Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Overview KEMET’s Ceramic Open Mode capacitor in X7R dielectric circuit failures. Although flexible termination technology is designed to significantly minimize the probability of a does not eliminate the potential for mechanical damage that low IR or short circuit condition when forced to failure in may propagate during extreme environmental and handling a board stress flex situation, thus reducing the potential conditions, it does provide superior flex performance over for catastrophic failure. The Open Mode capacitor may standard termination systems. When combined with flexible experience a drop in capacitance; however, a short is termination technology these devices offer the ultimate level unlikely because a crack will not typically propagate of protection against a low IR or short circuit condition. Open across counter electrodes within the device’s “active area.” Mode devices compliment KEMET's Floating Electrode Since there will not be any current leakage associated (FE-CAP) and Floating Electrode with Flexible Termination with a typical Open Mode flex crack, there is no localized (FF-CAP) product lines by providing a fail-safe design heating and therefore little chance for a catastrophic and optimized for mid to high range capacitance values. These potentially costly failure event. devices exhibit a predictable change in capacitance with respect to time and voltage and boast a minimal change Driven by the demand for a more robust and reliable in capacitance with reference to ambient temperature. component, the Open Mode capacitor was designed for Capacitance change is limited to ±15% from −55°C to +125°C. critical applications where higher operating temperatures and mechanical stress are a concern. These capacitors are widely used in automotive circuits as well as power supplies (input and output filters) and general electronic applications. Concerned with flex cracks resulting from excessive tensile and shear stresses produced during board flexure and thermal cycling? These devices are available with KEMET's Flexible termination technology which inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short Ordering Information C 1210 J 685 K 3 R A C TU Rated Failure Case Size Specification/ Capacitance Capacitance Packaging/Grade Ceramic Voltage Dielectric Rate/ Termination Finish1 (L" x W") Series Code (pF) Tolerance (C-Spec) (VDC) Design 0805 F = Open Mode Two significant K = ±10% 4 = 16 R = X7R A = N/A C = 100% Matte Sn See "Packaging 1206 J = Open Mode digits + number M = ±20% 3 = 25 L = SnPb C-Spec 1210 with Flexible of zeros 5 = 50 (5% Pb minimum) Ordering 1812 Termination 1 = 100 Options Table" 2 = 200 below 1 Additional termination finish options may be available. Contact KEMET for details. 1 SnPb termination finish option is not available on automotive grade product. One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Packaging Type Ordering Code (C-Spec) Commercial Grade1 Bulk Bag Not Required (Blank) 7" Reel/Unmarked TU 7411 (EIA 0603 and smaller case sizes) 13" Reel/Unmarked 7210 (EIA 0805 and larger case sizes) 7" Reel/Marked TM 7040 (EIA 0603 and smaller case sizes) 13" Reel/Marked 7215 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2 mm pitch2 7081 13" Reel/Unmarked/2 mm pitch2 7082 Automotive Grade3 7" Reel AUTO AUTO7411 (EIA 0603 and smaller case sizes) 13" Reel/Unmarked AUTO7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2 mm pitch2 3190 13" Reel/Unmarked/2 mm pitch2 3191 1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging. 1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information". 3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information". 3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". 