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  • 型号: CC2531F256RHAT
  • 制造商: Texas Instruments
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CC2531F256RHAT产品简介:

ICGOO电子元器件商城为您提供CC2531F256RHAT由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 CC2531F256RHAT价格参考。Texas InstrumentsCC2531F256RHAT封装/规格:RF 收发器 IC, IC 射频 TxRx + MCU 802.15.4 Zigbee® 2.4GHz 40-VFQFN 裸露焊盘。您可以下载CC2531F256RHAT参考资料、Datasheet数据手册功能说明书,资料中有CC2531F256RHAT 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

射频/IF 和 RFID

描述

IC SOC IEEE 802.15.4/ZIG 40VQFNRF片上系统 - SoC SOC Sol for IEEE 802.15.4 & ZigBee Ap

产品分类

RF 收发器集成电路 - IC

品牌

Texas Instruments

产品手册

http://www.ti.com/litv/swrs086a

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

嵌入式处理器和控制器,RF片上系统 - SoC,Texas Instruments CC2531F256RHAT-

mouser_ship_limit

此产品可能需要其他文件才能从美国出口。

数据手册

点击此处下载产品Datasheet

产品型号

CC2531F256RHAT

PCN封装

点击此处下载产品Datasheet

PCN设计/规格

点击此处下载产品Datasheet

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=25419

产品种类

RF片上系统 - SoC

其它名称

296-25186-2

制造商产品页

http://www.ti.com/general/docs/suppproductinfo.tsp?distId=10&orderablePartNumber=CC2531F256RHAT

功率-输出

8dBm

包装

带卷 (TR)

参考设计库

http://www.digikey.com/rdl/4294959884/4294959878/91

商标

Texas Instruments

天线连接器

PCB,表面贴装

存储容量

256kB 闪存,8kB RAM

安装风格

SMD/SMT

封装

Reel

封装/外壳

40-VFQFN 裸露焊盘

封装/箱体

VQFN-40

工作温度

-40°C ~ 125°C

工作温度范围

- 40 C to + 125 C

工作电源电压

2 V to 3.6 V

工厂包装数量

250

应用

通用

接收供电电流

20.5 mA

数据RAM大小

8 kB

数据接口

PCB,表面贴装

数据速率(最大值)

