CRCW0201 e3 www.vishay.com Vishay Lead (Pb)-free Commodity Thick Film Chip Resistors FEATURES • High volume product suitable for commercial applications • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 STANDARD ELECTRICAL SPECIFICATIONS LIMITING ELEMENT CASE CASE POWER RATING TEMPERATURE RESISTANCE VOLTAGE TOLERANCE MODEL SIZE SIZE P COEFFICIENT RANGE SERIES 70 U % INCH METRIC W max. ppm/K  AC /DC RMS V ± 200 10.0 to 10M ± 0.5 E24; E96 -200 / +400 1.0 to 9.76 ± 100 47.0 to 1M 0.05 30 ± 200 ± 1 10.0 to 10M E24; E96 CRCW0201 0201 RR 0603M -200 / +400 1.0 to 9.76 ± 200 10.0 to 10M ± 5 E24 -200 / +400 1.0 to 9.1 Zero-Ohm-Resistor: Rmax. = 50 m, Imax. at 70 °C = 1.0 A Notes • These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. • Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material. TECHNICAL SPECIFICATIONS PARAMETER UNIT CRCW0201 Rated Dissipation at 70 °C (1) W 0.05 Operating Voltage U AC /DC V 30 max. RMS Insulation Voltage U (1 min) V 50 ins Insulation Resistance  > 109 Operating Temperature Range °C -55 to +155 Weight mg 0.17 Note (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded. Revision: 07-Mar-17 1 Document Number: 20052 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CRCW0201 e3 www.vishay.com Vishay PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: CRCW02011K00FNED C R C W 0 2 0 1 1 K 0 0 F K E D MODEL VALUE TOLERANCE TCR PACKAGING CRCW0201 R = decimal D = ± 0.5 % K = ± 100 ppm/K ED K = thousand F = ± 1.0 % N = ± 200 ppm/K EE M = million J = ± 5.0 % X = -200 ppm/K / +400 ppm/K EI 0000 = jumper Z = jumper 0 = jumper PRODUCT DESCRIPTION: CRCW0201 100 1K0 1 % ET7 e3 CRCW0201 100 562R 1 % ET7 e3 RESISTANCE TOLERANCE MODEL TCR PACKAGING LEAD (Pb)-FREE VALUE VALUE CRCW0201 ± 200 ppm/K 1R0 = 1  ± 0.5 % ET7 e3 = pure tin ± 100 ppm/K 10R = 10  ± 1 % EF4 termination finish - 200/+ 400 ppm/K 1K0 = 1 k ± 5 % ET2 10K = 10 k 1M0 = 1 M 0R0 = jumper PACKAGING MODEL CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER ED = ET7 10 000 180 mm/7" Paper tape acc. CRCW0201 EI = ET2 20 000 to IEC 60068-3 8 mm 2 mm 254 mm/10" Type I EE = EF4 50 000 330 mm/13" DIMENSIONS in millimeters SIZE DIMENSIONS SOLDER PAD DIMENSIONS INCH METRIC L W H T1 T2 a b l 0201 0603 0.6 ± 0.05 0.3 ± 0.05 0.23 ± 0.05 0.15 ± 0.05 0.10 ± 0.05 0.28 0.43 0.23 Note • No marking for 0201 size. Revision: 07-Mar-17 2 Document Number: 20052 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CRCW0201 e3 www.vishay.com Vishay DERATING % n P i70 100 n o ati p si s Di d e Rat 50 of n o cti a Fr 0 - 50 0 50 70 100 125 150 Ambient Temperature ϑ in °C amb TEST PROCEDURES AND REQUIREMENTS REQUIREMENTS IEC PROCEDURE PERMISSIBLE CHANGE (R) EN 60115-1 60068-2 TEST CLAUSE TEST Stability for product types: METHOD CRCW0201 e3 1  to 10 M 4.5 - Resistance - ± 0.5 %; ± 1 %; ± 5 % 4.7 - Voltage proof U = 1.4 x U ; 60 s No flashover or breakdown ins Solder bath method; Sn60Pb40 Good tinning ( 95 % covered) non activated flux; no visible damage (235 ± 5) °C (2 ± 0.2) s 4.13 58 (Td) Solderability Solder bath method; Sn96.5Ag3Cu0.5 Good tinning ( 95 % covered) non-activated flux; no visible damage (245 ± 5) °C (3 ± 0.3) s ± 100 ppm/K, (20 / -55 / 20) °C and 4.8.4.2 - Temperature coefficient ± 200 ppm/K, (20 / 125 / 20) °C -200 ppm/K / +400 ppm/K 4.32 21 (Uu ) Shear (adhesion) 9 N No visible damage 3 No visible damage, 4.33 21 (Uu ) Substrate bending Depth 2 mm; 3 times no open circuit in bent position 1 ± (0.5 % R + 0.05 ) 30 min. at -55 °C; 30 min. at 125 °C Rapid change 4.19 14 (Na) of temperature 5 cycles ± (0.5 % R + 0.05 ) 1000 cycles ± (1 % R + 0.05 ) 4.23 - Climatic sequence: - 4.23.2 2 (Ba) Dry heat 125 °C; 16 h 4.23.3 30 (Db) Damp heat, cyclic 55 °C;  90 % RH; 24 h; 1 cycle 4.23.4 1 (Aa) Cold -55 °C; 2 h ± (2 % R + 0.1 ) 4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h 4.23.6 30 (Db) Damp heat, cyclic 55 °C;  90 % RH; 24 h; 5 cycles 4.23.7 - DC load U = P70 x R  Umax. Revision: 07-Mar-17 3 Document Number: 20052 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CRCW0201 e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS REQUIREMENTS IEC PROCEDURE PERMISSIBLE CHANGE (R) EN 60115-1 60068-2 TEST CLAUSE TEST Stability for product types: METHOD CRCW0201 e3 1  to 10 M U = P70 x R  Umax.; 1.5 h on; 0.5 h off; 4.25.1 - Endurance at 70 °C 70 °C; 1000 h ± (2 % R + 0.1 ) 70 °C; 8000 h ± (4 % R + 0.1 ) Resistance to Solder bath method 4.18.2 58 (Td) ± (1 % R + 0.05 ) soldering heat (260 ± 5) °C; (10 ± 1) s Flamability, IEC 60695-11-5; 4.35 - No burning after 30 s needle flame test 10 s 4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (2 % R + 0.1 ) Endurance at upper 4.25.3 - 155 °C, 1000 h ± (2 % R + 0.1 ) category temperature Component Isopropyl alcohol; 4.29 45 (XA) No visible damage solvent resistance 50 °C; method 2 f = 10 Hz to 2000 Hz; Vibration, endurance x, y, z  1.5 mm; 4.22 6 (Fc) ± (0.5 % R + 0.05 ) by sweeping A  200 m/s2; 10 sweeps per axis All tests are carried out in accordance with the following specifications: • EN 60115-1, generic specification • EN 140400, sectional specification • EN 140401-802, detail specification • IEC 60068-2-x, environmental test procedures Packaging of components is done in paper tapes according to IEC 60286-3. Revision: 07-Mar-17 4 Document Number: 20052 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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