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ICGOO电子元器件商城为您提供CY74FCT2827ATQCT由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供CY74FCT2827ATQCT价格参考¥9.91-¥20.22以及Texas InstrumentsCY74FCT2827ATQCT封装/规格参数等产品信息。 你可以下载CY74FCT2827ATQCT参考资料、Datasheet数据手册功能说明书, 资料中有CY74FCT2827ATQCT详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC) |
描述 | IC BUFFER TRI-ST 10BIT 24QSOP |
产品分类 | |
品牌 | Texas Instruments |
数据手册 | |
产品图片 | |
产品型号 | CY74FCT2827ATQCT |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 74FCT |
产品目录页面 | |
供应商器件封装 | 24-SSOP/QSOP |
元件数 | 1 |
其它名称 | 296-14166-6 |
包装 | Digi-Reel® |
安装类型 | 表面贴装 |
封装/外壳 | 24-SSOP(0.154",3.90mm 宽) |
工作温度 | -40°C ~ 85°C |
标准包装 | 1 |
每元件位数 | 10 |
电压-电源 | 4.75 V ~ 5.25 V |
电流-输出高,低 | 15mA,12mA |
逻辑类型 | 缓冲器/线路驱动器,非反相 |
CY74FCT2827T 10-BIT BUFFER WITH 3-STATE OUTPUTS SCCS045A – MAY 1994 – REVISED SEPTEMBER 2001 (cid:0) Function and Pinout Compatible With FCT, Q PACKAGE F, and AM29827 Logic (TOP VIEW) (cid:0) 25-Ω Output Series Resistors Reduce OE1 1 24 VCC Transmission-Line Reflection Noise (cid:0) D0 2 23 Y0 Reduced VOH (Typically = 3.3 V) Versions D1 3 22 Y1 of Equivalent FCT Functions D2 4 21 Y2 (cid:0) Edge-Rate Control Circuitry for D3 5 20 Y3 Significantly Improved Noise D4 6 19 Y4 Characteristics D5 7 18 Y5 (cid:0) Ioff Supports Partial-Power-Down Mode D6 8 17 Y6 Operation D7 9 16 Y7 (cid:0) D 10 15 Y ESD Protection Exceeds JESD 22 8 8 D 11 14 Y – 2000-V Human-Body Model (A114-A) 9 9 GND 12 13 OE – 200-V Machine Model (A115-A) 2 – 1000-V Charged-Device Model (C101) (cid:0) Matched Rise and Fall Times (cid:0) Fully Compatible With TTL Input and Output Logic Levels (cid:0) 12-mA Output Sink Current 15-mA Output Source Current (cid:0) 3-State Outputs description The CY74FCT2827T 10-bit buffer provides high-performance bus-interface buffering for wide data/address paths or buses carrying parity. This 10-bit buffer has NANDed output-enable (OE) inputs for maximum control flexibility. The CY74FCT2827T is designed for high-capacitance-load drive capability, while providing low-capacitance bus loading at both inputs and outputs. All inputs have clamp diodes and all outputs are designed for low-capacitance bus loading in the high-impedance state. On-chip termination resistors at the outputs reduce system noise caused by reflections. The CY74FCT2827T can replace the CY74FCT827T to reduce noise in an existing design. This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs, off off preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION SPEED ORDERABLE TOP-SIDE TA PACKAGE† (ns) PART NUMBER MARKING QSOP – Q Tape and reel 4.4 CY74FCT2827CTQCT FCT2827C –4400°°CC ttoo 8855°°CC QSOP – Q Tape and reel 8 CY74FCT2827ATQCT FCT2827A †Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright 2001, Texas Instruments Incorporated Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1
CY74FCT2827T 10-BIT BUFFER WITH 3-STATE OUTPUTS SCCS045A – MAY 1994 – REVISED SEPTEMBER 2001 FUNCTION TABLE INPUTS OUTPUT FFUUNNCCTTIIOONN OE1 OE2 D Y L L L L TTrraannssppaarreenntt L L H H H X X Z 33-SSttaattee X H X Z H = High logic level, L = Low logic level, X = Don’t care, Z = High-impedance state logic diagram (positive logic) 1 OE1 13 OE2 2 23 D0 Y0 To Nine Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, θ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W JA Ambient temperature range with power applied, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C A Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C stg †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 2) MIN NOM MAX UNIT VCC Supply voltage 4.75 5 5.25 V VIH High-level input voltage 2 V VIL Low-level input voltage 0.8 V IOH High-level output current –15 mA IOL Low-level output current 12 mA TA Operating free-air temperature –40 85 °C NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY74FCT2827T 10-BIT BUFFER WITH 3-STATE OUTPUTS SCCS045A – MAY 1994 – REVISED SEPTEMBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT VIK VCC = 4.75, IIN = –18 mA –0.7 –1.2 V VOH VCC = 