250kbps

标准包装

250

灵敏度

-97dBm

电压-电源

2 V ~ 3.6 V

电流-传输

33.5mA

电流-接收

24mA

程序存储器大小

256 kB

系列

CC2531

调制或协议

802.15.4 Zigbee

输出功率

4.5 dBm

频率

2.4GHz

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PDF Datasheet 数据手册内容提取

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 A USB-Enabled System-On-Chip Solution for 2.4-GHz IEEE802.15.4 and ZigBee Applications CheckforSamples:CC2531F128,CC2531F256 FEATURES – High-PerformanceandLow-Power8051 1 • RF/Layout MicrocontrollerCoreWithCodePrefetch 2345 – 2.4-GHzIEEE802.15.4CompliantRF – 256-KBor128-KBIn-System-Programmable Transceiver Flash – ExcellentReceiverSensitivityand – 8-KBRAMWithRetentioninAllPower RobustnesstoInterference Modes – ProgrammableOutputPowerUpto4.5dBm – HardwareDebugSupport – FewExternalComponents • Peripherals – OnlyaSingleCrystalNeededfor – PowerfulFive-ChannelDMA AsynchronousNetworks – IEEE802.15.4MACTimer,General-Purpose – 6-mm ×6-mmQFN40Package Timers(One16-Bit,Two8-Bit) – SuitableforSystemsTargetingCompliance – IRGenerationCircuitry WithWorldwideRadio-Frequency – 32-kHzSleepTimerWithCapture Regulations:ETSIEN300328andEN300 – CSMA/CAHardwareSupport 440(Europe),FCCCFR47Part15(US),and – AccurateDigitalRSSI/LQISupport ARIBSTD-T-66(Japan) – BatteryMonitorandTemperatureSensor • USB – 12-BitADCWithEightChannelsand – USB2.0CertifiedFullSpeedDevice(12 ConfigurableResolution Mbps) – AESSecurityCoprocessor – 5HighlyFlexibleEndpoints – TwoPowerfulUSARTsWithSupportfor – 1-KBDedicatedFIFO SeveralSerialProtocols – DMAAccesstoFIFO – 21General-PurposeI/OPins – No48-MHzCrystalRequired (19×4mA,2 ×20mA) • LowPower – WatchdogTimer – ActiveModeRX(CPUIdle):24mA • DevelopmentTools – ActiveModeTXat1dBm(CPUIdle):29mA – CC2531DevelopmentKit – PowerMode1(4 msWake-Up):0.2mA – CertifiedCC2531USBDongleReference – PowerMode2(SleepTimerRunning):1 mA Design – PowerMode3(ExternalInterrupts):0.4mA – SmartRF™Software – WideSupply-VoltageRange(2V–3.6V) – PacketSniffer • Microcontroller – IAREmbeddedWorkbench® Software Available 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. SmartRF,Z-Stack,RemoTIaretrademarksofTexasInstruments. 2 IAREmbeddedWorkbenchisaregisteredtrademarkofIARSystemsAB. 3 ZigBeeisaregisteredtrademarkofZigBeeAlliance. 4 Allothertrademarksarethepropertyoftheirrespectiveowners. 5 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2009–2010,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com APPLICATIONS • USBUpgradable2.4-GHzIEEE802.15.4 Systems • RF4CERemoteControlTargetforTVorSTB • PCPeripherals • ZigBee®Systems • Home/BuildingAutomation • LightingSystems • IndustrialControlandMonitoring • Low-PowerWirelessSensorNetworks • ConsumerElectronics • HealthCare This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. DESCRIPTION The CC2531 is a USB enabled true system-on-chip (SoC) solution for IEEE 802.15.4, ZigBee and RF4CE applications. It enables USB dongles or USB upgradable network nodes to be built with low total bill-of-material costs. The CC2531 combines the performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful features. The CC2531 has various operating modes, making it suited for systems where ultralow power consumption is required. Short transitiontimesbetweenoperatingmodesfurtherensurelowenergyconsumption.SourcecodeforUSBHIDand CDClibrariesandexamplesaredownloadablefromtheCC2531productpageonwww.ti.com. Combined with the industry-leading and golden-unit-status ZigBee protocol stack ( Z-Stack™) from Texas Instruments, the CC2531 provides a robust and complete ZigBee USB dongle or firmware upgradable network node. Combined with the golden-unit-status RemoTI™ stack from Texas Instruments, the CC2531 provides a robust ZigBeeRF4CEremote-controltargetforUSBdongleorTV/STBimplementations. 2 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 DIGITAL RESET WATTICMHEDROG ONR-CEHGIPULVAOTLOTRAGE VDDCDO U(2P VL–3.6 V) ANALOG MIXED 32-MHz HIGH-SPEED POWER ON RESET CRYSTALOSC RC-OSC BROWN OUT RESET_N CR3Y2.S7T6A8-LkOHzSC R3C2--OkHSzC SLEEPTIMER XOSC_Q2 XOSC_Q1 INTDEERBFUAGCE CCLOALCIKB RMAUTXIO aNnd SLEEPMODE CONTROLLER P2_4 DP P2_3 1-KB USBFIFO USB USB PHY DM P2_2 P2_1 128/256-KB FLASH P2_0 DMA 80C5O1 RCEPU ARMBEITMROARTYOR P1_7 P1_6 R 8-KB SRAM E P1_5 LL O P1_4 R P1_3 ONT IRQ CTRL FLASH WRITE C PP11__21 I/O 8 ACUHADADINOCN/DECLS ENCRAAYNEPDSTION RADIO REGISTERS P1_0 DECRYPTION CSMA/CASTROBE P0_7 PROCESSOR P0_6 P0_5 USART1 RADIO DATAINTERFACE OL P0_4 R T P0_3 ON USART2 C P0_2 DEMODULATOR AGC MODULATOR ME P0_1 RA P0_0 TIMER 1 (16-Bit) O and F (IEEE 802T.1I5M.4E RM A2CTIMER) FIF TTIIMMEERR 34 ((88--BBiitt)) RCEHCAEIINVE FREQUENCYSYNTHESIZER TRCAHNASINMIT RF_P RF_N B0300-02 ABSOLUTE MAXIMUM RATINGS(1) MIN MAX UNIT Supplyvoltage Allsupplypinsmusthavethesamevoltage –0.3 3.9 V –0.3 V +0.3, Voltageonanydigitalpin DD V ≤3.9 InputRFlevel 10 dBm Storagetemperaturerange –40 125 °C Allpads,accordingtohuman-bodymodel,JEDECSTD22,method 2 kV ESD(2) A114 Accordingtocharged-devicemodel,JEDECSTD22,methodC101 500 V (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) CAUTION:ESD-sensitivedevice.Precautionsshouldbeusedwhenhandlingthedeviceinordertopreventpermanentdamage. Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT Operatingambienttemperaturerange,T –40 125 °C A Operatingsupplyvoltage 2 3.6 V ELECTRICAL CHARACTERISTICS MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°CandV =3V,unlessotherwisenoted. A DD Boldfacelimitsapplyovertheentireoperatingrange,T =–40°Cto125°C,V =2Vto3.6V,andf =2394MHzto A DD c 2507MHz. PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Digitalregulatoron.16-MHzRCOSCrunning.Noradio, crystals,orperipheralsactive. 3.4 mA MediumCPUactivity:normalflashaccess(1),noRAMaccess 32-MHzXOSCrunning.Noradioorperipheralsactive. 6.5 8.9 mA MediumCPUactivity:normalflashaccess(1),noRAMaccess 32-MHzXOSCrunning,radioinRXmode,–50-dBminput 20.5 mA power,noperipheralsactive,CPUidle 32-MHzXOSCrunning,radioinRXmodeat–100-dBminput 24.3 29.6 mA power(waitingforsignal),noperipheralsactive,CPUidle 32-MHzXOSCrunning,radioinTXmode,1-dBmoutput 28.7 mA Icore Corecurrentconsumption power,noperipheralsactive,CPUidle 32-MHzXOSCrunning,radioinTXmode,4.5-dBmoutput 33.5 39.6 mA power,noperipheralsactive,CPUidle Powermode1.Digitalregulatoron;16-MHzRCOSCand 32-MHzcrystaloscillatoroff;32.768-kHzXOSC,POR,BOD 0.2 0.3 mA andsleeptimeractive;RAMandregisterretention Powermode2.Digitalregulatoroff;16-MHzRCOSCand 32-MHzcrystaloscillatoroff;32.768-kHzXOSC,POR,and 1 2 mA sleeptimeractive;RAMandregisterretention Powermode3.Digitalregulatoroff;noclocks;PORactive; 0.4 1 mA RAMandregisterretention PeripheralCurrentConsumption(AddstocorecurrentI foreachperipheralunitactivated) core Timer1 Timerrunning,32-MHzXOSCused 90 mA Timer2 Timerrunning,32-MHzXOSCused 90 mA Timer3 Timerrunning,32-MHzXOSCused 60 mA Timer4 