DS25CP152 www.ti.com SNLS274D–JANUARY2008–REVISEDAPRIL2013 DS25CP152 3.125 Gbps LVDS 2x2 Crosspoint Switch CheckforSamples:DS25CP152 FEATURES DESCRIPTION 1 • DC-3.125GbpsLowJitter,LowSkew,Low The DS25CP152 is a 3.125 Gbps 2x2 LVDS 2 crosspoint switch optimized for high-speed signal PowerOperation routing and switching over lossy FR-4 printed circuit • PinConfigurable,FullyDifferential,Non- board backplanes and balanced cables. Fully BlockingArchitecture differential signal paths ensure exceptional signal • On-Chip100Ω InputandOutputTerminations integrity and noise immunity. The non-blocking MinimizeReturnLosses,ReduceComponent architecture allows connections of any input to any CountandMinimizeBoardSpace outputoroutputs. • 8kVESDonLVDSI/OPinsProtectsAdjoining Wide input common mode range allows the switch to Components accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package • Small4mmx4mmWQFN-16SpaceSaving footprint requires a minimal space on the board while Package the flow-through pinout allows easy board layout. Each differential input and output is internally APPLICATIONS terminated with a 100Ω resistor to lower device return • High-SpeedChannelselectApplications losses, reduce component count and further minimize boardspace. • ClockandDataBufferingandMuxing • OC-48/STM-16 • SD/HD/3GHDSDIRouters Typical Application INPUT CARD OUTPUT CARD SD/HD/3G HD SD/HD/3G HD BACKPLANES Reclocker + Adaptive Equalizer DS25CP152 DS25CP152 Cable Driver 2x2 LVDS 2x2 LVDS Crosspoint Switch Crosspoint Switch SD/HD/3G HD SD/HD/3G HD Reclocker + Adaptive Equalizer Cable Driver SD/HD/3G HD SD/HD/3G HD Reclocker + Adaptive Equalizer DS25CP152 DS25CP152 Cable Driver 2x2 LVDS 2x2 LVDS Crosspoint Switch Crosspoint Switch SD/HD/3G HD SD/HD/3G HD Reclocker + Adaptive Equalizer Cable Driver Large (e.g. 128x128) Crosspoint Switch CROSSPOINT CARD Figure1. TypicalApplication 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2008–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

DS25CP152 SNLS274D–JANUARY2008–REVISEDAPRIL2013 www.ti.com Block Diagram SEL1 SEL0 EN0 IN0+ OUT0+ IN0- OUT0- 2 X 2 EN1 IN1+ OUT1+ IN1- OUT1- Figure2. BlockDiagram Connection Diagram C 0 1 C C N N V N E E 6 5 4 3 1 1 1 1 IN0+ 1 12 OUT0+ IN0- 2 DAP 11 OUT0- IN1+ 3 (GND) 10 OUT1+ IN1- 4 9 OUT1- 5 6 7 8 D C 0 1 GN N SEL SEL Figure3. DS25CP152PinDiagram PINDESCRIPTIONS Pin PinName I/O,Type PinDescription Number IN0+,IN0-, 1,2, I,LVDS Invertingandnon-invertinghighspeedLVDSinputpins. IN1+,IN1- 3,4 OUT0+,OUT0-, 12,11, O,LVDS Invertingandnon-invertinghighspeedLVDSoutputpins. OUT1+,OUT1- 10,9 SEL0,SEL1 7,8 I,LVCMOS Switchconfigurationpins.Thereisa20kΩpulldownresistoroneachpin. EN0,EN1 14,13 I,LVCMOS Outputenablepins.Thereisa20kΩpulldownresistoroneachpin. NC 6,15 I,LVCMOS "NOCONNECT"pins. VDD 16 Power Powersupplypin. GND 5,DAP Power GroundpinandDeviceAttachPad(DAP)ground. Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 2 SubmitDocumentationFeedback Copyright©2008–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS25CP152

