Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Overview The KEMET Automotive Grade Flexible Termination (FT-CAP) Combined with the stability of an X7R dielectric and designed multilayer ceramic capacitor in X7R dielectric incorporates to accommodate all capacitance requirements, these flex- a unique, flexible termination system that is integrated with robust devices are RoHS-compliant, offer up to 5 mm of KEMET’s standard termination materials. A conductive silver flex-bend capability and exhibit a predictable change in epoxy is utilized between the base metal and nickel barrier capacitance with respect to time and voltage. Capacitance layers of KEMET’s standard termination system in order change with reference to ambient temperature is limited to to establish pliability while maintaining terminal strength, ±15% from −55°C to +125°C. solderability and electrical performance. This technology was developed in order to address the primary failure mode Whether underhood or in-cabin, these capacitors are designed of MLCCs – flex cracks, which are typically the result of to provide reliable performance in a mission and safety of excessive tensile and shear stresses produced during board critical automotive circuits. Stricter testing protocol and flexure and thermal cycling. Flexible termination technology inspection criteria have been established for automotive grade inhibits the transfer of board stress to the rigid ceramic body, products in recognition of potentially harsh environmental therefore mitigating flex cracks which can result in low IR or conditions. KEMET automotive grade series capacitors meet short circuit failures. the demanding Automotive Electronics Council's AEC-Q200 qualification requirements. Although this technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination systems. FT-CAP complements KEMET’s Open Mode, Floating Electrode (FE-CAP), Floating Electrode with Flexible Termination (FF-CAP) and KEMET Power Solutions (KPS) product lines by providing a complete portfolio of flex mitigation solutions. Ordering Information C 1206 X 106 K 4 R A C AUTO Case Size Specification/ Capacitance Capacitance Rated Voltage Failure Rate/ Termination Packaging/ Ceramic Dielectric (L" x W") Series Code (pF) Tolerance (VDC) Design Finish1 Grade (C-Spec)2 0603 X = Flexible Two J = ±5% 9 = 6.3 R = X7R A = N/A C = 100% Matte Sn See 0805 termination significant K = ±10% 8 = 10 "Packaging 1206 digits and M = ±20% 4 = 16 C-Spec 1210 number of 3 = 25 Ordering 1808 zeros 5 = 50 Options 1812 1 = 100 Table" 1825 2 = 200 2220 A = 250 2225 1 Additional termination finish options may be available. Contact KEMET for details. One world. One KEMET © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 1 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Packaging Type1 Ordering Code (C-Spec)3 7" Reel AUTO AUTO7411 (EIA 0603 and smaller case sizes) 13" Reel/Unmarked AUTO7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2 mm pitch2 3190 13" Reel/Unmarked/2 mm pitch2 3191 1 Reeling tape options (paper or plastic) are dependent on capacitor case size (L x W) and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information." 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information." 3 All automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking." 3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information." Benefits • AEC-Q200 automotive qualified • DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V, • −55°C to +125°C operating temperature range 200 V, and 250 V • Superior flex performance (up to 5 mm) • Capacitance offerings ranging from 180 pF to 22 μF • High capacitance flex mitigation • Available capacitance tolerances of ±5%, ±10%, and ±20% • Lead (Pb)-free, RoHS and REACH compliant • Non-polar device, minimizing installation concerns • EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, and • 100% pure matte tin-plated termination finish allowing for 2225 case sizes excellent solderability Applications Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature cycling. Examples include raw power input side filtering (power plane/bus), high current applications (automobile battery line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive, aerospace and telecom. