CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 2.4-GHz Bluetooth™ low energy and Proprietary System-on-Chip CheckforSamples:CC2541 FEATURES 1 • RF – High-PerformanceandLow-Power8051 23 – 2.4-GHzBluetoothlowenergyCompliant MicrocontrollerCoreWithCodePrefetch andProprietaryRFSystem-on-Chip – In-System-ProgrammableFlash,128-or – Supports250-kbps,500-kbps,1-Mbps,2- 256-KB MbpsDataRates – 8-KBRAMWithRetentioninAllPower – ExcellentLinkBudget,EnablingLong- Modes RangeApplicationsWithoutExternalFront – HardwareDebugSupport End – ExtensiveBasebandAutomation,Including – ProgrammableOutputPowerupto0dBm Auto-AcknowledgmentandAddress – ExcellentReceiverSensitivity(–94dBmat Decoding 1Mbps),Selectivity,andBlocking – RetentionofAllRelevantRegistersinAll Performance PowerModes – SuitableforSystemsTargetingCompliance • Peripherals WithWorldwideRadioFrequency – PowerfulFive-ChannelDMA Regulations:ETSIEN300328andEN300 – General-PurposeTimers(One16-Bit,Two 440Class2(Europe),FCCCFR47Part15 8-Bit) (US),andARIBSTD-T66(Japan) – IRGenerationCircuitry • Layout – 32-kHzSleepTimerWithCapture – FewExternalComponents – AccurateDigitalRSSISupport – ReferenceDesignProvided – BatteryMonitorandTemperatureSensor – 6-mm ×6-mmQFN-40Package – 12-BitADCWithEightChannelsand – Pin-CompatibleWithCC2540(WhenNot ConfigurableResolution UsingUSBorI2C) – AESSecurityCoprocessor • LowPower – TwoPowerfulUSARTsWithSupportfor – Active-ModeRXDownto:17.9mA SeveralSerialProtocols – Active-ModeTX(0dBm):18.2mA – 23General-PurposeI/OPins – PowerMode1(4-µsWake-Up):270 µA (21×4mA,2 ×20mA) – PowerMode2(SleepTimerOn):1µA – I2Cinterface – PowerMode3(ExternalInterrupts):0.5µA – 2I/OPinsHaveLEDDrivingCapabilities – WideSupply-VoltageRange(2V–3.6V) – WatchdogTimer • TPS62730CompatibleLowPowerinActive – IntegratedHigh-PerformanceComparator Mode • DevelopmentTools – RXDownto:14.7mA(3-Vsupply) – CC2541EvaluationModuleKit – TX(0dBm):14.3mA(3-Vsupply) (CC2541EMK) Whitespace – CC2541MiniDevelopmentKit(CC2541DK- Whitespace MINI) Whitespace – SmartRF™Software Whitespace Whitespace – IAREmbeddedWorkbench™Available Whitespace • Microcontroller 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. BluetoothisatrademarkofBluetoothSIG,Inc.. 2 ZigBeeisaregisteredtrademarkofZigBeeAlliance. 3 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2012–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com SOFTWARE FEATURES CC2541 WITH TPS62730 • Bluetoothv4.0CompliantProtocolStackfor • TPS62730isa2-MHzStep-DownConverter Single-ModeBLESolution WithBypassMode – CompletePower-OptimizedStack, • ExtendsBatteryLifetimebyupto20% IncludingControllerandHost • ReducedCurrentinAllActiveModes – GAP –Central,Peripheral,Observer,or • 30-nABypassModeCurrenttoSupportLow- Broadcaster(IncludingCombination PowerModes Roles) • RFPerformanceUnchanged – ATT/GATT –ClientandServer • SmallPackageAllowsforSmallSolutionSize – SMP –AES-128Encryptionand • CC2541Controllable Decryption – L2CAP DESCRIPTION – SampleApplicationsandProfiles The CC2541 is a power-optimized true system-on- – GenericApplicationsforGAPCentral chip (SoC) solution for both Bluetooth low energy and andPeripheralRoles proprietary 2.4-GHz applications. It enables robust network nodes to be built with low total bill-of-material – Proximity,Accelerometer,SimpleKeys, costs. The CC2541 combines the excellent andBatteryGATTServices performance of a leading RF transceiver with an – MoreApplicationsSupportedinBLE industry-standard enhanced 8051 MCU, in-system SoftwareStack programmable flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. – MultipleConfigurationOptions The CC2541 is highly suited for systems where – Single-ChipConfiguration,Allowing ultralow power consumption is required. This is ApplicationstoRunonCC2541 specified by various operating modes. Short transition – NetworkProcessorInterfacefor times between operating modes further enable low ApplicationsRunningonanExternal powerconsumption. Microcontroller The CC2541 is pin-compatible with the CC2540 in – BTool– WindowsPCApplicationfor the 6-mm × 6-mm QFN40 package, if the USB is not Evaluation,Development,andTest usedonthe CC2540 and the I2C/extra I/O is not used on the CC2541. Compared to the CC2540, the APPLICATIONS CC2541 provides lower RF current consumption. The CC2541 does not have the USB interface of the • 2.4-GHzBluetoothlowenergySystems CC2540, and provides lower maximum output power • Proprietary2.4-GHzSystems in TX mode. The CC2541 also adds a HW I2C interface. • Human-InterfaceDevices(Keyboard,Mouse, RemoteControl) The CC2541 is pin-compatible with the CC2533 • SportsandLeisureEquipment RF4CE-optimizedIEEE802.15.4SoC. • MobilePhoneAccessories The CC2541 comes in two different versions: CC2541F128/F256, with 128 KB and 256 KB of flash • ConsumerElectronics memory,respectively. FortheCC2541blockdiagram,seeFigure1. 2 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. ON-CHIPVOLTAGE VDD(2 V–3.6 V) REGULATOR DCOUPL RESET_N RESET WATCHDOG TIMER POWER-ON RESET XOSC_Q2 32-MHZ BROWN OUT XOSC_Q1 CRYSTALOSC CLOCK MUXand s u CALIBRATION b SLEEPTIMER P2_4 32.768-kHz R CRYSTALOSC SF P2_3 P2_2 DEBUG HIGH SPEED 32-kHz POWER MGT.CONTROLLER P2_1 INTERFACE RC-OSC RC-OSC P2_0 PDATA P1_7 RAM SRAM 8051CPU XRAM P1_6 P1_5 CORE IRAM MEMORY ARBITRATOR P1_4 SFR FLASH FLASH P1_3 P1_2 DMA UNIFIED P1_1 P1_0 IRQ FLASH CTRL CTRL P0_7 P0_6 ANALOG COMPARATOR FIFOCTRL 1-KB SRAM P0_5 ER OP- er P0_4 L bit L AES Ar RADIO P0_3 O ENCRYPTION o REGISTERS PP00__21 NTR DSADC DECRaYnPdTION Radi Link Layer Engine O AUDIO/DC P0_0 C O I/ H T DEMODULATOR N MODULATOR Y s S u SDA I2C Rb F SCL S USART0 USART1 RECEIVE ENCYSIZER TRANSMIT UE QH TIMER1 (16-Bit) FRESYNT TIMER2 (BLELLTIMER) TIMER3(8-bit) RF_PRF_N TIMER4(8-bit) DIGITAL ANALOG MIXED Figure1. BlockDiagram Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com