SpecNo.JEFL243C-0003V-01 P1/9 Reference Only Chip Common Mode Choke Coil DLW21SN□□□SQ2□ Reference Specification 1. Scope This reference specification applies to Chip Common Mode Choke Coil. 2. Part Numbering (ex.) DL W 21 S N 371 S Q 2 L (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (1) Chip Common Mode Choke Coil (6) Impedance (Typ. at 100MHz) (2) Structure (W : Winding Type) (7) Circuit (3) Dimension (L×W) (8) Features (4) Type (9) Number of Line (5) Category (10) Packaging Code L : Taping / B : Bulk 3. Rating Common Mode Impedance Rated Withstanding Rated DC Insulation Customer Murata (at 100MHz,Under Standard Voltage Voltage Current Resistance Resistance Part Number Part Number Testing Condition) V(DC) V(DC) (mA) (Ω max.) (MΩ min.) (Ω ) DLW21SN371SQ2L 370 ± 25 % 280 0.45 DLW21SN371SQ2B DLW21SN261SQ2L 260 ± 25 % 300 0.40 DLW21SN261SQ2B DLW21SN181SQ2L 180 ± 25 % 330 0.35 DLW21SN181SQ2B 50 125 10 DLW21SN121SQ2L 120 ± 25 % 370 0.30 DLW21SN121SQ2B DLW21SN900SQ2L 90 ± 25 % 330 0.35 DLW21SN900SQ2B DLW21SN670SQ2L 67 ± 25 % 400 0.25 DLW21SN670SQ2B Operating Temperature : -40 to +85°C Storage Temperature : -40 to +85°C 4. Standard Testing Condition <Unless otherwise specified> <In case of doubt> Temperature : Ordinary Temperature 15 to 35°C Temperature : 20 ± 2°C Humidity : Ordinary Humidity 25 to 85%(RH) Humidity : 60 to 70%(RH) Atmospheric Pressure : 86 to106kPa 5. Style and Dimensions ■ Equivalent Circuits 2 ) 0. 17 2± 0. (1) (2) . ( 1 2.0±0.2 1.2±0.2 (4) (3) (0.45 ) (0.45) No polarity ■ Unit Mass (Typical value) (1) (2) 4) :Electrode 0.011g 0. () : ReferenceValue ( ) 4 . (in mm) 0 (4) (3) ( 6. Marking No Marking. 7. Electrical Performance No. Item Specification Test Method 7.1 Common Mode Meet item 3. Measuring Equipment : KEYSIGHT4291A or the equivalent Impedance (Zc) Measuring Frequency : 100±1MHz(ref.item 10,11) MURATA MFG.CO.,LTD

SpecNo.JEFL243C-0003V-01 P2/9 Reference Only No. Item Specification Test Method 7.2 Withstanding Products shall not be Test Voltage : 2.5 times for Rated Voltage Voltage damaged. Time : 1 to 5 seconds Charge Current : 1 mA max. (ref.item 10) 7.3 DC Resistance Meet item 3. Measuring current : 100mA max. (ref.item 10) (Rdc) (In case of doubt in the above mentioned standard condition, measure by 4 terminal method.) 7.4 Insulation Measuring voltage : Rated Voltage Resistance (I.R.) Measuring time : 1 minute max. (ref.item 10) 8. Mechanical Performance No. Item Specification Test Method 8.1 Appearance and Meet item 5. Visual Inspection and measured with Dimensions Slide Calipers. 8.2 Bonding Strength No evidence of coming off It shall be soldered on the substrate. substrate. Applying Force(F) : 5N Products shall not be Applying Time : 5±1seconds mechanical damaged. Pressure Substrate Product Testboardfixture 8.3 Bending Strength Meet Table 1. It shall be soldered on the Glass-epoxy substrate. Deflection : 2mm (t=1.0mm) Table 1 Keeping time : 5 seconds Appearance No damaged Speed of Applying Force : 0.5mm/s Pressurejig Common Mode R230 F Impedance within ±20% Change Deflection I.R. 10MΩ min. 45 45 Product Withstanding 8.4 Drop No damaged It shall be dropped on concrete or steel board. Voltage Method : free fall Height : 1 m The Number of Times : 3 times 8.5 Vibration It shall be soldered on the substrate. Oscillation Frequency : 10 to 55 to 10Hz for 1 minute Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) 8.6 Solderability The electrodes shall be at least Flux:Ethanol solution of rosin,25(wt)% includes activator equivalent to 0.06 to 0.10(wt)% chlorine 90% covered with new solder Pre-Heating : 80 to 120°C 1minute coating. Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 245±3°C Immersion Time : 4±1 seconds Immersion and emersion rates : 25mm/s Stainlesstweezers Pleaseholdproduct exceptthesepart. 8.7 Resistance to Meet Table 1. Flux : Ethanol solution of rosin,25(wt)% Soldering Heat includes activator equipment to 0.06 to 0.10(wt)% chlorine Pre-Heating : 80 to 120°C, 1minute Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 260±5°C Immersion Time : 5±0.5 seconds Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 4 to 48 hours. MURATA MFG.CO.,LTD

