DS26LV32AT www.ti.com SNLS128C–APRIL1999–REVISEDFEBRUARY2013 DS26LV32AT 3V Enhanced CMOS Quad Differential Line Receiver CheckforSamples:DS26LV32AT FEATURES • AvailableinSOICandCLGAPackaging 1 • LowPowerCMOSDesign(30mWtypical) • StandardMicrocircuitDrawing(SMD)5962- 2 98585 • InteroperablewithExisting5VRS-422 Networks DESCRIPTION • IndustrialandMilitaryTemperatureRange The DS26LV32A is a high speed quad differential • ConformstoTIA/EIA-422-B(RS-422)andITU-T CMOS receiver that meets the requirements of both V.11Recommendation TIA/EIA-422-B and ITU-T V.11. The CMOS • 3.3VOperation DS26LV32AT features typical low static I of 9 mA CC which makes it ideal for battery powered and power • ±7VCommonModeRange@V =3V ID conscious applications. The TRI-STATE enables, EN • ±10VCommonModeRange@V =0.2V ID and EN*, allow the device to be active High or active • ReceiverOPENInputFailsafeFeature Low.Theenablesarecommontoallfourreceivers. • GuaranteedACParameter: The receiver output (RO) is guaranteed to be High – MaximumReceiverSkew: 4ns when the inputs are left open. The receiver can detect signals as low as ±200 mV over the common – MaximumTransitionTime: 10ns mode range of ±10V. The receiver outputs (RO) are • PinCompatiblewithDS26C32AT compatiblewithTTLandLVCMOSlevels. • 32MHzToggleFrequency • >6.5kESDTolerance(HBM) Connection Diagram TopView Figure1. SOICPackage SeePackageNumbersD0016AorNAD0016A 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1999–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

DS26LV32AT SNLS128C–APRIL1999–REVISEDFEBRUARY2013 www.ti.com Truth Table(1) Enables Inputs Output EN EN* RI+–RI− RO L H X Z Allother V ≥+0.2V H ID combinationsof V ≤−0.2V L enableinputs ID Open(2) H (1) L=LogicLow H=LogicHigh X=Irrelevant Z=TRI-STATE (2) Open,notterminated Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. Absolute Maximum Ratings(1)(2) SupplyVoltage(V ) −0.5Vto+7V CC EnableInputVoltage(EN,EN*) −0.5VtoV +0.5V CC ReceiverInputVoltage(V :RI+,RI−) ±14V ID ReceiverInputVoltage (VCM:RI+,RI−) ±14V ReceiverOutputVoltage(RO) −0.5VtoV +0.5V CC ReceiverOutputCurrent(RO) ±25mAMaximum MaximumPackagePowerDissipation@+25°C D0016APackage 1190mW NAD0016APackage 1087mW DerateD0016APackage9.8mW/°Cabove+25°C DerateNAD0016APackage7.3mW/°Cabove+25°C StorageTemperatureRange −65°Cto+150°C LeadTemperatureRangeSoldering (4Sec.) +260°C ESDRatings(HBM,1.5kΩ,100pF) ReceiverInputsandEnables ≥6.5kV OtherPins ≥2kV (1) “AbsoluteMaximumratings”arethosevaluesbeyondwhichthesafetyofthedevicecannotbeguaranteed.Theyarenotmeanttoimply thatthedevicesshouldbeoperatedattheselimits.TheElectricalCharacteristicsspecifiesconditionsofdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityandspecifications. Recommended Operating Conditions Min Typ Max Units SupplyVoltage(V ) 3.0 3.3 3.6 V CC OperatingFreeAirTemperatureRange(T ) A DS26LV32AT −40 +25 +85 °C DS26LV32AW −55 +25 +125 °C 2 SubmitDocumentationFeedback Copyright©1999–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LV32AT