4.75, IOH = –15 mA 2.4 3.3 V VOL VCC = 4.75, IOL = 12 mA 0.3 0.55 V Rout VCC = 4.75, IOL = 12 mA 20 25 40 Ω Vhys All inputs 0.2 V II VCC = 5.25 V, VIN = VCC 5 µA IIH VCC = 5.25 V, VIN = 2.7 V ±1 µA IIL VCC = 5.25 V, VIN = 0.5 V ±1 µA IOS‡ VCC = 5.25 V, VOUT = 0 V –60 –120 –225 mA Ioff VCC = 0 V, VOUT = 4.5 V ±1 µA IOZH VCC = 5.25 V, VOUT = 2.7 V 10 µA IOZL VCC = 5.25 V, VOUT = 0.5 V –10 µA ICC VCC = 5.25 V, VIN ≤ 0.2 V, VIN ≥VCC – 0.2 V 0.1 0.2 mA ∆ICC VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open 0.5 2 mA ICCD¶ VOCEC1 o=r 5O.2E52 V=, GONneD i,n VpIuNt s≤w0it.c2h Vin ogr a Vt I5N0 %≥V dCuCty –c y0c.l2e ,V O, utputs open, 0.06 0.12 MmHAz/ One bit switching VIN ≤0.2 V or at f11 = 10 MHz VIN ≥VCC – 0.2 V 0.7 1.4 IICC### VOOCuuttCpp uu=tt ss5 oo.2pp5ee nnV,, at 50% duty cycle VIN = 3.4 V or GND 1 2.4 mmAA OE1 or OE2 = GND Taet nf11 b =it s2 .s5w MitcHhzing VVIINN ≤≥0V.C2 CV –o r0.2 V 1.6 3.2|| at 50% duty cycle VIN = 3.4 V or GND 4.1 13.2|| Ci 5 10 pF Co 9 12 pF †Typical values are at VCC = 5 V, TA = 25°C. ‡Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. §Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND ¶This parameter is derived for use in total power-supply calculations. #IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. ||Values for these conditions are examples of the ICC formula. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3
CY74FCT2827T 10-BIT BUFFER WITH 3-STATE OUTPUTS SCCS045A – MAY 1994 – REVISED SEPTEMBER 2001 switching characteristics over operating free-air temperature range (see Figure 1) FROM TO CY74FCT2827AT CY74FCT2827CT PPAARRAAMMEETTEERR TTEESSTT LLOOAADD UUNNIITT (INPUT) (OUTPUT) MIN MAX MIN MAX tPLH DD YY CLL = 50 pF,, 1.5 8 1.5 4.4 nnss tPHL RL = 500 Ω 1.5 8 1.5 4.4 tPLH DD YY CLL = 300 pF,, 1.5 15 1.5 10 nnss tPHL RL = 500 Ω 1.5 15 1.5 10 tPZH OOEE YY CLL = 50 pF,, 1.5 12 1.5 7 nnss tPZL RL = 500 Ω 1.5 12 1.5 7 tPZH OOEE YY CLL = 300 pF,, 1.5 23 1.5 14 nnss tPZL RL = 500 Ω 1.5 23 1.5 14 tPHZ OOEE YY CLL = 5 pF,, 1.5 9 1.5 5.7 nnss tPLZ RL = 500 Ω 1.5 9 1.5 5.7 tPHZ CLL = 50 pF, 1.5 9 1.5 6 tPLZ OOEE YY RL = 500 Ω 1.5 9 1.5 6 nnss 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY74FCT2827T 10-BIT BUFFER WITH 3-STATE OUTPUTS SCCS045A – MAY 1994 – REVISED SEPTEMBER 2001 PARAMETER MEASUREMENT INFORMATION 7 V 500 Ω S1 Open From Output Test From Output Under Test Point Under Test GND TEST S1 (sCeeL N= o5t0e pAF) 500 Ω (sCeeL N= o5t0e pAF) 500 Ω ttPPLLHZ//ttPPZHLL O7p Ven tPHZ/tPZH Open LOAD CIRCUIT FOR LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3-STATE OUTPUTS 3 V Timing Input 1.5 V tw 0 V th 3 V tsu 3 V Input 1.5 V 1.5 V Data Input 1.5 V 1.5 V 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUP AND HOLD TIMES 3 V 3 V Output Input 1.5 V 1.5 V Control 1.5 V 1.5 V 0 V 0 V tPLH tPHL tPZL tPLZ In-Phase VOH Output ≈3.5 V Output 1.5 V 1.5 V Waveform 1 1.5 V VOL + 0.3 V VOL (see Note B) VOL tPHL tPLH tPZH tPHZ VOH Output VOH Out-of-Phase 1.5 V 1.5 V Waveform 2 1.5 V VOH – 0.3 V Output VOL (see Note B) ≈0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES INVERTING AND NONINVERTING OUTPUTS LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5
PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) CY74FCT2827ATQCT ACTIVE SSOP DBQ 24 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT2827A & no Sb/Br) CY74FCT2827ATQCTG4 ACTIVE SSOP DBQ 24 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT2827A & no Sb/Br) CY74FCT2827CTQCT ACTIVE SSOP DBQ 24 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT2827C & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1
PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) CY74FCT2827ATQCT SSOP DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT2827CTQCT SSOP DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 PackMaterials-Page1
PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) CY74FCT2827ATQCT SSOP DBQ 24 2500 367.0 367.0 38.0 CY74FCT2827CTQCT SSOP DBQ 24 2500 367.0 367.0 38.0 PackMaterials-Page2
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