Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Overview KEMET’s COTS program is an extension of KEMET knowledge of All COTS testing includes voltage conditioning and post- high reliability test regimes and requirements. KEMET regularly electrical testing as per MIL–PRF–55681. For enhanced supplies “up-screened” products by working with customer reliability, KEMET also provides the following test level options drawings and imposing specified design and test requirements. and conformance certifications: The COTS program offers the same high quality and high Test Level A Test Level B Test Level C reliability components as up-screened products, but at a lower cost to the customer. This is accomplished by eliminating the Voltage Conditioning Voltage Conditioning Voltage Conditioning need for customer-specific drawings to achieve the reliability DWV DWV DWV IR@25°C IR@25°C IR@25°C level required for customer applications. A series of tests and CAP CAP CAP DF DF DF inspections have been selected to provide the accelerated conditioning and 100% screening necessary to eliminate infant PDA 8% PDA 8% PDA 8% mortal failures from the population. C of C DPA DPA KEMET’s C0G dielectric features a 125°C maximum operating temperature and is considered “stable.” The Electronics C of C 85/85 Components, Assemblies & Materials Association (EIA) C of C characterizes C0G dielectric as a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. C0G exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to ±30 ppm/ºC from −55°C to +125°C. Ordering Information C 1206 T 104 K 5 G A C TU Rated Case Size Specification/ Capacitance Capacitance Termination Packaging/ Ceramic Voltage Dielectric Test Level (L" x W") Series Code (pF) Tolerance1 Finish2 Grade (C-Spec) (VDC) 0402 T = COTS Two significant B = ±0.10 pF 8 = 10 G = C0G A = Testing per MIL- C = 100% See 0603 digits and C = ±0.25 pF 4 = 16 PRF-55681 PDA 8% Matte Sn "Packaging 0805 number of zeros D = ±0.5 pF 3 = 25 B = Testing per MIL- L = SnPb C-Spec 1206 Use 9 for F = ± 1% 6 = 35 PRF-55681 PDA 8%, DPA (5% Pb Ordering 1210 1.0 – 9.9 pF G = ±2% 5 = 50 per EIA-469 minimum) Options 1812 Use 8 for J = ±5% 1 = 100 C = Testing per MIL- Table" 2220 0.5 – .99 pF K = ±10% 2 = 200 PRF-55681 PDA 8%, DPA e.g., 2.2 pF = 229 M = ±20% A = 250 per EIA-469, Humidity per e.g., 0.5 pF = 508 MIL-STD-202, Method 103, Condition A 1 Additional capacitance tolerance offerings may be available. Contact KEMET for details. 2 Additional termination finish options may be available. Contact KEMET for details. One world. One KEMET © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 1 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Packaging C-Spec Ordering Options Table Packaging/Grade Packaging Type1 Ordering Code (C-Spec) Bulk Bag/Unmarked Not required (Blank) 7" Reel/Unmarked TU 7411 (EIA 0603 and smaller case sizes) 13" Reel/Unmarked 7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2 mm pitch2 7081 13" Reel/Unmarked/2 mm pitch2 7082 1 Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging. 1 The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see “Capacitor Marking”. 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”. Benefits • −55°C to +125°C operating temperature range pF, ±1%, ±2%, ±5%, ±10%, and ±20% • Lead (Pb)-free, RoHS and REACH compliant • Certificate of compliance • Voltage conditioning and post-electrical testing per • No piezoelectric noise MIL–PRF–55681, Paragraph 4.8.3.1, Standard Voltage • Extremely low ESR and ESL Conditioning • High thermal stability • Destructive Physical Analysis (DPA) per EIA–469 • High ripple current capability • Humidity, steady state, low voltage (85/85) per • Preferred capacitance solution at line frequencies and into MIL–STD–202, Method 103, Condition A the MHz range • RoHS Compliant (excluding SnPb end metallization option) • No