CY2304NZ Four Output PCI-X and General Purpose Buffer Four Output PCI-X and General Purpose Buffer Features Functional Description ■One input to four output buffer/driver The CY2304NZ is a low-cost buffer designed to distribute high-speed clocks for PCI-X and other applications. The device ■General-purpose or PCI-X clock buffer operates at 3.3 V and outputs can run up to 140 MHz. ■Buffers all frequencies from DC to 140 MHz For a complete list of related documentation, click here. ■Output-to-output skew less than 100 ps Function Table ■Space-saving 8-pin TSSOP package Inputs Outputs ■3.3 V operation BUF_IN OE Output [1:4] ■60 ps typical output-output skew L L L H L L L H L H H H Block Diagram Logic OE Control BUF_IN OUTPUT1 OUTPUT2 OUTPUT3 OUTPUT4 Pin Configuration 8-pin TSSOP Top View BUF_IN 1 8 OUTPUT4 OE 2 7 OUTPUT3 OUTPUT1 3 6 VDD GND 4 5 OUTPUT2 Pin Description For CY2304NZ Signal Pin Description V 6 3.3 V voltage supply DD GND 4 Ground BUF_IN 1 Input clock OUTPUT [1:4] 3, 5, 7, 8 Outputs OE 2 Input pin for output enable, active HIGH. CypressSemiconductorCorporation • 198 Champion Court • SanJose, CA 95134-1709 • 408-943-2600 Document Number: 38-07099 Rev. *K Revised May 4, 2016

CY2304NZ Maximum Ratings Storage Temperature ...............................–65 °C to +150 °C Max. Soldering Temperature (10 sec.) ......................260 °C Supply Voltage to Ground Potential ....–0.5 V to V + 0.5 V DD Junction Temperature ................................................150 °C DC Input Voltage ................................–0.5 V to V + 0.5 V DD Operating Conditions Parameter Description Min Max Unit V Supply Voltage 3.0 3.6 V DD T Operating Temperature (Ambient Temperature) –40 85 °C A C Load Capacitance – 25 pF L C Input Capacitance – 7 pF IN BUF_IN, Operating Frequency DC 140 MHz OUTPUT [1:4] t [1] Power-up time for all VDD’s to reach minimum specified voltage (power ramps must 0.05 50 ms PU be monotonic) Electrical Characteristics Parameter Description Test Conditions Min Max Unit V Input LOW Voltage [2] – 0.8 V IL V Input HIGH Voltage [2] 2.0 – V IH I Input LOW Current V = 0 V –5 5 A IL IN I Input HIGH Current V = V –5 5 A IH IN DD V Output LOW Voltage [3] I = 24 mA – 0.8 V OL OL I = 12 mA – 0.55 V OL V Output HIGH Voltage [3] I = –24 mA 2.0 – V OH OH I = –12 mA 2.4 – V OH I Supply Current Unloaded outputs at 66.66 MHz – 25 mA DD Thermal Resistance Parameter [4] Description Test Conditions 8-pin TSSOP Unit θ Thermal resistance Test conditions follow standard test methods and 165 °C/W JA (junction to ambient) procedures for measuring thermal impedance, in accordance with EIA/JESD51. θ Thermal resistance 33 °C/W JC (junction to case) Notes 1. This operating condition guarantees skew and propagation delay. 2. BUF_IN input has a threshold voltage of VDD/2. 3. Parameter is guaranteed by design and characterization. It is not 100% tested in production. 4. These parameters are guaranteed by design and are not tested. Document Number: 38-07099 Rev. *K Page 2 of 8

CY2304NZ Switching Characteristics For Commercial and Industrial Temperature Devices which are characterized over the frequency range of 1 MHz to 140 MHz. Parameter [5] Name Description Min Typ Max Unit Duty Cycle [6] = t  t Measured at 1.5 V 40.0 50.0 60.0 % 2 1 t Rise Time [6] Measured between 0.8 V and 2.0 V – – 1.50 ns 3 t Fall Time [6] Measured between 0.8 V and 2.0 V – – 1.50 ns 4 t Output to Output Skew [6] All outputs equally loaded – 60 100 ps 5 t Propagation Delay, Measured at V /2 2.5 3.5 5 ns 6 DD BUF_IN Rising Edge to OUTPUT Rising Edge [6] Switching Waveforms Figure 1. Duty Cycle Timing t1 t2 1.5 V 1.5 V 1.5 V Figure 2. All Outputs Rise/Fall Time 2.0 V 2.0 V 3.3 V OUTPUT 0.8 V 0.8 V 0 V t3 t4 Figure 3. Output-Output Skew 1.5 V OUTPUT 1.5 V OUTPUT t5 Figure 4. Input-Output Propagation Delay V /2 INPUT DD V /2 OUTPUT DD t6 Notes 5. All parameters specified with loaded outputs. 6. Parameter is guaranteed by design and characterization. It is not 100% tested in production. Document Number: 38-07099 Rev. *K Page 3 of 8

