NT *RoHS VCEOARVMSIAPILOLINAASBLE Features Applications NT MPLIA n RoHS compliant* n HDMI 1.4 HS CO n ESD protection >25 kV n Digital Visual Interface (DVI) Ro n Low capacitance <0.5 pF n USB 3.0 / USB OTG * n Low leakage current <50 nA n Memory protection n SIM card ports REE D F LEA ChipGuard® MLC Series - ESD Protectors General Information Device Symbol TedDDlehiVessecIci tghoCrnoarh enrIigEpdiceGE t)coE uoE a1pmSr3rdopD9®to4 e sMn capetLpe neCpctqsil fiiuS ccfiarepaotrmtimioieoens nens shl.te attcaostr rIgboEeesCtetea6ndt1 ic s0fL poVdE0REeAroRi0 DHs SchIS-F cOi4RiCfigNEhO-SEc ha2MAaP Rr,LsIlE g lALypeNeT e d*vdeeeadslm iU4ga nS(g±eBe8d . 3 ktTo.V0h p /eCUr oMoStnBeLtcC aOtc fsTta e/Gm n±,si 1lHyit5 iDvh keaMV sI A b1ie.r4 e,n V The ChipGuard® MLC Series has been manufactured to provide low 0.5 pF capacitance aanlmdo lseta tkraagnesp caurrernetn utsn ldeesrs nthoarmn a5l wnAo rwkiinthg ecxocnedllietionnt sc.lamp qual*iRtoie&H SsA EC,CO mAMPPPLaIRAkONVTiEnDg the family Electrical Characteristics @ 25 °C (unless otherwise noted) CG0402MLC- PTTMyyaapprxaiiccimmaallue CCmteol arCnmtaipnpiuanocgui tVsa onOlctpaeeg @rea t(1iNn goV tRVe Mo1l)tSa g1e M Hz SyVCVmDCObCol 33.3.L3G 055LG 112L2G 224L4G*R o20HRS5. 5OCV3OE.MD33 P(LL.SI3eGAleNAcTt Model0s)5L5GA 121L2GA 242L4GA UpVVnFit Maximum Leakage Current @ Max. VDC IL AEC APP5 nA Typical Trigger Voltage (Note 2) VT 250 V Maximum Response Time RT 1 ns ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge ±8 kV Min. Air Discharge ±15 (Note 3) kV Min. Air Discharge ±25 kV Operating Temperature TOPR -40 to +85 -40 to +125 ˚C Storage Temperature TSTG -55 to +150 ˚C CG0603MLC- Parameter Symbol Unit 3.3LE 05LE 12LE 24LE 3.3LEA 05LEA 12LEA 24LEA Typical Continuous Operating Voltage VDC 3.3 5 12 24 3.3 5 12 24 V Typical Clamping Voltage (Note 1) VC 25 25 25 V Maximum Capacitance @ 1 VRMS 1 MHz CO 0.5 pF Maximum Leakage Current @ Max. VDC IL 5 5 5 nA Typical Trigger Voltage (Note 2) VT 250 250 250 V Maximum Response Time RT 1 ns ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge ±8 kV Min. Air Discharge ±15 (Note 3) kV Min. Air Discharge ±25 kV Operating Temperature TOPR -40 to +85 -40 to +125 ˚C Storage Temperature TSTG -55 to +150 ˚C Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 3. IEC 61000-4-2 ESD Performance will meet minimum 1000 reps without degradation in performance. *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.

W A L ChipGuard® MLC Series - ESD Protectors W Product Dimensions Recommended Pad Layout C B A A D L W B A L MM DIMENSIONS: C B (INCHES) A D CG0402 CG0603 CG0402 CG0603 Dimension Series C Series B Dim. Series Series A B 1.00 ± 0.15 1.6D0 ± 0.20 0.51 0.76 L A (0.04 ± 0.006) (0.064 ± 0.008) (0.020) (0.030) 0.50 ± 0.10 0.80 ± 0.20 0.61 1.02 W B (0.02 ± 0.004) (0.032 ± 0.008) (0.024) (0.040) B 0.36 ± 0.05 0.45 ± 0.10 0.51 0.50 A C (0.014 ± 0.002) (0.018 ± 0.004) (0.020) (0.020) 0.25 ± 0.15 0.30 ± 0.20 1.70 2.54 B D (0.10 ± 0.006) (0.012 ± 0.008) (0.067) (0.100) Solder Reflow Recommendations 300 Preheat Stages 1-3 Soldering Cooling A Stage 1 Preheat Ambient to Preheating 30 s to 60 s 250 Temperature 200 B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s mperature (C)ϒ 115000 CD SM taaigne H 3e aPtrienhge at P2201re00h °°eCCa t to 200 °C 265005 sss tttooo 476005 sss Te 220 °C 50 s to 60 s 50 230 °C 40 s to 50 s 240 °C 30 s to 40 s 0 250 °C to 255 °C 5 s 110 sec. (min.) 30-70 120 sec. (min.) E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s sec. Time (seconds) • This product can be damaged by rapid heating, cooling or localized heating. • Heat shocks should be avoided. Preheating and gradual cooling recommended. • Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. • Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.

ChipGuard® MLC Series - ESD Protectors Packaging Dimensions 13.0 ± 1.0 8.00 ± 0.30 (0.52 ± 0.04) (0.32 ± 0.012) 4.00 ± 0.10 C (0.16 ± 0.004) 1.50 ± 0.10 (0.06 ± 0.004) 2.0 ± 0.50 62.0 ± 1.50 (2.48 ± 0.06) (0.08 ± 0.02) L 13.0 ± 0.50 (0.52 ± 0.02) TOP G D TAPE 21.0 ± 0.80 3.50 ± 0.05 (0.84 ± 0.032) 180.8 ± 2.0 W (0.14 ± 0.002) (7.12 ± 0.08) NOTES: TAPE MATERIAL IS PAPER. TAPE THICKNESS IS 0.48 ± 0.03 MM (0.019 ± 0.0012) DIMENSIONS: (INCHES) COVER TAPE ADHESION IS 40 ± 15 GRAMS. 9.0 ± 0.50 (0.36 ± 0.02) CG0402 CG0603 How to Order Dimension Series Series CG 0n0n MLC - n.n x x x 1.75 ± 0.05 1.75 ± 0.10 C ChipGuard® (0.04 ± 0.002) (0.04 ± 0.004) Product Designator 2.00 ± 0.02 2.00 ± 0.05 Package Option D 0402 = 0402 Package (0.08 ± 0.0008) (0.08 ± 0.002) 0603 = 0603 Package 1.12 ± 0.03 1.80 ± 0.20 Multilayer Series Designator L (0.045 ± 0.0012) (0.072 ± 0.008) Operating Voltage** 3.3 = 3.3 V 0.62 ± 0.03 0.90 ± 0.20 05 = 5 V W (0.025 ± 0.0012) (0.036 ± 0.008) 12 = 12 V 24 = 24 V G 2.0 ± 0.05 4.0 ± 0.05 Low Leakage Current Option (0.08 ± 0.002) (0.16 ± 0.002) L = Low Leakage Current Blank = Standard Product Tape & Reel Packaging E = 5,000 pcs. per reel (0603 Package) G = 10,000 pcs. per reel (0402 Package) Operating Temperature Option A = Higher +125 °C Operating Temperature Blank = Standard Product ** Only models lower than 10 volts require decimal point. Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com EMEA: Tel: +36 88 520 390 • Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com www.bourns.com REV. T 01/17 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.