Effective March 2019 Technical Data 4141 Supersedes September 2017 DR124 High power density, high efficiency, low profile shielded drum core power inductors Applications • Notebook power • LCD panels • Desktop and servers • DVD players and portable power devices • DC-DC Converters • Buck, boost, forward, and resonant converters • Noise filtering and filter chokes Environmental Data • Storage temperature range (Component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • Low profile surface mount inductor (ambient plus self-temperature rise) • 12.5 mm x 12.5 mm x 4.5 mm shielded • Solder reflow temperature: drum core J-STD-020 (latest revision) compliant • Inductance range from 0.47 µH to 1000 µH • Current range from 0.44 A to 24.4 A • Frequency range up to 1 MHz Pb HHALOFGEN • Ferrite core material FREE

Technical Data 4141 DR124 Effective March 2019 High power density, high efficiency, low profile shielded drum core power inductors Product specifications Rated DCR DCR Inductance OCL1 I 2 I 3 mΩ @20°C mΩ @ +20°C rms sat Part Number (μH) μH±20% (A) (A) Typ Max K-factor4 DR124-R47-R 0.47 0.42 16.0 24.40 2.2 2.7 17.51 DR124-1R0-R 1.0 0.83 13.9 18.00 3.00 3.6 12.50 DR124-1R5-R 1.5 1.37 11.1 14.00 4.75 5.7 9.73 DR124-2R2-R 2.2 2.04 9.1 11.45 5.92 7.1 7.96 DR124-3R9-R 3.9 3.80 7.0 8.40 12.50 15.0 5.84 DR124-4R7-R 4.7 4.88 6.5 7.65 13.50 16.2 5.15 DR124-6R8-R 6.8 6.10 5.6 6.47 18.06 21.7 4.61 DR124-8R2-R 8.2 7.45 5.2 6.22 21.67 26.0 4.17 DR124-100-R 10 8.94 4.5 5.80 23.33 28.0 3.81 DR124-120-R 12 11.5 4.1 4.96 31.67 38.0 3.50 DR124-150-R 15 14.2 3.6 4.62 37.30 44.8 3.02 DR124-180-R 18 16.2 3.4 4.32 46.97 56.4 2.82 DR124-220-R 22 20.7 3.2 3.83 53.99 64.8 2.50 DR124-270-R 27 25.7 2.8 3.44 66.67 80.0 2.24 DR124-330-R 33 31.2 2.6 3.12 80.83 97.0 2.04 DR124-390-R 39 37.3 2.3 2.85 110.00 132.0 1.86 DR124-470-R 47 44.0 2.2 2.63 124.66 149.6 1.72 DR124-560-R 56 54.9 2.0 2.35 144.32 173.2 1.54 DR124-680-R 68 67.1 1.8 2.13 183.33 220.0 1.39 DR124-820-R 82 80.5 1.7 1.94 212.72 255.3 1.27 DR124-101-R 100 95.1 1.5 1.79 256.67 308.0 1.17 DR124-121-R 120 111 1.3 1.65 311.18 373.4 1.08 DR124-151-R 150 146 1.3 1.44 371.02 445.2 0.94 DR124-181-R 180 179 1.1 1.30 501.66 602.0 0.87 DR124-221-R 220 216 1.0 1.15 558.00 669.6 0.77 DR124-271-R 270 256 0.88 1.09 725.00 870.0 0.71 DR124-331-R 330 327 0.83 0.92 825.00 990.0 0.63 DR124-471-R 470 460 0.68 0.74 1242.50 1491.0 0.53 DR124-681-R 680 669 0.56 0.65 1845.83 2215.0 0.45 DR124-821-R 820 825 0.53 0.62 2109.17 2351.0 0.40 DR124-102-R 1000 998 0.44 0.53 2898.00 3477.00 0.37 1. Open Circuit Inductance Test Parameters: 100 kHz, 0.25 V, 0.0 Adc. 4. K-factor: Used to determine B for core loss (see graph). p-p 2. I : DC current for an approximate ∆T of 40 °C without core loss. Derating is B = K*L*∆I, B (mT), K: (K factor from table), L: (Inductance in μH), rms p-p p-p necessary for AC currents. PCB layout, trace thickness and width, air-flow, ∆I (Peak to peak ripple current in Amps). and proximity of other heat generating components will affect the 5. Part Number Definition: DR124-xxx-R temperature rise. It is recommended that the temperature of the part not - DR124 = Product code and size; -xxx = Inductance value in uH; exceed +125 °C under worst case operating conditions verified in the end - R = decimal point; If no R is present, third character = # of zeros. application. - “-R” suffix = RoHS compliant 3. I Amps peak for approximately 25% rolloff (@ +25 °C). sat 2 www.eaton.com/electronics

DR124 Technical Data 4141 High power density, high efficiency, low profile shielded drum Effective March 2019 core power inductors Dimensions- mm BOTTOM VIEW FRONT VIEW TOP VIEW RECOMMENDED PCB LAYOUT SCHEMATIC 2.05 Typ. 13.8 5T.y0p0 1 2 1M2.a5x0 M4a.5x DR124-### 1 1 2 12.50 wwllyy R 5.50 Max 2 10 3.85 Dimensions are in millimeters. wwlly = Date code, R = Revision level. Do not route traces or vias underneath the inductor. Packaging- mm 1.5 dia 1.5 dia +0.1/-0.0 min A 1.75 4.0 11 BAoo==1133..22 mmmm 12.6 Bo B1 wwllyy RDR124-### 24.0 A1=10mm B1=10 mm Ko=5.2 mm Ko A1 16.0 A Ao SECTION A-A User direction of feed Parts packaged on 13" Diameter reel, 750 parts per reel. Temperature rise vs. total loss 120 100 C) ° 80 e ( s Ri e 60 ur at er 40 p m e T 20 0 0 0.4 0.8 1.2 1.6 2 Total Power Loss (W) www.eaton.com/electronics 3

Technical Data 4141 DR124 Effective March 2019 High power density, high efficiency, low profile shielded drum core power inductors Core loss vs. Bp-p 100 500 kHz 1 MHz 300 kHz 10 200 kHz 100 kHz 1 ) W ( s s o 0.1 L e r o C 0.01 0.001 0.0001 1 10 100 1000 Bp-p (mT) Inductance characteristics OCL vs. Isat 120.0 100.0 -40 °C 80.0 L C +25 °C O 60.0 % +85 °C 40.0 20.0 0.0 0.0 20.0 40.0 60.0 80.0 100.0 120.0 % Isat 4 www.eaton.com/electronics

DR124 High power density, high efficiency, low profile shielded drum Technical Data 4141 core power inductors Effective March 2019 Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) per Volume Volume Volume Tem Tsmin ts PThacickkangees s m<3m503 m35m03 - 2000 m>2m003 0 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2019 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4141 BU-SB14114 All other trademarks are property March 2019 of their respective owners.