Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Overview KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic Combined with the stability of C0G dielectric and designed to Capacitor in C0G dielectric incorporates a unique, flexible accommodate all capacitance requirements, these flex-robust termination system that is integrated with KEMET’s devices are RoHS Compliant, offer up to 5 mm of flex-bend standard termination materials. A conductive silver epoxy capability and exhibit no change in capacitance with respect is utilized between the base metal and nickel barrier to time and voltage. Capacitance change with reference to layers of KEMET’s standard termination system in order ambient temperature is limited to ±30 ppm/ºC from −55°C to to establish pliability while maintaining terminal strength, +125°C. solderability and electrical performance. This technology was developed in order to address the primary failure In addition to Commercial Grade, Automotive Grade devices mode of MLCCs– flex cracks, which are typically the result are available which meet the demanding Automotive of excessive tensile and shear stresses produced during Electronics Council's AEC–Q200 qualification requirements. board flexure and thermal cycling. Flexible termination technology inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures. Although this technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination systems. FT-CAP complements KEMET’s Open Mode, Floating Electrode (FE-CAP), Floating Electrode with Flexible Termination (FF-CAP), and KEMET Power Solutions (KPS) product lines by providing a complete portfolio of flex mitigation solutions. Ordering Information C 1206 X 563 J 3 G A C TU Rated Failure Case Size Specification/ Capacitance Capacitance Packaging/ Ceramic Voltage Dielectric Rate/ Termination Finish2 (L" x W") Series Code (pF) Tolerance1 Grade (C-Spec) (VDC) Design 0603 X = Flexible Two significant digits B = ±0.10 pF 8 = 10 G = C0G A = N/A C = 100% Matte Sn See 0805 Termination and number of zeros. C = ±0.25 pF 4 = 16 L = SnPb (5% Pb minimum) "Packaging 1206 Use 9 for 1.0 – 9.9 pF D = ±0.5 pF 3 = 25 C-Spec 1210 Use 8 for 0.5 – .99 pF F = ±1% 5 = 50 Ordering 1812 e.g., 2.2 pF = 229 G = ±2% 1 = 100 Options 1825 e.g., 0.5 pF = 508 J = ±5% 2 = 200 Table" below 2220 K = ±10% A = 250 2225 M = ±20% 1 Additional capacitance tolerance offerings may be available. Contact KEMET for details. 2 Additional termination finish options may be available. Contact KEMET for details. One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Packaging Type1 Ordering Code (C-Spec) Commercial Grade1 Bulk Bag Not required (Blank) 7" Reel/Unmarked TU 7411 (EIA 0603 and smaller case sizes) 13" Reel/Unmarked 7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2mm pitch2 7081 13" Reel/Unmarked/2mm pitch2 7082 Automotive Grade3 7" Reel AUTO AUTO7411 (EIA 0603 and smaller case sizes) 13" Reel/Unmarked AUTO7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2mm pitch2 3190 13" Reel/Unmarked/2mm pitch2 3191 1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging. 1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". 2 The 2mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2mm pitch option see "Tape & Reel Packaging Information". 3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information". 3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". 