DS25CP152 www.ti.com SNLS274D–JANUARY2008–REVISEDAPRIL2013 Absolute Maximum Ratings(1)(2) SupplyVoltage −0.3Vto+4V LVCMOSInputVoltage −0.3Vto(V +0.3V) CC LVDSInputVoltage −0.3Vto+4V DifferentialInputVoltage|VID| 1.0V LVDSOutputVoltage −0.3Vto(V +0.3V) CC LVDSDifferentialOutputVoltage 0Vto1.0V LVDSOutputShortCircuitCurrentDuration 5ms JunctionTemperature +150°C StorageTemperatureRange −65°Cto+150°C LeadTemperatureRange Soldering(4sec.) +260°C MaximumPackagePowerDissipationat25°C RGH0016APackage 2.99W DerateRGH0016APackage 23.9mW/°Cabove+25°C PackageThermalResistance θ +41.8°C/W JA θ +6.9°C/W JC ESDSusceptibility HBM (3) ≥8kV MM (4) ≥250V CDM (5) ≥1250V (1) “AbsoluteMaximumRatings”indicatelimitsbeyondwhichdamagetothedevicemayoccur,includinginoperabilityanddegradationof devicereliabilityand/orperformance.Functionaloperationofthedeviceand/ornon-degradationattheAbsoluteMaximumRatingsor otherconditionsbeyondthoseindicatedintheRecommendedOperatingConditionsisnotimplied.TheRecommendedOperating Conditionsindicateconditionsatwhichthedeviceisfunctionalandthedeviceshouldnotbeoperatedbeyondsuchconditions. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityandspecifications. (3) HumanBodyModel,applicablestd.JESD22-A114C (4) MachineModel,applicablestd.JESD22-A115-A (5) FieldInducedChargeDeviceModel,applicablestd.JESD22-C101-C Recommended Operating Conditions Min Typ Max Units SupplyVoltage(V ) 3.0 3.3 3.6 V CC ReceiverDifferentialInputVoltage(V ) 0 1 V ID OperatingFreeAirTemperature(T ) −40 +25 +85 °C A DC Electrical Characteristics Overrecommendedoperatingsupplyandtemperaturerangesunlessotherwisespecified.(1) (2) (3) Symbol Parameter Conditions Min Typ Max Units LVCMOSDCSPECIFICATIONS V HighLevelInputVoltage 2.0 V V IH CC V LowLevelInputVoltage GND 0.8 V IL I HighLevelInputCurrent V =3.6V 40 175 250 μA IH IN V =3.6V CC I LowLevelInputCurrent V =GND 0 ±10 μA IL IN V =3.6V CC (1) TheElectricalCharacteristicstableslistensuredspecificationsunderthelistedRecommendedOperatingConditionsexceptas otherwisemodifiedorspecifiedbytheElectricalCharacteristicsConditionsand/orNotes.Typicalspecificationsareestimationsonlyand arenotensured. (2) Currentintodevicepinsisdefinedaspositive.Currentoutofdevicepinsisdefinedasnegative.Allvoltagesarereferencedtoground exceptV andΔV . OD OD (3) TypicalvaluesrepresentmostlikelyparametricnormsforV =+3.3VandT =+25°C,andattheRecommendedOperationConditions CC A atthetimeofproductcharacterizationandarenotensured. Copyright©2008–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS25CP152