capacitance change with respect to applied rated DC • EIA 0402, 0603, 0805, 1206, 1210, 1812, and 2220 case voltage sizes • Negligible capacitance change with respect to temperature • DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, 200 V • No capacitance decay with time and 250 V • Non-polar device, minimizing installation concerns • Capacitance offerings ranging from 0.5 pF up to 0.47 μF • SnPb end metallization option available upon request • Available capacitance tolerances of ±0.10 pF, ±0.25 pF, ±0.5 (5% Pb minimum) Applications Typical applications include military, space quality and high reliability electronics. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 2 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Dimensions – Millimeters (Inches) W L T B S S EIA Size Metric Size L W T B Mounting Separation Code Code Length Width Thickness Bandwidth Technique Minimum 1.00 (0.040) 0.50 (0.020) 0.30 (0.012) Solder Reflow 0402 1005 0.30 (0.012) ±0.05 (0.002) ±0.05 (0.002) ±0.10 (0.004) Only 1.60 (0.063) 0.80 (0.032) 0.35 (0.014) 0603 1608 0.70 (0.028) ±0.15 (0.006) ±0.15 (0.006) ±0.15 (0.006) 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) Solder Wave or 0805 2012 0.75 (0.030) ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) Solder Reflow 3.20 (0.126) 1.60 (0.063) See Table 2 for 0.50 (0.02) 1206 3216 ±0.20 (0.008) ±0.20 (0.008) Thickness ±0.25 (0.010) 3.20 (0.126) 2.50 (0.098) 0.50 (0.02) 1210 3225 ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) N/A 4.50 (0.177) 3.20 (0.126) 0.60 (0.024) Solder Reflow 1812 4532 ±0.30 (0.012) ±0.30 (0.012) ±0.35 (0.014) Only 5.70 (0.224) 5.00 (0.197) 0.60 (0.024) 2220 5650 ±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014) Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 3 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to ±30 ppm/ºC +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) 0% 250% of rated voltage 1Dielectric Withstanding Voltage (DWV) (5±1 seconds and charge/discharge not exceeding 50 mA) 2Dissipation Factor (DF) Maximum Limit at 25ºC 0.1% 1,000 megohm microfarads or 100 GΩ 3Insulation Resistance (IR) Limit at 25°C (Rated voltage applied for 120±5 seconds at 25°C) 1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 2 Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF 1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF 3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Rated DC Capacitance Dissipation Factor Capacitance Insulation Dielectric Voltage Value (Maximum %) Shift Resistance 10% of Initial C0G All All 0.5 0.3% or ±0.25 pF Limit © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 4 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Table 1A – Capacitance Range/Selection Waterfall (0402 – 0805 Case Sizes) Case Size/Series C0402T C0603T C0805T Cap Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 8 4 3 5 1 2 A Capacitance Code Rated Voltage (VDC) 10 16 25 50 100 200 250 10 16 25 50 100 200 250 10 16 25 50 100 200 250 Capacitance Product Availability and Chip Thickness Codes Tolerance See Table 2 for Chip Thickness Dimensions 0.50 & 0.75 pF 508 & 758 B C D BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 1.0 - 9.1 pF* 109 - 919* B C D BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 10 - 91 pF* 100 - 910* F G J K M BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 100 pF 101 F G J K M BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 110 - 180 pF* 111 -181* F G J K M BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 200 - 270 pF* 201 - 271* F G J K M BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 300 pF 301 F G J K M BB BB BB BB BB BD BD CF CF CF CF CF CF CF DN DN DN DN DN DN DN 330 pF 331 F G J K M BB BB BB BB BB BD BD CF CF CF CF CF CF CF DN DN DN DN DN DN DN 360 pF 361 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 390 pF 391 