ABSOLUTE MAXIMUM RATINGS(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT Supplyvoltage Allsupplypinsmusthavethesamevoltage –0.3 3.9 V Voltageonanydigitalpin –0.3 VDD+0.3≤3.9 V InputRFlevel 10 dBm Storagetemperaturerange –40 125 °C Allpins,excludingpins25and26,accordingtohuman-body 2 kV model,JEDECSTD22,methodA114 ESD(2) Allpins,accordingtohuman-bodymodel,JEDECSTD22, 1 kV methodA114 Accordingtocharged-devicemodel,JEDECSTD22,method 500 V C101 (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) CAUTION:ESDsesnsitivedevice.Precautionsshouldbeusedwhenhandlingthedeviceinordertopreventpermanentdamage. RECOMMENDED OPERATING CONDITIONS overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN NOM MAX UNIT Operatingambienttemperaturerange,T –40 85 °C A Operatingsupplyvoltage 2 3.6 V ELECTRICAL CHARACTERISTICS MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°CandVDD=3V, A 1Mbps,GFSK,250-kHzdeviation,Bluetoothlowenergymode,and0.1%BER PARAMETER TESTCONDITIONS MIN TYP MAX UNIT RXmode,standardmode,noperipheralsactive,lowMCU 17.9 activity RXmode,high-gainmode,noperipheralsactive,lowMCU 20.2 activity mA TXmode,–20dBmoutputpower,noperipheralsactive,low 16.8 MCUactivity TXmode,0dBmoutputpower,noperipheralsactive,low 18.2 MCUactivity I Corecurrentconsumption Powermode1.Digitalregulatoron;16-MHzRCOSCand32- core MHzcrystaloscillatoroff;32.768-kHzXOSC,POR,BODand 270 sleeptimeractive;RAMandregisterretention Powermode2.Digitalregulatoroff;16-MHzRCOSCand32- µA MHzcrystaloscillatoroff;32.768-kHzXOSC,POR,andsleep 1 timeractive;RAMandregisterretention Powermode3.Digitalregulatoroff;noclocks;PORactive; 0.5 RAMandregisterretention LowMCUactivity:32-MHzXOSCrunning.Noradioor 6.7 mA peripherals.Limitedflashaccess,noRAMaccess. Timer1.Timerrunning,32-MHzXOSCused 90 Timer2.Timerrunning,32-MHzXOSCused 90 Peripheralcurrentconsumption Timer3.Timerrunning,32-MHzXOSCused 60 μA I (AddstocorecurrentI foreach peri core peripheralunitactivated) Timer4.Timerrunning,32-MHzXOSCused 70 Sleeptimer,including32.753-kHzRCOSC 0.6 ADC,whenconverting 1.2 mA 4 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 GENERAL CHARACTERISTICS MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°CandVDD=3V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT WAKE-UPANDTIMING Digitalregulatoron,16-MHzRCOSCand32-MHzcrystal Powermode1→Active 4 μs oscillatoroff.Start-upof16-MHzRCOSC Digitalregulatoroff,16-MHzRCOSCand32-MHzcrystal Powermode2or3→Active 120 μs oscillatoroff.Start-upofregulatorand16-MHzRCOSC CrystalESR=16Ω.Initiallyrunningon16-MHzRCOSC, 500 μs Active→TXorRX with32-MHzXOSCOFF With32-MHzXOSCinitiallyon 180 μs Proprietaryautomode 130 RX/TXturnaround μs BLEmode 150 RADIOPART RFfrequencyrange Programmablein1-MHzsteps 2379 2496 MHz 2Mbps,GFSK,500-kHzdeviation 2Mbps,GFSK,320-kHzdeviation 1Mbps,GFSK,250-kHzdeviation Datarateandmodulationformat 1Mbps,GFSK,160-kHzdeviation 500kbps,MSK 250kbps,GFSK,160-kHzdeviation 250kbps,MSK RF RECEIVE SECTION MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°C,VDD=3V,f =2440MHz A c PARAMETER TESTCONDITIONS MIN TYP MAX UNIT 2Mbps,GFSK,500-kHzDeviation,0.1%BER Receiversensitivity –90 dBm Saturation BER<0.1% –1 dBm Co-channelrejection Wantedsignalat–67dBm –9 dB ±2MHzoffset,0.1%BER,wantedsignal–67dBm –2 In-bandblockingrejection ±4MHzoffset,0.1%BER,wantedsignal–67dBm 36 dB ±6MHzorgreateroffset,0.1%BER,wantedsignal–67dBm 41 Frequencyerrortolerance(1) Includingbothinitialtoleranceanddrift.Sensitivitybetterthan–67dBm, –300 300 kHz 250bytepayload.BER0.1% Symbolrateerror Maximumpacketlength.Sensitivitybetterthan–67dBm,250byte tolerance(2) payload.BER0.1% –120 120 ppm 2Mbps,GFSK,320-kHzDeviation,0.1%BER Receiversensitivity –86 dBm Saturation BER<0.1% –7 dBm Co-channelrejection Wantedsignalat–67dBm –12 dB ±2MHzoffset,0.1%BER,wantedsignal–67dBm –1 In-bandblockingrejection ±4MHzoffset,0.1%BER,wantedsignal–67dBm 34 dB ±6MHzorgreateroffset,0.1%BER,wantedsignal–67dBm 39 Frequencyerrortolerance(1) Includingbothinitialtoleranceanddrift.Sensitivitybetterthan–67dBm, –300 300 kHz 250bytepayload.BER0.1% Symbolrateerror Maximumpacketlength.Sensitivitybetterthan–67dBm,250byte tolerance(2) payload.BER0.1% –120 120 ppm (1) DifferencebetweencenterfrequencyofthereceivedRFsignalandlocaloscillatorfrequency (2) Differencebetweenincomingsymbolrateandtheinternallygeneratedsymbolrate Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com RF RECEIVE SECTION (continued) MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°C,VDD=3V,f =2440MHz A c PARAMETER TESTCONDITIONS MIN TYP MAX UNIT 1Mbps,GFSK,250-kHzDeviation,BluetoothlowenergyMode,0.1%BER High-gainmode –94 Receiversensitivity(3)(4) dBm Standardmode –88 Saturation(4) BER<0.1% 5 dBm Co-channelrejection(4) Wantedsignal–67dBm –6 dB ±1MHzoffset,0.1%BER,wantedsignal–67dBm –2 ±2MHzoffset,0.1%BER,wantedsignal–67dBm 26 In-bandblockingrejection(4) dB ±3MHzoffset,0.1%BER,wantedsignal–67dBm 34 >6MHzoffset,0.1%BER,wantedsignal–67dBm 33 Minimuminterfererlevel<2GHz(Wantedsignal–67dBm) –21 Out-of-bandblocking rejection(4) Minimuminterfererlevel[2GHz,3GHz](Wantedsignal–67dBm) –25 dBm Minimuminterfererlevel>3GHz(Wantedsignal–67dBm) –7 Intermodulation(4) Minimuminterfererlevel –36 dBm Frequencyerrortolerance(5) Includingbothinitialtoleranceanddrift.Sensitivitybetterthan-67dBm, –250 250 kHz 250bytepayload.BER0.1% Symbolrateerror Maximumpacketlength.Sensitivitybetterthan–67dBm,250byte tolerance(6) payload.BER0.1% –80 80 ppm 1Mbps,GFSK,160-kHzDeviation,0.1%BER Receiversensitivity(7) –91 dBm Saturation BER<0.1% 0 dBm Co-channelrejection Wantedsignal10dBabovesensitivitylevel –9 dB ±1-MHzoffset,0.1%BER,wantedsignal–67dBm 2 ±2-MHzoffset,0.1%BER,wantedsignal–67dBm 24 In-bandblockingrejection dB ±3-MHzoffset,0.1%BER,wantedsignal-–67dBm 27 >6-MHzoffset,0.1%BER,wantedsignal–67dBm 32 