Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Overview The KEMET Automotive Grade Surface Mount Capacitors X7R dielectric features a 125°C maximum operating in X7R dielectric are suited for a variety of applications temperature and is considered temperature stable. The requiring proven, reliable performance in harsh Electronics Industries Alliance (EIA) characterizes X7R environments. Whether underhood or in-cabin, these dielectric as a Class II material. Components of this devices emphasize the vital and robust nature of capacitors classification are fixed, ceramic dielectric capacitors, suited required for mission and safety of critical automotive for bypass and decoupling applications, or for frequency circuits. Stricter testing protocol and inspection criteria discriminating circuits, where Q and stability of capacitance have been established for automotive grade products in characteristics are not critical. X7R exhibits a predictable recognition of potentially harsh environmental conditions. change in capacitance with respect to time and voltage, KEMET automotive grade capacitors meet the demanding and boasts a minimal change in capacitance with reference Automotive Electronics Council's AEC-Q200 qualification to ambient temperature. Capacitance change is limited to requirements. ±15% from −55°C to +125°C. Benefits • AEC–Q200 automotive qualified • −55°C to +125°C operating temperature range • Lead (Pb)-free, RoHS and REACH compliant • Temperature stable dielectric • EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, and 2220 case sizes • DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V, 200 V and 250 V • Capacitance offerings ranging from 10 pF to 22 μF • Available capacitance tolerances of ±5%, ±10% and ±20% • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated termination finish, allowing for excellent solderability Applications Typical applications include decoupling, bypass, filtering and transient voltage suppression. One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Ordering Information C 0805 C 225 M 4 R A C AUTO Case Size Specification/ Capacitance Capacitance Rated Voltage Failure Packaging/Grade Ceramic Dielectric Termination Finish1 (L" x W") Series Code (pF) Tolerance (VDC) Rate/Design (C-Spec) 0402 C = Standard Two significant J = ±5% 9 = 6.3 R = X7R A = N/A C = 100% Matte Sn See "Packaging 0603 digits and K = ±10% 8 = 10 C-Spec Ordering 0805 number of M = ±20% 4 = 16 Options Table" 1206 zeros. 3 = 25 1210 5 = 50 1808 1 = 100 1812 2 = 200 1825 A = 250 2220 1 Additional termination finish options may be available. Contact KEMET for details. Packaging C-Spec Ordering Options Table Packaging/Grade Packaging Type1 Ordering Code (C-Spec)3 7" Reel AUTO AUTO7411 (EIA 0603 and smaller case sizes) 13" Reel/Unmarked AUTO7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2 mm pitch2 3190 13" Reel/Unmarked/2 mm pitch2 3191 1 Reeling tape options (paper or plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information." 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information." 3 All automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking." 3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information." Qualification/Certification Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notifi cation (PCN) The KEMET product change notifi cation system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fi t, function, and/or reliability • Changes in manufacturing site • Product obsolescence KEMET Automotive Customer Notifi cation Due To: Days Prior To C-Spec Implementation Process/Product change Obsolescence* KEMET assigned1 Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specifi cation requirements are properly understood and fulfi lled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. KEMET