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 430 pF 431 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 470 pF 471 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DP DP 510 - 820 pF* 511 - 821* F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 910 pF 911 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DP DP DP 1,000 pF 102 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DP DP DP 1,100 pF 112 F G J K M BB BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN 1,200 pF 122 F G J K M BB BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN 1,300 pF 132 F G J K M BB BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN 1,500 pF 152 F G J K M BB BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN 1,600 pF 162 F G J K M BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN 1,800 pF 182 F G J K M BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN 2,000 pF 202 F G J K M BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN 2,200 pF 222 F G J K M BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN 2,400 pF 242 F G J K M CF CF CF CF CF DN DN DN DN DN DN DN 2,700 pF 272 F G J K M CF CF CF CF CF DN DN DN DN DN DN DN 3,000 pF 302 F G J K M CF CF CF CF CF DP DP DP DP DN DN DN 3,300 pF 332 F G J K M CF CF CF CF CF DP DP DP DP DN DN DN 3,600 pF 362 F G J K M CF CF CF CF CF DP DP DP DP DN DP DP 3,900 pF 392 F G J K M CF CF CF CF CF DE DE DE DE DN DP DP 4,300 pF 432 F G J K M CF CF CF CF CF DE DE DE DE DN DP DP 4,700 pF 472 F G J K M CF CF CF CF CF DE DE DE DE DN DP DP 5,100 pF 512 F G J K M CF CF CF CF DE DE DE DE DN DP DP 5,600 pF 562 F G J K M CF CF CF CF DN DN DN DN DN DP DP 6,200 pF 622 F G J K M CF CF CF CF DN DN DN DN DN DG DG 6,800 pF 682 F G J K M CF CF CF CF DN DN DN DN DN DG DG 7,500 pF 752 F G J K M CF CF CF DN DN DN DN DN DG DG 8,200 pF 822 F G J K M CF CF CF DN DN DN DN DN DG DG 9,100 pF 912 F G J K M CF CF CF DN DN DN DN DN 10,000 pF 103 F G J K M CF CF CF DN DN DN DN DP 12,000 pF 123 F G J K M CF CF CF DN DN DN DN DE 15,000 pF 153 F G J K M CF CF CF DN DN DN DP DG 18,000 pF 183 F G J K M DN DN DN DP 22,000 pF 223 F G J K M DP DP DP DF 27,000 pF 273 F G J K M DF DF DF 33,000 pF 333 F G J K M DG DG DG 39,000 pF 393 F G J K M DG DG DG 47,000 pF 473 F G J K M DG DG DG Rated Voltage (VDC) 10 16 25 50 100 200 250 10 16 25 50 100 200 250 10 16 25 50 100 200 250 Capacitance Cap Code Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 8 4 3 5 1 2 A Case Size/Series C0402T C0603T C0805T *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 5 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes) Case Size/Series C1206T C1210T C1812T C2220T Cap Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 5 1 2 A 5 1 2 Capacitance Code Rated Voltage (VDC) 10 16 25 50 100 200 250 10 16 25 50 100 200 250 50 100 200 250 50 100 200 Capacitance Product Availability and Chip Thickness Codes Tolerance See Table 2 for Chip Thickness Dimensions 1.0 - 9.1 pF* 109 - 919* B C D EB EB EB EB EB EB EB FB FB FB FB FB FB FB 10 - 91 pF* 100 - 910* F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB 100 - 430 pF* 101 - 431* F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB 470 - 910 pF* 471 - 911* F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB 1,000 pF 102 F G J K M EB EB EB EB EB EE EE FB FB FB FB FB FB FB GB GB GB GB 1,100 pF 112 F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB 1,200 pF 122 F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB 1,300 pF 132 F G J K M EB EB EB EB EC EC EC FB FB FB FB FB FC FC GB GB GB GB 1,500 pF 152 F G J K M EB EB EB EB ED EC EC FB FB FB FB FB FE FE GB GB GB GB 1,600 pF 162 F G J K M EB EB EB EB ED ED ED FB FB FB FB FB FE FE GB GB GB GB 1,800 pF 182 F G J K M EB EB EB EB ED ED ED FB FB FB FB FB FE FE GB GB GB GB 2,000 pF 202 F G J K M EB EB EB EB ED ED ED FB FB FB FB FC FE FE GB GB GB GB 2,200 pF 222 F G J K M EB EB EB EB