Frequencyerrortolerance(5) Includingbothinitialtoleranceanddrift.Sensitivitybetterthan–67dBm, –200 200 kHz 250-bytepayload.BER0.1% Symbolrateerror Maximumpacketlength.Sensitivitybetterthan–67dBm,250-byte tolerance(6) payload.BER0.1% –80 80 ppm 500kbps,MSK,0.1%BER Receiversensitivity(7) –99 dBm Saturation BER<0.1% 0 dBm Co-channelrejection Wantedsignal–67dBm –5 dB ±1-MHzoffset,0.1%BER,wantedsignal–67dBm 20 In-bandblockingrejection ±2-MHzoffset,0.1%BER,wantedsignal–67dBm 27 dB >2-MHzoffset,0.1%BER,wantedsignal–67dBm 28 Includingbothinitialtoleranceanddrift.Sensitivitybetterthan–67dBm, Frequencyerrortolerance –150 150 kHz 250-bytepayload.BER0.1% Maximumpacketlength.Sensitivitybetterthan–67dBm,250-byte Symbolrateerrortolerance –80 80 ppm payload.BER0.1% (3) ThereceiversensitivitysettingisprogrammableusingaTIBLEstackvendor-specificAPIcommand.Thedefaultvalueisstandard mode. (4) Resultsbasedonstandard-gainmode. (5) DifferencebetweencenterfrequencyofthereceivedRFsignalandlocaloscillatorfrequency (6) Differencebetweenincomingsymbolrateandtheinternallygeneratedsymbolrate (7) Resultsbasedonhigh-gainmode. 6 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 RF RECEIVE SECTION (continued) MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°C,VDD=3V,f =2440MHz A c PARAMETER TESTCONDITIONS MIN TYP MAX UNIT 250kbps,GFSK,160kHzDeviation,0.1%BER Receiversensitivity (8) –98 dBm Saturation BER<0.1% 0 dBm Co-channelrejection Wantedsignal-67dBm –3 dB ±1-MHzoffset,0.1%BER,wantedsignal–67dBm 23 In-bandblockingrejection ±2-MHzoffset,0.1%BER,wantedsignal–67dBm 28 dB >2-MHzoffset,0.1%BER,wantedsignal–67dBm 29 Frequencyerrortolerance(9) Includingbothinitialtoleranceanddrift.Sensitivitybetterthan–67dBm, –150 150 kHz 250-bytepayload.BER0.1% Symbolrateerror Maximumpacketlength.Sensitivitybetterthan–67dBm,250-byte tolerance(10) payload.BER0.1% –80 80 ppm 250kbps,MSK,0.1%BER Receiversensitivity (11) –99 dBm Saturation BER<0.1% 0 dBm Co-channelrejection Wantedsignal-67dBm –5 dB ±1-MHzoffset,0.1%BER,wantedsignal–67dBm 20 In-bandblockingrejection ±2-MHzoffset,0.1%BER,wantedsignal–67dBm 29 dB >2-MHzoffset,0.1%BER,wantedsignal–67dBm 30 Includingbothinitialtoleranceanddrift.Sensitivitybetterthan–67dBm, Frequencyerrortolerance –150 150 kHz 250-bytepayload.BER0.1% Maximumpacketlength.Sensitivitybetterthan–67dBm,250-byte Symbolrateerrortolerance –80 80 ppm payload.BER0.1% ALLRATES/FORMATS SpuriousemissioninRX. f<1GHz –67 dBm Conductedmeasurement SpuriousemissioninRX. f>1GHz –57 dBm Conductedmeasurement (8) Resultsbasedonstandard-gainmode. (9) DifferencebetweencenterfrequencyofthereceivedRFsignalandlocaloscillatorfrequency (10) Differencebetweenincomingsymbolrateandtheinternallygeneratedsymbolrate (11) Resultsbasedonhigh-gainmode. Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com RF TRANSMIT SECTION MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°C,VDD=3Vandf =2440MHz A c PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Deliveredtoasingle-ended50-Ωloadthroughabalunusing 0 maximumrecommendedoutputpowersetting Outputpower dBm Deliveredtoasingle-ended50-Ωloadthroughabalunusing –23 minimumrecommendedoutputpowersetting Programmableoutputpower Deliveredtoasingle-ended50-Ωloadthroughabalunusing 23 dB range minimumrecommendedoutputpowersetting f<1GHz –52 dBm Spuriousemissionconducted f>1GHz –48 dBm measurement Suitableforsystemstargetingcompliancewithworldwideradio-frequencyregulationsETSIEN300328and EN300440Class2(Europe),FCCCFR47Part15(US),andARIBSTD-T66(Japan) DifferentialimpedanceasseenfromtheRFport(RF_PandRF_N) Optimumloadimpedance 70+j30 Ω towardtheantenna Designs with antenna connectors that require conducted ETSI compliance at 64 MHz should insert an LC resonator in front of the antenna connector. Use a 1.6-nH inductor in parallel with a 1.8-pF capacitor. Connect bothfromthesignaltracetoagoodRFground. CURRENT CONSUMPTION WITH TPS62730 MeasuredonTexasInstrumentsCC2541TPA62730EMreferencedesignwithT =25°C,VDD=3Vandf =2440MHz, A c 1Mbsp,GFSK,250-kHzdeviation,Bluetooth™lowenergyMode,1%BER(1) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT RXmode,standardmode,noperipheralsactive,lowMCUactivity,MCU 14.7 at1MHz RXmode,high-gainmode,noperipheralsactive,lowMCUactivity, 16.7 MCUat1MHz Currentconsumption mA TXmode,–20dBmoutputpower,noperipheralsactive,lowMCUactivity, 13.1 MCUat1MHz TXmode,0dBmoutputpower,noperipheralsactive,lowMCUactivity, 14.3 MCUat1MHz (1) 0.1%BERmapsto30.8%PER 32-MHz CRYSTAL OSCILLATOR MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°CandVDD=3V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Crystalfrequency 32 MHz Crystalfrequencyaccuracy requirement(1) –40 40 ppm ESR Equivalentseriesresistance 6 60 Ω C Crystalshuntcapacitance 1 7 pF 0 C Crystalloadcapacitance 10 16 pF L Start-uptime 0.25 ms Thecrystaloscillatormustbeinpowerdownforaguard timebeforeitisusedagain.Thisrequirementisvalidfor Power-downguardtime 3 ms allmodesofoperation.Theneedforpower-downguard timecanvarywithcrystaltypeandload. (1) Includingagingandtemperaturedependency,asspecifiedby[1] 8 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 32.768-kHz CRYSTAL OSCILLATOR MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°CandVDD=3V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Crystalfrequency 32.768 kHz Crystalfrequencyaccuracyrequirement(1) –40 40 ppm ESR Equivalentseriesresistance 40 130 kΩ C Crystalshuntcapacitance 0.9 2 pF 0 C Crystalloadcapacitance 12 16 pF L Start-uptime 0.4 s (1) Includingagingandtemperaturedependency,asspecifiedby[1] 32-kHz RC OSCILLATOR MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°CandVDD=3V. A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Calibratedfrequency(1) 32.753 kHz Frequencyaccuracyaftercalibration ±0.2% Temperaturecoefficient(2) 0.4 %/°C Supply-voltagecoefficient(3) 3 %/V Calibrationtime(4) 2 ms (1) Thecalibrated32-kHzRCoscillatorfrequencyisthe32-MHzXTALfrequencydividedby977. (2) Frequencydriftwhentemperaturechangesaftercalibration (3) Frequencydriftwhensupplyvoltagechangesaftercalibration (4) Whenthe32-kHzRCoscillatorisenabled,itiscalibratedwhenaswitchfromthe16-MHzRCoscillatortothe32-MHzcrystaloscillator isperformedwhileSLEEPCMD.OSC32K_CALDISissetto0. 