Features Applications NT MPLIA ■ Monolithic construction offering high ■ DC/DC converters for: HS CO reliability - Smart p hones *Ro ■ Magnetically shielded construction - DVCs / D SCs providing low radiation - Tablets - HDDs / S SDs ■ Low DC resistance - Mobile e lectronic devices ■ Low profile, 1008 size (2.5 x 2 x 0.9 mm) REE ■ RoHS compliant* D F LEA CVH252009 Series Multilayer Power Chip Inductors Bourns® Part No. @In d1u McHtazn /c 0e. 1(1L VEV)EA RD H SISF ORCNEOSE MAPRLIE ANT*(MSRHFz ) (ODhCmRs ) (ImDAC) O Stp o.e.r.ar.a.g.t.ei.n. .Tg..e .T.m.e..pm(.T.e.pe.r.aem..tr.upa..ret.eu.r.ra.e.t-u5r5e °rCis eto i n+c1lu2d5e °dC) L (µH) ToRol. Typ. Max. Typ. .....................+40 °C max. at 70 % RH CVH252009-R47M 0.47 ±20 % 100 0.04 1800 Resistance to Soldering Heat CVH252009-1R0M 1.0 ±20 % 60 0.055 1600 ...............................................+260 °C Temperature Rise CVH252009-1R5M 1.5 ±20 % 50 0.07 1500 .........................40 °C at rated current CVH252009-2R2M 2.2 ±20 % 40 0.08 1300 Moisture Sensitivity Level .....................1 CVH252009-3R3M 3.3 ±20 % 30 0.10 1200 .................N/A CVH252009-4R7M 4.7 ±20 % 25 0.11 1100 (1) Apply 0.4 - 0.6 Adc to inductor for 1 - 3 seconds before taking inductance measurement. Materials 101 12.7 ± 0.3 (.500 ± .012) Core ..............................................Ferrite Terminal .........................................Ni/Sn Packaging .......3000 pcs. per 7 inch reel PRE-HEATING SOLDERING Product Dimensions 260 FERRITE 5.0 ± 0.2TERMINAL (.197 ± .00E7L)ECTRODE ) °C 217 12.7 ± 0.3 ( (.500 ± .012) e 200 r u rat 0.5 ± 0.3 (.83.355)0M.5A ±X .0.3 mpe 150 (.020 ± .012) 2.5 ± 0.2 (.020 ± .012) e (2.0.39 8± ± 0 ..2008) T (.091 ± .007) 25 60~120 0.9 ± 0.1 2.0 ± 0.20 SECONDS (.035 ± .004) (.079 ± .008) 60~150 SECONDS Recommended Layout Time (Seconds) 1.35 1.75 (.053) 7.(0.069) (.276) 3.75 EMEA: (.148) 6.0 (.236) The Americas: DIMENSIONS4: .0 MM www.bourns.com (.157)(INCHES) Schematic WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf

10 L -4R7M H) -3R3M ance (µ 1 ---121RRR025MMM ct u nd -R47M I CVH252009 Series Multilayer Power Chip 0I.1n1ductors10 100 1000 10000 DC Current (mA) L vs. Idc L vs. Frequency 10 10 L L -4R7M -4R7M -3R3M uctance (µH) 1 ----1213RRRR0253MMMM uctance (µH) 1 ---211RRR250MMM nd -R47M nd -R47M I I 0.1 0.1 1 10 100 1000 10000 1 10 100 DC Current (mA) Frequency (MHz) Packaging Specifications 10 DIA. 178 ± 1.0L 2.0 ± 0.5 12.0 ± 0.15 -4R7M (7.008 ± .039) (.079 ± .020) (.472 ± .006) -3R3M µH) -2R2M 13.0 ± 0.2 e ( -1R5M (.512 ± .008) nc 1 -1R0M DIA. a ct du -R47M 60.0 +0.5/-0.0 In (2.362 +.020/-0) A ± 0.20 (A ± .008) (1.0.2570) (1.0.2570) 0.1 13.0 ± 0.2 DIA. 1.27 1 (.512 ± .008) 10 100 (.050) Frequency (MHz) 9.0 ± 0.5 (.354 ± .020) 1.27 (.050) DIA. 1.75 ± 0.1 4.00 ± 0.1 2.00 ± 0.1 1.55 ± 0.05 (.069 ± .004) 0.22 ± 0.05 (.157 ± .004) (.079 ± .004) (.061 ± .002) (.009 ± .002) END START 2.54 2.54 (.100) (.100) 8.00 ± 0.1 (.315 ± .004) 2.41 2.80 ± 0.1 (.095)TYP. 3.5 ± 0.1 (.110 ± .004) 8.86 (.138 ± .004) (.349) 4.00 ± 0.1 DIA. 1.00 ± 0.05 4.00 ± 0.1 (.157 ± .004) 1.35 ± 0.1 (.039 ± .002) (.157 ± .004) (.053 ± .004) (2.0.4915)TYP. NO C(O72M.80P70O4N)ENT COMPONENTS NO (C1O54M.07P04O8N)ENT D IMENSIONS: (INMCHMES) MIN. MIN. USER DIRECTION OF FEED 3000 PCS. PER REEL REV. 10/17 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific disclaimers as set forth on the last page of this document, and at www.bourns.com/legal/disclaimer.pdf.

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