3 All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". Benefits • −55°C to +125°C operating temperature range • High ripple current capability • Superior flex performance (up to 5 mm) • Preferred capacitance solution at line frequencies and into • Lead (Pb)-Free, RoHS and REACH compliant the MHz range • EIA 0603, 0805, 1206, 1210, 1812, 1825, 2220, and • No capacitance change with respect to applied rated DC 2225 case sizes voltage • DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, • Negligible capacitance change with respect to temperature 200 V, and 250 V from −55°C to +125°C • Capacitance offerings ranging from 0.5 pF up to 0.47 μF • Non-polar device, minimizing installation concerns • Available capacitance tolerances of ±0.10pF, ±0.25 pF, • 100% pure matte tin-plated termination finish allowing for ±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20% excellent solderability • No piezoelectric noise • Commercial & Automotive (AEC–Q200) Grades available • Extremely low ESR and ESL • SnPb termination finish option available upon request • High thermal stability (5% Pb minimum) Applications Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression and blocking, as well as energy storage in critical and safety relevant circuits without (integrated) current limitation, including those subject to high levels of board flexure or temperature cycling. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below). Product Change Notifi cation (PCN) The KEMET Product Change Notifi cation system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fi t, function, and/or reliability • Changes in manufacturing site • Product obsolescence KEMET Automotive Customer Notifi cation due to: Days prior to C-Spec implementation Process/Product change Obsolescence* KEMET assigned1 Yes (with approval and sign off) Yes 180 days Minimum AUTO Yes (without approval) Yes 90 days Minimum 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design record and specifi cation requirements are properly understood and fulfi lled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part KEMET Automotive PPAP (Product Part Approval Process) Level C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO ○ ○ 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. ● Part Number specifi c PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) W L T B S S EIA Size Metric Size L W B Mounting T Thickness Separation Code Code Length Width Bandwidth Technique Minimum 1.60 (0.064) 0.80 (0.032) 0.45 (0.018) 0603 1608 0.58 (0.023) ±0.17 (0.007) ±0.15 (0.006) ±0.15 (0.006) Solder Wave 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) 0805 2012 0.75 (0.030) or ±0.30 (0.012) ±0.30 (0.012) ±0.25 (0.010) Solder Reflow 3.30 (0.130) 1.60 (0.063) 0.60 (0.024) 1206 3216 ±0.40 (0.016) ±0.35 (0.013) ±0.25 (0.010) 3.30 (0.130) 2.60 (0.102) 0.60 (0.024) 1210 3225 ±0.40 (0.016) ±0.30 (0.012) See Table 2 for ±0.25 (0.010) 4.50 (0.178) 3.20 (0.126) Thickness 0.70 (0.028) 1812 4532 ±0.40 (0.016) ±0.30 (0.012) ±0.35 (0.014) N/A 4.60 (0.181) 6.40 (0.252) 0.70 (0.028) Solder Reflow 1825 4564 ±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014) Only 5.90 (0.232) 5.00 (0.197) 0.70 (0.028) 2220 5650 ±0.75 (0.030) ±0.40 (0.016) ±0.35 (0.014) 5.90 (0.232) 6.40 (0.248) 0.70 (0.028) 2225 5664 ±0.75 (0.030) ±0.40 (0.016) ±0.35 (0.014) Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to ±30 ppm/ºC +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) 0% 250% of rated voltage 1Dielectric Withstanding Voltage (DWV) (5±1 seconds and charge/discharge not exceeding 50 mA) 2Dissipation Factor (DF) Maximum Limit at 25ºC 0.1% 1,000 megohm microfarads or 100 GΩ 3Insulation Resistance (IR) Limit at 25°C (Rated voltage applied for 120±5 seconds at 25°C) 