Timerrunning,32-MHzXOSCused 70 mA Iperi Sleeptimer Including32.753-kHzRCOSC 0.6 mA MeasuredonCC2531donglereferencedesign,48-MHzclock USB 0.1 mA running,USBenabled ADC Whenconverting 1.2 mA Erase 1 mA Flash Burstwritepeakcurrent 6 mA (1) Normalflashaccessmeansthatthecodeusedexceedsthecachestorage,socachemisseshappenfrequently. GENERAL CHARACTERISTICS MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°CandV =3V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT WAKE-UPANDTIMING Digitalregulatoron,16-MHzRCOSCand32-MHzcrystal Powermode1→active 4 ms oscillatoroff.Start-upof16-MHzRCOSC Digitalregulatoroff,16-MHzRCOSCand32-MHzcrystal Powermode2or3→active 0.1 ms oscillatoroff.Start-upofregulatorand16-MHzRCOSC Initiallyrunningon16-MHzRCOSC,with32-MHzXOSCoff 0.5 ms Active→TXorRX With32-MHzXOSCinitiallyon 192 ms 4 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 GENERAL CHARACTERISTICS (continued) MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°CandV =3V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT RX/TXandTX/RXturnaround 192 ms USBPLLstart-uptime With32-MHzXOSCinitiallyon 32 ms RADIOPART Programmablein1-MHzsteps,5MHzbetweenchannels RFfrequencyrange 2394 2507 MHz forcompliancewith[1] Radiobaudrate Asdefinedby[1] 250 kbps Radiochiprate Asdefinedby[1] 2 MChip/s Flasherasecycles 20 kCycles Flashpagesize 2 KB Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com RF RECEIVE SECTION MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°C,V =3V,andf =2440MHz,unless A DD c otherwisenoted. Boldlimitsapplyovertheentireoperatingrange,T =–40°Cto125°C,V =2Vto3.6V,andf =2394MHzto2507MHz. A DD c PARAMETER TESTCONDITIONS MIN TYP MAX UNIT PER=1%,asspecifiedby[1] –97 –92 Receiversensitivity dBm [1]requires–85dBm –88 PER=1%,asspecifiedby[1] Saturation(maximuminputlevel) 10 dBm [1]requires–20dBm Wantedsignal–82dBm,adjacentmodulatedchannelat Adjacent-channelrejection,5-MHz 5MHz,PER=1%,asspecifiedby[1]. 49 dB channelspacing [1]requires0dB Wantedsignal–82dBm,adjacentmodulatedchannelat Adjacent-channelrejection,–5-MHz –5MHz,PER=1%,asspecifiedby[1]. 49 dB channelspacing [1]requires0dB Wantedsignal–82dBm,adjacentmodulatedchannelat Alternate-channelrejection,10-MHz 10MHz,PER=1%,asspecifiedby[1] 57 dB channelspacing [1]requires30dB Wantedsignal–82dBm,adjacentmodulatedchannelat Alternate-channelrejection,–10-MHz –10MHz,PER=1%,asspecifiedby[1] 57 dB channelspacing [1]requires30dB Channelrejection Wantedsignalat–82dBm.UndesiredsignalisanIEEE ≥20MHz 802.15.4modulatedchannel,steppedthroughallchannels 57 dB ≤–20MHz from2405to2480MHz.SignallevelforPER=1%. 57 Wantedsignalat–82dBm.Undesiredsignalis802.15.4 Co-channelrejection modulatedatthesamefrequencyasthedesiredsignal.Signal –3 dB levelforPER=1%. Blocking/desensitization 5MHzfrombandedge Wantedsignal3dBabovethesensitivitylevel,CWjammer, –33 10MHzfrombandedge PER=1%.MeasuredaccordingtoEN300440class2. –33 20MHzfrombandedge –32 50MHzfrombandedge –31 dBm –5MHzfrombandedge –35 –10MHzfrombandedge –35 –20MHzfrombandedge –34 –50MHzfrombandedge –34 Spuriousemission.Onlylargestspurious emissionstatedwithineachband. Conductedmeasurementwitha50-Ωsingle-endedload. SuitableforsystemstargetingcompliancewithEN300328, dBm 30MHz–1000MHz EN300440,FCCCFR47Part15,andARIBSTD-T-66. ≤80 1GHz–12.75GHz –57 Frequencyerrortolerance(1) [1]requiresminimum80ppm ±150 ppm Symbolrateerrortolerance(2) [1]requiresminimum80ppm ±1000 ppm SensitivityimpactofUSBoperation MeasuredonCC2531donglereferencedesignwithCDCbulk 0.5 dB transfertoPCatmaximumspeed (1) DifferencebetweencenterfrequencyofthereceivedRFsignalandlocaloscillatorfrequency (2) Differencebetweenincomingsymbolrateandtheinternallygeneratedsymbolrate 6 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 RF TRANSMIT SECTION MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°C,V =3Vandf =2440MHz,unless A DD c otherwisenoted. Boldfacelimitsapplyovertheentireoperatingrange,T =–40°Cto125°C,V =2Vto3.6V,andf =2394MHzto2507 A DD c MHz. PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Deliveredtoasingle-ended50-Ωloadthroughabalunusing 0 4.5 8 Nominaloutputpower maximum-recommendedoutput-powersetting dBm [1]requiresminimum–3dBm –8 10 Programmableoutputpower 32 dB range Spuriousemissions Maxrecommendedoutputpowersetting(1) Measuredaccordingtostatedregulations. Onlylargestspuriousemission 25MHz–1000MHz(outsiderestrictedbands) –60 statedwithineachband. 25MHz–2400MHz(withinFCCrestrictedbands) –60 25MHz–1000MHz(withinETSIrestrictedbands) –60 1800–1900MHz(ETSIrestrictedband) –57 5150–5300MHz(ETSIrestrictedband) –55 dBm At2×fcand3×fc(FCCrestrictedband) –42 At2×fcand3×fc(ETSIEN300-440andEN300-328)(2) –31 1GHz–12.75GHz(outsiderestrictedbands) –53 At2483.5MHzandabove(FCCrestrictedband) f=2480MHz(3) c –42 Measuredasdefinedby[1]usingmaximum-recommended Errorvectormagnitude(EVM) output-powersetting 2% [1]requiresmaximum35%. DifferentialimpedanceasseenfromtheRFport(RF_PandRF_N) Optimumloadimpedance 69+j29 Ω towardstheantenna (1) TexasInstrumentsCC2530EMreferencedesignissuitableforsystemstargetingcompliancewithEN300328,EN300440,FCC CFR47Part15,andARIBSTD-T-66. (2) Marginsforpassingconductedrequirementsatthethirdharmoniccanbeimprovedbyusingasimpleband-passfilterconnected betweenmatchingnetworkandRFconnector(1.8pFinparallelwith1.6nH);thisfiltermustbeconnectedtoagoodRFground. (3) MarginsforpassingFCCrequirementsat2483.5MHzandabovewhentransmittingat2480MHzcanbeimprovedbyusingalower output-powersettingorhavinglessthan100%dutycycle. Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com 32-MHz CRYSTAL OSCILLATOR MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°CandV =3V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Crystalfrequency 32 MHz Crystalfrequencyaccuracy requirement(1) –40 40 ppm ESR Equivalentseriesresistance 6 60 Ω C Crystalshuntcapacitance 1 7 pF 0 C Crystalloadcapacitance 10 16 pF L Start-uptime 0.3 ms Thecrystaloscillatormustbeinpowerdownfora guardtimebeforeitisusedagain.This Power-downguardtime requirementisvalidforallmodesofoperation.The 3 ms needforpower-downguardtimecanvarywith crystaltypeandload. (1) Includingagingandtemperaturedependency,asspecifiedby[1] 32.768-kHz CRYSTAL OSCILLATOR MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°CandV =3V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Crystalfrequency 32.768 kHz Crystalfrequencyaccuracy requirement(1) –40 40 ppm ESR Equivalentseriesresistance 40 130 kΩ C Crystalshuntcapacitance 0.9 2 pF 0 C Crystalloadcapacitance 12 16 pF L Start-uptime 0.4 s (1) Includingagingandtemperaturedependency,asspecifiedby[1] 32-kHz RC OSCILLATOR MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°CandV =3V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Calibratedfrequency(1) 32.753 kHz Frequencyaccuracyaftercalibration ±0.2% Temperaturecoefficient(2) 0.4 %/°C Supply-voltagecoefficient(3) 3 %/V Calibrationtime(4) 2 ms (1) Thecalibrated32-kHzRCoscillatorfrequencyisthe32-MHzXTALfrequencydividedby977. (2) Frequencydriftwhentemperaturechangesaftercalibration (3) Frequencydriftwhensupplyvoltagechangesaftercalibration (4) Whenthe32-kHzRCoscillatorisenabled,itiscalibratedwhenaswitchfromthe16-MHzRCoscillatortothe32-MHzcrystaloscillator isperformedwhileSLEEPCMD.OSC32K_CALDISis0. 