16-MHz RC OSCILLATOR MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°CandVDD=3V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Frequency(1) 16 MHz Uncalibratedfrequencyaccuracy ±18% Calibratedfrequencyaccuracy ±0.6% Start-uptime 10 μs Initialcalibrationtime(2) 50 μs (1) Thecalibrated16-MHzRCoscillatorfrequencyisthe32-MHzXTALfrequencydividedby2. (2) Whenthe16-MHzRCoscillatorisenabled,itiscalibratedwhenaswitchfromthe16-MHzRCoscillatortothe32-MHzcrystaloscillator isperformedwhileSLEEPCMD.OSC_PDissetto0. Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com RSSI CHARACTERISTICS MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°CandVDD=3V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT 2Mbps,GFSK,320-kHzDeviation,0.1%BERand2Mbps,GFSK,500-kHzDeviation,0.1%BER ReducedgainbyAGCalgorithm 64 UsefulRSSIrange(1) dB HighgainbyAGCalgorithm 64 ReducedgainbyAGCalgorithm 79 RSSIoffset(1) dBm HighgainbyAGCalgorithm 99 Absoluteuncalibratedaccuracy(1) ±6 dB Stepsize(LSBvalue) 1 dB AllOtherRates/Formats Standardmode 64 UsefulRSSIrange(1) dB High-gainmode 64 Standardmode 98 RSSIoffset(1) dBm High-gainmode 107 Absoluteuncalibratedaccuracy(1) ±3 dB Stepsize(LSBvalue) 1 dB (1) AssumingCC2541EMreferencedesign.OtherRFdesignsgiveanoffsetfromthereportedvalue. FREQUENCY SYNTHESIZER CHARACTERISTICS MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°C,VDD=3Vandf =2440MHz A c PARAMETER TESTCONDITIONS MIN TYP MAX UNIT At±1-MHzoffsetfromcarrier –109 Phasenoise,unmodulatedcarrier At±3-MHzoffsetfromcarrier –112 dBc/Hz At±5-MHzoffsetfromcarrier –119 ANALOG TEMPERATURE SENSOR MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°CandVDD=3V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Output 1480 12-bit Temperaturecoefficient 4.5 /1°C Voltagecoefficient MeasuredusingintegratedADC,internalband-gapvoltage 1 0.1V Initialaccuracywithoutcalibration reference,andmaximumresolution ±10 °C Accuracyusing1-pointcalibration ±5 °C Currentconsumptionwhenenabled 0.5 mA COMPARATOR CHARACTERISTICS T =25°C,VDD=3V.AllmeasurementresultsareobtainedusingtheCC2541referencedesigns,post-calibration. A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Common-modemaximumvoltage VDD V Common-modeminimumvoltage –0.3 Inputoffsetvoltage 1 mV Offsetvstemperature 16 µV/°C Offsetvsoperatingvoltage 4 mV/V Supplycurrent 230 nA Hysteresis 0.15 mV 10 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 ADC CHARACTERISTICS T =25°CandVDD=3V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Inputvoltage VDDisvoltageonAVDD5pin 0 VDD V Externalreferencevoltage VDDisvoltageonAVDD5pin 0 VDD V Externalreferencevoltagedifferential VDDisvoltageonAVDD5pin 0 VDD V Inputresistance,signal Simulatedusing4-MHzclockspeed 197 kΩ Full-scalesignal(1) Peak-to-peak,defines0dBFS 2.97 V Single-endedinput,7-bitsetting 5.7 Single-endedinput,9-bitsetting 7.5 Single-endedinput,10-bitsetting 9.3 Single-endedinput,12-bitsetting 10.3 Differentialinput,7-bitsetting 6.5 ENOB(1) Effectivenumberofbits bits Differentialinput,9-bitsetting 8.3 Differentialinput,10-bitsetting 10 Differentialinput,12-bitsetting 11.5 10-bitsetting,clockedbyRCOSC 9.7 12-bitsetting,clockedbyRCOSC 10.9 Usefulpowerbandwidth 7-bitsetting,bothsingleanddifferential 0–20 kHz Singleendedinput,12-bitsetting,–6dBFS(1) –75.2 THD Totalharmonicdistortion dB Differentialinput,12-bitsetting,–6dBFS(1) –86.6 Single-endedinput,12-bitsetting(1) 70.2 Differentialinput,12-bitsetting(1) 79.3 Signaltononharmonicratio dB Single-endedinput,12-bitsetting,–6dBFS(1) 78.8 Differentialinput,12-bitsetting,–6dBFS(1) 88.9 Differentialinput,12-bitsetting,1-kHzsine CMRR Common-moderejectionratio >84 dB (0dBFS),limitedbyADCresolution Singleendedinput,12-bitsetting,1-kHzsine Crosstalk >84 dB (0dBFS),limitedbyADCresolution Offset Midscale –3 mV Gainerror 0.68% 12-bitsetting,mean(1) 0.05 DNL Differentialnonlinearity LSB 12-bitsetting,maximum(1) 0.9 12-bitsetting,mean(1) 4.6 12-bitsetting,maximum(1) 13.3 INL Integralnonlinearity LSB 12-bitsetting,mean,clockedbyRCOSC 10 12-bitsetting,max,clockedbyRCOSC 29 Singleendedinput,7-bitsetting(1) 35.4 Singleendedinput,9-bitsetting(1) 46.8 Singleendedinput,10-bitsetting(1) 57.5 SINAD Singleendedinput,12-bitsetting(1) 66.6 Signal-to-noise-and-distortion dB (–THD+N) Differentialinput,7-bitsetting(1) 40.7 Differentialinput,9-bitsetting(1) 51.6 Differentialinput,10-bitsetting(1) 61.8 Differentialinput,12-bitsetting(1) 70.8 7-bitsetting 20 9-bitsetting 36 Conversiontime μs 10-bitsetting 68 12-bitsetting 132 (1) Measuredwith300-Hzsine-waveinputandVDDasreference. Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com ADC CHARACTERISTICS (continued) T =25°CandVDD=3V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Powerconsumption 1.2 mA InternalreferenceVDDcoefficient 4 mV/V Internalreferencetemperature 0.4 mV/10°C coefficient Internalreferencevoltage 1.24 V CONTROL INPUT AC CHARACTERISTICS T =–40°Cto85°C,VDD=2Vto3.6V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Theundividedsystemclockis32MHzwhencrystaloscillatorisused. Systemclock,f SYSCLK Theundividedsystemclockis16MHzwhencalibrated16-MHzRC 16 32 MHz t =1/f SYSCLK SYSCLK oscillatorisused. Seeitem1,Figure2.Thisistheshortestpulsethatisrecognizedas acompleteresetpinrequest.Notethatshorterpulsesmaybe RESET_Nlowduration 1 µs recognizedbutdonotleadtocompleteresetofallmoduleswithinthe chip. Seeitem2,Figure2.Thisistheshortestpulsethatisrecognizedas Interruptpulseduration 20 ns aninterruptrequest. RESET_N 