1CY74FCT162374T Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. CY74FCT16374T CY74FCT162374T 16-Bit Registers SCCS055C - August 1994 - Revised September 2001 Features Functional Description • I supports partial-power-down mode operation CY74FCT16374T and CY74FCT162374T are 16-bit D-type off • Edge-rate control circuitry for significantly improved registersdesignedforuseasbufferedregistersinhigh-speed, noise characteristics lowpowerbusapplications.Thesedevicescanbeusedastwo • Typical output skew < 250 ps independent 8-bit registers or as a single 16-bit register by connecting the output Enable (OE) and Clock (CLK) inputs. • ESD > 2000V Flow-through pinout and small shrink packaging aid in • TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) simplifying board layout. packages • Industrial temperature range of−40˚C to +85˚C This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs, • V = 5V± 10% off off CC preventing damaging current backflow through the device CY74FCT16374T Features: when it is powered down. • 64 mA sink current, 32 mA source current The CY74FCT16374T is ideally suited for driving high-capacitance loads and low-impedance backplanes. • Typical V (ground bounce) <1.0V at V = 5V, OLP CC TA = 25˚C The CY74FCT162374T has 24-mA balanced output drivers withcurrentlimitingresistorsintheoutputs.Thisreducesthe CY74FCT162374T Features: need for external terminating resistors and provides for • Balanced 24 mA output drivers minimal undershoot and reduced ground bounce. The • Reduced system switching noise CY74FCT162374T is ideal for driving transmission lines. • Typical V (ground bounce) <0.6V at V = 5V, OLP CC T = 25˚C A LogicBlockDiagrams Pin Configuration SSOP/TSSOP Top View 1OE 1 48 1CLK 1O1 2 47 1D1 1O2 3 46 1D2 1OE 2OE GND 4 45 GND 1O3 5 44 1D3 1O4 6 43 1D4 1CLK 2CLK VCC 7 42 VCC D D 1O5 8 41 1D5 1D1 1O1 2D1 2O1 1O6 9 40 1D6 C C GND 10 39 GND 1O7 11 38 1D7 1O8 12 37 1D8 2O1 13 36 2D1 2O2 14 35 2D2 TO7OTHER CHANNELS TO7OTHERCHANNELS GND 15 34 GND 2O3 16 33 2D3 FCT162374-1 FCT162374-2 2O4 17 32 2D4 VCC 18 31 VCC 2O5 19 30 2D5 2O6 20 29 2D6 GND 21 28 GND 2O7 22 27 2D7 2O8 23 26 2D8 2OE 24 25 2CLK FCT162374-3 Copyright © 2001, Texas Instruments Incorporated

CY74FCT16374T CY74FCT162374T Function Table[1] Maximum Ratings[2, 3] Inputs Outputs (Above which the useful life may be impaired. For user guidelines, not tested.) D CLK OE O Function Storage Temperature .............................. −55°C to +125°C X L H Z High-Z Ambient Temperature with X H H Z Power Applied.......................................... −55°C to +125°C L L L Load DC Input Voltage.................................................−0.5V to +7.0V Register H L H DC Output Voltage..............................................−0.5V to +7.0V L H Z DC Output Current H H Z (Maximum Sink Current/Pin)............................−60 to +120 mA Power Dissipation..........................................................1.0W Pin Description Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015) Name Description D Data Inputs Operating Range CLK Clock Inputs Ambient OE Three-State Output Enable Inputs (Active LOW) Range Temperature V CC O Three-State Outputs Industrial −40°C to +85°C 5V± 10% Electrical Characteristics Over the Operating Range Parameter Description Test Conditions Min. Typ.[4] Max. Unit V Input HIGH Voltage 2.0 V IH V Input LOW Voltage 0.8 V IL V Input Hysteresis[5] 100 mV H V Input Clamp Diode Voltage V =Min., I =−18 mA −0.7 −1.2 V IK CC IN I Input HIGH Current V =Max., V=V ±1 µA IH CC I CC I Input LOW Current V =Max., V=GND ±1 µA IL CC I I High Impedance Output Current V =Max., V =2.7V ±1 µA OZH CC OUT (Three-State Output pins) I High Impedance Output Current V =Max., V =0.5V ±1 µA OZL CC OUT (Three-State Output pins) I Short Circuit Current[6] V =Max., V =GND −80 −140 −200 mA OS CC OUT I Output Drive Current[6] V =Max., V =2.5V −50 −180 mA O CC OUT I Power-Off Disable V =0V, V ≤4.5V[7] ±1 µA OFF CC OUT Output Drive Characteristics for CY74FCT16374T Parameter Description Test Conditions Min. Typ.[4] Max. Unit V Output HIGH Voltage V =Min., I =−3 mA 2.5 3.5 V OH CC OH V =Min., I =−15 mA 2.4 3.5 V CC OH V =Min., I =−32 mA 2.0 3.0 V CC OH V Output LOW Voltage V =Min., I =64 mA 0.2 0.55 V OL CC OL Notes: 1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = HIGH Impedance. = LOW-to-HIGH Transition. 2. Operationbeyondthelimitssetforthmayimpairtheusefullifeofthedevice.Unlessotherwisenoted,theselimitsareovertheoperatingfree-airtemperature range. 3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 4. Typical values are at VCC= 5.0V, TA= +25˚C ambient. 5. This parameter is specified but not tested. 6. Notmorethanoneoutputshouldbeshortedatatime.Durationofshortshouldnotexceedonesecond.Theuseofhigh-speedtestapparatusand/orsample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting ofahighoutputmayraisethechiptemperaturewellabovenormalandtherebycauseinvalidreadingsinotherparametrictests.Inanysequenceofparameter tests, IOS tests should be performed last. 7. Tested at +25˚C. 2

