescaler bit 1 = 1:128 0 = 1:32 WDTPOST FWDT Immediate Watchdog Timer Postscaler bits 1111 = 1:32,768 1110 = 1:16,384 • • • 0001 = 1:2 0000 = 1:1 DS70593D-page 254 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 22-2: CONFIGURATION BITS DESCRIPTION (CONTINUED) RTSP Bit Field Register Description Effect FPWRT<2:0> FPOR Immediate Power-on Reset Timer Value Select bits 111 = PWRT = 128 ms 110 = PWRT = 64 ms 101 = PWRT = 32 ms 100 = PWRT = 16 ms 011 = PWRT = 8 ms 010 = PWRT = 4 ms 001 = PWRT = 2 ms 000 = PWRT = Disabled JTAGEN FICD Immediate JTAG Enable bits 1 = JTAG enabled 0 = JTAG disabled ICS<1:0> FICD Immediate ICD Communication Channel Select bits 11 = Communicate on PGEC1 and PGED1 10 = Communicate on PGEC2 and PGED2 01 = Communicate on PGEC3 and PGED3 00 = Reserved 2009-2012 Microchip Technology Inc. DS70593D-page 255
dsPIC33FJXXXGPX06A/X08A/X10A 22.2 On-Chip Voltage Regulator 22.3 BOR: Brown-out Reset All of the dsPIC33FJXXXGPX06A/X08A/X10A devices The BOR (Brown-out Reset) module is based on an power their core digital logic at a nominal 2.5V. This internal voltage reference circuit that monitors the may create an issue for designs that are required to regulated voltage VCAP. The main purpose of the BOR operate at a higher typical voltage, such as 3.3V. To module is to generate a device Reset when a simplify system design, all devices in the brown-out condition occurs. Brown-out conditions are dsPIC33FJXXXGPX06A/X08A/X10A family incor- generally caused by glitches on the AC mains (i.e., porate an on-chip regulator that allows the device to missing portions of the AC cycle waveform due to bad run its core logic from VDD. power transmission lines or voltage sags due to excessive current draw when a large inductive load is The regulator provides power to the core from the turned on). other VDD pins. The regulator requires that a low-ESR (less than 5 ohms) capacitor (such as A BOR will generate a Reset pulse which will reset the tantalum or ceramic) be connected to the VCAP pin device. The BOR will select the clock source, based on (Figure22-1). This helps to maintain the stability of the device Configuration bit values (FNOSC<2:0> and the regulator. The recommended value for the filter POSCMD<1:0>). Furthermore, if an oscillator mode is capacitor is provided in Table25-13 of Section25.0 selected, the BOR will activate the Oscillator Start-up “Electrical Characteristics”. Timer (OST). The system clock is held until OST expires. If the PLL is used, then the clock will be held Note: It is important for the low-ESR capacitor to until the LOCK bit (OSCCON<5>) is ‘1’. be placed as close as possible to the VCAP pin. Concurrently, the PWRT time-out (TPWRT) will be applied before the internal Reset is released. If On a POR, it takes approximately 20s for the on-chip TPWRT= 0 and a crystal oscillator is being used, then voltage regulator to generate an output voltage. During a nominal delay of TFSCM = 100 is applied. The total this time, designated as TSTARTUP, code execution is delay in this case is TFSCM. disabled. TSTARTUP is applied every time the device The BOR Status bit (RCON<1>) will be set to indicate resumes operation after any power-down. that a BOR has occurred. The BOR circuit continues to operate while in Sleep or Idle modes and will reset the FIGURE 22-1: CONNECTIONS FOR THE device should VDD fall below the BOR threshold ON-CHIP VOLTAGE voltage. REGULATOR(1,2,3) 3.3V dsPIC33F VDD VCAP CEFC 10 µF VSS Note 1: These are typical operating voltages. Refer to Table25-13 located in Section25.1 “DC Characteristics” for the full operating ranges of VDD and VCAP. 2: It is important for the low-ESR capacitor to be placed as close as possible to the VCAP pin. 3: Typical VCAP pin voltage = 2.5V when VDD VDDMIN. DS70593D-page 256 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 22.4 Watchdog Timer (WDT) If the WDT is enabled, it will continue to run during Sleep or Idle modes. When the WDT time-out occurs, the For dsPIC33FJXXXGPX06A/X08A/X10A devices, the device will wake the device and code execution will WDT is driven by the LPRC oscillator. When the WDT continue from where the PWRSAV instruction was is enabled, the clock source is also enabled. executed. The corresponding SLEEP or IDLE bits The nominal WDT clock source from LPRC is 32kHz. (RCON<3,2>) will need to be cleared in software after the This feeds a prescaler and then can be configured for device wakes up. either 5-bit (divide-by-32) or 7-bit (divide-by-128) The WDT flag bit, WDTO (RCON<4>), is not automatically operation. The prescaler is set by the WDTPRE cleared following a WDT time-out. To detect subsequent Configuration bit. With a 32kHz input, the prescaler WDT events, the flag must be cleared in software. yields a nominal WDT time-out period (TWDT) of 1ms in 5-bit mode, or 4ms in 7-bit mode. Note: The CLRWDT and PWRSAV instructions clear the prescaler and postscaler counts A variable postscaler divides down the WDT prescaler when executed. output and allows for a wide range of time-out periods. The postscaler is controlled by the WDTPOST<3:0> The WDT is enabled or disabled by the FWDTEN Configuration bits (FWDT<3:0>) which allow the Configuration bit in the FWDT Configuration register. selection of a total of 16 settings, from 1:1 to 1:32,768. When the FWDTEN Configuration bit is set, the WDT is Using the prescaler and postscaler, time-out periods always enabled. ranging from 1ms to 131 seconds can be achieved. The WDT can be optionally controlled in software when The WDT, prescaler and postscaler are reset: the FWDTEN Configuration bit has been programmed to ‘0’. The WDT is enabled in software by setting the • On any device Reset SWDTEN control bit (RCON<5>). The SWDTEN • On the completion of a clock switch, whether control bit is cleared on any device Reset. The software invoked by software (i.e., setting the OSWEN bit WDT option allows the user to enable the WDT for after changing the NOSC bits) or by hardware critical code segments and disable the WDT during (i.e., Fail-Safe Clock Monitor) non-critical segments for maximum power savings. • When a PWRSAV instruction is executed (i.e., Sleep or Idle mode is entered) Note: If the WINDIS bit (FWDT<6>) is cleared, the CLRWDT instruction should be executed • When the device exits Sleep or Idle mode to by the application software only during the resume normal operation last 1/4 of the WDT period. This CLRWDT • By a CLRWDT instruction during normal execution window can be determined by using a timer. If a CLRWDT instruction is executed before this window, a WDT Reset occurs. FIGURE 22-2: WDT BLOCK DIAGRAM All Device Resets Transition to New Clock Source Exit Sleep or Idle Mode PWRSAV Instruction CLRWDT Instruction Watchdog Timer Sleep/Idle WDTPRE WDTPOST<3:0> SWDTEN WDT FWDTEN Wake-up RS RS 1 Prescaler Postscaler LPRC Clock (divide by N1) (divide by N2) WDT 0 Reset WINDIS WDT Window Select CLRWDT Instruction 2009-2012 Microchip Technology Inc. DS70593D-page 257
dsPIC33FJXXXGPX06A/X08A/X10A 22.5 JTAG Interface 22.8 In-Circuit Debugger dsPIC33FJXXXGPX06A/X08A/X10A devices imple- When MPLAB® ICD 3 is selected as a debugger, the ment a JTAG interface, which supports boundary scan in-circuit debugging functionality is enabled. This device testing, as well as in-circuit programming. function allows simple debugging functions when used Detailed information on the interface will be provided in with MPLAB IDE. Debugging functionality is controlled future revisions of the document. through the PGECx (Emulation/Debug Clock) and PGEDx (Emulation/Debug Data) pin functions. 22.6 Code Protection and Any one out of three pairs of debugging clock/data pins CodeGuard™ Security may be used: The dsPIC33F product families offer the advanced • PGEC1 and PGED1 implementation of CodeGuard™ Security. CodeGuard™ • PGEC2 and PGED2 Security enables multiple parties to securely share • PGEC3 and PGED3 resources (memory, interrupts and peripherals) on a To use the in-circuit debugger function of the device, single chip. This feature helps protect individual the design must implement ICSP connections to Intellectual Property in collaborative system designs. MCLR, VDD, VSS and the PGEDx/PGECx pin pair. In When coupled with software encryption libraries, addition, when the feature is enabled, some of the CodeGuard Security can be used to securely update resources are not available for general use. These Flash even when multiple IP are resident on the single resources include the first 80 bytes of data RAM and chip. The code protection features vary depending on two I/O pins. the actual dsPIC33F implemented. The following sections provide an overview of these features. The code protection features are controlled by the Configuration registers: FBS, FSS and FGS. Note: Refer to Section 23. “CodeGuard™ Security” (DS70199) in the “dsPIC33F/ PIC24H Family Reference Manual” for fur- ther information on usage, configuration and operation of CodeGuard™ Security. 22.7 In-Circuit Serial Programming dsPIC33FJXXXGPX06A/X08A/X10A family digital sig- nal controllers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data and three other lines for power, ground and the programming sequence. This allows customers to manufacture boards with unprogrammed devices and then program the digital signal controller just before shipping the product. This also allows the most recent firmware or a custom firmware, to be programmed. Please refer to the “dsPIC33F/PIC24H Flash Programming Specification” (DS70152) document for details about ICSP. Any one out of three pairs of programming clock/data pins may be used: • PGEC1 and PGED1 • PGEC2 and PGED2 • PGEC3 and PGED3 DS70593D-page 258 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 23.0 INSTRUCTION SET SUMMARY Most bit-oriented instructions (including simple rotate/ shift instructions) have two operands: Note: This data sheet summarizes the features • The W register (with or without an address of the dsPIC33FJXXXGPX06A/X08A/ modifier) or file register (specified by the value of X10A family of devices. However, it is not ‘Ws’ or ‘f’) intended to be a comprehensive • The bit in the W register or file register reference source. To complement the (specified by a literal value or indirectly by the information in this data sheet, refer to the contents of register ‘Wb’) latest family reference sections of the “dsPIC33F/PIC24H Family Reference The literal instructions that involve data movement may Manual”, which are available from the use some of the following operands: Microchip web site (www.microchip.com). • A literal value to be loaded into a W register or file register (specified by the value of ‘k’) The dsPIC33F instruction set is identical to that of the dsPIC30F. • The W register or file register where the literal value is to be loaded (specified by ‘Wb’ or ‘f’) Most instructions are a single program memory word (24 bits). Only three instructions require two program However, literal instructions that involve arithmetic or memory locations. logical operations use some of the following operands: Each single-word instruction is a 24-bit word, divided • The first source operand which is a register ‘Wb’ into an 8-bit opcode, which specifies the instruction without any address modifier type and one or more operands, which further specify • The second source operand which is a literal the operation of the instruction. value The instruction set is highly orthogonal and is grouped • The destination of the result (only if not the same into five basic categories: as the first source operand) which is typically a register ‘Wd’ with or without an address modifier • Word or byte-oriented operations The MAC class of DSP instructions may use some of the • Bit-oriented operations following operands: • Literal operations • The accumulator (A or B) to be used (required • DSP operations operand) • Control operations • The W registers to be used as the two operands Table23-1 illustrates the general symbols used in • The X and Y address space prefetch operations describing the instructions. • The X and Y address space prefetch destinations The dsPIC33F instruction set summary in Table23-2 • The accumulator write back destination provides all the instructions, along with the status flags affected by each instruction. The other DSP instructions do not involve any multiplication and may include: Most word or byte-oriented W register instructions (including barrel shift instructions) have three • The accumulator to be used (required) operands: • The source or destination operand (designated as Wso or Wdo, respectively) with or without an • The first source operand which is typically a address modifier register ‘Wb’ without any address modifier • The amount of shift specified by a W register ‘Wn’ • The second source operand which is typically a or a literal value register ‘Ws’ with or without an address modifier • The destination of the result which is typically a The control instructions may use some of the following register ‘Wd’ with or without an address modifier operands: However, word or byte-oriented file register instructions • A program memory address have two operands: • The mode of the table read and table write instructions • The file register specified by the value ‘f’ • The destination, which could either be the file register ‘f’ or the W0 register, which is denoted as ‘WREG’ 2009-2012 Microchip Technology Inc. DS70593D-page 259
dsPIC33FJXXXGPX06A/X08A/X10A All instructions are a single word, except for certain all table reads and writes and RETURN/RETFIE double-word instructions, which were made instructions, which are single-word instructions but take double-word instructions so that all the required two or three cycles. Certain instructions that involve skip- information is available in these 48 bits. In the second ping over the subsequent instruction require either two word, the 8MSbs are ‘0’s. If this second word is or three cycles if the skip is performed, depending on executed as an instruction (by itself), it will execute as whether the instruction being skipped is a single-word or a NOP. two-word instruction. Moreover, double-word moves require two cycles. The double-word instructions Most single-word instructions are executed in a single execute in two instruction cycles. instruction cycle, unless a conditional test is true, or the program counter is changed as a result of the Note: For more details on the instruction set, instruction. In these cases, the execution takes two refer to the “16-bit MCU and DSC instruction cycles with the additional instruction cycle(s) Programmer’s Reference Manual” executed as a NOP. Notable exceptions are the BRA (DS70157). (unconditional/computed branch), indirect CALL/GOTO, TABLE 23-1: SYMBOLS USED IN OPCODE DESCRIPTIONS Field Description #text Means literal defined by “text” (text) Means “content of text” [text] Means “the location addressed by text” { } Optional field or operation <n:m> Register bit field .b Byte mode selection .d Double-Word mode selection .S Shadow register select .w Word mode selection (default) Acc One of two accumulators {A, B} AWB Accumulator write back destination address register {W13, [W13]+ = 2} bit4 4-bit bit selection field (used in word addressed instructions) {0...15} C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero Expr Absolute address, label or expression (resolved by the linker) f File register address {0x0000...0x1FFF} lit1 1-bit unsigned literal {0,1} lit4 4-bit unsigned literal {0...15} lit5 5-bit unsigned literal {0...31} lit8 8-bit unsigned literal {0...255} lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode lit14 14-bit unsigned literal {0...16384} lit16 16-bit unsigned literal {0...65535} lit23 23-bit unsigned literal {0...8388608}; LSb must be ‘0’ None Field does not require an entry, may be blank OA, OB, SA, SB DSP Status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate PC Program Counter Slit10 10-bit signed literal {-512...511} Slit16 16-bit signed literal {-32768...32767} Slit6 6-bit signed literal {-16...16} Wb Base W register {W0..W15} Wd Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } Wdo Destination W register { Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] } Wm,Wn Dividend, Divisor working register pair (direct addressing) DS70593D-page 260 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 23-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED) Field Description Wm*Wm Multiplicand and Multiplier working register pair for Square instructions {W4 * W4,W5 * W5,W6 * W6,W7 * W7} Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions {W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7} Wn One of 16 working registers {W0..W15} Wnd One of 16 destination working registers {W0...W15} Wns One of 16 source working registers {W0...W15} WREG W0 (working register used in file register instructions) Ws Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } Wso Source W register { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] } Wx X data space prefetch address register for DSP instructions {[W8]+ = 6, [W8]+ = 4, [W8]+ = 2, [W8], [W8]- = 6, [W8]- = 4, [W8]- = 2, [W9]+ = 6, [W9]+ = 4, [W9]+ = 2, [W9], [W9]- = 6, [W9]- = 4, [W9]- = 2, [W9 + W12], none} Wxd X data space prefetch destination register for DSP instructions {W4...W7} Wy Y data space prefetch address register for DSP instructions {[W10]+ = 6, [W10]+ = 4, [W10]+ = 2, [W10], [W10]- = 6, [W10]- = 4, [W10]- = 2, [W11]+ = 6, [W11]+ = 4, [W11]+ = 2, [W11], [W11]- = 6, [W11]- = 4, [W11]- = 2, [W11 + W12], none} Wyd Y data space prefetch destination register for DSP instructions {W4...W7} 2009-2012 Microchip Technology Inc. DS70593D-page 261