8 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 16-MHz RC OSCILLATOR MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°CandV =3V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Frequency(1) 16 MHz Uncalibratedfrequencyaccuracy ±18% Calibratedfrequencyaccuracy ±0.6% ±1% Start-uptime 10 ms Initialcalibrationtime(2) 50 ms (1) Thecalibrated16-MHzRCoscillatorfrequencyisthe32-MHzXTALfrequencydividedby2. (2) Whenthe16-MHzRCoscillatorisenabled,itiscalibratedwhenaswitchfromthe16-MHzRCoscillatortothe32-MHzcrystaloscillator isperformedwhileSLEEPCMD.OSC_PDissetto0. RSSI/CCA CHARACTERISTICS MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°CandV =3V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT RSSIrange 100 dB AbsoluteuncalibratedRSSI/CCAaccuracy ±4 dB RSSI/CCAoffset(1) 73 dB Stepsize(LSBvalue) 1 dB (1) RealRSSI=Registervalue–offset FREQEST CHARACTERISTICS MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°CandV =3V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT FREQESTrange ±250 kHz FREQESTaccuracy ±40 kHz FREQESToffset(1) 20 kHz Stepsize(LSBvalue) 7.8 kHz (1) RealFREQEST=Registervalue–offset FREQUENCY SYNTHESIZER CHARACTERISTICS MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°C,V =3Vandf =2440MHz,unless A DD c otherwisenoted. PARAMETER TESTCONDITIONS MIN TYP MAX UNIT At±1-MHzoffsetfromcarrier –110 Phasenoise,unmodulatedcarrier At±2-MHzoffsetfromcarrier –117 dBc/Hz At±5-MHzoffsetfromcarrier –122 ANALOG TEMPERATURE SENSOR MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°CandV =3V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Outputat25°C 1480 12-bitADC Temperaturecoefficient 4.5 /1°C Voltagecoefficient 1 /0.1V MeasuredusingintegratedADC,using Initialaccuracywithoutcalibration internalbandgapvoltagereferenceand ±10 °C Accuracyusing1-pointcalibration(entire maximumresolution ±5 °C temperaturerange) Currentconsumptionwhenenabled(ADC 0.5 mA currentnotincluded) Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com ADC CHARACTERISTICS T =25°CandV =3V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Inputvoltage V isvoltageonAVDD5pin 0 V V DD DD Externalreferencevoltage V isvoltageonAVDD5pin 0 V V DD DD Externalreferencevoltagedifferential V isvoltageonAVDD5pin 0 V V DD DD Inputresistance,signal Using4-MHzclockspeed 197 kΩ Full-scalesignal(1) Peak-to-peak,defines0dBFS 2.97 V Single-endedinput,7-bitsetting 5.7 Single-endedinput,9-bitsetting 7.5 Single-endedinput,10-bitsetting 9.3 Single-endedinput,12-bitsetting 10.8 ENOB(1) Effectivenumberofbits bits Differentialinput,7-bitsetting 6.5 Differentialinput,9-bitsetting 8.3 Differentialinput,10-bitsetting 10.0 Differentialinput,12-bitsetting 11.5 Usefulpowerbandwidth 7-bitsetting,bothsingleanddifferential 0–20 kHz Single-endedinput,12-bitsetting,–6dBFS –75.2 THD(1) Totalharmonicdistortion dB Differentialinput,12-bitsetting,–6dBFS –86.6 Single-endedinput,12-bitsetting 70.2 Differentialinput,12-bitsetting 79.3 Signaltononharmonicratio(1) dB Single-endedinput,12-bitsetting,–6dBFS 78.8 Differentialinput,12-bitsetting,–6dBFS 88.9 Differentialinput,12-bitsetting,1-kHzsine(0 CMRR Common-moderejectionratio >84 dB dBFS),limitedbyADCresolution Single-endedinput,12-bitsetting,1-kHzsine Crosstalk >84 dB (0dBFS),limitedbyADCresolution Offset Midscale –3 mV Gainerror 0.68% 12-bitsetting,mean 0.05 DNL(1) Differentialnonlinearity LSB 12-bitsetting,maximum 0.9 12-bitsetting,mean 4.6 INL(1) Integralnonlinearity LSB 12-bitsetting,maximum 13.3 Single-endedinput,7-bitsetting 35.4 Single-endedinput,9-bitsetting 46.8 Single-endedinput,10-bitsetting 57.5 SINAD(1) Single-endedinput,12-bitsetting 66.6 Signal-to-noise-and-distortion dB (–THD+N) Differentialinput,7-bitsetting 40.7 Differentialinput,9-bitsetting 51.6 Differentialinput,10-bitsetting 61.8 Differentialinput,12-bitsetting 70.8 7-bitsetting 20 9-bitsetting 36 Conversiontime ms 10-bitsetting 68 12-bitsetting 132 Powerconsumption 1.2 mA Internalreferencevoltage 1.15 V InternalreferenceVDDcoefficient 4 mV/V Internalreferencetemperaturecoefficient 0.4 mV/10°C (1) Measuredwith300-Hzsine-waveinputandVDDasreference. 10 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 CONTROL INPUT AC CHARACTERISTICS T =–40°Cto125°C,V =2Vto3.6V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Systemclock,f Theundividedsystemclockis32MHzwhencrystaloscillatorisused. SYSCLK t =1/f Theundividedsystemclockis16MHzwhencalibrated16-MHzRC 16 32 MHz SYSCLK SYSCLK oscillatorisused. Seeitem1,Figure1.Thisistheshortestpulsethatisrecognizedas acompleteresetpinrequest.Notethatshorterpulsesmaybe RESET_Nlowduration 1 ms recognizedbutmightnotleadtocompleteresetofallmoduleswithin thechip. Seeitem2,Figure1.Thisistheshortestpulsethatisrecognizedas Interruptpulseduration 20 ns aninterruptrequest. RESET_N 1 2 Px.n T0299-01 Figure1. ControlInputACCharacteristics Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com SPI AC CHARACTERISTICS T =–40°Cto125°C,VDD=2Vto3.6V,unlessotherwisenoted. A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT SCKperiod Master,RXandTX 250 ns SCKdutycycle Master 50% t SSNlowtoSCK Master 63 ns 2 t SCKtoSSNhigh Master 63 ns 3 t MOSIearlyout Master,load=10pF 7 ns 4 t MOSIlateout Master,load=10pF 10 ns 5 t MISOsetup Master 90 ns 6 t MISOhold Master 10 ns 7 t SCKperiod Slave,RXandTX 250 ns 1 SCKdutycycle Slave 50% t SSNlowtoSCK Slave 63 ns 2 t SCKtoSSNhigh Slave 63 ns 3 t MISOearlyout Slave,load=10pF 0 ns 8 t MISOlateout Slave,load=10pF 95 ns 9 t MOSIsetup Slave 35 ns 10 t MOSIhold Slave 10 ns 11 Master,TXonly 8 Master,RXandTX 4 Operatingfrequency MHz Slave,RXonly 8 Slave,RXandTX 4 SCK t t 2 3 SSN t t 4 5 MOSI D0 X D1 t t 6 7 MISO X D0 X T0478-01 Figure2. SPIMasterACCharacteristics 12 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 SCK t t 2 3 SSN t t 8 9 MISO D0 X D1 t t 10 11 MOSI X D0 X T0479-01 Figure3. SPISlaveACCharacteristics Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com DEBUG INTERFACE AC CHARACTERISTICS T =–40°Cto125°C,V =2Vto3.6V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT f Debugclockfrequency(seeFigure4) 12 MHz clk_dbg t Allowedhighpulseonclock(seeFigure4) 35 ns 1 t Allowedlowpulseonclock(seeFigure4) 35 ns 2 EXT_RESET_Nlowtofirstfallingedgeon t 167 ns 3 debugclock(seeFigure5) FallingedgeonclocktoEXT_RESET_Nhigh t 83 ns 4 (seeFigure5) EXT_RESET_Nhightofirstdebugcommand t 83 ns 5 (seeFigure5) t