Automotive PPAP (Product Part Approval Process) Level C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO ○ ○ 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. ● Part number specifi c PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Dimensions – Millimeters (Inches) W L T B S S EIA Size Metric Size L W T B Mounting Separation Code Code Length Width Thickness Bandwidth Technique Minimum 1.00 (0.040) 0.50 (0.020) 0.30 (0.012) 0402 1005 0.30 (0.012) Solder reflow only ±0.05 (0.002) ±0.05 (0.002) ±0.10 (0.004) 1.60 (0.063) 0.80 (0.032) 0.35 (0.014) 06031 1608 0.70 (0.028) ±0.15 (0.006) ±0.15 (0.006) ±0.15 (0.006) 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) Solder wave or 08052 2012 0.75 (0.030) ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) Solder reflow 3.20 (0.126) 1.60 (0.063) See Table 2 for 0.50 (0.02) 12063 3216 ±0.20 (0.008) ±0.20 (0.008) Thickness ±0.25 (0.010) 3.20 (0.126) 2.50 (0.098) 0.50 (0.02) 12104 3225 ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) N/A 4.50 (0.177) 3.20 (0.126) 0.60 (0.024) Solder reflow 1812 4532 ±0.30 (0.012) ±0.30 (0.012) ±0.35 (0.014) only 5.70 (0.224) 5.00 (0.197) 0.60 (0.024) 2220 5650 ±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014) 1 For capacitance values ≥ 0.56 µF add 0.05 (0.002) to length tolerance dimension. 2 For capacitance values 1.0 µF or ≥ 2.7 µF add 0.10 (0.004) to length tolerance dimension. 3 For capacitance value 1.0 µF all voltages and 10 µF with 25 V add 0.05 (0.002) to length tolerance dimension. 4 For capacitance values ≥ 4.7 µF add 0.02 (0.001) to the width tolerance dimension and 0.10 (0.004) to the length tolerance dimension. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to ±15% +25°C and 0 VDC Applied (TCC) 1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% 250% of rated voltage 2Dielectric Withstanding Voltage (DWV) (5 ±1 seconds and charge/discharge not exceeding 50 mA) 3Dissipation Factor (DF) Maximum Limit at 25°C See Dissipation Factor Limit Table See Insulation Resistance Limit Table 4Insulation Resistance (IR) Minimum Limit at 25°C (Rated voltage applied for 120 ±5 seconds at 25°C) 1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. 2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 3 Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz ±50 Hz and 1.0 ±0.2 V if capacitance ≤ 10 µF rms 120 Hz ±10 Hz and 0.5 ±0.1 V if capacitance > 10 µF rms 4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Insulation Resistance Limit Table 1,000 megohm 500 megohm 100 megohm EIA Case Size Rated DC Voltage microfarads or 100 GΩ microfarads or 10 GΩ microfarads or 10 GΩ 0402 ALL < 0.012 µF ≥ 0.012 µF N/A ≤ 200 V < 0.047 µF ≥ 0.047 µf < 0.47 µf ≥ 0.47 µf 0603 250 V N/A N/A ALL ≤ 200 V < 0.15 µF ≥ 0.15 µF < 2.2 µf ≥ 2.2 µf 0805 250 V < .027 µF N/A ≥ .027 µF ≤ 200 V < 0.47 µF ≥ 0.47 µF < 4.7 µf ≥ 4.7 µf 1206 250 V < 0.12 µF N/A ≥ 0.12 µF ≤ 200 V < 0.39 µF ≥ 0.39 µF < 10 µf ≥ 10 µf 1210 250 V < 0.27 µF N/A ≥ 0.27 µF 1808 ALL ALL N/A N/A 1812 ALL < 2.2 µF ≥ 2.2 µF N/A 1825 ALL ALL N/A N/A 2220 ALL < 10 µF ≥ 10 µF N/A 2225 ALL ALL N/A N/A © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dissipation Rated Capacitance Insulation EIA Case Size Capacitance Factor DC Voltage Shift Resistance (Maximum %) < 16 All 7.5 0402 16/25 All 5.0 > 25 All 3.0 < 16 7.5 16/25 < 1.0 µF 5.0 0603 > 25 3.0 All ≥ 1.0 µF 20.0 < 4.7 µF 7.5 < 16 ≥ 4.7 µF 20.0 < 4.7 µF 5.0 0805 16 ≥ 4.7 µF 20.0 25 All 5.0 10% of Initial ±20% limit > 25 All 3.0 < 16 All 7.5 12061 16/25 All 5.0 > 25 All 3.0 < 16 All 7.5 16 All 5.0 1210 25 < 10 µF 5.0 ≥ 10 µF 20.0 > 25 All 3.0 < 16 All 7.5 1808 – 2225 16/25 All 5.0 > 25 All 3.0 1 For capacitance values 4.7 µf and 10 µF DF post value is 20% (all voltages). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Dissipation Factor (DF) Limits Table Dissipation Rated DC EIA Case Size Capacitance Factor Voltage (Maximum %) < 16 5.0 0402 16/25 All 3.5 > 25 2.5 < 16 5.0 16/25 < 1.0 µF 3.5 0603 > 25 2.5 All ≥ 1.0 µF 10.0 < 4.7 µF 5.0 < 16 ≥ 4.7 µF 10.0 < 4.7 µF 3.5 0805 16 ≥ 4.7 µF 10.0 25 All 3.5 > 25 All 2.5 < 16 All 5.0 12061 16/25 All 3.5 > 25 All 2.5 < 16 5.0 All 16 3.5 1210 < 10 µF 3.5 25 ≥ 10 µF 10.0 > 25 All 2.5 < 16 5.0 1808 - 2225 16/25 All 3.5 > 25 2.5 1 For Capacitance values 4.7 µf and 10 µF DF value is 10% (all voltages). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) Case Size C0402C C0603C C0805C C1206C /Series Cap Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A Capacitance Code Rate(dV VDoCl)tage 6.3 10 16 25 50 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 Capacitance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions Tolerance 10 - 91 pF* 100 - 910* J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB 100 - 150 pF** 101 - 151** J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB 180 - 820 pF** 181 - 820** J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB 1,000 pF 102 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 1,200 pF 122 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 1,500 pF 152 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 1,800 pF 182 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 2,200 pF 222 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 2,700 pF 272 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 3,300 pF 332 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 3,900 pF 392 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 4,700 pF 472 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 5,600 pF 562 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 6,800 pF 682 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 8,200 pF 822 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 10,000 pF 103 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 12,000 pF 123 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB 15,000 pF 153 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DN DN EB EB EB EB EB EB EB EB 18,000 pF 183 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DN DN EB EB EB EB EB EB EB EB 22,000 pF 223 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DN DN EB EB EB EB EB EB EB EB 27,000 pF 273 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DE DG EB EB EB EB EB EB EB EB 33,000 pF 333 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DE DG EB EB EB EB EB EB EB EB 39,000 pF 393 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DE DG EB EB EB EB EB EC EB EB 47,000 pF 473 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DE DG DG EB EB EB EB EB EC ED ED 56,000 pF 563 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DE DG DG EB EB EB EB EB EB ED ED 68,000 pF 683 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DE DG DG EB EB EB EB EB EB ED ED 82,000 pF 823 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DE EB EB EB EB EB EB ED ED 0.10 µF 104 J K M BB BB BB CF CF CF CF CF DN DN DN DN DN DE EB EB EB EB EB EB EM EM 0.12 µF 124 J K M CF CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC EG EM 0.15 µF 154 J K M CF CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC EG EG 0.18 µF 184 J K M CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC EM EM 0.22 µF 224 J K M CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC EG EG 0.27 µF 274 J K M CF CF CF DP DP DP DP DP EB EB EB EB EC EM 0.33 µF 334 J K M CF CF CF DP DP DP DP DP EB EB EB EB EC EG 0.39 µF 394 J K M CF CF CF DG DG DG DG DE EB EB EB EB EC EG 0.47 µF 474 J K M CF CF CF DP DP DP DP DE EC EC EC EC EC EG 0.56 µF 564 J K M DP DP DP DG DH ED ED ED ED EC EM 0.68 µF 684 J K M DP DP DP DG DH EE EE EE EE ED EM 0.82 µF 824 J K M DP DP DP DG EF EF EF EF ED EH 1.0 µF 105 J K M CJ¹ CJ¹ CJ¹ DP DP DP DG EF EF EF EG ED EH 1.2 µF 125 J K M DE DE DE ED ED ED EG EH 1.5 µF 155 J K M DG DG DG EF EF EF EG EH 1.8 µF 185 J K M DG DG DG ED ED ED EF EH 2.2 µF 225 J K M DG DG DG ED ED ED EF EH 2.7 µF 275 J K M EN EN EN EH 3.3 µF 335 J K M ED ED ED EH 3.9 µF 395 J K M EF EF EF EH Rate(dV VDoCl)tage 6.3 10 16 25 50 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 Capacitance Cap Code Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A Case Size C0402C C0603C C0805C C1206C /Series *Capacitance range includes E24 decade values only (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91.) **Capacitance range includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82.) xx1 Available only in K and M tolerances. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) cont'd Case Size C0402C C0603C C0805C C1206C /Series Cap Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A Capacitance Code Rate(dV VDoCl)tage 6.3 10 16 25 50 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 Capacitance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions Tolerance 4.7 µF 475 J K M DG DG DG EF EH EH EH 5.6 µF 565 J K M EH EH EH 6.8 µF 685 J K M EH EH EH 8.2 µF 825 J K M EH EH EH 10 µF 106 J K M DH DH EH EH EH EH Rate(dV VDoCl)tage 6.3 10 16 25 50 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 Capacitance Cap Code Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A Case Size C0402C C0603C C0805C C1206C /Series *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91) **Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82) xx¹ Available only in K andM tolerance. Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) Case Size C1210C C1808C C1812C C1825C C2220C /Series Cap Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A Capacitance Code Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 250 50 100 200 25 50 100 200 250 50 100 200 250 25 50 100 200 250 Capacitance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions Tolerance 10 - 91 pF* 100 - 910* J K M FB FB FB FB FB FB FB 100 - 270 pF** 101 - 271** J K M FB FB FB FB FB FB FB 330 pF 331 J K M FB FB FB FB FB FB FB LF LF LF 390 pF 391 J K M FB FB FB FB FB FB FB LF LF LF 470 - 820 pF** 471 - 821** J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB 1,000 pF 102 J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB 1,200 pF 122 J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB 1,500 pF 152 J K M FB FB FB FB FB FB FE LF LF LF GB GB GB GB 1,800 pF 182 J K M FB FB FB FB FB FB FE LF LF LF GB GB GB GB 2,200 pF 222 J K M FB FB FB FB FB FB FB FB LF LF LF GB GB GB GB 2,700 pF 272 J K M FB FB FB FB FB FB FB FB LF LF LF GB GB GB GB 3,300 pF 332 J K M FB FB FB FB FB FB FB FB LF LF GB GB GB GB 3,900 pF 392 J K M FB FB FB FB FB FB FB FB LF LF GB GB GB GB 4,700 pF 472 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GD 5,600 pF 562 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GH 6,800 pF 682 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE 8,200 pF 822 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE 10,000 pF 103 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE 12,000 pF 123 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE 15,000 pF 153 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 250 50 100 200 25 50 100 200 250 50 100 200 250 25 05 100 200 250 Capacitance Cap Code Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A Case Size C1210C C1808C C1812C C1825C C2220C /Series *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91) **Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) cont'd Case Size C1210C C1808C C1812C C1825C C2220C /Series Cap Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A Capacitance Code Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 250 50 100 200 25 50 100 200 250 50 100 200 250 25 50 100 200 250 