EE EE ED FB FB FB FB FC FG FG GB GB GB GB 2,400 pF 242 F G J K M EB EB EB EB EC EC EC FB FB FB FB FC FC FC 2,700 pF 272 F G J K M EB EB EB EB EC EC EC FB FB FB FB FC FC FC GB GB GB GB 3,000 pF 302 F G J K M EC EC EC EC EC EB EB FB FB FB FB FC FF FF 3,300 pF 332 F G J K M EC EC EC EC EE EB EB FB FB FB FB FF FF FF GB GB GB GB 3,600 pF 362 F G J K M EC EC EC EC EE EB EB FB FB FB FB FF FF FF 3,900 pF 392 F G J K M EC EC EC EC EF EB EB FB FB FB FB FF FF FF GB GB GB GB 4,300 pF 432 F G J K M EC EC EC EC EC EB EB FB FB FB FB FF FF FF 4,700 pF 472 F G J K M EC EC EC EC EC EB EB FF FF FF FF FG FG FG GB GB GD GD 5,100 pF 512 F G J K M ED ED ED ED ED EB EB FB FB FB FB FG FG FG 5,600 pF 562 F G J K M ED ED ED ED ED EB EB FB FB FB FB FG FG FG GB GB GH GH 6,200 pF 622 F G J K M EB EB EB EB EB EB EB FB FB FB FB FG FB FB 6,800 pF 682 F G J K M EB EB EB EB EB EB EB FB FB FB FB FG FB FB GB GB GJ GJ JE JE JB 7,500 pF 752 F G J K M EB EB EB EB EB EB EB FC FC FC FC FC FB FB 8,200 pF 822 F G J K M EC EC EC EC EB EC EC FC FC FC FC FC FB FB GB GH GB GB JE JE JB 9,100 pF 912 F G J K M EC EC EC EC EB EC EC FE FE FE FE FE FB FB 10,000 pF 103 F G J K M ED ED ED ED EB EC EC FF FF FF FF FF FB FB GB GH GB GB JE JE JB 12,000 pF 123 F G J K M EB EB EB EB EB ED ED FG FG FG FG FB FB FB GB GG GB GB JE JE JB 15,000 pF 153 F G J K M EB EB EB EB EB EF EF FG FG FG FG FB FC FC GB GB GB GB JE JE JB 18,000 pF 183 F G J K M EB EB EB EB EB EH EH FB FB FB FB FB FC FC GB GB GB GB JE JE JB 22,000 pF 223 F G J K M EB EB EB EB EC EH EH FB FB FB FB FB FF FF GB GB GB GB JE JB JB 27,000 pF 273 F G J K M EB EB EB EB EE FB FB FB FB FB FG FG GB GB GB GB JE JB JB 33,000 pF 333 F G J K M EB EB EB EB EE FB FB FB FB FB FH FH GB GB GB GB JB JB JB 39,000 pF 393 F G J K M EC EC EC EE EH FB FB FB FB FE FH FH GB GB GB GB JB JB JB 47,000 pF 473 F G J K M EC EC EC EE EH FB FB FB FB FE FJ FJ GB GB GD GD JB JB JB 56,000 pF 563 F G J K M ED ED ED EF FB FB FB FB FF GB GB GD GD JB JB JB 68,000 pF 683 F G J K M EF EF EF EH FB FB FB FC FG GB GB GK GK JB JB JB 82,000 pF 823 F G J K M EH EH EH EH FC FC FC FF FH GB GB GM GM JB JB JB 0.10 µF 104 F G J K M EH EH EH FE FE FE FG FM GB GD GM GM JB JB JD 0.12 µF 124 F G J K M FG FG FG FH GB GH JB JB JD 0.15 µF 154 F G J K M FH FH FH FM GD GN JB JB JG 0.18 µF 184 F G J K M FJ FJ FJ GH JB JD JG 0.22 µF 224 F G J K M FK FK FK GK JB JD JL 0.27 µF 274 F G J K M JB JF 0.33 µF 334 F G J K M JD JG 0.39 µF 394 F G J K M JG 0.47 µF 474 F G J K M JG Rated Voltage (VDC) 10 16 25 50 100 200 250 10 16 25 50 100 200 250 50 100 200 250 50 100 200 Cap Capacitance Code Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 5 1 2 A 5 1 2 Case Size/Series C1206T C1210T C1812T C2220T *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 6 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Thickness Case Thickness ± Paper Quantity1 Plastic Quantity Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel BB 0402 0.50 ± 0.05 10,000 50,000 0 0 BD 0402 0.55 ± 0.05 10,000 50,000 0 0 CF 0603 0.80 ± 0.07 4,000 15,000 0 0 CH 0603 0.85 ± 0.07 4,000 10,000 0 0 DN 0805 0.78 ± 0.10 4,000 15,000 0 0 DP 0805 0.90 ± 0.10 4,000 15,000 0 0 DE 0805 1.00 ± 0.10 0 0 2,500 10,000 DF 0805 1.10 ± 0.10 0 0 2,500 10,000 DG 0805 1.25 ± 0.15 0 0 2,500 10,000 EB 1206 0.78 ± 0.10 4,000 10,000 4,000 10,000 EC 1206 0.90 ± 0.10 0 0 4,000 10,000 ED 1206 1.00 ± 0.10 0 0 2,500 10,000 EE 1206 1.10 ± 0.10 0 0 2,500 10,000 EF 1206 1.20 ± 0.15 0 0 2,500 10,000 EH 1206 1.60 ± 0.20 0 0 2,000 8,000 FB 1210 0.78 ± 0.10 0 0 4,000 10,000 FC 1210 0.90 ± 0.10 0 0 4,000 10,000 FE 1210 1.00 ± 0.10 0 0 2,500 10,000 FF 1210 1.10 ± 0.10 0 0 2,500 10,000 FG 1210 1.25 ± 0.15 0 0 2,500 10,000 FH 1210 1.55 ± 0.15 0 0 2,000 8,000 FM 1210 1.70 ± 0.20 0 0 2,000 8,000 FJ 1210 1.85 ± 0.20 0 0 2,000 8,000 FK 1210 2.10 ± 0.20 0 0 2,000 8,000 GB 1812 1.00 ± 0.10 0 0 1,000 4,000 GD 1812 1.25 ± 0.15 0 0 1,000 4,000 GH 