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  • 型号: DMG563H10R
  • 制造商: Panasonic Corporation
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产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

TRANS PREBIAS NPN/PNP SMINI5开关晶体管 - 偏压电阻器 COMP TRANS W/BLT IN RES FLT LD 2.0x2.1mm

产品分类

晶体管(BJT) - 阵列﹐预偏压式分离式半导体

品牌

Panasonic Electronic Components - Semiconductor ProductsPanasonic

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,开关晶体管 - 偏压电阻器,Panasonic DMG563H10R-

数据手册

http://industrial.panasonic.com/www-cgi/jvcr13pz.cgi?E+SC+4+AJC7003+DMG563H1+8+WW

产品型号

DMG563H10RDMG563H10R

不同 Ib、Ic时的 Vce饱和值(最大值)

250mV @ 500µA, 10mA

不同 Ic、Vce 时的DC电流增益(hFE)(最小值)

80 @ 5mA,10V / 30 @ 5mA,10V

产品种类

开关晶体管 - 偏压电阻器

供应商器件封装

SMini5-F3-B

其它名称

DMG563H10RDKR

典型输入电阻器

47 kOhms

功率-最大值

150mW

包装

Digi-Reel®

商标

Panasonic

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

5-SMD,扁平引线

封装/箱体

SMini5-F3-B

工厂包装数量

3000

晶体管极性

NPN/PNP

晶体管类型

1 个 NPN,1 个 PNP - 预偏压式(双)

最大工作温度

+ 150 C

标准包装

1

电压-集射极击穿(最大值)

50V

电流-集电极(Ic)(最大值)

100mA

电流-集电极截止(最大值)

500nA

电阻器-发射极基底(R2)(Ω)

47k,10k

电阻器-基底(R1)(Ω)

47k,4.7k

配置

Dual

集电极—发射极最大电压VCEO

- 50 V

集电极连续电流

- 100 mA

频率-跃迁

-

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PDF Datasheet 数据手册内容提取

DMG563H1 Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) Unit: mm For digital circuits  Features  Low collector-emitter saturation voltage V CE(sat)  Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)  Marking Symbol: T1  Basic Part Number DRC2144E + DRA2143X (Collector-base connection)  Packaging 1: Emitter (Tr1) 4: Collecter (Tr2) DMG563H10R Embossed type (Thermo-compression sealing): 3 000 pcs / reel (standard) 2: Base (Tr1) 5: Base (Tr2) 3: Emitter (Tr2) Collecter (Tr1)  Absolute Maximum Ratings T = 25°C a Panasonic SMini5-F3-B Parameter Symbol Rating Unit JEITA SC-113CB Code SOT-353 Collector-base voltage (Emitter open) V 50 V CBO Tr1 Collector-emitter voltage (Base open) V 50 V CEO (B2, C1) (C2) 5 4 Collector current I 100 mA C Collector-base voltage (Emitter open) VCBO –50 V R1 Tr1 Tr2 Tr2 Collector-emitter voltage (Base open) V –50 V CEO R R Collector current I –100 mA 2 R1 2 C Total power dissipation P 150 mW 1 2 3 T (E1) (B1) (E2) Junction temperature T 150 °C j Overall R 47 kΩ 1 Operating ambient temperature T –40 to +85 °C Tr1 opr Resistance R2 47 kΩ Storage temperature Tstg –55 to +150 °C value R1 4.7 kΩ Tr2 R 10 kΩ 2 Publication date: November 2013 Ver. CED 1

DMG563H1  Electrical Characteristics T = 25°C±3°C a  Tr1 Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) V I = 10 µA, I = 0 50 V CBO C E Collector-emitter voltage (Base open) V I = 2 mA, I = 0 50 V CEO C B Collector-base cutoff current (Emitter open) I V = 50 V, I = 0 0.1 µA CBO CB E Collector-emitter cutoff current (Base open) I V = 50 V, I = 0 0.5 µA CEO CE B Emitter-base cutoff current (Collector open) I V = 6 V, I = 0 0.1 mA EBO EB C Forward current transfer ratio h V = 10 V, I = 5 mA 80  FE CE C Collector-emitter saturation voltage V I = 10 mA, I = 0.5 mA 0.25 V CE(sat) C B Input voltage (ON) V V = 0.2 V, I = 5 mA 3.6 V I(on) CE C Input voltage (OFF) V V = 5 V, I = 100 µA 0.8 V I(off) CE C Input resistance R –30% 47 +30% kΩ 1 Resistance ratio R / R 0.8 1.0 1.2  1 2 Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  Tr2 Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) V I = –10 µA, I = 0 –50 V CBO C E Collector-emitter voltage (Base open) V I = –2 mA, I = 0 –50 V CEO C B Collector-base cutoff current (Emitter open) I V = –50 V, I = 0 – 0.1 µA CBO CB E Collector-emitter cutoff current (Base open) I V = –50 V, I = 0 – 0.5 µA CEO CE B Emitter-base cutoff current (Collector open) I V = –6 V, I = 0 –1.0 mA EBO EB C Forward current transfer ratio h V = –10 V, I = –5 mA 30  FE CE C Collector-emitter saturation voltage V I = –10 mA, I = – 0.5 mA – 0.25 V CE(sat) C B Input voltage (ON) V V = – 0.2 V, I = –5 mA –1.7 V I(on) CE C Input voltage (OFF) V V = –5 V, I = –100 µA – 0.6 V I(off) CE C Input resistance R –30% 4.7 +30% kΩ 1 Resistance ratio R / R 0.37 0.47 0.57  1 2 Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. Ver. CED 2