Debugdatasetup(seeFigure6) 2 ns 6 t Debugdatahold(seeFigure6) 4 ns 7 t Clock-to-datadelay(seeFigure6) Load=10pF 30 ns 8 Time DEBUG_CLK P2_2 t t 1 2 1/f clk_dbg T0436-01 Figure4. DebugClock– BasicTiming Time DEBUG_CLK P2_2 RESET_N t t t 3 4 5 T0437-01 Figure5. DataSetupandHoldTiming 14 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 Time DEBUG_CLK P2_2 DEBUG_DATA (to CC2531) P2_1 DEBUG_DATA (from CC2531) P2_1 t t t 6 7 8 T0438-01 Figure6. DebugEnableTiming TIMER INPUTS AC CHARACTERISTICS T =–40°Cto125°C,V =2Vto3.6V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Synchronizersdeterminetheshortestinputpulsethatcanbe t SYSCLK Inputcapturepulseduration recognized.Thesynchronizersoperateatthecurrentsystem 1.5 clockrate(16or32MHz). DC CHARACTERISTICS T =25°C,VDD=3V,unlessotherwisenoted. A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT Logic-0inputvoltage 0.5 V Logic-1inputvoltage 2.5 V Logic-0inputcurrent Inputequals0V –50 50 nA Logic-1inputcurrent InputequalsV –50 50 nA DD I/O-pinpullupandpulldownresistors 20 kΩ Logic-0outputvoltage,4-mApins Outputload4mA 0.5 V Logic-1outputvoltage,4-mApins Outputload4mA 2.4 V Logic-0outputvoltage,20-mApins Outputload20mA 0.5 V Logic-1outputvoltage,20-mApins Outputload20mA 2.4 V USB INTERFACE DC CHARACTERISTICS T =25°C,V =3Vto3.6V,unlessotherwisenoted. A DD PARAMETER TESTCONDITIONS MIN TYP MAX UNIT USBpadvoltageoutput,high VDD3.6V,4-mAload 3.4 V USBpadvoltageoutput,low VDD3.6V,4-mAload 0.2 V Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com DEVICE INFORMATION RHAPACKAGE (TOPVIEW) 2 1 Q Q _ _ K K 2 2 3 3 C C S S L O O COUP VDD1 1_6 1_7 2_0 2_1 2_2 2_3/X 2_4/X VDD6 D D P P P P P P P A 40 39 38 37 36 35 34 33 32 31 DGND_USB 1 30 RBIAS USB_P 2 29 AVDD4 USB_N 3 28 AVDD1 DVDD_USB 4 27 AVDD2 P1_5 5 GND 26 RF_N P1_4 6 Ground Pad 25 RF_P P1_3 7 24 AVDD3 P1_2 8 23 XOSC_Q2 P1_1 9 22 XOSC_Q1 DVDD2 10 21 AVDD5 11 12 13 14 15 16 17 18 19 20 0 7 6 5 4 3 2 1 0 N P1_ P0_ P0_ P0_ P0_ P0_ P0_ P0_ P0_ ET_ S E R NOTE: Theexposedgroundpadmustbeconnectedtoasolidgroundplane,asthisisthegroundconnectionforthechip. PinDescriptions PINNAME PIN PINTYPE DESCRIPTION AVDD1 28 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection AVDD2 27 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection AVDD3 24 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection AVDD4 29 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection AVDD5 21 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection AVDD6 31 Power(analog) 2-V–3.6-Vanalogpower-supplyconnection DCOUPL 40 Power(digital) 1.8-Vdigitalpower-supplydecoupling.Donotuseforsupplyingexternalcircuits. DGND_USB 1 Ground(USB USBGround pads) DVDD1 39 Power(digital) 2-V–3.6-Vdigitalpower-supplyconnection DVDD2 10 Power(digital) 2-V–3.6-Vdigitalpower-supplyconnection DVDD_USB 4 Power(USB 3.3VUSBpowersupplyconnection Pads) GND — Ground Thegroundpadmustbeconnectedtoasolidgroundplane. P0_0 19 DigitalI/O Port0.0 P0_1 18 DigitalI/O Port0.1 P0_2 17 DigitalI/O Port0.2 P0_3 16 DigitalI/O Port0.3 P0_4 15 DigitalI/O Port0.4 P0_5 14 DigitalI/O Port0.5 16 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 PinDescriptions(continued) PINNAME PIN PINTYPE DESCRIPTION P0_6 13 DigitalI/O Port0.6 P0_7 12 DigitalI/O Port0.7 P1_0 11 DigitalI/O Port1.0–20-mAdrivecapability P1_1 9 DigitalI/O Port1.1–20-mAdrivecapability P1_2 8 DigitalI/O Port1.2 P1_3 7 DigitalI/O Port1.3 P1_4 6 DigitalI/O Port1.4 P1_5 5 DigitalI/O Port1.5 P1_6 38 DigitalI/O Port1.6 P1_7 37 DigitalI/O Port1.7 P2_0 36 DigitalI/O Port2.0 P2_1 35 DigitalI/O Port2.1 P2_2 34 DigitalI/O Port2.2 P2_3/ DigitalI/O, Port2.3/32.768kHzXOSC 33 XOSC32K_Q2 analogI/O P2_4/ DigitalI/O, Port2.4/32.768kHzXOSC 32 XOSC32K_Q1 analogI/O RBIAS 30 AnalogI/O Externalprecisionbiasresistorforreferencecurrent RESET_N 20 Digitalinput Reset,active-low NegativeRFinputsignaltoLNAduringRX RF_N 26 RFI/O NegativeRFoutputsignalfromPAduringTX 25 PositiveRFinputsignaltoLNAduringRX RF_P RFI/O PositiveRFoutputsignalfromPAduringTX USB_N 3 USBI/O USBdifferentialdataminus(D–) USB_P 2 USBI/O USBdifferentialdataplus(D+) XOSC_Q1 22 AnalogI/O 32-MHzcrystaloscillatorpin1orexternal-clockinput XOSC_Q2 23 AnalogI/O 32-MHzcrystaloscillatorpin2 Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com CIRCUIT DESCRIPTION ON-CHIPVOLTAGE VDD(2.0-3.6V) REGULATOR DCOUPL POWER-ON RESET RESET_N RESET WATCHDOG TIMER BROWN OUT XOSC_Q2 32-MHz SLEEPTIMER CRYSTALOSC XOSC_Q1 CLOCK MUXand CALIBRATION POWER MGT. CONTROLLER P2_4 32.768-kHz CRYSTALOSC P2_3 1-KB FIFO SRAM P2_2 DEBUG HIGH-SPEED 32-kHz P2_1 INTERFACE RC-OSC RC-OSC USB USB PHY DP DM P2_0 8-KB P1_7 SRAM 8051CPU P1_6 CORE MEMORY P1_5 ARBITER P1_4 128/256 KB FLASH P1_3 P1_2 DMA P1_1 P1_0 FLASH CTRL IRQCTRL P0_7 R P0_6 E AES L RADIO REGISTERS P0_5 L ENCRYPTION O 12-BitDS and P0_4 TR ADC DECRYPTION CSMA/CASTROBE PROCESSOR P0_3 N P0_2 O C P0_1 O RADIO DATAINTERFACE P0_0 I/ OL R T N DEMODanUdLATOR NTH MODULATOR CO AGC SY ME USART0 A R F D USART1 N A O F TIMER1(16-bit) YR FI TIMER2 RECEIVE ENCSIZE TRANSMIT (IEEE802.15.4MAC TIMER) QUHE ENT TIMER3(8-bit) FRSY TIMER4(8-bit) DIGITAL RF_PRF_N ANALOG MIXED Figure7. CC2531BlockDiagram A block diagram of the CC2531 is shown in Figure 7. The modules can be roughly divided into one of three categories: CPU- and memory-related modules; modules related to peripherals, clocks, and power management; and radio-related modules. In the following subsections, a short description of each module that appears in Figure7isgiven. 18 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 For more details about the modules and their usage, see the corresponding chapters in the CC253x User's Guide(SWRU191). CPUandMemory The 8051 CPU core used in the CC253x device family is a single-cycle 8051-compatible core. It has three different memory-access buses (SFR, DATA, and CODE/XDATA) with single-cycle access to SFR, DATA, and themainSRAM.Italsoincludesadebuginterfaceandan18-inputextendedinterruptunit. The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which is associated with one of four interrupt priorities. Any interrupt service request is serviced also when the device is in idle mode by going back to active mode. Some interrupts can also wake up the device from sleep mode (powermodes1–3). The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical memories and all peripherals through the SFR bus. The memory arbiter has four memory access points, access of which can map to one of three physical memories: an 8-KB SRAM, flash memory, and XREG/SFR registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same physicalmemory. The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The 8-KB SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power modes2and3).Thisisanimportantfeatureforlow-powerapplications. The 256 KB flash block provides