Capacitance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions Tolerance 18,000 pF 183 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE 22,000 pF 223 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB JE JE 27,000 pF 273 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB JE JE 33,000 pF 333 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB JB JB 39,000 pF 393 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB JB JB 47,000 pF 473 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB JB JB 56,000 pF 563 J K M FB FB FB FB FB FB FC FC LD LD GB GB GB GB GB HB HB HB JB JB 68,000 pF 683 J K M FB FB FB FB FB FB FC FC LD GB GB GB GB GB HB HB HB JB JB 82,000 pF 823 J K M FB FB FB FB FB FC FF FF LD GB GB GB GB GB HB HB HB JB JC JC JC 0.10 µF 104 J K M FB FB FB FB FB FD FG FG LD GB GB GB GB GB HB HB HB JB JC JC JC 0.12 µF 124 J K M FB FB FB FB FB FD FH FH LD GB GB GB GB GB HB HB HB JB JC JC JC 0.15 µF 154 J K M FC FC FC FC FC FD FM FM LD GB GB GB GE GE HB HB HB JB JC JC JC 0.18 µF 184 J K M FC FC FC FC FC FD FK FK LD GB GB GB GG GG HB HB HB JB JC JC JC 0.22 µF 224 J K M FC FC FC FC FC FD FK FK GB GB GB GG GG HB HB HB JB JC JC JC 0.27 µF 274 J K M FC FC FC FC FC FD FP FP GB GB GG GG GG HB HB HB JC JC JC JC 0.33 µF 334 J K M FD FD FD FD FD FD FM FM GB GB GG GG GG HB HB HB JC JC JC JC 0.39 µF 394 J K M FD FD FD FD FD FD FK FK GB GB GG GG GG HD HD HD JC JC JC JC 0.47 µF 474 J K M FD FD FD FD FD FD FS FS GB GB GG GJ GJ HD HD HD JC JC JC JC 0.56 µF 564 J K M FD FD FD FD FD FF GC GC GG HD HD HD JD JD JD JD 0.68 µF 684 J K M FD FD FD FD FD FG GC GC GG HD HD HD JD JD JD JD 0.82 µF 824 J K M FF FF FF FF FF FL GE GE GG HF HF HF JF JF JF JF 1.0 µF 105 J K M FH FH FH FH FH FM GE GE GG HF HF HF JF JF JF JF 1.2 µF 125 J K M FH FH FH FH FG FH GB GB GB JC 1.5 µF 155 J K M FH FH FH FH FG FM GC GC GC JC 1.8 µF 185 J K M FH FH FH FH FG FJ GE GE GE JD 2.2 µF 225 J K M FJ FJ FJ FJ FG FK GO GO GG JF 2.7 µF 275 J K M FE FE FE FG FH GJ GJ GJ 3.3 µF 335 J K M FF FF FF FM FM GL GL GL 3.9 µF 395 J K M FG FG FG FG FK 4.7 µF 475 J K M FC FC FC FG FS GK GK JF 5.6 µF 565 J K M FF FF FF FH 6.8 µF 685 J K M FG FG FG FM 8.2 µF 825 J K M FH FH FH FK 10 µF 106 J K M FH FH FH FS GK JO 22 µF 226 J K M FS FS Rate(dV VDoCl)tage 6.3 10 16 25 50 100 200 250 50 100 200 25 50 100 200 250 50 100 200 250 25 50 100 200 250 Capacitance Cap Code Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A Case Size C1210C C1808C C1812C C1825C C2220C /Series *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91) **Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Thickness Case Thickness ± Paper Quantity1 Plastic Quantity Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel BB 0402 0.50 ± 0.05 10,000 50,000 0 0 CF 0603 0.80 ± 0.07* 4,000 15,000 0 0 CJ 0603 0.80 ± 0.15* 4,000 15,000 0 0 DN 0805 0.78 ± 0.10* 4,000 15,000 0 0 DP 0805 0.90 ± 0.10* 4,000 15,000 0 0 DE 0805 1.00 ± 0.10 0 0 2,500 10,000 DG 0805 1.25 ± 0.15 0 0 2,500 10,000 DH 0805 1.25 ± 0.20 0 0 2,500 10,000 EB 1206 0.78 ± 0.10 4,000 10,000 4,000 10,000 EC 1206 0.90 ± 0.10 0 0 4,000 10,000 EN 1206 0.95 ± 0.10 0 0 4,000 10,000 ED 1206 1.00 ± 0.10 0 0 2,500 10,000 EE 1206 1.10 ± 0.10 0 0 2,500 10,000 EF 1206 1.20 ± 0.15 0 0 2,500 10,000 EM 1206 1.25 ± 0.15 0 0 2,500 10,000 EG 1206 1.60 ± 0.15 0 0 2,000 8,000 EH 1206 1.60 ± 0.20 0 0 2,000 8,000 FB 1210 0.78 ± 0.10 0 0 4,000 10,000 FC 1210 0.90 ± 0.10 0 0 4,000 10,000 FD 1210 0.95 ± 0.10 0 0 4,000 10,000 FE 1210 1.00 ± 0.10 0 0 2,500 10,000 FF 1210 1.10 ± 0.10 0 0 2,500 10,000 FG 1210 1.25 ± 0.15 0 0 2,500 10,000 FL 1210 1.40 ± 0.15 0 0 2,000 8,000 FH 1210 1.55 ± 0.15 0 0 2,000 8,000 FP 1210 1.60 ± 0.20 0 0 2,000 8,000 FM 1210 1.70 ± 0.20 0 0 2,000 8,000 FJ 1210 1.85 ± 0.20 0 0 2,000 8,000 FK 1210 2.10 ± 0.20 0 0 2,000 8,000 FS 1210 2.50 ± 0.30 0 0 1,000 4,000 7" Reel 13" Reel 7" Reel 13" Reel