3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking". Benefits • −55°C to +125°C operating temperature range • Non-polar device, minimizing installation concerns • Open Mode/fail open design • 100% pure matte tin-plated termination finish allowing for • Mid to high capacitance flex mitigation excellent solderability • Lead (Pb)-free, RoHS and REACH compliant • Commercial and Automotive (AEC–Q200) grades available • EIA 0805, 1206, 1210, and 1812 case sizes • SnPb termination finish option available upon request • DC voltage ratings of 16 V, 25 V, 50 V, 100 V, and 200 V (5% Pb minimum) • Capacitance offerings ranging from 1,000 pF to 6.8 μF • Flexible termination option available upon request • Available capacitance tolerances of ±5%, ±10%, and ±20% Applications Typical applications include input side filtering (power plane/bus), high current (battery line) and circuits that cannot be fused to open when short circuits occur due to flex cracks. Markets include automotive applications that are directly connected to the battery and/or involve conversion to a 42 V system and raw power input side filtering in power conversion. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below). Product Change Notifi cation (PCN) The KEMET Product Change Notifi cation system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fi t, function, and/or reliability • Changes in manufacturing site • Product obsolescence KEMET Automotive Customer Notifi cation due to: Days prior to C-Spec implementation Process/Product change Obsolescence* KEMET assigned1 Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design record and specifi cation requirements are properly understood and fulfi lled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. KEMET Automotive PPAP (Product Part Approval Process) Level C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO ○ ○ 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. ● Part number specifi c PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) – Standard Termination W L T B S S EIA Size Metric Size L W T B Mounting Separation Code Code Length Width Thickness Bandwidth Technique Minimum 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) 0805 2012 0.75 (0.030) ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) Solder Wave or 3.20 (0.126) 1.60 (0.063) 0.50 (0.02) Solder Reflow 1206 3216 ±0.20 (0.008) ±0.20 (0.008) See Table 2 for ±0.25 (0.010) 3.20 (0.126) 2.50 (0.098) Thickness 0.50 (0.02) 1210 3225 N/A ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) Solder Reflow 4.50 (0.177) 3.20 (0.126) 0.60 (0.024) Only 1812 4532 ±0.30 (0.012) ±0.30 (0.012) ±0.35 (0.014) Dimensions – Millimeters (Inches) – Flexible Termination S EIA Size Metric Size L W T B Mounting Separation Code Code Length Width Thickness Bandwidth Technique Minimum 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) 0805 2012 0.75 (0.030) ±0.30 (0.012) ±0.30 (0.012) ±0.25 (0.010) Solder Wave or 3.30 (0.130) 1.60 (0.063) 0.60 (0.024) Solder Reflow 1206 3216 ±0.40 (0.016) ±0.35 (0.013) See Table 2 for ±0.25 (0.010) 3.30 (0.130) 2.60 (0.102) Thickness 0.60 (0.024) 1210 3225 N/A ±0.40 (0.016) ±0.30 (0.012) ±0.25 (0.010) Solder Reflow 4.50 (0.178) 3.20 (0.126) 0.70 (0.028) Only 1812 4532 ±0.40 (0.016) ±0.30 (0.012) ±0.35 (0.014) Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to ±15% +25°C and 0 Vdc Applied (TCC) 1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% 250% of rated voltage 2Dielectric Withstanding Voltage (DWV) (5±1 seconds and charge/discharge not exceeding 50mA) 3Dissipation Factor (DF) Maximum Limit at 25°C 5%(6.3V & 10V), 3.5%(16V & 25V) and 2.5%(50V to 250V) See Insulation Resistance Limit Table 4Insulation Resistance (IR) Minimum Limit at 25°C (Rated voltage applied for 120±5 seconds at 25°C) 1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. 2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 3 Capacitance and dissipation factor (DF) measured under the following conditions: 1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF 120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF 4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON". Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Rated DC Capacitance Dissipation Factor Capacitance Insulation Dielectric Voltage Value (Maximum %) Shift Resistance > 25 3.0 10% of Initial X7R 16/25 All 5.0 ±20% Limit < 16 7.5 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Insulation Resistance Limit Table (X7R Dielectric) 1,000 Megohm 500 Megohm EIA Case Size Microfarads or 100 GΩ Microfarads or 10 GΩ 0201 N/A ALL 0402 < 0.012 µF ≥ 0.012 µF 0603 < 0.047 µF ≥ 0.047 µF 0805 < 0.15 µF ≥ 0.15 µF 1206 < 0.47 µF ≥ 0.47 µF 1210 < 0.39 µF ≥ 0.39 µF 1808 ALL N/A 1812 < 2.2 µF ≥ 2.2 µF 1825 ALL N/A 2220 < 10 µF ≥ 10 µF 2225 ALL N/A © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall - Standard Termination (0805 – 1812 Case Sizes) Case Size/ C0805F/J C1206F/J C1210F/J C1812F/J Series Capacitance Capacitance Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2 Code Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200 Capacitance Product Availability and Chip Thickness Codes Tolerance See Table 2 for Chip Thickness Dimensions 1,000 pF 102 K M DP DP DP DP DP 1,200 pF 122 K M DP DP DP DP DP 1,500 pF 152 K M DP DP DP DP DP 1,800 pF 182 K M DP DP DP DP DP 2,200 pF 222 K M DP DP DP DP DP 2,700 pF 272 K M DP DP DP DP DP 3,300 pF 332 K M DP DP DP DP DP 3,900 pF 392 K M DP DP DP DP DP 4,700 pF 472 K M DP DP DP DP DP 5,600 pF 562 K M DP DP DP DP DP 6,800 pF 682 K M DP DP DP DP DP 8,200 pF 822 K M DP DP DP DP DP 10,000 pF 103 K M DP DP DP DP DP 12,000 pF 123 K M DP DP DP DP DG 15,000 pF 153 K M DP DP DP DP DG 18,000 pF 183 K M DP DP DP DP ER ER ER ER ER 22,000 pF 223 K M DP DP DP DG ER ER ER ER ER 27,000 pF 273 K M DP DP DP DG ER ER ER ER ER 33,000 pF 333 K M DP DP DP DG ER ER ER ER ER 39,000 pF 393 K M DP DP DP DG ER ER ER ER ER 47,000 pF 473 K M DP DP DP DS ER ER ER ER EU GB GB GB GB 56,000 pF 563 K M DP DP DP ER ER ER ER EU GB GB GB GB 68,000 pF 683 K M DP DP DG DG ER ER ER ER EU FX FX FX FX FX GB GB GB GB 82,000 pF 823 K M DP DP DG ER ER ER ER EU FX FX FX FX FX GB GB GB GB 0.10 µF 104 K M DG DG DG ER ER ER ER EU FX FX FX FX FZ GB GB GB GB 0.12 µF 124 K M DG DG ER ER ER ER FX FX FX FX FZ GB GB GB GB 0.15 µF 154 K M DG DG ER ER ER EU FX FX FX FX FU GB GB GB GB 0.18 µF 184 K M DG DG ER ER ER EU FX FX FX FX FU GB GB GB GB 0.22 µF 224 K M DG DP DG ER ER ER ES FX FX FX FZ FS GB GB GB GC 0.27 µF 274 K M DP DP ER ER ER FX FX FX FZ GB GB GB GF 0.33 µF 334 K M DP DG EU EU EU EU FX FX FX FU GB GB GB GK 0.39 µF 394 K M DP DG EU EU FX FX FZ FU GB GB GB GL 0.47 µF 474 K M DS DG EU EU ER FX FX FZ FJ GB GB GC 0.56 µF 564 K M EU FX FX FZ FR GB GB GD 0.68 µF 684 K M DG EU FX FZ FU FR GD GD GF 0.82 µF 824 K M EU FX FZ FU FR GD GD GK 1.0 µF 105 K M EU ER EH FX FU FJ FS GN GN GM 1.2 µF 125 K M FZ 1.5 µF 155 K M FU 1.8 µF 185 K M FU 2.2 µF 225 K M ER EH FJ FM FM 2.7 µF 275 K M 3.3 µF 335 K M FM 3.9 µF 395 K M 4.7 µF 475 K M EH FZ FM GK GK 6.8 µF 685 K M FS FS Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200 Capacitance Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2 Capacitance Code Case Size/ Series C0805F/J C1206F/J C1210F/J C1812F/J © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Table 1B – Capacitance Range/Selection Waterfall - Flexible Termination (0805 – 1812 Case Sizes) Case Size/ C0805F/J C1206F/J C1210F/J C1812F/J Series Capacitance Capacitance Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2 Code Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200 Capacitance Product Availability and Chip Thickness Codes Tolerance See Table 2 for Chip Thickness Dimensions 1,000 pF 102 K M DD DD DD DD DD 1,200 pF 122 K M DD DD DD DD DD 1,500 pF 152 K M DD DD DD DD DD 1,800 pF 182 K M DD DD DD DD DD 2,200 pF 222 K M DD DD DD DD DD 2,700 pF 272 K M DD DD DD DD DD 3,300 pF 332 K M DD DD DD DD DD 3,900 pF 392 K M DD DD DD DD DD 4,700 pF 472 K M DD DD DD DD DD 5,600 pF 562 K M DD DD DD DD DD 6,800 pF 682 K M DD DD DD DD DD 8,200 pF 822 K M DD DD DD DD DD 10,000 pF 103 K M DD DD DD DD DD 12,000 pF 123 K M DD DD DD DD DG 15,000 pF 153 K M DD DD DD DD DG 18,000 pF 183 K M DD DD DD DD ER ER ER ER ER 22,000 pF 223 K M DD DD DD DG ER ER ER ER ER 27,000 