D/CRCW e3 www.vishay.com Vishay Standard Thick Film Chip Resistors FEATURES • Stability at different environmental conditions R/R  1 % (1000 h rated power at 70 °C) • 2 mm pitch packaging option for 0603 size • AEC-Q200 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Automotive D/CRCW e3 standard thick film chip resistors are the perfect choice for most fields of modern electronics where hig h • Industrial reliability and stability are of major concern. Typical • Telecommunication applications include automotive, telecommunications, and industrial. TECHNICAL SPECIFICATIONS D10/CRCW0402 D11/CRCW0603 D12/CRCW0805 D25/CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512 DESCRIPTION e3 e3 e3 e3 e3 e3 e3 e3 Imperial size 0402 0603 0805 1206 1210 1218 2010 2512 Metric size code RR1005M RR1608M RR2012M RR3216M RR3225M RR3246M RR5025M RR6332M 1  to Resistance 2.2 M; 1  to 10 M; 1  to 10 M; jumper (0 ) range jumper jumper (0 ) (0 ) Resistance ± 5 %; ± 1 % tolerance Temperature ± 200 ppm/K; ± 100 ppm/K coefficient Rated 0.063 W 0.10 W 0.125 W 0.25 W 0.5 W 1.0 W 0.75 W 1.0 W dissipation, P (1) 70 Operating voltage, 50 V 75 V 150 V 200 V 200 V 200 V 400 V 500 V U AC /DC max. RMS Permissible film temperature, 155 °C F max. (1) Operating temperature -55 °C to +155 °C range Max. resistance change at P70 for resistance range, |R/R|, after (2): 1000 h  1 % 8000 h  2 % Permissible voltage against ambient (insulation): 1 min, U 75 V 100 V 200 V 300 V 300 V 300 V 300 V 300 V ins Failure rate:  0.1 x 10-9/h FIT observed Notes (1) Please refer to “Application Information” below (2) Apply to components with stability class 1 APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drif t increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Revision: 27-Oct-2020 1 Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW e3 www.vishay.com Vishay TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES ± 200 ppm/K ± 5 % 1  to 10 M E24 D10/CRCW0402 e3 ± 100 ppm/K ± 1 % 1  to 10 M E24; E96 Jumper, Imax. = 1.5 A  20 m 0  - ± 200 ppm/K ± 5 % 1  to 10 M E24 D11/CRCW0603 e3 ± 100 ppm/K ± 1 % 1  to 10 M E24; E96 Jumper, Imax. = 2.0 A  20 m 0  - ± 200 ppm/K ± 5 % 1  to 10 M E24 D12/CRCW0805 e3 ± 100 ppm/K ± 1 % 1  to 10 M E24; E96 Jumper, Imax. = 2.5 A  20 m 0  - ± 200 ppm/K ± 5 % 1  to 10 M E24 D25/CRCW1206 e3 ± 100 ppm/K ± 1 % 1  to 10 M E24; E96 Jumper, Imax. = 3.5 A  20 m 0  - ± 200 ppm/K ± 5 % 1  to 10 M E24 CRCW1210 e3 ± 100 ppm/K ± 1 % 1  to 10 M E24; E96 Jumper, Imax. = 5.0 A  20 m 0  - ± 200 ppm/K ± 5 % 1  to 2.2 M E24 CRCW1218 e3 ± 100 ppm/K ± 1 % 1  to 2.2 M E24; E96 Jumper, Imax. = 7.0 A  20 m 0  - ± 200 ppm/K ± 5 % 1  to 10 M E24 CRCW2010 e3 ± 100 ppm/K ± 1 % 1  to 10 M E24; E96 Jumper, Imax. = 6.0 A  20 m 0  - ± 200 ppm/K ± 5 % 1  to 10 M E24 CRCW2512 e3 ± 100 ppm/K ± 1 % 1  to 10 M E24; E96 Jumper, Imax. = 7.0 A  20 m 0  - Note • The temperature coefficient of resistance (TCR) is not specified for 0  jumpers Revision: 27-Oct-2020 2 Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW e3 www.vishay.com Vishay PACKAGING PACKAGING TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH DIMENSIONS ED = ET7 10 000 Ø 180 mm / 7" D10/CRCW0402 e3 8 mm 2 mm EE = EF4 50 000 Ø 330 mm / 13" EI = ET2 5000 Ø 180 mm / 7" ED = ET3 10 000 Ø 180 mm / 7" 2 mm EL = ET4 20 000 Ø 285 mm / 11.25" D11/CRCW0603 e3 EE = ET8 50 000 8 mm Ø 330 mm / 13" EA = ET1 5000 Ø 180 mm / 7" EB = ET5 10 000 4 mm Ø 285 mm / 11.25" EC = ET6 20 000 Paper tape acc. to Ø 330 mm / 13" EA = ET1 5000 IEC 