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 23-2: INSTRUCTION SET OVERVIEW Base Assembly # of # of Status Flags Instr Assembly Syntax Description Mnemonic Words Cycles Affected # 1 ADD ADD Acc Add Accumulators 1 1 OA,OB,SA,SB ADD f f = f + WREG 1 1 C,DC,N,OV,Z ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB 2 ADDC ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z 3 AND AND f f = f .AND. WREG 1 1 N,Z AND f,WREG WREG = f .AND. WREG 1 1 N,Z AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z 4 ASR ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z 5 BCLR BCLR f,#bit4 Bit Clear f 1 1 None BCLR Ws,#bit4 Bit Clear Ws 1 1 None 6 BRA BRA C,Expr Branch if Carry 1 1 (2) None BRA GE,Expr Branch if greater than or equal 1 1 (2) None BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None BRA GT,Expr Branch if greater than 1 1 (2) None BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None BRA LE,Expr Branch if less than or equal 1 1 (2) None BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None BRA LT,Expr Branch if less than 1 1 (2) None BRA LTU,Expr Branch if unsigned less than 1 1 (2) None BRA N,Expr Branch if Negative 1 1 (2) None BRA NC,Expr Branch if Not Carry 1 1 (2) None BRA NN,Expr Branch if Not Negative 1 1 (2) None BRA NOV,Expr Branch if Not Overflow 1 1 (2) None BRA NZ,Expr Branch if Not Zero 1 1 (2) None BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None BRA OV,Expr Branch if Overflow 1 1 (2) None BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None BRA Expr Branch Unconditionally 1 2 None BRA Z,Expr Branch if Zero 1 1 (2) None BRA Wn Computed Branch 1 2 None 7 BSET BSET f,#bit4 Bit Set f 1 1 None BSET Ws,#bit4 Bit Set Ws 1 1 None 8 BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None 9 BTG BTG f,#bit4 Bit Toggle f 1 1 None BTG Ws,#bit4 Bit Toggle Ws 1 1 None DS70593D-page 262 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 23-2: INSTRUCTION SET OVERVIEW (CONTINUED) Base Assembly # of # of Status Flags Instr Assembly Syntax Description Mnemonic Words Cycles Affected # 10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1 None (2 or 3) BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1 None (2 or 3) 11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1 None (2 or 3) BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1 None (2 or 3) 12 BTST BTST f,#bit4 Bit Test f 1 1 Z BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z 13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z 14 CALL CALL lit23 Call subroutine 2 2 None CALL Wn Call indirect subroutine 1 2 None 15 CLR CLR f f = 0x0000 1 1 None CLR WREG WREG = 0x0000 1 1 None CLR Ws Ws = 0x0000 1 1 None CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB 16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep 17 COM COM f f = f 1 1 N,Z COM f,WREG WREG = f 1 1 N,Z COM Ws,Wd Wd = Ws 1 1 N,Z 18 CP CP f Compare f with WREG 1 1 C,DC,N,OV,Z CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C,DC,N,OV,Z 19 CP0 CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z 20 CPB CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,Ws Compare Wb with Ws, with Borrow 1 1 C,DC,N,OV,Z (Wb - Ws - C) 21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1 None (2 or 3) 22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1 None (2 or 3) 23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1 None (2 or 3) 24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if 1 1 None (2 or 3) 25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C 26 DEC DEC f f = f – 1 1 1 C,DC,N,OV,Z DEC f,WREG WREG = f – 1 1 1 C,DC,N,OV,Z DEC Ws,Wd Wd = Ws – 1 1 1 C,DC,N,OV,Z 27 DEC2 DEC2 f f = f – 2 1 1 C,DC,N,OV,Z DEC2 f,WREG WREG = f – 2 1 1 C,DC,N,OV,Z DEC2 Ws,Wd Wd = Ws – 2 1 1 C,DC,N,OV,Z 28 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None 2009-2012 Microchip Technology Inc. DS70593D-page 263
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 23-2: INSTRUCTION SET OVERVIEW (CONTINUED) Base Assembly # of # of Status Flags Instr Assembly Syntax Description Mnemonic Words Cycles Affected # 29 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV 30 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV 31 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 times 2 2 None DO Wn,Expr Do code to PC + Expr, (Wn) + 1 times 2 2 None 32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB, SA,SB,SAB 33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB, SA,SB,SAB 34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None 35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C 36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C 37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C 38 GOTO GOTO Expr Go to address 2 2 None GOTO Wn Go to indirect 1 2 None 39 INC INC f f = f + 1 1 1 C,DC,N,OV,Z INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z 40 INC2 INC2 f f = f + 2 1 1 C,DC,N,OV,Z INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z 41 IOR IOR f f = f .IOR. WREG 1 1 N,Z IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z 42 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 43 LNK LNK #lit14 Link Frame Pointer 1 1 None 44 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z 45 MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply and Accumulate 1 1 OA,OB,OAB, , SA,SB,SAB AWB MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB 46 MOV MOV f,Wn Move f to Wn 1 1 None MOV f Move f to f 1 1 None MOV f,WREG Move f to WREG 1 1 N,Z MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None MOV Wn,f Move Wn to f 1 1 None MOV Wso,Wdo Move Ws to Wd 1 1 None MOV WREG,f Move WREG to f 1 1 None MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None 47 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Prefetch and store accumulator 1 1 None DS70593D-page 264 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 23-2: INSTRUCTION SET OVERVIEW (CONTINUED) Base Assembly # of # of Status Flags Instr Assembly Syntax Description Mnemonic Words Cycles Affected # 48 MPY MPY Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB, Wm*Wn,Acc,Wx,Wxd,Wy,Wyd SA,SB,SAB MPY Square Wm to Accumulator 1 1 OA,OB,OAB, Wm*Wm,Acc,Wx,Wxd,Wy,Wyd SA,SB,SAB 49 MPY.N MPY.N -(Multiply Wm by Wn) to Accumulator 1 1 None Wm*Wn,Acc,Wx,Wxd,Wy,Wyd 50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Multiply and Subtract from Accumulator 1 1 OA,OB,OAB, , SA,SB,SAB AWB 51 MUL MUL.SS Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) 1 1 None MUL.SU Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None MUL.US Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None MUL.UU Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * 1 1 None unsigned(Ws) MUL.SU Wb,#lit5,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None MUL.UU Wb,#lit5,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * 1 1 None unsigned(lit5) MUL f W3:W2 = f * WREG 1 1 None 52 NEG NEG Acc Negate Accumulator 1 1 OA,OB,OAB, SA,SB,SAB NEG f f = f + 1 1 1 C,DC,N,OV,Z NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z 53 NOP NOP No Operation 1 1 None NOPR No Operation 1 1 None 54 POP POP f Pop f from Top-of-Stack (TOS) 1 1 None POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None POP.D Wnd Pop from Top-of-Stack (TOS) to 1 2 None W(nd):W(nd + 1) POP.S Pop Shadow Registers 1 1 All 55 PUSH PUSH f Push f to Top-of-Stack (TOS) 1 1 None PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None PUSH.D Wns Push W(ns):W(ns + 1) to Top-of-Stack (TOS) 1 2 None PUSH.S Push Shadow Registers 1 1 None 56 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep 57 RCALL RCALL Expr Relative Call 1 2 None RCALL Wn Computed Call 1 2 None 58 REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None 59 RESET RESET Software device Reset 1 1 None 60 RETFIE RETFIE Return from interrupt 1 3 (2) None 61 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None 62 RETURN RETURN Return from Subroutine 1 3 (2) None 63 RLC RLC f f = Rotate Left through Carry f 1 1 C,N,Z RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z 64 RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N,Z RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z 65 RRC RRC f f = Rotate Right through Carry f 1 1 C,N,Z RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z 2009-2012 Microchip Technology Inc. DS70593D-page 265
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 23-2: INSTRUCTION SET OVERVIEW (CONTINUED) Base Assembly # of # of Status Flags Instr Assembly Syntax Description Mnemonic Words Cycles Affected # 66 RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N,Z RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z 67 SAC SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None 68 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z 69 SETM SETM f f = 0xFFFF 1 1 None SETM WREG WREG = 0xFFFF 1 1 None SETM Ws Ws = 0xFFFF 1 1 None 70 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB, SA,SB,SAB SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB, SA,SB,SAB 71 SL SL f f = Left Shift f 1 1 C,N,OV,Z SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z 72 SUB SUB Acc Subtract Accumulators 1 1 OA,OB,OAB, SA,SB,SAB SUB f f = f – WREG 1 1 C,DC,N,OV,Z SUB f,WREG WREG = f – WREG 1 1 C,DC,N,OV,Z SUB #lit10,Wn Wn = Wn – lit10 1 1 C,DC,N,OV,Z SUB Wb,Ws,Wd Wd = Wb – Ws 1 1 C,DC,N,OV,Z SUB Wb,#lit5,Wd Wd = Wb – lit5 1 1 C,DC,N,OV,Z 73 SUBB SUBB f f = f – WREG – (C) 1 1 C,DC,N,OV,Z SUBB f,WREG WREG = f – WREG – (C) 1 1 C,DC,N,OV,Z SUBB #lit10,Wn Wn = Wn – lit10 – (C) 1 1 C,DC,N,OV,Z SUBB Wb,Ws,Wd Wd = Wb – Ws – (C) 1 1 C,DC,N,OV,Z SUBB Wb,#lit5,Wd Wd = Wb – lit5 – (C) 1 1 C,DC,N,OV,Z 74 SUBR SUBR f f = WREG – f 1 1 C,DC,N,OV,Z SUBR f,WREG WREG = WREG – f 1 1 C,DC,N,OV,Z SUBR Wb,Ws,Wd Wd = Ws – Wb 1 1 C,DC,N,OV,Z SUBR Wb,#lit5,Wd Wd = lit5 – Wb 1 1 C,DC,N,OV,Z 75 SUBBR SUBBR f f = WREG – f – (C) 1 1 C,DC,N,OV,Z SUBBR f,WREG WREG = WREG – f – (C) 1 1 C,DC,N,OV,Z SUBBR Wb,Ws,Wd Wd = Ws – Wb – (C) 1 1 C,DC,N,OV,Z SUBBR Wb,#lit5,Wd Wd = lit5 – Wb – (C) 1 1 C,DC,N,OV,Z 76 SWAP SWAP.b Wn Wn = nibble swap Wn 1 1 None SWAP Wn Wn = byte swap Wn 1 1 None 77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None 78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None 79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None 80 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None 81 ULNK ULNK Unlink Frame Pointer 1 1 None 82 XOR XOR f f = f .XOR. WREG 1 1 N,Z XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z 83 ZE ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N DS70593D-page 266 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 24.0 DEVELOPMENT SUPPORT 24.1 MPLAB Integrated Development Environment Software The PIC® microcontrollers and dsPIC® digital signal controllers are supported with a full range of software The MPLAB IDE software brings an ease of software and hardware development tools: development previously unseen in the 8/16/32-bit • Integrated Development Environment microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: - MPLAB® IDE Software • Compilers/Assemblers/Linkers • A single graphical interface to all debugging tools - MPLAB C Compiler for Various Device - Simulator Families - Programmer (sold separately) - HI-TECH C® for Various Device Families - In-Circuit Emulator (sold separately) - MPASMTM Assembler - In-Circuit Debugger (sold separately) - MPLINKTM Object Linker/ • A full-featured editor with color-coded context MPLIBTM Object Librarian • A multiple project manager - MPLAB Assembler/Linker/Librarian for • Customizable data windows with direct edit of Various Device Families contents • Simulators • High-level source code debugging - MPLAB SIM Software Simulator • Mouse over variable inspection • Emulators • Drag and drop variables from source to watch - MPLAB REAL ICE™ In-Circuit Emulator windows • In-Circuit Debuggers • Extensive on-line help - MPLAB ICD 3 • Integration of select third party tools, such as - PICkit™ 3 Debug Express IAR C Compilers • Device Programmers The MPLAB IDE allows you to: - PICkit™ 2 Programmer • Edit your source files (either C or assembly) - MPLAB PM3 Device Programmer • One-touch compile or assemble, and download to • Low-Cost Demonstration/Development Boards, emulator and simulator tools (automatically Evaluation Kits, and Starter Kits updates all project information) • Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. 2009-2012 Microchip Technology Inc. DS70593D-page 267
dsPIC33FJXXXGPX06A/X08A/X10A 24.2 MPLAB C Compilers for Various 24.5 MPLINK Object Linker/ Device Families MPLIB Object Librarian The MPLAB C Compiler code development systems The MPLINK Object Linker combines relocatable are complete ANSI C compilers for Microchip’s PIC18, objects created by the MPASM Assembler and the PIC24 and PIC32 families of microcontrollers and the MPLAB C18 C Compiler. It can link relocatable objects dsPIC30 and dsPIC33 families of digital signal control- from precompiled libraries, using directives from a lers. These compilers provide powerful integration linker script. capabilities, superior code optimization and ease of The MPLIB Object Librarian manages the creation and use. modification of library files of precompiled code. When For easy source level debugging, the compilers provide a routine from a library is called from a source file, only symbol information that is optimized to the MPLAB IDE the modules that contain that routine will be linked in debugger. with the application. This allows large libraries to be used efficiently in many different applications. 24.3 HI-TECH C for Various Device The object linker/library features include: Families • Efficient linking of single libraries instead of many The HI-TECH C Compiler code development systems smaller files are complete ANSI C compilers for Microchip’s PIC • Enhanced code maintainability by grouping family of microcontrollers and the dsPIC family of digital related modules together signal controllers. These compilers provide powerful • Flexible creation of libraries with easy module integration capabilities, omniscient code generation listing, replacement, deletion and extraction and ease of use. For easy source level debugging, the compilers provide 24.6 MPLAB Assembler, Linker and symbol information that is optimized to the MPLAB IDE Librarian for Various Device debugger. Families The compilers include a macro assembler, linker, pre- MPLAB Assembler produces relocatable machine processor, and one-step driver, and can run on multiple code from symbolic assembly language for PIC24, platforms. PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler 24.4 MPASM Assembler generates relocatable object files that can then be The MPASM Assembler is a full-featured, universal archived or linked with other relocatable object files and macro assembler for PIC10/12/16/18 MCUs. archives to create an executable file. Notable features of the assembler include: The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX • Support for the entire device instruction set files, MAP files to detail memory usage and symbol • Support for fixed-point and floating-point data reference, absolute LST files that contain source lines • Command line interface and generated machine code and COFF files for • Rich directive set debugging. • Flexible macro language The MPASM Assembler features include: • MPLAB IDE compatibility • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process DS70593D-page 268 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 24.7 MPLAB SIM Software Simulator 24.9 MPLAB ICD 3 In-Circuit Debugger System The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulat- MPLAB ICD 3 In-Circuit Debugger System is Micro- ing the PIC MCUs and dsPIC® DSCs on an instruction chip's most cost effective high-speed hardware level. On any given instruction, the data areas can be debugger/programmer for Microchip Flash Digital Sig- examined or modified and stimuli can be applied from nal Controller (DSC) and microcontroller (MCU) a comprehensive stimulus controller. Registers can be devices. It debugs and programs PIC® Flash microcon- logged to files for further run-time analysis. The trace trollers and dsPIC® DSCs with the powerful, yet easy- buffer and logic analyzer display extend the power of to-use graphical user interface of MPLAB Integrated the simulator to record and track program execution, Development Environment (IDE). actions on I/O, most peripherals and internal registers. The MPLAB ICD 3 In-Circuit Debugger probe is con- The MPLAB SIM Software Simulator fully supports nected to the design engineer's PC using a high-speed symbolic debugging using the MPLAB CCompilers, USB 2.0 interface and is connected to the target with a and the MPASM and MPLAB Assemblers. The soft- connector compatible with the MPLAB ICD 2 or MPLAB ware simulator offers the flexibility to develop and REAL ICE systems (RJ-11). MPLAB ICD 3 supports all debug code outside of the hardware laboratory envi- MPLAB ICD 2 headers. ronment, making it an excellent, economical software development tool. 24.10 PICkit 3 In-Circuit Debugger/ Programmer and 24.8 MPLAB REAL ICE In-Circuit PICkit 3 Debug Express Emulator System The MPLAB PICkit 3 allows debugging and program- MPLAB REAL ICE In-Circuit Emulator System is ming of PIC® and dsPIC® Flash microcontrollers at a Microchip’s next generation high-speed emulator for most affordable price point using the powerful graphical Microchip Flash DSC and MCU devices. It debugs and user interface of the MPLAB Integrated Development programs PIC® Flash MCUs and dsPIC® Flash DSCs Environment (IDE). The MPLAB PICkit 3 is connected with the easy-to-use, powerful graphical user interface of to the design engineer's PC using a full speed USB the MPLAB Integrated Development Environment (IDE), interface and can be connected to the target via an included with each kit. Microchip debug (RJ-11) connector (compatible with The emulator is connected to the design engineer’s PC MPLAB ICD 3 and MPLAB REAL ICE). The connector using a high-speed USB 2.0 interface and is connected uses two device I/O pins and the reset line to imple- to the target with either a connector compatible with in- ment in-circuit debugging and In-Circuit Serial Pro- circuit debugger systems (RJ11) or with the new high- gramming™. speed, noise tolerant, Low-Voltage Differential Signal The PICkit 3 Debug Express include the PICkit 3, demo (LVDS) interconnection (CAT5). board and microcontroller, hookup cables and CDROM The emulator is field upgradable through future firmware with user’s guide, lessons, tutorial, compiler and downloads in MPLAB IDE. In upcoming releases of MPLAB IDE software. MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 2009-2012 Microchip Technology Inc. DS70593D-page 269
