Product Sample & Technical Tools & Support & Folder Buy Documents Software Community CC2592 SWRS159–FEBRUARY2014 CC2592 2.4-GHz Range Extender 1 Introduction 1.1 Features 1 • SeamlessInterfaceto2.4-GHzLow-PowerRF • DigitalControlofLNAGainbyHGMTerminal DevicesfromTexasInstruments • 100nAinPowerDown(LNA_EN=PA_EN=0) • +22-dBmOutputPower • Low-TransmitCurrentConsumption • 3-dBTypicalImprovedSensitivityonCC2520, – 155mAat3Vfor+22dBm,PAE=34% CC253X,andCC85XX • Low-ReceiveCurrentConsumption • VeryFewExternalComponents – 4.0-mAforHigh-GainMode – IntegratedSwitches – 1.9-mAforLow-GainMode – IntegratedMatchingNetwork • 4.7-dBLNANoiseFigure,IncludingT/RSwitch – IntegratedBalun andExternalAntennaMatch – IntegratedInductors • RoHSCompliant4-mm×4-mmQFN-16Package – IntegratedPA • 2.0-Vto3.7-VOperation – IntegratedLNA • –40°Cto+125°COperation 1.2 Applications • All2.4-GHzISMBandSystems • IEEE802.15.4andZigBeeGateways • WirelessSensorNetworks • WirelessConsumerSystems • WirelessIndustrialSystems • WirelessAudioSystems • IEEE802.15.4andZigBee®MeteringSystems 1.3 Description The CC2592 device is a cost-effective and high-performance RF front end for low-power and low-voltage 2.4-GHzwirelessapplications. The CC2592 device is a range extender for all CC25XX 2.4-GHz low-power RF transceivers, transmitters, andsystem-on-chipproductsfromTexasInstruments. To increase the link budget, the CC2592 device provides a power amplifier for increased output power andanLNAwithalow-noisefigureforimprovedreceiversensitivity. The CC2592 device provides a very small size, high-output power RF design with its 4-mm × 4-mm QFN- 16package. The CC2592 device contains PA, LNA, switches, RF-matching, and balun for simple design of high- performancewirelessapplications. 1 AnIMPORTANTNOTICEattheendofthisdatasheetaddressesavailability,warranty,changes,useinsafety-criticalapplications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

CC2592 SWRS159–FEBRUARY2014 www.ti.com 1.4 Functional Block Diagram Figure1-1showsasimplifiedblockdiagramoftheCC2592device. VDD_LNA VDD_PA VDD_BIAS ANT PA PREAMP BALUN RF_P EN EN RF_N LNA EN PA_EN BIAS LOGIC LNA_EN BIAS HGM Figure1-1.CC2592SimplifiedBlockDiagram 2 Introduction Copyright©2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 www.ti.com SWRS159–FEBRUARY2014 RevisionHistory Date LiteratureNumber Changes February2014 SWRS159 Initialrelease Copyright©2014,TexasInstrumentsIncorporated Introduction 3 SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 SWRS159–FEBRUARY2014 www.ti.com 2 Device Characteristics 2.1 Absolute Maximum Ratings Undernocircumstancesmusttheabsolutemaximumratingsbeviolated.Stressexceedingoneormoreofthelimitingvalues maycausepermanentdamagetothedevice. Parameter Conditions Value Unit Supplyvoltage Allsupplyterminalsmusthavethesamevoltage –0.3to3.8 V Voltageonanydigitalterminal –0.3toVDD+0.3,max3.8 V InputRFlevel +10 dBm 2.2 Handling Ratings Undernocircumstancesmustthehandlingratingsbeviolated.Stressexceedingoneormoreofthelimitingvaluesmay causepermanentdamagetothedevice. Parameter Conditions Value Unit Storagetemperaturerange –50to150 °C HumanBodyModel 2000 V ESD ChargeDeviceModel 1000 V 2.3 Recommended Operating Conditions TheoperatingconditionsfortheCC2592devicearelistedbelow. Parameter Conditions Min Max Unit Ambienttemperaturerange –40 125 °C Operatingsupplyvoltage 2.0 3.7 V Operatingfrequencyrange 2400 2483.5 MHz 4 DeviceCharacteristics Copyright©2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 www.ti.com SWRS159–FEBRUARY2014 2.4 Electrical