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DS3695AMX/NOPB产品简介:
ICGOO电子元器件商城为您提供DS3695AMX/NOPB由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 DS3695AMX/NOPB价格参考。Texas InstrumentsDS3695AMX/NOPB封装/规格:接口 - 驱动器,接收器,收发器, 1/1 Transceiver Half RS422, RS485 8-SOIC。您可以下载DS3695AMX/NOPB参考资料、Datasheet数据手册功能说明书,资料中有DS3695AMX/NOPB 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
描述 | IC TXRX MULT PT RS485/422 8SOICRS-422/RS-485 接口 IC QUAD DIFF BUS XCVR |
Duplex | Half Duplex |
产品分类 | |
品牌 | Texas Instruments |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 接口 IC,RS-422/RS-485 接口 IC,Texas Instruments DS3695AMX/NOPB- |
数据手册 | |
产品型号 | DS3695AMX/NOPB |
产品种类 | RS-422/RS-485 接口 IC |
供应商器件封装 | 8-SOIC |
关闭 | Yes |
其它名称 | DS3695AMX/NOPBDKR |
功能 | Transceiver |
包装 | Digi-Reel® |
协议 | RS422,RS485 |
双工 | 半 |
商标 | Texas Instruments |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | 8-SOIC(0.154",3.90mm 宽) |
封装/箱体 | SOIC-8 |
工作温度 | 0°C ~ 70°C |
工作温度范围 | 0 C to + 70 C |
工作电源电压 | 5 V |
工厂包装数量 | 2500 |
接收器滞后 | 70mV |
接收机数量 | 1 Receiver |
数据速率 | - |
最大工作温度 | + 70 C |
最小工作温度 | 0 C |
标准包装 | 1 |
激励器数量 | 1 Driver |
电压-电源 | 4.75 V ~ 5.25 V |
电源电流 | 0.5 mA |
类型 | 收发器 |
系列 | DS3695A |
驱动器/接收器数 | 1/1 |
DS3695A, DS3695AT, DS3696A www.ti.com SNLS353C–FEBRUARY1996–REVISEDAPRIL2013 DS3695A/DS3695AT/DS3696A Multipoint RS485/RS422 Transceivers CheckforSamples:DS3695A,DS3695AT,DS3696A FEATURES DESCRIPTION 1 • MeetsEIAStandardRS485forMultipointBus The DS3695A and DS3696A are high speed 2 differential TRI-STATE bus/line transceivers designed TransmissionandisCompatiblewithRS-422 to meet the requirements of EIA standard RS485 with • 10NsDriverPropagationDelays(Typical) extended common mode range (+12V to −7V), for • Single+5VSupply multipoint data transmission. In addition they are • −7Vto+12VBusCommonModeRange compatiblewithrequirementsofRS-422. Permits±7VGroundDifferencebetween The driver and receiver outputs feature TRI-STATE DevicesontheBus capability. The driver outputs remain in over the • ThermalShutdownProtection entire common mode range of +12V to −7V. Bus faults that cause excessive power dissipation within • HighImpedancetoBuswithDriverinTRI- the device trigger a thermal shutdown circuit, which STATEorwithPowerOff,overtheEntire forces the driver outputs into the high impedance CommonModeRangeAllowstheUnused state. The DS3696A provides an output pin (TS) DevicesontheBustobePoweredDown which reports the thermal shutdown of the device. TS • CombinedImpedanceofaDriverOutputand is an “open collector” pin with an internal 10 kΩ pull- ReceiverInputislessthanOneRS485Unit up resistor. This allows the TS outputs of several devicestobewireOR-ed. Load,Allowingupto32Transceiversonthe Bus Both AC and DC specifications are guaranteed over • 70mVTypicalReceiverHysteresis the 0°C to 70°C temperature and 4.75V to 5.25V supplyvoltagerange. • AvailableinSOICPackaging Connection and Logic Diagrams Figure1.MoldedPackage,SmallOutline(D0008A) Figure2.TopView TopView (SeePackageNumberD0008A) TSwasLF(LineFault)onpreviousdatasheets,TSgoeslowuponthermalshutdown. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1996–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.