60286-3, Type 1a Ø 180 mm / 7" D12/CRCW0805 e3 EB = ET5 10 000 8 mm 4 mm Ø 285 mm / 11.25" EC = ET6 20 000 Ø 330 mm / 13" EA = ET1 5000 Ø 180 mm / 7" D25/CRCW1206 e3 EB = ET5 10 000 8 mm 4 mm Ø 285 mm / 11.25" EC = ET6 20 000 Ø 330 mm / 13" EA = ET1 5000 Ø 180 mm / 7" CRCW1210 e3 EB = ET5 10 000 8 mm 4 mm Ø 285 mm / 11.25" EC = ET6 20 000 Ø 330 mm / 13" CRCW1218 e3 EK = ET9 4000 12 mm 4 mm Ø 180 mm / 7" CRCW2010 e3 EF = E02 4000 Blister tape acc. to 12 mm 4 mm Ø 180 mm / 7" EG = E67 2000 IEC 60286-3, Type 2a 8 mm CRCW2512 e3 12 mm Ø 180 mm / 7" EH = E82 4000 4 mm PART NUMBER AND PRODUCT DESCRIPTION Part Number: CRCW0603562RFKEA Part Number: CRCW06030000Z0EA C R C W 0 6 0 3 5 6 2 R F K E A TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING D10/CRCW0402 R = decimal F = ± 1 % K = ± 100 ppm/K EA, EB, D11/CRCW0603 K = thousand J = ± 5 % N = ± 200 ppm/K EC, ED, D12/CRCW0805 M = million Z = jumper 0 = jumper EE, EF, D25/CRCW1206 0000 = jumper EG, EH, CRCW1210 EI, EK, CRCW1218 EL CRCW2010 CRCW2512 Product Description: D11/CRCW0603 100 562R 1% ET1 e3 Product Description: D11/CRCW0603 0R0 ET1 e3 D11/CRCW0603 100 562R 1 % ET1 e3 TYPE / SIZE TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE D10/CRCW0402 ± 100 ppm/K 10R = 10  ± 1 % ET1, ET2, e3 = pure tin D11/CRCW0603 ± 200 ppm/K 562R = 562  ± 5 % ET3, ET4, termination finish D12/CRCW0805 1M = 1 M ET5, ET6, D25/CRCW1206 0R0 = jumper ET8, ET9, CRCW1210 EF4, E02, CRCW1218 E67, E82 CRCW2010 CRCW2512 Revision: 27-Oct-2020 3 Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW e3 www.vishay.com Vishay DESCRIPTION MATERIALS Production is strictly controlled and follows an extensive se t Vishay acknowledges the following systems for th e of instructions established for reproducibility. A cermet film regulation of hazardous substances: layer and a glass-over are deposited on a high grade (Al2O3) • IEC 62474, Material Declaration for Products of and for the ceramic substrate with its prepared inner contacts. A Electrotechnical Industry, with the list of declarable special laser is used to achieve the target value by smoothly substances given therein (2) fine trimming the resistive layer without damaging the • The Global Automotive Declarable Substance Lis t ceramics. The resistor elements are covered by a protectiv e (GADSL) (3) coating designed for electrical, mechanical and climati c • The REACH regulation (1907/2006/EC) and the related lis t protection. The terminations receive a final pure tin on nickel of substances with very high concern (SVHC) (4) for its plating.  supply chain The result of the determined production is verified by an The products do not contain any of the banned extensive testing procedure on 100 % of the individual chip substances as per IEC 62474, GADSL, or the SVHC list, resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 Type 1a and see www.vishay.com/how/leadfree. Type 2a (1). Hence the products fully comply with the following directives: ASSEMBLY • 2000/53/EC End-of-Life Vehicle Directive (ELV) and The resistors are suitable for processing on automatic SMD Annex II (ELV II) assembly systems. They are suitable for automatic • 2011/65/EU Restriction of the Use of Hazardous soldering using wave, reflow or vapor phase as shown in Substances Directive (RoHS) with amendmen t IEC 61760-1 (1). The encapsulation is resistant to all 2015/863/EU cleaning solvents commonly used in the electronics • 2012/19/EU Waste Electrical and Electronic Equipment industry, including alcohols, esters and aqueous solutions. Directive (WEEE) The suitability of conformal coatings, potting compounds Vishay pursues the elimination of conflict minerals from its and their processes, if applied, shall be qualified b y supply chain, see the Conflict Minerals Policy a t appropriate means to ensure the long-term stability of th e www.vishay.com/doc?49037. whole system. The resistors are RoHS-compliant, the pure tin platin g APPROVALS provides compatibility with lead (Pb)-free an d The resistors are qualified according to AEC-Q200. lead-containing soldering processes. Solderability is Where applicable, the resistors are tested in accordanc e specified for 2 years after production or requalification. The with EN 140401-802 which refers to EN 60115-1, permitted storage time is 20 years. The immunity of th e EN 60115-8 and the variety of environmental tes t plating against tin whisker growth has been proven unde r procedures of the IEC 60068 (1) series. extensive testing. RELATED PRODUCTS For more information about products with better TCR and tighter tolerance please refer to the “Lead (Pb)-Free Thick Film, Rectangular, Semi-Precision Chip Resistors ” datasheet (www.vishay.com/doc?20036). The D/CRCW with SnPb termination plating is designed fo r applications where lead bearing terminations ar e mandatory. For ordering D/CRCW with SnPb terminations please refer to latest edition of datasheet D/CRCW (www.vishay.com/doc?20008). Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 27-Oct-2020 4 Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE Single Pulse Axis Title 1000 10000 CRCW2512 CRCW1218 CRCW2010 100 CRCW1210 2nd line^ P-Pulse Load (W)max. 101 DDDD21115210////CCCCRRRRCCCCWWWW1000286400006532 1100000 1st line2nd line 0.1 0.01 10 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 t-Pulse Duration (s) i Maximum pulse load, single pulse; applicable if P  0 and n < 1000 and Uˆ = Uˆmax.; for permissible resistance change equivalent to 8000 h operation Continuous Pulse Axis Title 1000 10000 CRCW2512 CRCW1218 eW) CRCW2010 2nd lin^ P-Continuous Pulse Load (max. 1001.0101 DDDD21115210////CCCCCRRRRRCCCCCWWWWW11000228640100060532 1100000 1st line2nd line 0.01 10 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 t-Pulse Duration (s) i Maximum pulse load, continuous pulses; applicable if P  P (amb) and Uˆ = Uˆmax.; for permissible resistance change equivalent to 8000 h operation Pulse Voltage Axis Title 2000 10000 CRCW2512 1800 CRCW2010 D25/CRCW1206, CRCW1210, CRCW1218 1600 D12/CRCW0805 eV) D11/CRCW0603 d linge ( 1400 D10/CRCW0402 1000 na 1200 2^ U-Pulse Voltmax. 1046800000000 100 1st line2nd line 200 0 10 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 t-Pulse Duration (s) i Maximum pulse voltage, single and continuous pulses; applicable if Pˆ = Pˆ ; max. for permissible resistance change equivalent to 8000 h operation Revision: 27-Oct-2020 5 Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW e3 www.vishay.com Vishay Derating Axis Title 1.2 10000 CRCW2512,CRCW1218 CRCW2010 1.0 CRCW1210 W) DD2152//CCRRCCWW10280065 n ( 0.8 D11/CRCW0603 1000 2nd lineer Dissipatio 0.6 D10/CRCW0402 1st line2nd line w 0.4 100 o P - P 0.2 0 10 -70 -60 --5500 -40 -30 -20 -10 00 10 20 30 40 5500 60 7700 80 90 110000 110 120 130 140 115500 160 ϑ -Ambient Temperature (°C) amb Non-Linearity Axis Title 120 10000 D25/CRCW1206, CRCW2010 B) D12/CRCW0805 d 100 D11/CRCW0603 3 ( D10/CRCW0402 A nc 80 1000 oi m 2nd linerdof 3Har 60 1st line2nd line n 40 100 o ati u n 20 e Att 0 10 10 100 1K 10K 100K 1M 