1812 1.40 ± 0.15 0 0 1,000 4,000 GG 1812 1.55 ± 0.10 0 0 1,000 4,000 GK 1812 1.60 ± 0.20 0 0 1,000 4,000 GJ 1812 1.70 ± 0.15 0 0 1,000 4,000 GN 1812 1.70 ± 0.20 0 0 1,000 4,000 GM 1812 2.00 ± 0.20 0 0 500 2,000 JB 2220 1.00 ± 0.15 0 0 1,000 4,000 JD 2220 1.30 ± 0.15 0 0 1,000 4,000 JE 2220 1.40 ± 0.15 0 0 1,000 4,000 JF 2220 1.50 ± 0.15 0 0 1,000 4,000 JG 2220 1.70 ± 0.15 0 0 1,000 4,000 JL 2220 2.00 ± 0.20 0 0 500 2,000 7" Reel 13" Reel 7" Reel 13" Reel Thickness Case Thickness ± Code Size1 Range (mm) Paper Quantity1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 7 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Table 2B – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec1 N/A2 Case Size Packaging Quantities (pieces/unit packaging) EIA (in) Metric (mm) Minimum Maximum 0402 1005 0603 1608 0805 2012 50,000 1206 3216 1210 3225 1 1808 4520 1812 4532 1825 4564 20,000 2220 5650 2225 5664 1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products. 2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 8 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 Density Level A: Density Level B: Density Level C: EIA Metric Maximum (Most) Median (Nominal) Minimum (Least) Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm) Code Code C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 12101 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 1 Only for capacitance values ≥ 22 µF Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X V2 C C Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 9 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish T Profile Feature P Maximum Ramp-up Rate = 3°C/second tP SnPb 100% Matte Sn Maximum Ramp-down Rate = 6°C/second T Preheat/Soak e L tL r Temperature Minimum (TSmin) 100°C 150°C ratu Tsmax Temperature Maximum (T ) 150°C 200°C e Smax mp T Time (t) from T to T 60 – 120 seconds 60 – 120 seconds e smin t S Smin Smax T s 3°C/second 3°C/second Ramp-Up Rate (T to T ) L P maximum maximum 25 25°C to Peak Liquidous Temperature (T) 183°C 217°C L Time Time Above Liquidous (t) 60 – 150 seconds 60 – 150 seconds L Peak Temperature (T ) 235°C 260°C P Time Within 5°C of Maximum 20 seconds 30 seconds Peak Temperature (t ) maximum maximum P 6°C/second 6°C/second Ramp-Down Rate (T to T) P L maximum maximum Time 25°C to Peak 6 minutes 8 minutes Temperature maximum maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 10 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm Board Flex JIS–C–6429 for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X. Conditions: a) Method B, 4 hours at 155°C, dry heat at 235°C Solderability J–STD–002 b) Method B at 215°C category 3 c) Method D, category 3 at 260°C 1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test Temperature Cycling JESD22 Method JA–104 conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. MIL–STD–202 Method Measurement at 24 hours +/− 4 hours after test conclusion. Biased Humidity 103 Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/− 4 hours after test conclusion. MIL–STD–202 Method t = 24 hours/cycle. Steps 7a and 7b not required. Moisture Resistance 106 Measurement at 24 hours +/− 4 hours after test conclusion. MIL–STD–202 Method −55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 Thermal Shock 107 seconds, dwell time – 15 minutes. Air – Air. MIL–STD–202 Method High Temperature Life 108 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied. /EIA–198 MIL–STD–202 Method Storage Life 150°C, 0 VDC for 1,000 hours. 108 5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 MIL–STD–202 Method Vibration secure points on one long side and 2 secure points at corners of opposite sides. Parts 204 mounted within 2" from any secure point. Test from 10 – 2,000 Hz MIL–STD–202 Method Mechanical Shock Figure 1 of Method 213, Condition F. 213 MIL–STD–202 Method Resistance to Solvents Add aqueous wash chemical, OKEM Clean or equivalent. 