DS3695A, DS3695AT, DS3696A SNLS353C–FEBRUARY1996–REVISEDAPRIL2013 www.ti.com Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. Absolute Maximum Ratings (1)(2) SupplyVoltage,V 7V CC ControlInputVoltages 7V DriverInputVoltage 7V DriverOutputVoltages +15V/−10V ReceiverInputVoltages +15V/−10V ReceiverOutputVoltage 5.5V ContinuousPowerDissipation@25°C D0008APackage 630mW (3) StorageTemp.Range −65°Cto+150°C LeadTemp.(Soldering4seconds) 260°C (1) “Absolutemaximumratings”arethosebeyondwhichthesafetyofthedevicecannotbeverified.Theyarenotmeanttoimplythatthe deviceshouldbeoperatedattheselimits.Thetablesof“ElectricalCharacteristics”provideconditionsforactualdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexasInstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Deratelinearlyat6.5mW/°Cto337mWat70°C. Recommended Operating Conditions Min Max Units SupplyVoltage,V 4.75 5.25 V CC BusVoltage −7 +12 V OperatingFreeAirTemperature(T ) A Commercial(DS3695AM) 0 +70 °C Industrial(DS3695ATM) −40 +85 °C Commercial(DS3696AM) 0 +70 °C Electrical Characteristics (1) (2) 0°C≤T ≤70°C,4.75V<V <5.25Vunlessotherwisespecified A CC Parameter TestConditions Min Typ Max Units V DifferentialDriverOutputVoltage(Unloaded) I =0 5 V OD1 O V DifferentialDriverOutputVoltage(withLoad) R=50Ω;(RS-422) (3) 2 V OD2 R=27Ω;(RS-485) 1.5 V ΔV ComplementaryOutputStates R=27Ω 0.2 V OD DifferentialOutputVoltageFor ChangeinMagnitudeofDriver V DriverCommonModeOutputVoltage 3.0 V OC Δ|V | ChangeinMagnitudeofDriver 0.2 V OC CommonModeOutputVoltage ForComplementaryOutputStates V InputHighVoltage DI,DE,RE, 2 V IH RE/DE V InputLowVoltage 0.8 V IL V InputClampVoltage I =−18mA −1.5 V CL IN I InputLowCurrent V =0.4V −200 μA IL IL I InputHighCurrent V =2.4V 20 μA IH IH (1) Allcurrentsintodevicepinsarepositive;allcurrentsoutofdevicepinsarenegative.Allvoltagesarereferencedtodevicegroundunless otherwisespecified. (2) AlltypicalsaregivenforV =5VandT =25°C. CC A (3) Alllimitsforwhichthisnoteisappliedmustbederatedby10%forDS3695AT.Otherparametersremainthesameforthisextended temperaturerangedevice(−40°C≤T ≤+85°C). A 2 SubmitDocumentationFeedback Copyright©1996–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A www.ti.com SNLS353C–FEBRUARY1996–REVISEDAPRIL2013 Electrical Characteristics (1) (2) (continued) 0°C≤T ≤70°C,4.75V<V <5.25Vunlessotherwisespecified A CC Parameter TestConditions Min Typ Max Units I InputCurrent RI,RI,DO/RI, V =0Vor5.25V, V =12V +1.0 mA IN CC IN DO/RI DEorRE/DE=0V V =−7V −0.8 mA IN V DifferentialInputThresholdVoltageforReceiver −7V≤V ≤+12V −0.2 +0.2 V TH CM ΔV ReceiverInputHysteresis V =0V 70 mV TH CM V ReceiverOutputHighVoltage I =−400μA 2.4 V OH OH V OutputLowVoltage RO I =16mA (3) 0.5 V OL OL TS I =8mA 0.45 V OL I OutputCurrentatReceiverOFF-State(High 0.4V≤V ≤2.4V,V =Max, OZR O CC ±20 μA Impedance) R ReceiverInputResistance −7V≤V ≤+12V 12 kΩ IN CM I SupplyCurrent DriverOutputs 42 60 mA CC Enabled NoLoad(3) DriverOutputs 27 40 mA Disabled I V =−7V (3) −250 mA OSD O OutputCurrentDriverShort-Circuit V =+12V (3) +250 mA O I OutputCurrentReceiverShort-Circuit V =0V −15 −85 mA OSR O Receiver Switching Characteristics 0°C≤T ≤70°C,4.75V<V <5.25Vunlessotherwisespecified (4) A CC Symbol TestConditions Min Typ Max Units t C =15pF 15 28 42 ns PLH L t S1andS2 15 28 42 ns PHL |t –t | Closed 0 3 ns PLH PHL t C =15pF,S2Open 5 29 35 ns PLZ L t C =15pF,S1Open 5 12 16 ns PHZ L t C =15pF,S2Open 7 15 28 ns PZL L t C =15pF,S1Open 7 15 20 ns PZH L (4) AlltypicalsaregivenforV =5VandT =25°C. CC A Driver Switching Characteristics 0°C≤T ≤70°C,4.75V<V <5.25Vunlessotherwisespecified (1) A CC Symbol TestConditions Min Typ Max Units SINGLEENDEDCHARACTERISTICS(Figure7,Figure8,andFigure10) t