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CL21X475KAQNNNE产品简介:
ICGOO电子元器件商城为您提供CL21X475KAQNNNE由SAMSUNG设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 CL21X475KAQNNNE价格参考¥0.32-¥0.32。SAMSUNGCL21X475KAQNNNE封装/规格:陶瓷电容器, 4.7µF ±10% 25V 陶瓷电容器 X6S 0805(2012 公制)。您可以下载CL21X475KAQNNNE参考资料、Datasheet数据手册功能说明书,资料中有CL21X475KAQNNNE 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | CAP CER 4.7UF 25V 10% X6S 0805 |
产品分类 | |
品牌 | Samsung Electro-Mechanics America, Inc |
数据手册 | |
产品图片 | |
产品型号 | CL21X475KAQNNNE |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
RoHS指令信息 | |
产品系列 | CL |
产品培训模块 | http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=30051 |
其它名称 | 1276-3033-6 |
包装 | Digi-Reel® |
厚度(最大值) | 0.055"(1.40mm) |
大小/尺寸 | 0.079" 长 x 0.049" 宽(2.00mm x 1.25mm) |
安装类型 | 表面贴装,MLCC |
容差 | ±10% |
封装/外壳 | 0805(2012 公制) |
工作温度 | -55°C ~ 105°C |
应用 | 通用 |
引线形式 | - |
引线间距 | - |
标准包装 | 1 |
温度系数 | X6S |
特性 | - |
特色产品 | http://www.digikey.cn/product-highlights/cn/zh/samsung-mlcc-ceramic-capacitors/4040 |
电压-额定 | 25V |
电容 | 4.7µF |
等级 | - |
高度-安装(最大值) | - |
SPECIFICATION Supplier : Samsung electro-mechanics Samsung P/N : CL21X475KAQNNNE Product : Multi-layer Ceramic Capacitor Description : CAP, 4.7㎌, 25V, ±10%, X6S, 0805 A. Samsung Part Number CL 21 X 475 K A Q N N N E ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ① Series Samsung Multi-layer Ceramic Capacitor ② Size 0805 (inch code) L: 2.0 ± 0.15 mm W: 1.25 ± 0.15 mm ③ Dielectric X6S ⑧ Inner electrode Ni ④ Capacitance 4.7 ㎌ Termination Cu ⑤ Capacitance ±10 % Plating Sn 100% (Pb Free) tolerance ⑨ Product Normal ⑥ Rated Voltage 25 V ⑩ Special Reserved for future use ⑦ Thickness 1.25 ± 0.15 mm ⑪ Packaging Embossed Type, 7" reel B. Samsung Reliability Test and Judgement condition Performance Test condition Capacitance Within specified tolerance 1㎑±10% 1.0±0.2Vrms Tan δ (DF) 0.1 max. Insulation 10,000Mohm or 100Mohm㎌ Rated Voltage 60~120 sec. Resistance Whichever is Smaller Appearance No abnormal exterior appearance Microscope (10) Withstanding No dielectric breakdown or 250% of the rated voltage Voltage mechanical breakdown Temperature X6S Characteristics (From -55℃ to 105℃, Capacitance change should be within ±22%) Adhesive Strength No peeling shall be occur on the 500gF, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : within±12.5% Bending to the limit (1mm) with 1.0mm/sec. Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : within±7.5% Solder pot : 270±5℃, 10±1sec. Soldering heat Tan δ, IR : initial spec.
Performance Test condition Vibration Test Capacitance change : within±10% Amplitude : 1.5mm Tan δ, IR : initial spec. From 10㎐ to 55㎐ (return : 1min.) 2hours 3 direction (x, y, z) Moisture Capacitance change : within±12.5% With rated voltage Resistance Tan δ : 0.2 max 40±2℃, 90~95%RH, 500+12/-0hrs IR : 12.5㏁·㎌ or Over High Temperature Capacitance change : within±25% With 100% of the rated voltage Resistance Tan δ : 0.2 max Max. operating temperature IR : 25㏁·㎌ or Over 1000+48/-0hrs Temperature Capacitance change : within±15% 1 cycle condition Cycling Tan δ, IR : initial spec. Min. operating temperature → 25℃ → Max. operating temperature → 25℃ 5 cycle test C. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) * For the more detail Specification, Please refer to the Samsung MLCC catalogue.