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  • 型号: DA56-11GWA
  • 制造商: Kingbright
  • 库位|库存: xxxx|xxxx
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DA56-11GWA产品简介:

ICGOO电子元器件商城为您提供DA56-11GWA由Kingbright设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 DA56-11GWA价格参考¥9.47-¥20.46。KingbrightDA56-11GWA封装/规格:显示器模块 - LED 字符与数字, Character LED Display Module Green 7-Segment 2 Character Common Anode 2.2V 20mA 0.750" H x 0.984" W x 0.315" D (19.05mm x 25.00mm x 8.00mm) 18-DIP (0.600", 15.24mm)。您可以下载DA56-11GWA参考资料、Datasheet数据手册功能说明书,资料中有DA56-11GWA 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

光电元件

描述

.56" DUAL GRN.LED DISPLAYLED 显示器和配件 Dual Green 568nm Common Anode

产品分类

显示器模块 - LED 字符与数字

品牌

Kingbright Company LLCKingbright

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

LED 显示器和配件,Kingbright DA56-11GWA-

数据手册

点击此处下载产品Datasheet

产品型号

DA56-11GWADA56-11GWA

产品种类

LED 显示器和配件

光强度

10500 ucd

共用管脚

Common Anode

其它名称

754-1664-5
DA56-11GWA-ND
Q4597045B

功率耗散(最大值)

62.5mW

功耗

62.5 mW

商标

Kingbright

大小/尺寸

0.750" 高 x 0.984" 宽 x 0.315" 直径(19.05mm x 25.00mm x 8.00mm)

字符大小

8 mm x 14.2 mm

字符数

2

安装风格

Through Hole

封装

Bulk

封装/外壳

18-DIP(0.600",15.24mm)

工作电流

20 mA

工作电源电压

2.2 V

工厂包装数量

20

数位数量

2

数字/字母大小

0.56" (14.22mm)

显示器类型

7 Segment

显示类型

7 段显示

最大工作温度

+ 85 C

最小工作温度

- 40 C

标准包装

20

正向电压

2.2 V

正向电流

20 mA

毫烛光等级

11mcd

波长

568 nm

波长-峰值

565nm

照明颜色

Green

电压-正向(Vf)(典型值)

2.2V

电流-测试

20mA

通用引脚

共阳极

配置

Common Anode

颜色

绿

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PDF Datasheet 数据手册内容提取

DA56-11GWA 14.22 mm (0.56 inch) Dual Digit Numeric Display DESCRIPTION PACKAGE DIMENSIONS (cid:1) The Green source color devices are made with Gallium Phosphide Green Light Emitting Diode FEATURES (cid:1) 0.56 inch digit height (cid:1) Low current operation (cid:1) Excellent character appearance (cid:1) Easy mounting on P.C. boards or sockets (cid:1) Two digit package simplifies alignments & assembly (cid:1) Mechanically rugged (cid:1) Standard : gray face, white segment (cid:1) RoHS compliant APPLICATIONS (cid:1) Home and smart appliances (cid:1) Display time and digital combination (cid:1) Industrial and instrumental applications (cid:1) Numeric status Notes: 1. All dimensions are in millimeters (inches), Tolerance is ±0.25(0.01")unless otherwise noted. 2. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. SELECTION GUIDE Iv (ucd) @ 10mA [1] Emitting Color Part Number Lens Type Description (Material) Min. Typ. 3600 11000 ■ Common Anode, DA56-11GWA Green (GaP) White Diffused Rt. Hand Decimal *2200 *4500 Notes: 1. Luminous intensity / luminous Flux: +/-15%. * Luminous intensity value is traceable to CIE127-2007 standards. Page 1 / 4 © 2020 Kingbright. All Rights Reserved. Spec No: DSAP8274 / 1302000211 Rev No: V.1A Date: 02/27/2020

