CPC1150N Single-Pole, Normally Closed 4-Pin SOP OptoMOS® Relay I C D NTEGRATED IRCUITS IVISION Parameter Rating Units Description Blocking Voltage 350 V The CPC1150N is a miniature single-pole, normally P Load Current 120 mA / mA closed (1-Form-B) solid state relay that uses optically rms DC On-Resistance (max) 50  coupled MOSFET technology to provide 1500Vrms of input to output isolation. Its optically coupled output, which uses the patented Features OptoMOS architecture, is controlled by a highly (cid:129) 1500V Input/Output Isolation efficient GaAIAs infrared LED. rms (cid:129) Low Drive Power Requirements (TTL/CMOS Compatible) State of the art double-molded vertical construction (cid:129) No Moving Parts packaging enables the CPC1150N to be one of the (cid:129) High Reliability world’s smallest 4-pin solid state relays. It offers (cid:129) Arc-Free With No Snubbing Circuits board space savings over the competitor’s larger (cid:129) No EMI/RFI Generation 4-pin SOP relay. (cid:129) Small 4-Pin SOP Package (cid:129) Machine Insertable, Wave Solderable Approvals (cid:129) Tape & Reel Version Available (cid:129) UL 1577 Approved Component: File E76270 (cid:129) CSA Certified Component: Certificate 1172007 (cid:129) EN 60950 Certified Component: Applications TUV Certificate B 10 05 49410 006 (cid:129) Telecommunications (cid:129) Telecom Switching (cid:129) Tip/Ring Circuits Ordering Information (cid:129) Modem Switching (Laptop, Notebook, Pocket Part # Description Size) CPC1150N 4-Pin SOP (100/tube) (cid:129) Hook Switch CPC1150NTR 4-Pin SOP (2000/reel) (cid:129) Dial Pulsing (cid:129) Ground Start (cid:129) Ringing Injection Pin Configuration (cid:129) Instrumentation (cid:129) Multiplexers 1 4 + Control Load (cid:129) Data Acquisition (cid:129) Electronic Switching (cid:129) I/O Subsystems 2 3 – Control Load (cid:129) Meters (Watt-Hour, Water, Gas) (cid:129) Medical Equipment-Patient/Equipment Isolation (cid:129) Security Switching Characteristics (cid:129) Aerospace of Normally Closed Devices (cid:129) Industrial Controls Form-B I F I LOAD 90% 10% t t off on e Pb 3 DS-CPC1150N-R09 www.ixysic.com 1

I C D CPC1150N NTEGRATED IRCUITS IVISION Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to Blocking Voltage 350 V P the device. Functional operation of the device at conditions Reverse Input Voltage 5 V beyond those indicated in the operational sections of this Input Control Current 50 mA data sheet is not implied. Peak (10ms) 1 A Input Power Dissipation 70 mW Total Power Dissipation 1 400 mW Isolation Voltage, Input to Output 1500 V rms Operational Temperature -40 to +85 °C Storage Temperature -40 to +125 °C 1 Derate linearly 3.33 mW / ºC Electrical Characteristics @ 25ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 - I - - 120 mA / mA L rms DC Peak t =10ms I - - ±350 mA LPK P On-Resistance I=120mA R - - 50  L ON Off-State Leakage Current I =2mA , V=350V I - - 5 µA F L P LEAK Switching Speeds Turn-On t - - 1 I =5mA, V=10V on ms Turn-Off F L t - - 2 off Output Capacitance I =2mA, V=50V, f=1MHz C - 25 - pF F L OUT Input Characteristics Input Control Current to Activate 2 I=120mA I - 0.6 2 mA L F Input Control Current to Deactivate - I 0.3 0.55 - mA F Input Voltage Drop I =5mA V 0.9 1.2 1.4 V F F Reverse Input Current V =5V I - - 10 µA R R Common Characteristics Capacitance, Input to Output - C - 1 - pF I/O 1 Load current derates linearly from 120mA @ 25oC to 85mA @ 85oC. 2 For applications requiring high temperature operation (greater than 60°C) a LED drive current of 4mA is recommended. 2 www.ixysic.com R09