R =60Ω 9 15 22 ns PLH LDIFF t C =C =100pF 9 15 22 ns PHL L1 L2 t |t –t | 0 2 8 ns SKEW PLH PHL t C =15pF,S2Open 7 15 30 ns PLZ L t C =15pF,S1Open 7 15 30 ns PHZ L t C =100pF,S2Open 30 35 50 ns PZL L t C =100pF,S1Open 30 35 50 ns PZH L DIFFERENTIALSWITCHINGCHARACTERISTICS(Figure10) t,t R =60Ω r f LDIFF 6 10 18 ns C =C =100pF L1 L2 (1) AlltypicalsaregivenforV =5VandT =25°C. CC A Copyright©1996–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A SNLS353C–FEBRUARY1996–REVISEDAPRIL2013 www.ti.com AC TEST CIRCUITS AND SWITCHING WAVEFORMS Figure3. ReceiverPropagationDelayTestCircuit DifferentialinputvoltagemayberealizedbygroundingRIandpulsingRIbetween+2.5Vand−2.5V Figure4. ReceiverInput-to-OutputPropagationDelayTiming Figure5. ReceiverEnable/DisablePropagationDelayTiming Figure6. UnlessOtherwiseSpecifiedtheSwitchesareClosed 4 SubmitDocumentationFeedback Copyright©1996–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A www.ti.com SNLS353C–FEBRUARY1996–REVISEDAPRIL2013 Figure7. DriverPropagationDelayTestCircuits t andt aremeasuredtotherespective50%points.t isthedifferencebetweenpropagationdelaysofthe PLH PHL SKEW complementaryoutputs. Figure8. DriverInput-to-OutputPropagationDelayTiming(Single-Ended) Figure9. DriverEnable/DisablePropagationDelayTiming Figure10. DriverDifferentialTransitionTiming Copyright©1996–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A SNLS353C–FEBRUARY1996–REVISEDAPRIL2013 www.ti.com Table1.FunctionTablesDS3695A/DS3696ATransmitting(1) Inputs Line Outputs RE DE DI Condition DO DO TS*(DS3696AOnly) X 1 1 NoFault 0 1 H X 1 0 NoFault 1 0 H X 0 X X Z Z H X 1 X Fault Z Z L Table2.FunctionTablesDS3695A/DS3696AReceiving(1) Inputs Outputs RE DE RI–RI RO TS*(DS3696AOnly) 0 0 ≥+0.2V 1 H 0 0 ≤−0.2V 0 H 0 0 InputsOpen** 1 H 1 0 X Z H (1) X—Don'tcarecondition Z—Highimpedancestate Fault—Improperlineconditionscausingexcessivepowerdissipationinthedriver,suchasshortsorbuscontentionsituations *TSisan“opencollector”outputwithanon-chip10kΩpull-upresistor. **Thisisafailsafecondition (1) X—Don'tcarecondition Z—Highimpedancestate Fault—Improperlineconditionscausingexcessivepowerdissipationinthedriver,suchasshortsorbuscontentionsituations *TSisan“opencollector”outputwithanon-chip10kΩpull-upresistor. **Thisisafailsafecondition Typical Application Repeatercontrollogicnotshown. Figure11. 6 SubmitDocumentationFeedback Copyright©1996–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A www.ti.com SNLS353C–FEBRUARY1996–REVISEDAPRIL2013 REVISION HISTORY ChangesfromRevisionB(April2013)toRevisionC Page • ChangedlayoutofNationalDataSheettoTIformat............................................................................................................ 6 Copyright©1996–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS3695A DS3695AT DS3696A
PACKAGE OPTION ADDENDUM www.ti.com 2-Oct-2018 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) DS3695AM/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 DS36 & no Sb/Br) 95AM DS3695AMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 DS36 & no Sb/Br) 95AM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE OPTION ADDENDUM www.ti.com 2-Oct-2018 Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) DS3695AMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 PackMaterials-Page1
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) DS3695AMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PackMaterials-Page2
PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com
EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com
EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com
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