1 2 Px.n T0299-01 Figure2. ControlInputACCharacteristics 12 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 SPI AC CHARACTERISTICS T =–40°Cto85°C,VDD=2Vto3.6V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Master,RXandTX 250 t SCKperiod ns 1 Slave,RXandTX 250 SCKdutycycle Master 50% Master 63 t SSNlowtoSCK ns 2 Slave 63 Master 63 t SCKtoSSNhigh ns 3 Slave 63 t MOSIearlyout Master,load=10pF 7 ns 4 t MOSIlateout Master,load=10pF 10 ns 5 t MISOsetup Master 90 ns 6 t MISOhold Master 10 ns 7 SCKdutycycle Slave 50% ns t MOSIsetup Slave 35 ns 10 t MOSIhold Slave 10 ns 11 t MISOlateout Slave,load=10pF 95 ns 9 Master,TXonly 8 Master,RXandTX 4 Operatingfrequency MHz Slave,RXonly 8 Slave,RXandTX 4 SCK t t 2 3 SSN t t 4 5 MOSI D0 X D1 t t 6 7 MISO X D0 X T0478-01 Figure3. SPIMasterACCharacteristics Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com SCK t t 2 3 SSN t t 8 9 MISO D0 X D1 t t 10 11 MOSI X D0 X T0479-01 Figure4. SPISlaveACCharacteristics DEBUG INTERFACE AC CHARACTERISTICS T =–40°Cto85°C,VDD=2Vto3.6V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT f Debugclockfrequency(seeFigure5) 12 MHz clk_dbg t Allowedhighpulseonclock(seeFigure5) 35 ns 1 t Allowedlowpulseonclock(seeFigure5) 35 ns 2 EXT_RESET_Nlowtofirstfallingedgeondebugclock(see t 167 ns 3 Figure7) t FallingedgeonclocktoEXT_RESET_Nhigh(seeFigure7) 83 ns 4 t EXT_RESET_Nhightofirstdebugcommand(seeFigure7) 83 ns 5 t Debugdatasetup(seeFigure6) 2 ns 6 t Debugdatahold(seeFigure6) 4 ns 7 t Clock-to-datadelay(seeFigure6) Load=10pF 30 ns 8 Time DEBUG_CLK P2_2 t t 1 2 1/f clk_dbg T0436-01 Figure5. DebugClock– BasicTiming 14 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 Time DEBUG_CLK P2_2 RESET_N t t t 3 4 5 T0437-01 Figure6. DebugEnableTiming Time DEBUG_CLK P2_2 DEBUG_DATA (to CC2541) P2_1 DEBUG_DATA (from CC2541) P2_1 t t t 6 7 8 Figure7. DataSetupandHoldTiming TIMER INPUTS AC CHARACTERISTICS T =–40°Cto85°C,VDD=2Vto3.6V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Synchronizersdeterminetheshortestinputpulsethatcanbe Inputcapturepulseduration recognized.Thesynchronizersoperateatthecurrentsystem 1.5 t SYSCLK clockrate(16MHzor32MHz). Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com DC CHARACTERISTICS T =25°C,VDD=3V A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Logic-0inputvoltage 0.5 V Logic-1inputvoltage 2.4 V Logic-0inputcurrent Inputequals0V –50 50 nA Logic-1inputcurrent InputequalsVDD –50 50 nA I/O-pinpullupandpulldownresistors 20 kΩ Logic-0outputvoltage,4-mApins Outputload4mA 0.5 V Logic-1outputvoltage,4-mApins Outputload4mA 2.5 V Logic-0outputvoltage,20-mApins Outputload20mA 0.5 V Logic-1outputvoltage,20-mApins Outputload20mA 2.5 V DEVICE INFORMATION PIN DESCRIPTIONS TheCC2541pinoutisshowninFigure8andashortdescriptionofthepinsfollows. CC2541 RHAPackage (Top View) 2 1 Q Q _ _ K K 2 2 3 3 C C S S COUPL VDD1 1_6 1_7 2_0 2_1 2_2 2_3 / O 2_4 / O VDD6 D D P P P P P P P A 40 39 38 37 36 35 34 33 32 31 GND 1 30 R_BIAS SCL 2 29 AVDD4 SDA 3 28 AVDD1 NC 4 27 AVDD2 P1_5 5 GND 26 RF_N P1_4 6 Ground Pad 25 RF_P P1_3 7 24 AVDD3 P1_2 8 23 XOSC_Q2 P1_1 9 22 XOSC_Q1 DVDD2 10 21 AVDD5 11 12 13 14 15 16 17 18 19 20 0 7 6 5 4 3 2 1 0 N P1_ P0_ P0_ P0_ P0_ P0_ P0_ P0_ P0_ ET_ S E R NOTE: Theexposedgroundpadmustbeconnectedtoasolidgroundplane,asthisisthegroundconnectionforthechip. Figure8. PinoutTopView 16 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 PINDESCRIPTIONS PINNAME PIN PINTYPE DESCRIPTION AVDD1 28 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection AVDD2 27 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection AVDD3 24 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection AVDD4 29 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection AVDD5 21 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection AVDD6 31 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection DCOUPL 40 Power(digital) 1.8-Vdigitalpower-supplydecoupling.Donotuseforsupplyingexternalcircuits. DVDD1 39 Power(digital) 2-V–3.6-Vdigitalpower-supplyconnection DVDD2 10 Power(digital) 2-V–3.6-Vdigitalpower-supplyconnection GND 1 Groundpin ConnecttoGND GND — Ground Thegroundpadmustbeconnectedtoasolidgroundplane. NC 4 Unusedpins Notconnected P0_0 19 DigitalI/O Port0.0 P0_1 18 DigitalI/O Port0.1 P0_2 17 DigitalI/O Port0.2 P0_3 16 DigitalI/O Port0.3 P0_4 15 DigitalI/O Port0.4 P0_5 14 DigitalI/O Port0.5 P0_6 13 DigitalI/O Port0.6 P0_7 12 DigitalI/O Port0.7 P1_0 11 DigitalI/O Port1.0–20-mAdrivecapability P1_1 9 DigitalI/O Port1.1–20-mAdrivecapability P1_2 8 DigitalI/O Port1.2 P1_3 7 DigitalI/O Port1.3 P1_4 6 DigitalI/O Port1.4 P1_5 5 DigitalI/O Port1.5 P1_6 38 DigitalI/O Port1.6 P1_7 37 DigitalI/O Port1.7 P2_0 36 DigitalI/O Port2.0 P2_1/DD 35 DigitalI/O Port2.1/debugdata P2_2/DC 34 DigitalI/O Port2.2/debugclock P2_3/ 33 DigitalI/O,AnalogI/O Port2.3/32.768kHzXOSC OSC32K_Q2 P2_4/ 32 DigitalI/O,AnalogI/O Port2.4/32.768kHzXOSC OSC32K_Q1 RBIAS 30 AnalogI/O Externalprecisionbiasresistorforreferencecurrent RESET_N 20 Digitalinput Reset,active-low RF_N 26 RFI/O NegativeRFinputsignaltoLNAduringRX NegativeRFoutputsignalfromPAduringTX RF_P 25 RFI/O PositiveRFinputsignaltoLNAduringRX PositiveRFoutputsignalfromPAduringTX SCL 2 I2CclockordigitalI/O CanbeusedasI2CclockpinordigitalI/O.Leavefloatingifnotused.Ifgrounded disablepullup SDA 3 I2CclockordigitalI/O CanbeusedasI2CdatapinordigitalI/O.Leavefloatingifnotused.Ifgrounded disablepullup XOSC_Q1 22 AnalogI/O 32-MHzcrystaloscillatorpin1orexternalclockinput XOSC_Q2 23 AnalogI/O 32-MHzcrystaloscillatorpin2 Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com BLOCK DIAGRAM A block diagram of the CC2541 is shown in Figure 9. The modules can be roughly divided into one of three categories: CPU-related modules; modules related to power, test, and clock distribution; and radio-related