Effective June 2017 Technical Data 4346 Supersedes June, 2014 CC06H High I2t Chip™ 0603 size fuses Pb HHALOFGEN Applications For secondary circuit protection in space FREE constrained applications: • LCD Backlight inverters • Digital cameras • DVD Players • Bluetooth headsets • Battery packs Agency information • cURus Recognized Guide and Card JDXY2/ JDYX8, File E19180 Packaging TR - Packaging code suffix for tape-and-reel • (8 mm wide tape on 178mm diameter reel - Product feature: specification EIA 481-1) • 0603 (1608 metric) compact design Quantity = 5000 fuses utilizes less board space • • Halogen free, lead free and RoHS compliant • High inrush withstand capability • Fast-acting performance • Ampacity alpha mark on fuse for easy identification • Standard termination design for easy solderability • Compatible with standard lead-free solder reflow and wave soldering processes • Excellent environmental integrity

Technical Data CC06H 4346 High I2t Chip™ 0603 size fuses Effective June 2017 Electrical characteristics Amp Rating % of Amp Rating Opening Time 1-8 A 100 4 Hours 1-7 A 200 1-60 Seconds 1-8 A 250 5 Seconds Max Specifications Typical Typical Voltage Interrupting Typical Cold Typical Voltage Power Agency Part Amp Rating Rating1, 4 Resistance2 Pre-Arcing3 Drop Dissipation Alpha Information Number Rating5 (Vdc) (A) (Ω) (I2t) (mV) (W) Marking (cURus) CC06H1A 1 32 50 0.25 0.02 310 0.32 B x CC06H1.5A 1.5 32 50 0.13 0.07 250 0.38 H x CC06H2A 2 32 50 0.068 0.14 170 0.38 K x CC06H2.5A 2.5 32 50 0.05 0.25 155 0.38 L x CC06H3A 3 32 50 0.035 0.30 130 0.38 O x CC06H3.5A 3.5 32 50 0.023 0.50 100 0.35 R x CC06H4A 4 32 50 0.02 0.8 110 0.45 S x CC06H5A 5 32 50 0.013 1.6 95 0.48 T x CC06H6A 6 32 50 0.0076 2.6 80 0.48 V x CC06H7A 7 32 50 0.0056 3.3 80 0.56 X x CC06H8A 8 32/24 50/80 0.0040 4.5 75 0.60 Z x 1. DC Interrupting Rating (measured at rated voltage, time constant of less than 50 microseconds, battery source). 2. DC Cold Resistance are measured at <10% of rated current in ambient temperature of 20 °C - FOR REFERENCE ONLY - CONTROLLED VALUES HELD BY PLANT AND SUBJECT TO CHANGE WITHOUT NOTICE. 3. Typical Pre-arcing I2t are measured at rated DC voltage, 10I current (not to exceed interrupting rating). n 4. The insulation resistance after breaking capacity test is higher than 0.1 MΩ when measured by 2X rated voltage. 5. Device designed to carry rated current for 4 hours minimum. An operating current 80% or less of rated current is recommended, with further design derating required at elevated ambient temperature. See Temperature Derating Curve on next page. 2 www.eaton.com/electronics

CC06H Technical Data 4346 High I2t Chip™ 0603 size fuses Effective June 2017 Time-current curves — average melt 3

Technical Data 4346 CC06H Effective June 2017 High I2t Chip™ 0603 size fuses I2t vs. time curves ) s 2 A ( t 2 I 4 www.eaton.com/electronics

CC06H Technical Data 4346 High I2t Chip™ 0603 size fuses Effective June 2017 I2t vs. current curves ) s 2 A ( t 2 I 5

Technical Data 4346 CC06H Effective June 2017 High I2t Chip™ 0603 size fuses Temperature derating curve Pad layout 1.25 (0.05) 0.90 (0.035) 0.50 (0.02) Dimensions - mm (in) Drawing not to scale. 1.60 ± 0.15 (0.063 ± 0.006) 0.81 ± 0.15 (0.032 ± 0.006) 0.35 ± 0.15 (0.014 ± 0.006) 0.47 ± 0.08 (0.0185 ± 0.003) A B D E E F G P P P T W 0 0 0 1 2 0 1 2 0.95 1.80 1.50 1.75 6.25 3.50 0.75 4.00 4.00 2.00 0.060 8.00 ±0.05 ±0.05 +0.10, ±0.10 ±0.30 ±0.05 min. ±0.10 ±0.10 ±0.05 ±0.05 ±0.20 -0.0 Product characteristics Operating temperature -40 °C to +85 °C , with proper derating factor applied Storage temperature -40 °C to +85 °C Load humidity MIL-STD-202G, Method 103B (1000 hr @ +85 °C / 85% RH & 10% rated current) Moisture resistance MIL-STD-202, Method 106E (50 cycles) Thermal shock MIL-STD-202, Method 107D (-65 °C to +125 °C, 100 cycles) Vibration test MIL-STD-202, Method 204D, Test Condition D (10-2,000 Hz) Mechanical shock resistance MIL-STD-202, Method 213B (3000 G / 0.3 ms) Salt spray resistance MIL-STD-202, Method 101, Test Condition B (48 hour exposure) Insulation resistance The insulation resistance after breaking capacity test is higher than 0.1 MΩ when measured by 2X rated voltage J-STD-002C Method B1 (Dip and Look Test), Method G1 (Wetting Balance Test), Method D (Resistance to Solderability Dissolution / Dewetting of Metalization) Resistance to soldering heat MIL-STD-202, Method 210F (Solder dip +260 °C, 60 seconds / Solder Iron +350 °C, 3-5 seconds) High temperature life test MIL-STD-202G, Method 108A (1000 Hours @ +70 °C & 60% rated current) Resistance to solvents MIL-STD-202, Method 215K 6 www.eaton.com/electronics

CC06H Technical Data 4346 High I2t Chip™ 0603 size fuses Effective June 2017 Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Max. Ramp Down Rate = 6°C/s Package mm3 mm3 Thickness <350 >_350 TL <2.5mm 235°C 220°C Preheat t A >_2.5mm 220°C 220°C e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) er p Volume Volume Volume Tem Tsmin ts Package mm3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak •Temperature min.(Tsmin) 100°C 150°C •Temperature max.(Tsmax) 150°C 200°C •Time (Tsminto Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmaxto Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tpto Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. *Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4346 BU-SB14476 All other trademarks are property June 2017 of their respective owners.