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  • 型号: DMN65D8LFB-7B
  • 制造商: Diodes Inc.
  • 库位|库存: xxxx|xxxx
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DMN65D8LFB-7B产品简介:

ICGOO电子元器件商城为您提供DMN65D8LFB-7B由Diodes Inc.设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 DMN65D8LFB-7B价格参考。Diodes Inc.DMN65D8LFB-7B封装/规格:晶体管 - FET,MOSFET - 单, 表面贴装 N 沟道 60V 260mA(Ta) 430mW(Ta) X1-DFN1006-3。您可以下载DMN65D8LFB-7B参考资料、Datasheet数据手册功能说明书,资料中有DMN65D8LFB-7B 详细功能的应用电路图电压和使用方法及教程。

Diodes Incorporated的DMN65D8LFB-7B是一款N沟道增强型MOSFET晶体管,广泛应用于多种电力电子设备和电路设计中。其应用场景主要包括以下几个方面:

1. 电源管理:
   - 该MOSFET适用于各种开关电源(SMPS)的设计,如DC-DC转换器、AC-DC适配器等。它能够高效地进行电压调节,提供稳定的输出电压。
   - 在电池管理系统(BMS)中,用于控制电池充放电路径,确保电池的安全和长寿命。

2. 电机驱动:
   - 在小型电机驱动应用中,如风扇、水泵、无人机电机等,DMN65D8LFB-7B可以作为功率开关,实现电机的启动、停止和调速功能。
   - 它也可以用于步进电机和无刷直流电机(BLDC)的驱动电路中,提供高效的电流控制。

3. 负载切换:
   - 用于智能家电和工业控制系统中的负载切换,例如灯光控制、加热元件控制等。它可以快速响应并可靠地切断或接通电路,确保系统的安全性和稳定性。

4. 保护电路:
   - 在过流保护、短路保护等电路中,该MOSFET可以用作开关元件,当检测到异常电流时迅速切断电路,保护其他敏感元件免受损坏。
   - 它还可以用于热插拔保护电路,防止在带电插入或拔出设备时产生浪涌电流。

5. 通信设备:
   - 在通信基站、路由器、交换机等设备中,用于电源管理和信号处理模块,确保设备的稳定运行和高效能表现。

6. 消费电子产品:
   - 在智能手机、平板电脑、笔记本电脑等便携式设备中,用于充电接口的电源管理,以及内部电路的电源分配和保护。

总之,DMN65D8LFB-7B凭借其低导通电阻、高开关速度和可靠性,成为许多电力电子应用的理想选择,特别适合需要高效能和小尺寸解决方案的设计场合。
产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

ChannelMode

Enhancement

描述

MOSFET N-CH 60V 260MA 3DFNMOSFET MOSFET BVDSS: 61V-10 X1-DFN1006-3 T&R 10K

产品分类

FET - 单分离式半导体

FET功能

逻辑电平门

FET类型

MOSFET N 通道,金属氧化物

Id-ContinuousDrainCurrent

400 mA

Id-连续漏极电流

400 mA

品牌

Diodes Incorporated

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,MOSFET,Diodes Incorporated DMN65D8LFB-7B-

数据手册

点击此处下载产品Datasheet

产品型号

DMN65D8LFB-7B

Pd-PowerDissipation

430 mW

Pd-功率耗散

430 mW

RdsOn-Drain-SourceResistance

3 Ohms

RdsOn-漏源导通电阻

3 Ohms

RoHS指令信息

http://diodes.com/download/4349

Vds-Drain-SourceBreakdownVoltage

60 V

Vds-漏源极击穿电压

60 V

Vgs-Gate-SourceBreakdownVoltage

+/- 20 V

Vgs-栅源极击穿电压

20 V

Vgsth-Gate-SourceThresholdVoltage

2 V

Vgsth-栅源极阈值电压

2 V

上升时间

3.15 ns

下降时间

6.29 ns

不同Id时的Vgs(th)(最大值)

2V @ 250µA

不同Vds时的输入电容(Ciss)

25pF @ 25V

不同Vgs时的栅极电荷(Qg)

-

不同 Id、Vgs时的 RdsOn(最大值)

3 欧姆 @ 115mA,10V

产品种类

MOSFET

供应商器件封装

3-DFN1006(1.0x0.6)

其它名称

DMN65D8LFB-7BDICT

典型关闭延迟时间

12.025 ns

功率-最大值

430mW

包装

剪切带 (CT)

