DAN222, NSVDAN222 Common Cathode Silicon Dual Switching Diode This Common Cathode Silicon Epitaxial Planar Dual Diode is designed for use in ultra high speed switching applications. This device is housed in the SOT−416/SC−75 package which is designed for low power surface mount applications, where board space is at a http://onsemi.com premium. CATHODE Features 3 • Fast t rr • Low C D • NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 1 2 Qualified and PPAP Capable ANODE • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 MAXIMUM RATINGS (T = 25°C) A SC−75/SOT−416 Rating Symbol Value Unit CASE 463 STYLE 3 Reverse Voltage VR 80 Vdc Peak Reverse Voltage VRM 80 Vdc MARKING DIAGRAM Forward Current IF 100 mAdc Peak Forward Current IFM 300 mAdc Peak Forward Surge Current (Note 1) IFSM 2.0 Adc N9 M(cid:2) (cid:2) THERMAL CHARACTERISTICS 1 Characteristic Symbol Max Unit N9 = Specific Device Code Power Dissipation PD 150 mW M = Date Code* Junction Temperature TJ 150 °C/W (cid:2) = Pb−Free Package (Note: Microdot may be in either location) Storage Temperature Range Tstg −55 to +150 °C *Date Code orientation may vary depending Stresses exceeding Maximum Ratings may damage the device. Maximum upon manufacturing location. Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. t = 1 (cid:2)S ORDERING INFORMATION Device Package Shipping† DAN222G SC−75 3000 / Tape & Reel (Pb−Free) DAN222T1G SC−75 3000 / Tape & Reel (Pb−Free) NSVDAN222T1G SC−75 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013 1 Publication Order Number: September, 2013 − Rev. 7 DAN222/D

DAN222, NSVDAN222 ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Symbol Condition Min Max Unit Reverse Voltage Leakage Current IR VR = 70 V − 0.1 (cid:2)Adc Forward Voltage VF IF = 100 mA − 1.2 Vdc Reverse Breakdown Voltage VR IR = 100 (cid:2)A 80 − Vdc Diode Capacitance CD VR = 6.0 V, f = 1.0 MHz − 3.5 pF Reverse Recovery Time trr (Note 2) IF = 5.0 mA, VR = 6.0 V, RL = 100 (cid:3), Irr = 0.1 IR − 4.0 ns 2. trr Test Circuit on following page. TYPICAL ELECTRICAL CHARACTERISTICS 100 10 TA = 150°C NT (mA) 10 TA = 85°C μENT (A) 1.0 TA = 125°C URRE TA = -(cid:2)40°C CURR TA = 85°C D C SE 0.1 R R RWA 1.0 TA = 25°C REVE TA = 55°C FO , R 0.01 , F I I TA = 25°C 0.1 0.001 0.2 0.4 0.6 0.8 1.0 1.2 0 10 20 30 40 50 VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Forward Voltage Figure 2. Reverse Current 1.0 F) E (p 0.9 C N A T CI PA 0.8 A C E D O DI , D 0.7 C 0.6 0 2 4 6 8 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Diode Capacitance http://onsemi.com 2

DAN222, NSVDAN222 tr tp trr IF t t 10% RL Irr = 0.1 IR A 90% IF = 5.0 mA VR tp = 2 (cid:2)s VRRL == 160 V0 (cid:3) tr = 0.35 ns RECOVERY TIME EQUIVALENT TEST CIRCUIT INPUT PULSE OUTPUT PULSE Figure 4. Reverse Recovery Time Test Circuit for the DAN222 http://onsemi.com 3

DAN222, NSVDAN222 PACKAGE DIMENSIONS SC−75/SOT−416 CASE 463 ISSUE F −E− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 2 MILLIMETERS INCHES 3 e −D− DIM MIN NOM MAX MIN NOM MAX A 0.70 0.80 0.90 0.027 0.031 0.035 1 b3 PL A1 0.00 0.05 0.10 0.000 0.002 0.004 b 0.15 0.20 0.30 0.006 0.008 0.012 0.20 (0.008) M D C 0.10 0.15 0.25 0.004 0.006 0.010 HE 0.20 (0.008) E D 1.55 1.60 1.65 0.059 0.063 0.067 E 0.70 0.80 0.90 0.027 0.031 0.035 e 1.00 BSC 0.04 BSC L 0.10 0.15 0.20 0.004 0.006 0.008 HE 1.50 1.60 1.70 0.061 0.063 0.065 C A STYLE 3: PIN 1.ANODE 2.ANODE 3.CATHODE L A1 SOLDERING FOOTPRINT* 0.356 0.014 1.803 0.787 0.071 0.031 0.508 0.020 1.000 0.039 (cid:2) (cid:3) mm SCALE 10:1 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com DAN222/D 4

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