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 2 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notifi cation (PCN) The KEMET product change notifi cation system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fi t, function, and/or reliability • Changes in manufacturing site • Product obsolescence KEMET Automotive Customer Notifi cation Due To: Days Prior To C-Spec Implementation Process/Product change Obsolescence* KEMET assigned1 Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specifi cation requirements are properly understood and fulfi lled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. KEMET Automotive PPAP (Product Part Approval Process) Level C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO ○ 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. ● Part number specifi c PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 3 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Dimensions – Millimeters (Inches) W L T B S S EIA Size Metric Size L W T B Mounting Separation Code Code Length Width Thickness Bandwidth Technique Minimum 1.60 (0.063) 0.80 (0.032) 0.45 (0.018) 06031 1608 0.58 (0.023) ±0.17 (0.007) ±0.15 (0.006) ±0.15 (0.006) Solder wave 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) 08052 2012 0.75 (0.030) or ±0.30 (0.012) ±0.30 (0.012) ±0.25 (0.010) Solder reflow 3.30 (0.130) 1.60 (0.063) 0.60 (0.024) 1206 3216 ±0.40 (0.016) ±0.35 (0.013) ±0.25 (0.010) 3.30 (.130) 2.60 (0.102) 0.60 (0.024) 1210 3225 ±0.40 (.016) ±0.30 (0.012) ±0.25 (0.010) 4.70 (0.185) 2.00 (0.079) See Table 2 for 0.70 (0.028) 1808 4520 ±0.50 (0.020) ±0.20 (0.008) Thickness ±0.35 (0.014) 4.50 (0.178) 3.20 (0.126) 0.70 (0.028) 1812 4532 N/A ±0.40 (0.016) ±0.30 (0.012) ±0.35 (0.014) Solder reflow 4.60 (0.181) 6.40 (0.252) 0.70 (0.028) only 1825 4564 ±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014) 5.90 (0.232) 5.00 (0.197) 0.70 (0.028) 2220 5650 ±0.75 (0.030) ±0.40 (0.016) ±0.35 (0.014) 5.90 (0.232) 6.40 (0.248) 0.70 (0.028) 2225 5664 ±0.75 (0.030) ±0.40 (0.016) ±0.35 (0.014) 1 For capacitance values ≥ 0.56 µF add 0.03 (0.001) to length tolerance dimension. 2 For capacitance values 1.0 µF or ≥ 2.7 µF add 0.05 (0.002) to length tolerance dimension. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 4 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Qualification/Certification Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC-Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC-Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions. Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to ±15% +25°C and 0 VDC Applied (TCC) 1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% 250% of rated voltage 2Dielectric Withstanding Voltage (DWV) (5 ±1 seconds and charge/discharge not exceeding 50 mA) 3Dissipation Factor (DF) Maximum Limit at 25°C See Dissipation Factor Limit Table See Insulation Resistance Limit Table 4Insulation Resistance (IR) Minimum Limit at 25°C (Rated voltage applied for 120 ±5 seconds at 25°C) 1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. 2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 3 Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz ±50Hz and 1.0 ±0.2 V if capacitance ≤ 10µF rms 120 Hz ±10Hz and 0.5 ±0.1 V if capacitance > 10µF rms 4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance, it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 5 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Insulation Resistance Limit Table 1,000 megohm 500 megohm 100 megohm EIA Case Size Rated DC Voltage microfarads or 100 GΩ microfarads or 10 GΩ microfarads or 10 GΩ 0402 ALL < 0.012 µF ≥ 0.012 µF N/A ≤ 200 V < 0.047 µF ≥ 0.047 µf < 0.47 µf ≥ 0.47 µf 0603 250 V N/A N/A ALL ≤ 200 V < 0.15 µF ≥ 0.15 µF < 2.2 µf ≥ 2.2 µf 0805 250 V < .027 µF N/A ≥ .027 µF ≤ 200 V < 0.47 µF ≥ 0.47 µF < 2.2 µf ≥ 2.2 µf 1206 250 V < 0.12 µF N/A ≥ 0.12 µF ≤ 200 V < 0.39 µF ≥ 0.39 µF < 10 µf ≥ 10 µf 1210 250 V < 0.27 µF N/A ≥ 0.27 µF 1808 ALL ALL N/A N/A 1812 ALL < 2.2 µF ≥ 2.2 µF N/A 1825 ALL ALL N/A N/A 2220 ALL < 10 µF ≥ 10 µF N/A 2225 ALL ALL N/A N/A Dissipation Factor (DF) Limit Table Dissipation EIA Rated DC Capacitance Factor Case Size Voltage (Maximum %) < 16 5.0 16/25 < 1.0 µF 3.5 06031 > 25 2.5 All ≥ 1.0 µF 10.0 < 4.7 µF 5.0 < 16 ≥ 4.7 µF 10.0 < 4.7 µF 3.5 08052 16 ≥ 4.7 µF 10.0 25 All 3.5 > 25 All 2.5 < 16 All 5.0 12063 16/25 All 3.5 > 25 All 2.5 < 16 All 5.0 16 All 3.5 12104 < 10µF 3.5 25 ≥ 10µF 10.0 > 25 All 2.5 < 16 All 5.0 1808 – 2225 16/25 All 3.5 > 25 All 2.5 1 For Capacitance values 0.22 µF (16 and 25 Volts) DF is 5%. 