DS26LV32AT www.ti.com SNLS128C–APRIL1999–REVISEDFEBRUARY2013 Electrical Characteristics (1) (2) OverSupplyVoltageandOperatingTemperatureranges,unlessotherwisespecified. Parameter TestConditions Pin Min Typ Max Units V DifferentialInputThreshold V =V orV V =−7Vto+7V, −200 ±17.5 +200 mV TH OUT OH OL CM T =-40°Cto A +85°C RI+, V =−0.5Vto -200 +200 mV CM RI− +5.5V,T =-55°C A to+125°C(3) V Hysteresis V =1.5V 35 mV HY CM V MinimumHighLevelInput IH 2.0 V Voltage EN, V MaximumLowLevelInput EN* IL 0.8 V Voltage R InputResistance V =−7V,+7V,T =-40°Cto+85°C IN IN A 5.0 8.5 kΩ (OtherInput=GND) V =−0.5V,+5.5V,T =-55°Cto+125°C 5.0 kΩ IN A (OtherInput=GND) (3) I InputCurrent V =+10V T =-40°Cto 0 1.1 1.8 mA IN IN A +85°C (OtherInput=0V, V =+3V RI+, 0 0.27 mA IN RI− PowerOn,or V =0.5V −0.02 mA IN V =0V) V =−3V 0 −0.43 mA CC IN V =−10V 0 −1.26 −2.2 mA IN V =−0.5V T =-55°Cto 0 -1.8 mA IN A +125°C (3) V =5.5V 0 1.8 mA IN I InputCurrent V =0VtoV EN, ±1 μA EN IN CC EN* V HighLevelOutputVoltage I =−6mA,V =+1V OH OH ID 2.4 3 V I =−6mA,V =OPEN OH ID V HighLevelOutputVoltage I =−100μA,V =+1V OH OH ID V −0.1 V CC I =−100μA,V =OPEN OH ID RO V LowLevelOutputVoltage I =+6mA,V =−1V 0.13 0.5 V OL OL ID I OutputTRI-STATELeakage V =V orGND OZ OUT CC Current ±50 μA EN=V ,EN*=V IL IH I OutputShortCircuitCurrent V =0V,V ≥|200mV| (4) −10 −35 −70 mA SC O ID I PowerSupplyCurrent NoLoad,AllRI+, T =-40°Cto V 9 15 mA CC A CC R1−=OPEN,EN, +85°C EN*=V orGND CC T =-55°Cto 20 mA A +125°C (1) Currentintodevicepinsisdefinedaspositive.Currentoutofdevicepinsisdefinedasnegative.Allvoltagesarereferencedtoground exceptV . ID (2) Alltypicalsaregivenfor:V =+3.3V,T =+25°C. CC A (3) ThisparameterdoesnotmeettheTIA/EIA-422-Bspecification. (4) Shortoneoutputatatimetoground.Donotexceedpackage. Copyright©1999–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS26LV32AT

DS26LV32AT SNLS128C–APRIL1999–REVISEDFEBRUARY2013 www.ti.com Switching Characteristics - Industrial (1) (2) OverSupplyVoltageand-40°Cto+85°COperatingTemperaturerange,unlessotherwisespecified. Parameter TestConditions Min Typ Max Units t PropagationDelayHightoLow C =15pF,V =1.5V(Figure2andFigure3) 6 17.5 35 ns PHL L CM t PropagationDelayLowtoHigh 6 17.8 35 ns PLH t RiseTime(20%to80%) 4.1 10 ns r t FallTime(80%to20%) 3.3 10 ns f t DisableTime C =50pF,V =1.5V(Figure4andFigure5) 40 ns PHZ L CM t DisableTime 40 ns PLZ t EnableTime 40 ns PZH t EnableTime 40 ns PZL t Skew,|t −t | (3) C =15pF,V =1.5V 0.3 4 ns SK1 PHL PLH L CM t Skew,PintoPin (4) 0.6 4 ns SK2 t Skew,ParttoPart (2) 7 17 ns SK3 f MaximumOperatingFrequency C =15pF,V =1.5V 32 MHz MAX L CM (5) (1) Alltypicalsaregivenfor:V =+3.3V,T =+25°C. CC A (2) t isthedifferenceinpropagationdelaytimesbetweenanychannelsofanydevices.Thisspecification(maximumlimit)appliesto SK3 deviceswithinV ±0.1Vofoneanother,andaDeltaT =±5°C(betweendevices)withintheoperatingtemperaturerange.This CC A parameterisguaranteedbydesignandcharacterization. (3) t isthe|t –t |ofachannel. SK1 PHL PLH (4) t isthemaximumskewbetweenanytwochannelswithinadevice,eitheredge. SK2 (5) Allchannelsswitching,OutputDutyCyclecriteriais40%/60%measuredat50%.Input=1Vto2V,50%DutyCycle,t/t ≤5ns.This r f parameterisguaranteedbydesignandcharacterization. Switching Characteristics - Military OverSupplyVoltageand-55°Cto+125°COperatingTemperaturerange,unlessotherwisespecified. Parameter TestConditions Min Max Units t PropagationDelayHightoLow C =50pF,V =1.5V(Figure2andFigure3) 6 45 ns PHL L CM t PropagationDelayLowtoHigh 6 45 ns PLH t DisableTime C =50pF,V =1.5V(Figure4andFigure5) 50 ns PHZ L CM t DisableTime 50 ns PLZ t EnableTime 50 ns PZH t EnableTime 50 ns PZL t Skew,|t −t | (1) C =50pF,V =1.5V 6 ns SK1 PHL PLH L CM t Skew,PintoPin (2) 6 ns SK2 (1) t isthe|t –t |ofachannel. SK1 PHL PLH (2) t isthemaximumskewbetweenanytwochannelswithinadevice,eitheredge. SK2 4 SubmitDocumentationFeedback Copyright©1999–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LV32AT