10M R-Resistance Value (Ω) Current Noise Axis Title 100 10000 D10/CRCW0402 D11/CRCW0603 D12/CRCW0805 D25/CRCW1206 V) 10 CRCW2010 V/ 1000 μ ( 2nd lineNoise A1 1 1st line2nd line ent 100 urr 0.1 C 0.01 10 100 1K 10K 100K 1M 10M R-Resistance Value (Ω) Revision: 27-Oct-2020 6 Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW e3 www.vishay.com Vishay TESTS AND REQUIREMENTS All executed tests are carried out in accordance with the The testing also covers most of the requirements specifie d following specifications: by EIA/IS-703 and JIS-C-5201-1. EN 60115-1, generic specification The tests are carried out under standard atmospheri c EN 60115-8 (successor of EN 140400), sectional conditions in accordance with IEC 60068-1, 4.3, whereupon specification the following values are applied: EN 140401-802, detail specification Temperature: 15 °C to 35 °C IEC 60068-2-xx, test methods Relative humidity: 25 % to 75 % The parameters stated in the Test Procedures an d Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). Requirements table are based on the required tests and A climatic category LCT / UCT / 56 is applied, defined by the permitted limits of EN 140401-802. The table presents only lower category temperature (LCT), the upper categor y the most important tests, for the full test schedule refer t o temperature (UCT), and the duration of exposure in th e the documents listed above. However, some additional damp heat, steady state test (56 days). The components ar e tests and a number of improvements against thos e mounted for testing on boards in accordance with E N minimum requirements have been included. 60115-8, 2.4.2 unless otherwise specified. TEST PROCEDURES AND REQUIREMENTS REQUIREMENTS PERMISSIBLE CHANGE (R) IEC PROCEDURE EN 60068-2 STABILITY CLASS 1 STABILITY CLASS 2 60115-1 (1) TEST TEST OR BETTER OR BETTER CLAUSE METHOD Stability for product types: 1  to 10 M D/CRCW e3 4.5 - Resistance - ± 1 % ± 5 % At (20 / -55 / 20) °C and 4.8 - Temperature coefficient ± 100 ppm/K ± 200 ppm/K (20 / 155 / 20) °C U = P x R or U = U 70 max. whichever is the less severe; 1.5 h on; 0.5 h off 4.25.1 - Endurance at 70 °C 70 °C; 1000 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 70 °C; 8000 h ± (2 % R + 0.1 ) ± (4 % R + 0.1 ) Endurance at upper 4.25.3 - 155 °C; 1000 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) category temperature (40 ± 2) °C; 56 days; 4.24 78 (Cab) Damp heat, steady state ± (1 % R + 0.05 ) (93 ± 3) % RH (85 ± 2) °C; (85 ± 5) % RH; Damp heat, steady state, 4.37 67 (Cy) U = 0.1 x P x R  100 V; ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) accelerated 85 1000 h 4.23 - Climatic sequence: 4.23.2 2 (Bb) Dry heat 125 °C; 16 h 4.23.3 30 (Db) Damp 55 °C; 24 h;  90 % RH; 1 cycle 4.23.4 1 (Ab) Cold -55 °C; 2 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C 55 °C; 5 days; 4.23.6 30 (Db) Damp heat, cyclic > 90 % RH; 5 cycles 4.23.7 - DC load U = P70 x R  Umax.; 1 min - 1 (Aa) Cold -55 °C; 2 h ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) Rapid change 30 min. at -55 °C and 30 min. at 125 °C ± (1 % R + 0.05 ) 4.19 14 (Na) of temperature 1000 cycles no visible damage 4.13 - Short time overload U = 2.5 x P70 x R  2 x Umax.; ± (2 % R + 0.05 ) whichever is the less severe; 5 s Severity no. 4: U = 10 x P x R Single pulse high voltage 70 ± (1 % R + 0.05 ) 4.27 - or U = 2 x U overload max.; no visible damage whichever is the less severe; 10 pulses 10 μs / 700 μs Revision: 27-Oct-2020 7 Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS REQUIREMENTS PERMISSIBLE CHANGE (R) IEC PROCEDURE EN 60068-2 STABILITY CLASS 1 STABILITY CLASS 2 60115-1 (1) TEST TEST OR BETTER OR BETTER CLAUSE METHOD Stability for product types: 1  to 10 M D/CRCW e3 U = 15 x P x R or 70 4.39 - Periodic electric overload U = 2 x Umax.; ± (1 % R + 0.05 ) whichever is the less severe; no visible damage 0.1 s on; 2.5 s off; 1000 cycles IEC 61340-3-1 (1); Electrostatic discharge 4.38 - 3 positive + 3 negative discharges; ± (1 % R + 0.05 ) (human body model) ESD voltage acc. to size Endurance by sweeping; 10 Hz to 2000 Hz; ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) 4.22 6 (Fc) Vibration no resonance; no visible damage no visible damage amplitude  1.5 mm or  200 m/s2; 7.5 h Solder bath method, SnPb40; non-activated flux (235 ± 5) °C; (2 ± 0.2) s Good tinning ( 95 % covered); 4.17 58 (Td) Solderability Solder bath method, no visible damage Sn96.5Ag3Cu0.5; non-activated flux (245 ± 5) °C; (3 ± 0.3) s Resistance to Soldering bath method; 4.18 58 (Td) ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) soldering heat (260 ± 5) °C; (10 ± 1) s Component solvent Isopropyl alcohol; 4.29 45 (XA) No visible damage resistance +50 °C; method 2 CRCW0402 and CRCW0603: 9 N 4.32 21 (Uu ) Shear (adhesion) No visible damage 3 CRCW0805 to CRCW2512: 45 N ± (0.25 % R + 0.05 ) 4.33 21 (Ue1) Substrate bending Depth 2 mm; 3 times no visible damage, no open circuit in bent position 4.7 - Voltage proof U = 1.4 x U ; 60 s No flashover or breakdown ins Flammability, IEC 60695-11-5 (1); 4.35 - No burning after 30 s needle flame test 10 s Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 27-Oct-2020 8 Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW e3 www.vishay.com Vishay DIMENSIONS L T2 W H T1 DIMENSIONS AND MASS L W H T1 T2 MASS TYPE / SIZE (mm) (mm) (mm) (mm) (mm) (mg) D10/CRCW0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.10 0.65 D11/CRCW0603 e3 1.55 + 0.10 / - 0.05 0.85 ± 0.10 0.45 ± 0.05 0.3 ± 0.20 0.3 ± 0.20 2 D12/CRCW0805 e3 2.0 + 0.20 / - 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20 / - 0.10 0.3 ± 0.20 5.5 D25/CRCW1206 e3 3.2 + 0.10 / - 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 10 CRCW1210 e3 3.2 ± 0.20 2.5 ± 0.20 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 16 CRCW1218 e3 3.2 + 0.10 / - 0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 29.5 CRCW2010 e3 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.6 ± 0.20 25.5 CRCW2512 e3 6.3 ± 0.20 3.15 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.6 ± 0.20 40.5 SOLDER PAD DIMENSIONS G X Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE / SIZE G Y X Z G Y X Z (mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm) D10/CRCW0402 e3 - - - - 0.45 0.6 0.6 1.65 D11/CRCW0603 e3 0.65 1.10 1.25 2.85 0.75 0.75 1.00 2.25 D12/CRCW0805 e3 0.90 1.30 1.60 3.50 1.00 0.95 1.45 2.90 D25/CRCW1206 e3 1.40 1.40 1.95 4.20 1.50 1.05 1.80 3.60 CRCW1210 e3 1.80 1.45 2.95 4.70 1.70 1.10 2.80 3.90 CRCW1218 e3 1.80 1.30 5.10 4.40 1.90 1.10 4.90 4.10 CRCW2010 e3 3.40 1.65 2.85 6.70 3.50 1.45 2.80 6.40 CRCW2512 e3 4.60 1.60 3.65 7.80 4.75 1.45 3.50 7.65 Note • The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintai n the reliability of the assembly. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by man y other parameters. Still, the given solder pad dimensions will be found adequate for most general applications Revision: 27-Oct-2020 9 Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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