in-circuit programmable non-volatile program memory for the device, and maps into the CODE and XDATA memory spaces. In addition to holding program code and constants, the non-volatile memory allows the application to save data that must be preserved such that it is available after restartingthedevice.Usingthisfeatureonecan,e.g.,usesavednetwork-specificdatatoavoidtheneedforafull start-upandnetworkfind-and-joinprocess. ClocksandPowerManagement The digital core and peripherals are powered by a 1.8-V low-dropout voltage regulator. It provides power management functionality that enables low-power operation for long battery life using different power modes. Fivedifferentresetsourcesexisttoresetthedevice. Peripherals The CC2531 includes many different peripherals that allow the application designer to develop advanced applications. The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging. Through this debug interface, it is possible to perform an erasure of the entire flash memory, control which oscillators are enabled, stop and start execution of the user program, execute supplied instructions on the 8051 core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possibletoperformin-circuitdebuggingandexternalflashprogrammingelegantly. The device contains flash memory for storage of program code. The flash memory is programmable from the user software and through the debug interface. The flash controller handles writing and erasing the embedded flashmemory.Theflashcontrollerallowspage-wiseerasureand4-bytewiseprogramming. The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral modulescontrolcertainpinsorwhethertheyareundersoftwarecontrol,andifso,whethereachpinisconfigured as an input or output and if a pullup or pulldown resistor in the pad is connected. CPU interrupts can be enabled on each pin individually. Each peripheral that connects to the I/O pins can choose between two different I/O pin locationstoensureflexibilityinvariousapplications. A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface) achieve highly efficient operation by using the DMA controller for data transfers between SFR or XREG addresses and flash/SRAM. Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It can also be configured in IR Generation Mode, where it counts Timer 3 periods and the output is ANDed with theoutputofTimer3togeneratemodulatedconsumerIRsignalswithminimalCPUinteraction. Timer 2 (the MAC Timer) is specially designed for supporting an IEEE 802.15.4 MAC or other time-slotted protocol in software. The timer has a configurable timer period and a 24-bit overflow counter that can be used to keep track of the number of periods that have transpired. A 40-bit capture register is also used to record the exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission ends, as well as two 16-bit output compare registers and two 24-bit overflow compare registers that can send variouscommandstrobes(startRX,startTX,etc.)atspecifictimestotheradiomodules. Timer 3 and Timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of thecounterchannelscanbeusedasaPWMoutput. The sleep timer is an ultralow-power timer that counts 32-kHz crystal oscillator or 32-kHz RC oscillator periods. The sleep timer runs continuously in all operating modes except power mode 3 (PM3). Typical applications of thistimerareasareal-timecounterorasawake-uptimertocomeoutofpowermode1(PM1)or2(PM2). The ADC supports 7 to 12 bits of resolution in a 30-kHz to 4-kHz bandwidth, respectively. DC and audio conversions with up to eight input channels (Port 0) are possible. The inputs can be selected as single-ended or differential. The reference voltage can be internal, AVDD, or a single-ended or differential external signal. The ADC also has a temperature-sensor input channel. The ADC can automate the process of periodic sampling or conversionoverasequenceofchannels. The random-number generator uses a 16-bit LFSR to generate pseudorandom numbers, which can be read by theCPUoruseddirectlybythecommandstrobeprocessor.Itcanbeseededwithrandomdatafromnoiseinthe radioADC. The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with 128-bit keys. The core is able to support the AES operations required by IEEE 802.15.4 MAC security, the ZigBeenetworklayer,andtheapplicationlayer. A built-in watchdog timer allows the CC2531 to reset itself in case the firmware hangs. When enabled by software,thewatchdogtimermustbeclearedperiodically;otherwise,itresetsthedevicewhenittimesout.Itcan alternativelybeconfiguredforuseasageneral32-kHztimer. USART 0 and USART 1 are each configurable as either a SPI master/slave or a UART. They provide double buffering on both RX and TX and hardware flow control, and are thus well suited to high-throughput full-duplex applications. Each has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other uses. The USB device operates at full-speed, 12-Mbps transfer rate. The controller has 5 bidirectional endpoints in addition to control endpoint 0. The endpoints support bulk, interrupt, and isochronous operation for implementation of a wide range of applications. The 1024 bytes of dedicated, flexible FIFO memory combined withDMAaccessensuresthataminimumofCPUinvolvementisneededforUSBcommunication. Radio The CC2531 features an IEEE 802.15.4-compliant radio transceiver. The RF core controls the analog radio modules. In addition, it provides an interface between the MCU and the radio which makes it possible to issue commands, read status, and automate and sequence radio events. The radio also includes a packet-filtering and address-recognitionmodule. 20 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 TYPICAL CHARACTERISTICS RXCURRENT(–100-dBmINPUT) TXCURRENT(TXPOWER=0xF5) vs vs TEMPERATURE TEMPERATURE 28 36 27 35 26 A A m m − − ent 25 ent 34 urr urr C C X X R 24 T 33 23 22 32 −40 0 40 80 120 −40 0 40 80 120 T − Temperature − °C T − Temperature − °C G001 G002 Figure8. Figure9. RXCURRENT(–100-dBmINPUT) TXCURRENT(TXPOWER=0xF5) vs vs SUPPLYVOLTAGE SUPPLYVOLTAGE 26.0 34.4 25.5 34.2 A A m m − − Current 25.0 Current 34.0 X X R T 24.5 33.8 24.0 33.6 2.0 2.4 2.8 3.2 3.6 2.0 2.4 2.8 3.2 3.6 VCC − Supply Voltage − V VCC − Supply Voltage − V G003 G004 Figure10. Figure11. Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com TYPICAL CHARACTERISTICS (continued) INTERFERERREJECTION(802.15.4INTERFERER) OUTPUTPOWER(TXPOWER=0xF5) vs vs INTERFERERFREQUENCY(CARRIERAT–82dBm,2440 FREQUENCY MHz) 6.0 75 5.5 50 m er − dB 5.0 on − dB ut Pow Rejecti 25 Outp 4.5 erer − erf O nt P I 0 4.0 3.5 −25 2394 2414 2434 2454 2474 2494 2400 2420 2440 2460 2480 f − Frequency − MHz Interferer Frequency − MHz G005 G006 Figure12. Figure13. SENSITIVITY OUTPUTPOWER(TXPOWER=0xF5) vs vs TEMPERATURE TEMPERATURE −92 8 −93 6 −94 m B d m − dB −95 er 4 − w y Po nsitivit −96 utput 2 e O S − −97 O P 0 −98 −99 −2 −40 0 40 80 120 −40 0 40 80 120 T − Temperature − °C T − Temperature − °C G007 G008 Figure14. Figure15. 