DS25CP152 SNLS274D–JANUARY2008–REVISEDAPRIL2013 www.ti.com DC Electrical Characteristics (continued) Overrecommendedoperatingsupplyandtemperaturerangesunlessotherwisespecified.(1)(2)(3) Symbol Parameter Conditions Min Typ Max Units V InputClampVoltage I =−18mA,V =0V −0.9 −1.5 V CL CL CC LVDSINPUTDCSPECIFICATIONS V InputDifferentialVoltage 0 1 V ID V DifferentialInputHighThreshold V =+0.05VorV -0.05V 0 +100 mV TH CM CC V DifferentialInputLowThreshold −100 0 mV TL V CommonModeVoltageRange V =100mV 0.05 V - V CMR ID CC 0.05 V =+3.6Vor0V ±1 ±10 μA I InputCurrent IN IN V =3.6Vor0V CC C InputCapacitance AnyLVDSInputPintoGND 1.7 pF IN R InputTerminationResistor BetweenIN+andIN- 100 Ω IN LVDSOUTPUTDCSPECIFICATIONS V DifferentialOutputVoltage 250 350 450 mV OD ΔVOD ChangeinMagnitudeofVODforComplimentary RL=100Ω -35 35 mV OutputStates V OffsetVoltage 1.05 1.2 1.375 V OS ΔVOS ChangeinMagnitudeofVOSforComplimentary RL=100Ω -35 35 mV OutputStates I OutputShortCircuitCurrent (4) OUTtoGND -35 -55 mA OS OUTtoV 7 55 mA CC C OutputCapacitance AnyLVDSOutputPintoGND 1.2 pF OUT R OutputTerminationResistor BetweenOUT+andOUT- 100 Ω OUT SUPPLYCURRENT I SupplyCurrent EN0=EN1=High 64 77 mA CC I SupplyCurrentwithOutputsDisabled EN0=EN1=Low 23 29 mA CCZ (4) Outputshortcircuitcurrent(I )isspecifiedasmagnitudeonly,minussignindicatesdirectiononly. OS AC Electrical Characteristics Overrecommendedoperatingsupplyandtemperaturerangesunlessotherwisespecified (1) (2) Symbol Parameter Conditions Min Typ Max Units LVDSOUTPUTACSPECIFICATIONS t DifferentialPropagationDelayLowto 340 500 ps PLHD High (3) R =100Ω L t DifferentialPropagationDelayHighto 344 500 ps PHLD Low (3) t PulseSkew|t −t | 4 35 ps SKD1 PLHD PHLD (3) (4) t ChanneltoChannelSkew 12 40 ps SKD2 (3) (5) t ParttoPartSkew 50 150 ps SKD3 (3) (6) (1) TheElectricalCharacteristicstableslistensuredspecificationsunderthelistedRecommendedOperatingConditionsexceptas otherwisemodifiedorspecifiedbytheElectricalCharacteristicsConditionsand/ornotes.Typicalspecificationsareestimationsonlyand arenotensured. (2) TypicalvaluesrepresentmostlikelyparametricnormsforV =+3.3VandT =+25°C,andattheRecommendedOperationConditions CC A atthetimeofproductcharacterizationandarenotensured. (3) Specificationisensuredbycharacterizationandisnottestedinproduction. (4) t ,|t −t |,PulseSkew,isthemagnitudedifferenceindifferentialpropagationdelaytimebetweenthepositivegoingedgeand SKD1 PLHD PHLD thenegativegoingedgeofthesamechannel. (5) t ,ChanneltoChannelSkew,isthedifferenceinpropagationdelay(t ort )amongalloutputchannelsinBroadcastmode SKD2 PLHD PHLD (anyoneinputtoalloutputs). (6) t ,ParttoPartSkew,isdefinedasthedifferencebetweentheminimumandmaximumdifferentialpropagationdelays.This SKD3 specificationappliestodevicesatthesameV andwithin5°Cofeachotherwithintheoperatingtemperaturerange. CC 4 SubmitDocumentationFeedback Copyright©2008–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS25CP152