Characteristics T =25°C,VDD=3.0V,f =2440MHz(unlessotherwisenoted).MeasuredonCC2592EMreferencedesignincluding c RF externalmatchingcomponents. Parameter TestConditions Min Typ Max Unit Receivecurrent,high-gainmode HGM=1 4 mA Receivecurrent,low-gainmode HGM=0 1.9 mA P =20dBm 123 OUT Transmitcurrent mA P =22dBm 155 OUT Transmitcurrent Noinputsignal 50 mA Powerdowncurrent EN=0 0.1 0.3 µA High-inputlevel(controlterminals) PA_EN,LNA_EN,HGM 1.3 Vdd V Low-inputlevel(controlterminals) PA_EN,LNA_EN,HGM 0.3 V Powerdown-Receivemodeswitching 1 µs time Powerdown-Transmitmodeswitching 1 µs time RFReceive Gain,high-gainmode HGM=1 11 dB Gain,low-gainmode HGM=0 6 dB Gainvariationoverfrequency 2400to2483.5MHz,HGM=1 2 dB Gainvariationoverpowersupply 2.0Vto3.7V,HGM=1 1.5 dB Gainvariationovertemperature –40°Cto85°C,HGM=1 1.7 dB Gainvariationovertemperature 85°Cto125°C,HGM=1 1 dB HGM=1,includinginternalT/R 4.7 dB Noisefigure,high-gainmode switchandexternalantennamatch Input1-dBcompression,high-gainmode HGM=1 –18 dBm InputIP3,high-gainmode HGM=1 –9 dBm Inputreflectioncoefficient,S11 HGM=1,measuredatantennaport –15 dB RFTransmit Gain 24 dB P =0.0dBm 20.3 IN Outputpower,P dBm OUT P =4.0dBm 21.9 IN Poweraddedefficiency,PAE P =22dBm 34 % OUT Output1-dBcompression 15 dBm Outputpowervariationoverfrequency 2400to2483.5MHz,P =4dBm 0.5 dB IN Outputpowervariationoverpowersupply 2.0Vto3.7V,P =4dBm 3.8 dB IN Outputpowervariationovertemperature –40°Cto125°C,P =4dBm 1.7 dB IN Secondharmonicpower FCCrequirement –41.2 dBm Thirdharmonicpower FCCrequirement –41.2 dBm Nodamage 20:1 VSWR Stability 7.5:1 Copyright©2014,TexasInstrumentsIncorporated DeviceCharacteristics 5 SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 SWRS159–FEBRUARY2014 www.ti.com 3 Device Information 3.1 Terminal and I/O Configuration Figure3-1andTable3-1,providetheterminallayoutanddescriptionfortheCC2592device. S A A A N I P B L _ _ _ D D D D N D D D G V V V 16 15 14 13 GND 1 12 GND RF_N 2 11 GND QFN-16 4x4mm RF_P 3 10 ANT GND 4 9 GND 5 6 7 8 N N M S E E G A _ _ I H B A A P N L Figure3-1.TerminalTopView 6 DeviceInformation Copyright©2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 www.ti.com SWRS159–FEBRUARY2014 Table3-1.TerminalFunctions Terminal Type Description No. Name – GND Ground Theexposeddieattachpadmustbeconnectedtoasolidground plane.SeeCC2592EMreferencedesignfortherecommendedlayout. 1,4,9,11,12,16 GND Ground Groundconnections.Onlyterminals9,11,and12shouldbeshorted tothedieattachpadonthetopPCBlayer. 2 RF_N RF RFinterfacetowardCC25xxdevice 3 RF_P RF RFinterfacetowardCC25xxdevice 5 PA_EN Digitalinput Digitalcontrolterminal.SeeTable9-1fordetails. 6 LNA_EN Digitalinput Digitalcontrolterminal.SeeTable9-1ordetails. 7 HGM Digitalinput Digitalcontrolterminal HGM=1→DeviceinHighGainMode HGM=0→DeviceinLowGainMode 8 BIAS Analog Biasinginput.Resistorbetweenthisnodeandgroundsetsbias currentforPAandLNA. 10 ANT RF Antennainterface 13 VDD_LNA Power 2.0-to3.7-Vpower 14 VDD_BIAS Power 2.0-to3.7-Vpower 15 VDD_PA Power 2.0-to3.7-Vpower Copyright©2014,TexasInstrumentsIncorporated DeviceInformation 7 SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 SWRS159–FEBRUARY2014 www.ti.com 4 Sensitivity Improvement Example CC2592 CC2520 NF = 4.7 dB NF = 8 dB Gain = 11 dB Figure4-1. The noise factor of a system consisting of the CC2592 device and a CC2520 device, as seen in Figure 4- 1isgivenby: 8 F (cid:16)1 4.7 1010 (cid:16)1 F F (cid:14) 2 1010 (cid:14) 3.37 1 G 11 1 1010 (1) Thenoisefigureis: NF 10log(F) 10log(3.37) 5.28dB (2) The noise