2 For Capacitance values 2.2 µF (6.3, 10, and 16 Volts) and 4.7 µF (25 Volts) DF is 10%. 3 For Capacitance values 4.7 and 10 µF (All Voltages) and 2.2 µF (25 and 50 Volts) DF is 10%. 4 For Capacitance values ≥ 10 µF (≤ 16 Volts) DF is 10% © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 6 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dissipation Rated Capacitance Insulation EIA Case Size Capacitance Factor DC Voltage Shift Resistance (Maximum %) < 16 7.5 16/25 < 1.0 µF 5.0 06031 > 25 3.0 All ≥ 1.0 µF 20.0 < 4.7 µF 7.5 < 16 ≥ 4.7 µF 20.0 < 4.7 µF 5.0 08052 16 ≥ 4.7 µF 20.0 25 All 5.0 > 25 All 3.0 10% of Initial < 16 All 7.5 ±20% limit 12063 16/25 All 5.0 > 25 All 3.0 < 16 All 7.5 16 All 5.0 1210 < 10µF 5.0 25 ≥ 10µF 20.0 > 25 All 3.0 < 16 All 7.5 1808 - 2225 16/25 All 5.0 > 25 All 3.0 1 For Capacitance values 0.22 uF (16 and 25 V) DF is 7.5%. 2 For Capacitance values 2.2 µF (6.3, 10, and 16 V) and 4.7 µF (25 Volts) DF is 20%. 3 For Capacitance values 4.7 and 10 µF (All Voltages) and 2.2 µF (25 and 50 V) DF is 20%. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 7 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1210 Case Sizes) Case Size/ C0603X C0805X C1206X C1210X Series Cap Cap Voltage Code 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A Code Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 Cap Tolerance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions 180 pF 181 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 220 pF 221 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 270 pF 271 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 330 pF 331 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 390 pF 391 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 470 pF 471 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 560 pF 561 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 680 pF 681 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 820 pF 821 J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR 1,000 pF 102 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ 1,200 pF 122 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ 1,500 pF 152 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ 1,800 pF 182 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ 2,200 pF 222 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 2,700 pF 272 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 3,300 pF 332 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 3,900 pF 392 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 4,700 pF 472 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 5,600 pF 562 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 6,800 pF 682 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 8,200 pF 822 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 10,000 pF 103 J K M CJ CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 12,000 pF 123 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 15,000 pF 153 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DD DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 18,000 pF 183 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DD DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 22,000 pF 223 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DD DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 27,000 pF 273 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DD DS DG EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 33,000 pF 333 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DD DS DG EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN 39,000 pF 393 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DD DS DG EQ EQ EQ EQ EQ ER EQ EQ FN FN FN FN FN FN FN FN 47,000 pF 473 J K M CJ CJ CJ CJ CJ CJ DR DR DR DR DR DS DG DG EQ EQ EQ EQ EQ ER ES ES FN FN FN FN FN FN FQ FQ Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 Cap Cap Voltage Code 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A Code Case Size/ C0603X C0805X C1206X C1210X Series For VW80808 flexible termination offering please visit: https://content.kemet.com/datasheets/KEM_X7R_FT_VW_AUDI.pdf © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 8 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1210 Case Sizes) cont. Case Size/ C0603X C0805X C1206X C1210X Series Cap Cap Voltage Code 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A Code Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 Cap Tolerance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions 56,000 pF 563 J K M CJ CJ CJ CJ CJ DD DD DD DD DD DS DG DG EQ EQ EQ EQ EQ EQ ES ES FN FN FN FN FN FN FQ FQ 68,000 pF 683 J K M CJ CJ CJ CJ CJ DD DD DD DD DD DS DG DG EQ EQ EQ EQ EQ EQ ES ES FN FN FN FN FN FN FQ FQ 82,000 pF 823 J K M CJ CJ CJ CJ CJ DD DD DD DD DD DS EQ EQ EQ EQ EQ EQ ES ES FN FN FN FN FN FQ FA FA 0.10 µF 104 J K M CJ CJ CJ CJ CJ DR DR DR DR DR DS EQ EQ EQ EQ EQ EQ EM EM FN FN FN FN FN FX FZ FZ 0.12 µF 124 J K M CJ CJ CJ CJ CJ DR DR DR DR DD DG ER ER ER ER ER ER EU EM FN FN FN FN FN FX FU FU 0.15 µF 154 J K M CJ CJ CJ CJ CJ DR DR DR DR DD DG ER ER ER ER ER ER EU EH FQ FQ FQ FQ FQ FX FM FM 0.18 µF 184 J K M CJ CJ CJ CJ DR DR DR DR DD DG ER ER ER ER ER ER EM EM FQ FQ FQ FQ FQ FX FK FK 0.22 µF 224 J K M CJ CJ CJ CJ DR DR DR DR DD DG ER ER ER ER ER ER EH EH FQ FQ FQ FQ FQ FX FK FK 0.27 µF 274 J K M CJ CJ CJ DD DD DD DD DD EQ EQ EQ EQ ER EM FQ FQ FQ FQ FQ FX FP FP 0.33 µF 334 J K M CJ CJ CJ DD DD DD DD DD EQ EQ EQ EQ ER EU FX FX FX FX FX FX FM FM 0.39 µF 394 J K M CJ CJ CJ DG DG DG DG DS EQ EQ EQ EQ ER EU FX FX FX FX FX FX FK FK 0.47 µF 474 J K M CJ CJ CJ DD DD DD DD DS ER ER ER ER ER EU FX FX FX FX FX FX FS FS 0.56 µF 564 J K M DD DD DD DG DH ES ES ES ES ER EM FX FX FX FX FX FA 0.68 µF 684 J K M DD DD DD DG DH ET ET ET ET ES EM FX FX FX FX FX FZ 0.82 µF 824 J K M DD DD DD DG EF EF EF EF ES EH FA FA FA FA FA FL 1.0 µF 105 J K M CJ CJ CJ DD DD DD DG EF EF EF EU ES EH FU FU FU FU FU FM 1.2 µF 125 J K M DS DS DS ES ES ES EU EH FU FU FU FU FZ FH 1.5 µF 155 J K M DG DG DG ES ES ES EU EH FU FU FU FU FZ FM 1.8 µF 185 J K M DG DG DG ES ES ES EF EH FU FU FU FU FZ FJ 2.2 µF 225 J K M DG DG DG EA EA EA EH EH FJ FJ FJ FJ FZ FK 2.7 µF 275 J K M EN EN EN EH FE FE FE FZ FU 3.3 µF 335 J K M ES ES ES EH FA FA FA FM FM 3.9 µF 395 J K M EF EF EF EH FZ FZ FZ FZ FK 4.7 µF 475 J K M DH DH DH DH EA EA EA EA EA FQ FQ FQ FZ FS 5.6 µF 565 J K M EH EH EH FA FA FA FU 6.8 µF 685 J K M EH EH EH FZ FZ FZ FM 8.2 µF 825 J K M EH EH EH FU FU FU FK 10 µF 106 J K M DH DH EA EA EA EA FS FS FS FS 22 µF 226 J K M FS FS Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 Cap Cap Voltage Code 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A Code Case Size/ C0603X C0805X C1206X C1210X Series For VW80808 flexible termination offering please visit: https://content.kemet.com/datasheets/KEM_X7R_FT_VW_AUDI.pdf © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 9 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 1B – Capacitance Range/Selection Waterfall (1808 – 2225 Case Sizes) Case Size/ C1808X C1812X C1825X C2220X C2225X Series Cap Cap Voltage Code 5 1 2 A 3 5 1 2 A 5 1 2 A 3 5 1 2 A 5 1 2 A Code Rate(dV VDoCl)tage 50 100 200 250 25 50 100 200 250 50 100 200 250 25 50 100 200 250 50 100 200 250 Cap Tolerance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions 4,700 pF 472 J K M LD LD LD 5,600 pF 562 J K M LD LD LD 6,800 pF 682 J K M LD LD LD GB GB GB GB GB 8,200 pF 822 J K M LD LD LD GB GB GB GB GB 10,000 pF 103 J K M LD LD LD GB GB GB GB GB 12,000 pF 123 J K M LD LD LD GB GB GB GB GB 15,000 pF 153 J K M LD LD LD GB GB GB GB GB 18,000 pF 183 J K M LD LD LD GB GB GB GB GB 22,000 pF 223 J K M LD LD GB GB GB GB GB HB HB HB HB 27,000 pF 273 J K M LD LD GB GB GB GB GB HB HB HB HB 33,000 pF 333 J K M LD LD GB GB GB GB GB HB HB HB HB 39,000 pF 393 J K M LD LD GB GB GB GB GB HB HB HB HB 47,000 pF 473 J K M LD LD GB GB GB GB GB HB HB HB HB 56,000 pF 563 J K M LD LD GB GB GB GB GB HB HB HB