DS26LV32AT www.ti.com SNLS128C–APRIL1999–REVISEDFEBRUARY2013 PARAMETER MEASUREMENT INFORMATION A. Generatorwaveformforalltestsunlessotherwisespecified:f=1MHz,DutyCycle=50%,Z =50Ω,t ≤10ns,t ≤ O r f 10ns. B. C includesprobeandjigcapacitance. L Figure2. ReceiverPropagationDelayandTransitionTimeTestCircuit A. Generatorwaveformforalltestsunlessotherwisespecified:f=1MHz,DutyCycle=50%,Z =50Ω,t ≤10ns,t ≤ O r f 10ns. B. C includesprobeandjigcapacitance. L C. Formilitarygradeproduct,t ≤6nsandt ≤6ns. r f D. Formilitarygradeproductthemeasurepointis1/2V fort ,t ,t ,andt . CC PLH PHL PZL PZH Figure3. ReceiverPropagationDelayandTransitionTimeWaveform Figure4. ReceiverTRI-STATETestCircuit Copyright©1999–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS26LV32AT

DS26LV32AT SNLS128C–APRIL1999–REVISEDFEBRUARY2013 www.ti.com A. Generatorwaveformforalltestsunlessotherwisespecified:f=1MHz,DutyCycle=50%,Z =50Ω,t ≤10ns,t ≤ O r f 10ns. B. C includesprobeandjigcapacitance. L C. Formilitarygradeproduct,t ≤6nsandt ≤6ns. r f D. Formilitarygradeproductthemeasurepointis1/2V fort ,t ,t ,andt . CC PLH PHL PZL PZH Figure5. ReceiverTRI-STATEOutputEnableandDisableWaveforms 6 SubmitDocumentationFeedback Copyright©1999–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LV32AT

DS26LV32AT www.ti.com SNLS128C–APRIL1999–REVISEDFEBRUARY2013 TYPICAL APPLICATION INFORMATION General application guidelines and hints for differential drivers and receivers may be found in the following applicationnotes: • AN-214 • AN-457 • AN-805 • AN-847 • AN-903 • AN-912 • AN-916 PowerDecouplingRecommendations: Bypass caps must be used on power pins. High frequency ceramic (surface mount is recommended) 0.1 μF in parallel with 0.01 μF at the power supply pin. A 10 μF or greater solid tantalum or electrolytic should be connectedatthepowerentrypointontheprintedcircuitboard. R isoptionalalthoughhighlyrecommendedtoreducereflection T Figure6. TypicalReceiverConnections Figure7. TypicalReceiverOutputWaveforms Copyright©1999–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS26LV32AT

DS26LV32AT SNLS128C–APRIL1999–REVISEDFEBRUARY2013 www.ti.com Figure8. TypicalReceiverInputCircuit Figure9. TypicalI vsFrequency CC Figure10. ReceiverI vsV (PowerOnorPowerOff) IN IN 8 SubmitDocumentationFeedback Copyright©1999–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LV32AT

DS26LV32AT www.ti.com SNLS128C–APRIL1999–REVISEDFEBRUARY2013 Figure11. I vsV OL OL Figure12. I vsV OH OH Copyright©1999–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS26LV32AT

DS26LV32AT SNLS128C–APRIL1999–REVISEDFEBRUARY2013 www.ti.com REVISION HISTORY ChangesfromRevisionB(February2013)toRevisionC Page • ChangedlayoutofNationalDataSheettoTIformat............................................................................................................ 9 10 SubmitDocumentationFeedback Copyright©1999–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LV32AT

PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) DS26LV32ATM LIFEBUY SOIC D 16 48 TBD Call TI Call TI -40 to 85 DS26LV32A TM DS26LV32ATM/NOPB ACTIVE SOIC D 16 48 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 DS26LV32A & no Sb/Br) TM DS26LV32ATMX LIFEBUY SOIC D 16 2500 TBD Call TI Call TI -40 to 85 DS26LV32A TM DS26LV32ATMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 DS26LV32A & no Sb/Br) TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) DS26LV32ATMX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) DS26LV32ATMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 PackMaterials-Page2

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