CY2304NZ Ordering Information Ordering Code Package Type Operating Range Standard CY2304NZZI-1 8-pin TSSOP Industrial, –40 °C to 85 °C CY2304NZZI-1T 8-pin TSSOP – Tape and Reel Industrial, –40 °C to 85 °C Pb-free CY2304NZZXC-1 8-pin TSSOP Commercial, 0 °C to 70 °C CY2304NZZXC-1T 8-pin TSSOP – Tape and Reel Commercial, 0 °C to 70 °C CY2304NZZXI-1 8-pin TSSOP Industrial, –40 °C to 85 °C CY2304NZZXI-1T 8-pin TSSOP – Tape and Reel Industrial, –40 °C to 85 °C Ordering Code Definitions CY 2304NZ Z X X - X X X = blank or T blank = Tube; T = Tape and Reel X = 1 or 2 Temperature Range: X = C or I C = Commercial; I = Industrial X = Pb-free Package Type: Z = 8-pin TSSOP Base Device Part Number Company ID: CY = Cypress Document Number: 38-07099 Rev. *K Page 4 of 8

CY2304NZ Package Diagram Figure 5. 8-pin TSSOP (4.40 mm Body) Z08.173/ZZ08.173 Package Outline, 51-85093 51-85093 *E Document Number: 38-07099 Rev. *K Page 5 of 8

CY2304NZ Acronyms Document Conventions Acronym Description Units of Measure PCI Peripheral Component Interconnect Symbol Unit of Measure TSSOP Thin-Shrink Small Outline Package °C degree Celsius Hz hertz MHz megahertz µA microampere mA milliampere ms millisecond mV millivolt ns nanosecond  ohm % percent pF picofarad ps picosecond V volt W watt Document Number: 38-07099 Rev. *K Page 6 of 8

CY2304NZ Document History Page Document Title: CY2304NZ, Four Output PCI-X and General Purpose Buffer Document Number: 38-07099 Orig. of Rev. ECN No. Issue Date Description of Change Change ** 111420 02/12/02 IKA New data sheet. *A 118610 09/25/02 HWT Updated Ordering Information: Added Industrial Temperature Range in the Ordering Information. *B 121820 12/14/02 RBI Updated Operating Conditions: Added t parameter and its details. PU *C 291098 See ECN RGL Updated Switching Characteristics: Specified typical value for “Output to Output Skew” parameter. Updated Ordering Information: Added Lead-free Devices. *D 2904623 04/05/10 CXQ Updated Ordering Information (Removed inactive parts). Updated Package Diagram. *E 3163624 02/05/2011 CXQ Updated Maximum Ratings (Removed reference to “Except REF” and “REF” for DC Input Voltage spec). Added Ordering Code Definitions. Updated Package Diagram. Added Acronyms and Units of Measure. Updated to new template. *F 3931498 04/08/2013 PURU Updated Maximum Ratings: Removed “Static Discharge Voltage” and its related information. Updated Package Diagram: spec 51-85093 – Changed revision from *C to *D. *G 4103402 08/23/2013 MNSB Updated Operating Conditions: Added Note 1 and referred the same note in t parameter. PU Updated to new template. *H 4312848 03/18/2014 CINM No technical updates. Completing Sunset Review. *I 4578443 11/25/2014 AJU Updated Functional Description: Added “For a complete list of related documentation, click here.” at the end. Updated Package Diagram: spec 51-85093 – Changed revision from *D to *E. *J 4756553 05/06/2015 TAVA Updated Switching Characteristics: Replaced “For Commercial and Industrial Temperature Devices” with “For Commercial and Industrial Temperature Devices which are characterized over the frequency range of 1 MHz to 140 MHz.” for characterization. *K 5258800 05/04/2016 PSR Added Thermal Resistance. Updated to new template. Document Number: 38-07099 Rev. *K Page 7 of 8

CY2304NZ Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products PSoC®Solutions ARM® Cortex® Microcontrollers cypress.com/arm PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Automotive cypress.com/automotive Cypress Developer Community Clocks & Buffers cypress.com/clocks Forums | Projects | Video | Blogs | Training | Components Interface cypress.com/interface Technical Support Lighting & Power Control cypress.com/powerpsoc cypress.com/support Memory cypress.com/memory PSoC cypress.com/psoc Touch Sensing cypress.com/touch USB Controllers cypress.com/usb Wireless/RF cypress.com/wireless © Cypress Semiconductor Corporation, 2002-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document, including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited. TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 38-07099 Rev. *K Revised May 4, 2016 Page 8 of 8