D/CRCW-P e3 www.vishay.com Vishay Lead (Pb)-Free Thick Film, Rectangular, Semi-Precision Chip Resistors FEATURES • Low temperature coefficient (50 ppm/K) and tight tolerances (± 0.25 %) • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processing • Metal glaze on high quality ceramic • AEC-Q200 qualified • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 STANDARD ELECTRICAL SPECIFICATIONS LIMITING POWER ELEMENT CASE CASE TEMPERATURE RESISTANCE RATING VOLTAGE TOLERANCE MODEL SIZE SIZE COEFFICIENT RANGE SERIES P U % INCH METRIC 70 max. ppm/K  W AC /DC RMS V ± 100 ± 0.5 1R to 1M1 D10/CRCW0402-P 0402 1005 0.063 50 E24; E96 ± 50 ± 0.25, ± 0.5, ± 1 100R to 1M ± 100 ± 0.5, ± 0.25 1R to 10M D11/CRCW0603-P 0603 1608 0.1 75 ± 0.25 100R to 1M E24; E96 ± 50 ± 0.5, ± 1 100R to 10M ± 100 ± 0.5 10R to 10M D12/CRCW0805-P 0805 2012 0.125 150 ± 0.25 100R to 1M E24; E96 ± 50 ± 0.5, ± 1 100R to 10M ± 100 ± 0.5 10R to 10M D25/CRCW1206-P 1206 3216 0.25 200 ± 0.25 100R to 1M E24; E96 ± 50 ± 0.5, ± 1 100R to 10M ± 100 ± 0.5 100R to 1M CRCW1210-P 1210 3225 0.5 200 E24; E96 ± 50 ± 0.5, ± 1 100R to 1M ± 100 ± 0.5 100R to 2M2 CRCW1218-P 1218 3246 1.0 200 E24; E96 ± 50 ± 0.5, ± 1 100R to 2M2 ± 100 ± 0.5 10R to 10M CRCW2010-P 2010 5025 0.75 400 E24; E96 ± 50 ± 0.5, ± 1 100R to 10M ± 100 ± 0.5 10R to 10M CRCW2512-P 2512 6332 1.0 500 E24; E96 ± 50 ± 0.5, ± 1 100R to 10M Notes • These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage and permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time generally known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time. • Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020). • Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material. Revision: 07-Apr-14 1 Document Number: 20036 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW-P e3 www.vishay.com Vishay TECHNICAL SPECIFICATIONS D10/ D11/ D12/ D25/ PARAMETER UNIT CRCW1210-P CRCW1218-P CRCW2010-P CRCW2512-P CRCW0402-P CRCW0603-P CRCW0805-P CRCW1206-P Rated Dissipation at P (1) W 0.063 0.1 0.125 0.25 0.5 1.0 0.75 1.0 70 Operating Voltage V 50 75 150 200 200 200 400 500 U AC /DC max. RMS Insulation Voltage U (1 min) V 75 100 200 300 300 300 300 300 ins Insulation Resistance  > 109 Operating Temperature Range °C - 55 to + 155 Failure Rate h-1 < 0.1 x 10-9 Weight mg 0.65 2 5.5 10 16 29.5 25.5 40.5 Note (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-ciruit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded. PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: CRCW040275R0DKEDP C R C W 0 4 0 2 7 5 R 0 D K E D P MODEL RESISTANCE TOLERANCE TCR PACKAGING SPECIAL CRCW0402 R = Decimal C = ± 0.25 % H = ± 50 ppm/K EA, EB, P = CRCW0603 K = Thousand D = ± 0.5 % K = ± 100 ppm/K EC, ED, Semi-Precision CRCW0805 M = Million F = ± 1.0 % EE, EF, CRCW1206 EG, EH, CRCW1210 EI, EL CRCW1218 EK CRCW2010 CRCW2512 PRODUCT DESCRIPTION: D10/CRCW0402-P 100 75R 0.5 % ET7 e3 D10/CRCW0402-P 100 75R 0.5 % ET7 e3 MODEL TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE D10/CRCW0402-P ± 