modules.Inthefollowingsubsections,ashortdescriptionofeachmoduleisgiven. ON-CHIPVOLTAGE VDD(2 V–3.6 V) REGULATOR DCOUPL RESET_N RESET WATCHDOG TIMER POWER-ON RESET XOSC_Q2 32-MHZ BROWN OUT XOSC_Q1 CRYSTALOSC CLOCK MUXand s u CALIBRATION b SLEEPTIMER P2_4 32.768-kHz R CRYSTALOSC SF P2_3 P2_2 DEBUG HIGH SPEED 32-kHz POWER MGT.CONTROLLER P2_1 INTERFACE RC-OSC RC-OSC P2_0 PDATA P1_7 RAM SRAM 8051CPU XRAM P1_6 P1_5 CORE IRAM MEMORY ARBITRATOR P1_4 SFR FLASH FLASH P1_3 P1_2 DMA UNIFIED P1_1 P1_0 IRQ FLASH CTRL CTRL P0_7 P0_6 ANALOG COMPARATOR FIFOCTRL 1-KB SRAM P0_5 ER OP- er P0_4 L bit L AES Ar RADIO P0_3 O ENCRYPTION o REGISTERS PP00__21 NTR DSADC DECRaYnPdTION Radi Link Layer Engine O AUDIO/DC P0_0 C O I/ H T DEMODULATOR N MODULATOR Y s S u SDA I2C Rb F SCL S USART0 USART1 RECEIVE ENCYSIZER TRANSMIT UE QH TIMER1 (16-Bit) FRESYNT TIMER2 (BLELLTIMER) TIMER3(8-bit) RF_PRF_N TIMER4(8-bit) DIGITAL ANALOG MIXED Figure9. CC2541BlockDiagram 18 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 BLOCK DESCRIPTIONS A block diagram of the CC2541 is shown in Figure 9. The modules can be roughly divided into one of three categories: CPU-related modules; modules related to power, test, and clock distribution; and radio-related modules.Inthefollowingsubsections,ashortdescriptionofeachmoduleisgiven. CPUandMemory The 8051 CPU core is a single-cycle 8051-compatible core. It has three different memory access busses (SFR, DATA,andCODE/XDATA),adebuginterface,andan18-inputextendedinterruptunit. The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical memories and all peripherals through the SFR bus. The memory arbiter has four memory-access points, access of which can map to one of three physical memories: an SRAM, flash memory, and XREG/SFR registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same physicalmemory. The SFR bus is drawn conceptually in Figure 9 as a common bus that connects all hardware peripherals to the memory arbiter. The SFR bus in the block diagram also provides access to the radio registers in the radio registerbank,eventhoughtheseareindeedmappedintoXDATAmemoryspace. The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power mode 2 and mode3). The 128/256 KB flash block provides in-circuit programmable non-volatile program memory for the device, and mapsintotheCODEandXDATAmemoryspaces. Peripherals Writing to the flash block is performed through a flash controller that allows page-wise erasure and 4-bytewise programming.SeeUserGuidefordetailsontheflashcontroller. A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors that can be located anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface, etc.) can be used with the DMA controller for efficient operation by performing data transfers betweenasingleSFRorXREGaddressandflash/SRAM. Each CC2541 contains a unique 48-bit IEEE address that can be used as the public device address for a Bluetooth device. Designers are free to use this address, or provide their own, as described in the Bluetooth specfication. The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which is associated with one of four interrupt priorities. I/O and sleep timer interrupt requests are serviced even if the deviceisinasleepmode(powermodes1and2)bybringingtheCC2541backtotheactivemode. The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging. Through this debug interface, it is possible to erase or program the entire flash memory, control which oscillators are enabled, stop and start execution of the user program, execute instructions on the 8051 core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possible to perform in- circuitdebuggingandexternalflashprogrammingelegantly. The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral modulescontrolcertainpinsorwhethertheyareundersoftwarecontrol,andifso,whethereachpinisconfigured as an input or output and if a pullup or pulldown resistor in the pad is connected. Each peripheral that connects totheI/OpinscanchoosebetweentwodifferentI/Opinlocationstoensureflexibilityinvariousapplications. The sleep timer is an ultralow-power timer that can either use an external 32.768-kHz crystal oscillator or an internal 32.753-kHz RC oscillator. The sleep timer runs continuously in all operating modes except power mode 3. Typical applications of this timer are as a real-time counter or as a wake-up timer to get out of power mode 1 ormode2. A built-in watchdog timer allows the CC2541 to reset itself if the firmware hangs. When enabled by software, thewatchdogtimermustbeclearedperiodically;otherwise,itresetsthedevicewhenittimesout. Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It can also be configured in IR generation mode, where it counts timer 3 periods and the output is ANDed with the outputoftimer3togeneratemodulatedconsumerIRsignalswithminimalCPUinteraction. Timer 2 is a 40-bit timer. It has a 16-bit counter with a configurable timer period and a 24-bit overflow counter that can be used to keep track of the number of periods that have transpired. A 40-bit capture register is also usedtorecordtheexacttimeatwhichastart-of-framedelimiterisreceived/transmittedortheexacttimeatwhich transmission ends. There are two 16-bit output compare registers and two 24-bit overflow compare registers that canbeusedtogiveexacttimingforstartofRXorTXtotheradioorgeneralinterrupts. Timer3andtimer4are8-bittimerswithtimer/counter/PWMfunctionality.Theyhaveaprogrammableprescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of the counter channelscanbeusedasPWMoutput. USART 0 and USART 1 are each configurable as either an SPI master/slave or a UART. They provide double buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex applications. Each USART has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other uses. When configured as SPI slaves, the