215 Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 11 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Construction Detailed Cross Section Dielectric Material (CaZrO) 3 Barrier Layer Dielectric Material (Ni) (CaZrO) 3 Termination Finish End Termination/ (100% Matte Sn / External Electrode SnPb - 5% Pb min) (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Inner Electrodes (Ni) Capacitor Marking (Optional): Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 12 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel KEMET ® Epumnbcohsesde pda pplears tciac*rr ioerr . Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm Anti-static cover tape or 16 mm carrier tape 180 mm (7.00") (0.10 mm (0.004") maximum thickness) or 330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm) New 2 mm Pitch Reel Options* Embossed Plastic Punched Paper Tape Packaging EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Ordering Code Packaging Type/Options (W)* Pitch (P)* Pitch (P)* 1 1 (C-Spec) 01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked 0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked C-7081 Commercial grade 7" reel unmarked 0805 8 4 4 4 4 C-7082 Commercial grade 13" reel unmarked 1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size. 1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development. ≥ 1812 12 8 8 Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing KPS 1210 12 8 8 • Lower placement costs. KPS 1812 • Double the parts on each reel results in fewer reel 16 12 12 and 2220 changes and increased effi ciency. Array 0612 8 4 4 • Fewer reels result in lower packaging, shipping and *Refer to Figures 1 and 2 for W and P carrier tape reference locations. storage costs, reducing waste. 1 *Refer to Tables 6 and 7 for tolerance specifi cations. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 13 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Figure 1 – Embossed (Plastic) Carrier Tape Dimensions T P 2 T2 ØD0 P0 t(o1l0e rpaintcchee osn c tuampuel a±0ti.v2e mm) E1 A 0 F K 0 W B1 B0 E2 S P 1 1 T1 Center Lines of Cavity ØD Embossment 1 For cavity size, Cover Tape see Note 1 Table 4 B is for tape feeder reference only, 1 including draft concentric about B0. User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) D Minimum R Reference S Minimum T T Tape Size D 1 E P P 1 1 0 Note 1 1 0 2 Note 2 Note 3 Maximum Maximum 1.0 25.0 8 mm (0.039) (0.984) 1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100 12 mm (0.059 +0.004/−0.0) 1.5 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 30 (0.024) (0.024) (0.004) (0.059) (1.181) 16 mm Variable Dimensions — Millimeters (Inches) B Maximum E T W Tape Size Pitch 1 2 F P 2 A,B & K Note 4 Minimum 1 Maximum Maximum 0 0 0 4.35 6.25 3.5 ±0.05 4.0 ±0.10 2.5 8.3 8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098) (0.327) Single (4 mm) 8.2 10.25 5.5 ±0.05 8.0 ±0.10 4.6 12.3 12 mm Note 5 and double (8 mm) (0.323) (0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181) (0.484) 12.1 14.25 7.5 ±0.05 12.0 ±0.10 4.6 16.3 16 mm Triple (12 mm) (0.476) (0.561) (0.138 ±0.002) (0.157 ±0.004) (0.181) (0.642) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independently of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6.) 3. If S < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.) 1 4. B dimension is a reference dimension for tape feeder clearance only. 1 5. The cavity defi ned by A, B and K shall surround the component with suffi cient clearance that: 0 0 0 (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.) (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4.) (e) for KPS product, A and B are measured on a plane 0.3 mm above the bottom of the pocket. 