ICGOO在线商城 > 集成电路(IC) > 接口 - 驱动器,接收器,收发器 > DS26LS31CMX/NOPB
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DS26LS31CMX/NOPB产品简介:
ICGOO电子元器件商城为您提供DS26LS31CMX/NOPB由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 DS26LS31CMX/NOPB价格参考¥4.75-¥11.79。Texas InstrumentsDS26LS31CMX/NOPB封装/规格:接口 - 驱动器,接收器,收发器, 4/0 Driver RS422, RS485 16-SOIC。您可以下载DS26LS31CMX/NOPB参考资料、Datasheet数据手册功能说明书,资料中有DS26LS31CMX/NOPB 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
描述 | IC LINE DVR QUAD HI SPD 16-SOICRS-422接口集成电路 Quad High Speed Diff Line Dvrs |
产品分类 | |
品牌 | Texas Instruments |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 接口 IC,RS-422接口集成电路,Texas Instruments DS26LS31CMX/NOPB- |
数据手册 | |
产品型号 | DS26LS31CMX/NOPB |
产品种类 | RS-422接口集成电路 |
供应商器件封装 | 16-SOIC N |
关闭 | No |
其它名称 | DS26LS31CMX/NOPBDKR |
功能 | Driver |
包装 | Digi-Reel® |
协议 | RS422 |
双工 | - |
商标 | Texas Instruments |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | 16-SOIC(0.154",3.90mm 宽) |
封装/箱体 | SOIC-16 |
工作温度 | 0°C ~ 70°C |
工作温度范围 | 0 C to + 70 C |
工作电源电压 | 4.75 V to 5.25 V |
工厂包装数量 | 2500 |
接收器滞后 | - |
接收机数量 | 0 |
数据速率 | 10 Mbps |
最大工作温度 | + 70 C |
最小工作温度 | 0 C |
标准包装 | 1 |
激励器数量 | 4 |
电压-电源 | 4.5 V ~ 5.5 V |
电源电流 | 35 mA |
类型 | 驱动器 |
系列 | DS26LS31C |
驱动器/接收器数 | 4/0 |
DS26LS31C, DS26LS31M www.ti.com SNOSBK1C–JUNE1998–REVISEDAPRIL2013 DS26LS31C/DS26LS31M Quad High Speed Differential Line Driver CheckforSamples:DS26LS31C,DS26LS31M FEATURES DESCRIPTION 1 • OutputSkew—2.0nsTypical The DS26LS31 is a quad differential line driver 2 designed for digital data transmission over balanced • Inputtooutputdelay—10nsTypical lines. The DS26LS31 meets all the requirements of • OperationfromSingle5VSupply EIA Standard RS-422 and Federal Standard 1020. It • OutputsWon'tLoadLinewhenV =0V is designed to provide unipolar differential drive to CC twisted-pairorparallel-wiretransmissionlines. • FourLineDriversinOnePackagefor MaximumPackageDensity The circuit provides an enable and disable function common to all four drivers. The DS26LS31 features • OutputShort-CircuitProtection TRI-STATE outputs and logically ANDed • ComplementaryOutputs complementary outputs. The inputs are all LS • MeetstheRequirementsofEIAStandardRS- compatibleandarealloneunitload. 422 • PinCompatiblewithAM26LS31 • AvailableinMilitaryandCommercial TemperatureRange Logic and Connection Diagrams TopView ForCompleteMilitaryProductSpecifications,refertotheappropriateSMDorMDS. Figure1. PDIPPackage SeePackageD0016AorNFG0016E SeePackageNumbersNAJ0020A,NFE0016AorNAD0016A 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1998–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.
DS26LS31C, DS26LS31M SNOSBK1C–JUNE1998–REVISEDAPRIL2013 www.ti.com Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. Absolute Maximum Ratings(1)(2) SupplyVoltage 7V InputVoltage 7V OutputVoltage 5.5V OutputVoltage(PowerOFF) −0.25to6V MaximumPowerDissipation (3)at25°C CavityPackage 1509mW NFG0016EPackage 1476mW D0016APackage 1051mW (1) “AbsoluteMaximumRatings”arethosevaluesbeyondwhichthesafetyofthedevicecannotbeverified.Theyarenotmeanttoimply thatthedevicesshouldbeoperatedattheselimits.TheElectricalCharacteristicsprovideconditionsforactualdeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityandspecifications. (3) Deratecavitypackage10.1mW/°Cabove25°C;deratemoldedDIPpackage11.9mW/°Cabove25°C;derateSOpackage8.41mW/°C above25°C. Operating Conditions Min Max Units SupplyVoltage,V CC DS26LS31M 4.5 5.5 V DS26LS31 4.75 5.25 V Temperature,T A DS26LS31M −55 +125 °C DS26LS31 0 +70 °C Electrical Characteristics(1)(2)(3) Parameter TestConditions Min Typ Max Units V OutputHighVoltage I =−20mA 2.5 V OH OH V OutputLowVoltage I =20mA 0.5 V OL OL V InputHighVoltage 2.0 V IH V InputLowVoltage 0.8 V IL I InputLowCurrent V =0.4V −40 −200 μA IL IN I InputHighCurrent V =2.7V 20 μA IH IN I InputReverseCurrent V =7V 0.1 mA I IN I TRI-STATEOutputCurrent V =2.5V 20 μA O O V =0.5V −20 μA O V InputClampVoltage I =−18mA −1.5 V CL IN I OutputShort-CircuitCurrent −30 −150 mA SC I PowerSupplyCurrent AllOutputsDisabledorActive 35 60 mA CC (1) Unlessotherwisespecifiedmin/maxlimitsapplyacrossthe−55°Cto+125°CtemperaturerangefortheDS726LS31Mandacrossthe 0°Cto+70°CrangefortheDS26LS31.AlltypicalsaregivenforV =5VandT =25°C. CC A (2) Allcurrentsintodevicepinsarepositive;allcurrentsoutofdevicepinsarenegative.Allvoltagesarereferencedtogroundunless otherwisespecified. (3) Onlyoneoutputatatimeshouldbeshorted. 2 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LS31C DS26LS31M
DS26LS31C, DS26LS31M www.ti.com SNOSBK1C–JUNE1998–REVISEDAPRIL2013 Switching Characteristics V =5V,T =25°C CC A Parameter TestConditions Min Typ Max Units t InputtoOutput C =30pF 10 15 ns PLH L t InputtoOutput C =30pF 10 15 ns PHL L Skew OutputtoOutput C =30pF 2.0 6.0 ns L t EnabletoOutput C =10pF,S2Open 15 35 ns LZ L t EnabletoOutput C =10pF,S1Open 15 25 ns HZ L t EnabletoOutput C =30pF,S2Open 20 30 ns ZL L t EnabletoOutput C =30pF,S1Open 20 30 ns ZH L AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS S1andS2ofloadcircuitareclosedexceptwhereshown. Figure2. ACTestCircuit f=1MHz,t ≤15ns,t ≤6ns r f Figure3. PropagationDelays Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS26LS31C DS26LS31M
DS26LS31C, DS26LS31M SNOSBK1C–JUNE1998–REVISEDAPRIL2013 www.ti.com f=1MHz,t ≤15ns,t ≤6ns r f Figure4. EnableandDisableTimes TYPICAL APPLICATIONS R isoptionalalthoughhighlyrecommendedtoreducereflection. T Figure5. Two-WireBalancedSystem,RS-422 4 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LS31C DS26LS31M
DS26LS31C, DS26LS31M www.ti.com SNOSBK1C–JUNE1998–REVISEDAPRIL2013 Typical Performance Characteristics DS26LS31CNUnloadedI C vs DS26LS31I CC Frequency vsV CC vsT vsT A A Figure6. Figure7. DS26LS31CNV DS26LS31CNV OH OL vsI vsI OH OL vsT vsT A A Figure8. Figure9. DS26LS31CNV OD vsI O vsT A Figure10. Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS26LS31C DS26LS31M
DS26LS31C, DS26LS31M SNOSBK1C–JUNE1998–REVISEDAPRIL2013 www.ti.com REVISION HISTORY ChangesfromRevisionB(April2013)toRevisionC Page • ChangedlayoutofNationalDataSheettoTIformat............................................................................................................ 5 6 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS26LS31C DS26LS31M
PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) DS26LS31CM/NOPB ACTIVE SOIC D 16 48 Green (RoHS SN Level-1-260C-UNLIM 0 to 70 DS26LS31CM & no Sb/Br) DS26LS31CMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS SN Level-1-260C-UNLIM 0 to 70 DS26LS31CM & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 1-Oct-2016 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) DS26LS31CMX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 PackMaterials-Page1
PACKAGE MATERIALS INFORMATION www.ti.com 1-Oct-2016 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) DS26LS31CMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 PackMaterials-Page2
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