CRA06P www.vishay.com Vishay Thick Film Chip Resistor Array FEATURES • Concave terminal array with square corners • 4 and 8 terminal package with isolated resistors • Wide ohmic range: 10R to 1M0 • AEC-Q200 qualified CRA06P thick film resistor array is constructed on a high • Material categorization: for definitions of compliance grade ceramic body with concave terminations. A small package enables the design of high density circuits. The please see www.vishay.com/doc?99912 single component reduces board space, component counts and assembly costs. STANDARD ELECTRICAL SPECIFICATIONS POWER RATING LIMITING ELEMENT TEMPERATURE RESISTANCE TOLERANCE MODEL CIRCUIT P VOLTAGE MAX. COEFFICIENT RANGE E-SERIES 70 °C ± % W V ± ppm/K  100 1 24 + 96 0.063 50 10 to 1M CRA06P 03 200 2; 5 24 Zero-Ohm-Resistor: Rmax. = 50 m, Imax. = 1 A TECHNICAL SPECIFICATIONS CRA06P PARAMETER UNIT 03 CIRCUIT Rated dissipation at 70 °C (2) W per element 0.063 Limiting element voltage (1) V 50 Insulation voltage (1 min) V peak 100 DC/AC Category temperature range °C -55 to +155 Insulation resistance  > 109 Notes (1) Rated voltage: P x R (2) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded PART NUMBER AND PRODUCT DESCRIPTION Part Number: CRA06P08347K0JTA (1) C R A 0 6 P 0 8 3 4 7 K 0 J T A TERMINAL MODEL PIN CIRCUIT VALUE TOLERANCE PACKAGING (2) SPECIAL STYLE CRA06 P 04 3 = 03 R = decimal F = ± 1 % TA Up to 2 digits 08 K = thousand G = ± 2 % TC M = million J = ± 5 % 0000 = 0  jumper Z = 0  jumper Product Description: CRA06P 08 03 473 J RT1 e3 CRA06P 08 03 473 J RT1 e3 MODEL TERMINAL COUNT CIRCUIT TYPE RESISTANCE VALUE TOLERANCE PACKAGING (4) LEAD (Pb)-FREE CRA06P 04 03 473 = 47 k F = ± 1 % RT1 e3 = pure tin 08 4702 = 47 k G = ± 2 % RT6 termination finish 10R0 = 10  J = ± 5 % 100 = 10  Z = 0  jumper 000 = 0  jumper First two digits (3 for 1 %) are significant. Last digit is the multiplier. Notes (1) Preferred way for ordering products is by use of the PART NUMBER (2) Please refer to the table PACKAGING, see next page Revison: 23-Feb-17 1 Document Number: 31047 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CRA06P www.vishay.com Vishay PACKAGING PACKAGING CODE MODEL TAPE WIDTH DIAMETER PITCH PIECES/REEL PAPER TAPE PART NUMBER PRODUCT DESCRIPTION 180 mm/7" 4 mm 5000 TA RT1 CRA06P 8 mm 330 mm/13" 4 mm 20 000 TC RT6 CIRCUIT DERATING % 120 n 03 CIRCUIT wer i 100 o P d ate 80 R 60 40 20 4 pin 8 pin 0 - 55 - 25 0 25 50 75 100 125 155 175 70 Ambient Temperature in °C DIMENSIONS PIN DIMENSIONS in millimeters NO# L A B C P T W A C 4 1.60 0.30 0.40 0.40 0.80 0.60 1.60 w 8 3.20 0.30 0.40 0.40 0.80 0.60 1.60 Tol. ± 0.20 ± 0.20 ± 0.15 ± 0.20 - ± 0.10 ± 0.15 P B T L SOLDER PAD DIMENSIONS in millimeters c w p a b WAVE 0.8 2.6 0.8 0.4 0.9 c w b p a Revison: 23-Feb-17 2 Document Number: 31047 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CRA06P www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 REQUIREMENTS TEST PERMISSIBLE CHANGE (R/R) (1) CONDITIONS OF TEST (clause) STABILITY STABILITY CLASS 1 OR BETTER CLASS 2 OR BETTER Stability for product types: 10  to 1 M 10  to 1 M CRA06P Resistance (4.5) - ± 1 % ± 2 %; ± 5 % (20 / -55 / 20) °C and Temperature coefficient (4.8.4.2) ± 100 ppm/K ± 200 ppm/K (20 / 125 / 20) °C U = 2.5 x (P x R)1/2 Overload (4.13) 70 ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )  2 x Umax.; 0.5 s Aging 4 h at 155 °C, dryheat Good tinning ( 95 % covered) Solderability (4.17.5) (2) Solder bath method; 235 °C; 2 s no visible damage Visual examination Solder bath method; Resistance to soldering heat (4.18.2) ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) (260 ± 5) °C; (10 ± 1) s 30 min at LCT = -55 °C; Rapid change of temperature (4.19) ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) 30 min at UCT = 125 °C; 5 cycles (40 ± 2) °C; 56 days; Damp heat, steady state (4.24) ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) (93 ± 3) % RH 16 h at UCT = 125 °C; 1 cycle at 55 °C; 2 h at LCT = -55 °C; 1 h/1 kPa at 15 °C to 35 °C; Climatic sequence (4.23) ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 5 cycles at 55 °C U = (P x R)1/2 70 U = U ; whichever is less severe max. U = (P x R)1/2 70 U = U ; whichever is less severe Endurance at 70 °C (4.25.1) max. ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 1.5 h “ON”; 0.5 h “OFF”; 70 °C; 1000 h Extended endurance (4.25.1.8) Duration extended to 8000 h ± (2 % R + 0.1 ) ± (4 % R + 0.1 ) Endurance at upper category UCT = 125 °C; 1000 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) temperature (4.25.3) Notes (1) Figures are given for a single element (2) Solderability is specified for 2 years after production or requalification. Permitted storage time is 20 years APPLICABLE SPECIFICATIONS • EN 60115-1 Generic specification • EN 140400 Sectional specification • EN 140401-802 Detail specification • IEC 60068-2-X Variety of environmental test procedures • EIA 481 Packaging of SMD components Revison: 23-Feb-17 3 Document Number: 31047 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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