pF 273 K M DD DD DD DG ER ER ER ER ER 33,000 pF 333 K M DD DD DD DG ER ER ER ER ER 39,000 pF 393 K M DD DD DD DG ER ER ER ER ER 47,000 pF 473 K M DD DD DD DS ER ER ER ER EU GB GB GB GB 56,000 pF 563 K M DD DD DD ER ER ER ER EU GB GB GB GB 68,000 pF 683 K M DD DD DG DG ER ER ER ER EU FX FX FX FX FX GB GB GB GB 82,000 pF 823 K M DD DD DG ER ER ER ER EU FX FX FX FX FX GB GB GB GB 0.10 µF 104 K M DG DG DG ER ER ER ER EU FX FX FX FX FZ GB GB GB GB 0.12 µF 124 K M DG DG ER ER ER ER FX FX FX FX FZ GB GB GB GB 0.15 µF 154 K M DG DG ER ER ER EU FX FX FX FX FU GB GB GB GB 0.18 µF 184 K M DG DG ER ER ER EU FX FX FX FX FU GB GB GB GB 0.22 µF 224 K M DG DD DG ER ER ER ES FX FX FX FZ FS GB GB GB GC 0.27 µF 274 K M DD DD ER ER ER FX FX FX FZ GB GB GB GF 0.33 µF 334 K M DD DG EU EU EU EU FX FX FX FU GB GB GB GK 0.39 µF 394 K M DD DG EU EU FX FX FZ FU GB GB GB GL 0.47 µF 474 K M DS DG EU EU ER FX FX FZ FJ GB GB GC 0.56 µF 564 K M EU FX FX FZ FR GB GB GD 0.68 µF 684 K M DG EU FX FZ FU FR GD GD GF 0.82 µF 824 K M EU FX FZ FU FR GD GD GK 1.0 µF 105 K M EU ER EH FX FU FJ FS GN GN GM 1.2 µF 125 K M FZ 1.5 µF 155 K M FU 1.8 µF 185 K M FU 2.2 µF 225 K M ER EH FJ FM FM 2.7 µF 275 K M 3.3 µF 335 K M FM 3.9 µF 395 K M 4.7 µF 475 K M EH FZ FM GK GK 6.8 µF 685 K M FS FS Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200 Capacitance Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2 Capacitance Code Case Size/ Series C0805F/J C1206F/J C1210F/J C1812F/J © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities - Standard Termination Thickness Case Thickness ± Paper Quantity Plastic Quantity Code Size Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel DP 0805 0.90 ± 0.10* 4,000 15,000 0 0 DS 0805 1.00 ± 0.20 0 0 2,500 10,000 DG 0805 1.25 ± 0.15 0 0 2,500 10,000 ER 1206 0.90 ± 0.20 0 0 4,000 10,000 ES 1206 1.00 ± 0.20 0 0 2,500 10,000 EH 1206 1.60 ± 0.20 0 0 2,000 8,000 EU 1206 1.60 ± 0.25 0 0 2,000 8,000 FX 1210 0.95 ± 0.20 0 0 4,000 10,000 FZ 1210 1.25 ± 0.20 0 0 2,500 10,000 FU 1210 1.55 ± 0.20 0 0 2,000 8,000 FM 1210 1.70 ± 0.20 0 0 2,000 8,000 FJ 1210 1.85 ± 0.20 0 0 2,000 8,000 FR 1210 2.25 ± 0.20 0 0 2,000 8,000 FS 1210 2.50 ± 0.30 0 0 1,000 4,000 GB 1812 1.00 ± 0.10 0 0 1,000 4,000 GC 1812 1.10 ± 0.10 0 0 1,000 4,000 GD 1812 1.25 ± 0.15 0 0 1,000 4,000 GF 1812 1.50 ± 0.10 0 0 1,000 4,000 GK 1812 1.60 ± 0.20 0 0 1,000 4,000 GN 1812 1.70 ± 0.20 0 0 1,000 4,000 GL 1812 1.90 ± 0.20 0 0 500 2,000 GM 1812 2.00 ± 0.20 0 0 500 2,000 7" Reel 13" Reel 7" Reel 13" Reel Thickness Case Thickness ± Code Size Range (mm) Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Table 2B – Chip Thickness/Tape & Reel Packaging Quantities - Flexible Termination Thickness Case Thickness ± Paper Quantity Plastic Quantity Code Size Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel DD 0805 0.90 ± 0.10 0 0 4,000 10,000 DS 0805 1.00 ± 0.20 0 0 2,500 10,000 DG 0805 1.25 ± 0.15 0 0 2,500 10,000 ER 1206 0.90 ± 0.20 0 0 4,000 10,000 ES 1206 1.00 ± 0.20 0 0 2,500 10,000 EH 1206 1.60 ± 0.20 0 0 2,000 8,000 EU 1206 1.60 ± 0.25 0 0 2,000 8,000 FX 1210 0.95 ± 0.20 0 0 4,000 10,000 FZ 1210 1.25 ± 0.20 0 0 2,500 10,000 FU 1210 1.55 ± 0.20 0 0 2,000 8,000 FM 1210 1.70 ± 0.20 0 0 2,000 8,000 FJ 1210 1.85 ± 0.20 0 0 2,000 8,000 FR 1210 2.25 ± 0.20 0 0 2,000 8,000 FS 1210 2.50 ± 0.30 0 0 1,000 4,000 GB 1812 1.00 ± 0.10 0 0 1,000 4,000 GC 1812 1.10 ± 0.10 0 0 1,000 4,000 GD 1812 1.25 ± 0.15 0 0 1,000 4,000 GF 1812 1.50 ± 0.10 0 0 1,000 4,000 GK 1812 1.60 ± 0.20 0 0 1,000 4,000 GN 1812 1.70 ± 0.20 0 0 1,000 4,000 GL 1812 1.90 ± 0.20 0 0 500 2,000 GM 1812 2.00 ± 0.20 0 0 500 2,000 7" Reel 13" Reel 7" Reel 13" Reel Thickness Case Thickness ± Code Size Range (mm) Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Table 2C – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec1 N/A2 Case Size Packaging Quantities (pieces/unit packaging) EIA (in) Metric (mm) Minimum Maximum 0402 1005 0603 1608 0805 2012 50,000 1206 3216 1210 3225 1 1808 4520 1812 4532 1825 4564 20,000 2220 5650 2225 5664 1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products. 