1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 2 Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF 1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF 3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Rated DC Capacitance Dissipation Factor Capacitance Insulation Dielectric Voltage Value (Maximum %) Shift Resistance 10% of Initial C0G All All 0.5 0.3% or ±0.25 pF Limit © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1206 Case Sizes) Case Size/Series C0603X C0805X C1206X Cap Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 8 4 3 5 1 2 A Capacitance Code Rated Voltage (VDC) 10 16 25 50 100 200 250 10 16 25 50 100 200 250 10 16 25 50 100 200 250 Product Availability and Chip Thickness Codes Capacitance Tolerance See Table 2 for Chip Thickness Dimensions 0.50 & 0.75 pF 508 & 758 B C D CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR 1.0 - 9.1 pF* 109 - 919* B C D CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 10 - 91 pF* 100 - 910* F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 100 pF 101 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 110 - 180 pF* 111 - 181* F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 200 - 300 pF* 201 - 301* F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 330 pF 331 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 360 pF 361 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 390 pF 391 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 430 pF 431 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 470 pF 471 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DD DD EQ EQ EQ EQ EQ EQ EQ 510 pF 511 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 560 pF 561 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 620 pF 621 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 680 pF 681 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 750 pF 751 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 820 pF 821 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 910 pF 911 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DD DD DD EQ EQ EQ EQ EQ EQ EQ 1,000 pF 102 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DD DD DD EQ EQ EQ EQ EQ EQ EQ 1,100 pF 112 F G J K M CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 1,200 pF 122 F G J K M CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ 1,300 pF 132 F G J K M CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ER ER ER 1,500 pF 152 F G J K M CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ER ER 1,600 pF 162 F G J K M CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ES ES 1,800 pF 182 F G J K M CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ES ES 2,000 pF 202 F G J K M CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ ES ES ES 2,200 pF 222 F G J K M CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ ET ET ET 2,400 pF 242 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ ER ER ER 2,700 pF 272 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ ER ER ER 3,000 pF 302 F G J K M CJ CJ CJ CJ CJ DD DD DD DD DR DR DR ER ER ER ER ER EQ EQ 3,300 pF 332 F G J K M CJ CJ CJ CJ CJ DD DD DD DD DR DR DR ER ER ER ER ET EQ EQ 3,600 pF 362 F G J K M CJ CJ CJ CJ CJ DD DD DD DD DR DD DD ER ER ER ER ET EQ EQ 3,900 pF 392 F G J K M CJ CJ CJ CJ CJ DS DS DS DS DR DD DD ER ER ER ER EF EQ EQ 4,300 pF 432 F G J K M CJ CJ CJ CJ CJ DS DS DS DS DR DD DD ER ER ER ER ER EQ EQ 4,700 pF 472 F G J K M CJ CJ CJ CJ CJ DS DS DS DS DR DD DD ER ER ER ER ER EQ EQ 5,100 pF 512 F G J K M CJ CJ CJ CJ DS DS DS DS DR DD DD ES ES ES ES ES EQ EQ 5,600 pF 562 F G J K M CJ CJ CJ CJ DR DR DR DR DR DD DD ES ES ES ES ES EQ EQ 6,200 pF 622 F G J K M CJ CJ CJ CJ DR DR DR DR DR DG DG EQ EQ EQ EQ EQ EQ EQ 6,800 pF 682 F G J K M CJ CJ CJ CJ DR DR DR DR DR DG DG EQ EQ EQ EQ EQ EQ EQ 7,500 pF 752 F G J K M CJ CJ CJ DR DR DR DR DR DG DG EQ EQ EQ EQ EQ EQ EQ 8,200 pF 822 F G J K M CJ CJ CJ DR DR DR DR DR DG DG ER ER ER ER EQ ER ER 9,100 pF 912 F G J K M CJ CJ CJ DR DR DR DR DR ER ER ER ER EQ ER ER 10,000 pF 103 F G J K M CJ CJ CJ DR DR DR DR DD ES ES ES ES EQ ER ER 12,000 pF 123 F G J K M CJ CJ CJ DR DR DR DR DS EQ EQ EQ EQ EQ ES ES 15,000 pF 153 F G J K M CJ CJ CJ DR DR DR DD DG EQ EQ EQ EQ EQ EF EF 18,000 pF 183 F G J K M DR DR DR DD EQ EQ EQ EQ EQ EH EH 22,000 pF 223 F G J K M DD DD DD DF EQ EQ EQ EQ ER EH EH 27,000 pF 273 F G J K M DF DF DF EQ EQ EQ EQ ET 33,000 pF 333 F G J K M DG DG DG EQ EQ EQ EQ ET 39,000 pF 393 F G J K M DG DG DG ER ER ER ET EH 47,000 pF 473 F G J K M DG DG DG ER ER ER ET EH 56,000 pF 563 F G J K M ES ES ES EF 68,000 pF 683 F G J K M EF EF EF EH 82,000 pF 823 F G J K M EH EH EH EH 0.10 µF 104 F G J K M EH EH EH Rated Voltage (VDC) 10 16 25 50 100 200 250 10 16 25 50 100 200 250 10 16 25 50 100 200 250 Cap Capacitance Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 8 4 3 5 1 2 A Code Case Size/Series C0603X C0805X C1206X *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes) Case Size/Series C1210X C1812X C1825X C2220X C2225X Cap Voltage Code 8 4 3 5 1 2 A 5 1 2 A 5 1 2 A 5 1 2 A 5 1 2 A Capacitance Code Rated Voltage (VDC) 10 16 25 50 100 200 250 50 100 200 250 50 100 200 250 50 100 200 250 50 100 200 250 Product Availability and Chip Thickness Codes Capacitance Tolerance See Table 2 for Chip Thickness Dimensions 1.0 - 9.1 pF* 109 - 919* B C D FN FN FN FN FN FN FN 10 - 91 pF* 100 - 910* F G J K M FN FN FN FN FN FN FN 100 - 430 pF* 101 - 431* F G J K M FN FN FN FN FN FN FN 470 - 910 pF* 471 - 911* F G J K M FN FN FN FN FN FN FN GB GB GB GB 1,000 pF 102 F G J K M FN FN FN FN FN FN FN GB GB GB GB 1,100 pF 112 F G J K M FN FN FN FN FN FN FN GB GB GB GB 1,200 pF 122 F G J K M FN FN FN FN FN FN FN GB GB GB GB 1,300 pF 132 F G J K M FN FN FN FN FN FQ FQ GB GB GB GB 1,500 pF 152 F G J K M FN FN FN FN FN FE FE GB GB GB GB 1,600 pF 162 F G J K M FN FN FN FN FN FE FE GB GB GB GB 1,800 pF 182 F G J K M FN FN FN FN FN FE FE GB GB GB GB 2,000 pF 202 F G J K M FN FN FN FN FQ FE FE GB GB GB GB 2,200 pF 222 F G J K M FN FN FN FN FQ FZ FZ GB GB GB GB 2,400 pF 242 F G J K M FN FN FN FN FQ FQ FQ 2,700 pF 272 F G J K M FN FN FN FN FQ FQ FQ GB GB GB GB 3,000 pF 302 F G J K M FN FN FN FN FQ FA FA 3,300 pF 332 F G J K M FN FN FN FN FA FA FA GB GB GB GB 3,600 pF 362 F G J K M FN FN FN FN FA FA FA 3,900 pF 392 F G J K M FN FN FN FN FA FA FA GB GB GB GB HB HB HB HB 4,300 pF 432 F G J K M FN FN FN FN FA FA FA 4,700 pF 472 F G J K M FA FA FA FA FZ FZ FZ GB GB GD GD HB HB HB HB KE KE KE KE 5,100 pF 512 F G J K M FN FN FN FN FZ FZ FZ KE KE KE KE 5,600 pF 562 F G J K M FN FN FN FN FZ FZ FZ GB GB GH GH HB HB HB HB KE KE KE KE 6,200 pF 622 F G J K M FN FN FN FN FZ FN FN KE KE KE KE 6,800 pF 682 F G J K M FN FN FN FN FZ FN FN GB GB GJ GJ HB HB HB HB JE JE JB KE KE KE KE 7,500 pF 752 F G J K M FQ FQ FQ FQ FQ FN FN KE KE KE KE 8,200 pF 822 F G J K M FQ FQ FQ FQ FQ FN FN GB GH GB GB HB HB HB HB JE JE JB KE KE KE KE 9,100 pF 912 F G J K M FE FE FE FE FE FN FN KE KE KE KE 10,000 pF 103 F G J K M FA FA FA FA FA FN FN GB GH GB GB HB HB HE HE JE JE JB KE KE KE KE 12,000 pF 123 F G J K M FZ FZ FZ FZ FN FN FN GB GG GB GB HB HB HE HE JE JE JB KE KE KE KE 15,000 pF 153 F G J K M FZ FZ FZ FZ FN FQ FQ GB GB GB GB HB HB JE