Features Applications n 0805 size n Mobile phones n Available in E12 series n Cellular phones n High Q up to 80 typ. n CTV, VCR, HIC, FDD n High operating temperature of 125 °C n Small size of only 2.0 mm n RoHS compliant* CW201212 Series - High Q Chip Inductors Electrical Specifications General Specifications Test Freq. SRF RDC I rms Temperature Rise Inductance Q Bourns® Part No. (MHz) (MHz) (Ohms) (mA) .................40 °C max. at rated current Tol. Operating Temperature nH Min. L Q Min. Max. Max. % ................................-40 °C to +125 °C CW201212-2N2J 2.2 ±5 50 250 1500 8000 0.06 800 Storage Temperature CW201212-2N7J 2.7 ±5 35 250 1000 6000 0.08 800 ................................-40 °C to +125 °C Reflow Soldering ..230 °C, 50 sec. max. CW201212-2N8J 2.8 ±5 30 250 1000 5000 0.08 800 Resistance to Soldering Heat CW201212-3N3J 3.3 ±5 50 250 1000 7900 0.08 600 ............................+260 °C, 5 seconds CW201212-3N9J 3.9 ±5 60 250 1000 6000 0.06 600 Moisture Sensitivity Level .....................2 CW201212-4N7J 4.7 ±5 60 250 1000 5800 0.06 600 ESD Classification (HBM).................N/A CW201212-5N6J 5.6 ±5 60 250 1000 5800 0.08 600 CW201212-6N8J 6.8 ±5 50 250 1000 5500 0.11 600 Materials CW201212-8N2J 8.2 ±5 50 250 1000 4700 0.12 600 Core Material CW201212-10NJ 10 ±5 50 250 500 4300 0.12 600 -2N2J through -R39J ..............Ceramic -R47J through -R91J .................Ferrite CW201212-12NJ 12 ±5 50 250 500 4000 0.15 600 Wire ........Enameled copper (1W1E180) CW201212-15NJ 15 ±5 50 250 500 3400 0.17 600 Terminal ...........................Mo/Mn+Ni+Au CW201212-18NJ 18 ±5 50 250 500 3300 0.20 600 Packaging .................2,000 pcs. per reel CW201212-22NJ 22 ±5 55 250 500 2600 0.22 500 CW201212-27NJ 27 ±5 55 250 500 2500 0.25 500 Product Dimensions CW201212-33NJ 33 ±5 60 250 500 2050 0.27 500 1.2 ± 0.2 0.6 CW201212-39NJ 39 ±5 60 250 500 2000 0.29 500 (.024)TYP. (.047 ± .008) CW201212-47NJ 47 ±5 60 200 500 1650 0.31 500 CW201212-56NJ 56 ±5 60 200 500 1550 0.34 500 CW201212-68NJ 68 ±5 60 200 500 1450 0.38 500 CW201212-82NJ 82 ±5 60 150 500 1300 0.42 400 CW201212-R10J 100 ±5 60 150 500 1200 0.46 400 2.0 ± 0.2 (.079 ± .008) CW201212-R12J 120 ±5 50 150 250 1100 0.51 400 CW201212-R15J 150 ±5 50 100 250 920 0.56 400 1.25 ± 0.2 CW201212-R18J 180 ±5 50 100 250 900 0.78 400 (.049 ± .008) CW201212-R22J 220 ±5 50 100 250 860 1.00 400 CW201212-R27J 270 ±5 45 100 250 850 1.46 350 0.4 ± 0.1 0.4 ± 0.1 CW201212-R33J 330 ±5 45 100 250 800 1.65 300 (.016 ± .004) (.016 ± .004) CW201212-R39J 390 ±5 45 100 250 780 2.20 210 CW201212-R47J 470 ±5 33 50 100 375 1.76 250 Recommended Layout CW201212-R56J 560 ±5 23 25 50 340 1.90 230 CW201212-R68J 680 ±5 23 25 50 215 2.20 190 1.02 1.02 REF. REF. CW201212-R82J 820 ±5 23 25 50 188 2.35 180 (.040) (.040) CW201212-R91J 910 ±5 22 25 50 180 3.00 180 Note: 2 % tolerance available for inductance ranges of 12 nH and above. Replace “J” with “G”. REF.(0.0.7360) (1.0.7780)REF. MM DIMENSIONS: (INCHES) WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

CW201212 Series - High Q Chip Inductors Soldering Profile Temperature Rising Area Preheat Area Reflow Area Forced Cooling Area +2.0~4.0 °C / +4.0 °C / sec. max. 150~200 °C / 60~120 sec. s ec. m ax.-(1.0~5.0) °C / sec. max. 250 230 °C °C) 200 50 sec. max. P26ea0k ° TCe mmapxe.rature: e ( 70 sec. max. atur 150 Time Above 230 °C: er 50 sec. max. mp 100 Te Time Above 200 °C: 50 70 sec. max. 0 50 100 150 200 250 Time (Seconds) Packaging Specifications 2.0 ± 0.5 178.0 (.079 ± .020) 2.0 ± 0.5 (7.00) 178.0 (.079 ± .020) 12.5 DIA. (7.00) (.492) 12.5 DIA. (.492) THICKNESS 0.10 13.0 ± 0.5 (.004) (.2812.70 ±± .00.381) 21.0 ± 0.8 (.512D ±IA ..020)(.1531.20 ±± .00.250) MAX. (.827 ± .031) DIA. EMBOSSED CAVITY 50.0 (1.969) 50.0 (1.969) 13.0 ± 0.5 (.512 ± .020)D1IA3..0 ± 0.5 DIA. (.512 ± .020) EMBOSSED CARRIER 8.0 (.315) 10.0 (.393) 10.0 (.393) MM DIMENSIONS: (INCHES) REV. 05/19 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

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