Data sheet acquired from Harris Semiconductor SCHS057C – Revised September 2003 The CD4073B, CD4081B, and CD4082B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright  2003, Texas Instruments Incorporated

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PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty 7702402CA ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType 7705102CA ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType 7705902CA ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4073BE ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4073BEE4 ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4073BF ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4073BF3A ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4073BM ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BM96 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BM96E4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BM96G4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BME4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BMG4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BMT ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BMTE4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BMTG4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BNSR ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BNSRE4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BNSRG4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BPW ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BPWE4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BPWG4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BPWR ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BPWRE4 ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4073BPWRG4 ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BE ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4081BEE4 ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) Addendum-Page1

PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty CD4081BF ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4081BF3A ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4081BF3AS2534 OBSOLETE CDIP J 14 TBD CallTI CallTI CD4081BM ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BM96 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BM96E4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BM96G4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BME4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BMG4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BMT ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BMTE4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BMTG4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BNSR ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BNSRE4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BNSRG4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BPW ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BPWE4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BPWG4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BPWR ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BPWRE4 ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4081BPWRG4 ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BE ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4082BEE4 ACTIVE PDIP N 14 25 Pb-Free CUNIPDAU N/AforPkgType (RoHS) CD4082BF ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4082BF3A ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType CD4082BM ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BM96 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BM96E4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) Addendum-Page2

PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty CD4082BM96G4 ACTIVE SOIC D 14 2500 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BME4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BMG4 ACTIVE SOIC D 14 50 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BMT ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BMTE4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BMTG4 ACTIVE SOIC D 14 250 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BNSR ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BNSRE4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BNSRG4 ACTIVE SO NS 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BPW ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BPWE4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BPWG4 ACTIVE TSSOP PW 14 90 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BPWR ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BPWRE4 ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) CD4082BPWRG4 ACTIVE TSSOP PW 14 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) JM38510/17001BCA ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType JM38510/17002BCA ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType JM38510/17003BCA ACTIVE CDIP J 14 1 TBD A42 N/AforPkgType (1)Themarketingstatusvaluesaredefinedasfollows: ACTIVE:Productdevicerecommendedfornewdesigns. LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect. NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartin anewdesign. PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable. OBSOLETE:TIhasdiscontinuedtheproductionofthedevice. (2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheck http://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails. TBD:ThePb-Free/Greenconversionplanhasnotbeendefined. Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirements forall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesoldered athightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses. Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieand package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible)asdefinedabove. Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflame retardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial) Addendum-Page3

PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimited informationmaynotbeavailableforrelease. InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTI toCustomeronanannualbasis. Addendum-Page4

PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0(mm) B0(mm) K0(mm) P1 W Pin1 Type Drawing Diameter Width (mm) (mm) Quadrant (mm) W1(mm) CD4073BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4073BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4073BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 CD4081BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4081BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4081BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 CD4082BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4082BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4082BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) CD4073BM96 SOIC D 14 2500 346.0 346.0 33.0 CD4073BNSR SO NS 14 2000 346.0 346.0 33.0 CD4073BPWR TSSOP PW 14 2000 346.0 346.0 29.0 CD4081BM96 SOIC D 14 2500 346.0 346.0 33.0 CD4081BNSR SO NS 14 2000 346.0 346.0 33.0 CD4081BPWR TSSOP PW 14 2000 346.0 346.0 29.0 CD4082BM96 SOIC D 14 2500 346.0 346.0 33.0 CD4082BNSR SO NS 14 2000 346.0 346.0 33.0 CD4082BPWR TSSOP PW 14 2000 346.0 346.0 29.0 PackMaterials-Page2

MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,65 0,10 M 0,19 14 8 0,15 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 1 7 0°–8° A 0,75 0,50 Seating Plane 0,15 1,20 MAX 0,10 0,05 PINS ** 8 14 16 20 24 28 DIM A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 4040064/F 01/97 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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PACKAGE OPTION ADDENDUM www.ti.com 22-Jul-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) Ball material (3) (4/5) (6) 7702402CA ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 7702402CA CD4081BF3A 7705102CA ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 7705102CA CD4073BF3A 7705902CA ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 7705902CA CD4082BF3A CD4073BE ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4073BE & no Sb/Br) CD4073BF ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 CD4073BF CD4073BF3A ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 7705102CA CD4073BF3A CD4073BM ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4073BM & no Sb/Br) CD4073BM96 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4073BM & no Sb/Br) CD4073BMT ACTIVE SOIC D 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4073BM & no Sb/Br) CD4073BNSR ACTIVE SO NS 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4073B & no Sb/Br) CD4073BPW ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM073B & no Sb/Br) CD4073BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM073B & no Sb/Br) CD4081BE ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4081BE & no Sb/Br) CD4081BEE4 ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4081BE & no Sb/Br) CD4081BF ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 CD4081BF CD4081BF3A ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 7702402CA CD4081BF3A CD4081BM ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4081BM & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 22-Jul-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) Ball material (3) (4/5) (6) CD4081BM96 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4081BM & no Sb/Br) CD4081BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4081BM & no Sb/Br) CD4081BME4 ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4081BM & no Sb/Br) CD4081BMG4 ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4081BM & no Sb/Br) CD4081BMT ACTIVE SOIC D 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4081BM & no Sb/Br) CD4081BNSR ACTIVE SO NS 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4081B & no Sb/Br) CD4081BPW ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM081B & no Sb/Br) CD4081BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM081B & no Sb/Br) CD4081BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM081B & no Sb/Br) CD4082BE ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4082BE & no Sb/Br) CD4082BEE4 ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4082BE & no Sb/Br) CD4082BF ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 CD4082BF CD4082BF3A ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 7705902CA CD4082BF3A CD4082BM ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4082BM & no Sb/Br) CD4082BM96 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4082BM & no Sb/Br) CD4082BMT ACTIVE SOIC D 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4082BM & no Sb/Br) CD4082BNSR ACTIVE SO NS 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4082B & no Sb/Br) CD4082BPW ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM082B & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 22-Jul-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) Ball material (3) (4/5) (6) CD4082BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM082B & no Sb/Br) CD4082BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM082B & no Sb/Br) JM38510/17001BCA ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510/ 17001BCA JM38510/17002BCA ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510/ 17002BCA JM38510/17003BCA ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510/ 17003BCA M38510/17001BCA ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510/ 17001BCA M38510/17002BCA ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510/ 17002BCA M38510/17003BCA ACTIVE CDIP J 14 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510/ 17003BCA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 22-Jul-2020 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD4073B, CD4073B-MIL, CD4081B, CD4081B-MIL, CD4082B, CD4082B-MIL : •Catalog: CD4073B, CD4081B, CD4082B •Military: CD4073B-MIL, CD4081B-MIL, CD4082B-MIL NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Military - QML certified for Military and Defense Applications Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 8-Nov-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) CD4073BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4073BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4073BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4073BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD4081BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4081BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4081BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4081BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD4082BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4082BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4082BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4082BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 8-Nov-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) CD4073BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4073BMT SOIC D 14 250 210.0 185.0 35.0 CD4073BNSR SO NS 14 2000 367.0 367.0 38.0 CD4073BPWR TSSOP PW 14 2000 367.0 367.0 35.0 CD4081BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4081BMT SOIC D 14 250 210.0 185.0 35.0 CD4081BNSR SO NS 14 2000 367.0 367.0 38.0 CD4081BPWR TSSOP PW 14 2000 367.0 367.0 35.0 CD4082BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4082BMT SOIC D 14 250 210.0 185.0 35.0 CD4082BNSR SO NS 14 2000 367.0 367.0 38.0 CD4082BPWR TSSOP PW 14 2000 367.0 367.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE J0014A CDIP - 5.08 mm max height SCALE 0.900 CERAMIC DUAL IN LINE PACKAGE PIN 1 ID A 4X .005 MIN (OPTIONAL) [0.13] .015-.060 TYP [0.38-1.52] 1 14 12X .100 [2.54] 14X .014-.026 14X .045-.065 [0.36-0.66] [1.15-1.65] .010 [0.25] C A B .754-.785 [19.15-19.94] 7 8 B .245-.283 .2 MAX TYP .13 MIN TYP [6.22-7.19] [5.08] [3.3] SEATING PLANE C .308-.314 [7.83-7.97] AT GAGE PLANE .015 GAGE PLANE [0.38] 0 -15 14X .008-.014 TYP [0.2-0.36] 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. www.ti.com

EXAMPLE BOARD LAYOUT J0014A CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE (.300 ) TYP [7.62] SEE DETAIL B SEE DETAIL A 1 14 12X (.100 ) [2.54] SYMM 14X ( .039) [1] 7 8 SYMM LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X .002 MAX (.063) [0.05] [1.6] METAL ALL AROUND ( .063) SOLDER MASK [1.6] OPENING METAL .002 MAX SOLDER MASK (R.002 ) TYP [0.05] OPENING [0.05] ALL AROUND DETAIL A DETAIL B SCALE: 15X 13X, SCALE: 15X 4214771/A 05/2017 www.ti.com

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