DA56-11GWA ELECTRICAL / OPTICAL CHARACTERISTICS at T =25°C A Value Parameter Symbol Emitting Color Unit Typ. Max. Wavelength at Peak Emission IF = 10mA λpeak Green 565 - nm Dominant Wavelength IF = 10mA λdom [1] Green 568 - nm Spectral Bandwidth at 50% Φ REL MAX ∆λ Green 30 - nm IF = 10mA Capacitance C Green 15 - pF Forward Voltage IF = 10mA VF [2] Green 2.0 2.4 V Reverse Current (VR = 5V) IR Green - 10 uA Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at T =25°C A Parameter Symbol Value Unit Power Dissipation P 62.5 mW D Reverse Voltage V 5 V R Junction Temperature T 110 °C j Operating Temperature T -40 To +85 °C op Storage Temperature T -40 To +85 °C stg DC Forward Current I 25 mA F Peak Forward Current IFM [1] 140 mA Electrostatic Discharge Threshold (HBM) - 8000 V Lead Solder Temperature [2] 260°C For 3-5 Seconds Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. 2mm below package base. 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. Page 2 / 4 © 2020 Kingbright. All Rights Reserved. Spec No: DSAP8274 / 1302000211 Rev No: V.1A Date: 02/27/2020

DA56-11GWA TECHNICAL DATA RELATIVE INTENSITY vs. WAVELENGTH Green 100% a. u.) 80% Ta = 25 °C y ( sit 60% n e nt e I 40% v ati el 20% R 0% 350 400 450 500 550 600 650 700 750 800 Wavelength (nm) GREEN Forward Current vs. Luminous Intensity vs. Forward Current Derating Curve Luminous Intensity vs. Forward Voltage Forward Current Ambient Temperature 20 d 2.5 A) 50 d 2.5 Forward current (mA) 112648 Ta = 25 °C minous intensity normaliseat 10 mA 0112....5050 Ta = 25 °C missible forward current (m 12340000 minous intensity normaliseat T = 25 °Ca 0112....5050 0 Lu 0.0 Per 0 Lu 0.0 1.5 1.7 1.9 2.1 2.3 2.5 0 4 8 12 16 20 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Forward voltage (V) Forward current (mA) Ambient temperature (°C) Ambient temperature (°C) RECOMMENDED WAVE SOLDERING PROFILE Soldering General Notes 1. Through-hole displays are incompatible with reflow soldering. 2. If components will undergo multiple soldering processes, or other processes where the components may be subjected to intense heat, please check with Kingbright for compatibility. CLEANING 1. Mild "no-clean" fluxes are recommended for use in soldering. 2. If cleaning is required, Kingbright recommends to wash components with water only. Do not use harsh organic solvents for cleaning because they may damage the plastic parts . 3. The cleaning process should take place at room temperature and the devices should not be washed for more than one minute. Notes: 4. When water is used in the cleaning process, Immediately 1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple remove excess moisture from the component with forced-air attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath temperature of 260°C drying afterwards. 2. Peak wave soldering temperature between 245°C ~ 255°Cfor 3 sec (5 sec max). 3. Do not apply stress to the epoxy resin while the temperature is above 85°C. 4. Fixtures should not incur stress on the component when mounting and during soldering process. 5. SAC 305 solder alloy is recommended. 6. No more than one wave soldering pass. 7. During wave soldering, the PCB top-surface temperature should be kept below 105°C. Page 3 / 4 © 2020 Kingbright. All Rights Reserved. Spec No: DSAP8274 / 1302000211 Rev No: V.1A Date: 02/27/2020

DA56-11GWA PACKING & LABEL SPECIFICATIONS THROUGH HOLE DISPLAY MOUNTING METHOD Lead Forming Do not bend the component leads by hand without proper tools. The leads should be bent by clinching the upper part of the lead firmly such that the bending force is not exerted on the plastic body. Installation 1. The installation process should not apply stress to the lead terminals. 2. When inserting for assembly, ensure the terminal pitch matches the substrate board's hole pitch to prevent spreading or pinching the lead terminals. (Fig.1) 3. The component shall be placed at least 5mm from edge of PCB to avoid damage caused excessive heat during wave soldering.(Fig.2) CIRCUIT DESIGN NOTES 1. Protective current-limiting resistors may be necessary to operate the LEDs within the specified range. 2. LEDs mounted in parallel should each be placed in series with its own current-limiting resistor.(Fig.3) 3. The driving circuit should be designed to protect the LED against reverse voltages and transient voltage spikes when the circuit is powered up or shut down. 4. The safe operating current should be chosen after considering the maximum ambient temperature of the operating environment. 5. Prolonged reverse bias should be avoided, as it could cause metal migration, leading to an increase in leakage current or causing a short circuit. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. When any special process such as potting is required for LED assembly, please consult with Kingbright representative before proceeding. 7. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes Page 4 / 4 © 2020 Kingbright. All Rights Reserved. Spec No: DSAP8274 / 1302000211 Rev No: V.1A Date: 02/27/2020

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