50 ppm/K 49K9 = 49.9 k ± 0.25 % ET1, ET2, e3 = Pure tin D11/CRCW0603-P ± 100 ppm/K 5R1 = 5.1  ± 0.5 % ET3, ET4, termination D12/CRCW0805-P ± 1 % ET5, ET6, finish D25/CRCW1206-P ET7, ET8, CRCW1210-P ET9, EF4, CRCW1218-P E02, E67, CRCW2010-P E82 CRCW2512-P Revision: 07-Apr-14 2 Document Number: 20036 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW-P e3 www.vishay.com Vishay PACKAGING MODEL CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER ED = ET7 10 000 180 mm/7" D10/CRCW0402-P 8 mm 2 mm EE = EF4 50 000 330 mm/13" EI = ET2 5000 180 mm/7" ED = ET3 10 000 180 mm/7" 8 mm 2 mm EL = ET4 20 000 285 mm/11.25" D11/CRCW0603-P EE = ET8 50 000 330 mm/13" EA = ET1 5000 180 mm/7" EB = ET5 10 000 8 mm 4 mm 285 mm/11.25" EC = ET6 20 000 Paper tape acc. to 330 mm/13" IEC 60068-3 EA = ET1 5000 Type I 180 mm/7" D12/CRCW0805-P EB = ET5 10 000 8 mm 4 mm 285 mm/11.25" EC = ET6 20 000 330 mm/13" EA = ET1 5000 180 mm/7" D25/CRCW1206-P EB = ET5 10 000 8 mm 4 mm 285 mm/11.25" EC = ET6 20 000 330 mm/13" EA = ET1 5000 180 mm/7" CRCW1210-P EB = ET5 10 000 12 mm 4 mm 285 mm/11.25" EC = ET6 20 000 330 mm/13" CRCW1218-P EK = ET9 4000 12 mm 4 mm 180 mm/7" CRCW2010-P EF = E02 4000 Blister tape acc. to 12 mm 4 mm 180 mm/7" IEC 60068-3 EG = E67 2000 Type II 8 mm CRCW2512-P 12 mm 180 mm/7" EH = E82 4000 4 mm DIMENSIONS in millimeters SOLDER PAD DIMENSIONS SIZE DIMENSIONS REFLOW SOLDERING WAVE SOLDERING INCH METRIC L W H T1 T2 a b l a b l 0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.1 0.4 0.6 0.5 0603 1608 1.55 + 0.10 0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.2 0.3 ± 0.2 0.5 0.9 1.0 0.9 0.9 1.0 - 0.05 0805 2012 2.0 + 0.20 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20 0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3 - 0.10 - 0.10 1206 3216 3.2 + 0.10 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3 - 0.20 1210 3225 3.2 ± 0.2 2.5 ± 0.2 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 2.5 2.0 1.1 2.5 2.2 1218 3246 3.2 + 0.10 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 1.05 4.9 1.9 1.25 4.8 1.9 - 0.20 2010 5025 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 2.5 3.9 1.2 2.5 3.9 2512 6332 6.3 ± 0.2 3.15 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 3.2 5.2 1.2 3.2 5.2 Revision: 07-Apr-14 3 Document Number: 20036 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW-P e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE P70 n atio 100 p ssi % Di d e at R of n 50 o cti a Fr 0 - 50 0 50 70 100 °C 150 Ambient Temperature in amb TEST PROCEDURES AND REQUIREMENTS IEC EN 60115-1 60068-2 REQUIREMENTS TEST PROCEDURE CLAUSE TEST PERMISSIBLE CHANGE (R) METHOD Stability for product types: STABILITY CLASS 1 OR BETTER D/CRCW-P e3 1 to 10 M 4.5 - Resistance - ± 0.25 %; ± 0.5 %; ± 1 % 4.7 - Voltage proof U = 1.4 x U ; 60 s No flashover or breakdown ins 4.13 - Short time overload U = 2.5 x P70 x R  2 x Umax.; ± (0.25 % R + 0.05 ) duration acc. to style Solder bath method; Sn60Pb40 Good tinning ( 95 % covered) non-activated flux; no