CY74FCT16374T CY74FCT162374T Output Drive Characteristics for CY74FCT162374T Parameter Description Test Conditions Min. Typ.[4] Max. Unit I Output LOW Current[6] V =5V, V =V or V , V =1.5V 60 115 150 mA ODL CC IN IH IL OUT I Output HIGH Current[6] V =5V, V =V or V , V =1.5V −60 −115 −150 mA ODH CC IN IH IL OUT V Output HIGH Voltage V =Min., I =−24 mA 2.4 3.3 V OH CC OH V Output LOW Voltage V =Min., I =24 mA 0.3 0.55 V OL CC OL Capacitance[5](T = +25˚C, f = 1.0 MHz) A Parameter Description Test Conditions Typ.[4] Max. Unit C Input Capacitance V = 0V 4.5 6.0 pF IN IN C Output Capacitance V = 0V 5.5 8.0 pF OUT OUT Power Supply Characteristics Parameter Description Test Conditions Typ.[4] Max. Unit I QuiescentPowerSupplyCurrent V =Max. V ≤0.2V, 5 500 µA CC CC IN V ≥V −0.2V IN CC ∆I QuiescentPowerSupplyCurrent V =Max. V =3.4V[8] 0.5 1.5 mA CC CC IN (TTL inputs HIGH) I Dynamic Power Supply V =Max., One Input V =V or 60 100 µA/ CCD CC IN CC Current[9] Toggling, 50% Duty Cycle, V =GND MHz IN Outputs Open,OE=GND I Total Power Supply Current[10] V =Max., f =10 MHz, V =V or 0.6 1.5 mA C CC 0 IN CC f =5 MHz, 50% Duty Cycle, V =GND 1 IN Outputs Open, One Bit V =3.4V or 1.1 3.0 mA Toggling,OE=GND IN V =GND IN V =Max., f =10 MHz, V =V or 3.0 5.5[11] mA CC 0 IN CC f =2.5 MHz, 50% Duty V =GND 1 IN Cycle,OutputsOpen,Sixteen V =3.4V or 7.5 19.0[11] mA Bits Toggling,OE=GND IN V =GND IN Note: 8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. 10. IC = IQUIESCENT + IINPUTS+ IDYNAMIC IC = ICC+∆ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) DH = Duty Cycle for TTL inputs HIGH NT = Number of TTL inputs at DH ICCD = Dynamic Current caused by an input transition pair(HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamps and all frequencies are in megahertz. 11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 3