22 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 TYPICAL CHARACTERISTICS (continued) OUTPUTPOWER(TXPOWER=0xF5) SENSITIVITY vs vs SUPPLYVOLTAGE SUPPLYVOLTAGE 5.0 −94 −95 4.8 m B d −96 − m ower 4.6 − dB P y −97 ut vit Outp 4.4 ensiti − S −98 O P 4.2 −99 4.0 −100 2.0 2.4 2.8 3.2 3.6 2.0 2.4 2.8 3.2 3.6 VCC − Supply Voltage − V VCC − Supply Voltage − V G009 G010 Figure16. Figure17. Table1.RecommendedOutputPowerSettings(1) TXPOWERRegisterSetting TypicalOutputPower(dBm) TypicalCurrentConsumption(mA) 0xF5 4.5 34 0xE5 2.5 31 0xD5 1 29 0xC5 –0.5 28 0xB5 –1.5 27 0xA5 –3 27 0x95 –4 26 0x85 –6 26 0x75 –8 25 0x65 –10 25 0x55 –12 25 0x45 –14 25 0x35 –16 25 0x25 –18 24 0x15 –20 24 0x05 –22 23 0x05andTXCTRL=0x09 –28 23 (1) MeasuredonTexasInstrumentsCC2530EMreferencedesignwithT =25°C,VDD=3V,andf =2440MHz,unlessotherwisenoted. A c Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 23 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com APPLICATION INFORMATION Few external components are required for the operation of the CC2531. A typical application circuit is shown in Figure 18. For a complete USB-certified reference design, see the CC2531 product page on www.ti.com. Typical values and description of external components are shown in Table 2. The USB_P and USB_N pins need series resistors R21 and R31 for impedance matching, and the D+ line must have a pullup resistor, R32. The series resistors should match the 90 Ω ±15% characteristic impedance of the USB bus. Notice that the pullup resistor and DVDD_USB must be connected to a voltage source between 3 V and 3.6 V (typically 3.3 V). The voltage source should be derived from or controlled by the VBUS power supply provided by the USB cable. In this way, the pullup resistor does not provide current to the D+ line when VBUS is removed. The pullup resistor may be connected directly between VBUS and the D+ line. As an alternative, if the CC2531 firmware needs the ability to disconnectfromtheUSBbus,aGPIOontheCC2531canbeusedtocontrolthepullupresistor. Optional32-kHzCrystal C331 2-V–3.6-V Power Supply C401 3.3-V Power Supply AL T X C321 40 39 38 37 36 35 34 33 32 31 PL D1 _6 _7 _0 _1 _2 Q2 Q1 D6 COU DVD P1 P1 P2 P2 P2 2K_ 2K_ AVD R301 R32 D C3 C3 RBIAS30 R31 1DGND_USB XOS XOS AVDD429 L252 Antenna D+ C41 2USB_P 2_3/ 2_4/ AVDD128 C251 C252 (50W) D– 3USB_N P P R21 AVDD227 4DVDD_USB C253 RF_N26 5 P1_5 CC2531 C31 C21 RF_P25 C261 6 P1_4 L261 DIEATTACHPAD AVDD324 7 P1_3 XOSC_Q223 C262 8 P1_2 XOSC_Q122 9 P1_1 N AVDD521 10 DVDD2 _ T P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 RESE 1 2 3 4 5 6 7 8 9 0 1 1 1 1 1 1 1 1 1 2 XTAL C221 C231 S0383-04 Powersupplydecouplingcapacitorsarenotshown.DigitalI/Onotconnected. Figure18. CC2531ApplicationCircuit 24 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 Table2.OverviewofExternalComponents(ExcludingSupplyDecoupling Capacitors) Component Description Value C21 USBD–decoupling 47pF C31 USBD+decoupling 47pF C41 DecouplingcapacitorforUSBpadpowersupply 10pF C221 32-MHzxtal-loadingcapacitor 27pF C231 32-MHzxtal-loadingcapacitor 27pF C251 PartoftheRFmatchingnetwork 18pF C252 PartoftheRFmatchingnetwork 1pF C253 PartoftheRFmatchingnetwork 2.2pF C261 PartoftheRFmatchingnetwork 18pF C262 PartoftheRFmatchingnetwork 1pF C321 32-kHzxtal-loadingcapacitor 15pF C331 32-kHzxtal-loadingcapacitor 15pF C401 Decouplingcapacitorfortheinternaldigitalregulator 1mF L252 PartoftheRFmatchingnetwork 2nH L261 PartoftheRFmatchingnetwork 2nH R21 USBD–seriesresistor 33Ω R31 USBD+seriesresistor 33Ω R32 USBD+pullupresistortosignalfull-speeddevice 1.5kΩ R301 Resistorusedforinternalbiasing 56kΩ Input/Output Matching When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown consistsofC262,L261,C252,andL252. Ifabalancedantennasuchasafoldeddipoleisused,thebaluncanbeomitted. Crystal An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See the 32-MHz Crystal Oscillator section for details. The load capacitance seen by the 32-MHz crystalisgivenby: 1 C = +C L 1 1 parasitic + C C 221 231 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is givenby: 1 C = +C L 1 1 parasitic + C C 321 331 (2) AseriesresistormaybeusedtocomplywiththeESRrequirement. On-Chip 1.8-V Voltage-Regulator Decoupling The1.8-Von-chipvoltageregulatorsuppliesthe1.8-Vdigitallogic.Thisregulatorrequiresadecouplingcapacitor (C401)forstableoperation. Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 25 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com Power-Supply Decoupling and Filtering Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are important to achieve the best performance in an application.TIprovidesarecommendedcompactreferencedesignfortheusertofollow. References 1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications forLow-RateWirelessPersonalAreaNetworks(LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf 2. CC253x User's Guide – CC253x System-on-Chip Solution for 2.4 GHz IEEE 802.15.4 and ZigBee Applications(SWRU191) 3. UniversalSerialBusRevision2.0Specificationhttp://www.usb.org/developers/docs/usb_20_052709.zip Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. The selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1-GHzand2.4-GHzfrequencybands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. TheLow-PowerRFE2EOnlineCommunityprovidestechnicalsupportforums,videosandblogs,andthechance tointeractwithengineersfromallovertheworld. With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instrumentsoffersthebroadestlow-powerRFportfolio. Texas Instruments Low-Power RF Web Site Texas Instruments’ Low-Power RF Web site has all the latest products, application and design notes, FAQ section,newsandeventsupdates.Gotowww.ti.com/lprf. Low-Power RF Online Community • Forums,videos,andblogs • RFdesignhelp • E2Einteraction Joinat:www.ti.com/lprf-forum. 26 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 www.ti.com SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 Texas Instruments Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independentdesignhousesthatprovideaseriesofhardwaremoduleproductsanddesignservices,including: • RFcircuit,low-powerRF,andZigBeedesignservices • Low-powerRFandZigBeemodulesolutionsanddevelopmenttools • RFcertificationservicesandRFcircuitmanufacturing Forhelpwithmodules,engineeringservicesordevelopmenttools: SearchtheLow-PowerRFDeveloperNetworktofindasuitablepartner.www.ti.com/lprfnetwork Low-Power RF eNewsletter The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles includelinkstogetmoreonlineinformation. Signupat:www.ti.com/lprfnewsletter Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 27 ProductFolderLink(s):CC2531F128 CC2531F256