USARTs sample the input signal using SCK directly instead ofusingsomeoversamplingscheme,andarethuswell-suitedforhighdatarates. The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with 128-bit keys. The AES core also supports ECB, CBC, CFB, OFB, CTR, and CBC-MAC, as well as hardware supportforCCM. The ADC supports 7 to 12 bits of resolution with a corresponding range of bandwidths from 30-kHz to 4-kHz, respectively. DC and audio conversions with up to eight input channels (I/O controller pins) are possible. The inputs can be selected as single-ended or differential. The reference voltage can be internal, AVDD, or a single- ended or differential external signal. The ADC also has a temperature-sensor input channel. The ADC can automatetheprocessofperiodicsamplingorconversionoverasequenceofchannels. The I2C module provides a digital peripheral connection with two pins and supports both master and slave operation. I2C support is compliant with the NXP I2C specification version 2.1 and supports standard mode (up to 100 kbps) and fast mode (up to 400 kbps). In addition, 7-bit device addressing modes are supported, as well as masterandslavemodes. The ultralow-power analog comparator enables applications to wake up from PM2 or PM3 based on an analog signal. Both inputs are brought out to pins; the reference voltage must be provided externally. The comparator output is connected to the I/O controller interrupt detector and can be treated by the MCU as a regular I/O pin interrupt. 20 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 TYPICAL CHARACTERISTICS RXCURRENT TXCURRENT vs vs TEMPERATURE TEMPERATURE 19 19.5 1 Mbps GFSK 250 kHz TX Power Setting = 0 dBm Standard Gain Setting VCC = 3 V 18.5 Input = −70 dBm 19 VCC = 3 V mA) 18 mA) 18.5 nt ( nt ( e e urr 17.5 urr 18 C C 17 17.5 16.5 17 −40 −20 0 20 40 60 80 −40 −20 0 20 40 60 80 Temperature (°C) Temperature (°C) G001 G002 Figure10. Figure11. RXSENSITIVITY TXPOWER vs vs TEMPERATURE TEMPERATURE −84 4.0 1 Mbps GFSK 250 kHz TX Power Setting = 0 dBm Standard Gain Setting VCC = 3 V VCC = 3 V −86 2.0 m) m) B B d d el ( −88 el ( 0.0 v v e e L L −90 −2.0 −92 −4.0 −40 −20 0 20 40 60 80 −40 −20 0 20 40 60 80 Temperature (°C) Temperature (°C) G003 G004 Figure12. Figure13. RXCURRENT TXCURRENT vs vs SUPPLYVOLTAGE SUPPLYVOLTAGE 20 20 1 Mbps GFSK 250 kHz TX Power Setting = 0 dBm 19.5 Standard Gain Setting 19.5 TA = 25°C Input = −70 dBm 19 TA = 25°C 19 A) 18.5 A) 18.5 m m nt ( 18 nt ( 18 e e Curr 17.5 Curr 17.5 17 17 16.5 16.5 16 16 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Voltage (V) Voltage (V) G005 G006 Figure14. Figure15. Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com TYPICAL CHARACTERISTICS (continued) RXSENSITIVITY TXPOWER vs vs SUPPLYVOLTAGE SUPPLYVOLTAGE −84 4 1 Mbps GFSK 250 kHz TX Power Setting = 0 dBm Standard Gain Setting TA = 25°C TA = 25°C −86 2 m) m) B B d d el ( −88 el ( 0 v v e e L L −90 −2 −92 −4 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Voltage (V) Voltage (V) G007 G008 Figure16. Figure17. RXSENSITIVITY TXPOWER vs vs FREQUENCY FREQUENCY −84 4 1 Mbps GFSK 250 kHz TX Power Setting = 0 dBm Standard Gain Setting TA = 25°C TA = 25°C VCC = 3 V −86 VCC = 3 V 2 m) m) B B d d el ( −88 el ( 0 v v e e L L −90 −2 −92 −4 2400 2410 2420 2430 2440 2450 2460 2470 2480 2400 2410 2420 2430 2440 2450 2460 2470 2480 Frequency (MHz) Frequency (MHz) G009 G010 Figure18. Figure19. Table1. OutputPower(1)(2) TXPOWERSetting TypicalOutputPower(dBm) 0xE1 0 0xD1 –2 0xC1 –4 0xB1 –6 0xA1 –8 0x91 –10 0x81 –12 0x71 –14 0x61 –16 0x51 –18 0x41 –20 0x31 –23 (1) MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°C,VDD=3Vandf =2440MHz.SeeSWRU191for A c recommendedregistersettings. (2) 1Mbsp,GFSK,250-kHzdeviation,Bluetooth™lowenergymode,1%BER 22 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 Table2.OutputPowerandCurrentConsumption TypicalCurrentConsumption TypicalCurrentConsumption TypicalOutputPower(dBm) (mA)(1) WithTPS62730(mA)(2) 0 18.2 14.3 –20 16.8 13.1 (1) MeasuredonTexasInstrumentsCC2541EMreferencedesignwithT =25°C,VDD=3Vandf = A c 2440MHz.SeeSWRU191forrecommendedregistersettings. (2) MeasuredonTexasInstrumentsCC2541TPS62730EMreferencedesignwithT =25°C,VDD=3V A andf =2440MHz.SeeSWRU191forrecommendedregistersettings. c TYPICAL CURRENT SAVINGS WHEN USING TPS62730 Current Consumption TX 0 dBm Current Consumption RX SG 0 CLKCONMOD 0xBF 25 40 25 40 DC/DC OFF DC/DC OFF DC/DC ON 35 DC/DC ON 35 20 Current Savings 20 Current Savings 30 30 %) %) mA) 15 25 ngs ( mA) 15 25 ngs ( nt ( 20 avi nt ( 20 avi e S e S Curr 10 15 urrent Curr 10 15 urrent C C 10 10 5 5 5 5 0 0 0 0 2.1 2.4 2.7 3 3.3 3.6 2.1 2.4 2.7 3 3.3 3.6 Supply (V) Supply (V) Figure20.CurrentSavingsinTXatRoom Figure21.CurrentSavingsinRXatRoom Temperature Temperature The application note (SWRA365) has information regarding the CC2541 and TPS62730 combo board and the currentsavingsthatcanbeachievedusingthecomboboard. Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 23 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com APPLICATION INFORMATION Few external components are required for the operation of the CC2541. A typical application circuit is shown in Figure22. 32-kHzCrystal(1) C331 2-V to 3.6-V Power Supply C401 2 L A T X C321 40 39 38 37 36 35 34 33 32 31 1 GND DCOUPL DVDD1 P1_6 P1_7 P2_0 P2_1 P2_2 OSC32K_Q2 OSC32K_Q1 AVDD6 RBIAS 30 R301 2 SCL P2_3/X P2_4/X AAVVDDDD41 2289 A(n5t0enWn)a 3 SDA AVDD2 27 4 NC RF_N 26 5 P1_5 CC2541 RF_P 25 6 P1_4 DIEATTACHPAD AVDD3 24 7 P1_3 XOSC_Q2 23 8 P1_2 XOSC_Q1 22 9 P1_1 N AVDD5 21 10 DVDD2 _ T 1_0 0_7 0_6 0_5 0_4 0_3 0_2 0_1 0_0 ESE P P P P P P P P P R 11 12 13 14 15 16 17 18 19 20 XTAL1 Power Supply Decoupling Capacitors are Not Shown C221 C231 Digital I/O Not Connected (1)32-kHzcrystalismandatorywhenrunningtheBLEprotocolstackinlow-powermodes,exceptifthelinklayerisin thestandbystate(Vol.6PartBSection1.1in[1]). NOTE:Differentantennaalternativeswillbeprovidedasreferencedesigns. Figure22. CC2541ApplicationCircuit Table3.OverviewofExternalComponents(ExcludingSupplyDecouplingCapacitors) Component Description Value C401 Decouplingcapacitorfortheinternal1.8-Vdigitalvoltageregulator 1µF R301 Precisionresistor±1%,usedforinternalbiasing 56kΩ Input/Output Matching When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. See reference design, CC2541EM, forrecommendedbalun. 24 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