商标

Diodes Incorporated

安装类型

表面贴装

安装风格

SMD/SMT

导通电阻

3 Ohms

封装

Reel

封装/外壳

3-XFDFN

封装/箱体

X1-DFN1006-3

晶体管极性

N-Channel

最大工作温度

+ 150 C

最小工作温度

- 55 C

标准包装

1

正向跨导-最小值

80 mS

汲极/源极击穿电压

60 V

漏极连续电流

400 mA

漏源极电压(Vdss)

60V

电流-连续漏极(Id)(25°C时)

260mA (Ta)

系列

DMN63D8

通道模式

Enhancement

配置

Single

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PDF Datasheet 数据手册内容提取

DMN65D8LFB N-CHANNEL ENHANCEMENT MODE FIELD MOSFET Product Summary Features and Benefits V(BR)DSS RDS(ON) TA = I+D2 5°C  NLo-Cwh Oannn-Reel sMisOtaSnFcEeT  Low Gate-Threshold Voltage 3.0Ω @ VGS = 10V 400mA  Low-Input Capacitance 60V 4.0Ω @ VGS = 5V 330mA  Fast Switching Speed  Small-Surface Mount Package  ESD Protected Gate, 1.2kV HBM  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. "Green" Device (Note 3)  Qualified to AEC-Q101 Standards for High Reliability Description and Applications Mechanical Data This new generation MOSFET is designed to minimize the on-state  Case: X1-DFN1006-3 resistance (R ) yet maintain superior switching performance,  Case Material: Molded Plastic, “Green” Molding Compound; DS(ON) which makes it ideal for high-efficiency power-management UL Flammability Classification Rating 94V-0 applications.  Moisture Sensitivity: Level 1 per J-STD-020  Terminal Connections: See Diagram  Terminals: Finish—NiPdAu over Copper Leadframe;  DC-DC Converters Solderable per MIL-STD-202, Method 208 e4  Power Management Functions  Weight: 0.001 grams (Approximate)  Battery Operated Systems and Solid-State Relays Drivers: Relays, Solenoids, Lamps, Hammers, Displays, Memories, Transistors, etc. Drain X1-DFN1006-3 Body Diode Gate S D Gate G Protection Source Diode ESD PROTECTED TO 1.2kV Bottom View Equivalent Circuit Top View Pin Configuration Ordering Information (Note 4) Part Number Case Packaging DMN65D8LFB-7 X1-DFN1006-3 3000/Tape & Reel DMN65D8LFB-7B X1-DFN1006-3 10,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, refer to our website at http://www.diodes.com. DMN65D8LFB 1 of 6 June 2018 Document number: DS35545 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

DMN65D8LFB Marking Information X1 From date code 1527 (YYWW), X1 this changes to: Top View Top View Dot Denotes Drain Side Bar Denotes Gate and Source Side DMN65D8LFB-7 1 1 1 X X X X X X 1 1 1 X1 Top View Bar Denotes Gate and Source Side X1 = Part Marking Code DMN65D8LFB-7B 1 1 1 X X X DMN65D8LFB 2 of 6 June 2018 Document number: DS35545 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

DMN65D8LFB Maximum Ratings Characteristic Symbol Value Units Drain-Source Voltage VDSS 60 V Gate-Source Voltage VGSS 20 V Continuous Drain Current (Note 4) VGS = 10V SStetaatdey TTAA == ++2750°°CC ID 226100 mA Continuous Drain Current (Note 5) VGS = 10V SStetaatdey TTAA == ++2750°°CC ID 430100 mA Thermal Characteristics Characteristic Symbol Value Units Power Dissipation, @ TA = +25°C (Note 4) PD 430 mW Thermal Resistance, Junction to Ambient @TA = +25°C (Note 4) RϴJA 290 °C/W Power Dissipation, @ TA = +25°C (Note 5) PD 840 mW Thermal Resistance, Junction to Ambient @ TA = +25°C (Note 5) RϴJSA 147 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 6) Drain-Source Breakdown Voltage BVDSS 60 — — V VGS = 0V, ID = 250µA Zero Gate Voltage Drain Current TJ = +25°C IDSS — — 0.1 µA VDS = 60V, VGS = 0V Gate-Body Leakage IGSS — — 10 µA VGS = 20V, VDS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage VGS(th) 1.2 — 2.0 V VDS = VGS, ID = 250µA Static Drain-Source On-Resistance RDS (ON) — — 34..00 Ω VVGGSS == 15V0V, I, DI D= = 0 .01.1115A5A Forward Transfer Admittance |Yfs| 80 320 — mS VDS = 10V, ID = 0.115A Diode Forward Voltage VSD — 0.7 1.2 V VGS = 0V, IS = 0.115A DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance Ciss — 25 — pF Output Capacitance Coss — 4.7 — pF VDS = 25V, VGS = 0V, f = 1.0MHz Reverse Transfer Capacitance Crss — 2.5 — pF Turn-On Delay Time tD(on) — 3.27 — ns Turn-On Rise Time tr — 3.15 — ns VDD = 30V, VGEN = 10V, Turn-Off Delay Time tD(off) — 12.025 — ns RGEN = 25Ω,ID = 0.115A Turn-Off Fall Time tf — 6.29 — ns Notes: 4. Device mounted on FR-4 PCB with minimum recommended pad layout, single-sided. 5. Device mounted on 2” × 2” FR-4 PCB with high coverage 2oz. Copper, single-sided. 6. Short duration pulse test used to minimize self-heating effect. 7. Guaranteed by design. Not subject to production testing. DMN65D8LFB 3 of 6 June 2018 Document number: DS35545 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