0 0 (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 14 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Figure 2 – Punched (Paper) Carrier Tape Dimensions T ØDo Po t(o1l0e rpaintcchee osn c tuampeu l±a0ti.v2e mm) E1 A 0 F W Bottom Cover Tape B0 E2 P1 G T1 Cavity Size, T1 Top Cover Tape Center Lines of Cavity SNeoete 1, Table 7 Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) R Reference Tape Size D E P P T Maximum G Minimum 0 1 0 2 1 Note 2 0.10 1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.75 25 8 mm (0.004) (0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.030) (0.984) maximum Variable Dimensions — Millimeters (Inches) Tape Size Pitch E2 Minimum F P T Maximum W Maximum A B 1 0 0 2.0 ±0.05 8.3 8 mm Half (2 mm) 6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327) Note 1 (0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3 8 mm Single (4 mm) (0.157 ±0.004) (0.327) 1. The cavity defi ned by A, B and T shall surround the component with suffi cient clearance that: 0 0 a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3.) d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.) e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6.) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 15 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Maximum Component Rotation Top View Side View Typical Pocket Centerline Tape Maximum ° Width (mm) Rotation ( °) s T 8,12 20 Bo Tape Maximum 16 – 200 10 Width (mm) Rotation ( °) S 8,12 20 Typical Component Centerline 16 – 56 10 72 – 200 5 Ao Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius 8 mm & 12 mm Tape 16 mm Tape Embossed Punched Carrier Carrier 0.5 mm maximum 1.0 mm maximum 0.5 mm maximum 1.0 mm maximum Bending R R Radius © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 16 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Figure 6 – Reel Dimensions W Full Radius, (Includes Access Hole at 3 See Note Slot Location flange distortion (Ø 40 mm minimum) at outer edge) W (Measured at hub) 2 A D (See Note) N C (Arbor hole W (Measured at hub) diameter) 1 If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth B (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) 1.5 13.0 +0.5/−0.2 20.2 12 mm or (0.059) (0.521 +0.02/−0.008) (0.795) 330 ±0.20 16 mm (13.000 ±0.008) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W W Maximum W 1 2 3 8.4 +1.5/−0.0 14.4 8 mm (0.331 +0.059/−0.0) (0.567) 50 12.4 +2.0/−0.0 18.4 Shall accommodate tape 12 mm (1.969) (0.488 +0.078/−0.0) (0.724) width without interference 16.4 +2.0/−0.0 22.4 16 mm (0.646 +0.078/−0.0) (0.882) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 17 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier Carrier Tape 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) 100 mm minimum leader Trailer Components 400 mm minimum 160 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes Carrier Tape (32 mm & wider tapes) Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 18 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 – 250 VDC KEMET Electronics Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1026_C0G_COTS_SMD • 3/11/2019 19 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: K EMET: C0603T101J5GCL C1206T182K2GAL7800 C0805T101K2GCLTU C0402T101J5GALTU C0603T101J5GALTU C1206T330J5GACTU C1206T101J5GACTU C1206T331J5GACTU C1206T510J5GACTU C1206T121J5GACTU C0805T102J1GACTU C0805T471J1GACTU C0603T330J5GACTU C0603T681J3GACTU C0402T101J5GACTU C0402T508D3GALTU C0402T330J5GALTU C0402T689D5GALTU C0603T470F5GACTU C0603T479C5GCLTU C0603T221F5GCLTU C0603T102G5GCLTU C0805T220J5GALTU C0603T471J5GCLTU C0402T330F3GACTU C0603T102J5GCLTU C0603T101J5GCLTU C0603T101J5GACTU C0402T270J3GACTU C0402T101F5GACTU C0402T470K5GACTU C0402T330J3GACTU C0402T100J5GALTU C0603T102J5GALTU C0603T680J5GCLTU C0805T220J5GCLTU C1210T472J1GALTU C0603T103K3GALTU C0402T101J5GAC7867 C0603T220J5GAC7867 C0603T102J5GAC7867 C0603T470J5GAC7867 C0603T100J5GAC7867 C0603T180J5GAC7867 C0603T100J5GALTU