dsPIC33FJXXXGPX06A/X08A/X10A 24.11 PICkit 2 Development 24.13 Demonstration/Development Programmer/Debugger and Boards, Evaluation Kits, and PICkit 2 Debug Express Starter Kits The PICkit™ 2 Development Programmer/Debugger is A wide variety of demonstration, development and a low-cost development tool with an easy to use inter- evaluation boards for various PIC MCUs and dsPIC face for programming and debugging Microchip’s Flash DSCs allows quick application development on fully func- families of microcontrollers. The full featured tional systems. Most boards include prototyping areas for Windows® programming interface supports baseline adding custom circuitry and provide application firmware (PIC10F, PIC12F5xx, PIC16F5xx), midrange and source code for examination and modification. (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, The boards support a variety of features, including LEDs, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit temperature sensors, switches, speakers, RS-232 microcontrollers, and many Microchip Serial EEPROM interfaces, LCD displays, potentiometers and additional products. With Microchip’s powerful MPLAB Integrated EEPROM memory. Development Environment (IDE) the PICkit™ 2 enables in-circuit debugging on most PIC® microcon- The demonstration and development boards can be trollers. In-Circuit-Debugging runs, halts and single used in teaching environments, for prototyping custom steps the program while the PIC microcontroller is circuits and for learning about various microcontroller embedded in the application. When halted at a break- applications. point, the file registers can be examined and modified. In addition to the PICDEM™ and dsPICDEM™ demon- The PICkit 2 Debug Express include the PICkit 2, demo stration/development board series of circuits, Microchip board and microcontroller, hookup cables and CDROM has a line of evaluation kits and demonstration software with user’s guide, lessons, tutorial, compiler and for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® MPLAB IDE software. evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. 24.12 MPLAB PM3 Device Programmer Also available are starter kits that contain everything The MPLAB PM3 Device Programmer is a universal, needed to experience the specified device. This usually CE compliant device programmer with programmable includes a single application and debug capability, all voltage verification at VDDMIN and VDDMAX for on one board. maximum reliability. It features a large LCD display Check the Microchip web page (www.microchip.com) (128 x 64) for menus and error messages and a modu- for the complete list of demonstration, development lar, detachable socket assembly to support various and evaluation kits. package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. DS70593D-page 270 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 25.0 ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC33FJXXXGPX06A/X08A/X10A electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the dsPIC33FJXXXGPX06A/X08A/X10A family are listed below. Exposure to these max- imum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings (See Note 1) Ambient temperature under bias.............................................................................................................-40°C to +125°C Storage temperature.............................................................................................................................. -65°C to +160°C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V Voltage on any pin that is not 5V tolerant with respect to VSS(4) ....................................................-0.3V to (VDD + 0.3V) Voltage on any 5V tolerant pin with respect to VSS when VDD 3.0V(4) .................................................. -0.3V to +5.6V Voltage on any 5V tolerant pin with respect to Vss when VDD < 3.0V(4)......................................................-0.3V to 3.6V Maximum current out of VSS pin...........................................................................................................................300 mA Maximum current into VDD pin(2)...........................................................................................................................250 mA Maximum current sourced/sunk by any 2x I/O pin(3)................................................................................................8 mA Maximum current sourced/sunk by any 4x I/O pin(3)..............................................................................................15 mA Maximum current sourced/sunk by any 8x I/O pin(3)..............................................................................................25 mA Maximum current sunk by all ports.......................................................................................................................200 mA Maximum current sourced by all ports(2)...............................................................................................................200 mA Note1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2: Maximum allowable current is a function of device maximum power dissipation (see Table25-2). 3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGECx and PGEDx pins, which are able to sink/source 12 mA. 4: See the “Pin Diagrams” section for 5V tolerant pins. 2009-2012 Microchip Technology Inc. DS70593D-page 271
dsPIC33FJXXXGPX06A/X08A/X10A 25.1 DC Characteristics TABLE 25-1: OPERATING MIPS VS. VOLTAGE Max MIPS VDD Range Temp Range Characteristic (in Volts) (in °C) dsPIC33FJXXXGPX06A/X08A/X10A — VBOR-3.6V(1) -40°C to +85°C 40 — VBOR-3.6V(1) -40°C to +125°C 40 Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table25-11 for the minimum and maximum BOR values. TABLE 25-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit dsPIC33FJXXXGPX06A/X08A/X10A Operating Junction Temperature Range TJ -40 — +125 °C Operating Ambient Temperature Range TA -40 — +85 °C Extended Temperature Devices Operating Junction Temperature Range TJ -40 — +150 °C Operating Ambient Temperature Range TA -40 — +125 °C Power Dissipation: Internal chip power dissipation: PINT = VDD x (IDD - IOH) PD PINT + PI/O W I/O Pin Power Dissipation: I/O = ({VDD - VOH} x IOH) + (VOL x IOL) Maximum Allowed Power Dissipation PDMAX (TJ - TA)/JA W TABLE 25-3: THERMAL PACKAGING CHARACTERISTICS Characteristic Symbol Typ Max Unit Notes Package Thermal Resistance, 100-pin TQFP (14x14x1 mm) JA 40 — °C/W 1 Package Thermal Resistance, 100-pin TQFP (12x12x1 mm) JA 40 — °C/W 1 Package Thermal Resistance, 80-pin TQFP (12x12x1 mm) JA 40 — °C/W 1 Package Thermal Resistance, 64-pin TQFP (10x10x1 mm) JA 40 — °C/W 1 Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm) JA 28 — °C/W 1 Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations. DS70593D-page 272 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic Min Typ(1) Max Units Conditions No. Operating Voltage DC10 Supply Voltage VDD — 3.0 — 3.6 V — DC12 VDR RAM Data Retention Voltage(2) 1.8 — — V — DC16 VPOR VDD Start Voltage — — VSS V — to ensure internal Power-on Reset signal DC17 SVDD VDD Rise Rate 0.03 — — V/ms 0-3.0V in 0.1s to ensure internal Power-on Reset signal Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 2: This is the limit to which VDD can be lowered without losing RAM data. 2009-2012 Microchip Technology Inc. DS70593D-page 273
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Parameter Typical(2) Max Units Conditions No.(3) Operating Current (IDD)(1) DC20d 27 30 mA -40°C DC20a 27 30 mA +25°C 3.3V 10 MIPS DC20b 27 30 mA +85°C DC20c 27 35 mA +125°C DC21d 36 40 mA -40°C DC21a 37 40 mA +25°C 3.3V 16 MIPS DC21b 38 45 mA +85°C DC21c 39 45 mA +125°C DC22d 43 50 mA -40°C DC22a 46 50 mA +25°C 3.3V 20 MIPS DC22b 46 55 mA +85°C DC22c 47 55 mA +125°C DC23d 65 70 mA -40°C DC23a 65 70 mA +25°C 3.3V 30 MIPS DC23b 65 70 mA +85°C DC23c 65 70 mA +125°C DC24d 84 90 mA -40°C DC24a 84 90 mA +25°C 3.3V 40 MIPS DC24b 84 90 mA +85°C DC24c 84 90 mA +125°C Note 1: IDD is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: • Oscillator is configured in EC mode with PLL, OSC1 is driven with external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required) • CLKO is configured as an I/O input pin in the Configuration word • All I/O pins are configured as inputs and pulled to VSS • MCLR = VDD, WDT and FSCM are disabled • CPU, SRAM, program memory and data memory are operational • No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits are set to zero and unimplemented PMDx bits are set to one) • CPU executing while(1) statement • JTAG is disabled 2: Data in “Typ” column is at 3.3V, +25ºC unless otherwise stated. 3: These parameters are characterized but not tested in manufacturing. DS70593D-page 274 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Parameter Typical(2) Max Units Conditions No.(3) Idle Current (IIDLE): Core OFF Clock ON Base Current(1) DC40d 3 25 mA -40°C DC40a 3 25 mA +25°C 10 MIPS DC40b 3 25 mA +85°C 3.3V DC40c 3 25 mA +125°C DC41d 4 25 mA -40°C DC41a 5 25 mA +25°C 3.3V 16 MIPS DC41b 6 25 mA +85°C DC41c 6 25 mA +125°C DC42d 8 25 mA -40°C DC42a 9 25 mA +25°C 3.3V 20 MIPS DC42b 10 25 mA +85°C DC42c 10 25 mA +125°C DC43a 15 25 mA +25°C DC43d 15 25 mA -40°C 3.3V 30 MIPS DC43b 15 25 mA +85°C DC43c 15 25 mA +125°C DC44d 16 25 mA -40°C DC44a 16 25 mA +25°C 3.3V 40 MIPS DC44b 16 25 mA +85°C DC44c 16 25 mA +125°C Note 1: Base IIDLE current is measured as follows: • CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required) • CLKO is configured as an I/O input pin in the Configuration word • All I/O pins are configured as inputs and pulled to VSS • MCLR = VDD, WDT and FSCM are disabled • No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits are set to zero and unimplemented PMDx bits are set to one) • JTAG is disabled 2: Data in “Typ” column is at 3.3V, +25ºC unless otherwise stated. 3: These parameters are characterized but not tested in manufacturing. 2009-2012 Microchip Technology Inc. DS70593D-page 275
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Parameter Typical(2) Max Units Conditions No.(3) Power-Down Current (IPD)(1) DC60d 50 200 A -40°C DC60a 50 200 A +25°C 3.3V Base Power-Down Current(3,4) DC60b 200 500 A +85°C DC60c 600 1000 A +125°C DC61d 8 13 A -40°C DC61a 10 15 A +25°C 3.3V Watchdog Timer Current: IWDT(3,5) DC61b 12 20 A +85°C DC61c 13 25 A +125°C Note 1: IPD (Sleep) current is measured as follows: • CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required) • CLKO is configured as an I/O input pin in the Configuration word • All I/O pins are configured as inputs and pulled to VSS • MCLR = VDD, WDT and FSCM are disabled, all peripheral modules except the ADC are disabled (PMDx bits are all ‘1’s). The following ADC settings are enabled for each ADC module (ADCx) prior to executing the PWRSAV instruction: ADON = 1, VCFG = 1, AD12B = 1 and ADxMD = 0. • VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to stand-by while the device is in Sleep mode) • RTCC is disabled. • JTAG is disabled 2: Data in the “Typ” column is at 3.3V, +25ºC unless otherwise stated. 3: The Watchdog Timer Current is the additional current consumed when the WDT module is enabled. This current should be added to the base IPD current. 4: These currents are measured on the device containing the most memory in this family. 5: These parameters are characterized, but are not tested in manufacturing. DS70593D-page 276 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Parameter Typical(2) Max Doze Ratio Units Conditions No. Doze Current (IDOZE)(1) DC73a 11 35 1:2 mA DC73f 11 30 1:64 mA -40°C 3.3V 40 MIPS DC73g 11 30 1:128 mA DC70a 42 50 1:2 mA DC70f 26 30 1:64 mA +25°C 3.3V 40 MIPS DC70g 25 30 1:128 mA DC71a 41 50 1:2 mA DC71f 25 30 1:64 mA +85°C 3.3V 40 MIPS DC71g 24 30 1:128 mA DC72a 42 50 1:2 mA DC72f 26 30 1:64 mA +125°C 3.3V 40 MIPS DC72g 25 30 1:128 mA Note 1: IDOZE is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDOZE measurements are as follows: • Oscillator is configured in EC mode and external clock active, OSC1 is driven with external square wave from rail-to-rail with overshoot/undershoot < 250 mV • CLKO is configured as an I/O input pin in the Configuration word • All I/O pins are configured as inputs and pulled to VSS • MCLR = VDD, WDT and FSCM are disabled • CPU, SRAM, program memory and data memory are operational • No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits are set to zero and unimplemented PMDx bits are set to one) • CPU executing while(1) statement • JTAG is disabled 2: Data in the “Typ” column is at 3.3V, +25ºC unless otherwise stated. 2009-2012 Microchip Technology Inc. DS70593D-page 277
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°C TA+125°C for Extended Param Symbol Characteristic Min Typ(1) Max Units Conditions No. VIL Input Low Voltage DI10 I/O pins VSS — 0.2VDD V DI15 MCLR VSS — 0.2VDD V DI16 I/O Pins with OSC1 or SOSCI VSS — 0.2VDD V DI18 I/O Pins with I2C VSS — 0.3 VDD V SMBus disabled DI19 I/O Pins with I2C VSS — 0.8 V V SMBus enabled VIH Input High Voltage DI20 I/O Pins Not 5V Tolerant(4) 0.7VDD — VDD V I/O Pins 5V Tolerant(4) 0.7VDD — 5.5 V DI28 SDAx, SCLx 0.7 VDD — 5.5 V SMBus disabled DI29 SDAx, SCLx 2.1 — 5.5 V SMBus enabled ICNPU CNx Pull-up Current DI30 50 250 400 A VDD = 3.3V, VPIN = VSS IIL Input Leakage Current(2,3) DI50 I/O Pins 5V Tolerant(4) — — ±2 A VSS VPIN VDD, Pin at high-impedance DI51 I/O Pins Not 5V Tolerant(4) — — ±1 A VSS VPIN VDD, Pin at high-impedance, -40°CTA +85°C DI51a I/O Pins Not 5V Tolerant(4) — — ±2 A Shared with external reference pins, -40°CTA +85°C DI51b I/O Pins Not 5V Tolerant(4) — — ±3.5 A VSS VPIN VDD, Pin at high-impedance, -40°CTA +125°C DI51c I/O Pins Not 5V Tolerant(4) — — ±8 A Analog pins shared with external reference pins, -40°CTA +125°C DI55 MCLR — — ±2 A VSS VPIN VDD DI56 OSC1 — — ±2 A VSS VPIN VDD, XT and HS modes Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. 4: See “Pin Diagrams” for a list of 5V tolerant pins. 5: VIL source < (VSS – 0.3). Characterized but not tested. 6: Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not tested. 7: Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V. 8: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. 9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted pro- vided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not exceed the specified limit. Characterized but not tested. DS70593D-page 278 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°C TA+125°C for Extended Param Symbol Characteristic Min Typ(1) Max Units Conditions No. IICL Input Low Injection Current DI60a All pins except VDD, VSS, AVDD, 0 — -5(5,8) mA AVSS, MCLR, VCAP, SOSCI, SOSCO, and RB11 IICH Input High Injection Current DI60b All pins except VDD, VSS, AVDD, 0 — +5(6,7,8) mA AVSS, MCLR, VCAP, SOSCI, SOSCO, RB11, and all 5V tolerant pins(7) IICT Total Input Injection Current DI60c (sum of all I/O and control -20(9) — +20(9) mA Absolute instantaneous sum of pins) all ± input injection currents from all I/O pins (| IICL + | IICH |) IICT Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. 4: See “Pin Diagrams” for a list of 5V tolerant pins. 5: VIL source < (VSS – 0.3). Characterized but not tested. 6: Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not tested. 7: Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V. 8: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. 9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted pro- vided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not exceed the specified limit. Characterized but not tested. 2009-2012 Microchip Technology Inc. DS70593D-page 279
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic Min Typ Max Units Conditions No. Output Low Voltage I/O Pins: — — 0.4 V IOL 3 mA, VDD = 3.3V 2x Sink Driver Pins - All pins not defined by 4x or 8x driver pins Output Low Voltage I/O Pins: DO10 VOL 4x Sink Driver Pins - RA2, RA3, — — 0.4 V IOL 6 mA, VDD = 3.3V RA9, RA10, RA14, RA15, RB0, RB1, RB11, RF4, RF5, RG2, RG3 Output Low Voltage I/O Pins: — — 0.4 V IOL 10 mA, VDD = 3.3V 8x Sink Driver Pins - OSC2, CLKO, RC15 Output High Voltage I/O Pins: 2.4 — — V IOL-3 mA, VDD = 3.3V 2x Source Driver Pins - All pins not defined by 4x or 8x driver pins Output High Voltage I/O Pins: 4x Source Driver Pins - RA2, RA3, 2.4 — — V IOL-6 mA, VDD = 3.3V DO20 VOH RA9, RA10, RA14, RA15, RB0, RB1, RB11, RF4, RF5, RG2, RG3 Output High Voltage I/O Pins: 8x Source Driver Pins - OSC2, 2.4 — — V IOL-10 mA, VDD = 3.3V CLKO, RC15 Output High Voltage IOH-6 mA, VDD = 3.3V 1.5 — — I/O Pins: See Note 1 2x Source Driver Pins - All pins not IOH-5 mA, VDD = 3.3V 2.0 — — V defined by 4x or 8x driver pins See Note 1 IOH-2 mA, VDD = 3.3V 3.0 — — See Note 1 Output High Voltage IOH-12 mA, VDD = 3.3V 1.5 — — 4x Source Driver Pins - RA2, RA3, See Note 1 RA9, RA10, RA14, RA15, RB0, IOH-11 mA, VDD = 3.3V DO20A VOH1 RB1, RB11, RF4, RF5, RG2, RG3 2.0 — — V See Note 1 IOH-3 mA, VDD = 3.3V 3.0 — — See Note 1 Output High Voltage IOH-16 mA, VDD = 3.3V 1.5 — — 8x Source Driver Pins - OSC2, See Note 1 CLKO, RC15 IOH-12 mA, VDD = 3.3V 2.0 — — V See Note 1 IOH-4 mA, VDD = 3.3V 3.0 — — See Note 1 Note 1: Parameters are characterized, but not tested. DS70593D-page 280 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-11: ELECTRICAL CHARACTERISTICS: BOR Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param. Symbol Characteristic(1) Min(1) Typ Max(1) Units Conditions BO10 VBOR BOR Event on VDD transition high-to-low 2.40 — 2.55 V VDD Note 1: Parameters are for design guidance only and are not tested in manufacturing. TABLE 25-12: DC CHARACTERISTICS: PROGRAM MEMORY Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param. Symbol Characteristic(3) Min Typ(1) Max Units Conditions Program Flash Memory D130 EP Cell Endurance 10,000 — — E/W D131 VPR VDD for Read VMIN — 3.6 V VMIN = Minimum operating voltage D132b VPEW VDD for Self-Timed Write VMIN — 3.6 V VMIN = Minimum operating voltage D134 TRETD Characteristic Retention 20 — — Year Provided no other specifications are violated D135 IDDP Supply Current during — 10 — mA Programming D136a TRW Row Write Time 1.32 — 1.74 ms TRW = 11064 FRC cycles, TA = +85°C, See Note 2 D136b TRW Row Write Time 1.28 — 1.79 ms TRW = 11064 FRC cycles, TA = +150°C, See Note 2 D137a TPE Page Erase Time 20.1 — 26.5 ms TPE = 168517 FRC cycles, TA = +85°C, See Note 2 D137b TPE Page Erase Time 19.5 — 27.3 ms TPE = 168517 FRC cycles, TA = +150°C, See Note 2 D138a TWW Word Write Cycle Time 42.3 — 55.9 µs TWW = 355 FRC cycles, TA = +85°C, See Note 2 D138b TWW Word Write Cycle Time 41.1 — 57.6 µs TWW = 355 FRC cycles, TA = +150°C, See Note 2 Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 2: Other conditions: FRC = 7.37 MHz, TUN<5:0> = b'011111 (for Min), TUN<5:0> = b'100000 (for Max). This parameter depends on the FRC accuracy (see Table25-19) and the value of the FRC Oscillator Tuning register (see Register9-4). For complete details on calculating the Minimum and Maximum time see Section5.3 “Programming Operations”. 3: These parameters are assured by design, but are not characterized or tested in manufacturing. TABLE 25-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C TA +85°C for Industrial -40°C TA +125°C for Extended Param. Symbol Characteristics Min Typ Max Units Comments — CEFC External Filter Capacitor Value(1) 4.7 10 — F Capacitor must be low series resistance (< 5 ohms) Note 1: Typical VCORE voltage = 2.5V when VDD VDDMIN. 2009-2012 Microchip Technology Inc. DS70593D-page 281
