Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 200°C, C0G Dielectric, 10 – 200 VDC (Industrial Grade) Overview KEMET’s High Temperature surface mount C0G Multilayer elevated temperatures up to 200°C. They also exhibit low ESR Ceramic Capacitors (MLCCs) are constructed of a robust at high frequencies and offer greater volumetric efficiency and proprietary C0G/NP0 base metal electrode (BME) over competitive high temperature precious metal electrode dielectric system that offers industry-leading performance (PME) and BME ceramic capacitor devices. at extreme temperatures up to 200°C. These devices are specifically designed to withstand the demands of harsh These devices are Lead (Pb)-Free, RoHS and REACH industrial environments such as down-hole oil exploration compliant without the need of any exemptions. and automotive/avionics engine compartment circuitry. KEMET’s High Temperature C0G capacitors are temperature compensating and are well suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. They exhibit no change in capacitance with respect to time and voltage and boast a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to ±30ppm/ºC from −55°C to +200°C. In addition, these capacitors exhibit high insulation resistance with low dissipation factor at Ordering Information C 1210 H 124 J 5 G A C TU Case Size Specification/ Capacitance Capacitance Failure Rate/ Packaging/ Ceramic Voltage Dielectric Termination Finish2 (L" x W") Series Code (pF) Tolerance1 Design Grade (C-Spec) 0402 H = High Two significant digits + B = ±0.10 pF 8 = 10 V G = C0G A = N/A C = 100% Matte Sn See 0603 Temperature number of zeros. C = ±0.25 pF 4 = 16 V L = SnPb (5% Pb minimum) “Packaging 0805 (200°C) Use 9 for 1.0 – 9.9 pF D = ±0.5 pF 3 = 25 V E = Gold (Au) 1.97 – 11.8 µin C-Spec 1206 Use 8 for 0.5 – 0.99 pF F = ±1% 5 = 50 V F = Gold (Au) 30 – 50 µin Ordering 1210 e.g., 2.2 pF = 229 G = ±2% 1 = 100 V G = Gold (Au) 100 µin Options 1812 e.g., 0.5 pF = 508 J = ±5% 2 = 200 V minimum Table” 2220 K = ±10% below M = ±20% 1 Additional capacitance tolerance offerings may be available. Contact KEMET for details. 2 Additional termination finish options may be available. Contact KEMET for details. One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Benefits • −55°C to +200°C operating temperature range • Preferred capacitance solution at line frequencies and into • Lead (Pb)-free, RoHS and REACH compliant the MHz range • EIA 0402, 0603, 0805, 1206, 1210, 1812, and 2220 • No capacitance change with respect to applied rated DC case sizes voltage • DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, • Negligible capacitance change with respect to temperature and 200 V from −55°C to +200°C • Capacitance offerings ranging from 0.5 pF up to 470 nF • No capacitance decay with time • Available capacitance tolerances of ±0.10 pF, ±0.25 pF, • Non-polar device, minimizing installation concerns ±0.5 pF, ±1%, ±2%, ±5%, ±10% or ±20% • 100% pure matte tin-plated termination finish allowing for • No piezoelectric noise excellent solderability • Extremely low ESR and ESL • Gold (Au), Tin/Lead (Sn/Pb) and 100% pure matte Tin (Sn) • High thermal stability termination finishes available • High ripple current capability Applications Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression, blocking and energy storage for use in extreme environments such as down- hole exploration, aerospace engine compartments and geophysical probes. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Packaging C-Spec Ordering Options Table Packaging Termination Finish Options Packaging Type/Options Ordering Code (C-Spec) Standard Packaging – Unmarked3 Bulk Bag Blank1 Waffle Tray2 7292 7" Tape & Reel TU 7411 (EIA 0603 and smaller case sizes) 13" Reel C = 100% Matte Sn 7210 (EIA 0805 and larger case sizes) L = SnPb (5% Pb min.) 7” Tape & Reel/2 mm pitch4 7081 F = Gold (Au) 30 – 50 µin 7" Tape & Reel – 50 pieces T050 G = Gold (Au) 100 µin minimum 7" Tape & Reel – 100 pieces T100 7" Tape & Reel – 250 pieces T250 7" Tape & Reel – 500 pieces T500 7" Tape & Reel – 1,000 pieces T1K0 Moisture Sensitive Packaging5 – Unmarked3 Waffle Tray2 7282 7" Tape & Reel 7130 7" Tape & Reel – 50 pieces E = Gold (Au) 1.97 – 11.8 µin F = Gold (Au) 30 – 50 µin 7" Tape & Reel – 100 pieces G = Gold (Au) 100 µin minimum 7" Tape & Reel – 250 pieces Contact KEMET6 7" Tape & Reel – 500 pieces 7" Tape & Reel – 1,000 pieces 1 Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging. 1 “Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric). 2 “Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric). 3 The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. 3 Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 through 2225 case size devices with chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options may be available. Contact KEMET for details. 4 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”. 5 Moisture sensitive packaging is required for Gold (Au) termination option “E” (1.97 – 11.8 µin) 6 Additional reeling or packaging options may be available. Contact KEMET for details. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Dimensions – Millimeters (Inches) W L T B S S EIA Size Metric Size L W T B Mounting Separation Code Code Length Width Thickness Bandwidth Technique Minimum 1.00 (0.040) 0.50 (0.020) 0.30 (0.012) Solder Reflow 0402 1005 0.30 (0.012) ±0.05 (0.002) ±0.05 (0.002) ±0.10 (0.004) Only 1.60 (0.063) 0.80 (0.032) 0.35 (0.014) 0603 1608 0.70 (0.028) ±0.15 (0.006) ±0.15 (0.006) ±0.15 (0.006) 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) Solder Wave or 0805 2012 0.75 (0.030) ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) Solder Reflow 3.20 (0.126) 1.60 (0.063) See Table 2 for 0.50 (0.02) 1206 3216 ±0.20 (0.008) ±0.20 (0.008) Thickness ±0.25 (0.010) 3.20 (0.126) 2.50 (0.098) 0.50 (0.02) 1210 3225 ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) N/A 4.50 (0.177) 3.20 (0.126) 0.60 (0.024) Solder Reflow 1812 4532 ±0.30 (0.012) ±0.30 (0.012) ±0.35 (0.014) Only 5.70 (0.224) 5.00 (0.197) 0.60 (0.024) 2220 5650 ±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014) Qualification/Certification High temperature (200ºC) Industrial grade products meet or exceed the requirements outlined in Table 4, Performance & Reliability. Qualification packages are available for review and download on our website at www.kemet.com/hightemp Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +200°C Capacitance Change with Reference to ±30 ppm/ºC (up to 200ºC) +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) 0% 250% of rated voltage 1Dielectric Withstanding Voltage (DWV) (5±1 seconds and charge/discharge not exceeding 50 mA) 2Dissipation Factor (DF) Maximum Limit at 25ºC 0.1% 1,000 megohm microfarads or 100 GΩ 3Insulation Resistance (IR) Minimum Limit at 25°C (Rated voltage applied for 120±5 seconds at 25°C) 1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 2 Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF 1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF 3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to “ON.” Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Rated DC Capacitance Dissipation Factor Capacitance Insulation Dielectric Voltage Value (Maximum %) Shift Resistance 10% of Initial C0G All All 0.5 0.3% or ±0.25 pF Limit © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Electrical Characteristics Delta Cap vs. Temperature (Typical) C1210H104J1GAC - Life Test IR Distribution (Lognormal) 20 99 15 95 0 hrs 2000 hrs 90 10 80 %) 5 % 7600 a Cap ( 0 Percent 543000 elt −5 20 D −10 10 0 Vr 5 −15 100% Vr 1 −20 0.1 1.0 10.0 100.0 −6 −4 −2 0 20 40 60 80 10 12 14 16 18 20 25°C IR (GOhms) 0 0 0 0 0 0 0 0 0 Temperature (ºC) Capacitance vs. Temperature with 25 V DC Bias DF vs. Temperature without DC Bias. (Rated Voltage) 200 1.00 200ºC C0G 100nF no DC 200ºC C0G MLCC 100nF 200ºC C0G 100nF 25V DC 150 0.50 F) n citance (100 DF (%) 0.00 a Cap 50 −0.50 0 −1.00 −60 −40 −20 0 20 40 60 80 100 120 140 160 180 200 −60 −40 −20 0 20 40 60 80 100 120 140 160 180 200 Temperature (°C) Temperature (°C) BME vs. PME/IR vs. Temperature with 25 V DC Bias IR vs. Temperature with 25 V DC Bias (Rated Voltage) (Rated Voltage) 1.E+08 1.E+08 1.E+07 1.E+07 1.E+06 1.E+06 1.E+05 R (MOhms) 11..EE++0034 IR (MOhms) 111...EEE+++000345 I 1.E+02 PME C0G MLCC 1206/10nF 1.E+02 1.E+01 200ºC C0G MLCC 100nF BME C0G MLCC 1206/10nF 1.E+00 1.E+01 −60 −40 −20 0 20 40 60 80 100 120 140 160 180 200 −60 −40 −20 0 20 40 60 80 100 120 140 160 180 200 Temperature (°C) Temperature (°C) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) Case Size / Series C0402H C0603H C0805H C1206H Cap Voltage Code 8 4 3 5 1 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 Capacitance Code Rated Voltage (VDC) 10 16 25 50 100 10 16 25 50 100 200 10 16 25 50 100 200 10 16 25 50 100 200 Product Availability and Chip Thickness Codes Capacitance Tolerance See Table 2 for Chip Thickness Dimensions 0.5 & 0.75 pF 508 & 758 B C D BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN 1.0 - 9.0 pF* 109 - 919* B C D BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN EB EB EB EB EB EB 10 - 91 pF* 100 - 910* F G J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN EB EB EB EB EB EB 100 - 180 pF* 101 - 181* F G J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN EB EB EB EB EB EB 200 - 430 pF* 201 - 431* F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN DN EB EB EB EB EB EB 470 pF 471 F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN DP EB EB EB EB EB EB 510 pF 511 F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN DN EB EB EB EB EB EB 560 pF 561 F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN DN EB EB EB EB EB EB 620 pF 621 F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN DN EB EB EB EB EB EB 680 pF 681 F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN DN EB EB EB EB EB EB 750 pF 751 F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN DN EB EB EB EB EB EB 820 pF 821 F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN DN EB EB EB EB EB EB 910 pF 911 F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DP DP EB EB EB EB EB EB 1,000 pF 102 F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DP DP EB EB EB EB EB EE 1,100 pF 112 F G J K M BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB EB 1,200 pF 122 F G J K M BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB EB 1,300 pF 132 F G J K M BB BB BB BB CF CF CF CF CF DP DP DP DP DP EB EB EB EB EC EC 1,500 pF 152 F G J K M BB BB BB BB CF CF CF CF CF DP DP DP DP DP EB EB EB EB ED EC 1,600 pF 162 F G J K M CF CF CF CF CF DP DP DP DP DP EB EB EB EB ED ED 1,800 pF 182 F G J K M CF CF CF CF CF DP DP DP DP DP EB EB EB EB ED ED 2,000 pF 202 F G J K M CF CF CF CF CF DN DN DN DN DN EB EB EB EB ED ED 2,200 pF 222 F G J K M CF CF CF CF CF DN DN DN DN DN EB EB EB EB EE EE 2,400 pF 242 F G J K M CF CF CF CF CF DN DN DN DN DN EB EB EB EB EC EC 2,700 pF 272 F G J K M CF CF CF CF CF DN DN DN DN DN EB EB EB EB EC EC 3,000 pF 302 F G J K M CF CF CF CF CF DP DP DP DP DN EC EC EC EC EC 3,300 pF 332 F G J K M CF CF CF CF CF DP DP DP DP DN EC EC EC EC EE 3,600 pF 362 F G J K M CF CF CF CF CF DP DP DP DP DN EC EC EC EC EE 3,900 pF 392 F G J K M CF CF CF CF CF DE DE DE DE DN EC EC EC EC EF 4,300 pF 432 F G J K M CF CF CF CF CF DE DE DE DE DN EC EC EC EC EC 4,700 pF 472 F G J K M CF CF CF CF CF DE DE DE DE DN EC EC EC EC EC 5,100 pF 512 F G J K M CF CF CF CF DE DE DE DE DN ED ED ED ED ED 5,600 pF 562 F G J K M CF CF CF CF DN DN DN DN DN ED ED ED ED ED 6,200 pF 622 F G J K M CF CF CF CF DN DN DN DN DN EB EB EB EB EB 6,800 pF 682 F G J K M CF CF CF CF DN DN DN DN DN EB EB EB EB EB 7,500 pF 752 F G J K M CF CF CF DN DN DN DN DN EB EB EB EB EB 8,200 pF 822 F G J K M CF CF CF DN DN DN DN DN EC EC EC EC EB 9,100 pF 912 F G J K M CF CF CF DN DN DN DN DN EC EC EC EC EB 10,000 pF 103 F G J K M CF CF CF DN DN DN DN DP ED ED ED ED EB 12,000 pF 123 F G J K M DN DN DN DN DE EB EB EB EB EB 15,000 pF 153 F G J K M DN DN DN DP DG EB EB EB EB EB 18,000 pF 183 F G J K M DN DN DN DP EB EB EB EB EB 22,000 pF 223 F G J K M DP DP DP DF EB EB EB EB EC 27,000 pF 273 F G J K M DF DF DF EB EB EB EB EE 33,000 pF 333 F G J K M DG DG DG EB EB EB EB EE 39,000 pF 393 F G J K M DG DG DG EC EC EC EE EH 47,000 pF 473 F G J K M DG DG DG EC EC EC EE EH 56,000 pF 563 F G J K M ED ED ED EF 68,000 pF 683 F G J K M EF EF EF EH 82,000 pF 823 F G J K M EH EH EH EH 0.10 µF 104 F G J K M EH EH EH Rated Voltage (VDC) 10 16 25 50 100 10 16 25 50 100 200 10 16 25 50 100 200 10 16 25 50 100 200 Capacitance Cap Code Voltage Code 8 4 3 5 1 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 Case Size / Series C0402H C0603H C0805H C1206H *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) Case Size / Series C1210H C1812H C2220H Cap Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 Capacitance Code Rated Voltage (VDC) 10 16 25 50 100 200 10 16 25 50 100 200 10 16 25 50 100 200 Product Availability and Chip Thickness Codes Capacitance Tolerance See Table 2 for Chip Thickness Dimensions 0.5 & 0.75 pF 508 & 758 B C D 1.0 - 9.1 pF* 109 - 919* B C D FB FB FB FB FB FB 10 - 91 pF* 100 - 910* F G J K M FB FB FB FB FB FB 100 - 910 pF* 101 - 911* F G J K M FB FB FB FB FB FB 1,000 pF 102 F G J K M FB FB FB FB FB FB 1,100 pF 112 F G J K M FB FB FB FB FB FB 1,200 pF 122 F G J K M FB FB FB FB FB FB 1,300 pF 132 F G J K M FB FB FB FB FB FC 1,500 pF 152 F G J K M FB FB FB FB FB FE 1,600 pF 162 F G J K M FB FB FB FB FB FE 1,800 pF 182 F G J K M FB FB FB FB FB FE 2,000 pF 202 F G J K M FB FB FB FB FC FE 2,200 pF 222 F G J K M FB FB FB FB FC FG 2,400 pF 242 F G J K M FB FB FB FB FC FC 2,700 pF 272 F G J K M FB FB FB FB FC FC 3,000 pF 302 F G J K M FB FB FB FB FC FF 3,300 pF 332 F G J K M FB FB FB FB FF FF 3,600 pF 362 F G J K M FB FB FB FB FF FF 3,900 pF 392 F G J K M FB FB FB FB FF FF 4,300 pF 432 F G J K M FB FB FB FB FF FF 4,700 pF 472 F G J K M FF FF FF FF FG FG 5,100 pF 512 F G J K M FB FB FB FB FG FG 5,600 pF 562 F G J K M FB FB FB FB FG FG 6,200 pF 622 F G J K M FB FB FB FB FG 6,800 pF 682 F G J K M FB FB FB FB FG 7,500 pF 752 F G J K M FC FC FC FC FC 8,200 pF 822 F G J K M FC FC FC FC FC 9,100 pF 912 F G J K M FE FE FE FE FE 10,000 pF 103 F G J K M FF FF FF FF FF 12,000 pF 123 F G J K M FG FG FG FG FB 15,000 pF 153 F G J K M FG FG FG FG FB GB GB GB GB GB 18,000 pF 183 F G J K M FB FB FB FB FB GB GB GB GB GB 22,000 pF 223 F G J K M FB FB FB FB FB GB GB GB GB GB 27,000 pF 273 F G J K M FB FB FB FB FB GB GB GB GB GB 33,000 pF 333 F G J K M FB FB FB FB FB GB GB GB GB GB 39,000 pF 393 F G J K M FB FB FB FB FE GB GB GB GB GB 47,000 pF 473 F G J K M FB FB FB FB FE GB GB GB GB GB 56,000 pF 563 F G J K M FB FB FB FB FF GB GB GB GB GB 68,000 pF 683 F G J K M FB FB FB FC FG GB GB GB GB GB 82,000 pF 823 F G J K M FC FC FC FF FH GB GB GB GB GB 0.10 µF 104 F G J K M FE FE FE FG FM GB GB GB GB GD 0.12 µF 124 F G J K M FG FG FG FH GB GB GB GB GH 0.15 µF 154 F G J K M FH FH FH FM GD GD GD GD GN 0.18 µF 184 F G J K M GH GH GH GH 0.22 µF 224 F G J K M GK GK GK GK 0.47 µF 474 F G J K M JJ JJ JJ JJ Rated Voltage (VDC) 10 16 25 50 100 200 10 16 25 50 100 200 10 16 25 50 100 200 Capacitance Cap Code Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 Case Size / Series C1210H C1812H C2220H *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Thickness Case Thickness ± Paper Quantity1 Plastic Quantity Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel BB 0402 0.50±0.05 10,000 50,000 0 0 CF 0603 0.80±0.07 4,000 15,000 0 0 DN 0805 0.78±0.10 4,000 15,000 0 0 DP 0805 0.90±0.10 4,000 15,000 0 0 DE 0805 1.00±0.10 0 0 2,500 10,000 DF 0805 1.10±0.10 0 0 2,500 10,000 DG 0805 1.25±0.15 0 0 2,500 10,000 EB 1206 0.78±0.10 4,000 10,000 4,000 10,000 EC 1206 0.90±0.10 0 0 4,000 10,000 ED 1206 1.00±0.10 0 0 2,500 10,000 EE 1206 1.10±0.10 0 0 2,500 10,000 EF 1206 1.20±0.15 0 0 2,500 10,000 EH 1206 1.60±0.20 0 0 2,000 8,000 FB 1210 0.78±0.10 0 0 4,000 10,000 FC 1210 0.90±0.10 0 0 4,000 10,000 FE 1210 1.00±0.10 0 0 2,500 10,000 FF 1210 1.10±0.10 0 0 2,500 10,000 FG 1210 1.25±0.15 0 0 2,500 10,000 FH 1210 1.55±0.15 0 0 2,000 8,000 FM 1210 1.70±0.20 0 0 2,000 8,000 GB 1812 1.00±0.10 0 0 1,000 4,000 GD 1812 1.25±0.15 0 0 1,000 4,000 GH 1812 1.40±0.15 0 0 1,000 4,000 GK 1812 1.60±0.20 0 0 1,000 4,000 GN 1812 1.70±0.20 0 0 1,000 4,000 JJ 2220 2.20±0.15 0 0 500 2,000 7" Reel 13" Reel 7" Reel 13" Reel Thickness Case Thickness ± Code Size1 Range (mm) Paper Quantity1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2mm pitch option see “Tape & Reel Packaging Information”. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 2B – Bulk Packaging Quantities Loose Packaging Secure Packaging Packaging Type 2” x 2” Waffle Pack/ Bulk Bag (default) Tray3 Packaging C-Spec1 N/A2 7282/7292 Case Size Chip Thickness Packaging Quantities (pieces/unit packaging) (mm) EIA (in) Metric (mm) Minimum Maximum Minimum Maximum 0402 1005 368 0603 1608 All 368 0805 2012 100 50,000 1206 3216 ≤ 1.25 (nominal) 126 1206 3216 > 1.25 (nominal) 50 1210 3225 1 1 80 1808 4520 50 1812 4532 42 All 1825 4564 20,000 20 2220 5650 20 2225 5664 20 1 The "Packaging C-Spec" is a 4-digit code which identifies the packaging type. When ordering, the proper code must be included in the 15th through 18th character positions of the ordering code. See "Ordering Information" section of this document for further details. Product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. 2 A packaging C-Spec (see note 1 above) is not required For "Bulk Bag" packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. 3 Also commonly referred to as “Chip Carrier” or “Molded Tray”. All tray packaging options offer static protection. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 Density Level A: Density Level B: Density Level C: EIA Metric Maximum (Most) Median (Nominal) Minimum (Least) Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm) Code Code C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 12101 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 1 Only for capacitance values ≥ 22 µF Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X V2 C C Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish T Profile Feature P Maximum Ramp Up Rate = 3ºC/sec tP SnPb 100% Matte Sn Maximum Ramp Down Rate = 6ºC/sec T Preheat/Soak e L tL r Temperature Minimum (TSmin) 100°C 150°C ratu Tsmax Temperature Maximum (T ) 150°C 200°C e Smax mp T Time (t) from T to T 60 – 120 seconds 60 – 120 seconds e smin t S Smin Smax T s 3°C/second 3°C/second Ramp-Up Rate (T to T ) L P maximum maximum Liquidous Temperature (T) 183°C 217°C 25 L 25ºC to Peak Time Above Liquidous (t) 60 – 150 seconds 60 – 150 seconds Time L Peak Temperature (T ) 235°C 260°C P Time Within 5°C of Maximum 20 seconds 30 seconds Peak Temperature (t ) maximum maximum P 6°C/second 6°C/second Ramp-Down Rate (T to T) P L maximum maximum Time 25°C to Peak 6 minutes 8 minutes Temperature maximum maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Product Qualification Test Plan Reliability/Environmental Tests per MIL–STD–202//JESD22 High Temperature Life 200°C rated voltage 1,000 hours Load Humidity 85°C/85%RH rated voltage 1,000 hours Low Voltage Humidity 85°C/85%RH, 1.5 V, 1,000 hours Temperature Cycling −55°C to +200°C, 50 Cycles Thermal Shock −55°C to +150°C, 20 seconds transfer, 15 minute dwell, 300 cycles Moisture Resistance Cycled Temp/RH 0 V, 10 cycles at 24 hours each Physical, Mechanical & Process Tests per MIL–STD 202/JIS–C–6429 Resistance to Solvents Include Aqueous wash chemical, OKEM Clean or equivalent Mechanical Shock and Vibration Method 213: Figure 1, Condition F Method 204: 5 gs for 20 minutes 12 cycles Resistance to Soldering Heat Condition B, no per-heat of samples, Single Wave Solder Terminal Strength Force of 1.8 kg for 60 seconds Board Flex Appendix 2, Note: 3.0 mm (minimum) Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within the time frame outlined in the table below: Termination Finish Termination Finish Ordering Code1 Storage Life 100% Matte Tin (Sn) C 1.5 years upon receipt SnPb (5% Pb min.) L 1.5 years upon receipt Gold (Au) 1.97 – 11.8 µin2 E 6 months upon receipt2 Gold (Au) 30 – 50 µin F 1.5 years upon receipt Gold (Au) 100 µin min. G 1.5 years upon receipt 1 The fourteenth (14th) character position of the KEMET part number is assigned to identify and/or define the termination finish. For more information, see “Ordering Information” section of this document. 2 Gold plating option “E” devices should remain in its factory sealed moisture sensitive packaging during storage. If the factory sealed packaging is disturbed please store any remaining packaged components in a dry box container to prevent oxidation of the termination finish. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Construction Detailed Cross Section Termination Finish: Dielectric Material C = 100% Matte Sn (CaZrO) L = SnPb - 5% Pb min 3 E = Gold (Au) 1.97 - 11.8 µin Dielectric F = Gold (Au) 30 - 50 µin Material (CaZrO) G = Gold (Au) 100 µin min 3 Barrier Layer End Termination/ (Ni) External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (See options at left) Inner Electrodes (Ni) Capacitor Marking (Optional): Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel KEMET ® EPmunbcohsesde dP aPplaesr tCica*r roier r. Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm Anti-Static Cover Tape or 16 mm Carrier Tape 178 mm (7.00") (.10 mm (.004") Maximum Thickness) or 330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm) New 2 mm Pitch Reel Options* Embossed Plastic Punched Paper Tape Packaging EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Ordering Code Packaging Type/Options (W)* Pitch (P)* Pitch (P)* 1 1 (C-Spec) 01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked 0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked C-7081 Commercial grade 7" reel unmarked 0805 8 4 4 4 4 C-7082 Commercial grade 13" reel unmarked 1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size. 1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development. ≥ 1812 12 8 8 Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing KPS 1210 12 8 8 • Lower placement costs • Double the parts on each reel results in fewer reel KPS 1812 & 2220 16 12 12 changes and increased effi ciency Array 0508 & 0612 8 4 4 • Fewer reels result in lower packaging, shipping and *Refer to Figures 1 & 2 for W and P carrier tape reference locations. storage costs, reducing waste 1 *Refer to Tables 6 & 7 for tolerance specifi cations. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions T P2 T2 ØDo Po [10 pitches cumulative E1 tolerance on tape ± 0.2 mm] Ao F Ko W B1 Bo E2 S1 P1 T1 Center Lines of Cavity ØD1 FEomrb coasvsitmy esnizte, Cover Tape see Note 1 Table 4 B1 is for tape feeder reference only, including draft concentric about B o. User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) D Minimum R ReferenceS Minimum T T Tape Size D 1 E P P 1 1 0 Note 1 1 0 2 Note 2 Note 3 Maximum Maximum 1.0 25.0 8 mm (0.039) (0.984) 1.5+0.10 −0.0 1.75±0.10 4.0±0.10 2.0±0.05 0.600 0.600 0.100 12 mm (0.059+0.004 −0.0) (0.069±0.004) (0.157±0.004) (0.079±0.002) (0.024) (0.024) (0.004) 1.5 30 (0.059) (1.181) 16 mm Variable Dimensions — Millimeters (Inches) B Maximum E T W Tape Size Pitch 1 2 F P 2 A,B & K Note 4 Minimum 1 Maximum Maximum 0 0 0 4.35 6.25 3.5±0.05 4.0±0.10 2.5 8.3 8 mm Single (4 mm) (0.171) (0.246) (0.138±0.002) (0.157±0.004) (0.098) (0.327) Single (4 mm) & 8.2 10.25 5.5±0.05 8.0±0.10 4.6 12.3 12 mm Note 5 Double (8 mm) (0.323) (0.404) (0.217±0.002) (0.315±0.004) (0.181) (0.484) 12.1 14.25 7.5±0.05 12.0±0.10 4.6 16.3 16 mm Triple (12 mm) (0.476) (0.561) (0.138±0.002) (0.157±0.004) (0.181) (0.642) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 1 4. B dimension is a reference dimension for tape feeder clearance only. 1 5. The cavity defi ned by A, B and K shall surround the component with suffi cient clearance that: 0 0 0 (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (See Figure 4). (e) for KPS Series product, A and B are measured on a plane 0.3 mm above the bottom of the pocket. 0 0 (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T ØDo Po t[o1l0e rpaitncchee os nc utampuel a±t 0iv.e2 mm] E1 A0 F W B0 E2 Bottom Cover Tape P1 G T1 Cavity Size, T1 Top Cover Tape Center Lines of Cavity SNeoete 1, Table 7 Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) R Reference Tape Size D E P P T Maximum G Minimum 0 1 0 2 1 Note 2 0.10 1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.75 25 8 mm (0.004) (0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.030) (0.984) Maximum Variable Dimensions — Millimeters (Inches) Tape Size Pitch E2 Minimum F P T Maximum W Maximum A B 1 0 0 2.0 ±0.05 8.3 8 mm Half (2 mm) 6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327) Note 1 (0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3 8 mm Single (4 mm) (0.157 ±0.004) (0.327) 1. The cavity defi ned by A, B and T shall surround the component with suffi cient clearance that: 0 0 a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Maximum Component Rotation Top View Side View Typical Pocket Centerline Tape Maximum ° Width (mm) Rotation ( °) s T 8,12 20 Bo Tape Maximum 16 – 200 10 Width (mm) Rotation ( °) S 8,12 20 Typical Component Centerline 16 – 56 10 72 – 200 5 Ao Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius 8 mm & 12 mm Tape 16 mm Tape Embossed Punched Carrier Carrier 0.5 mm maximum 1.0 mm maximum 0.5 mm maximum 1.0 mm maximum Bending R R Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Figure 6 – Reel Dimensions W3 Full Radius, (Includes Access Hole at See Note Slot Location flange distortion (Ø 40 mm minimum) at outer edge) W2 (Measured at hub) A D (See Note) N C (Arbor hole W1 (Measured at hub) diameter) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth B (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) 1.5 13.0 +0.5/-0.2 20.2 12 mm or (0.059) (0.521 +0.02/-0.008) (0.795) 330 ±0.20 16 mm (13.000 ±0.008) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W W Maximum W 1 2 3 8.4 +1.5/-0.0 14.4 8 mm (0.331 +0.059/-0.0) (0.567) 50 12.4 +2.0/-0.0 18.4 Shall accommodate tape 12 mm (1.969) (0.488 +0.078/-0.0) (0.724) width without interference 16.4 +2.0/-0.0 22.4 16 mm (0.646 +0.078/-0.0) (0.882) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier Carrier Tape 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) 100 mm Minimum Leader Trailer Components 400 mm Minimum 160 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes Carrier Tape (32 mm & wider tapes) Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 20

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Waffl e Tray Packaging Information – 2" x 2" w/ Static Protection Figure 9 – Waffl e Tray Dimensions – Inches (Millimeters) 0.10 (2.54 ) X 45° M M3 M1 Y M2 X X A Z 0.098 (2.489) 0.156 +0.002/-0.003 (3.962 +0.051/-0.076) 0.086 (2.184) 0.004 2.000 ±0.004 SQ 90° (0.102) (50.800 ±0.102 SQ) 1.800 ±0.004 SQ (45.720 ±0.102 SQ) 1.812 ±0.004 SQ (46.025 ±0.102 SQ) STANDARD RIB MATRIX © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 21

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 9A – Waffl e Tray Dimensions – Inches 2" x 2" Waffl e Tray Dimensions – Inches Packaging Quantity Case Size M M1 M2 M3 X Y Z A° MATRIX (pcs/unit EIA (in) Metric (mm) ±0.003 ±0.003 ±0.002 ±0.002 ±0.002 ±0.002 ±0.003 ± 1/2° (X x Y) packaging) 0402 1005 0.175 0.153 0.077 0.110 0.073 0.042 0.041 7 16 X 23 368 0504 1210 0.235 0.226 0.172 0.170 0.080 0.090 0.055 5 10 X 10 100 0603 1608 0.175 0.153 0.077 0.110 0.073 0.042 0.041 7 16 X 23 368 0805 2012 0.232 0.186 0.181 0.171 0.062 0.092 0.036 10 10 X 10 100 1005 2512 0.230 0.240 0.190 0.140 0.060 0.110 0.075 5 12 X 9 108 12061,2 3216 0.194 0.228 0.193 0.124 0.067 0.130 0.065 5 14 X 9 126 12061,3 3216 0.250 0.250 0.375 0.167 0.100 0.200 0.070 5 10 X 5 50 1210 3225 0.217 0.244 0.215 0.174 0.110 0.145 0.080 5 10 X 8 80 1808 4520 0.271 0.285 0.286 0.243 0.150 0.200 0.075 5 7 X 6 42 1812 4532 0.271 0.285 0.286 0.243 0.150 0.200 0.075 5 7 X 6 42 1825 4564 0.318 0.362 0.424 0.34 0.24 0.32 0.032 5 5 X 4 20 2220 5650 0.318 0.362 0.424 0.34 0.24 0.32 0.032 5 5 X 4 20 2225 5664 0.318 0.362 0.424 0.34 0.24 0.32 0.032 5 5 X 4 20 1 Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall" and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor. 2 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches). 3 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches). Table 9B – Waffl e Tray Dimensions – Millimeters 2" x 2" Waffl e Tray Dimensions – Millimeters Packaging Quantity Case Size M M1 M2 M3 X Y Z A° MATRIX (pcs/unit EIA (in) Metric (mm) ±0.08 ±0.08 ±0.05 ±0.05 ±0.05 ±0.05 ±0.08 ± 1/2° (X x Y) packaging) 0402 1005 4.45 3.89 1.96 2.79 1.85 1.07 1.04 7 16 X 23 368 0504 1210 5.97 5.74 4.37 4.32 2.03 2.29 1.40 5 10 X 10 100 0603 1608 4.45 3.89 1.96 2.79 1.85 1.07 1.04 7 16 X 23 368 0805 2012 5.89 4.72 4.60 4.34 1.57 2.34 0.91 10 10 X 10 100 1005 2512 5.84 6.10 4.83 3.56 1.52 2.79 1.91 5 12 X 9 108 12061,2 3216 4.93 5.79 4.90 3.15 1.70 3.30 1.65 5 14 X 9 126 12061,3 3216 6.35 6.35 9.53 4.24 2.54 5.08 1.78 5 10 X 5 50 1210 3225 5.51 6.20 5.46 4.42 2.79 3.68 2.03 5 10 X 8 80 1808 4520 6.88 7.24 7.26 6.17 3.81 5.08 1.91 5 7 X 6 42 1812 4532 6.88 7.24 7.26 6.17 3.81 5.08 1.91 5 7 X 6 42 1825 4564 8.08 9.19 10.77 8.64 6.10 8.13 0.81 5 5 X 4 20 2220 5650 8.08 9.19 10.77 8.64 6.10 8.13 0.81 5 5 X 4 20 2225 5664 8.08 9.19 10.77 8.64 6.10 8.13 0.81 5 5 X 4 20 1 Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall" and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor. 2 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches). 3 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 22

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) KEMET Electronic Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 23

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: K EMET: C0603H103J3GACT500 C0805H103J1GACT500 C0805H103J5GACT500 C0805H333J4GACT500 C1206H473J5GACT500 C1206H103J1GACT500 C1206H103J5GACT500 C1206H104J3GACT500 C1206H473J1GACT500 C1210H104J1GACT500 C1210H104J5GACTU C1812H104J1GACT500 C1812H104J5GACT500 C1812H224J5GACT500 C0805H561J3GACTU C0805H223J3GACTU C0805H330J5GALT500 C0805H220J5GALT500 C0805H103K3GALT500 C0805H150J5GALT500 C0805H822K5GALT500 C1206H821J1GACTU C0805H103J5GACTU C0805H220J5GACTU C0805H102J5GACTU C0805H103J3GACTU C0603H152J5GACTU C0603H180J5GACTU C0603H181J5GACTU C0603H330J5GACTU C0603H272J5GACTU C0603H222J5GACTU C0603H121J5GACTU C0603H100J5GACTU C0603H472F1GACTU C0603H102J1GACTU C0603H332J5GACTU C0603H101J5GACTU C0603H331J5GACTU C0603H821J5GACTU C0603H820J5GACTU C0603H751J5GACTU C0603H680J5GACTU C0603H621J5GACTU C0603H560J5GACTU C0603H472J1GACTU C0603H390J5GACTU C0805H101K5GACTU C0805H101G5GACTU C0805H100K5GACTU C0805H100J1GACTU C0805H102J1GACTU C0805H470J3GACTU C0805H682J3GACTU C0805H821J3GACTU C0805H822K5GALTU C0805H472J1GACTU C0805H221J3GACTU C0805H102K3GALTU C0805H103K3GACTU C0805H103K3GALTU C0805H121J5GACTU C0805H122J3GACTU C0805H123J3GACTU C0805H150J5GALTU C0805H152J5GACTU C0805H180J5GACTU C0805H680J3GACTU C0805H220J5GALTU C0805H621J3GACTU C0805H222J1GACTU C0805H222K5GALTU C0805H223J5GACTU C0805H272J1GACTU C0805H330J3GACTU C0805H330J5GALTU C0805H471J1GACTU C0805H471J3GACTU C0805H102J3GACTU C0805H200J1GACTU C1206H103K3GACTU C1206H120J5GACTU C1206H122J1GACTU C1206H122J5GACTU C1206H123J5GACTU C1206H151J1GACTU C1206H151J5GACTU C1206H180J5GACTU C1206H202G5GACTU C1206H183J5GACTU C1206H183J1GACTU C1206H182J5GACTU C1206H182J1GACTU C1206H181J5GACTU C1206H153J5GACTU C1206H100J5GACTU C1206H101J1GACTU C1206H101J5GACTU C1206H829J5GACTU C1206H102J5GACTU