CC2531F128, CC2531F256 SWRS086A–SEPTEMBER2009–REVISEDJUNE2010 www.ti.com REVISION HISTORY ChangesfromRevisionOriginal(September2009)toRevisionA Page • Changedrecommendationforsingle-crystalimplementationstoasynchronousnetworks. ................................................. 1 • AddedF128versionofCC2531todatasheet. .................................................................................................................... 1 • Addednumberoferasecyclesandpagesizeforflash........................................................................................................ 4 • Addednumberoferasecyclesandpagesizeforflash........................................................................................................ 5 • UpdatedESRfor32kHzcrystal. .......................................................................................................................................... 8 • Updatedvoltagecoefficientfortemperaturesensor. ............................................................................................................ 9 • ChangedSPIACcharacteristicsSSNlowfromSCKnegativeedgetoSCKpositiveedgeandsplititintoseparate masterandslavefigures..................................................................................................................................................... 12 • CorrecteddescriptionofTimer2(MACTimer)................................................................................................................... 20 • Improvedreadabilityofsleeptimerdescription. ................................................................................................................. 20 • Removedsentencethatpseudorandomdatacanbeusedforsecurity. ............................................................................ 20 28 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):CC2531F128 CC2531F256

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) CC2531F128RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS NIPDAU | NIPDAUAG Level-3-260C-168 HR -40 to 125 CC2531 & no Sb/Br) F128 CC2531F128RHAT ACTIVE VQFN RHA 40 250 Green (RoHS NIPDAU | NIPDAUAG Level-3-260C-168 HR -40 to 125 CC2531 & no Sb/Br) F128 CC2531F256RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS NIPDAU | NIPDAUAG Level-3-260C-168 HR -40 to 125 CC2531 & no Sb/Br) F256 CC2531F256RHAT ACTIVE VQFN RHA 40 250 Green (RoHS NIPDAU | NIPDAUAG Level-3-260C-168 HR -40 to 125 CC2531 & no Sb/Br) F256 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) CC2531F128RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2531F128RHAT VQFN RHA 40 250 180.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2531F256RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2531F256RHAT VQFN RHA 40 250 180.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) CC2531F128RHAR VQFN RHA 40 2500 350.0 350.0 43.0 CC2531F128RHAT VQFN RHA 40 250 213.0 191.0 55.0 CC2531F256RHAR VQFN RHA 40 2500 350.0 350.0 43.0 CC2531F256RHAT VQFN RHA 40 250 213.0 191.0 55.0 PackMaterials-Page2

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