dsPIC33FJXXXGPX06A/X08A/X10A 25.2 AC Characteristics and Timing Parameters The information contained in this section defines dsPIC33FJXXXGPX06A/X08A/X10A AC characteris- tics and timing parameters. TABLE 25-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Operating voltage VDD range as described in Table25-1. FIGURE 25-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 - for all pins except OSC2 Load Condition 2 - for OSC2 VDD/2 RL Pin CL VSS CL Pin RL = 464 CL = 50 pF for all pins except OSC2 VSS 15 pF for OSC2 output TABLE 25-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS Param Symbol Characteristic Min Typ Max Units Conditions No. DO50 COSC2 OSC2/SOSC2 pin — — 15 pF In XT and HS modes when external clock is used to drive OSC1 DO56 CIO All I/O pins and OSC2 — — 50 pF EC mode DO58 CB SCLx, SDAx — — 400 pF In I2C™ mode DS70593D-page 282 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-2: EXTERNAL CLOCK TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 OS20 OS30 OS30 OS31 OS31 OS25 CLKO OS41 OS40 TABLE 25-16: EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic Min Typ(1) Max Units Conditions No. OS10 FIN External CLKI Frequency DC — 40 MHz EC (External clocks allowed only in EC and ECPLL modes) Oscillator Crystal Frequency 3.5 — 10 MHz XT 10 — 40 MHz HS — — 33 kHz SOSC OS20 TOSC TOSC = 1/FOSC 12.5 — DC ns — OS25 TCY Instruction Cycle Time(2) 25 — DC ns — OS30 TosL, External Clock in (OSC1) 0.375 x TOSC — 0.625 x TOSC ns EC TosH High or Low Time OS31 TosR, External Clock in (OSC1) — — 20 ns EC TosF Rise or Fall Time OS40 TckR CLKO Rise Time(3) — 5.2 — ns — OS41 TckF CLKO Fall Time(3) — 5.2 — ns — OS42 GM External Oscillator 14 16 18 mA/V VDD = 3.3V Transconductance(4) TA = +25ºC Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 2: Instruction cycle period (TCY) equals two times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “max.” cycle time limit is “DC” (no clock) for all devices. 3: Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin. 4: Data for this parameter is Preliminary. This parameter is characterized, but not tested in manufacturing. 2009-2012 Microchip Technology Inc. DS70593D-page 283
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic Min Typ(1) Max Units Conditions No. OS50 FPLLI PLL Voltage Controlled 0.8 — 8.0 MHz ECPLL, HSPLL, XTPLL Oscillator (VCO) Input modes Frequency Range(2) OS51 FSYS On-Chip VCO System 100 — 200 MHz — Frequency OS52 TLOCK PLL Start-up Time (Lock Time) 0.9 1.5 3.1 ms — OS53 DCLK CLKO Stability (Jitter) -3.0 0.5 3.0 % Measured over 100 ms period Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 2: These parameters are characterized by similarity but are not tested in manufacturing. This specification is based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time base or communication clocks used by peripherals use the formula: Peripheral Clock Jitter = DCLK / √(FOSC/Peripheral bit rate clock) Example Only: Fosc = 80 MHz, DCLK = 3%, SPI bit rate clock, (i.e. SCK), is 5 MHz SPI SCK Jitter = [ DCLK / √(80 MHz/5 MHz)] = [3%/ √16] = [3% / 4] = 0.75% TABLE 25-18: AC CHARACTERISTICS: INTERNAL FRC ACCURACY Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Characteristic Min Typ Max Units Conditions No. Internal FRC Accuracy @ FRC Frequency = 7.37 MHz(1) F20a FRC -2 — +2 % -40°C TA +85°C VDD = 3.0-3.6V F20b FRC -5 — +5 % -40°C TA +125°C VDD = 3.0-3.6V Note 1: Frequency calibrated at 25°C and 3.3V. TUN bits can be used to compensate for temperature drift. TABLE 25-19: INTERNAL LPRC ACCURACY Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Characteristic Min Typ Max Units Conditions No. LPRC @ 32.768 kHz(1) F21a LPRC -30 — +30 % -40°C TA +85°C — F21b LPRC -35 — +35 % -40°C TA +125°C — Note 1: Change of LPRC frequency as VDD changes. DS70593D-page 284 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-3: CLKO AND I/O TIMING CHARACTERISTICS I/O Pin (Input) DI35 DI40 I/O Pin Old Value New Value (Output) DO31 DO32 Note: Refer to Figure25-1 for load conditions. TABLE 25-20: I/O TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic Min Typ(1) Max Units Conditions No. DO31 TIOR Port Output Rise Time — 10 25 ns — DO32 TIOF Port Output Fall Time — 10 25 ns — DI35 TINP INTx Pin High or Low Time (input) 20 — — ns — DI40 TRBP CNx High or Low Time (input) 2 — — TCY — Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 2009-2012 Microchip Technology Inc. DS70593D-page 285
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING CHARACTERISTICS VDD SY12 MCLR Internal SY10 POR SY11 PWRT Time-out SY30 OSC Time-out Internal Reset Watchdog Timer Reset SY20 SY13 SY13 I/O Pins SY35 FSCM Delay Note: Refer to Figure25-1 for load conditions. DS70593D-page 286 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A T A B LE 25-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ(2) Max Units Conditions No. SY10 TMCL MCLR Pulse-Width (low) 2 — — s -40°C to +85°C SY11 TPWRT Power-up Timer Period — 2 — ms -40°C to +85°C — 4 — User programmable — 8 — — 16 — — 32 — — 64 — — 128 — SY12 TPOR Power-on Reset Delay 3 10 30 s -40°C to +85°C SY13 TIOZ I/O High-Impedance from 0.68 0.72 1.2 s — MCLR Low or Watchdog Timer Reset SY20 TWDT1 Watchdog Timer — — — — See Section22.4 “Watchdog Time-out Period Timer (WDT)” and LPRC specification F21 (Table25-19) SY30 TOST Oscillator Start-up Timer — 1024TOSC — — TOSC = OSC1 period Period SY35 TFSCM Fail-Safe Clock Monitor — 500 900 s -40°C to +85°C Delay Note 1: These parameters are characterized but not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 2009-2012 Microchip Technology Inc. DS70593D-page 287
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-5: TIMER1, 2, 3, 4, 5, 6, 7, 8 AND 9 EXTERNAL CLOCK TIMING CHARACTERISTICS TxCK Tx10 Tx11 Tx15 Tx20 OS60 TMRx Note: Refer to Figure25-1 for load conditions. TABLE 25-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic Min Typ Max Units Conditions No. TA10 TTXH TxCK High Time Synchronous, TCY + 20 — — ns Must also meet no prescaler parameter TA15 Synchronous, (TCY + 20)/N — — ns with prescaler Asynchronous 20 — — ns TA11 TTXL TxCK Low Time Synchronous, (TCY + 20)/N — — ns Must also meet no prescaler parameter TA15 Synchronous, 20 — — ns N = prescale with prescaler value Asynchronous 20 — — ns (1,8,64,256) TA15 TTXP TxCK Input Synchronous, 2TCY + 40 — — ns — Period no prescaler Synchronous, Greater of — — — N = prescale with prescaler 40 ns or value (2TCY + 40)/N (1, 8, 64, 256) Asynchronous 40 — — ns — OS60 Ft1 SOSC1/T1CK Oscillator Input DC — 50 kHz — frequency Range (oscillator enabled by setting TCS bit (T1CON<1>)) TA20 TCKEXTMRL Delay from External TxCK 0.75TCY+40 — 1.75TCY+40 ns — Clock Edge to Timer Increment Note 1: Timer1 is a Type A. DS70593D-page 288 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A T ABLE 25-23: TIMER2, TIMER4, TIMER6 AND TIMER8 EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ Max Units Conditions No. TB10 TtxH TxCK High Synchronous Greater of — — ns Must also meet Time mode 20 or parameter TB15 (TCY + 20)/N N = prescale value (1, 8, 64, 256) TB11 TtxL TxCK Low Synchronous Greater of: — — ns Must also meet Time mode 20 or parameter TB15 (TCY + 20)/N N = prescale value (1, 8, 64, 256) TB15 TtxP TxCK Input Synchronous Greater of: — — ns N = prescale Period mode 40 or value (2 TCY + 40)/N (1, 8, 64, 256) TB20 TCKEXTMRL Delay from External TxCK 0.75 TCY + 40 — 1.75 TCY + 40 ns — Clock Edge to Timer Incre- ment Note 1: These parameters are characterized, but are not tested in manufacturing. TABLE 25-24: TIMER3, TIMER5, TIMER7 AND TIMER9 EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ Max Units Conditions No. TC10 TtxH TxCK High Synchronous TCY + 20 — — ns Must also meet Time parameter TC15 TC11 TtxL TxCK Low Synchronous TCY + 20 — — ns Must also meet Time parameter TC15 TC15 TtxP TxCK Input Synchronous, 2TCY + 40 — — ns N = prescale Period with prescaler value (1, 8, 64, 256) TC20 TCKEXTMRL Delay from External TxCK 0.75 TCY + 40 — 1.75 TCY + 40 ns — Clock Edge to Timer Incre- ment Note 1: These parameters are characterized, but are not tested in manufacturing. 2009-2012 Microchip Technology Inc. DS70593D-page 289
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-6: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS ICx IC10 IC11 IC15 Note: Refer to Figure25-1 for load conditions. TABLE 25-25: INPUT CAPTURE TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Max Units Conditions No. IC10 TccL ICx Input Low Time No Prescaler 0.5 TCY + 20 — ns — With Prescaler 10 — ns IC11 TccH ICx Input High Time No Prescaler 0.5 TCY + 20 — ns — With Prescaler 10 — ns IC15 TccP ICx Input Period (TCY + 40)/N — ns N = prescale value (1, 4, 16) Note 1: These parameters are characterized but not tested in manufacturing. FIGURE 25-7: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS OCx (Output Compare or PWM Mode) OC11 OC10 Note: Refer to Figure25-1 for load conditions. TABLE 25-26: OUTPUT COMPARE MODULE TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ Max Units Conditions No. OC10 TccF OCx Output Fall Time — — — ns See parameter D032 OC11 TccR OCx Output Rise Time — — — ns See parameter D031 Note 1: These parameters are characterized but not tested in manufacturing. DS70593D-page 290 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-8: OC/PWM MODULE TIMING CHARACTERISTICS OC20 OCFA/OCFB OC15 OCx Active Tri-state TABLE 25-27: SIMPLE OC/PWM MODE TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ Max Units Conditions No. OC15 TFD Fault Input to PWM I/O — — TCY+20 ns — Change OC20 TFLT Fault Input Pulse-Width TCY+20 — — ns — Note 1: These parameters are characterized but not tested in manufacturing. 2009-2012 Microchip Technology Inc. DS70593D-page 291
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-28: SPIx MAXIMUM DATA/CLOCK RATE SUMMARY Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Master Master Slave Maximum Transmit Only Transmit/Receive Transmit/Receive CKE CKP SMP Data Rate (Half-Duplex) (Full-Duplex) (Full-Duplex) 15 MHz Table25-29 — — 0,1 0,1 0,1 10 MHz — Table25-30 — 1 0,1 1 10 MHz — Table25-31 — 0 0,1 1 15 MHz — — Table25-32 1 0 0 11 MHz — — Table25-33 1 1 0 15 MHz — — Table25-34 0 1 0 11 MHz — — Table25-35 0 0 0 FIGURE 25-9: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 0) TIMING CHARACTERISTICS SCKx (CKP = 0) SP10 SP21 SP20 SCKx (CKP = 1) SP35 SP20 SP21 SDOx MSb Bit 14 - - - - - -1 LSb SP30, SP31 SP30, SP31 Note: Refer to Figure25-1 for load conditions. DS70593D-page 292 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-10: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 1) TIMING CHARACTERISTICS SP36 SCKx (CKP = 0) SP10 SP21 SP20 SCKx (CKP = 1) SP35 SP20 SP21 SDOx MSb Bit 14 - - - - - -1 LSb SP30, SP31 Note: Refer to Figure25-1 for load conditions. TABLE 25-29: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ(2) Max Units Conditions No. SP10 TscP Maximum SCK Frequency — — 15 MHz See Note 3 SP20 TscF SCKx Output Fall Time — — — ns See parameter DO32 and Note 4 SP21 TscR SCKx Output Rise Time — — — ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after — 6 20 ns — TscL2doV SCKx Edge SP36 TdiV2scH, SDOx Data Output Setup to 30 — — ns — TdiV2scL First SCKx Edge Note 1: These parameters are characterized, but are not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 3: The minimum clock period for SCKx is 66.7 ns. Therefore, the clock generated in Master mode must not violate this specification. 4: Assumes 50 pF load on all SPIx pins. 2009-2012 Microchip Technology Inc. DS70593D-page 293
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-11: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = X, SMP = 1) TIMING CHARACTERISTICS SP36 SCKx (CKP = 0) SP10 SP21 SP20 SCKx (CKP = 1) SP35 SP20 SP21 SDOx MSb Bit 14 - - - - - -1 LSb SP30, SP31 SP40 SDIx MSb In Bit 14 - - - -1 LSb In SP41 Note: Refer to Figure25-1 for load conditions. TABLE 25-30: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ(2) Max Units Conditions No. SP10 TscP Maximum SCK Frequency — — 10 MHz See Note 3 SP20 TscF SCKx Output Fall Time — — — ns See parameter DO32 and Note 4 SP21 TscR SCKx Output Rise Time — — — ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after — 6 20 ns — TscL2doV SCKx Edge SP36 TdoV2sc, SDOx Data Output Setup to 30 — — ns — TdoV2scL First SCKx Edge SP40 TdiV2scH, Setup Time of SDIx Data 30 — — ns — TdiV2scL Input to SCKx Edge SP41 TscH2diL, Hold Time of SDIx Data Input 30 — — ns — TscL2diL to SCKx Edge Note 1: These parameters are characterized, but are not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 3: The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this specification. 4: Assumes 50 pF load on all SPIx pins. DS70593D-page 294 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-12: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = X, SMP = 1) TIMING CHARACTERISTICS SCKx (CKP = 0) SP10 SP21 SP20 SCKx (CKP = 1) SP35 SP20 SP21 SDOx MSb Bit 14 - - - - - -1 LSb SP30, SP31 SP30, SP31 SDIx MSb In Bit 14 - - - -1 LSb In SP40 SP41 Note: Refer to Figure25-1 for load conditions. TABLE 25-31: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING REQUIREMENTS Standard Operating Conditions: 2.4V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ(2) Max Units Conditions No. SP10 TscP Maximum SCK Frequency — — 10 MHz -40ºC to +125ºC and see Note 3 SP20 TscF SCKx Output Fall Time — — — ns See parameter DO32 and Note 4 SP21 TscR SCKx Output Rise Time — — — ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after — 6 20 ns — TscL2doV SCKx Edge SP36 TdoV2scH, SDOx Data Output Setup to 30 — — ns — TdoV2scL First SCKx Edge SP40 TdiV2scH, Setup Time of SDIx Data 30 — — ns — TdiV2scL Input to SCKx Edge SP41 TscH2diL, Hold Time of SDIx Data Input 30 — — ns — TscL2diL to SCKx Edge Note 1: These parameters are characterized, but are not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 3: The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this specification. 4: Assumes 50 pF load on all SPIx pins. 2009-2012 Microchip Technology Inc. DS70593D-page 295
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-13: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING CHARACTERISTICS SP60 SSx SP52 SP50 SCKx (CKP = 0) SP70 SP73 SP72 SCKx (CKP = 1) SP35 SP72 SP73 SDOx MSb Bit 14 - - - - - -1 LSb SP30,SP31 SP51 SSDDIIx MSb In Bit 14 - - - -1 LSb In SP41 SP40 Note: Refer to Figure25-1 for load conditions. DS70593D-page 296 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-32: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.4V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ(2) Max Units Conditions No. SP70 TscP Maximum SCK Input Frequency — — 15 MHz See Note 3 SP72 TscF SCKx Input Fall Time — — — ns See parameter DO32 and Note 4 SP73 TscR SCKx Input Rise Time — — — ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after — 6 20 ns — TscL2doV SCKx Edge SP36 TdoV2scH, SDOx Data Output Setup to 30 — — ns — TdoV2scL First SCKx Edge SP40 TdiV2scH, Setup Time of SDIx Data Input 30 — — ns — TdiV2scL to SCKx Edge SP41 TscH2diL, Hold Time of SDIx Data Input 30 — — ns — TscL2diL to SCKx Edge SP50 TssL2scH, SSx to SCKx or SCKx Input 120 — — ns — TssL2scL SP51 TssH2doZ SSx to SDOx Output 10 — 50 ns — High-Impedance(4) SP52 TscH2ssH SSx after SCKx Edge 1.5 TCY + 40 — — ns See Note 4 TscL2ssH SP60 TssL2doV SDOx Data Output Valid after — — 50 ns — SSx Edge Note 1: These parameters are characterized, but are not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 3: The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must not violate this specificiation. 4: Assumes 50 pF load on all SPIx pins. 2009-2012 Microchip Technology Inc. DS70593D-page 297
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-14: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING CHARACTERISTICS SP60 SSx SP52 SP50 SCKx (CKP = 0) SP70 SP73 SP72 SCKx (CKP = 1) SP35 SP72 SP73 SP52 SDOx MSb Bit 14 - - - - - -1 LSb SP30,SP31 SP51 SSDDIIx MSb In Bit 14 - - - -1 LSb In SP41 SP40 Note: Refer to Figure25-1 for load conditions. DS70593D-page 298 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-33: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.4V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ(2) Max Units Conditions No. SP70 TscP Maximum SCK Input Frequency — — 11 MHz See Note 3 SP72 TscF SCKx Input Fall Time — — — ns See parameter DO32 and Note 4 SP73 TscR SCKx Input Rise Time — — — ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after — 6 20 ns — TscL2doV SCKx Edge SP36 TdoV2scH, SDOx Data Output Setup to 30 — — ns — TdoV2scL First SCKx Edge SP40 TdiV2scH, Setup Time of SDIx Data Input 30 — — ns — TdiV2scL to SCKx Edge SP41 TscH2diL, Hold Time of SDIx Data Input 30 — — ns — TscL2diL to SCKx Edge SP50 TssL2scH, SSx to SCKx or SCKx Input 120 — — ns — TssL2scL SP51 TssH2doZ SSx to SDOx Output 10 — 50 ns — High-Impedance(4) SP52 TscH2ssH SSx after SCKx Edge 1.5 TCY + 40 — — ns See Note 4 TscL2ssH SP60 TssL2doV SDOx Data Output Valid after — — 50 ns — SSx Edge Note 1: These parameters are characterized, but are not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 3: The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not violate this specificiation. 4: Assumes 50 pF load on all SPIx pins. 2009-2012 Microchip Technology Inc. DS70593D-page 299
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-15: SPIx SLAVE MODE (FULL-DUPLEX CKE = 0, CKP = 1, SMP = 0) TIMING CHARACTERISTICS SSX SP50 SP52 SCKX (CKP = 0) SP70 SP73 SP72 SCKX (CKP = 1) SP72 SP73 SP35 SDOX MSb Bit 14 - - - - - -1 LSb SP30,SP31 SP51 SDIX MSb In Bit 14 - - - -1 LSb In SP41 SP40 Note: Refer to Figure25-1 for load conditions. DS70593D-page 300 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-34: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.4V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ(2) Max Units Conditions No. SP70 TscP Maximum SCK Input Frequency — — 15 MHz See Note 3 SP72 TscF SCKx Input Fall Time — — — ns See parameter DO32 and Note 4 SP73 TscR SCKx Input Rise Time — — — ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after — 6 20 ns — TscL2doV SCKx Edge SP36 TdoV2scH, SDOx Data Output Setup to 30 — — ns — TdoV2scL First SCKx Edge SP40 TdiV2scH, Setup Time of SDIx Data Input 30 — — ns — TdiV2scL to SCKx Edge SP41 TscH2diL, Hold Time of SDIx Data Input 30 — — ns — TscL2diL to SCKx Edge SP50 TssL2scH, SSx to SCKx or SCKx Input 120 — — ns — TssL2scL SP51 TssH2doZ SSx to SDOx Output 10 — 50 ns — High-Impedance(4) SP52 TscH2ssH SSx after SCKx Edge 1.5 TCY + 40 — — ns See Note 4 TscL2ssH Note 1: These parameters are characterized, but are not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 3: The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must not violate this specificiation. 4: Assumes 50 pF load on all SPIx pins. 2009-2012 Microchip Technology Inc. DS70593D-page 301