DS25CP152 www.ti.com SNLS274D–JANUARY2008–REVISEDAPRIL2013 AC Electrical Characteristics (continued) Overrecommendedoperatingsupplyandtemperaturerangesunlessotherwisespecified(1)(2) Symbol Parameter Conditions Min Typ Max Units t RiseTime (3) 65 120 ps LHT R =100Ω t FallTime (3) L 65 120 ps HLT t OutputEnableTime ENn=LHtooutputactive 7 20 μs ON t OutputDisableTime ENn=HLtooutputinactive 5 12 ns OFF t SelectTime SELnLHorHLtooutput 3.5 12 ns SEL JITTERPERFORMANCE (3) t V =350mV 2.5Gbps 0.5 1 ps RJ1 RandomJitter(RMSValue) ID tRJ2 (7) VCCloMck=(1R.2ZV) 3.125Gbps 0.5 1 ps t V =350mV 2.5Gbps 8 25 ps DJ1 DeterministicJitter(PeaktoPeak) ID tDJ2 (8) VKC2M8.5=(1N.2RVZ) 3.125Gbps 3 19 ps t V =350mV 2.5Gbps 0.04 0.08 UI TJ1 TotalJitter(PeaktoPeak) ID P-P tTJ2 (9) VPCRMBS=-12.32V(NRZ) 3.125Gbps 0.03 0.09 UIP-P (7) Measuredonaclockedgewithahistogramandanaccumulationof1500histogramhits.Inputstimulusjitterissubtractedgeometrically. (8) Testedwithacombinationofthe1100000101(K28.5+character)and0011111010(K28.5-character)patterns.Inputstimulusjitteris subtractedalgebraically. (9) Measuredonaneyediagramwithahistogramandanaccumulationof3500histogramhits.Inputstimulusjitterissubtracted. DC Test Circuits VOH IN+ OUT+ Power Supply R D RL Power Supply IN- OUT- VOL Figure4. DifferentialDriverDCTestCircuit AC Test Circuits and Timing Diagrams IN+ OUT+ Signal Generator R D RL IN- OUT- Figure5. DifferentialDriverACTestCircuit Figure6. PropagationDelayTimingDiagram Copyright©2008–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS25CP152

DS25CP152 SNLS274D–JANUARY2008–REVISEDAPRIL2013 www.ti.com Figure7. LVDSOutputTransitionTimes Functional Description The DS25CP152 is a 3.125 Gbps 2x2 LVDS digital crosspoint switch optimized for high-speed signal routing and switchingoverlossyFR-4printedcircuitboardbackplanesandbalancedcables. Table1.SwitchConfigurationTruthTable S1 S0 OUT1 OUT0 0 0 IN0 IN0 0 1 IN0 IN1 1 0 IN1 IN0 1 1 IN1 IN1 Table2.OutputEnableTruthTable EN1 EN0 OUT1 OUT0 0 0 Disabled Disabled 0 1 Disabled Enabled 1 0 Enabled Disabled 1 1 Enabled Enabled Input Interfacing The DS25CP152 accepts differential signals and allows simple AC or DC coupling. With a wide common mode range, the DS25CP152 can be DC-coupled with all common differential drivers (i.e. LVPECL, LVDS, CML). The following three figures illustrate typical DC-coupled interface to common differential drivers. Note that the DS25CP152inputsareinternallyterminatedwitha100Ω resistor. LVDS DS25CP152 Driver 100: Differential T-Line Receiver OUT+ IN+ 100: OUT- IN- Figure8. TypicalLVDSDriverDC-CoupledInterfacetoDS25CP152Input 6 SubmitDocumentationFeedback Copyright©2008–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS25CP152

DS25CP152 www.ti.com SNLS274D–JANUARY2008–REVISEDAPRIL2013 CML3.3V or CML2.5V Driver VCC DS25CP152 50: 50: 100: Differential T-Line Receiver OUT+ IN+ 100: OUT- IN- Figure9. TypicalCMLDriverDC-CoupledInterfacetoDS25CP152Input LVPECL LVDS Driver 100: Differential T-Line Receiver OUT+ IN+ 100: OUT- IN- 150-250: 150-250: Figure10. TypicalLVPECLDriverDC-CoupledInterfacetoDS25CP152Input Output Interfacing The DS25CP152 outputs signals that are compliant to the LVDS standard. Its outputs can be DC-coupled to most common differential receivers. The following figure illustrates typical DC-coupled interface to common differential receivers and assumes that the receivers have high impedance inputs. While most differential receivers have a common mode input range that can accommodate LVDS compliant signals, it is recommended tochecktherespectivereceiver'sdatasheetpriortoimplementingthesuggestedinterfaceimplementation. DS25CP152 Differential Driver Receiver 100: Differential T-Line OUT+ IN+ CML or 100: 100: LVPECL or LVDS OUT- IN- Figure11. TypicalDS25CP152OutputDC-CoupledInterfacetoanLVDS,CMLorLVPECLReceiver Copyright©2008–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS25CP152