SpecNo.JEFL243C-0003V-01 P3/9 Reference Only 9. Environmental Performance(Products shall be soldered on the substrate.) No. Item Specification Test Method 9.1 Temperature Meet Table 1. 1 Cycle Cycle Step 1 -40°C(+0°C,-3°C) / 30±3 min Step 2 Ordinary Temp. / 10 to 15 minutes Step 3 +85°C(+3°C,-0°C) / 30±3 min Step 4 Ordinary Temp. / 10 to 15 minutes Total of 10 cycles Then measured after exposure in the room condition for 4 to 48 hours 9.2 Humidity Temperature : 40±2°C Humidity : 90~95%(RH) Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. 9.3 Heat life Temperature : 85±2°C Applying Voltage : 2times for Rated Voltage Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. (ref.item 10) 9.4 Cold Resistance Temperature : -40± 2°C Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. 10. Terminal to be Tested. When measuring and supplying the voltage,the following terminal is applied. No. Item Terminal to be Tested 10.1 Common Mode Impedance (Measurement Terminal) Terminal Terminal 10.2 Withstanding Voltage Terminal (Measurement Terminal) Terminal 10.3 DC Resistance Terminal Terminal (Measurement Terminal) Terminal Terminal 10.4 Insulation Resistance (Measurement Terminal) Terminal 10.5 Heat Life(Supply Terminal) Terminal 11. Measuring method for common mode impedance. Measured common mode impedance may be included measurement error due to stray capacitance, residual inductance of test fixture. To correct this error, the common mode impedance should be calculate as follows; (1) Measure admittance of the fixture(opened), Go Bo. (2) Measure impedance of the fixture(shorted), Rs Xs. (3) Measure admittance of the specimen, Gm Bm. (4) Calculate corrected impedance Z using the formula below. Z = (Rx2+Xx2) 1/2 Where Gm-Go Rx = - Rs (Gm-Go)2 + (Bm-Bo)2 -(Bm- Bo) Xx = - Xs (Gm-Go) 2 + (Bm-Bo)2 MURATA MFG.CO.,LTD

SpecNo.JEFL243C-0003V-01 P4/9 Reference Only 12. P.C.B., Flux, Solder and Soldering condition Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except the case of being specified special condition. 13. Impedance Frequency Characteristics(Typical) 10000 DLW21SN371SQ2 DLW21SN900SQ2 Common Mode DLW21SN670SQ2 1000 DLW21SN261SQ2 DLW21SN181SQ2 DLW21SN121SQ2 Ω) 100 DLW21SN261SQ2 l ( DLW21SN900SQ2 Z DLW21SN181SQ2 l 10 Differential Mode 1 DLW21SN121SQ2 DLW21SN371SQ2 DLW21SN670SQ2 0.1 1 10 100 1000 f (MHz) 14. Specification of Packaging 14.1 Appearance and Dimensions ( 8mm-wide,Plastic tape) Sprocket Hole 5±0.1 φ1.5±00.1 4.0±0.1 2.0±0.05 00..235±±00.0.055 7 1. 5 3 0 0. 0. ± ± 1 8.0 3.5 5±0. *aDti mtheen bsoiottno mof stihdee .C avity is measured 2 2. 1.4±0.1 1.45±0.1 4.0±0.1 Cavity Directionof feed (inmm) 14.2 Specification of Taping (1)Packing quantity(Standard quantity) 2000 pcs. / reel (2)Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3) Spliced point The cover tape have no spliced point. (4) Sprocket Hole Sprocket hole shall be located on the left hand side toward the direction of feed. (5)Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous.The specified quantity per reel is kept. 14.3 Pull Strength of Plastic Tape Plastic Tape 5N min. Cover Tape 10N min. 14.4 Peeling off force of Cover Tape 165to180degree 0.2 to 0.7N(Minimum value is Typical) F Cover tape Speed of Peeling off : 300 mm / min Plastic tape MURATA MFG.CO.,LTD

SpecNo.JEFL243C-0003V-01 P5/9 Reference Only 14.5 Dimensions of Leader-tape, Trailer and Reel Trailer Leader 2.0±0.5 160min. Label 190min. 210min. Emptytape Toptape φ13.0±0.2 φ60±10 φ21.0±0.8 Directionoffeed 9±1 0 13±1.4 φ180±0 3 14.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity, etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS Marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 14.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS Marking (∗2), Quantity, etc 14.8 Specification of Outer Case Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) Label W D H 186 186 93 5 H ∗ Above Outer Case size is typical. It depends on a quantity of an order. D W △ 15. ! Caution 15.1 Mounting Direction Mount products in right direction. Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also flames or other serious trouble. Ｚ Ｚ 15.2 Limitation of Applications rightdirection wrongdirection Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and / or reliability requirements to the applications listed in the above. MURATA MFG.CO.,LTD