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-16: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING CHARACTERISTICS SSX SP50 SP52 SCKX (CKP = 0) SP70 SP73 SP72 SCKX (CKP = 1) SP72 SP73 SP35 SDOX MSb Bit 14 - - - - - -1 LSb SP30,SP31 SP51 SDIX MSb In Bit 14 - - - -1 LSb In SP41 SP40 Note: Refer to Figure25-1 for load conditions. DS70593D-page 302 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-35: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.4V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ(2) Max Units Conditions No. SP70 TscP Maximum SCK Input Frequency — — 11 MHz See Note 3 SP72 TscF SCKx Input Fall Time — — — ns See parameter DO32 and Note 4 SP73 TscR SCKx Input Rise Time — — — ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after — 6 20 ns — TscL2doV SCKx Edge SP36 TdoV2scH, SDOx Data Output Setup to 30 — — ns — TdoV2scL First SCKx Edge SP40 TdiV2scH, Setup Time of SDIx Data Input 30 — — ns — TdiV2scL to SCKx Edge SP41 TscH2diL, Hold Time of SDIx Data Input 30 — — ns — TscL2diL to SCKx Edge SP50 TssL2scH, SSx to SCKx or SCKx Input 120 — — ns — TssL2scL SP51 TssH2doZ SSx to SDOx Output 10 — 50 ns — High-Impedance(4) SP52 TscH2ssH SSx after SCKx Edge 1.5 TCY + 40 — — ns See Note 4 TscL2ssH Note 1: These parameters are characterized, but are not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. 3: The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not violate this specificiation. 4: Assumes 50 pF load on all SPIx pins. 2009-2012 Microchip Technology Inc. DS70593D-page 303
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-17: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE) SCLx IM31 IM34 IM30 IM33 SDAx Start Stop Condition Condition Note: Refer to Figure25-1 for load conditions. FIGURE 25-18: I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE) IM20 IM11 IM21 IM10 SCLx IM11 IM26 IM10 IM25 IM33 SDAx In IM40 IM40 IM45 SDAx Out Note: Refer to Figure25-1 for load conditions. DS70593D-page 304 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A T ABLE 25-36: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C -40°CTA +125°C for Extended Param Symbol Characteristic Min(1) Max Units Conditions No. IM10 TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1) — s — 400 kHz mode TCY/2 (BRG + 1) — s — 1 MHz mode(2) TCY/2 (BRG + 1) — s — IM11 THI:SCL Clock High Time 100 kHz mode TCY/2 (BRG + 1) — s — 400 kHz mode TCY/2 (BRG + 1) — s — 1 MHz mode(2) TCY/2 (BRG + 1) — s — IM20 TF:SCL SDAx and SCLx 100 kHz mode — 300 ns CB is specified to be Fall Time 400 kHz mode 20 + 0.1 CB 300 ns from 10 to 400 pF 1 MHz mode(2) — 100 ns IM21 TR:SCL SDAx and SCLx 100 kHz mode — 1000 ns CB is specified to be Rise Time 400 kHz mode 20 + 0.1 CB 300 ns from 10 to 400 pF 1 MHz mode(2) — 300 ns IM25 TSU:DAT Data Input 100 kHz mode 250 — ns — Setup Time 400 kHz mode 100 — ns 1 MHz mode(2) 40 — ns IM26 THD:DAT Data Input 100 kHz mode 0 — s — Hold Time 400 kHz mode 0 0.9 s 1 MHz mode(2) 0.2 — s IM30 TSU:STA Start Condition 100 kHz mode TCY/2 (BRG + 1) — s Only relevant for Setup Time 400 kHz mode TCY/2 (BRG + 1) — s Repeated Start 1 MHz mode(2) TCY/2 (BRG + 1) — s condition IM31 THD:STA Start Condition 100 kHz mode TCY/2 (BRG + 1) — s After this period the Hold Time 400 kHz mode TCY/2 (BRG + 1) — s first clock pulse is 1 MHz mode(2) TCY/2 (BRG + 1) — s generated IM33 TSU:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) — s — Setup Time 400 kHz mode TCY/2 (BRG + 1) — s 1 MHz mode(2) TCY/2 (BRG + 1) — s IM34 THD:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) — ns — Hold Time 400 kHz mode TCY/2 (BRG + 1) — ns 1 MHz mode(2) TCY/2 (BRG + 1) — ns IM40 TAA:SCL Output Valid 100 kHz mode — 3500 ns — From Clock 400 kHz mode — 1000 ns — 1 MHz mode(2) — 400 ns — Note 1: BRG is the value of the I2C Baud Rate Generator. Refer to Section 19. “Inter-Integrated Circuit™ (I2C™)” (DS70195) in the “dsPIC33F/PIC24H Family Reference Manual”. 2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). 3: Typical value for this parameter is 130 ns. 2009-2012 Microchip Technology Inc. DS70593D-page 305
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-36: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C -40°CTA +125°C for Extended Param Symbol Characteristic Min(1) Max Units Conditions No. IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — s Time the bus must be 400 kHz mode 1.3 — s free before a new 1 MHz mode(2) 0.5 — s transmission can start IM50 CB Bus Capacitive Loading — 400 pF — IM51 TPGD Pulse Gobbler Delay 65 390 ns See Note 3 Note 1: BRG is the value of the I2C Baud Rate Generator. Refer to Section 19. “Inter-Integrated Circuit™ (I2C™)” (DS70195) in the “dsPIC33F/PIC24H Family Reference Manual”. 2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). 3: Typical value for this parameter is 130 ns. FIGURE 25-19: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) SCLx IS31 IS34 IS30 IS33 SDAx Start Stop Condition Condition FIGURE 25-20: I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 IS11 IS21 IS10 SCLx IS30 IS26 IS31 IS25 IS33 SDAx In IS40 IS40 IS45 SDAx Out DS70593D-page 306 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-37: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic Min Max Units Conditions No. IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 — s Device must operate at a minimum of 1.5 MHz 400 kHz mode 1.3 — s Device must operate at a minimum of 10 MHz 1 MHz mode(1) 0.5 — s — IS11 THI:SCL Clock High Time 100 kHz mode 4.0 — s Device must operate at a minimum of 1.5 MHz 400 kHz mode 0.6 — s Device must operate at a minimum of 10 MHz 1 MHz mode(1) 0.5 — s — IS20 TF:SCL SDAx and SCLx 100 kHz mode — 300 ns CB is specified to be from Fall Time 400 kHz mode 20 + 0.1 CB 300 ns 10 to 400 pF 1 MHz mode(1) — 100 ns IS21 TR:SCL SDAx and SCLx 100 kHz mode — 1000 ns CB is specified to be from Rise Time 400 kHz mode 20 + 0.1 CB 300 ns 10 to 400 pF 1 MHz mode(1) — 300 ns IS25 TSU:DAT Data Input 100 kHz mode 250 — ns — Setup Time 400 kHz mode 100 — ns 1 MHz mode(1) 100 — ns IS26 THD:DAT Data Input 100 kHz mode 0 — s — Hold Time 400 kHz mode 0 0.9 s 1 MHz mode(1) 0 0.3 s IS30 TSU:STA Start Condition 100 kHz mode 4.7 — s Only relevant for Repeated Setup Time 400 kHz mode 0.6 — s Start condition 1 MHz mode(1) 0.25 — s IS31 THD:STA Start Condition 100 kHz mode 4.0 — s After this period, the first Hold Time 400 kHz mode 0.6 — s clock pulse is generated 1 MHz mode(1) 0.25 — s IS33 TSU:STO Stop Condition 100 kHz mode 4.7 — s — Setup Time 400 kHz mode 0.6 — s 1 MHz mode(1) 0.6 — s IS34 THD:STO Stop Condition 100 kHz mode 4000 — ns — Hold Time 400 kHz mode 600 — ns 1 MHz mode(1) 250 ns IS40 TAA:SCL Output Valid 100 kHz mode 0 3500 ns — From Clock 400 kHz mode 0 1000 ns 1 MHz mode(1) 0 350 ns IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — s Time the bus must be free 400 kHz mode 1.3 — s before a new transmission 1 MHz mode(1) 0.5 — s can start IS50 CB Bus Capacitive Loading — 400 pF — Note 1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). 2009-2012 Microchip Technology Inc. DS70593D-page 307
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-21: DCI MODULE (MULTI-CHANNEL, I2S MODES) TIMING CHARACTERISTICS CSCK (SCKE = 0) CS11 CS10 CS21 CS20 CSCK (SCKE = 1) CS20 CS21 COFS CS55CS56 CS35 CS51 CS50 70 High-Z MSb LSb High-Z CSDO CS30 CS31 CSDI MSb In LSb In CS40 CS41 Note: Refer to Figure25-1 for load conditions. DS70593D-page 308 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A T ABLE 25-38: DCI MODULE (MULTI-CHANNEL, I2S MODES) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ(2) Max Units Conditions No. CS10 TCSCKL CSCK Input Low Time TCY/2 + 20 — — ns — (CSCK pin is an input) CSCK Output Low Time(3) 30 — — ns — (CSCK pin is an output) CS11 TCSCKH CSCK Input High Time TCY/2 + 20 — — ns — (CSCK pin is an input) CSCK Output High Time(3) 30 — — ns — (CSCK pin is an output) CS20 TCSCKF CSCK Output Fall Time(4) — 10 25 ns — (CSCK pin is an output) CS21 TCSCKR CSCK Output Rise Time(4) — 10 25 ns — (CSCK pin is an output) CS30 TCSDOF CSDO Data Output Fall Time(4) — 10 25 ns — CS31 TCSDOR CSDO Data Output Rise Time(4) — 10 25 ns — CS35 TDV Clock Edge to CSDO Data Valid — — 10 ns — CS36 TDIV Clock Edge to CSDO Tri-Stated 10 — 20 ns — CS40 TCSDI Setup Time of CSDI Data Input 20 — — ns — to CSCK Edge (CSCK pin is input or output) CS41 THCSDI Hold Time of CSDI Data Input to 20 — — ns — CSCK Edge (CSCK pin is input or output) CS50 TCOFSF COFS Fall Time — 10 25 ns Note 1 (COFS pin is output) CS51 TCOFSR COFS Rise Time — 10 25 ns Note 1 (COFS pin is output) CS55 TSCOFS Setup Time of COFS Data Input 20 — — ns — to CSCK Edge (COFS pin is input) CS56 THCOFS Hold Time of COFS Data Input to 20 — — ns — CSCK Edge (COFS pin is input) Note 1: These parameters are characterized but not tested in manufacturing. 2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. 3: The minimum clock period for CSCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. 4: Assumes 50 pF load on all DCI pins. 2009-2012 Microchip Technology Inc. DS70593D-page 309
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-22: DCI MODULE (AC-LINK MODE) TIMING CHARACTERISTICS BIT_CLK (CSCK) CS61 CS60 CS62 CS21 CS20 CS71 CS70 CS72 SYNC (COFS) CS76 CS75 CS80 LSb MSb LSb SDOx (CSDO) CS76 CS75 SDIx MSb In (CSDI) CS65 CS66 TABLE 25-39: DCI MODULE (AC-LINK MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C -40°CTA +125°C for Extended Param Symbol Characteristic(1,2) Min Typ(3) Max Units Conditions No. CS60 TBCLKL BIT_CLK Low Time 36 40.7 45 ns — CS61 TBCLKH BIT_CLK High Time 36 40.7 45 ns — CS62 TBCLK BIT_CLK Period — 81.4 — ns Bit clock is input CS65 TSACL Input Setup Time to — — 10 ns — Falling Edge of BIT_CLK CS66 THACL Input Hold Time from — — 10 ns — Falling Edge of BIT_CLK CS70 TSYNCLO SYNC Data Output Low Time — 19.5 — s Note 1 CS71 TSYNCHI SYNC Data Output High Time — 1.3 — s Note 1 CS72 TSYNC SYNC Data Output Period — 20.8 — s Note 1 CS75 TRACL Rise Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V CS76 TFACL Fall Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V CS77 TRACL Rise Time, SYNC, SDATA_OUT — — 30 ns CLOAD = 50 pF, VDD = 3V CS78 TFACL Fall Time, SYNC, SDATA_OUT — — 30 ns CLOAD = 50 pF, VDD = 3V CS80 TOVDACL Output Valid Delay from Rising — — 15 ns — Edge of BIT_CLK Note 1: These parameters are characterized but not tested in manufacturing. 2: These values assume BIT_CLK frequency is 12.288 MHz. 3: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. DS70593D-page 310 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-23: CAN MODULE I/O TIMING CHARACTERISTICS CiTx Pin Old Value New Value (output) CA10 CA11 CiRx Pin (input) CA20 TABLE 25-40: ECAN™ MODULE I/O TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C -40°CTA +125°C for Extended Param Symbol Characteristic(1) Min Typ Max Units Conditions No. CA10 TioF Port Output Fall Time — — — ns See parameter D032 CA11 TioR Port Output Rise Time — — — ns See parameter D031 CA20 Tcwf Pulse Width to Trigger 120 — — ns — CAN Wake-up Filter Note 1: These parameters are characterized but not tested in manufacturing. 2009-2012 Microchip Technology Inc. DS70593D-page 311
dsPIC33FJXXXGPX06A/X08A/X10A T ABLE 25-41: ADC MODULE SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°C TA +125°C for Extended Param Symbol Characteristic Min. Typ Max. Units Conditions No. Device Supply AD01 AVDD Module VDD Supply Greater of — Lesser of V — VDD - 0.3 VDD + 0.3 or 3.0 or 3.6 AD02 AVSS Module VSS Supply VSS - 0.3 — VSS + 0.3 V — Reference Inputs AD05 VREFH Reference Voltage High AVSS + 2.5 — AVDD V AD05a 3.0 — 3.6 V VREFH = AVDD VREFL = AVSS = 0 AD06 VREFL Reference Voltage Low AVSS — AVDD - 2.5 V AD06a 0 — 0 V VREFH = AVDD VREFL = AVSS = 0 AD07 VREF Absolute Reference 2.5 — 3.6 V VREF = VREFH - VREFL Voltage AD08 IREF Current Drain — — 1 A ADC off AD08a IAD Operating Current — 7.0 9.0 mA 10-bit ADC mode, See Note 1 — 2.7 3.2 mA 12-bit ADC mode, See Note 1 Analog Input AD12 VINH Input Voltage Range VINL — VREFH V This voltage reflects Sample VINH and Hold Channels 0, 1, 2, and 3 (CH0-CH3), positive input. AD13 VINL Input Voltage Range VREFL — AVSS + 1V V This voltage reflects Sample VINL and Hold Channels 0, 1, 2, and 3 (CH0-CH3), negative input. AD17 RIN Recommended Imped- — — 200 10-bit ance of Analog Voltage 200 12-bit Source Note 1: These parameters are not characterized or tested in manufacturing. DS70593D-page 312 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-42: ADC MODULE SPECIFICATIONS (12-BIT MODE)(2) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°C TA +125°C for Extended Param Symbol Characteristic Min. Typ Max. Units Conditions No. ADC Accuracy (12-bit Mode) - Measurements with external VREF+/VREF- AD20a Nr Resolution 12 data bits bits AD21a INL Integral Nonlinearity -2 — +2 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD22a DNL Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD23a GERR Gain Error — 3.4 10 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24a EOFF Offset Error — 0.9 5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD25a — Monotonicity(1) — — — — Guaranteed ADC Accuracy (12-bit Mode) - Measurements with internal VREF+/VREF- AD20a Nr Resolution 12 data bits bits AD21a INL Integral Nonlinearity -2 — +2 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD22a DNL Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD23a GERR Gain Error — 10.5 20 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24a EOFF Offset Error — 3.8 10 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD25a — Monotonicity(1) — — — — Guaranteed Dynamic Performance (12-bit Mode) AD30a THD Total Harmonic Distortion — — -75 dB — AD31a SINAD Signal to Noise and 68.5 69.5 — dB — Distortion AD32a SFDR Spurious Free Dynamic 80 — — dB — Range AD33a FNYQ Input Signal Band-Width — — 250 kHz — AD34a ENOB Effective Number of Bits 11.09 11.3 — bits — Note 1: The ADC conversion result never decreases with an increase in the input voltage, and has no missing codes. 2: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. 2009-2012 Microchip Technology Inc. DS70593D-page 313
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-43: ADC MODULE SPECIFICATIONS (10-BIT MODE)(2) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°C TA +125°C for Extended Param Symbol Characteristic Min. Typ Max. Units Conditions No. ADC Accuracy (10-bit Mode) - Measurements with external VREF+/VREF- AD20b Nr Resolution 10 data bits bits AD21b INL Integral Nonlinearity -1.5 — +1.5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD22b DNL Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD23b GERR Gain Error — 3 6 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24b EOFF Offset Error — 2 5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD25b — Monotonicity(1) — — — — Guaranteed ADC Accuracy (10-bit Mode) - Measurements with internal VREF+/VREF- AD20b Nr Resolution 10 data bits bits AD21b INL Integral Nonlinearity -1 — +1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD22b DNL Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD23b GERR Gain Error — 7 15 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24b EOFF Offset Error — 3 7 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD25b — Monotonicity(1) — — — — Guaranteed Dynamic Performance (10-bit Mode) AD30b THD Total Harmonic Distortion — — -64 dB — AD31b SINAD Signal to Noise and 57 58.5 — dB — Distortion AD32b SFDR Spurious Free Dynamic 72 — — dB — Range AD33b FNYQ Input Signal Bandwidth — — 550 kHz — AD34b ENOB Effective Number of Bits 9.16 9.4 — bits — Note 1: The ADC conversion result never decreases with an increase in the input voltage, and has no missing codes. 2: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. DS70593D-page 314 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-24: ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS (ASAM = 0, SSRC<2:0> = 000) AD50 ADCLK Instruction Execution Set SAMP Clear SAMP SAMP ch0_dischrg ch0_samp eoc AD61 AD60 TSAMP AD55 CONV ADxIF Buffer(0) 1 2 3 4 5 6 7 8 9 1 – Software sets ADxCON. SAMP to start sampling. 5 – Convert bit 11. 2 – Sampling starts after discharge period. TSAMP is described 6 – Convert bit 10. in Section 16. “Analog-to-Digital Converter (ADC) with DMA” (DS70183) in the “dsPIC33F/PIC24H Family Reference Manual”. 7 – Convert bit 1. 3 – Software clears ADxCON. SAMP to start conversion. 8 – Convert bit 0. 4 – Sampling ends, conversion sequence starts. 9 – One TAD for end of conversion. 2009-2012 Microchip Technology Inc. DS70593D-page 315
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-44: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°C TA +125°C for Extended Param Symbol Characteristic Min. Typ(1) Max. Units Conditions No. Clock Parameters AD50a TAD ADC Clock Period 117.6 — — ns — AD51a tRC ADC Internal RC Oscillator — 250 — ns — Period Conversion Rate AD55a tCONV Conversion Time — 14 TAD ns — AD56a FCNV Throughput Rate — — 500 ksps — AD57a tSAMP Sample Time 3 TAD — — — — Timing Parameters AD60a tPCS Conversion Start from Sample 2.0 TAD — 3.0 TAD — Auto-Convert Trigger Trigger(2) (SSRC<2:0> = 111) not selected AD61a tPSS Sample Start from Setting 2.0 TAD — 3.0 TAD — — Sample (SAMP) bit(2) AD62a tCSS Conversion Completion to — 0.5 TAD — — — Sample Start (ASAM = 1)(2) AD63a tDPU Time to Stabilize Analog Stage — — 20 s — from ADC Off to ADC On(2,3) Note 1: These parameters are characterized but not tested in manufacturing. 2: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. 3: tDPU is the time required for the ADC module to stabilize when it is turned on (AD1CON1<ADON> = 1). During this time, the ADC result is indeterminate. DS70593D-page 316 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-25: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000) AD50 ADCLK Instruction Execution Set SAMP Clear SAMP SAMP ch0_dischrg ch0_samp ch1_dischrg ch1_samp eoc AD61 AD60 TSAMP AD55 AD55 CONV ADxIF Buffer(0) Buffer(1) 1 2 3 4 5 6 7 8 5 6 7 8 1 – Software sets ADxCON. SAMP to start sampling. 2 – Sampling starts after discharge period. TSAMP is described in Section 16. “Analog-to-Digital Converter (ADC)” (DS70183) in the “dsPIC33F/PIC24H Family Reference Manual”. 3 – Software clears ADxCON. SAMP to start conversion. 4 – Sampling ends, conversion sequence starts. 5 – Convert bit 9. 6 – Convert bit 8. 7 – Convert bit 0. 8 – One TAD for end of conversion. 2009-2012 Microchip Technology Inc. DS70593D-page 317