Thickness Case Thickness ± Code Size1 Range (mm) Paper Quantity1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape & Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information." © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 2 – Chip Thickness/Tape & Reel Packaging Quantities cont'd. Thickness Case Thickness ± Paper Quantity1 Plastic Quantity Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel NA 1706 0.90 ± 0.10 0 0 4,000 10,000 NC 1706 1.00 ± 0.15 0 0 4,000 10,000 LD 1808 0.90 ± 0.10 0 0 2,500 10,000 LF 1808 1.00 ± 0.15 0 0 2,500 10,000 GB 1812 1.00 ± 0.10 0 0 1,000 4,000 GC 1812 1.10 ± 0.10 0 0 1,000 4,000 GD 1812 1.25 ± 0.15 0 0 1,000 4,000 GE 1812 1.30 ± 0.10 0 0 1,000 4,000 GH 1812 1.40 ± 0.15 0 0 1,000 4,000 GG 1812 1.55 ± 0.10 0 0 1,000 4,000 GK 1812 1.60 ± 0.20 0 0 1,000 4,000 GJ 1812 1.70 ± 0.15 0 0 1,000 4,000 GL 1812 1.90 ± 0.20 0 0 500 2,000 GO 1812 2.50 ± 0.20 0 0 500 2,000 HB 1825 1.10 ± 0.15 0 0 1,000 4,000 HD 1825 1.30 ± 0.15 0 0 1,000 4,000 HF 1825 1.50 ± 0.15 0 0 1,000 4,000 JB 2220 1.00 ± 0.15 0 0 1,000 4,000 JC 2220 1.10 ± 0.15 0 0 1,000 4,000 JD 2220 1.30 ± 0.15 0 0 1,000 4,000 JE 2220 1.40 ± 0.15 0 0 1,000 4,000 JF 2220 1.50 ± 0.15 0 0 1,000 4,000 JO 2220 2.40 ± 0.15 0 0 500 2,000 7" Reel 13" Reel 7" Reel 13" Reel Thickness Case Thickness ± Code Size1 Range (mm) Paper Quantity1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape & Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information." © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 Density Level A: Density Level B: Density Level C: EIA Metric Maximum (Most) Median (Nominal) Minimum (Least) Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm) Code Code C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 12101 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 1 Only for capacitance values ≥ 22 µF Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X V2 C C Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. The KEMET recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish T Profile Feature P Maximum Ramp Up Rate = 3°C/second tP SnPb 100% Matte Sn Maximum Ramp Down Rate = 6°C/second T Preheat/Soak e L tL r Temperature Minimum (TSmin) 100°C 150°C ratu Tsmax Temperature Maximum (T ) 150°C 200°C e Smax mp T Time (t) from T to T 60 – 120 seconds 60 – 120 seconds e smin t S Smin Smax T s 3°C/second 3°C/second Ramp-Up Rate (T to T ) L P maximum maximum Liquidous Temperature (TL) 183°C 217°C 25 25°C to Peak Time Above Liquidous (t) 60 – 150 seconds 60 – 150 seconds Time L Peak Temperature (T ) 235°C 260°C P Time Within 5°C of Maximum 20 seconds 30 seconds Peak Temperature (t ) maximum maximum P 6°C/second 6°C/second Ramp-Down Rate (T to T) P L maximum maximum Time 25°C to Peak 6 minutes 8 minutes Temperature maximum maximum Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Construction (Typical) Detailed Cross Section Dielectric Material (BaTiO) 3 Barrier Layer Dielectric (Ni) Material (BaTiO3) Termination Finish End Termination/ (100% Matte Sn) External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are Marking appears in legible contrast. Illustrated below normally supplied unmarked. If required, they can be is an example of an MLCC with laser marking of “KA8”, marked as an extra cost option. Marking is available which designates a KEMET device with rated capacitance on most KEMET devices, but must be requested using of 100 µF. Orientation of marking is vendor optional. the correct ordering code identifi er(s). If this option is requested, two sides of the ceramic body will be laser marked with a “K” to identify KEMET, followed by two characters (per EIA–198 - see table below) to identify the capacitance value. EIA 0603 case size devices are limited 2-Digit KEMET to the “K” character only. Capacitance ID Code Laser marking option