JE JB KE KE KE KE 18,000 pF 183 F G J K M FN FN FN FN FN FQ FQ GB GB GB GB HB HE JE JE JB KE KE 22,000 pF 223 F G J K M FN FN FN FN FN FA FA GB GB GB GB HB HE JE JB JB KE KE 27,000 pF 273 F G J K M FN FN FN FN FN FZ FZ GB GB GB GB HB HG JE JB JB KE KE 33,000 pF 333 F G J K M FN FN FN FN FN FU FU GB GB GB GB JB JB JB KE 39,000 pF 393 F G J K M FN FN FN FN FE FU FU GB GB GB GB JB JB JB 47,000 pF 473 F G J K M FN FN FN FN FE FJ FJ GB GB GD GD JB JB JB 56,000 pF 563 F G J K M FN FN FN FN FA GB GB GD GD JB JB JB 68,000 pF 683 F G J K M FN FN FN FQ FZ GB GB GK GK JB JB JB 82,000 pF 823 F G J K M FQ FQ FQ FA FU GB GB GM GM JB JB JB 0.10 µF 104 F G J K M FE FE FE FZ FM GB GD GM GM JB JB JD 0.12 µF 124 F G J K M FZ FZ FZ FU GB GH JB JB JD 0.15 µF 154 F G J K M FU FU FU FM GD GN JB JB JG 0.18 µF 184 F G J K M FJ FJ FJ GH JB JD JG 0.22 µF 224 F G J K M FK FK FK GK JB JD 0.27 µF 274 F G J K M JB JF 0.33 µF 334 F G J K M JD JG 0.39 µF 394 F G J K M JG 0.47 µF 474 F G J K M JG Rated Voltage (VDC) 10 16 25 50 100 200 250 50 100 200 250 50 100 200 250 50 100 200 50 100 200 250 Capacitance Cap Voltage Code 8 4 3 5 1 2 A 5 1 2 A 5 1 2 A 5 1 2 5 1 2 A Code Case Size/Series C1210X C1812X C1825X C2220X C2225X *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91) These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Thickness Case Thickness ± Paper Quantity1 Plastic Quantity Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel CJ 0603 0.80 ± 0.15 4,000 15,000 0 0 CH 0603 0.85 ± 0.07 4,000 10,000 0 0 DR 0805 0.78 ± 0.20 0 0 4,000 10,000 DD 0805 0.90 ± 0.10 0 0 4,000 10,000 DS 0805 1.00 ± 0.20 0 0 2,500 10,000 DF 0805 1.10 ± 0.10 0 0 2,500 10,000 DG 0805 1.25 ± 0.15 0 0 2,500 10,000 EQ 1206 0.78 ± 0.20 4,000 10,000 4,000 10,000 ER 1206 0.90 ± 0.20 0 0 4,000 10,000 ES 1206 1.00 ± 0.20 0 0 2,500 10,000 ET 1206 1.10 ± 0.20 0 0 2,500 10,000 EF 1206 1.20 ± 0.15 0 0 2,500 10,000 EH 1206 1.60 ± 0.20 0 0 2,000 8,000 FN 1210 0.78 ± 0.20 0 0 4,000 10,000 FQ 1210 0.90 ± 0.20 0 0 4,000 10,000 FE 1210 1.00 ± 0.10 0 0 2,500 10,000 FA 1210 1.10 ± 0.15 0 0 2,500 10,000 FZ 1210 1.25 ± 0.20 0 0 2,500 10,000 FU 1210 1.55 ± 0.20 0 0 2,000 8,000 FM 1210 1.70 ± 0.20 0 0 2,000 8,000 FJ 1210 1.85 ± 0.20 0 0 2,000 8,000 FK 1210 2.10 ± 0.20 0 0 2,000 8,000 GB 1812 1.00 ± 0.10 0 0 1,000 4,000 GD 1812 1.25 ± 0.15 0 0 1,000 4,000 GH 1812 1.40 ± 0.15 0 0 1,000 4,000 GG 1812 1.55 ± 0.10 0 0 1,000 4,000 GK 1812 1.60 ± 0.20 0 0 1,000 4,000 GJ 1812 1.70 ± 0.15 0 0 1,000 4,000 GN 1812 1.70 ± 0.20 0 0 1,000 4,000 GM 1812 2.00 ± 0.20 0 0 500 2,000 HB 1825 1.10 ± 0.15 0 0 1,000 4,000 HE 1825 1.40 ± 0.15 0 0 1,000 4,000 HG 1825 1.60 ± 0.20 0 0 1,000 4,000 JB 2220 1.00 ± 0.15 0 0 1,000 4,000 JD 2220 1.30 ± 0.15 0 0 1,000 4,000 JE 2220 1.40 ± 0.15 0 0 1,000 4,000 JF 2220 1.50 ± 0.15 0 0 1,000 4,000 JG 2220 1.70 ± 0.15 0 0 1,000 4,000 KE 2225 1.40 ± 0.15 0 0 1,000 4,000 7" Reel 13" Reel 7" Reel 13" Reel Thickness Case Thickness ± Code Size1 Range (mm) Paper Quantity1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Table 2B – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec1 N/A2 Case Size Packaging Quantities (pieces/unit packaging) EIA (in) Metric (mm) Minimum Maximum 0402 1005 0603 1608 0805 2012 50,000 1206 3216 1210 3225 1 1808 4520 1812 4532 1825 4564 20,000 2220 5650 2225 5664 1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products. 2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm) Density Level A: Density Level B: Density Level C: EIA Metric Maximum (Most) Median (Nominal) Minimum (Least) Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm) Code Code C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20 0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81 1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16 1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11 1812 4532 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1825 4564 2.15 1.80 6.90 7.10 7.90 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00 2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60 2225 5664 2.85 2.10 6.90 8.80 7.90 2.75 1.90 6.80 7.90 7.30 2.65 1.70 6.70 7.20 7.00 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X V2 C C Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J- STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish T Profile Feature P Maximum Ramp Up Rate = 3ºC/sec tP SnPb 100% Matte Sn Maximum Ramp Down Rate = 6ºC/sec T Preheat/Soak e L tL r Temperature Minimum (TSmin) 100°C 150°C ratu Tsmax Temperature Maximum (T ) 150°C 200°C e Smax mp T Time (t) from T to T 60 – 120 seconds 60 – 120 seconds e smin t S Smin Smax T s 3°C/second 3°C/second Ramp-Up Rate (T to T ) L P maximum maximum 25 25ºC to Peak Liquidous Temperature (T) 183°C 217°C L Time Time Above Liquidous (t) 60 – 150 seconds 60 – 150 seconds L Peak Temperature (T ) 235°C 260°C P Time Within 5°C of Maximum 20 seconds 30 seconds Peak Temperature (t ) maximum maximum P 6°C/second 6°C/second Ramp-Down Rate (T to T) P L maximum maximum Time 25°C to Peak 6 minutes 8 minutes Temperature maximum maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm Board Flex JIS–C–6429 for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X. Conditions: a) Method B, 4 hours at 155°C, dry heat at 235°C Solderability J–STD–002 b) Method B at 215°C category 3 c) Method D, category 3 at 260°C Temperature Cycling JESD22 Method JA–104 1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/−4 hours after test conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. MIL–STD–202 Method Measurement at 24 hours +/−4 hours after test conclusion. Biased Humidity 103 Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/−4 hours after test conclusion. MIL–STD–202 Method t = 24 hours/cycle. Steps 7a and 7b not required. Moisture Resistance 106 Measurement at 24 hours +/−4 hours after test conclusion. MIL–STD–202 Method −55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 Thermal Shock 107 seconds, dwell time – 15 minutes. Air – Air. MIL–STD–202 Method High Temperature Life 108 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied. /EIA–198 MIL–STD–202 Method Storage Life 150°C, 0 VDC for 1,000 hours. 108 5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick MIL–STD–202 Method Vibration 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts 204 mounted within 2" from any secure point. Test from 10 – 2,000 Hz MIL–STD–202 Method Mechanical Shock Figure 1 of Method 213, Condition F. 213 MIL–STD–202 Method Resistance to Solvents Add aqueous wash chemical, OKEM Clean or equivalent. 215 Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Construction Detailed Cross Section Dielectric Material (CaZrO) 3 Barrier Layer End Termination/ (Ni) External Electrode Termination Finish (Cu) (100% Matte Epoxy Layer Sn/SnPb–5% Pb min) (Ag) Dielectric Material (CaZrO) 3 Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Termination Finish Inner Electrodes (100% Matte (Ni) Sn/SnPb–5% Pb min) Capacitor Marking (Optional): Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel KEMET ® EPmunbcohsesde dP aPplaesr tCica*r roier r. Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm Anti-Static Cover Tape or 16 mm Carrier Tape 178 mm (7.00") (.10 mm (.004") Maximum Thickness) or 330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm) New 2 mm Pitch Reel Options* Embossed Plastic Punched Paper Tape Packaging EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Ordering Code Packaging Type/Options (W)* Pitch (P)* Pitch (P)* 1 1 (C-Spec) 01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked 0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked C-7081 Commercial grade 7" reel unmarked 0805 8 4 4 4 4 C-7082 Commercial grade 13" reel unmarked 1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size. 1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development. ≥ 1812 12 8 8 Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing KPS 1210 12 8 8 • Lower placement costs • Double the parts on each reel results in fewer reel KPS 1812 & 2220 16 12 12 changes and increased effi ciency Array 0508 & 0612 8 4 4 • Fewer reels result in lower packaging, shipping and *Refer to Figures 1 & 2 for W and P carrier tape reference locations. storage costs, reducing waste 1 *Refer to Tables 6 & 7 for tolerance specifi cations. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions T P2 T2 ØDo Po [10 pitches cumulative E1 tolerance on tape ± 0.2 mm] Ao F Ko W B1 Bo E2 S1 P1 T1 Center Lines of Cavity ØD1 FEomrb coasvsitmy esnizte, Cover Tape see Note 1 Table 4 B1 is for tape feeder reference only, including draft concentric about B o. User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) D Minimum R Reference S Minimum T T Tape Size D 1 E P P 1 1 0 Note 1 1 0 2 Note 2 Note 3 Maximum Maximum 1.0 25.0 8 mm (0.039) (0.984) 1.5 +0.10/-0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100 12 mm (0.059 +0.004/- 0.0) 1.5 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 30 (0.024) (0.024) (0.004) (0.059) (1.181) 16 mm Variable Dimensions — Millimeters (Inches) B Maximum E T W Tape Size Pitch 1 2 F P 2 A,B & K Note 4 Minimum 1 Maximum Maximum 0 0 0 4.35 6.25 3.5 ±0.05 4.0 ±0.10 2.5 8.3 8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098) (0.327) Single (4 mm) & 8.2 10.25 5.5 ±0.05 8.0 ±0.10 4.6 12.3 12 mm Note 5 Double (8 mm) (0.323) (0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181) (0.484) 12.1 14.25 7.5 ±0.05 12.0 ±0.10 4.6 16.3 16 mm Triple (12 mm) (0.476) (0.561) (0.138 ±0.002) (0.157 ±0.004) (0.181) (0.642) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 1 4. B dimension is a reference dimension for tape feeder clearance only. 1 5. The cavity defi ned by A, B and K shall surround the component with suffi cient clearance that: 0 0 0 (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A and B are measured on a plane 0.3 mm above the bottom of the pocket. 0 0 (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T ØDo Po t[o1l0e rpaitncchee os nc utampuel a±t 0iv.e2 mm] E1 A0 F W B0 E2 Bottom Cover Tape P1 G T1 Cavity Size, T1 Top Cover Tape Center Lines of Cavity SNeoete 1, Table 7 Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) R Reference Tape Size D E P P T Maximum G Minimum 0 1 0 2 1 Note 2 0.10 1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.75 25 8 mm (0.004) (0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.030) (0.984) Maximum Variable Dimensions — Millimeters (Inches) Tape Size Pitch E2 Minimum F P T Maximum W Maximum A B 1 0 0 2.0 ±0.05 8.3 8 mm Half (2 mm) 6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327) Note 1 (0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3 8 mm Single (4 mm) (0.157 ±0.004) (0.327) 1. The cavity defi ned by A, B and T shall surround the component with suffi