dsPIC33FJXXXGPX06A/X08A/X10A FIGURE 25-26: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001) AD50 ADCLK Instruction Execution Set ADON SAMP ch0_dischrg ch0_samp ch1_dischrg ch1_samp eoc TSAMP TSAMP AD55 AD55 TCONV CONV ADxIF Buffer(0) Buffer(1) 1 2 3 4 5 6 7 3 4 5 6 8 3 4 1 – Software sets ADxCON. ADON to start AD operation. 5 – Convert bit 0. 2 – Sampling starts after discharge period. 6 – One TAD for end of conversion. TSAMP is described in Section 16. “Analog-to-Digital Converter (ADC)” (DS70183) in the “dsPIC33F/PIC24H Family Reference Manual”. 7 – Begin conversion of next channel. 3 – Convert bit 9. 8 – Sample for time specified by SAMC<4:0>. 4 – Convert bit 8. DS70593D-page 318 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 25-45: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°C TA +125°C for Extended Param Symbol Characteristic Min. Typ(1) Max. Units Conditions No. Clock Parameters AD50b TAD ADC Clock Period 76 — — ns — AD51b TRC ADC Internal RC Oscillator Period — 250 — ns — Conversion Rate AD55b TCONV Conversion Time — 12 TAD — — — AD56b FCNV Throughput Rate — — 1.1 Msps — AD57b TSAMP Sample Time 2 TAD — — — — Timing Parameters AD60b TPCS Conversion Start from Sample 2.0 TAD — 3.0 TAD — Auto-Convert Trigger Trigger(2) (SSRC<2:0> = 111) not selected AD61b TPSS Sample Start from Setting 2.0 TAD — 3.0 TAD — — Sample (SAMP) bit(2) AD62b TCSS Conversion Completion to — 0.5 TAD — — — Sample Start (ASAM = 1)(2) AD63b TDPU Time to Stabilize Analog Stage — — 20 s — from ADC Off to ADC On(2,3) Note 1: These parameters are characterized but not tested in manufacturing. 2: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. 3: TDPU is the time required for the ADC module to stabilize when it is turned on (AD1CON1<ADON> = 1). During this time, the ADC result is indeterminate. TABLE 25-46: DMA READ/WRITE TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +85°C for Industrial -40°CTA +125°C for Extended Param Characteristic Min. Typ Max. Units Conditions No. DM1a DMA Read/Write Cycle Time — — 2 TCY ns This characteristic applies to dsPIC33FJ256GPX06A/X08A/X10A devices only. DM1b DMA Read/Write Cycle Time — — 1 TCY ns This characteristic applies to all devices with the exception of the dsPIC33FJ256GPX06A/X08A/X10A. 2009-2012 Microchip Technology Inc. DS70593D-page 319
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 320 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 26.0 HIGH TEMPERATURE ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC33FJXXXGPX06A/X08A/X10A electrical characteristics for devices operating in an ambient temperature range of -40°C to +150°C. The specifications between -40°C to +150°C are identical to those shown in Section25.0 “Electrical Characteristics” for operation between -40°C to +125°C, with the exception of the parameters listed in this section. Parameters in this section begin with an H, which denotes High temperature. For example, parameter DC10 in Section25.0 “Electrical Characteristics” is the Industrial and Extended temperature equivalent of HDC10. Absolute maximum ratings for the dsPIC33FJXXXGPX06A/X08A/X10A high temperature devices are listed below. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings (See Note 1) Ambient temperature under bias(4).........................................................................................................-40°C to +150°C Storage temperature.............................................................................................................................. -65°C to +160°C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V Voltage on any pin that is not 5V tolerant with respect to VSS(5) ....................................................-0.3V to (VDD + 0.3V) Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(5) ....................................... -0.3V to (VDD + 0.3V) Voltage on any 5V tolerant pin with respect to VSS when VDD 3.0V(5) .................................................... -0.3V to 5.6V Voltage on VCAP with respect to VSS ...................................................................................................... 2.25V to 2.75V Maximum current out of VSS pin.............................................................................................................................60 mA Maximum current into VDD pin(2).............................................................................................................................60 mA Maximum junction temperature.............................................................................................................................+155°C Maximum current sourced/sunk by any 2x I/O pin(3)................................................................................................2 mA Maximum current sourced/sunk by any 4x I/O pin(3)................................................................................................4 mA Maximum current sourced/sunk by any 8x I/O pin(3)................................................................................................8 mA Maximum current sunk by all ports combined ........................................................................................................10 mA Maximum current sourced by all ports combined(2)................................................................................................10 mA Note1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods can affect device reliability. 2: Maximum allowable current is a function of device maximum power dissipation (see Table26-2). 3: Unlike devices at 125°C and below, the specifications in this section also apply to the CLKOUT, VREF+, VREF-, SCLx, SDAx, PGECx, and PGEDx pins. 4: AEC-Q100 reliability testing for devices intended to operate at 150°C is 1,000 hours. Any design in which the total operating time from 125°C to 150°C will be greater than 1,000 hours is not warranted without prior written approval from Microchip Technology Inc. 5: Refer to the “Pin Diagrams” section for 5V tolerant pins. 2009-2012 Microchip Technology Inc. DS70593D-page 321
dsPIC33FJXXXGPX06A/X08A/X10A 26.1 High Temperature DC Characteristics TABLE 26-1: OPERATING MIPS VS. VOLTAGE Max MIPS VDD Range Temperature Range Characteristic (in Volts) (in °C) dsPIC33FJXXXGPX06A/X08A/X10A HDC5 VBOR to 3.6V(1) -40°C to +150°C 20 Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table25-11 for the minimum and maximum BOR values. TABLE 26-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit High Temperature Devices Operating Junction Temperature Range TJ -40 — +155 °C Operating Ambient Temperature Range TA -40 — +150 °C Power Dissipation: Internal chip power dissipation: PINT = VDD x (IDD - IOH) PD PINT + PI/O W I/O Pin Power Dissipation: I/O = ({VDD - VOH} x IOH) + (VOL x IOL) Maximum Allowed Power Dissipation PDMAX (TJ - TA)/JA W TABLE 26-3: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V DC CHARACTERISTICS (unless otherwise stated) Operating temperature -40°C TA +150°C for High Temperature Parameter Symbol Characteristic Min Typ Max Units Conditions No. Operating Voltage HDC10 Supply Voltage VDD — 3.0 3.3 3.6 V -40°C to +150°C TABLE 26-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 3.0V to 3.6V DC CHARACTERISTICS (unless otherwise stated) Operating temperature -40°C TA +150°C for High Temperature Parameter Typical Max Units Conditions No. Power-Down Current (IPD) HDC60e 250 2000 A +150°C 3.3V Base Power-Down Current(1,3) Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1. 2: The current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. 3: These currents are measured on the device containing the most memory in this family. 4: These parameters are characterized, but are not tested in manufacturing. DS70593D-page 322 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Standard Operating Conditions: 3.0V to 3.6V DC CHARACTERISTICS (unless otherwise stated) Operating temperature -40°C TA +150°C for High Temperature Parameter Typical Max Units Conditions No. Power-Down Current (IPD) HDC61c 3 5 A +150°C 3.3V Watchdog Timer Current: IWDT(2,4) Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1. 2: The current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. 3: These currents are measured on the device containing the most memory in this family. 4: These parameters are characterized, but are not tested in manufacturing. TABLE 26-5: DC CHARACTERISTICS: DOZE CURRENT (IDOZE) Standard Operating Conditions: 3.0V to 3.6V DC CHARACTERISTICS (unless otherwise stated) Operating temperature -40°C TA +150°C for High Temperature Parameter Doze Typical(1) Max Units Conditions No. Ratio HDC72a 39 45 1:2 mA HDC72f 18 25 1:64 mA +150°C 3.3V 20 MIPS HDC72g 18 25 1:128 mA Note 1: Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing. 2009-2012 Microchip Technology Inc. DS70593D-page 323
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 26-6: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C TA +85°C for High Temperature Param. Symbol Characteristic Min. Typ. Max. Units Conditions Output Low Voltage I/O Pins: IOL 1.8 mA, VDD = 3.3V — — 0.4 V 2x Sink Driver Pins - All pins not See Note 1 defined by 4x or 8x driver pins Output Low Voltage I/O Pins: IOL 3.6 mA, VDD = 3.3V HDO10 VOL 4x Sink Driver Pins - RA2, RA3, RA9, — — 0.4 V See Note 1 RA10, RA14, RA15, RB0, RB1, RB11, RF4, RF5, RG2, RG3 Output Low Voltage I/O Pins: IOL 6 mA, VDD = 3.3V — — 0.4 V 8x Sink Driver Pins - OSC2, CLKO, See Note 1 RC15 Output High Voltage I/O Pins: IOL-1.8 mA, VDD = 3.3V 2.4 — — V 2x Source Driver Pins - All pins not See Note 1 defined by 4x or 8x driver pins Output High Voltage I/O Pins: IOL-3 mA, VDD = 3.3V 4x Source Driver Pins - RA2, RA3, 2.4 — — V HDO20 VOH See Note 1 RA9, RA10, RA14, RA15, RB0, RB1, RB11, RF4, RF5, RG2, RG3 Output High Voltage I/O Pins: IOL-6 mA, VDD = 3.3V 8x Source Driver Pins - OSC2, CLKO, 2.4 — — V See Note 1 RC15 Output High Voltage IOH-1.9 mA, VDD = 3.3V 1.5 — — I/O Pins: See Note 1 2x Source Driver Pins - All pins not IOH-1.85 mA, VDD = defined by 4x or 8x driver pins 2.0 — — V 3.3V See Note 1 IOH-1.4 mA, VDD = 3.3V 3.0 — — See Note 1 Output High Voltage IOH-3.9 mA, VDD = 3.3V 1.5 — — 4x Source Driver Pins - RA2, RA3, See Note 1 HDO20A VOH1 RA9, RA10, RA14, RA15, RB0, RB1, IOH-3.7 mA, VDD = 3.3V 2.0 — — V RB11, RF4, RF5, RG2, RG3 See Note 1 IOH-2 mA, VDD = 3.3V 3.0 — — See Note 1 Output High Voltage IOH-7.5 mA, VDD = 3.3V 1.5 — — 8x Source Driver Pins - OSC2, CLKO, See Note 1 RC15 IOH-6.8 mA, VDD = 3.3V 2.0 — — V See Note 1 IOH-3 mA, VDD = 3.3V 3.0 — — See Note 1 Note 1: Parameters are characterized, but not tested. DS70593D-page 324 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 26.2 AC Characteristics and Timing Parameters The information contained in this section defines dsPIC33FJXXXGPX06A/X08A/X10A AC characteristics and timing parameters for high temperature devices. However, all AC timing specifications in this section are the same as those in Section25.2 “AC Characteristics and Timing Parameters”, with the exception of the parameters listed in this section. Parameters in this section begin with an H, which denotes High temperature. For example, parameter OS53 in Section25.2 “AC Characteristics and Timing Parameters” is the Industrial and Extended temperature equivalent of HOS53. TABLE 26-7: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Operating voltage VDD range as described in Table26-1. FIGURE 26-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2 VDD/2 RL Pin CL VSS CL Pin RL = 464 CL = 50 pF for all pins except OSC2 VSS 15 pF for OSC2 output TABLE 26-8: PLL CLOCK TIMING SPECIFICATIONS AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Symbol Characteristic Min Typ Max Units Conditions No. HOS53 DCLK CLKO Stability (Jitter)(1) -5 0.5 5 % Measured over 100 ms period Note 1: These parameters are characterized, but are not tested in manufacturing. 2009-2012 Microchip Technology Inc. DS70593D-page 325
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 26-9: INTERNAL LPRC ACCURACY AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Characteristic Min Typ Max Units Conditions No. LPRC @ 32.768 kHz (1) HF21 LPRC -70(2) — +70(2) % -40°C TA +150°C Note 1: Change of LPRC frequency as VDD changes. 2: Characterized but not tested. TABLE 26-10: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Symbol Characteristic(1) Min Typ Max Units Conditions No. HSP35 TscH2doV, SDOx Data Output Valid after — 10 25 ns — TscL2doV SCKx Edge HSP40 TdiV2scH, Setup Time of SDIx Data Input 28 — — ns — TdiV2scL to SCKx Edge HSP41 TscH2diL, Hold Time of SDIx Data Input 35 — — ns — TscL2diL to SCKx Edge Note 1: These parameters are characterized but not tested in manufacturing. TABLE 26-11: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Symbol Characteristic(1) Min Typ Max Units Conditions No. HSP35 TscH2doV, SDOx Data Output Valid after — 10 25 ns — TscL2doV SCKx Edge HSP36 TdoV2sc, SDOx Data Output Setup to 35 — — ns — TdoV2scL First SCKx Edge HSP40 TdiV2scH, Setup Time of SDIx Data Input 28 — — ns — TdiV2scL to SCKx Edge HSP41 TscH2diL, Hold Time of SDIx Data Input 35 — — ns — TscL2diL to SCKx Edge Note 1: These parameters are characterized but not tested in manufacturing. DS70593D-page 326 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 26-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Symbol Characteristic(1) Min Typ Max Units Conditions No. HSP35 TscH2doV, SDOx Data Output Valid after — — 35 ns — TscL2doV SCKx Edge HSP40 TdiV2scH, Setup Time of SDIx Data Input 25 — — ns — TdiV2scL to SCKx Edge HSP41 TscH2diL, Hold Time of SDIx Data Input to 25 — — ns — TscL2diL SCKx Edge HSP51 TssH2doZ SSx to SDOx Output 15 — 55 ns See Note 2 High-Impedance Note 1: These parameters are characterized but not tested in manufacturing. 2: Assumes 50 pF load on all SPIx pins. TABLE 26-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Symbol Characteristic(1) Min Typ Max Units Conditions No. HSP35 TscH2doV, SDOx Data Output Valid after — — 35 ns — TscL2doV SCKx Edge HSP40 TdiV2scH, Setup Time of SDIx Data Input 25 — — ns — TdiV2scL to SCKx Edge HSP41 TscH2diL, Hold Time of SDIx Data Input 25 — — ns — TscL2diL to SCKx Edge HSP51 TssH2doZ SSx to SDOX Output 15 — 55 ns See Note 2 High-Impedance HSP60 TssL2doV SDOx Data Output Valid after — — 55 ns — SSx Edge Note 1: These parameters are characterized but not tested in manufacturing. 2: Assumes 50 pF load on all SPIx pins. 2009-2012 Microchip Technology Inc. DS70593D-page 327
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 26-14: ADC MODULE SPECIFICATIONS AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Symbol Characteristic Min Typ Max Units Conditions No. Reference Inputs HAD08 IREF Current Drain — 250 600 A ADC operating, See Note 1 — — 50 A ADC off, See Note 1 Note 1: These parameters are not characterized or tested in manufacturing. 2: These parameters are characterized, but are not tested in manufacturing. TABLE 26-15: ADC MODULE SPECIFICATIONS (12-BIT MODE)(3) AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Symbol Characteristic Min Typ Max Units Conditions No. ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREF-(1) AD23a GERR Gain Error — 5 10 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24a EOFF Offset Error — 2 5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREF-(1) AD23a GERR Gain Error 2 10 20 LSb VINL = AVSS = 0V, AVDD = 3.6V AD24a EOFF Offset Error 2 5 10 LSb VINL = AVSS = 0V, AVDD = 3.6V Dynamic Performance (12-bit Mode)(2) HAD33a FNYQ Input Signal Bandwidth — — 200 kHz — Note 1: These parameters are characterized, but are tested at 20 ksps only. 2: These parameters are characterized by similarity, but are not tested in manufacturing. 3: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. TABLE 26-16: ADC MODULE SPECIFICATIONS (10-BIT MODE)(3) AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Symbol Characteristic Min Typ Max Units Conditions No. ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREF-(1) AD23b GERR Gain Error — 3 6 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24b EOFF Offset Error — 2 5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREF-(1) AD23b GERR Gain Error — 7 15 LSb VINL = AVSS = 0V, AVDD = 3.6V AD24b EOFF Offset Error — 3 7 LSb VINL = AVSS = 0V, AVDD = 3.6V Dynamic Performance (10-bit Mode)(2) HAD33b FNYQ Input Signal Bandwidth — — 400 kHz — Note 1: These parameters are characterized, but are tested at 20 ksps only. 2: These parameters are characterized by similarity, but are not tested in manufacturing. 3: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. DS70593D-page 328 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A TABLE 26-17: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Symbol Characteristic Min Typ Max Units Conditions No. Clock Parameters HAD50 TAD ADC Clock Period(1) 147 — — ns — Conversion Rate HAD56 FCNV Throughput Rate(1) — — 400 Ksps — Note 1: These parameters are characterized but not tested in manufacturing. TABLE 26-18: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) CHARACTERISTICS Operating temperature -40°C TA +150°C for High Temperature Param Symbol Characteristic Min Typ Max Units Conditions No. Clock Parameters HAD50 TAD ADC Clock Period(1) 104 — — ns — Conversion Rate HAD56 FCNV Throughput Rate(1) — — 800 Ksps — Note 1: These parameters are characterized but not tested in manufacturing. 2009-2012 Microchip Technology Inc. DS70593D-page 329
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 330 2009-2012 Microchip Technology Inc.
27.0 DC AND AC DEVICE CHARACTERISTICS GRAPHS 2 0 0 9 Note: The graphs provided following this note are a statistical summary based on a limited number of samples and are provided for design guidance purposes -20 only. The performance characteristics listed herein are not tested or guaranteed. In some graphs, the data presented may be outside the specified operating 1 2 range (e.g., outside specified power supply range) and therefore, outside the warranted range. M ic ro c FIGURE 27-1: VOH – 2x DRIVER PINS FIGURE 27-3: VOH – 8x DRIVER PINS h ip T --00..001166 --00..004400 e ch 3.6V n --00..001144 --00..003355 d o 3.6V log --00..001122 --00..003300 3.3V s y In 3.3V P c --00..001100 --00..002255 . A)A) 3V A)A) 3V IC H (H ( --00..000088 H (H ( --00..002200 IOIO --00..000066 IOIO --00..001155 3 3 --00..000044 -0.010 F -0.002 -0.005 J X 0.000 0.000 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 X 0.00 1.00 2.00 3.00 4.00 VOH (V) VOH (V) X G FIGURE 27-2: VOH – 4x DRIVER PINS FIGURE 27-4: VOH – 16x DRIVER PINS P --00..003300 --00..008800 X 3.6V --00..007700 3.6V 0 --00..002255 6 3.3V --00..006600 3.3V A --00..002200 --00..005500 H (A)H (A) --00..001155 3V H (A)H (A) --00..004400 3V /X IOIO IOIO --00..003300 0 --00..001100 8 --00..002200 D A S70 -0.005 -0.010 / 5 X 9 3D 0.000 0.000 1 -p 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 0.00 1.00 2.00 3.00 4.00 age VOH (V) VOH (V) 0 3 A 3 1
D FIGURE 27-5: VOL – 2x DRIVER PINS FIGURE 27-7: VOL – 8x DRIVER PINS d S 70 s 5 93 00..002200 00..006600 P D -p 00..001188 I ag 3.6V 00..005500 3.6V C e 00..001166 332 00..001144 3.3V 00..004400 3.3V 33 00..001122 3V 3V F A)A) A)A) L (L ( 00..001100 L (L ( 00..003300 J OO OO II 00..000088 II X 00..002200 00..000066 X 0.004 X 0.010 0.002 G 0.000 0.000 P 0.00 1.00 2.00 3.00 4.00 0.00 1.00 2.00 3.00 4.00 X VOL (V) VOL (V) 0 6 A FIGURE 27-6: VOL – 4x DRIVER PINS FIGURE 27-8: VOL – 16x DRIVER PINS / X 00..004400 00..112200 0 8 00..003355 3.6V 00..110000 3.6V A 00..003300 3.3V 3.3V / X 00..008800 00..002255 3V 3V 1 200 L (A)L (A) 00..002200 L (A)L (A) 00..006600 0 9-2 IOIO 00..001155 IOIO A 01 00..004400 2 M 00..001100 icroc 0.005 0.020 h ip T 0.000 0.000 e c 0.00 1.00 2.00 3.00 4.00 0.00 1.00 2.00 3.00 4.00 h n olo VOL (V) VOL (V) g y In c .