SpecNo.JEFL243C-0003V-01 P6/9 Reference Only 16. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 16.1 Flux and Solder Flux Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ), but not highly acidic flux (with Halogen content exceeding 0.2(wt)% conversion to chlorine). Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder 16.2 Assembling <Exclusive use of Reflow soldering> Flow soldering may cause deterioration in insulation resistance. So, reflow soldering shall be applied for this product. 16.3 Cleaning Conditions Do not clean after soldering. Some cleaning agents may degrade bonding strength,and characteristics of products by detaching. If cleaning,please contact us. 16.4 Resin coating The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 16.5 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be location the sideways b Direction (Length : a<b) to the mechanical Stress. 〈Poorexample〉 〈Goodexample〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C C Perforatio n B *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore D A > D is invalid. A Slit MURATA MFG.CO.,LTD

SpecNo.JEFL243C-0003V-01 P7/9 Reference Only (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 16.6 Attention Regarding P.C.B. Design Portionof < The Arrangement of Products > Perforation P.C.B. shall be designed so that products are × P.C.B. far from the portion of perforation. ○ ○ The portion of perforation shall be designed Product as narrow as possible, and shall be designed Portionof × Perforation so as not to be applied the stress in the case of P.C.B. separation. Products shall not be arranged on the line P.C.B. ○ × of a series of holes when there are big holes in P.C.B. Product Hole (Because the stress concentrate on the line of holes.) < Products Placing > Support pins shall be set under P.C.B . Pick-upnozzle to prevent causing a warp to P.C.B. Product during placing the products on the other side of P.C.B. P.C.B. < P.C.B. Separation > Supportpin P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. 16.7 Standard Land Dimensions (Reflow) ∗2 4 0. ∗1 2 1. ∗3 Resist 0.8 Copperfoilpattern 2.6 Nopattern (inmm) ∗ 1 If the pattern is made with wider than 1.2mm. It will result to let component turn around, because melting speed is different. In the worst case, short circuit between lines may be occured. ∗ 2 If the pattern is made with less than 0.4mm , in the worst case , short circuit between lines may be occurred due to the spread of soldering paste or mount placing accuracy. ∗ 3 If the pattern is made with wider than 0.8mm, the strength of bending will be reduced. ∗ 4 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization. MURATA MFG.CO.,LTD

SpecNo.JEFL243C-0003V-01 P8/9 Reference Only 16.8 Standard Soldering Condition 1.Reflow Soldering (1)Standard printing pattern of solder paste • Standard thickness of the solder paste should be 100 to 150µm. 5 2 • Use the solder paste printing pattern of the 0. 1. right pattern. • For the resist and copper foil pattern, use standard land dimensions. 0.8 • Use the Solder Sn-3.0Ag-0.5Cu for pattern printing. • Spread of soldering paste between lines may 2.6 (inmm) cause short circuit of lines. (2) Soldering Temperature Temperature difference between soldering and surface of components must be within 150°C, in preheating. When components are immersed in liquid after soldering, temperature difference should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration in insulation resistance. (3) Soldering Condition Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. 260℃/10s (℃) 245±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30～60s 60s max. 90s±30s Time（ｓ） Standard Profile Limit Profile Pre-heating 150～180°C 、90s±30s Heating above 220°C、30s～60s above 230°C、60s max. Peak temperature 245±3°C 260°C、10s Cycle of reflow 2 times 2 times 2. Reworking with Soldering iron The following conditions must be strictly followed when using a soldering iron after being mounted by reflow soldering. · Pre-heating: 150°C, 1 min · Soldering iron output: 30W max. · Tip temperature: 350°C max. · Tip diameter:φ3mm max. · Soldering time : 3(+1,-0) seconds. · Times : 2times max. Notes : Do not touch the products directly with the soldering iron. MURATA MFG.CO.,LTD

SpecNo.JEFL243C-0003V-01 P9/9 Reference Only 3. Solder Volume Solder shall be used not to be exceeded the upper limits as shown below. Upperlimit Recommendable ｔ T 1/3T≦t≦T(T:Ticknessofelectrode) Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 16.9 Caution for use tweezer ･When you hold products with a tweezer, please hold like a figure of the right side, and sharp material, such as a pair of tweezers, shall not be touched to the winding portion to prevent the breaking of wire. ･Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 16.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 16.11 Brushing of neighborhood of products When you clean the neighborhood of products such as connector pins, bristles of cleaning brush shall not be touched to the winding portion to prevent the breaking of wire. 16.12 Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 16.13 Storage Condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment conditions ·Products should be stored in the warehouse on the following conditions. Temperature ： -10 ~ +40°C Humidity ： 15 to 85% relative humidity No rapid change on temperature and humidity. · Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases, to prevent the following deterioration. Poor solderability due to the oxidized electrode. · Products should be stored on the palette for the prevention of the influence from humidity,dust and so on. · Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. · Products should not be stored under the air tights packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. △ 17. ! Notes (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD