Features NT MPLIA ■ 0402 and 0603 package options HS CO ■ Rated for IEC 61000-4-2, for applications requiring up to 18 V DC *Ro ■ Withstands multiple ESD strikes ■ Low capacitance and leakage currents for invisible load protection ■ Tape and reel packaging ChipGuard® MLE Series Varistor ESD Clamp Protectors Description The ChipGuard® CG0402MLE and CG0603MLE Series have been designed to provide high frequency attenuation, thereby providing suppression and fi ltering in a single device. The MLE family also offers protection to ESD standards such as IEC61000-4-2 for applications requiring up to 18 V DC and is available in the industry standard 0603 and 0402 type leadless surface mount packaging. Electrical Characteristics @ 25 °C (unless otherwise noted) Continuous Clamping Off-state Current Capacitance Operating Voltage Voltage Vrms VDC VCLAMP IL CP Model (V) (V) (V) (µA) (pF) Max. Typ. Max. Typ. Max. Max. 1 A 1 Vrms 3.5 V 5.5 V 9 V 12 V 18 V @ 8/20 µs @ 1 MHz CG0402MLE-18G 8.5 12 18 100 0.3 0.4 0.5 1 10 9 CG0603MLE-18E 8.5 12 18 60 0.3 0.4 0.5 1 10 50 Environmental Characteristics Surge Withstand Ratings Operating Temperature ...-55 °C to +125 °C Peak Current Peak Current Storage Temperature.......-55 °C to +125 °C Model 8/20 µs @ 8 kV Response Time..................................<1 ns (Max.) (Max.) Standard .................IEC 61000-4-2 Level 4 CG0402MLE-18G 15 A 30 A These products are RoHS compliant. CG0603MLE-18E 20 A 45 A There is some lead contained within the glass of the ceramic. This is acceptable under exemption no. 5 of the RoHS Voltage-Current Characteristics directive (DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous 2 10 substances in electrical and electronic equipment). CG0402MLE-18G CG0603MLE-18E Schematic CG0402MLE-18G olts) CG0603MLE-18E V e ( 101 g a olt V 0 *RoHS Directive 2002/95/EC Jan. 27, 2003 including 10 annex and RoHS Recast 2011/65/EU June 8, 2011. 10-8 10-7 10-6 10-5 10-4 10-3 10-2 10-1 100 101 102 103 104 Specifi cations are subject to change without notice. The device characteristics and parameters in this data SOURCE = DC SOURCE = 8/20 μs PULSE, IPEAK sheet can and do vary in different applications and actual device performance may vary over time. I Current (Amps) Users should verify actual device performance in their specifi c applications.

3Ch3i1p2G u-a 2rd m® mML SE MSeDr iTesri Vmamrisitnogr EPSoDte Cnlatimomp Pertoetrectors Product Dimensions Recommended Pad Layout A A W MM DIMENSIONS: (INCHES) B L C B D CG0402MLE CG0603MLE CG0402MLE CG0603MLE Dimension Series Series Dim. Series Series 1.00 ± 0.15 1.60 ± 0.20 0.51 0.76 L A (0.04 ± 0.006) (0.064 ± 0.008) (0.020) (0.030) 0.50 ± 0.10 0.80 ± 0.20 0.61 1.02 W B (0.02 ± 0.004) (0.032 ± 0.008) (0.024) (0.040) 0.50 ± 0.10 0.80 ± 0.20 0.51 0.50 A C (0.02 ± 0.004) (0.032 ± 0.008) (0.020) (0.020) 0.25 ± 0.15 0.30 ± 0.20 1.70 2.54 B D (0.10 ± 0.006) (0.012 ± 0.008) (0.067) (0.100) Solder Refl ow Recommendations Preheat Stages 1-3 Soldering Cooling A Stage 1 Preheat Ambient to Preheating 30 s to 60 s 300 Temperature 250 B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s mperature (C)° 211050000 CD SM taaigne H 3e aPtrienhge at 22P01re00h °°eCCa t to 200 °C 652050 sss tttooo 764050 sss Te 220 °C 50 s to 60 s 50 230 °C 40 s to 50 s 240 °C 30 s to 40 s 0 E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s 110 sec. (min.) 30-70 120 sec. (min.) sec. Time (seconds) • This product can be damaged by rapid heating, cooling or localized heating. • Heat shocks should be avoided. Preheating and gradual cooling recommended. • Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. • Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. How to Order CG 0n0n MLE - 18 x ChipGuard® Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage 18 = 18 V Tape & Reel Packaging E = 4,000 pcs. per reel (0603 package) G = 10,000 pcs. per reel (0402 package) Ni barrier terminations are standard on all ChipGuard® part numbers. Specifi cations are subject to change without notice. Customers should verify actual device performance in their specifi c applications.

ChipGuard® MLE Series Varistor ESD Clamp Protectors Packaging Dimensions 13.0 ± 1.0 8.00 ± 0.30 (0.52 ± 0.04) (0.32 ± 0.012) 4.00 ± 0.10 (0.16 ± 0.004) 1.50 ± 0.10 C (0.06 ± 0.004) 2.0 ± 0.50 (622.4.08 ±± 10..5006) (0.08 ± 0.02) L 13.0 ± 0.50 (0.52 ± 0.02) TOP G D TAPE 21.0 ± 0.80 3.50 ± 0.05 (0.84 ± 0.032) 180.8 ± 2.0 W (0.14 ± 0.002) (7.12 ± 0.08) NOTES: TAPE MATERIAL IS PAPER. 0.48 ± 0.03 TAPE THICKNESS IS(0.019 ± 0.0012) DIMENSIONS: MM COVER TAPE ADHESION IS 40 ± 15 GRAMS. (INCHES) 9.0 ± 0.50 (0.36 ± 0.02) CG0402MLE CG0603MLE Dimension Series Series 1.75 ± 0.05 1.75 ± 0.10 C (0.04 ± 0.002) (0.04 ± 0.004) 2.00 ± 0.02 2.00 ± 0.05 D (0.08 ± 0.0008) (0.08 ± 0.002) 1.19 ± 0.05 1.80 ± 0.20 L (0.047 ± 0.002) (0.072 ± 0.008) 0.69 ± 0.05 0.90 ± 0.20 W (0.027 ± 0.002) (0.036 ± 0.008) 2.0 ± 0.05 4.0 ± 0.05 G (0.08 ± 0.002) (0.16 ± 0.002) Asia-Pacifi c: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com REV. I 09/12 Specifi cations are subject to change without notice. Customers should verify actual device performance in their specifi c applications.