CC2541 www.ti.com SWRS110D–JANUARY2012–REVISEDJUNE2013 Crystal An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See 32-MHz CRYSTAL OSCILLATOR for details. The load capacitance seen by the 32-MHz crystal is givenby: 1 C = +C L 1 1 parasitic + C C 221 231 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is givenby: 1 C = +C L 1 1 parasitic + C C 321 331 (2) AseriesresistormaybeusedtocomplywiththeESRrequirement. On-Chip 1.8-V Voltage Regulator Decoupling The1.8-Von-chipvoltageregulatorsuppliesthe1.8-Vdigitallogic.Thisregulatorrequiresadecouplingcapacitor (C401)forstableoperation. Power-Supply Decoupling and Filtering Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application.TIprovidesacompactreferencedesignthatshouldbefollowedveryclosely. References 1. Bluetooth®CoreTechnicalSpecificationdocument,version4.0 http://www.bluetooth.com/SiteCollectionDocuments/Core_V40.zip 2. CC253x System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee® Applications/CC2541 System-on- ChipSolutionfor2.4-GHzBluetoothlowenergyApplications(SWRU191) 3. CurrentSavingsinCC254xUsingtheTPS62730(SWRA365). Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard- based wireless applications for use in industrial and consumer applications. Our selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1-and2.4-GHzfrequencybands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. TheLow-PowerRFE2EOnlineCommunityprovidestechnicalsupportforums,videosandblogs,andthechance tointeractwithfellowengineersfromallovertheworld. With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instrumentsoffersthebroadestlow-powerRFportfolio.WemakeRFeasy! Thefollowingsubsectionspointtowheretofindmoreinformation. Copyright©2012–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 25 ProductFolderLinks:CC2541

CC2541 SWRS110D–JANUARY2012–REVISEDJUNE2013 www.ti.com Texas Instruments Low-Power RF Web Site • Forums,videos,andblogs • RFdesignhelp • E2Einteraction Joinustodayatwww.ti.com/lprf-forum. Texas Instruments Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independentdesignhousesthatprovideaseriesofhardwaremoduleproductsanddesignservices,including: • RFcircuit,low-powerRF,andZigBee®designservices • Low-powerRFandZigBeemodulesolutionsanddevelopmenttools • RFcertificationservicesandRFcircuitmanufacturing Needhelpwithmodules,engineeringservicesordevelopmenttools? SearchtheLow-PowerRFDeveloperNetworktooltofindasuitablepartner. www.ti.com/lprfnetwork Low-Power RF eNewsletter The Low-Power RF eNewsletter keeps you up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles includelinkstogetmoreonlineinformation. Signuptodayon www.ti.com/lprfnewsletter Spacer REVISION HISTORY ChangesfromOriginal(January2012)toRevisionA Page • ChangeddatasheetstatusfromProductPreviewtoProductionData ................................................................................ 1 ChangesfromRevisionA(February2012)toRevisionB Page • ChangedtheTemperaturecoefficientUnitvalueFrom:mV/°CTo:/0.1°C ....................................................................... 10 • ChangedFigure22textFrom:Optional32-kHzCrystalTo:32-kHzCrystal ..................................................................... 24 ChangesfromRevisionB(August2012)toRevisionC Page • Changedthe"Internalreferencevoltage"TYPvalueFrom1.15VTo:1.24V .................................................................. 12 • ChangedpinXOSC_Q1PinTypeFromAnalogOTo:AnalogI/O,andchangedthePinDescription .............................. 17 • ChangedpinXOSC_Q2PinTypeFromAnalogOTo:AnalogI/O .................................................................................... 17 ChangesfromRevisionC(November2012)toRevisionD Page • ChangedtheRFTRANSMITSECTION,OutputpowerTYPvalueFrom:–20To:–23....................................................... 8 • ChangedtheRFTRANSMITSECTION,ProgrammableoutputpowerrangeTYPvalueFrom:20To:23 ........................ 8 • Addedrow0x31toTable1................................................................................................................................................. 22 26 SubmitDocumentationFeedback Copyright©2012–2013,TexasInstrumentsIncorporated ProductFolderLinks:CC2541

PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) CC2541F128RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS NIPDAU | NIPDAUAG Level-3-260C-168 HR -40 to 85 CC2541 & no Sb/Br) F128 CC2541F128RHAT ACTIVE VQFN RHA 40 250 Green (RoHS NIPDAU | NIPDAUAG Level-3-260C-168 HR -40 to 85 CC2541 & no Sb/Br) F128 CC2541F256RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS Call TI | NIPDAUAG Level-3-260C-168 HR -40 to 85 CC2541 & no Sb/Br) | NIPDAU F256 CC2541F256RHAT ACTIVE VQFN RHA 40 250 Green (RoHS Call TI | NIPDAUAG Level-3-260C-168 HR -40 to 85 CC2541 & no Sb/Br) | NIPDAU F256 HPA01215RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS NIPDAU Level-3-260C-168 HR -40 to 85 CC2541 & no Sb/Br) F128 HPA01216RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS NIPDAU Level-3-260C-168 HR -40 to 85 CC2541 & no Sb/Br) F256 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CC2541 : •Automotive: CC2541-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

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