DS25CP152 SNLS274D–JANUARY2008–REVISEDAPRIL2013 www.ti.com Typical Performance Characteristics Figure12.A3.125GbpsNRZPRBS-7After2" Figure13.A2.5GbpsNRZPRBS-7After2" DifferentialFR-4Stripline DifferentialFR-4Stripline V:100mV/DIV,H:50ps/DIV V:100mV/DIV,H:75ps/DIV 60 60 VCC = 3.3V VCC = 3.3V 50 TA = 25°C 50 TA = 25°C 3.125 Gbps NRZ PRBS-7 ps) 40 NRZ PRBS-7 ps) 40 R ( VID = 350 mV R ( E E T T T 30 T 30 JI JI L L A A OT 20 OT 20 T T 10 10 0 0 0 0.66 1.32 1.98 2.64 3.3 0 0.8 1.6 2.4 3.2 4.0 INPUT COMMON MODE VOLTAGE (V) DATA RATE (Gbps) Figure14.TotalJitterasaFunctionofInputCommonMode Figure15.TotalJitterasaFunctionofDataRate Voltage 8 SubmitDocumentationFeedback Copyright©2008–2013,TexasInstrumentsIncorporated ProductFolderLinks:DS25CP152

DS25CP152 www.ti.com SNLS274D–JANUARY2008–REVISEDAPRIL2013 REVISION HISTORY ChangesfromRevisionC(April2013)toRevisionD Page • ChangedlayoutofNationalDataSheettoTIformat............................................................................................................ 8 Copyright©2008–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS25CP152

PACKAGE OPTION ADDENDUM www.ti.com 8-Oct-2015 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) DS25CP152TSQ/NOPB ACTIVE WQFN RGH 16 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 2C152SQ & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 8-Oct-2015 Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) DS25CP152TSQ/NOPB WQFN RGH 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) DS25CP152TSQ/NOPB WQFN RGH 16 1000 210.0 185.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE RGH0016A WQFN - 0.8 mm max height SCALE 3.000 PLASTIC QUAD FLATPACK - NO LEAD B 4.1 A 3.9 0.5 0.3 PIN 1 INDEX AREA 4.1 0.3 3.9 0.2 DETAIL OPTIONAL TERMINAL TYPICAL DIM A OPT 1 OPT 1 (0.1) (0.2) C 0.8 MAX SEATING PLANE 0.05 0.00 0.08 2.6 0.1 (A) TYP 5 8 SEE TERMINAL EXPOSED DETAIL THERMAL PAD 12X 0.5 4 9 4X 17 SYMM 1.5 1 12 0.3 16X 0.2 0.1 C A B PIN 1 ID 16 13 0.05 SYMM (OPTIONAL) 0.5 16X 0.3 4214978/B 01/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT RGH0016A WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 2.6) SYMM 16 13 16X (0.6) (R0.05) 1 TYP 12 16X (0.25) 17 SYMM (3.8) (1) 9 4 12X (0.5) ( 0.2) TYP VIA 5 8 (1) (3.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND SOLDER MASK METAL OPENING EXPOSED METAL EXPOSED METAL SOLDER MASK METAL UNDER OPENING SOLDER MASK NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214978/B 01/2017 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN RGH0016A WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO LEAD 4X ( 1.15) (0.675) TYP 16 13 17 16X (0.6) 1 (0.675) 12 TYP 16X (0.25) SYMM (3.8) 12X (0.5) 9 4 EXPOSED METAL TYP 5 8 (R0.05) SYMM TYP (3.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 17 78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4214978/B 01/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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