HB 68,000 pF 683 J K M LD GB GB GB GB GB HB HB HB HB 82,000 pF 823 J K M LD GB GB GB GB GB HB HB HB HB JC JC JC JC JC 0.10 µF 104 J K M LD GB GB GB GB GB HB HB HB HB JC JC JC JC JC KC KC KC KC 0.12 µF 124 J K M LD GB GB GB GB GB HB HB HB HB JC JC JC JC JC KC KC KC KC 0.15 µF 154 J K M LD GB GB GB GE GE HB HB HB HB JC JC JC JC JC KC KC KC KC 0.18 µF 184 J K M LD GB GB GB GF GG HB HB HB HB JC JC JC JC JC KC KC KC KC 0.22 µF 224 J K M GB GB GB GG GG HB HB HB HB JC JC JC JC JC KC KC KC KC 0.27 µF 274 J K M GB GB GG GG GG HB HB HB HB JC JC JC JC JC KB KC KC KC 0.33 µF 334 J K M GB GB GG GG GG HB HB HB HB JC JC JC JC JC KB KC KC KC 0.39 µF 394 J K M GB GB GG GG GG HB HB HD HD JC JC JC JC JC KB KC KC KC 0.47 µF 474 J K M GB GB GG GJ GJ HB HB HD HD JC JC JC JC JC KB KC KD KD 0.56 µF 564 J K M GC GC GG HB HD HD HD JC JC JC JD JD KB KC KD KD 0.68 µF 684 J K M GC GC GG HB HD HD HD JC JC JD JD JD KB KC KD KD 0.82 µF 824 J K M GE GE GG HB HF HF HF JC JC JF JF JF KB KC KE KE 1.0 µF 105 J K M GE GE GG HB HF HF HF JC JC JF JF JF KB KD KE KE 1.2 µF 125 J K M GB GB GB HB JC JC KB KE KE KE 1.5 µF 155 J K M GC GC GC HC JC JC KC 1.8 µF 185 J K M GE GE GE HD JD JD KD 2.2 µF 225 J K M GG GG GG HF JF JF KD 2.7 µF 275 J K M GJ GJ GJ 3.3 µF 335 J K M GL GL GL 4.7 µF 475 J K M GK GK 10 µF 106 J K M GK JF JO 15 µF 156 J K M JO 22 µF 226 J K M JO Rate(dV VDoCl)tage 50 100 200 250 25 50 100 200 250 50 100 200 250 25 50 100 200 250 50 100 200 250 Cap Cap Voltage Code 5 1 2 A 3 5 1 2 A 5 1 2 A 3 5 1 2 A 5 1 2 A Code Case Size/ C1808X C1812X C1825X C2220X C2225X Series For VW80808 flexible termination offering please visit: https://content.kemet.com/datasheets/KEM_X7R_FT_VW_AUDI.pdf © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 10 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Thickness Case Thickness ± Paper Quantity1 Plastic Quantity Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel CJ 0603 0.80 ±0.15* 4,000 15,000 0 0 DR 0805 0.78 ±0.20 0 0 4,000 10,000 DD 0805 0.90 ±0.10 0 0 4,000 10,000 DS 0805 1.00 ±0.20 0 0 2,500 10,000 DG 0805 1.25 ±0.15 0 0 2,500 10,000 DH 0805 1.25 ±0.20 0 0 2,500 10,000 EQ 1206 0.78 ±0.20 4,000 10,000 4,000 10,000 ER 1206 0.90 ±0.20 0 0 4,000 10,000 EN 1206 0.95 ±0.10 0 0 4,000 10,000 ES 1206 1.00 ±0.20 0 0 2,500 10,000 ET 1206 1.10 ±0.20 0 0 2,500 10,000 EF 1206 1.20 ±0.15 0 0 2,500 10,000 EM 1206 1.25 ±0.15 0 0 2,500 10,000 EH 1206 1.60 ±0.20 0 0 2,000 8,000 EU 1206 1.60 ±0.25 0 0 2,000 8,000 EA 1206 1.60 ±0.35 0 0 2,000 8,000 FN 1210 0.78 ±0.20 0 0 4,000 10,000 FQ 1210 0.90 ±0.20 0 0 4,000 10,000 FX 1210 0.95 ±0.20 0 0 4,000 10,000 FE 1210 1.00 ±0.10 0 0 2,500 10,000 FA 1210 1.10 ±0.15 0 0 2,500 10,000 FZ 1210 1.25 ±0.20 0 0 2,500 10,000 FL 1210 1.40 ±0.15 0 0 2,000 8,000 FH 1210 1.55 ±0.15 0 0 2,000 8,000 FU 1210 1.55 ±0.20 0 0 2,000 8,000 FP 1210 1.60 ±0.20 0 0 2,000 8,000 FM 1210 1.70 ±0.20 0 0 2,000 8,000 FJ 1210 1.85 ±0.20 0 0 2,000 8,000 FK 1210 2.10 ±0.20 0 0 2,000 8,000 FS 1210 2.50 ±0.30 0 0 1,000 4,000 LD 1808 0.90 ±0.10 0 0 2,500 10,000 GB 1812 1.00 ±0.10 0 0 1,000 4,000 GC 1812 1.10 ±0.10 0 0 1,000 4,000 GE 1812 1.30 ±0.10 0 0 1,000 4,000 GF 1812 1.50 ±0.10 0 0 1,000 4,000 GG 1812 1.55 ±0.10 0 0 1,000 4,000 GK 1812 1.60 ±0.20 0 0 1,000 4,000 GJ 1812 1.70 ±0.15 0 0 1,000 4,000 GL 1812 1.90 ±0.20 0 0 500 2,000 HB 1825 1.10 ±0.15 0 0 1,000 4,000 HC 1825 1.15 ±0.15 0 0 1,000 4,000 HD 1825 1.30 ±0.15 0 0 1,000 4,000 HF 1825 1.50 ±0.15 0 0 1,000 4,000 JC 2220 1.10 ±0.15 0 0 1,000 4,000 JD 2220 1.30 ±0.15 0 0 1,000 4,000 JF 2220 1.50 ±0.15 0 0 1,000 4,000 JO 2220 2.40 ±0.15 0 0 500 2,000 KB 2225 1.00 ±0.15 0 0 1,000 4,000 KC 2225 1.10 ±0.15 0 0 1,000 4,000 KD 2225 1.30 ±0.15 0 0 1,000 4,000 KE 2225 1.40 ±0.15 0 0 1,000 4,000 Thickness Case Thickness ± 7" Reel 13" Reel 7" Reel 13" Reel Code Size1 Range (mm) Paper Quantity1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information." © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 11 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 Density Level A: Density Level B: Density Level C: EIA Metric Maximum (Most) Median (Nominal) Minimum (Least) Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm) Code Code C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20 