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CL14A105MO8NANC产品简介:
ICGOO电子元器件商城为您提供CL14A105MO8NANC由SAMSUNG设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供CL14A105MO8NANC价格参考以及SAMSUNGCL14A105MO8NANC封装/规格参数等产品信息。 你可以下载CL14A105MO8NANC参考资料、Datasheet数据手册功能说明书, 资料中有CL14A105MO8NANC详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | CAP ARRAY 1.0UF 16V X5R 0504 |
产品分类 | 电容器阵列 |
品牌 | Samsung Electro-Mechanics America, Inc |
数据手册 | |
产品图片 | |
产品型号 | CL14A105MO8NANC |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
RoHS指令信息 | |
产品系列 | CL |
介电材料 | 陶瓷 |
其它名称 | 1276-2392-2 |
包装 | 带卷 (TR) |
大小/尺寸 | 0.054" 长 x 0.039" 宽(1.37mm x 1.00mm) |
安装类型 | 表面贴装 |
容差 | ±20% |
封装/外壳 | 0504(1410 公制) |
标准包装 | 4,000 |
温度系数 | X5R |
特色产品 | http://www.digikey.cn/product-highlights/cn/zh/samsung-mlcc-ceramic-capacitors/4040 |
电压-额定 | 16V |
电容 | 1.0µF |
电容器数 | 2 |
电路类型 | 隔离 |
等级 | - |
高度-安装(最大值) | 0.035" (0.88mm) |
SPECIFICATION • Supplier : Samsung electro-mechanics • Samsung P/N : CL14A105MO8NANC • Product : Multi-layer Ceramic Capacitor • Description : CAP, 1㎌, 16V, ±20%, X5R, 0504 A. Samsung Part Number CL 14 A 105 M O 8 N A N C ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ① Series Samsung Multi-layer Ceramic Capacitor ② Size 0504 (inch code) L: 1.37± 0.15 mm W: 1.0 ± 0.15 mm ③ Dielectric X5R ⑧ Inner electrode Ni ④ Capacitance 1 ㎌ Termination Cu ⑤ Capacitance ±20 % Plating Sn 100% (Pb Free) tolerance ⑨ Product Array(2-element) ⑥ Rated Voltage 16 V ⑩ Special Reserved for future use ⑦ Thickness 0.8 ± 0.08 mm ⑪ Packaging Cardboard Type, 7" reel B. Samsung Reliablility Test and Judgement condition Performance Test condition Capacitance Within specified tolerance 1㎑±10% 1.0±0.2Vrms Tan δ (DF) 0.1 max. Insulation 10,000Mohm or 100Mohm⋅㎌ Rated Voltage 60~120 sec. Resistance Whichever is Smaller Appearance No abnormal exterior appearance Microscope (×10) Withstanding No dielectric breakdown or 250% of the rated voltage Voltage mechanical breakdown Temperature X5R Characterisitcs (From -55℃ to 85℃, Capacitance change shoud be within ±15%) Adhesive Strength No peeling shall be occur on the 500g⋅F, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : within±12.5% Bending to the limit (1mm) with 1.0mm/sec. Solderability More than 75% of terminal surface 1) Sn63Pb37 solder is to be soldered newly 235±5℃, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : within±7.5% Solder pot : 270±5℃, 10±1sec. Soldering heat Tan δ, IR : initial spec.
Performance Test condition Vibration Test Capacitance change : within±5% Amplitude : 1.5mm Tan δ, IR : initial spec. From 10㎐ to 55㎐ (return : 1min.) 2hours × 3 direction (x, y, z) Humidity Capacitance change : within±12.5% 40±2℃, 90~95%RH, 500+12/-0hrs Tan δ : 0.125 max IR : 25㏁·㎌ or Over Moisture Capacitance change : within±12.5% With rated voltage Resistance Tan δ : 0.125 max 40±2℃, 90~95%RH, 500+12/-0hrs IR : 12.5㏁·㎌ or Over High Temperature Capacitance change : within±12.5% With 100% of the rated voltage Resistance Tan δ : 0.125 max Max. operating temperature IR : 25㏁·㎌ or Over 1000+48/-0hrs Temperature Capacitance change : within±7.5% 1 cycle condition Cycling Tan δ, IR : initial spec. Min. operating temperature→ 25℃ → Max. operating temperature → 25℃ 5 cycle test C. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) * For the more detail Specification, Please refer to the Samsung MLCC catalogue.