is not available on: • C0G, ultra stable X8R and Y5V dielectric devices. • EIA 0402 case size devices. • EIA 0603 case size devices with fl exible termination option. • KPS commercial and automotive grade stacked devices. • X7R dielectric products in capacitance values outlined below. EIA Case Size Metric Size Code Capacitance 0603 1608 ≤ 170 pF 0805 2012 ≤ 150 pF 1206 3216 ≤ 910 pF 1210 3225 ≤ 2,000 pF 1808 4520 ≤ 3,900 pF 1812 4532 ≤ 6,700 pF 1825 4564 ≤ 0.018 µF 2220 5650 ≤ 0.027 µF 2225 5664 ≤ 0.033 µF © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Capacitor Marking (Optional) cont’d Capacitance (pF) For Various Alpha/Numeral Identifi ers Numeral Alpha 9 0 1 2 3 4 5 6 7 8 Character Capacitance (pF) A 0.10 1.0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000 B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000 C 0.12 1.2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000 D 0.13 1.3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000 E 0.15 1.5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000 F 0.16 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000 G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.20 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 3.3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.50 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.60 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.70 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.90 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel KEMET ® Epumnbcohsesde pda pplears tciac*rr ioerr . Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm Anti-static cover tape or 16 mm carrier tape 178 mm (7.00") (0.10 mm (0.004") maximum thickness) or 330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm) New 2 mm Pitch Reel Options* Embossed Plastic Punched Paper Tape Packaging EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Ordering Code Packaging Type/Options (W)* Pitch (P)* Pitch (P)* 1 1 (C-Spec) 01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked 0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked C-7081 Commercial grade 7" reel unmarked 0805 8 4 4 4 4 C-7082 Commercial grade 13" reel unmarked 1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size. 1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development. ≥ 1812 12 8 8 Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing KPS 1210 12 8 8 • Lower placement costs. KPS 1812 • Double the parts on each reel results in fewer reel 16 12 12 and 2220 changes and increased effi ciency. Array 0612 8 4 4 • Fewer reels result in lower packaging, shipping and *Refer to Figures 1 and 2 for W and P carrier tape reference locations. storage costs, reducing waste. 1 *Refer to Tables 6 and 7 for tolerance specifi cations. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions T P 2 T2 ØD0 P0 t(o1l0e rpaintcchee osn c tuampuel a±0ti.v2e mm) E1 A 0 F K 0 W B1 B0 E2 S P 1 1 T1 Center Lines of Cavity ØD Embossment 1 For cavity size, Cover Tape see Note 1 Table 4 B is for tape feeder reference only, 1 including draft concentric about B0. User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) D Minimum R Reference S Minimum T T Tape Size D 1 E P P 1 1 0 Note 1 1 0 2 Note 2 Note 3 Maximum Maximum 1.0 25.0 8 mm (0.039) (0.984) 1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100 12 mm (0.059 +0.004/−0.0) 1.5 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 30 (0.024) (0.024) (0.004) (0.059) (1.181) 16 mm Variable Dimensions — Millimeters (Inches) B Maximum E T W Tape Size Pitch 1 2 F P 2 A,B & K Note 4 Minimum 1 Maximum Maximum 0 0 0 4.35 6.25 3.5 ±0.05 4.0 ±0.10 2.5 8.3 8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098) (0.327) Single (4 mm) 8.2 10.25 5.5 ±0.05 8.0 ±0.10 4.6 12.3 12 mm Note 5 and double (8 mm) (0.323) (0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181) (0.484) 12.1 14.25 7.5 ±0.05 12.0 ±0.10 4.6 16.3 16 mm Triple (12 mm) (0.476) (0.561) (0.138 ±0.002) (0.157 ±0.004) (0.181) (0.642) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independently of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6.) 