Data sheet acquired from Harris Semiconductor SCHS021D – Revised September 2003 The CD4011B, CD4012B, and CD4023B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PWR suffix). The CD4011B and CD4023B types also are supplied in 14-lead thin shrink small-outline packages (PW suffix). Copyright© 2003, Texas Instruments Incorporated

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PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) CD4011BE ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4011BE & no Sb/Br) CD4011BEE4 ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4011BE & no Sb/Br) CD4011BF ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4011BF CD4011BF3A ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4011BF3A CD4011BM ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM & no Sb/Br) CD4011BM96 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM & no Sb/Br) CD4011BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM & no Sb/Br) CD4011BME4 ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM & no Sb/Br) CD4011BMT ACTIVE SOIC D 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM & no Sb/Br) CD4011BPW ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM011B & no Sb/Br) CD4011BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM011B & no Sb/Br) CD4011BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM011B & no Sb/Br) CD4011BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM011B & no Sb/Br) CD4012BE ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4012BE & no Sb/Br) CD4012BEE4 ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4012BE & no Sb/Br) CD4012BF3A ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4012BF3A CD4012BM ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4012BM & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) CD4012BM96 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4012BM & no Sb/Br) CD4012BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4012BM & no Sb/Br) CD4012BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4012BM & no Sb/Br) CD4012BNSR ACTIVE SO NS 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4012B & no Sb/Br) CD4012BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM012B & no Sb/Br) CD4023BE ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4023BE & no Sb/Br) CD4023BEE4 ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -55 to 125 CD4023BE & no Sb/Br) CD4023BF ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4023BF CD4023BF3A ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4023BF3A CD4023BM ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4023BM & no Sb/Br) CD4023BM96 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4023BM & no Sb/Br) CD4023BMG4 ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4023BM & no Sb/Br) CD4023BMT ACTIVE SOIC D 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4023BM & no Sb/Br) CD4023BMTE4 ACTIVE SOIC D 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CD4023BM & no Sb/Br) CD4023BPW ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM023B & no Sb/Br) CD4023BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -55 to 125 CM023B & no Sb/Br) JM38510/05051BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 05051BCA JM38510/05052BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 05052BCA Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) JM38510/05053BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 05053BCA M38510/05051BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 05051BCA M38510/05052BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 05052BCA M38510/05053BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 05053BCA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD4011B, CD4011B-MIL, CD4012B, CD4012B-MIL, CD4023B, CD4023B-MIL : •Catalog: CD4011B, CD4012B, CD4023B •Military: CD4011B-MIL, CD4012B-MIL, CD4023B-MIL NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Military - QML certified for Military and Defense Applications Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 30-Jun-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) CD4011BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4011BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4011BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD4012BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4012BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4012BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD4023BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4023BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4023BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 30-Jun-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) CD4011BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4011BMT SOIC D 14 250 210.0 185.0 35.0 CD4011BPWR TSSOP PW 14 2000 367.0 367.0 35.0 CD4012BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4012BNSR SO NS 14 2000 367.0 367.0 38.0 CD4012BPWR TSSOP PW 14 2000 367.0 367.0 35.0 CD4023BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4023BMT SOIC D 14 250 210.0 185.0 35.0 CD4023BPWR TSSOP PW 14 2000 367.0 367.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE J0014A CDIP - 5.08 mm max height SCALE 0.900 CERAMIC DUAL IN LINE PACKAGE PIN 1 ID A 4X .005 MIN (OPTIONAL) [0.13] .015-.060 TYP [0.38-1.52] 1 14 12X .100 [2.54] 14X .014-.026 14X .045-.065 [0.36-0.66] [1.15-1.65] .010 [0.25] C A B .754-.785 [19.15-19.94] 7 8 B .245-.283 .2 MAX TYP .13 MIN TYP [6.22-7.19] [5.08] [3.3] SEATING PLANE C .308-.314 [7.83-7.97] AT GAGE PLANE .015 GAGE PLANE [0.38] 0 -15 14X .008-.014 TYP [0.2-0.36] 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. www.ti.com

EXAMPLE BOARD LAYOUT J0014A CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE (.300 ) TYP [7.62] SEE DETAIL B SEE DETAIL A 1 14 12X (.100 ) [2.54] SYMM 14X ( .039) [1] 7 8 SYMM LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X .002 MAX (.063) [0.05] [1.6] METAL ALL AROUND ( .063) SOLDER MASK [1.6] OPENING METAL .002 MAX SOLDER MASK (R.002 ) TYP [0.05] OPENING [0.05] ALL AROUND DETAIL A DETAIL B SCALE: 15X 13X, SCALE: 15X 4214771/A 05/2017 www.ti.com

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