cient clearance that: 0 0 a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Maximum Component Rotation Top View Side View Typical Pocket Centerline Tape Maximum ° Width (mm) Rotation ( °) s T 8,12 20 Bo Tape Maximum 16 – 200 10 Width (mm) Rotation ( °) S 8,12 20 Typical Component Centerline 16 – 56 10 72 – 200 5 Ao Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius 8 mm & 12 mm Tape 16 mm Tape Embossed Punched Carrier Carrier 0.5 mm maximum 1.0 mm maximum 0.5 mm maximum 1.0 mm maximum Bending R R Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Figure 6 – Reel Dimensions W3 Full Radius, (Includes Access Hole at See Note Slot Location flange distortion (Ø 40 mm minimum) at outer edge) W2 (Measured at hub) A D (See Note) N C (Arbor hole W1 (Measured at hub) diameter) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth B (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) 1.5 13.0 +0.5/-0.2 20.2 12 mm or (0.059) (0.521 +0.02/-0.008) (0.795) 330 ±0.20 16 mm (13.000 ±0.008) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W W Maximum W 1 2 3 8.4 +1.5/-0.0 14.4 8 mm (0.331 +0.059/-0.0) (0.567) 50 12.4 +2.0/-0.0 18.4 Shall accommodate tape 12 mm (1.969) (0.488 +0.078/-0.0) (0.724) width without interference 16.4 +2.0/-0.0 22.4 16 mm (0.646 +0.078/-0.0) (0.882) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier Carrier Tape 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) 100 mm Minimum Leader Trailer Components 400 mm Minimum 160 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes Carrier Tape (32 mm & wider tapes) Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade) KEMET Electronic Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1062_C0G_FT-CAP_SMD • 1/9/2017 20

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: K EMET: C1206X153M2GAL7210 C1206X912J2GAC7210 C0603X751F2GAC7411 C0805X162F2GALTU C0805X472K2GACTU C1206X153KAGALTU C1210X273JAGAC7210 C1206X622JAGALTU C2220X223F2GACTU C0603X361FAGAL7411 C2220X154F2GAC7210 C0603X241F2GALTU C0805X122F2GAC7210 C0805X362K2GAC7210 C1210X822KAGACTU C0805X222G2GALTU C1206X153KAGAL7210 C0805X162JAGALTU C0805X362FAGALTU C1206X362G2GAL7210 C0805X302GAGALTU C0805X162J2GALTU C1210X183M2GACTU C2220X103F2GAC7210 C1210X822JAGALTU C0603X361KAGALTU C0603X112JAGACTU C1812X223GAGALTU C0603X112M2GALTU C1210X123KAGALTU C1206X472GAGAL7210 C0805X752GAGACTU C0805X332K2GACTU C0805X752KAGALTU C1210X183JAGALTU C2220X104J2GACTU C0805X432KAGACTU C1812X823F2GAL7210 C0603X162GAGACTU C0603X152F2GACTU C0805X622M2GAC7210 C1812X822G2GAL7210 C2220X184J2GALTU C0805X152JAGALTU C0603X221G2GAC7411 C0805X302F2GACTU C1206X123GAGAL7210 C0603X621KAGALTU C0603X361FAGAC7411 C1206X562G2GACTU C0603X431M2GALTU C0603X202F2GAC7411 C0603X162GAGAL7411 C1812X393K2GAC7210 C0603X241JAGAC7411 C1206X392KAGALTU C1206X472KAGAC7210 C0805X682F2GACTU C1210X622J2GAL7210 C0603X132M2GAC7411 C0603X182JAGAC7411 C1812X823J2GAC7210 C2220X104M2GAC7210 C1812X153MAGAC7210 C1812X103J2GACTU C1812X822G2GALTU C1210X682GAGALTU C1206X912M2GACTU C1206X682G2GAC7210 C2220X184K2GALTU C1206X183MAGAC7210 C1210X752JAGALTU C1206X302G2GACTU C1206X223MAGACTU C0603X182KAGAC7411 C0805X362FAGAL7210 C0603X102K2GAL7411 C1812X333KAGAC7210 C2220X123G2GALTU C1812X473J2GACTU C1206X103M2GAC7210 C2220X393M2GALTU C0603X301G2GAL7411 C2220X224M2GAL7210 C1206X432GAGAL7210 C0603X221G2GAL7411 C0603X132JAGAL7411 C0805X122M2GAC7210 C0603X221G2GALTU C0805X512MAGALTU C0805X132G2GAL7210 C0805X822JAGAC7210 C0805X822F2GACTU C2220X682G2GALTU C2220X683G2GALTU C1812X333M2GALTU C1210X223FAGACTU C0603X431JAGAL7411 C0603X471G2GAL7411 C1812X104KAGAL7210