2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination Density Level A: Density Level B: Density Level C: EIA Metric Maximum (Most) Median (Nominal) Minimum (Least) Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm) Code Code C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 12101 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 1 Only for capacitance values ≥ 22 µF Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X V2 C C Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination Density Level A: Density Level B: Density Level C: EIA Metric Maximum (Most) Median (Nominal) Minimum (Least) Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm) Code Code C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81 1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16 1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11 1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X V2 C C Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish T Profile Feature P Maximum Ramp Up Rate = 3°C/second tP SnPb 100% Matte Sn Maximum Ramp Down Rate = 6°C/second T Preheat/Soak e L tL r Temperature Minimum (TSmin) 100°C 150°C ratu Tsmax Temperature Maximum (T ) 150°C 200°C e Smax mp T Time (t) from T to T 60 – 120 seconds 60 – 120 seconds e smin t S Smin Smax T s 3°C/second 3°C/second Ramp-Up Rate (T to T ) L P maximum maximum Liquidous Temperature (TL) 183°C 217°C 25 25°C to Peak Time Above Liquidous (t) 60 – 150 seconds 60 – 150 seconds Time L Peak Temperature (T ) 235°C 260°C P Time Within 5°C of Maximum 20 seconds 30 seconds Peak Temperature (t ) maximum maximum P 6°C/second 6°C/second Ramp-Down Rate (T to T) P L maximum maximum Time 25°C to Peak 6 minutes 8 minutes Temperature maximum maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm Board Flex JIS–C–6429 for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X. Conditions: a) Method B, 4 hours at 155°C, dry heat at 235°C Solderability J–STD–002 b) Method B at 215°C category 3 c) Method D, category 3 at 260°C 1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test Temperature Cycling JESD22 Method JA–104 conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. MIL–STD–202 Method Measurement at 24 hours +/− 4 hours after test conclusion. Biased Humidity 103 Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/− 4 hours after test conclusion. MIL–STD–202 Method t = 24 hours/cycle. Steps 7a and 7b not required. Moisture Resistance 106 Measurement at 24 hours +/− 4 hours after test conclusion. MIL–STD–202 Method −55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 Thermal Shock 107 seconds, dwell time – 15 minutes. Air – Air. MIL–STD–202 Method High Temperature Life 108 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied. /EIA–198 MIL–STD–202 Method Storage Life 150°C, 0 VDC for 1,000 hours. 108 5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 MIL–STD–202 Method Vibration secure points on one long side and 2 secure points at corners of opposite sides. Parts 204 mounted within 2" from any secure point. Test from 10 – 2,000 Hz MIL–STD–202 Method Mechanical Shock Figure 1 of Method 213, Condition F. 213 MIL–STD–202 Method Resistance to Solvents Add aqueous wash chemical, OKEM Clean or equivalent. 215 Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Construction – Standard Termination Detailed Cross Section Dielectric Material (BaTiO) 3 Barrier Layer Dielectric (Ni) Material (BaTiO) 3 Termination Finish End Termination/ (100% Matte Sn / External Electrode SnPb - 5% Pb min) (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Inner Electrodes (Ni) Construction – Flexible Termination Detailed Cross Section Dielectric Material (BaTiO) 3 Barrier Layer End Termination/ (Ni) External Electrode Termination Finish (Cu) (100% Matte Sn / Epoxy Layer SnPb - 5% Pb min) (Ag) Dielectric Material (BaTiO) 3 Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Termination Finish Inner Electrodes (100% Matte Sn / (Ni) SnPb - 5% Pb min) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are Marking appears in legible contrast. Illustrated below normally supplied unmarked. If required, they can be is an example of an MLCC with laser marking of “KA8”, marked as an extra cost option. Marking is available which designates a KEMET device with rated capacitance on most KEMET devices but must be requested using of 100 µF. Orientation of marking is vendor optional. the correct ordering code identifi er(s). If this option is requested, two sides of the ceramic body will be laser marked with a “K” to identify KEMET, followed by two characters (per EIA–198 - see table below) to identify the capacitance value. EIA 0603 case size devices are limited 2-Digit KEMET to the “K” character only. Capacitance ID Code Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices. • EIA 0402 case size devices. • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive Grade stacked devices. • X7R dielectric products in capacitance values outlined below. EIA Case Size Metric Size Code Capacitance 0603 1608 ≤ 170 pF 0805 2012 ≤ 150 pF 1206 3216 ≤ 910 pF 1210 3225 ≤ 2,000 pF 1808 4520 ≤ 3,900 pF 1812 4532 ≤ 6,700 pF 1825 4564 ≤ 0.018 µF 2220 5650 ≤ 0.027 µF 2225 5664 ≤ 0.033 µF © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Capacitor Marking (Optional) cont’d Capacitance (pF) For Various Alpha/Numeral Identifi ers Numeral Alpha 9 0 1 2 3 4 5 6 7 8 Character Capacitance (pF) A 0.10 1.0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000 B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000 C 0.12 1.2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000 D 0.13 1.3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000 E 0.15 1.5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000 F 0.16 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000 G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.20 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 3.3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.50 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.60 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.70 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.90 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel KEMET ® Epumnbcohsesde pda pplears tciac*rr ioerr . Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm Anti-static cover tape or 16 mm carrier tape 178 mm (7.00") (0.10 mm (0.004") maximum thickness) or 330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm) New 2 mm Pitch Reel Options* Embossed Plastic Punched Paper Tape Packaging EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Ordering Code Packaging Type/Options (W)* Pitch (P)* Pitch (P)* 1 1 (C-Spec) 01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked 0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked C-7081 Commercial grade 7" reel unmarked 0805 8 4 4 4 4 C-7082 Commercial grade 13" reel unmarked 1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size. 1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development. ≥ 1812 12 8 8 Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing KPS 1210 12 8 8 • Lower placement costs. KPS 1812 • Double the parts on each reel results in fewer reel 16 12 12 and 2220 changes and increased effi ciency. Array 0612 8 4 4 • Fewer reels result in lower packaging, shipping and *Refer to Figures 1 and 2 for W and P carrier tape reference locations. storage costs, reducing waste. 1 *Refer to Tables 6 and 7 for tolerance specifi cations. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions T P2 T2 ØDo Po [10 pitches cumulative E1 tolerance on tape ±0.2 mm] Ao F Ko W B1 Bo E2 S1 P1 T1 Center Lines of Cavity ØD1 FEomrb coasvsitmy esnizte, Cover Tape see Note 1 Table 4 B1 is for tape feeder reference only, including draft concentric about Bo. User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) D Minimum R Reference S Minimum T T Tape Size D 1 E P P 1 1 0 Note 1 1 0 2 Note 2 Note 3 Maximum Maximum 1.0 25.0 8 mm (0.039) (0.984) 1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100 12 mm (0.059 +0.004/−0.0) 1.5 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 30 (0.024) (0.024) (0.004) (0.059) (1.181) 16 mm Variable Dimensions — Millimeters (Inches) B Maximum E T W Tape Size Pitch 1 2 F P 2 A,B & K Note 4 Minimum 1 Maximum Maximum 0 0 0 4.35 6.25 3.5 ±0.05 4.0 ±0.10 2.5 8.3 8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098) (0.327) Single (4 mm) 8.2 10.25 5.5 ±0.05 8.0 ±0.10 4.6 12.3 12 mm Note 5 and Double (8 mm) (0.323) (0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181) (0.484) 12.1 14.25 7.5 ±0.05 12.0 ±0.10 4.6 16.3 16 mm Triple (12 mm) (0.476) (0.561) (0.138 ±0.002) (0.157 ±0.004) (0.181) (0.642) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 1 4. B dimension is a reference dimension for tape feeder clearance only. 1 5. The cavity defi ned by A, B and K shall surround the component with suffi cient clearance that: 0 0 0 (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS product, A and B are measured on a plane 0.3 mm above the bottom of the pocket. 0 0 (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 20

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T ØDo Po t[o1l0e rpaitncchee os nc utampuel a±t0iv.2e mm] E1 A 0 F W Bottom Cover Tape B0 E2 P1 G T1 Cavity Size, T1 Top Cover Tape Center Lines of Cavity SNeoete 1, Table 7 Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) R Reference Tape Size D E P P T Maximum G Minimum 0 1 0 2 1 Note 2 0.10 1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.75 25 8 mm (0.004) (0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.030) (0.984) Maximum Variable Dimensions — Millimeters (Inches) Tape Size Pitch E2 Minimum F P T Maximum W Maximum A B 1 0 0 2.0 ±0.05 8.3 8 mm Half (2 mm) 6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327) Note 1 (0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3 8 mm Single (4 mm) (0.157 ±0.004) (0.327) 1. The cavity defi ned by A, B and T shall surround the component with suffi cient clearance that: 0 0 a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 21

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Maximum Component Rotation Top View Side View Typical Pocket Centerline Tape Maximum ° Width (mm) Rotation ( °) s T 8,12 20 Bo Tape Maximum 16 – 200 10 Width (mm) Rotation ( °) S 8,12 20 Typical Component Centerline 16 – 56 10 72 – 200 5 Ao Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius 8 mm & 12 mm Tape 16 mm Tape Embossed Punched Carrier Carrier 0.5 mm maximum 1.0 mm maximum 0.5 mm maximum 1.0 mm maximum Bending R R Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 22

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Figure 6 – Reel Dimensions W3 Full Radius, (Includes Access Hole at See Note Slot Location flange distortion (Ø 40 mm minimum) at outer edge) W2 (Measured at hub) A D (See Note) N C (Arbor hole W1 (Measured at hub) diameter) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth B (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) 1.5 13.0 +0.5/−0.2 20.2 12 mm or (0.059) (0.521 +0.02/−0.008) (0.795) 330 ±0.20 16 mm (13.000 ±0.008) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W W Maximum W 1 2 3 8.4 +1.5/−0.0 14.4 8 mm (0.331 +0.059/−0.0) (0.567) 50 12.4 +2.0/−0.0 18.4 Shall accommodate tape 12 mm (1.969) (0.488 +0.078/−0.0) (0.724) width without interference 16.4 +2.0/−0.0 22.4 16 mm (0.646 +0.078/−0.0) (0.882) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 23

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier Carrier Tape 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) 100 mm minimum Leader Trailer Components 400 mm minimum 160 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes Carrier Tape (32 mm & wider tapes) Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 24

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade) KEMET Electronics Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 11/29/2017 25

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