figure is reduced from 8 dB for the CC2520 standalone to 5.28 dB for the CC2592 and CC2520 devicecombination,leadingtoa2.72-dBtheoreticalimprovementinsensitivity. In practice, tests on the CC2592 and CC25XX devices show around 3-dB improvement in sensitivity. For theCC2538andCC2592devices,theimprovementisalmost4dB(approximately –97dBmto–101dBm) 8 SensitivityImprovementExample Copyright©2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 www.ti.com SWRS159–FEBRUARY2014 5 CC2592EM Evaluation Module Figure5-1showsanevaluationmodulecircuitoftheCC2592device. VDD VDD C131 C151 VDD A S A N A P C108 C107 C106 L101 VDD_L VDD_BI VDD_ RFRRFF___PPP C21LDB182G4520C-110 SMA Balun RRXXTTXX C152 SMA C109 L103 L102 RF_N ANT CC2592 RRFF__NN PA_EN PA_EN C105 C103 C101 LNA_EN LNA_EN S A HGM HGM BI R81 Figure5-1.CC2592EvaluationModule Table5-1liststhematerialsintheCC2592evaluationmodulecircuit. Table5-1.ListofMaterials Device Function Value L101 PAbiasinductor 4.7nH,Multilayerchipinductor L102 Partofantennamatch 1nH,Multilayerchipinductor L103 Partofantennamatch 1.8nH,Multilayerchipinductor C101 Partofantennamatch 2.2-pF0402Chipcapacitor C103 Partofantennamatch 2.2-pF0402Chipcapacitor C105 Partofantennamatch 0.1-pF0402Chipcapacitor C106 Decoupling 12-pF0402Chipcapacitor C107 Decoupling 1-nF0402Chipcapacitor C108 Decoupling 1-µF0402Chipcapacitor C109 DCblock 18-pF0402Chipcapacitor C21 Balunmatchingcapacitor 0.2-pF0402Chipcapacitor C152 Balunmatchingcapacitor 0.3-pF0402Chipcapacitor C131 Decoupling 1-nF0402Chipcapacitor C151 Decoupling 12-pF0402Chipcapacitor R81 Biasresistor 3.9kΩ,0402resistor Copyright©2014,TexasInstrumentsIncorporated CC2592EMEvaluationModule 9 SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 SWRS159–FEBRUARY2014 www.ti.com 6 Typical Characteristics spacer 13 5.2 12 HGM 12 LGM 5.1 11 NF HGM 11 5.0 10 10 4.9 B) Gain (dB) 89 44..78 se Figure (d Gain (dB) 789 7 4.6 oi N 6 6 4.5 5 4.4 5 HGM LGM 4 4.3 4 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 Frequency (MHz) C003 Power Supply (V) C002 Figure1.LNAGainandNoiseFigureVersusFrequency Figure2.LNAGainVersusPowerSupply 12 36 180 HGM Pout 11 LGM %) 34 PAE 170 10 AE (32 Ivdd 160 mA) d P30 150 n ( dB) 9 m) an28 140 mptio Gain ( 78 er (dB26 130 Consu 6 put Pow2224 111200 Current 5 Out20 100 4 18 90 ±40 ±20 0 20 40 60 80 100 120 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 Temperature (ƒC) C001 Frequency (MHz) C007 Figure3.LNAGainVersusTemperature Figure4.OutputPower,PAE,andCurrentConsumptionVersus Frequency InputPowerLevel=+4dBm 36 200 36 180 %) 32 180 %) 34 170 AE (28 160 mA) AE (32 160 mA) d P24 140 n ( d P30 150 n ( n o n o m) a20 120 mpti m) a28 140 mpti er (dB16 100 Consu er (dB26 130 Consu Output Pow1248 PPoAuEt 468000 Current Output Pow222024 PPoAuEt 111012000 Current Ivdd Ivdd 0 20 18 90 ±20 ±16 ±12 ±8 ±4 0 4 8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 Input Power (dBm) Power Supply (V) C004 C005 Figure5.OutputPower,PAE,andCurrentConsumptionVersus Figure6.OutputPower,PAE,andCurrentConsumptionVersus InputPower PowerSupply InputPowerLevel=+4dBm 10 TypicalCharacteristics Copyright©2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 www.ti.com SWRS159–FEBRUARY2014 36 160 Pout %) 34 PAE 158 AE (32 Ivdd 156 mA) d P30 154 n ( n o m) a28 152 mpti er (dB26 150 Consu put Pow2224 114468 Current Out20 144 18 142 ±40 ±20 0 20 40 60 80 100 120 140 Temperature (ƒC) C006 Figure7.OutputPower,PAE,andCurrentConsumptionVersusTemperature InputPowerLevel=+4dBm Copyright©2014,TexasInstrumentsIncorporated