I C D CPC1150N NTEGRATED IRCUITS IVISION PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time (N=50, I=5mA) (N=50, I=90mA, I=5mA) (N=50, I=5mA, I=90mA) F L F F L 35 25 25 30 20 20 N) 25 N) N) unt ( 20 unt ( 15 unt ( 15 o o o C C C Device 1150 Device 105 Device 105 5 0 0 0 1.17 1.19 1.21 1.23 1.25 0.21 0.22 0.23 0.24 0.25 0.26 0.27 0.50 0.60 0.70 0.80 0.90 1.00 1.10 LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms) Typical I for Switch Operation Typical I for Switch Dropout Typical On-Resistance Distribution F F (N=50, I=90mA) (N=50, I=90mA) (N=50, I=90mA) L L L 25 25 35 30 20 20 N) N) N) 25 unt ( 15 unt ( 15 unt ( 20 o o o C C C Device 105 Device 105 Device 1150 5 0 0 0 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.45 0.50 0.55 0.60 0.65 0.70 0.75 38.5 39 39.5 40 40.5 41 41.5 LED Current (mA) LED Current (mA) On-Resistance ((cid:58)) Typical Blocking Voltage Distribution (N=50) 35 30 N) 25 nt ( u 20 o C e 15 c evi 10 D 5 0 377.5 388.5399.5 410.5 421.5 432.5 443.5 Blocking Voltage (V) P *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. R09 www.ixysic.com 3

I C D CPC1150N NTEGRATED IRCUITS IVISION PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Typical Turn-On Time Typical Turn-Off Time Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current vs. Temperature (I=100mA) (I=100mA) 1.8 0.7 L 2.0 L orward Voltage Drop (V)1111....6420 IIIIIFFFFF=====532150000mmmmmAAAAA Turn-On Time (ms) 00000.....65432 Turn-Off Time (ms) 11111000........86420864 F 0.1 D 0.2 E L0.8 0 0 -40 -20 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50 Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA) Typical I for Switch Operation Typical Turn-On Time Typical Turn-Off Time F vs. Temperature vs. Temperature vs. Temperature (I=50mA) (I=50mA) (I=50mA) 3.0 L 1.0 L 5.0 L 0.9 4.5 nt (mA) 22..50 me (ms) 000...876 me (ms) 433...050 LED Curre 110...505 Turn-On Ti 0000....5432 IF=10mA Turn-Off Ti 2211....5050 IF=5mA 0.1 0.5 I=10mA I=5mA F 0 0 F 0 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) Temperature (ºC) Typical On-Resistance Maximum Load Current vs. Temperature Typical Load Current vs. Load Voltage vs. Temperature (I=0mA, I=Max Rated) (I=0mA) (I=0mA) 60 F L 150 F 180 F 160 50 100 )(cid:58) A) A)140 Resistance ( 432000 d Current (m -55000 d Current (m1120860000 On- 10 Loa-100 Loa 40 20 0 -150 0 -40 -20 0 20 40 60 80 100 -6 -4 -2 0 2 4 6 -40 -20 0 20 40 60 80 100 120 Temperature (ºC) Load Voltage (V) Temperature (ºC) Typical Leakage vs. Temperature Typical Blocking Voltage Measured Across Pins 3&4 vs. Temperature (V=350V) Energy Rating Curve L 430 0.016 1.0 425 0.014 0.9 )P 0.8 Blocking Voltage (V444442110005050 Leakage (µA)000000......000000110000208642 Load Current (A)0000000.......7654321 395 0 0 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 10(cid:80)s 100(cid:80)s1ms 10ms100ms 1s 10s 100s Temperature (ºC) Temperature (ºC) Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 4 www.ixysic.com R09

I C D CPC1150N NTEGRATED IRCUITS IVISION Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1150N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1150N 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e Pb 3 R09 www.ixysic.com 5

I C D CPC1150N NTEGRATED IRCUITS IVISION Mechanical Dimensions CPC1150N 4.089 ± 0.203 Recommended PCB Land Pattern (0.161 ± 0.008) 0.200 ± 0.025 0.60 (0.008 ± 0.001) (0.0217) 3.810 ± 0.076 6.096 ± 0.102 (0.150 ± 0.003) (0.240 ± 0.004) 0.432 ± 0.127 (0.017 ± 0.005) 5.60 Pin 1 1.02 ± 0.025 (0.2205) (0.040 ± 0.001) 2.54 Typ 1.30 (0.100 Typ) (0.0512) 2.184 Max 2.54 (0.086 Max) (0.10) Lead to package standoff: 0.0637 ± 0.0383 (0.0025 ± 0.0015) 0.762 ± 0.102 0.381 TYP. Dimensions (0.030 ± 0.004) (0.015 TYP.) mm (inches) CPC1150NTR Tape & Reel 330.2 Dia (13.00 Dia) W=12.00 Top Cover B=4.70 (0.472) Tape Thickness (00.185) 0.102 Max (0.004 Max) P=8.00 K=2.70 A=6.50 0 0 (0.315) (0.106) (0.256) K=2.30 1 (0.091) UUsseerr DDiirreeccttiioonn ooff FFeeeedd Dimensions Embossed mm Carrier (inches) Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1150N-R09 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 6 12/14/2012

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