CY74FCT16374T CY74FCT162374T Switching Characteristics Over the Operating Range[12] CY74FCT16374T CY74FCT16374AT CY74FCT162374T CY74FCT162374AT Fig. Parameter Description Min. Max. Min. Max. Unit No.[13] t Propagation Delay 2.0 10.0 2.0 6.5 ns 1, 5 PLH t CLK to O PHL t Output Enable Time 1.5 12.5 1.5 6.5 ns 1, 7, 8 PZH t PZL t Output Disable Time 1.5 8.0 1.5 5.5 ns 1, 7, 8 PHZ t PLZ t Set-Up Time HIGH or LOW, 2.0 2.0 ns 4 SU D to CLK t Hold Time HIGH or LOW, 1.5 1.5 ns 4 H D to CLK t CLK Pulse Width 5.0 5.0 ns 5 W HIGH or LOW t Output Skew[14] 0.5 0.5 ns SK(O) CY74FCT16374CT CY74FCT162374CT Fig. Parameter Description Min. Max. Unit No.[13] t Propagation Delay 2.0 5.2 ns 1, 5 PLH t CLK to O PHL t Output Enable Time 1.5 5.5 ns 1, 7, 8 PZH t PZL t Output Disable Time 1.5 5.0 ns 1, 7, 8 PHZ t PLZ t Set-Up Time HIGH or LOW, 2.0 ns 4 SU D to CLK t Hold Time HIGH or LOW, 1.5 ns 4 H D to CLK t CLK Pulse Width 3.3 ns 5 W HIGH or LOW t Output Skew[14] 0.5 ns SK(O) Notes: 12. Minimum limits are specified but not tested on Propagation Delays. 13. See “Parameter Measurement Information” in the General Information section. 14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design. 4

CY74FCT16374T CY74FCT162374T Ordering Information CY74FCT16374T Speed Package Operating (ns) Ordering Code Name Package Type Range 5.2 CY74FCT16374CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT16374CTPVC/PVCT O48 48-Lead (300-Mil) SSOP 6.5 CY74FCT16374ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT16374ATPVC/PVCT O48 48-Lead (300-Mil) SSOP 10.0 CY74FCT16374TPVC/PVCT O48 48-Lead (300-Mil) SSOP Industrial Ordering Information CY74FCT162374T Speed Package Operating (ns) Ordering Code Name Package Type Range 5.2 74FCT162374CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162374CTPVC O48 48-Lead (300-Mil) SSOP 74FCT162374CTPVCT O48 48-Lead (300-Mil) SSOP 6.5 74FCT162374ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162374ATPVC O48 48-Lead (300-Mil) SSOP 74FCT162374ATPVCT O48 48-Lead (300-Mil) SSOP 10.0 CY74FCT162374TPVC/PVCT O48 48-Lead (300-Mil) SSOP Industrial 5

CY74FCT16374T CY74FCT162374T Package Diagrams 48-LeadShrunkSmallOutlinePackageO48 48-LeadThinShrunkSmallOutlinePackageZ48 6

PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty 74FCT162374ATPACT ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT162374ATPVCG4 ACTIVE SSOP DL 48 25 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT162374ATPVCT ACTIVE SSOP DL 48 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT162374CTPACT ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT162374CTPVCG4 ACTIVE SSOP DL 48 25 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT162374CTPVCT ACTIVE SSOP DL 48 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT162374ETPACT OBSOLETE TSSOP DGG 48 TBD CallTI CallTI 74FCT162374ETPVCT OBSOLETE SSOP DL 48 TBD CallTI CallTI 74FCT162374TPVCTG4 ACTIVE SSOP DL 48 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT16374ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT16374ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT16374ATPVCG4 ACTIVE SSOP DL 48 25 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT16374ATPVCTG4 ACTIVE SSOP DL 48 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT16374CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT16374CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT16374CTPVCG4 ACTIVE SSOP DL 48 25 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT16374CTPVCTG4 ACTIVE SSOP DL 48 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74FCT16374TPVCG4 ACTIVE SSOP DL 48 25 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CY74FCT162374ATPVC ACTIVE SSOP DL 48 25 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CY74FCT162374CTPVC ACTIVE SSOP DL 48 25 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CY74FCT162374ETPAC OBSOLETE TSSOP DGG 48 TBD CallTI CallTI CY74FCT162374ETPVC OBSOLETE SSOP DL 48 TBD CallTI CallTI CY74FCT162374TPVCT ACTIVE SSOP DL 48 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CY74FCT16374ATPACT ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CY74FCT16374ATPVC ACTIVE SSOP DL 48 25 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CY74FCT16374ATPVCT ACTIVE SSOP DL 48 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CY74FCT16374CTPACT ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM Addendum-Page1

PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty noSb/Br) CY74FCT16374CTPVC ACTIVE SSOP DL 48 25 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CY74FCT16374CTPVCT ACTIVE SSOP DL 48 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CY74FCT16374ETPAC OBSOLETE TSSOP DGG 48 TBD CallTI CallTI CY74FCT16374ETPACT OBSOLETE TSSOP DGG 48 TBD CallTI CallTI CY74FCT16374ETPVC OBSOLETE SSOP DL 48 TBD CallTI CallTI CY74FCT16374ETPVCT OBSOLETE SSOP DL 48 TBD CallTI CallTI CY74FCT16374TPVC ACTIVE SSOP DL 48 25 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) FCT162374ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) FCT162374ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) FCT162374ATPVCTG4 ACTIVE SSOP DL 48 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) FCT162374CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) FCT162374CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) FCT162374CTPVCTG4 ACTIVE SSOP DL 48 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) (1)Themarketingstatusvaluesaredefinedasfollows: ACTIVE:Productdevicerecommendedfornewdesigns. LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect. NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartin anewdesign. PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable. OBSOLETE:TIhasdiscontinuedtheproductionofthedevice. (2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheck http://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails. TBD:ThePb-Free/Greenconversionplanhasnotbeendefined. Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirements forall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesoldered athightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses. Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieand package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible)asdefinedabove. Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflame retardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimited informationmaynotbeavailableforrelease. InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTI Addendum-Page2

PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 toCustomeronanannualbasis. Addendum-Page3

PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) 74FCT162374ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 74FCT162374ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 74FCT162374CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 74FCT162374CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT162374TPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT16374ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16374ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT16374CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16374CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) 74FCT162374ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0 74FCT162374ATPVCT SSOP DL 48 1000 346.0 346.0 49.0 74FCT162374CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0 74FCT162374CTPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT162374TPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT16374ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0 CY74FCT16374ATPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT16374CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0 CY74FCT16374CTPVCT SSOP DL 48 1000 346.0 346.0 49.0 PackMaterials-Page2

MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,50 0,08 M 0,17 48 25 6,20 8,30 6,00 7,90 0,15 NOM Gage Plane 0,25 1 24 0°–8° A 0,75 0,50 Seating Plane 0,15 1,20 MAX 0,10 0,05 PINS ** 48 56 64 DIM A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 4040078/F 12/97 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.005 (0,13) M 0.008 (0,203) 48 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 24 0°–(cid:1)8° 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.004 (0,10) 0.110 (2,79) MAX 0.008 (0,20) MIN PINS ** 28 48 56 DIM 0.380 0.630 0.730 A MAX (9,65) (16,00) (18,54) 0.370 0.620 0.720 A MIN (9,40) (15,75) (18,29) 4040048/E 12/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-118 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 74FCT162374ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162374A & no Sb/Br) 74FCT162374CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162374C & no Sb/Br) 74FCT162374CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162374C & no Sb/Br) CY74FCT162374ATPVC ACTIVE SSOP DL 48 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162374A & no Sb/Br) CY74FCT162374CTPVC ACTIVE SSOP DL 48 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162374C & no Sb/Br) CY74FCT162374TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT162374 & no Sb/Br) CY74FCT16374ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16374A & no Sb/Br) CY74FCT16374ATPVC ACTIVE SSOP DL 48 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16374A & no Sb/Br) CY74FCT16374ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16374A & no Sb/Br) CY74FCT16374CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16374C & no Sb/Br) CY74FCT16374CTPVC ACTIVE SSOP DL 48 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16374C & no Sb/Br) CY74FCT16374TPVC ACTIVE SSOP DL 48 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 FCT16374 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 15-Sep-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) 74FCT162374ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 13.0 1.8 12.0 24.0 Q1 74FCT162374CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 13.0 1.8 12.0 24.0 Q1 74FCT162374CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT162374TPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT16374ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 13.0 1.8 12.0 24.0 Q1 CY74FCT16374ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT16374CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 13.0 1.8 12.0 24.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 15-Sep-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) 74FCT162374ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 74FCT162374CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0 74FCT162374CTPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT162374TPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT16374ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16374ATPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT16374CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0 PackMaterials-Page2

None

MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,50 0,08 M 0,17 48 25 6,20 8,30 6,00 7,90 0,15 NOM Gage Plane 0,25 1 24 0°–8° A 0,75 0,50 Seating Plane 0,15 1,20 MAX 0,10 0,05 PINS ** 48 56 64 DIM A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 4040078/F 12/97 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

IMPORTANTNOTICEANDDISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated