Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial & Automotive Grade) Overview KEMET’s Floating Electrode with Flexible Termination The FF-CAP complements KEMET’s Open Mode, Floating capacitor (FF-CAP) combines two existing KEMET Electrode (FE-CAP), Flexible Termination (FT-CAP) and KEMET technologies– Floating Electrode and Flexible Termination. Power Solutions (KPS) product lines by providing an ultimate The floating electrode component utilizes a cascading fail-safe design optimized for low to mid range capacitance internal electrode design configured to form multiple values. These devices exhibit a predictable change in capacitors in series within a single monolithic structure. capacitance with respect to time and voltage and boast a This unique configuration results in enhanced voltage and minimal change in capacitance with reference to ambient ESD performance over standard capacitor designs while temperature. Capacitance change is limited to ±15% from allowing for a fail-open condition if mechanically damaged −55°C to +125°C. (cracked). The flexible termination component utilizes a conductive silver epoxy between the base metal and nickel In addition to Commercial Grade, Automotive Grade devices barrier layers of KEMET’s standard termination system are available which meet the demanding Automotive in order to establish pliability while maintaining terminal Electronics Council's AEC–Q200 qualification requirements. strength, solderability and electrical performance. Both technologies address the primary failure mode of MLCCs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Although neither technology can eliminate the potential for mechanical damage that may propagate during extreme environmental and/or handling conditions, the combination of these two technologies provide the ultimate level of protection against a low IR or short circuit condition. Ordering Information C 0805 Y 104 K 5 R A C TU Case Size Specification/ Capacitance Capacitance Rated Voltage Failure Rate/ Packaging/ Ceramic Dielectric Termination Finish1 (L" x W") Series Code (pF) Tolerance (VDC) Design Grade (C-Spec) 0603 Y = Floating Two significant J = ±5% 9 = 6.3 R = X7R A = N/A C = 100% Matte Sn See 0805 Electrode digits and K = ±10% 8 = 10 L = SnPb (5% Pb "Packaging 1206 with number of M = ±20% 4 = 16 minimum) C-Spec 1210 Flexible zeros 3 = 25 Ordering 1812 Termination 5 = 50 Options 1 = 100 Table" 2 = 200 A = 250 1 Additional termination finish options may be available. Contact KEMET for details. 1 SnPb termination finish option is not available on automotive grade product. One world. One KEMET © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 1 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Packaging Type Ordering Code (C-Spec) Commercial Grade1 Bulk Bag Not Required (Blank) 7" Reel/Unmarked TU 7411 (EIA 0603 and smaller case sizes) 13" Reel/Unmarked 7210 (EIA 0805 and larger case sizes) 7" Reel/Marked TM 7040 (EIA 0603) 13" Reel/Marked 7215 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2 mm pitch2 7081 13" Reel/Unmarked/2 mm pitch2 7082 Automotive Grade3 7" Reel AUTO AUTO7411 (EIA 0603 and smaller case sizes) 13" Reel/Unmarked AUTO7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2 mm pitch2 3190 13" Reel/Unmarked/2 mm pitch2 3191 1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging. 1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information". 3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information". 3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". 3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking". Benefits • −55°C to +125°C operating temperature range • Capacitance offerings ranging from 180 pF to 0.22 μF • Superior flex performance (up to 5 mm) • Available capacitance tolerances of ±5%, ±10%, and ±20% • Floating Electrode/fail open design • Commercial and Automotive (AEC–Q200) grades available • Low to mid capacitance flex mitigation • Non-polar device, minimizing installation concerns • Lead (Pb)-free, RoHS and REACH compliant • 100% pure matte tin-plated termination finish allowing for • EIA 0603, 0805, 1206, 1210, and 1812 case sizes excellent solderability • DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V, • SnPb termination finish option available upon request 200 V, and 250 V (5% Pb minimum) Applications Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature cycling. Examples include raw power input side filtering (power plane/bus), high current applications (automobile battery line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive, aerospace and telecom. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 2 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notifi cation (PCN) The KEMET product change notifi cation system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fi t, function, and/or reliability • Changes in manufacturing site • Product obsolescence KEMET Automotive Customer Notifi cation Due To: Days Prior To C-Spec Implementation Process/Product change Obsolescence* KEMET assigned1 Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specifi cation requirements are properly understood and fulfi lled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. KEMET Automotive PPAP (Product Part Approval Process) Level C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO ○ 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. ● Part number specifi c PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 3 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) W L T B S S EIA Size Metric Size L W T B Mounting Separation Code Code Length Width Thickness Bandwidth Technique Minimum 1.60 (0.063) 0.80 (0.032) 0.45 (0.018) 0603 1608 0.58 (0.023) ±0.17 (0.007) ±0.15 (0.006) ±0.15 (0.006) 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) Solder Wave or 0805 2012 0.75 (0.030) ±0.30 (0.012) ±0.30 (0.012) ±0.25 (0.010) Solder Reflow 3.30 (0.130) 1.60 (0.063) See Table 2 for 0.60 (0.024) 1206 3216 ±0.40 (0.016) ±0.35 (0.013) Thickness ±0.25 (0.010) 3.30 (0.130) 2.60 (0.102) 0.60 (0.024) 1210 3225 N/A ±0.40 (0.016) ±0.30 (0.012) ±0.25 (0.010) Solder Reflow 4.50 (0.178) 3.20 (0.126) 0.70 (0.028) Only 1812 4532 ±0.40 (0.016) ±0.30 (0.012) ±0.35 (0.014) Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 4 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to ±15% +25°C and 0 Vdc Applied (TCC) 1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% 250% of rated voltage 2Dielectric Withstanding Voltage (DWV) (5±1 seconds and charge/discharge not exceeding 50mA) 3Dissipation Factor (DF) Maximum Limit at 25°C 5%(6.3V & 10V), 3.5%(16V & 25V) and 2.5%(50V to 250V) See Insulation Resistance Limit Table 4Insulation Resistance (IR) Minimum Limit at 25°C (Rated voltage applied for 120±5 seconds at 25°C) 1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. 2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 3 Capacitance and dissipation factor (DF) measured under the following conditions: 1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF 120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF 4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON". Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Rated DC Capacitance Dissipation Factor Capacitance Insulation Dielectric Voltage Value (Maximum %) Shift Resistance > 25 3.0 10% of Initial X7R 16/25 All 5.0 ±20% Limit < 16 7.5 Insulation Resistance Limit Table (X7R Dielectric) 1,000 Megohm 500 Megohm EIA Case Size Microfarads or 100 GΩ Microfarads or 10 GΩ 0201 N/A ALL 0402 < 0.012 µF ≥ 0.012 µF 0603 < 0.047 µF ≥ 0.047 µF 0805 < 0.15 µF ≥ 0.15 µF 1206 < 0.47 µF ≥ 0.47 µF 1210 < 0.39 µF ≥ 0.39 µF 1808 ALL N/A 1812 < 2.2 µF ≥ 2.2 µF 1825 ALL N/A 2220 < 10 µF ≥ 10 µF 2225 ALL N/A © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 5 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 0805 Case Sizes) Case Size/ C0603Y C0805Y Series Capacitance Voltage Code 9 8 4 3 5 1 2 9 8 4 3 5 1 2 A Capacitance Code Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 250 Capacitance Product Availability and Chip Thickness Codes Tolerance See Table 2 for Chip Thickness Dimensions 180 pF 181 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 220 pF 221 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 270 pF 271 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 330 pF 331 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 390 pF 391 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 470 pF 471 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 560 pF 561 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 680 pF 681 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 820 pF 821 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 1,000 pF 102 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 1,200 pF 122 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 1,500 pF 152 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 1,800 pF 182 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 2,200 pF 222 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 2,700 pF 272 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 3,300 pF 332 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 3,900 pF 392 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 4,700 pF 472 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 5,600 pF 562 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 6,800 pF 682 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 8,200 pF 822 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 10,000 pF 103 J K M CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 12,000 pF 123 J K M CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 15,000 pF 153 J K M CJ CJ CJ CJ CJ DR DR DR DR DR DD 18,000 pF 183 J K M CJ CJ CJ CJ CJ DR DR DR DR DR DD 22,000 pF 223 J K M CJ CJ CJ CJ CJ DR DR DR DR DR DD 27,000 pF 273 J K M DR DR DR DR DR 33,000 pF 333 J K M DR DR DR DR DR 39,000 pF 393 J K M DR DR DR DR DR 47,000 pF 473 J K M DR DR DR DR DR 56,000 pF 563 J K M DD DD DD DD DD 68,000 pF 683 J K M DD DD DD DD DD 82,000 pF 823 J K M DG DG DG DG DG 0.10 µF 104 J K M DG DG DG DG DG Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 250 Capacitance Capacitance Code Voltage Code 9 8 4 3 5 1 2 9 8 4 3 5 1 2 A Case Size/Series C0603Y C0805Y © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 6 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Table 1B – Capacitance Range/Selection Waterfall (1206 – 1812 Case Sizes) Case Size/ C1206Y C1210Y C1812Y Series Cap Voltage Code 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 3 5 1 2 A Capacitance Code Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 25 50 100 200 250 Capacitance Product Availability and Chip Thickness Codes Tolerance See Table 2 for Chip Thickness Dimensions 1,000 pF 102 J K M EQ EQ EQ EQ EQ EQ EQ EQ 1,200 pF 122 J K M EQ EQ EQ EQ EQ EQ EQ EQ 1,500 pF 152 J K M EQ EQ EQ EQ EQ EQ EQ EQ 1,800 pF 182 J K M EQ EQ EQ EQ EQ EQ EQ EQ 2,200 pF 222 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 2,700 pF 272 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 3,300 pF 332 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 3,900 pF 392 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 4,700 pF 472 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 5,600 pF 562 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 6,800 pF 682 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN GB GB GB GB GB 8,200 pF 822 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN GB GB GB GB GB 10,000 pF 103 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN GB GB GB GB GB 12,000 pF 123 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN GB GB GB GB GB 15,000 pF 153 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN GB GB GB GB GB 18,000 pF 183 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN GB GB GB GB GB 22,000 pF 223 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN GB GB GB GB GB 27,000 pF 273 J K M EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN GB GB GB GB GB 33,000 pF 333 J K M EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN GB GB GB GB GB 39,000 pF 393 J K M EQ EQ EQ EQ EQ ER FN FN FN FN FN FN FN FN GB GB GB GB GB 47,000 pF 473 J K M EQ EQ EQ EQ EQ ER FN FN FN FN FN FN FQ FQ GB GB GB GB GB 56,000 pF 563 J K M EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FQ FQ GB GB GB GB GB 68,000 pF 683 J K M EQ EQ EQ EQ EQ FN FN FN FN FN FN GB GB GB GB GB 82,000 pF 823 J K M EQ EQ EQ EQ EQ FN FN FN FN FN FQ GB GB GB GB GB 0.10 µF 104 J K M EQ EQ EQ EQ EQ FN FN FN FN FN FX GB GB GB GB GB 0.12 µF 124 J K M ER ER ER ER ER FN FN FN FN FN GB GB GB GB GB 0.15 µF 154 J K M FQ FQ FQ FQ FQ GB GB GB GB GB 0.18 µF 184 J K M FQ FQ FQ FQ FQ GB GB GB GB GB 0.22 µF 224 J K M FQ FQ FQ FQ FQ GB GB GB GB GB Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 25 50 100 200 250 Capacitance Cap Code Voltage Code 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 3 5 1 2 A Case Size/ C1206Y C1210Y C1812Y Series © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 7 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Thickness Case Thickness ± Paper Quantity1 Plastic Quantity Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel CJ 0603 0.80 ± 0.15 4,000 15,000 0 0 DR 0805 0.78 ± 0.20 0 0 4,000 10,000 DD 0805 0.90 ± 0.10 0 0 4,000 10,000 DG 0805 1.25 ± 0.15 0 0 2,500 10,000 EQ 1206 0.78 ± 0.20 4,000 10,000 4,000 10,000 ER 1206 0.90 ± 0.20 0 0 4,000 10,000 FN 1210 0.78 ± 0.20 0 0 4,000 10,000 FQ 1210 0.90 ± 0.20 0 0 4,000 10,000 FX 1210 0.95 ± 0.20 0 0 4,000 10,000 GB 1812 1.00 ± 0.10 0 0 1,000 4,000 7" Reel 13" Reel 7" Reel 13" Reel Thickness Case Thickness ± Code Size1 Range (mm) Paper Quantity1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information". Table 2B – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec1 N/A2 Case Size Packaging Quantities (pieces/unit packaging) EIA (in) Metric (mm) Minimum Maximum 0402 1005 0603 1608 0805 2012 50,000 1206 3216 1210 3225 1 1808 4520 1812 4532 1825 4564 20,000 2220 5650 2225 5664 1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products. 2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 8 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 Density Level A: Density Level B: Density Level C: EIA Metric Maximum (Most) Median (Nominal) Minimum (Least) Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm) Code Code C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20 0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81 1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16 1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11 1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X V2 C C Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 9 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish T Profile Feature P Maximum Ramp-up Rate = 3°C/second tP SnPb 100% Matte Sn Maximum Ramp-down Rate = 6°C/second T Preheat/Soak e L tL r Temperature Minimum (TSmin) 100°C 150°C ratu Tsmax Temperature Maximum (T ) 150°C 200°C e Smax mp T Time (t) from T to T 60 – 120 seconds 60 – 120 seconds e smin t S Smin Smax T s 3°C/second 3°C/second Ramp-Up Rate (T to T ) L P maximum maximum Liquidous Temperature (TL) 183°C 217°C 25 25°C to Peak Time Above Liquidous (t) 60 – 150 seconds 60 – 150 seconds Time L Peak Temperature (T ) 235°C 260°C P Time Within 5°C of Maximum 20 seconds 30 seconds Peak Temperature (t ) maximum maximum P 6°C/second 6°C/second Ramp-Down Rate (T to T) P L maximum maximum Time 25°C to Peak 6 minutes 8 minutes Temperature maximum maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 10 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm Board Flex JIS–C–6429 for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X. Conditions: a) Method B, 4 hours at 155°C, dry heat at 235°C Solderability J–STD–002 b) Method B at 215°C category 3 c) Method D, category 3 at 260°C 1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test Temperature Cycling JESD22 Method JA–104 conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. MIL–STD–202 Method Measurement at 24 hours +/− 4 hours after test conclusion. Biased Humidity 103 Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/− 4 hours after test conclusion. MIL–STD–202 Method t = 24 hours/cycle. Steps 7a and 7b not required. Moisture Resistance 106 Measurement at 24 hours +/− 4 hours after test conclusion. MIL–STD–202 Method −55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 Thermal Shock 107 seconds, dwell time – 15 minutes. Air – Air. MIL–STD–202 Method High Temperature Life 108 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied. /EIA–198 MIL–STD–202 Method Storage Life 150°C, 0 VDC for 1,000 hours. 108 5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 MIL–STD–202 Method Vibration secure points on one long side and 2 secure points at corners of opposite sides. Parts 204 mounted within 2" from any secure point. Test from 10 – 2,000 Hz MIL–STD–202 Method Mechanical Shock Figure 1 of Method 213, Condition F. 213 MIL–STD–202 Method Resistance to Solvents Add aqueous wash chemical, OKEM Clean or equivalent. 215 Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 11 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Construction Detailed Cross Section Dielectric Material (BaTiO) 3 Barrier Layer End Termination/ (Ni) External Electrode Termination Finish (Cu) (100% Matte Sn / Epoxy Layer SnPb - 5% Pb min) (Ag) Dielectric Material (BaTiO) 3 Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Termination Finish Inner Electrodes (100% Matte Sn / (Ni) SnPb - 5% Pb min) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 12 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are Marking appears in legible contrast. Illustrated below normally supplied unmarked. If required, they can be is an example of an MLCC with laser marking of “KA8”, marked as an extra cost option. Marking is available which designates a KEMET device with rated capacitance on most KEMET devices, but must be requested using of 100 µF. Orientation of marking is vendor optional. the correct ordering code identifi er(s). If this option is requested, two sides of the ceramic body will be laser marked with a “K” to identify KEMET, followed by two characters (per EIA–198 - see table below) to identify the capacitance value. EIA 0603 case size devices are limited 2-Digit KEMET to the “K” character only. Capacitance ID Code Laser marking option is not available on: • C0G, ultra stable X8R and Y5V dielectric devices. • EIA 0402 case size devices. • EIA 0603 case size devices with fl exible termination option. • KPS commercial and automotive grade stacked devices. • X7R dielectric products in capacitance values outlined below. EIA Case Size Metric Size Code Capacitance 0603 1608 ≤ 170 pF 0805 2012 ≤ 150 pF 1206 3216 ≤ 910 pF 1210 3225 ≤ 2,000 pF 1808 4520 ≤ 3,900 pF 1812 4532 ≤ 6,700 pF 1825 4564 ≤ 0.018 µF 2220 5650 ≤ 0.027 µF 2225 5664 ≤ 0.033 µF © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 13 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Capacitor Marking (Optional) cont. Capacitance (pF) For Various Alpha/Numeral Identifi ers Numeral Alpha 9 0 1 2 3 4 5 6 7 8 Character Capacitance (pF) A 0.10 1.0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000 B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000 C 0.12 1.2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000 D 0.13 1.3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000 E 0.15 1.5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000 F 0.16 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000 G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.20 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 3.3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.50 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.60 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.70 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.90 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 14 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel KEMET ® Epumnbcohsesde pda pplears tciac*rr ioerr . Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm Anti-static cover tape or 16 mm carrier tape 180 mm (7.00") (0.10 mm (0.004") maximum thickness) or 330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm) New 2 mm Pitch Reel Options* Embossed Plastic Punched Paper Tape Packaging EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Ordering Code Packaging Type/Options (W)* Pitch (P)* Pitch (P)* 1 1 (C-Spec) 01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked 0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked C-7081 Commercial grade 7" reel unmarked 0805 8 4 4 4 4 C-7082 Commercial grade 13" reel unmarked 1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size. 1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development. ≥ 1812 12 8 8 Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing KPS 1210 12 8 8 • Lower placement costs. KPS 1812 • Double the parts on each reel results in fewer reel 16 12 12 and 2220 changes and increased effi ciency. Array 0612 8 4 4 • Fewer reels result in lower packaging, shipping and *Refer to Figures 1 and 2 for W and P carrier tape reference locations. storage costs, reducing waste. 1 *Refer to Tables 6 and 7 for tolerance specifi cations. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 15 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions T P 2 T2 ØD0 P0 t(o1l0e rpaintcchee osn c tuampuel a±0ti.v2e mm) E1 A 0 F K 0 W B1 B0 E2 S P 1 1 T1 Center Lines of Cavity ØD Embossment 1 For cavity size, Cover Tape see Note 1 Table 4 B is for tape feeder reference only, 1 including draft concentric about B0. User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) D Minimum R Reference S Minimum T T Tape Size D 1 E P P 1 1 0 Note 1 1 0 2 Note 2 Note 3 Maximum Maximum 1.0 25.0 8 mm (0.039) (0.984) 1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100 12 mm (0.059 +0.004/−0.0) 1.5 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 30 (0.024) (0.024) (0.004) (0.059) (1.181) 16 mm Variable Dimensions — Millimeters (Inches) B Maximum E T W Tape Size Pitch 1 2 F P 2 A,B & K Note 4 Minimum 1 Maximum Maximum 0 0 0 4.35 6.25 3.5 ±0.05 4.0 ±0.10 2.5 8.3 8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098) (0.327) Single (4 mm) 8.2 10.25 5.5 ±0.05 8.0 ±0.10 4.6 12.3 12 mm Note 5 and double (8 mm) (0.323) (0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181) (0.484) 12.1 14.25 7.5 ±0.05 12.0 ±0.10 4.6 16.3 16 mm Triple (12 mm) (0.476) (0.561) (0.138 ±0.002) (0.157 ±0.004) (0.181) (0.642) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independently of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6.) 3. If S < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.) 1 4. B dimension is a reference dimension for tape feeder clearance only. 1 5. The cavity defi ned by A, B and K shall surround the component with suffi cient clearance that: 0 0 0 (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.) (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4.) (e) for KPS product, A and B are measured on a plane 0.3 mm above the bottom of the pocket. 0 0 (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 16 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T ØDo Po t(o1l0e rpaintcchee osn c tuampeu l±a0ti.v2e mm) E1 A 0 F W Bottom Cover Tape B0 E2 P1 G T1 Cavity Size, T1 Top Cover Tape Center Lines of Cavity SNeoete 1, Table 7 Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) R Reference Tape Size D E P P T Maximum G Minimum 0 1 0 2 1 Note 2 0.10 1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.75 25 8 mm (0.004) (0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.030) (0.984) maximum Variable Dimensions — Millimeters (Inches) Tape Size Pitch E2 Minimum F P T Maximum W Maximum A B 1 0 0 2.0 ±0.05 8.3 8 mm Half (2 mm) 6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327) Note 1 (0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3 8 mm Single (4 mm) (0.157 ±0.004) (0.327) 1. The cavity defi ned by A, B and T shall surround the component with suffi cient clearance that: 0 0 a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3.) d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.) e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6.) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 17 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Maximum Component Rotation Top View Side View Typical Pocket Centerline Tape Maximum ° Width (mm) Rotation ( °) s T 8,12 20 Bo Tape Maximum 16 – 200 10 Width (mm) Rotation ( °) S 8,12 20 Typical Component Centerline 16 – 56 10 72 – 200 5 Ao Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius 8 mm & 12 mm Tape 16 mm Tape Embossed Punched Carrier Carrier 0.5 mm maximum 1.0 mm maximum 0.5 mm maximum 1.0 mm maximum Bending R R Radius © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 18 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Figure 6 – Reel Dimensions W Full Radius, (Includes Access Hole at 3 See Note Slot Location flange distortion (Ø 40 mm minimum) at outer edge) W (Measured at hub) 2 A D (See Note) N C (Arbor hole W (Measured at hub) diameter) 1 If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth B (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) 1.5 13.0 +0.5/−0.2 20.2 12 mm or (0.059) (0.521 +0.02/−0.008) (0.795) 330 ±0.20 16 mm (13.000 ±0.008) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W W Maximum W 1 2 3 8.4 +1.5/−0.0 14.4 8 mm (0.331 +0.059/−0.0) (0.567) 50 12.4 +2.0/−0.0 18.4 Shall accommodate tape 12 mm (1.969) (0.488 +0.078/−0.0) (0.724) width without interference 16.4 +2.0/−0.0 22.4 16 mm (0.646 +0.078/−0.0) (0.882) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 19 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier Carrier Tape 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) 100 mm minimum leader Trailer Components 400 mm minimum 160 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes Carrier Tape (32 mm & wider tapes) Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 20 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) KEMET Electronics Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1015_X7R_FF-CAP_SMD • 4/15/2019 21 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com