DMG563H1 Common characteristics chart DMG563H1_PT-Ta P  T T a 200 ) W m ( T150 P n o ati p100 si s di er w o al p 50 ot T 0 0 40 80 120 160 200 Ambient temperature T (°C) a Characteristics charts of Tr1 DMG563H1(Tr1)_IC-VCE DMG563H1(Tr1)_hFE-IC DMG563H1(Tr1)_VCEsat-IC I  V h  I V  I C CE FE C CE(sat) C Collector current I (mA) C11208642000000 Ta = 25°CI B = 500 µA 450 µA 33422115050055000000000 µµµµµµµµAAAAAAAA Forward current transfer ratio hFE 534210000000000 VCE = 10 V 25°C Ta =− 8450°°CC or-emitter saturation voltage V (V) CE(sat) 01.101 Ta = 85°C IC / −IB4 0=° 2C0 ct 25°C e oll 0 0 C0.01 0 2 4 6 8 10 12 0.1 1 10 100 0.1 1 10 100 Collector-emitter voltage V (V) Collector current I (mA) Collector current I (mA) CE C C DMG563H1(Tr1)_IO-VIN DMG563H1(Tr1)_VIN-IO I  V V  I O IN IN O 10 100 V = 5 V O VO = 0.2 V T = 85°C ) A 1 a V) (utput current I mO10−1 −402°5C°C nput voltage V (IN 110 25°C Ta = −8450°°CC O 10−2 I 10−3 0.1 0 0.5 1.0 1.5 2.0 0.1 1 10 100 Input voltage VIN (V) Output current IO (mA) Ver. CED 3

DMG563H1 Characteristics charts of Tr2 DMG563H1(Tr2)_IC-VCE DMG563H1(Tr2)_hFE-IC DMG563H1(Tr2)_VCEsat-IC I  V h  I V  I C CE FE C CE(sat) C Collector current I (mA) C−−−−−112086400000 Ta = 25°C IB = −800 µA −−−−−−563427000000000000 µµµµµµAAAAAA ward current transfer ratio hFE 322110505000000 25°C TVaC =E =−8 54−°01C°0C V mitter saturation voltage V (V) CE(sat)−− 0−1.101 Ta = 85°C I−C 4/ 0I°BC = 20 −20 For 50 or-e 25°C −100 µA ct e oll 0 0 C− 0.01 0 −2 −4 −6 −8 −10 −12 − 0.1 −1 −10 −100 − 0.1 −1 −10 −100 Collector-emitter voltage VCE (V) Collector current IC (mA) Collector current IC (mA) DMG563H1(Tr2)_IO-VIN DMG563H1(Tr2)_VIN-IO I  V V  I O IN IN O −10 −100 V = −5 V O VO = − 0.2 V T = 85°C a ) A −1 V) (utput current I mO−10−1 25°C −40°C nput voltage V (IN−−110 25°C Ta = −8450°°CC O−10−2 I −10−3 − 0.1 0 − 0.5 −1.0 −1.5 −2.0 − 0.1 −1 −10 −100 Input voltage VIN (V) Output current IO (mA) Ver. CED 4

DMG563H1 SMini5-F3-B Unit: mm  Land Pattern (Reference) (Unit: mm) Ver. CED 5

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If anyof theproductsor technicalinformationdescribedinthisbook is tobe exported or provided to non-residents, the lawsandregulationsoftheexportingcountry,especially,thosewithregardtosecurityexportcontrol,mustbeobserved. (2)Thetechnicalinformationdescribedinthisbookisintendedonlytoshowthemaincharacteristicsandapplicationcircuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical informationde-scribedinthisbook. (3) The products described in this book are intended to be used for general applications (such as office equipment, communicationsequipment,measuringinstrumentsandhouseholdappliances),orforspecificapplicationsasexpressly statedinthisbook. Please consult with our sales staff in advance for information on the following applications, moreover please exchange documentsseparatelyontermsofuseetc.:Specialapplications(suchasforin-vehicleequipment,airplanes,aerospace, automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardizelifeorharmthehumanbody. Unlessexchangingdocumentsontermsofuseetc.inadvance,itistobeunderstoodthatourcompanyshallnotbeheld responsiblefor anydamageincurred asaresult of or inconnection with your usingthe productsdescribed inthisbook foranyspecialapplication. (4) The products and product specifications described in this book are subject to change without notice for modification and/orimprovement.Atthefinalstageofyourdesign,purchasing,oruseoftheproducts,therefore,askforthemostup- to-dateProductStandardsinadvancetomakesurethatthelatestspecificationssatisfyyourrequirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions(operatingpowersupplyvoltageandoperatingenvironmentetc.).Especially,pleasebecarefulnottoexceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other- wise,wewillnotbeliableforanydefectwhichmayariselaterinyourequipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arrestingthespreadoffireorpreventingglitcharerecommendedinordertopreventphysicalinjury,fire,socialdamages, forexample,byusingtheproducts. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do notguaranteequalityfordisassembledproductsortheproductre-mountedafterremovingfromthemountingboard. Whenusingproductsforwhichdamp-proofpackingisrequired,satisfytheconditions,suchasshelflifeandtheelapsed timesincefirstopeningthepackages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of requestfromtheresaledestination,pleaseunderstandthatcustomerswillbeartheburden. (8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. No.010618

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