visible damage (235 ± 5) °C (2 ± 0.2) s 4.17.2 58 (Td) Solderability Solder bath method; Sn96.5Ag3Cu0.5 Good tinning ( 95 % covered) non-activated flux; no visible damage (245 ± 5) °C (3 ± 0.3) s Temperature (20/- 55/20) °C and 4.8.4.2 - ± 50 ppm/K; ± 100 ppm/K coefficient (20/125/20) °C Shear RR 1608 and smaller: 9 N 4.32 21 (Uu ) No visible damage 3 (adhesion) RR 2012 and larger: 45 N Depth 2 mm; No visible damage, no open circuit in bent position 4.33 21 (Uu ) Substrate bending 1 3 times ± (0.25 % R + 0.05 ) 30 min at - 55 °C; 30 min at 125 °C Rapid change of 4.19 14 (Na) temperature 5 cycles ± (0.25 % R + 0.05 ) 1000 cycles ± (1 % R + 0.05 ) Revision: 07-Apr-14 4 Document Number: 20036 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

D/CRCW-P e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS IEC EN 60115-1 60068-2 REQUIREMENTS TEST PROCEDURE CLAUSE TEST PERMISSIBLE CHANGE (R) METHOD Stability for product types: STABILITY CLASS 1 OR BETTER D/CRCW-P e3 1 to 10 M 4.23 - Climatic sequence: - 4.23.2 2 (Ba) Dry heat 125 °C; 16 h 55 °C;  90 % RH; 4.23.3 30 (Db) Damp heat, cyclic 24 h; 1 cycle 4.23.4 1 (Aa) Cold - 55 °C; 2 h ± (1 % R + 0.05 ) 4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h 55 °C;  90 % RH; 4.23.6 30 (Db) Damp heat, cyclic 24 h; 5 cycles 4.23.7 - DC load U = P x R 70 U = P70 x R  Umax.; 1.5 h on; 0.5 h off; 4.25.1 - Endurance at 70 °C 70 °C; 1000 h ± (1 % R + 0.05 ) 70 °C; 8000 h ± (2 % R + 0.05 ) Solder bath method Resistance to 4.18.2 58 (Td) (260 ± 5) °C; ± (0.25 % R + 0.05 ) soldering heat (10 ± 1) s Flamability, IEC 60695-11-5; 4.35 - No burning after 30 s needle flame test 10 s (40 ± 2) °C; Damp heat, 4.24 78 (Cab) (93 ± 3) % RH; ± (1 % R + 0.05 ) steady state 56 days Endurance at 4.25.3 - upper category 155 °C, 1000 h ± (1 % R + 0.05 ) temperature Electrostatic IEC 61340-3-1; 4.40 - discharge 3 pos. + 3 neg. discharges; ± (1 % R + 0.05 ) (human body model) ESD voltage acc. to size Component solvent Isopropyl alcohol; 4.29 45 (XA) No visible damage resistance 50 °C; method 2 Isopropyl alcohol; Solvent resistance Marking legible, 4.30 45 (XA) 50 °C; method 1, of marking no visible damage toothbrush f = 10 Hz to 2000 Hz; Vibration, endurance x, y, z  1.5 mm; 4.22 6 (Fc) ± (0.25 % R + 0.05 ) by sweeping A  200 m/s2; 10 sweeps per axis U = 15 x P x R 70 4.37 - Periodic electric  2 x Umax.; ± (1 % R + 0.05 ) overload 0.1 s on; 2.5 s off; 1000 cycles Single pulse high Û = 10 x P x R 70 4.27 - voltage overload,  2 x Umax.; ± (1 % R + 0.05 ) 10 μs/700 μs 10 pulses All tests are carried out in accordance with the following specifications: • EN 60115-1, generic specification • EN 140400, sectional specification • EN 140401-802, detail specification • IEC 60068-2-x, variety of environmental test procedures Packaging of components is done in paper or blister tapes according to IEC 60286-3. Revision: 07-Apr-14 5 Document Number: 20036 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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