DMN65D8LFB 0.6 1 VGS=10V VGS=3.5V VDS= 5.0V TA=125C TA=150C 0.5 VGS=4.0V VGS=3.0V VGS=5.0V A) 0.4 VGS=4.5V ENT ( TA=25C R TA=-55C R 0.3 U0.1 TA=85C C N AI 0.2 VGS=2.5V DR , D I 0.1 0.0 0.01 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 1.5 2 2.5 3 3.5 4 VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE Fig.1 Typical Output Characteristics Fig. 2 Typical Transfer Characteristics 5 2.4 ) E ( 4.5 CE 2.2 ANC 4 TAN 2 VIDG=S1=1150mVA, T S S SI SI 3.5 E 1.8 E R R N- N- 3 Od)1.6 CE O 2.5 VGS=5V RCE malize1.4 VIDG=S1=155Vm,A OUR 2 VGS=10V SOUNor1.2 S N-( N- 1.5 AI 1 AI R R D , DDS(ON) 0.51 R, DS(ON) 00..68 R 0 0.4 0 0.1 0.2 0.3 0.4 0.5 0.6 -50 -25 0 25 50 75 100 125 150 I , DRAIN-SOURCE CURRENT (A) TJ, JUNCTION TEMPERATURE (C) D Fig. 3 Typical On-Resistance vs. Fig. 4 On-Resistance Variation with Temperature Drain Current and Gate Charge 2 50 f=1MHz V) 1.8 45 E ( F) G 1.6 p 40 OLTA 1.4 ID=1mA NCE ( 35 V A LD 1.2 CIT 30 RESHO 1 ID=250µA N CAPA 2205 CISS H 0.8 O E T CTI 15 T 0.6 N , GAGS(TH) 00..24 C, JUT150 COSS V 0 CRSS 0 -50 -25 0 25 50 75 100 125 150 0 5 10 15 20 25 TJ, JUNCTION TEMPERATURE (°C) VDS, DRAIN-SOURCE VOLTAGE Fig. 5 Gate Threshold Variation vs. Ambient Temperature Fig. 6 Typical Junction Capacitance DMN65D8LFB 4 of 6 June 2018 Document number: DS35545 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

DMN65D8LFB 1 TA=125°C TA=150°C TA=25°C A) T ( 0.1 N TA=85°C E RR TA=-55°C U C E C R U0.01 O S , S I 0.001 0 0.2 0.4 0.6 0.8 1 1.2 V , SOURCE-DRAIN VOLTAGE (V) SD Fig. 7 Diode Forward Voltage vs. Current Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. X1-DFN1006-3 A A1 X1-DFN1006-3 Dim Min Max Typ Seating Plane A 0.47 0.53 0.50 A1 0.00 0.05 0.03 D b 0.10 0.20 0.15 Pin #1 ID b b2 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e - - 0.35 L1 0.20 0.30 0.25 E b2 e L2 0.20 0.30 0.25 L3 - - 0.40 z 0.02 0.08 0.05 All Dimensions in mm z L2 L3 L1 Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. X1-DFN1006-3 Y C Dimensions Value (in mm) C 0.70 Y1 G1 0.30 G2 0.20 G2 X 0.40 X1 1.10 Y 0.25 X G1 Y1 0.70 X1 DMN65D8LFB 5 of 6 June 2018 Document number: DS35545 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

DMN65D8LFB IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2018, Diodes Incorporated www.diodes.com DMN65D8LFB 6 of 6 June 2018 Document number: DS35545 Rev. 4 - 2 www.diodes.com © Diodes Incorporated

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