FIGURE 27-9: TYPICAL FRC FREQUENCY @ VDD = 3.3V FIGURE 27-10: TYPICAL LPRC FREQUENCY @ VDD = 3.3V 2 0 0 9-2 7450 50 0 1 2 M 7400 45 ic ro ch 7350 ip 40 T echnology Inc. Frequency (kHz) 777223050000 Frequency (kHz) 3305 dsPI 25 C 7150 3 20 3 7100 (cid:2)40 (cid:2)30 (cid:2)20 (cid:2)10 0 10 20 30 40 50 60 70 80 90 100 110 120 F -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 Temperature(cid:2)Celsius Temperature Celsius J X X X G P X 0 6 A / X 0 8 D A S 7 0 / 5 X 9 3 D 1 -p ag 0 e 3 A 3 3
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 334 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 28.0 PACKAGING INFORMATION 28.1 Package Marking Information 64-Lead QFN (9x9x0.9mm) Example XXXXXXXXXX 33FJ64GP XXXXXXXXXX 206A-I/MRe3 YYWWNNN 0610017 64-Lead TQFP (10x10x1 mm) Example XXXXXXXXXX dsPIC33FJ XXXXXXXXXX 256GP706A XXXXXXXXXX -I/PTe3 YYWWNNN 0510017 80-Lead TQFP (12x12x1 mm) Example XXXXXXXXXXXX dsPIC33FJ128 XXXXXXXXXXXX GP708A-I/PTe3 YYWWNNN 0510017 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2009-2012 Microchip Technology Inc. DS70593D-page 335
dsPIC33FJXXXGPX06A/X08A/X10A 28.1 Package Marking Information (Continued) 100-Lead TQFP (12x12x1 mm) Example XXXXXXXXXXXX dsPIC33FJ256 XXXXXXXXXXXX GP710A-I/PTe3 YYWWNNN 0510017 100-Lead TQFP (14x14x1mm) Example XXXXXXXXXXXX dsPIC33FJ256 XXXXXXXXXXXX GP710A-I/PFe3 YYWWNNN 0510017 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS70593D-page 336 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 28.2 Package Details Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2012 Microchip Technology Inc. DS70593D-page 337
dsPIC33FJXXXGPX06A/X08A/X10A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS70593D-page 338 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 E e E1 N b NOTE 1 123 NOTE 2 α A c φ A2 β A1 L L1 Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Leads N 64 Lead Pitch e 0.50 BSC Overall Height A – – 1.20 Molded Package Thickness A2 0.95 1.00 1.05 Standoff A1 0.05 – 0.15 Foot Length L 0.45 0.60 0.75 Footprint L1 1.00 REF Foot Angle φ 0° 3.5° 7° Overall Width E 12.00 BSC Overall Length D 12.00 BSC Molded Package Width E1 10.00 BSC Molded Package Length D1 10.00 BSC Lead Thickness c 0.09 – 0.20 Lead Width b 0.17 0.22 0.27 Mold Draft Angle Top α 11° 12° 13° Mold Draft Angle Bottom β 11° 12° 13° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Chamfers at corners are optional; size may vary. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. MicrochipTechnologyDrawingC04-085B 2009-2012 Microchip Technology Inc. DS70593D-page 339
dsPIC33FJXXXGPX06A/X08A/X10A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS70593D-page 340 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 E e E1 b N NOTE 1 123 NOTE 2 α A c φ β A1 A2 L L1 Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Leads N 80 Lead Pitch e 0.50 BSC Overall Height A – – 1.20 Molded Package Thickness A2 0.95 1.00 1.05 Standoff A1 0.05 – 0.15 Foot Length L 0.45 0.60 0.75 Footprint L1 1.00 REF Foot Angle φ 0° 3.5° 7° Overall Width E 14.00 BSC Overall Length D 14.00 BSC Molded Package Width E1 12.00 BSC Molded Package Length D1 12.00 BSC Lead Thickness c 0.09 – 0.20 Lead Width b 0.17 0.22 0.27 Mold Draft Angle Top α 11° 12° 13° Mold Draft Angle Bottom β 11° 12° 13° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Chamfers at corners are optional; size may vary. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. MicrochipTechnologyDrawingC04-092B 2009-2012 Microchip Technology Inc. DS70593D-page 341
dsPIC33FJXXXGPX06A/X08A/X10A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS70593D-page 342 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 e E E1 N b NOTE 1 123 NOTE 2 α c A φ β L A1 L1 A2 Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Leads N 100 Lead Pitch e 0.40 BSC Overall Height A – – 1.20 Molded Package Thickness A2 0.95 1.00 1.05 Standoff A1 0.05 – 0.15 Foot Length L 0.45 0.60 0.75 Footprint L1 1.00 REF Foot Angle φ 0° 3.5° 7° Overall Width E 14.00 BSC Overall Length D 14.00 BSC Molded Package Width E1 12.00 BSC Molded Package Length D1 12.00 BSC Lead Thickness c 0.09 – 0.20 Lead Width b 0.13 0.18 0.23 Mold Draft Angle Top α 11° 12° 13° Mold Draft Angle Bottom β 11° 12° 13° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Chamfers at corners are optional; size may vary. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. MicrochipTechnologyDrawingC04-100B 2009-2012 Microchip Technology Inc. DS70593D-page 343
dsPIC33FJXXXGPX06A/X08A/X10A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS70593D-page 344 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A 100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 e E1 E b N α NOTE 1 123 NOTE 2 A φ c A2 β A1 L L1 Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Leads N 100 Lead Pitch e 0.50 BSC Overall Height A – – 1.20 Molded Package Thickness A2 0.95 1.00 1.05 Standoff A1 0.05 – 0.15 Foot Length L 0.45 0.60 0.75 Footprint L1 1.00 REF Foot Angle φ 0° 3.5° 7° Overall Width E 16.00 BSC Overall Length D 16.00 BSC Molded Package Width E1 14.00 BSC Molded Package Length D1 14.00 BSC Lead Thickness c 0.09 – 0.20 Lead Width b 0.17 0.22 0.27 Mold Draft Angle Top α 11° 12° 13° Mold Draft Angle Bottom β 11° 12° 13° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Chamfers at corners are optional; size may vary. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. MicrochipTechnologyDrawingC04-110B 2009-2012 Microchip Technology Inc. DS70593D-page 345
dsPIC33FJXXXGPX06A/X08A/X10A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS70593D-page 346 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A APPENDIX A: MIGRATING FROM dsPIC33FJXXXGPX06/X08/X10 DEVICES TO dsPIC33FJXXXGPX06A/X08A/X10A DEVICES dsPIC33FJXXXGPX06A/X08A/X10A devices were designed to enhance the dsPIC33FJXXXGPX06/X08/ X10 families of devices. In general, the dsPIC33FJXXXGPX06A/X08A/X10A devices are backward-compatible with dsPIC33FJXXXGPX06/X08/X10 devices; however, manufacturing differences may cause dsPIC33FJXXXGPX06A/X08A/X10A devices to behave differently from dsPIC33FJXXXGPX06/X08/ X10 devices. Therefore, complete system test and characterization is recommended if dsPIC33FJXXXGPX06A/X08A/X10A devices are used to replace dsPIC33FJXXXGPX06/X08/X10 devices. The following enhancements were introduced: • Extended temperature support of up to +125ºC • Enhanced Flash module with higher endurance and retention • New PLL Lock Enable configuration bit • Added Timer5 trigger for ADC1 and Timer3 trigger for ADC2 2009-2012 Microchip Technology Inc. DS70593D-page 347
dsPIC33FJXXXGPX06A/X08A/X10A APPENDIX B: REVISION HISTORY Revision B (October 2009) The revision includes the following global update: Revision A (April 2009) • Added Note 2 to the shaded table that appears at This is the initial released version of the document. the beginning of each chapter. This new note provides information regarding the availability of registers and their associated bits This revision also includes minor typographical and formatting changes throughout the data sheet text. All other major changes are referenced by their respective section in the following table. TABLE B-1: MAJOR SECTION UPDATES Section Name Update Description “High-Performance, 16-Bit Digital Signal Added information on high temperature operation (see “Operating Controllers” Range”). Section10.0 “Power-Saving Features” Updated the last paragraph to clarify the number of cycles that occur prior to the start of instruction execution (see Section10.2.2 “Idle Mode”). Section11.0 “I/O Ports” Changed the reference to digital-only pins to 5V tolerant pins in the second paragraph of Section11.2 “Open-Drain Configuration”. Section18.0 “Universal Asynchronous Updated the two baud rate range features to: 10 Mbps to 38 bps at Receiver Transmitter (UART)” 40 MIPS. Section21.0 “10-Bit/12-Bit Updated the ADCx block diagram (see Figure21-1). Analog-to-Digital Converter (ADC)” Section22.0 “Special Features” Updated the second paragraph and removed the fourth paragraph in Section22.1 “Configuration Bits”. Updated the Device Configuration Register Map (see Table22-1). Added the FPWRT<2:0> bit field for the FWDT register to the Configurative Bits Description table (see Table22-1). Section25.0 “Electrical Characteristics” Updated the Absolute Maximum Ratings for high temperature and added Note 4. Updated Power-Down Current parameters DC60d, DC60a, DC60b, and DC60d (see Table25-7). Added I2Cx Bus Data Timing Requirements (Master Mode) parameter IM51 (see Table25-36). Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics (see Figure25-12). Updated the Internal LPRC Accuracy parameters (see Table25-19). Updated the ADC Module Specifications (12-bit Mode) parameters AD23a and AD24a (see Table25-42). Updated the ADC Module Specifications (10-bit Mode) parameters AD23b and AD24b (see Table25-43). Section26.0 “High Temperature Electrical Added new chapter with high temperature specifications. Characteristics” “Product Identification System” Added the “H” definition for high temperature. DS70593D-page 348 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Revision C (March 2011) This revision includes typographical and formatting changes throughout the data sheet text. In addition, all instances of VDDCORE have been removed. All other major changes are referenced by their respective section in the following table. TABLE B-2: MAJOR SECTION UPDATES Section Name Update Description Section2.0 “Guidelines for Getting Started Updated the title of Section2.3 “CPU Logic Filter Capacitor with 16-Bit Digital Signal Controllers” Connection (VCAP)”. The frequency limitation for device PLL start-up conditions was updated in Section2.7 “Oscillator Value Conditions on Device Start-up”. The second paragraph in Section2.9 “Unused I/Os” was updated. Section4.0 “Memory Organization” The All Resets values for the following SFRs in the Timer Register Map were changed (see Table4-6): • TMR1 • TMR2 • TMR3 • TMR4 • TMR5 • TMR6 • TMR7 • TMR8 • TMR9 Section9.0 “Oscillator Configuration” Added Note 3 to the OSCCON: Oscillator Control Register (see Register9-1). Added Note 2 to the CLKDIV: Clock Divisor Register (see Register9-2). Added Note 1 to the PLLFBD: PLL Feedback Divisor Register (see Register9-3). Added Note 2 to the OSCTUN: FRC Oscillator Tuning Register (see Register9-4). Section21.0 “10-Bit/12-Bit Updated the VREFL references in the ADC1 module block diagram Analog-to-Digital Converter (ADC)” (see Figure21-1). Section22.0 “Special Features” Added a new paragraph and removed the third paragraph in Section22.1 “Configuration Bits”. Added the column “RTSP Effects” to the Configuration Bits Descriptions (see Table22-2). 2009-2012 Microchip Technology Inc. DS70593D-page 349
dsPIC33FJXXXGPX06A/X08A/X10A TABLE B-2: MAJOR SECTION UPDATES (CONTINUED) Section Name Update Description Section25.0 “Electrical Characteristics” Removed Note 4 from the DC Temperature and Voltage Specifications (see Table25-4). Updated the maximum value for parameter DI19 and added parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input Specifications (see Table25-9). Removed Note 2 from the AC Characteristics: Internal RC Accuracy (see Table25-18). Updated the characteristic description for parameter DI35 in the I/O Timing Requirements (see Table25-20). Updated the ADC Module Specification minimum values for parameters AD05 and AD07, and updated the maximum value for parameter AD06 (see Table25-41). Added Note 1 to the ADC Module Specifications (12-bit Mode) (see Table25-42). Added Note 1 to the ADC Module Specifications (10-bit Mode) (see Table25-43). Added DMA Read/Write Timing Requirements (see Table25-46). Section26.0 “High Temperature Electrical Updated all ambient temperature end range values to +150ºC Characteristics” throughout the chapter. Updated the storage temperature end range to +160ºC. Updated the maximum junction temperature from +145ºC to +155ºC. Updated the maximum values for High Temperature Devices in the Thermal Operating Conditions (see Table26-2). Added Note 3 and updated the ADC Module Specifications (12-bit Mode), removing all parameters with the exception of HAD33a (see Table26-16). Added Note 3 and updated the ADC Module Specifications (10-bit Mode), removing all parameters with the exception of HAD33b (see Table26-17). DS70593D-page 350 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A Revision D (June 2012) This revision includes typographical and formatting changes throughout the data sheet text. All other major changes are referenced by their respective section in the following table. TABLE B-3: MAJOR SECTION UPDATES Section Name Update Description Section2.0 “Guidelines for Getting Started Updated the Recommended Minimum Connection (see Figure2-1). with 16-Bit Digital Signal Controllers” Section9.0 “Oscillator Configuration” Updated the COSC<2:0> and NOSC<2:0> bit value definitions for ‘001’ (see Register9-1). Section21.0 “10-Bit/12-Bit Updated the Analog-to-Digital Conversion Clock Period Block Analog-to-Digital Converter (ADC)” Diagram (see Figure21-2). Section22.0 “Special Features” Added Note 3 to the On-chip Voltage Regulator Connections (see Figure22-1). Section25.0 “Electrical Characteristics” Updated “Absolute Maximum Ratings”. Updated Operating MIPS vs. Voltage (see Table25-1). Removed parameter DC18 from the DC Temperature and Voltage Specifications (see Table25-4). Updated the notes in the following tables: • Table25-5 • Table25-6 • Table25-7 • Table25-8 Updated the I/O Pin Output Specifications (see Table25-10). Updated the Conditions for parameter BO10 (see Table25-11). Updated the Conditions for parameters D136b, D137b, and D138b (TA = 150ºC) (see Table25-12). Section26.0 “High Temperature Electrical Updated “Absolute Maximum Ratings”. Characteristics” Updated the I/O Pin Output Specifications (see Table26-6). Removed Table 25-7: DC Characteristics: Program Memory. 2009-2012 Microchip Technology Inc. DS70593D-page 351
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 352 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A INDEX A CPU Control Register..........................................................30 A/D Converter...................................................................237 CPU Clocking System......................................................146 DMA..........................................................................237 Options.....................................................................146 Initialization...............................................................237 Selection...................................................................146 Key Features.............................................................237 Customer Change Notification Service.............................357 AC Characteristics....................................................282, 325 Customer Notification Service..........................................357 ADC Module..............................................................328 Customer Support.............................................................357 ADC Module (10-bit Mode).......................................328 ADC Module (12-bit Mode).......................................328 D Internal RC Accuracy................................................284 Data Accumulators and Adder/Subtractor..........................35 Load Conditions................................................282, 325 Data Space Write Saturation......................................37 ADC Module Overflow and Saturation.............................................35 ADC11 Register Map..................................................55 Round Logic...............................................................36 ADC2 Register Map....................................................55 Write Back..................................................................36 Alternate Interrupt Vector Table (AIVT)..............................89 Data Address Space...........................................................41 Arithmetic Logic Unit (ALU).................................................33 Alignment....................................................................41 Assembler Memory Map for dsPIC33FJXXXGPX06A/X08A/X10A MPASM Assembler...................................................268 Devices with 16 KB RAM....................................43 B Memory Map for dsPIC33FJXXXGPX06A/X08A/X10A Devices with 30 KB RAM....................................44 Barrel Shifter.......................................................................37 Memory Map for dsPIC33FJXXXGPX06A/X08A/X10A Bit-Reversed Addressing....................................................70 Devices with 8 KB RAM......................................42 Example......................................................................71 Near Data Space........................................................41 Implementation...........................................................70 Software Stack...........................................................67 Sequence Table (16-Entry).........................................71 Width..........................................................................41 Block Diagrams Data Converter Interface (DCI) Module............................229 16-bit Timer1 Module................................................167 DC and AC Characteristics A/D Module...............................................................238 Graphs and Tables...................................................331 Connections for On-Chip Voltage Regulator.............256 DC Characteristics............................................................272 DCI Module...............................................................230 Device Clock.....................................................145, 147 Doze Current (IDOZE)................................................323 High Temperature.....................................................322 DSP Engine................................................................34 I/O Pin Input Specifications......................................278 dsPIC33F....................................................................20 I/O Pin Output Specifications............................280, 324 dsPIC33F CPU Core...................................................28 ECAN Module...........................................................202 Idle Current (IIDLE)....................................................275 Input Capture............................................................175 Operating Current (IDD)............................................274 Operating MIPS vs. Voltage.....................................322 Output Compare.......................................................177 PLL............................................................................147 Power-Down Current (IPD)........................................276 Reset System..............................................................83 Power-down Current (IPD)........................................322 Program Memory......................................................281 Shared Port Structure...............................................163 Temperature and Voltage.........................................322 SPI............................................................................181 Temperature and Voltage Specifications..................273 Timer2 (16-bit)..........................................................171 Thermal Operating Conditions..................................322 Timer2/3 (32-bit).......................................................170 DCI UART........................................................................195 Buffer Control...........................................................229 Watchdog Timer (WDT)............................................257 Buffer Data Alignment..............................................229 C Introduction...............................................................229 C Compilers Transmit/Receive Shift Register...............................229 MPLAB C18..............................................................268 DCI I/O Pins......................................................................229 Clock Switching.................................................................153 COFS........................................................................229 Enabling....................................................................153 CSCK........................................................................229 Sequence..................................................................153 CSDI.........................................................................229 Code Examples CSDO.......................................................................229 Erasing a Program Memory Page...............................81 DCI Module Initiating a Programming Sequence............................82 Register Map..............................................................64 Loading Write Buffers.................................................82 Development Support.......................................................267 Port Write/Read........................................................164 DMA Module PWRSAV Instruction Syntax.....................................155 DMA Register Map.....................................................56 Code Protection........................................................251, 258 DMAC Registers...............................................................136 Configuration Bits..............................................................251 DMAxCNT................................................................136 Description (Table)....................................................252 DMAxCON................................................................136 Configuration Register Map..............................................251 Configuring Analog Port Pins............................................164 2009-2012 Microchip Technology Inc. DS70593D-page 353