TypicalCharacteristics 11 SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 SWRS159–FEBRUARY2014 www.ti.com 7 Controlling the Output Power from CC2592 The output power of the CC2592 device is controlled by controlling the input power. The CC2592 PA is designedtoworkincompression(classAB). Driving the CC2592 device too far into saturation might result in spurious emissions and harmonics above regulatory limits. This caution should especially be considered for systems targeting a wide operating temperature range, where a combination of low temperature, low supply voltage, and a transceiver that increasesoutputpower(drivelevel)atlowtemperature,canresultinhighspuriousemissions. Figure7-1showsthemaximumrecommendeddrivelevelversustemperatureandsupplyvoltage. Figure7-1.MaximumRecommendedDriveLevel 8 Input Levels on Control Terminals The three digital control terminals (PA_EN, LNA_EN, and HGM) have built-in level-shifting functionality, meaning that if the CC2592 device operates off a 3.7-V supply voltage, the control terminals still sense 1.6- to 1.8-V signals as a logical 1. However, the input voltages should not have a logical 1 level that is higherthanthesupply. 12 InputLevelsonControlTerminals Copyright©2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 www.ti.com SWRS159–FEBRUARY2014 9 Connecting the CC2592 Device to a CC25xx Device Table9-1showsthecontrollogicforconnectingCC2592toaCC25xxdevice. Table9-1.ControlLogicforConnectingCC2592toaCC25xxDevice PA_EN LNA_EN HGM ModeofOperation 0 0 X PowerDown X 1 0 RXLow-GainMode X 1 1 RXHigh-GainMode 1 0 X TX Figure9-1showstheapplicationcircuitfortheCC2592andCC253Xdevices. VDD VDD C131 C151 VDD A S A N A P C108 C107 C106 L101 VDD_L VDD_BI VDD_ RFRRFF___PPP RF_P RRXXTTXX SMA C109 L103 L102 ANT CC2592 RFRRFF___NNN RF_N CC2530 PA_EN P1.1 C105 C103 C101 LNA_EN P1.0 S A HGM P0.7 BI R81 Alternatively to VDD/GND/MCU Figure9-1.ApplicationCircuitExampleforCC2530+CC2592 Copyright©2014,TexasInstrumentsIncorporated ConnectingtheCC2592DevicetoaCC25xxDevice 13 SubmitDocumentationFeedback ProductFolderLinks:CC2592

CC2592 SWRS159–FEBRUARY2014 www.ti.com 10 Device and Documentation Support 10.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table10-1.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY CC2592 Clickhere Clickhere Clickhere Clickhere Clickhere 10.2 Trademarks ZigBeeisaregisteredtrademarkofZigBeeAlliance. 10.3 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. 10.4 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronymsanddefinitions. 14 DeviceandDocumentationSupport Copyright©2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback ProductFolderLinks:CC2592

PACKAGE OPTION ADDENDUM www.ti.com 15-May-2015 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) CC2592RGVR ACTIVE VQFN RGV 16 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 CC2592 & no Sb/Br) CC2592RGVT ACTIVE VQFN RGV 16 250 Green (RoHS CU NIPDAU | Call TI Level-2-260C-1 YEAR -40 to 125 CC2592 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 15-May-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 26-Feb-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) CC2592RGVR VQFN RGV 16 2500 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 CC2592RGVT VQFN RGV 16 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 26-Feb-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) CC2592RGVR VQFN RGV 16 2500 350.0 350.0 43.0 CC2592RGVT VQFN RGV 16 250 210.0 185.0 35.0 PackMaterials-Page2

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