3. If S < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.) 1 4. B dimension is a reference dimension for tape feeder clearance only. 1 5. The cavity defi ned by A, B and K shall surround the component with suffi cient clearance that: 0 0 0 (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.) (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4.) (e) for KPS product, A and B are measured on a plane 0.3 mm above the bottom of the pocket. 0 0 (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T ØDo Po t(o1l0e rpaintcchee osn c tuampeu l±a0ti.v2e mm) E1 A 0 F W Bottom Cover Tape B0 E2 P1 G T1 Cavity Size, T1 Top Cover Tape Center Lines of Cavity SNeoete 1, Table 7 Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) R Reference Tape Size D E P P T Maximum G Minimum 0 1 0 2 1 Note 2 0.10 1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.75 25 8 mm (0.004) (0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.030) (0.984) maximum Variable Dimensions — Millimeters (Inches) Tape Size Pitch E2 Minimum F P T Maximum W Maximum A B 1 0 0 2.0 ±0.05 8.3 8 mm Half (2 mm) 6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327) Note 1 (0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3 8 mm Single (4 mm) (0.157 ±0.004) (0.327) 1. The cavity defi ned by A, B and T shall surround the component with suffi cient clearance that: 0 0 a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3.) d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.) e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6.) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 20

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Maximum Component Rotation Top View Side View Typical Pocket Centerline Tape Maximum ° Width (mm) Rotation ( °) s T 8,12 20 Bo Tape Maximum 16 – 200 10 Width (mm) Rotation ( °) S 8,12 20 Typical Component Centerline 16 – 56 10 72 – 200 5 Ao Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius 8 mm & 12 mm Tape 16 mm Tape Embossed Punched Carrier Carrier 0.5 mm maximum 1.0 mm maximum 0.5 mm maximum 1.0 mm maximum Bending R R Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 21

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Figure 6 – Reel Dimensions W Full Radius, (Includes Access Hole at 3 See Note Slot Location flange distortion (Ø 40 mm minimum) at outer edge) W (Measured at hub) 2 A D (See Note) N C (Arbor hole W (Measured at hub) diameter) 1 If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth B (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) 1.5 13.0 +0.5/−0.2 20.2 12 mm or (0.059) (0.521 +0.02/−0.008) (0.795) 330 ±0.20 16 mm (13.000 ±0.008) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W W Maximum W 1 2 3 8.4 +1.5/−0.0 14.4 8 mm (0.331 +0.059/−0.0) (0.567) 50 12.4 +2.0/−0.0 18.4 Shall accommodate tape 12 mm (1.969) (0.488 +0.078/−0.0) (0.724) width without interference 16.4 +2.0/−0.0 22.4 16 mm (0.646 +0.078/−0.0) (0.882) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 22

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier Carrier Tape 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) 100 mm minimum leader Trailer Components 400 mm minimum 160 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes Carrier Tape (32 mm & wider tapes) Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 23

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R Dielectric, 6.3 – 250 VDC (Automotive Grade) KEMET Electronics Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1023_X7R_AUTO_SMD • 4/26/2018 24