dsPIC33FJXXXGPX06A/X08A/X10A DMAxPAD.................................................................136 Instruction Set DMAxREQ................................................................136 Overview...................................................................262 DMAxSTA.................................................................136 Summary..................................................................259 DMAxSTB.................................................................136 Instruction-Based Power-Saving Modes...........................155 DSP Engine.........................................................................33 Idle............................................................................156 Multiplier......................................................................35 Sleep........................................................................155 Internal RC Oscillator E Use with WDT...........................................................257 ECAN Module Internet Address...............................................................357 CiFMSKSEL2 register...............................................221 Interrupt Control and Status Registers...............................93 ECAN1 Register Map (C1CTRL1.WIN = 0 or 1).........58 IECx............................................................................93 ECAN1 Register Map (C1CTRL1.WIN = 0)................58 IFSx............................................................................93 ECAN1 Register Map (C1CTRL1.WIN = 1)................59 INTCON1....................................................................93 ECAN2 Register Map (C2CTRL1.WIN = 0 or 1).........61 INTCON2....................................................................93 ECAN2 Register Map (C2CTRL1.WIN = 0)..........61, 62 IPCx............................................................................93 Frame Types.............................................................201 Interrupt Setup Procedures...............................................133 Modes of Operation..................................................203 Initialization...............................................................133 Overview...................................................................201 Interrupt Disable.......................................................133 ECAN Registers Interrupt Service Routine..........................................133 Filter 15-8 Mask Selection Register Trap Service Routine................................................133 (CiFMSKSEL2).................................................221 Interrupt Vector Table (IVT)................................................89 Electrical Characteristics...................................................271 Interrupts Coincident with Power Save Instructions.........156 AC.....................................................................282, 325 J Enhanced CAN Module.....................................................201 Equations JTAG Boundary Scan Interface........................................251 Device Operating Frequency....................................146 M Errata..................................................................................16 Memory Organization.........................................................39 F Microchip Internet Web Site..............................................357 Flash Program Memory.......................................................77 Modes of Operation Control Registers........................................................78 Disable......................................................................203 Operations..................................................................78 Initialization...............................................................203 Programming Algorithm..............................................81 Listen All Messages..................................................203 RTSP Operation..........................................................78 Listen Only................................................................203 Table Instructions........................................................77 Loopback..................................................................203 Flexible Configuration.......................................................251 Normal Operation.....................................................203 FSCM Modulo Addressing.............................................................68 Delay for Crystal and PLL Clock Sources...................87 Applicability.................................................................70 Device Resets.............................................................87 Operation Example.....................................................69 Start and End Address...............................................69 H W Address Register Selection....................................69 High Temperature Electrical Characteristics.....................321 MPLAB ASM30 Assembler, Linker, Librarian...................268 MPLAB Integrated Development I Environment Software..............................................267 I/O Ports............................................................................163 MPLAB PM3 Device Programmer....................................270 Parallel I/O (PIO).......................................................163 MPLAB REAL ICE In-Circuit Emulator System................269 Write/Read Timing....................................................164 MPLINK Object Linker/MPLIB Object Librarian................268 I2C N Operating Modes......................................................187 Registers...................................................................187 NVM Module I2C Module Register Map..............................................................66 I2C1 Register Map......................................................53 O I2C2 Register Map......................................................53 In-Circuit Debugger...........................................................258 Open-Drain Configuration.................................................164 In-Circuit Emulation...........................................................251 Output Compare...............................................................177 In-Circuit Serial Programming (ICSP).......................251, 258 P Input Capture Registers...................................................................176 Packaging.........................................................................335 Input Change Notification Module.....................................164 Details.......................................................................339 Instruction Addressing Modes.............................................67 Marking.............................................................335, 336 File Register Instructions............................................67 Peripheral Module Disable (PMD)....................................156 Fundamental Modes Supported..................................68 Pinout I/O Descriptions (table)............................................21 MAC Instructions.........................................................68 PMD Module MCU Instructions........................................................67 Register Map..............................................................66 Move and Accumulator Instructions............................68 POR and Long Oscillator Start-up Times...........................87 Other Instructions........................................................68 DS70593D-page 354 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A PORTA CiRXFUL1 (ECAN Receive Buffer Full 1).................223 Register Map...............................................................64 CiRXFUL2 (ECAN Receive Buffer Full 2).................223 PORTB CiRXMnEID (ECAN Acceptance Filter Mask n Register Map...............................................................64 Extended Identifier)..........................................222 PORTC CiRXMnSID (ECAN Acceptance Filter Mask n Register Map...............................................................65 Standard Identifier)...........................................222 PORTD CiRXOVF1 (ECAN Receive Buffer Overflow 1)........224 Register Map...............................................................65 CiRXOVF2 (ECAN Receive Buffer Overflow 2)........224 PORTE CiTRBnDLC (ECAN Buffer n Data Register Map...............................................................65 Length Control).................................................227 PORTF CiTRBnDm (ECAN Buffer n Data Field Byte m).......227 Register Map...............................................................65 CiTRBnEID (ECAN Buffer n Extended Identifier).....226 PORTG CiTRBnSID (ECAN Buffer n Standard Identifier)......226 Register Map...............................................................66 CiTRBnSTAT (ECAN Receive Buffer n Status)........228 Power-Saving Features....................................................155 CiTRmnCON (ECAN TX/RX Buffer m Control)........225 Clock Frequency and Switching................................155 CiVEC (ECAN Interrupt Code).................................206 Program Address Space.....................................................39 CLKDIV (Clock Divisor)............................................150 Construction................................................................72 CORCON (Core Control)......................................32, 94 Data Access from Program Memory DCICON1 (DCI Control 1)........................................231 Using Program Space Visibility...........................75 DCICON2 (DCI Control 2)........................................232 Data Access from Program Memory DCICON3 (DCI Control 3)........................................233 Using Table Instructions.....................................74 DCISTAT (DCI Status).............................................234 Data Access from, Address Generation......................73 DMACS0 (DMA Controller Status 0)........................141 Memory Map...............................................................39 DMACS1 (DMA Controller Status 1)........................143 Table Read Instructions DMAxCNT (DMA Channel x Transfer Count)...........140 TBLRDH.............................................................74 DMAxCON (DMA Channel x Control).......................137 TBLRDL..............................................................74 DMAxPAD (DMA Channel x Peripheral Address)....140 Visibility Operation......................................................75 DMAxREQ (DMA Channel x IRQ Select).................138 Program Memory DMAxSTA (DMA Channel x RAM Start Interrupt Vector...........................................................40 Address A)........................................................139 Organization................................................................40 DMAxSTB (DMA Channel x RAM Start Reset Vector...............................................................40 Address B)........................................................139 DSADR (Most Recent DMA RAM Address).............144 R I2CxCON (I2Cx Control)...........................................190 Reader Response.............................................................358 I2CxMSK (I2Cx Slave Mode Address Mask)............194 Registers I2CxSTAT (I2Cx Status)...........................................192 ADxCHS0 (ADCx Input Channel 0 Select.................247 ICxCON (Input Capture x Control)............................176 ADxCHS123 (ADCx Input Channel 1, 2, 3 Select)...246 IEC0 (Interrupt Enable Control 0).............................106 ADxCON1 (ADCx Control 1).....................................241 IEC1 (Interrupt Enable Control 1).............................108 ADxCON2 (ADCx Control 2).....................................243 IEC2 (Interrupt Enable Control 2).............................110 ADxCON3 (ADCx Control 3).....................................244 IEC3 (Interrupt Enable Control 3).............................112 ADxCON4 (ADCx Control 4).....................................245 IEC4 (Interrupt Enable Control 4).............................113 ADxCSSH (ADCx Input Scan Select High)...............248 IFS0 (Interrupt Flag Status 0).....................................98 ADxCSSL (ADCx Input Scan Select Low)................248 IFS1 (Interrupt Flag Status 1)...................................100 ADxPCFGH (ADCx Port Configuration High)...........249 IFS2 (Interrupt Flag Status 2)...................................102 ADxPCFGL (ADCx Port Configuration Low).............249 IFS3 (Interrupt Flag Status 3)...................................104 CiBUFPNT1 (ECAN Filter 0-3 Buffer Pointer)...........215 IFS4 (Interrupt Flag Status 4)...................................105 CiBUFPNT2 (ECAN Filter 4-7 Buffer Pointer)...........216 INTCON1 (Interrupt Control 1)...................................95 CiBUFPNT3 (ECAN Filter 8-11 Buffer Pointer).........217 INTCON2 (Interrupt Control 2)...................................97 CiBUFPNT4 (ECAN Filter 12-15 Buffer Pointer).......218 INTTREG Interrupt Control and Status Register......132 CiCFG1 (ECAN Baud Rate Configuration 1)............212 IPC0 (Interrupt Priority Control 0).............................114 CiCFG2 (ECAN Baud Rate Configuration 2)............213 IPC1 (Interrupt Priority Control 1).............................115 CiCTRL1 (ECAN Control 1)......................................204 IPC10 (Interrupt Priority Control 10).........................124 CiCTRL2 (ECAN Control 2)......................................205 IPC11 (Interrupt Priority Control 11).........................125 CiEC (ECAN Transmit/Receive Error Count)............211 IPC12 (Interrupt Priority Control 12).........................126 CiFCTRL (ECAN FIFO Control)................................207 IPC13 (Interrupt Priority Control 13).........................127 CiFEN1 (ECAN Acceptance Filter Enable)...............214 IPC14 (Interrupt Priority Control 14).........................128 CiFIFO (ECAN FIFO Status).....................................208 IPC15 (Interrupt Priority Control 15).........................129 CiFMSKSEL1 (ECAN Filter 7-0 Mask IPC16 (Interrupt Priority Control 16).........................130 Selection)..................................................220, 221 IPC17 (Interrupt Priority Control 17).........................131 CiINTE (ECAN Interrupt Enable)..............................210 IPC2 (Interrupt Priority Control 2).............................116 CiINTF (ECAN Interrupt Flag)...................................209 IPC3 (Interrupt Priority Control 3).............................117 CiRXFnEID (ECAN Acceptance Filter n IPC4 (Interrupt Priority Control 4).............................118 Extended Identifier)...........................................219 IPC5 (Interrupt Priority Control 5).............................119 CiRXFnSID (ECAN Acceptance Filter n IPC6 (Interrupt Priority Control 6).............................120 Standard Identifier)...........................................219 2009-2012 Microchip Technology Inc. DS70593D-page 355
dsPIC33FJXXXGPX06A/X08A/X10A IPC7 (Interrupt Priority Control 7).............................121 12-bit A/D Conversion (ASAM = 0, SSRC = 000).....315 IPC8 (Interrupt Priority Control 8).............................122 CAN I/O....................................................................311 IPC9 (Interrupt Priority Control 9).............................123 DCI AC-Link Mode....................................................310 NVMCOM (Flash Memory Control).......................79, 80 DCI Multi -Channel, I2S Modes.................................308 OCxCON (Output Compare x Control).....................179 External Clock...........................................................283 OSCCON (Oscillator Control)...................................148 I2Cx Bus Data (Master Mode)..................................304 OSCTUN (FRC Oscillator Tuning)............................152 I2Cx Bus Data (Slave Mode)....................................306 PLLFBD (PLL Feedback Divisor)..............................151 I2Cx Bus Start/Stop Bits (Master Mode)...................304 PMD1 (Peripheral Module Disable Control I2Cx Bus Start/Stop Bits (Slave Mode).....................306 Register 1)........................................................157 Input Capture (CAPx)...............................................290 PMD1 (Peripheral Module Disable OC/PWM...................................................................291 Control Register 1)............................................157 Output Compare (OCx).............................................290 PMD2 (Peripheral Module Disable Control Reset, Watchdog Timer, Oscillator Start-up Timer Register 2)........................................................159 and Power-up Timer.........................................286 PMD3 (Peripheral Module Disable Control Timer1, 2, 3, 4, 5, 6, 7, 8, 9 External Clock..............288 Register 3)........................................................161 Timing Requirements PMD3 (Peripheral Module Disable ADC Conversion (10-bit mode).................................329 Control Register 3)............................................161 ADC Conversion (12-bit Mode).................................329 RCON (Reset Control)................................................84 CLKO and I/O...........................................................285 RSCON (DCI Receive Slot Control)..........................235 DCI AC-Link Mode............................................310, 312 SPIxCON1 (SPIx Control 1)......................................184 DCI Multi-Channel, I2S Modes..........................309, 312 SPIxCON2 (SPIx Control 2)......................................186 External Clock...........................................................283 SPIxSTAT (SPIx Status and Control).......................183 Input Capture............................................................290 SR (CPU Status).........................................................94 SPIx Master Mode (CKE = 0)...................................326 T1CON (Timer1 Control)...........................................168 SPIx Module Master Mode (CKE = 1)......................326 TSCON (DCI Transmit Slot Control).........................235 SPIx Module Slave Mode (CKE = 0)........................327 TxCON (T2CON, T4CON, T6CON or SPIx Module Slave Mode (CKE = 1)........................327 T8CON Control)................................................172 Timing Specifications TyCON (T3CON, T5CON, T7CON or 10-bit A/D Conversion Requirements.......................319 T9CON Control)................................................173 12-bit A/D Conversion Requirements.......................316 UxMODE (UARTx Mode)..........................................197 CAN I/O Requirements.............................................311 UxSTA (UARTx Status and Control).........................199 I2Cx Bus Data Requirements (Master Mode)...........305 Reset I2Cx Bus Data Requirements (Slave Mode).............307 Clock Source Selection...............................................86 Output Compare Requirements................................290 Special Function Register Reset States.....................87 PLL Clock.........................................................284, 325 Times..........................................................................86 Reset, Watchdog Timer, Oscillator Start-up Timer, Reset Sequence..................................................................89 Power-up Timer and Brown-out Resets.................................................................................83 Reset Requirements.........................................287 Simple OC/PWM Mode Requirements.....................291 S Timer1 External Clock Requirements.......................288 Serial Peripheral Interface (SPI).......................................181 Timer2, Timer4, Timer6 and Timer8 External Software Simulator (MPLAB SIM).....................................269 Clock Requirements.........................................289 Software Stack Pointer, Frame Pointer Timer3, Timer5, Timer7 and Timer9 External CALLL Stack Frame....................................................67 Clock Requirements.........................................289 Special Features of the CPU.............................................251 U SPI Module SPI1 Register Map......................................................54 UART Module SPI2 Register Map......................................................54 UART1 Register Map..................................................54 Symbols Used in Opcode Descriptions.............................260 UART2 Register Map..................................................54 System Control V Register Map...............................................................66 Voltage Regulator (On-Chip)............................................256 T W Temperature and Voltage Specifications AC.....................................................................282, 325 Watchdog Timer (WDT)............................................251, 257 Timer1...............................................................................167 Programming Considerations...................................257 Timer2/3, Timer4/5, Timer6/7 and Timer8/9.....................169 WWW Address.................................................................357 Timing Characteristics WWW, On-Line Support.....................................................16 CLKO and I/O...........................................................285 Timing Diagrams 10-bit A/D Conversion (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000).........................317 10-bit A/D Conversion (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001).......................................319 DS70593D-page 356 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at Users of Microchip products can receive assistance www.microchip.com. This web site is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the web site contains the following • Field Application Engineer (FAE) information: • Technical Support • Product Support – Data sheets and errata, • Development Systems Information Line application notes and sample programs, design resources, user’s guides and hardware support Customers should contact their distributor, documents, latest software releases and archived representative or field application engineer (FAE) for software support. Local sales offices are also available to help • General Technical Support – Frequently Asked customers. A listing of sales offices and locations is Questions (FAQs), technical support requests, included in the back of this document. online discussion groups, Microchip consultant Technical support is available through the web site program member listing at: http://microchip.com/support • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2009-2012 Microchip Technology Inc. DS70593D-page 357
dsPIC33FJXXXGPX06A/X08A/X10A READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480)792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager Total Pages Sent ________ RE: Reader Response From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: dsPIC33FJXXXGPX06A/X08A/X10A Literature Number: DS70593D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70593D-page 358 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. dsPIC 33 FJ 256 GP7 10 A T I / PT - XXX Examples: a) dsPIC33FJ256GP710AI/PT: Microchip Trademark General-purpose dsPIC33, 64KB program memory, 100-pin, Industrial temp., Architecture TQFP package. Flash Memory Family Program Memory Size (KB) Product Group Pin Count Revision Level Tape and Reel Flag (if applicable) Temperature Range Package Pattern Architecture: 33 = 16-bit Digital Signal Controller Flash Memory Family: FJ = Flash program memory, 3.3V Product Group: GP2 = General purpose family GP3 = General purpose family GP5 = General purpose family GP7 = General purpose family Pin Count: 06 = 64-pin 08 = 80-pin 10 = 100-pin Temperature Range: I = -40C to+85C(Industrial) E = -40C to+125C(Extended) H = -40C to+150C(High) Package: PT = 10x10 or 12x12 mm TQFP (Thin Quad Flatpack) PF = 14x14 mm TQFP (Thin Quad Flatpack) MR = 9x9mm QFN (Plastic Quad Flatpack) Pattern Three-digit QTP, SQTP, Code or Special Requirements (blank otherwise) ES = Engineering Sample 2009-2012 Microchip Technology Inc. DS70593D-page 359
dsPIC33FJXXXGPX06A/X08A/X10A NOTES: DS70593D-page 360 2009-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, ensure that your application meets with your specifications. PIC32 logo, rfPIC and UNI/O are registered trademarks of MICROCHIP MAKES NO REPRESENTATIONS OR Microchip Technology Incorporated in the U.S.A. and other WARRANTIES OF ANY KIND WHETHER EXPRESS OR countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MXDEV, MXLAB, SEEVAL and The Embedded Control QUALITY, PERFORMANCE, MERCHANTABILITY OR Solutions Company are registered trademarks of Microchip FITNESS FOR PURPOSE. Microchip disclaims all liability Technology Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Analog-for-the-Digital Age, Application Maestro, chipKIT, devices in life support and/or safety applications is entirely at chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, the buyer’s risk, and the buyer agrees to defend, indemnify and dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, hold harmless Microchip from any and all damages, claims, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, suits, or expenses resulting from such use. No licenses are Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, conveyed, implicitly or otherwise, under any Microchip MPLINK, mTouch, Omniscient Code Generation, PICC, intellectual property rights. PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62076-344-5 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2009-2012 Microchip Technology Inc. DS70593D-page 361
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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrochip: dsPIC33FJ256GP506A-I/MR DSPIC33FJ128GP206A-E/MR DSPIC33FJ128GP306A-E/MR DSPIC33FJ128GP706A- E/MR DSPIC33FJ64GP306A-E/MR DSPIC33FJ64GP306AT-I/MR DSPIC33FJ128GP206A-E/PT DSPIC33FJ128GP306A-E/PT DSPIC33FJ128GP306A-I/PT DSPIC33FJ128GP310A-E/PT DSPIC33FJ128GP310A- I/PF DSPIC33FJ128GP310A-I/PT DSPIC33FJ128GP708A-I/PT DSPIC33FJ128GP710A-E/PF DSPIC33FJ128GP710A-I/PF DSPIC33FJ128GP710A-I/PT DSPIC33FJ256GP506A-E/PT DSPIC33FJ256GP506A-I/PT DSPIC33FJ256GP506AT-I/PT DSPIC33FJ256GP510A-E/PF DSPIC33FJ256GP510A-E/PT DSPIC33FJ256GP510A- I/PF DSPIC33FJ256GP510A-I/PT DSPIC33FJ256GP510AT-I/PF DSPIC33FJ256GP510AT-I/PT DSPIC33FJ256GP710A-E/PF DSPIC33FJ256GP710A-E/PT DSPIC33FJ256GP710A-I/PF DSPIC33FJ256GP710A- I/PT DSPIC33FJ256GP710AT-I/PF DSPIC33FJ256GP710AT-I/PT DSPIC33FJ64GP206A-E/PT DSPIC33FJ64GP206A-I/PT DSPIC33FJ64GP206AT-I/PT DSPIC33FJ64GP306A-E/PT DSPIC33FJ64GP306A-I/PT DSPIC33FJ64GP306AT-I/PT DSPIC33FJ64GP310A-E/PF DSPIC33FJ64GP310A-E/PT DSPIC33FJ64GP310A-I/PF DSPIC33FJ64GP310A-I/PT DSPIC33FJ64GP310AT-I/PF DSPIC33FJ64GP310AT-I/PT DSPIC33FJ64GP706A-E/PT DSPIC33FJ64GP706A-I/PT DSPIC33FJ64GP706AT-I/PT DSPIC33FJ64GP708A-E/PT DSPIC33FJ64GP708A-I/PT DSPIC33FJ64GP708AT-I/PT DSPIC33FJ64GP710A-E/PF DSPIC33FJ64GP710A-E/PT DSPIC33FJ64GP710A-I/PF DSPIC33FJ64GP710A-I/PT DSPIC33FJ64GP710AT-I/PF DSPIC33FJ64GP710AT-I/PT DSPIC33FJ128GP206A-I/MR DSPIC33FJ128GP306A-I/MR DSPIC33FJ128GP706A-I/MR DSPIC33FJ64GP206A-I/MR DSPIC33FJ64GP306A- I/MR DSPIC33FJ64GP706A-I/MR DSPIC33FJ128GP706A-H/MR DSPIC33FJ128GP706A-H/PT DSPIC33FJ128GP710A-H/PF DSPIC33FJ128GP710A-H/PT DSPIC33FJ256GP710A-H/PF DSPIC33FJ256GP710A- H/PT DSPIC33FJ128GP206AT-I/MR DSPIC33FJ128GP306AT-I/MR DSPIC33FJ256GP506A-E/MR DSPIC33FJ128GP206A-I/PT DSPIC33FJ128GP206AT-I/PT DSPIC33FJ128GP306AT-I/PT DSPIC33FJ128GP310A- E/PF DSPIC33FJ128GP310AT-I/PF DSPIC33FJ128GP310AT-I/PT DSPIC33FJ128GP706A-E/PT DSPIC33FJ128GP706AT-I/PT DSPIC33FJ128GP708A-E/PT DSPIC33FJ128GP708AT-I/PT DSPIC33FJ128GP710A- E/PT DSPIC33FJ128GP710AT-I/PF DSPIC33FJ128GP710AT-I/PT DSPIC33FJ128GP706A-I/PT DSPIC33FJ256GP506A-H/MR DSPIC33FJ256GP506A-H/PT DSPIC33FJ64GP706A-E/MR DSPIC33FJ64GP206A- E/MR DSPIC33FJ128GP706AT-I/MR DSPIC33FJ64GP706AT-I/MR DSPIC33FJ64GP206AT-I/MR DSPIC33FJ256GP506A-I/MR DSPIC33FJ256GP506AT-I/MR