0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81 1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16 1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11 1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 1825 4564 2.15 1.80 6.90 7.10 7.90 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00 2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60 2225 5664 2.85 2.10 6.90 8.80 7.90 2.75 1.90 6.80 7.90 7.30 2.65 1.70 6.70 7.20 7.00 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X V2 C C Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 12 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish T Profile Feature P Maximum Ramp-up Rate = 3°C/second tP SnPb 100% Matte Sn Maximum Ramp-down Rate = 6°C/second T Preheat/Soak e L tL r Temperature Minimum (TSmin) 100°C 150°C ratu Tsmax Temperature Maximum (T ) 150°C 200°C e Smax mp T Time (t) from T to T 60 – 120 seconds 60 – 120 seconds e smin t S Smin Smax T s 3°C/second 3°C/second Ramp-Up Rate (T to T ) L P maximum maximum 25 25°C to Peak Liquidous Temperature (T) 183°C 217°C L Time Time Above Liquidous (t) 60 – 150 seconds 60 – 150 seconds L Peak Temperature (T ) 235°C 260°C P Time Within 5°C of Maximum 20 seconds 30 seconds Peak Temperature (t ) maximum maximum P 6°C/second 6°C/second Ramp-Down Rate (T to T) P L maximum maximum Time 25°C to Peak 6 minutes 8 minutes Temperature maximum maximum Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 13 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Construction Detailed Cross Section Dielectric Material (BaTiO) 3 Barrier Layer End Termination/ (Ni) External Electrode (Cu) Termination Finish Epoxy Layer (100% Matte Sn) (Ag) Dielectric Material (BaTiO) 3 Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Termination Finish Inner Electrodes (100% Matte Sn) (Ni) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 14 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Capacitor Marking (Optional) These surface mount multilayer ceramic capacitors are Marking appears in legible contrast. Illustrated below normally supplied unmarked. If required, they can be is an example of an MLCC with laser marking of “KA8”, marked as an extra cost option. Marking is available which designates a KEMET device with rated capacitance on most KEMET devices, but must be requested using of 100 µF. Orientation of marking is vendor optional. the correct ordering code identifi er(s). If this option is requested, two sides of the ceramic body will be laser marked with a “K” to identify KEMET, followed by two characters (per EIA–198 - see table below) to identify the capacitance value. EIA 0603 case size devices are limited 2-Digit KEMET to the “K” character only. Capacitance ID Code Laser marking option is not available on: • C0G, ultra stable X8R and Y5V dielectric devices. • EIA 0402 case size devices. • EIA 0603 case size devices with fl exible termination option. • KPS commercial and automotive grade stacked devices. • X7R dielectric products in capacitance values outlined below. EIA Case Size Metric Size Code Capacitance 0603 1608 ≤ 170 pF 0805 2012 ≤ 150 pF 1206 3216 ≤ 910 pF 1210 3225 ≤ 2,000 pF 1808 4520 ≤ 3,900 pF 1812 4532 ≤ 6,700 pF 1825 4564 ≤ 0.018 µF 2220 5650 ≤ 0.027 µF 2225 5664 ≤ 0.033 µF © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 15 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Capacitor Marking (Optional) cont. Capacitance (pF) For Various Alpha/Numeral Identifi ers Numeral Alpha 9 0 1 2 3 4 5 6 7 8 Character Capacitance (pF) A 0.10 1.0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000 B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000 C 0.12 1.2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000 D 0.13 1.3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000 E 0.15 1.5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000 F 0.16 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000 G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.20 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 3.3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.50 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.60 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.70 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.90 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 16 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel KEMET ® Epumnbcohsesde pda pplears tciac*rr ioerr . Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm Anti-static cover tape or 16 mm carrier tape 180 mm (7.00") (0.10 mm (0.004") maximum thickness) or 330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm) New 2 mm Pitch Reel Options* Embossed Plastic Punched Paper Tape Packaging EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Ordering Code Packaging Type/Options (W)* Pitch (P)* Pitch (P)* 1 1 (C-Spec) 01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked 0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked C-7081 Commercial grade 7" reel unmarked 0805 8 4 4 4 4 C-7082 Commercial grade 13" reel unmarked 1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size. 1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development. ≥ 1812 12 8 8 Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing KPS 1210 12 8 8 • Lower placement costs. KPS 1812 • Double the parts on each reel results in fewer reel 16 12 12 and 2220 changes and increased effi ciency. Array 0612 8 4 4 • Fewer reels result in lower packaging, shipping and *Refer to Figures 1 and 2 for W and P carrier tape reference locations. storage costs, reducing waste. 1 *Refer to Tables 6 and 7 for tolerance specifi cations. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 17 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions T P 2 T2 ØD0 P0 t(o1l0e rpaintcchee osn c tuampuel a±0ti.v2e mm) E1 A 0 F K 0 W B1 B0 E2 S P 1 1 T1 Center Lines of Cavity ØD Embossment 1 For cavity size, Cover Tape see Note 1 Table 4 B is for tape feeder reference only, 1 including draft concentric about B0. User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) D Minimum R Reference S Minimum T T Tape Size D 1 E P P 1 1 0 Note 1 1 0 2 Note 2 Note 3 Maximum Maximum 1.0 25.0 8 mm (0.039) (0.984) 1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100 12 mm (0.059 +0.004/−0.0) 1.5 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 30 (0.024) (0.024) (0.004) (0.059) (1.181) 16 mm Variable Dimensions — Millimeters (Inches) B Maximum E T W Tape Size Pitch 1 2 F P 2 A,B & K Note 4 Minimum 1 Maximum Maximum 0 0 0 4.35 6.25 3.5 ±0.05 4.0 ±0.10 2.5 8.3 8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098) (0.327) Single (4 mm) 8.2 10.25 5.5 ±0.05 8.0 ±0.10 4.6 12.3 12 mm Note 5 and double (8 mm) (0.323) (0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181) (0.484) 12.1 14.25 7.5 ±0.05 12.0 ±0.10 4.6 16.3 16 mm Triple (12 mm) (0.476) (0.561) (0.138 ±0.002) (0.157 ±0.004) (0.181) (0.642) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independently of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6.) 3. If S < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.) 1 4. B dimension is a reference dimension for tape feeder clearance only. 1 5. The cavity defi ned by A, B and K shall surround the component with suffi cient clearance that: 0 0 0 (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.) (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4.) (e) for KPS product, A and B are measured on a plane 0.3 mm above the bottom of the pocket. 0 0 (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 18 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T ØDo Po t(o1l0e rpaintcchee osn c tuampeu l±a0ti.v2e mm) E1 A 0 F W Bottom Cover Tape B0 E2 P1 G T1 Cavity Size, T1 Top Cover Tape Center Lines of Cavity SNeoete 1, Table 7 Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) R Reference Tape Size D E P P T Maximum G Minimum 0 1 0 2 1 Note 2 0.10 1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.75 25 8 mm (0.004) (0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.030) (0.984) maximum Variable Dimensions — Millimeters (Inches) Tape Size Pitch E2 Minimum F P T Maximum W Maximum A B 1 0 0 2.0 ±0.05 8.3 8 mm Half (2 mm) 6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327) Note 1 (0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3 8 mm Single (4 mm) (0.157 ±0.004) (0.327) 1. The cavity defi ned by A, B and T shall surround the component with suffi cient clearance that: 0 0 a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3.) d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.) e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6.) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 19 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Maximum Component Rotation Top View Side View Typical Pocket Centerline Tape Maximum ° Width (mm) Rotation ( °) s T 8,12 20 Bo Tape Maximum 16 – 200 10 Width (mm) Rotation ( °) S 8,12 20 Typical Component Centerline 16 – 56 10 72 – 200 5 Ao Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius 8 mm & 12 mm Tape 16 mm Tape Embossed Punched Carrier Carrier 0.5 mm maximum 1.0 mm maximum 0.5 mm maximum 1.0 mm maximum Bending R R Radius © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 20 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Figure 6 – Reel Dimensions W Full Radius, (Includes Access Hole at 3 See Note Slot Location flange distortion (Ø 40 mm minimum) at outer edge) W (Measured at hub) 2 A D (See Note) N C (Arbor hole W (Measured at hub) diameter) 1 If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth B (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) 1.5 13.0 +0.5/−0.2 20.2 12 mm or (0.059) (0.521 +0.02/−0.008) (0.795) 330 ±0.20 16 mm (13.000 ±0.008) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W W Maximum W 1 2 3 8.4 +1.5/−0.0 14.4 8 mm (0.331 +0.059/−0.0) (0.567) 50 12.4 +2.0/−0.0 18.4 Shall accommodate tape 12 mm (1.969) (0.488 +0.078/−0.0) (0.724) width without interference 16.4 +2.0/−0.0 22.4 16 mm (0.646 +0.078/−0.0) (0.882) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 21 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier Carrier Tape 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) 100 mm minimum leader Trailer Components 400 mm minimum 160 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes Carrier Tape (32 mm & wider tapes) Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 22 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) KEMET Electronics Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1078_X7R_FT-CAP_AUTO_SMD • 4/7/2020 23 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: K EMET: C0805X472KARACAUTO C1210X106K3RACAUTO C1210X475M5RACAUTO C1206X106M8RACAUTO C0603X104J5RACAUTO C0603X471J5RACAUTO C0603X102K5RACAUTO C0603X103K5RACAUTO C0603X104K4RACAUTO C0603X104K5RACAUTO C0603X154K5RACAUTO C0603X222K5RACAUTO C0603X472K5RACAUTO C0805X102K1RACAUTO C0805X105K3RACAUTO C0805X105K8RACAUTO C0805X184K5RACAUTO C0805X223K5RACAUTO C0805X224K5RACAUTO C0805X225K4RACAUTO C0805X332K5RACAUTO C0805X333K1RACAUTO C0805X333K5RACAUTO C0805X472K5RACAUTO C0805X474K5RACAUTO C0805X684K5RACAUTO C1206X105K3RACAUTO C1206X105K5RACAUTO C1206X106K4RACAUTO C1206X224K5RACAUTO C1206X475K3RACAUTO C1210X105K5RACAUTO C1210X225K3RACAUTO C1210X335K5RACAUTO C1210X475K3RACAUTO C1210X475K4RACAUTO C0603X472K1RACAUTO C1206X225K3RACAUTO C0805X474K3RACAUTO C0603X181K5RACAUTO C0603X183K3RACAUTO C0603X221K1RACAUTO C0603X823K5RACAUTO C0805X103J5RACAUTO C0805X103K5RACAUTO C0805X222K5RACAUTO C0805X332J2RACAUTO C1206X102J5RACAUTO C1206X104K2RACAUTO C1206X155K4RACAUTO C1206X222K1RACAUTO C1206X223J1RACAUTO C1206X472K2RACAUTO C1210X185K5RACAUTO C1210X395K5RACAUTO C1210X475K5RACAUTO C0603X103J1RACAUTO C0603X223K5RACAUTO C0805X103K1RACAUTO C0805X104K5RACAUTO C0805X104K1RACAUTO C1206X684K3RACAUTO C1812X475K5RACAUTO C1812X474K1RACAUTO C1812X105K1RACAUTO C1206X225K5RACAUTO C1210X225K5RACAUTO C1206X225K4RACAUTO C0805X473K5RACAUTO C0805X473K1RACAUTO C0805X181K1RACAUTO C0805X333K2RACAUTO C0603X822K5RACAUTO C0805X222J1RACAUTO C0805X474J4RACAUTO C0603X682K5RACAUTO C1206X185K4RACAUTO C0805X104M1RACAUTO C0805X471J1RACAUTO C0603X471K5RACAUTO C0805X221K5RACAUTO C0603X474K4RACAUTO C0603X104K3RACAUTO C0603X683K5RACAUTO C0603X102K1RACAUTO C0603X222K1RACAUTO C0603X103K1RACAUTO C0805X225K8RACAUTO C1206X155K3RACAUTO C0805X334K5RACAUTO C0805X105K4RACAUTO C2220X156K5RACAUTO C1206X104K1RACAUTO C1210X106K4RACAUTO C2220X226K3RACAUTO C0805X103K2RACAUTO C0603X332K1RACAUTO C1210X105K1RACAUTO C0805X102J1RACAUTO C1210X225K1RACAUTO