BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features Mechanical Data  Planar Die Construction  Case: SOD323  Small Surface Mount Package  Case Material: Molded Plastic.  Ideally Suited for Automated Assembly Processes UL Flammability Classification Rating 94V-0  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Moisture Sensitivity: Level 1 per J-STD-020  Halogen and Antimony Free. “Green” Device (Notes 3 & 4)  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe  Qualified to AEC-Q101 Standards for High Reliability (Lead Free Plating). Solderable per MIL-STD-202, Method 208  Polarity: Cathode Band  Weight: 0.0049 grams (Approximate) SOD323 Top View Ordering Information (Note 5) Part Number Qualification Case Packaging (Type Number)-7-F* Commercial SOD323 3,000/Tape & Reel (Type Number)Q-7-F* Automotive SOD323 3,000/Tape & Reel *Add “-7-F” to the appropriate type number in Electrical Characteristics Table, example: 6.2V Zener – BZT52C6V2S-7-F. Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Products manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 5. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information XX = Product Type Marking Code for XX = Product Type Marking Code for XX SAT (Shanghai Assembly / Test site) XX CAT (Chengdu Assembly / Test site) (See Electrical Characteristics Table) (See Electrical Characteristics Table) BZT52C2V0S - BZT52C39S 1 of 5 February 2017 Document number: DS30093 Rev. 20 - 2 www.diodes.com © Diodes Incorporated

BZT52C2V0S - BZT52C39S Maximum Ratings (@TA = +25°C, unless otherwise specified.) Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Symbol Value Unit Forward Voltage (Note 6) @IF = 10mA VF 0.9 V Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 7) PD 200 mW Thermal Resistance, Junction to Ambient Air (Note 7) RJA 625 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Maximum Temperature Zener Voltage Maximum Zener Impedance Reverse Current Coefficient of Range (Note 4) f = 1kHz Marking (Note 6) Zener Voltage Type Number Code VZ @IZT IZT ZZT @IZT ZZK @IZK IZK IR @VR @ImZTV =/ °5Cm A Nom (V) Min (V) Max (V) (mA) Ω mA uA V Min Max BZT52C2V0S WY 2.0 1.91 2.09 5 100 600 1.0 150 1.0 -3.5 0 BZT52C2V4S WX 2.4 2.20 2.60 5 100 600 1.0 50 1.0 -3.5 0 BZT52C2V7S W1 2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0 BZT52C3V0S W2 3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0 BZT52C3V3S W3 3.3 3.1 3.5 5 95 600 1.0 5 1.0 -3.5 0 BZT52C3V6S W4 3.6 3.4 3.8 5 90 600 1.0 5 1.0 -3.5 0 BZT52C3V9S W5 3.9 3.7 4.1 5 90 600 1.0 3 1.0 -3.5 0 BZT52C4V3S W6 4.3 4.0 4.6 5 90 600 1.0 3 1.0 -3.5 0 BZT52C4V7S W7 4.7 4.4 5.0 5 80 500 1.0 2 2.0 -3.5 0.2 BZT52C5V1S W8 5.1 4.8 5.4 5 60 480 1.0 1 2.0 -2.7 1.2 BZT52C5V6S W9 5.6 5.2 6.0 5 40 400 1.0 3 2.0 -2.0 2.5 BZT52C6V2S WA 6.2 5.8 6.6 5 10 150 1.0 2 4.0 0.4 3.7 BZT52C6V8S WB 6.8 6.4 7.2 5 15 80 1.0 1 4.0 1.2 4.5 BZT52C7V5S WC 7.5 7.0 7.9 5 15 80 1.0 0.7 5.0 2.5 5.3 BZT52C8V2S WD 8.2 7.7 8.7 5 15 80 1.0 0.5 5.0 3.2 6.2 BZT52C9V1S WE 9.1 8.5 9.6 5 15 100 1.0 0.2 6.0 3.8 7.0 BZT52C10S WF 10 9.4 10.6 5 20 150 1.0 0.1 7.0 4.5 8.0 BZT52C11S WG 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0 BZT52C12S WH 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0 BZT52C13S WI 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0 BZT52C15S WJ 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0 BZT52C16S WK 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 — BZT52C18S WL 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 — BZT52C20S WM 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 — BZT52C22S WN 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 — BZT52C24S WO 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 — BZT52C27S WP 27 25.1 28.9 2 80 300 0.5 0.1 18.9 21.4 — BZT52C30S WQ 30 28.0 32.0 2 80 300 0.5 0.1 21.0 24.4 — BZT52C33S WR 33 31.0 35.0 2 80 325 0.5 0.1 23.1 27.4 — BZT52C36S WS 36 34.0 38.0 2 90 350 0.5 0.1 25.2 30.4 — BZT52C39S WT 39 37.0 41.0 2 130 350 0.5 0.1 27.3 33.4 — Notes: 6. Short duration pulse test used to minimize self-heating effect. 7. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com/package-outlines.html. BZT52C2V0S - BZT52C39S 2 of 5 February 2017 Document number: DS30093 Rev. 20 - 2 www.diodes.com © Diodes Incorporated

BZT52C2V0S - BZT52C39S 300 50 TJ = 25°C C2V7 C3V9 C5V6 Note 7 C2V0 C3V3 C4V7 C6V8 W) 40 TION (m200 NT (mA) 30 C8V2 A E P R SI R S U DI C R R 20 E E W100 N , POD I, ZEZ10Test5 C.0umrreAnt IZ P 0 0 0 40 80 120 160 200 0 1 2 3 4 5 6 7 8 9 10 T , AMBIENT TEMPERATURE, °C V , ZENER VOLTAGE (V) A Z Fig. 1 Power Derating Curve Fig. 2 Typical Zener Breakdown Characteristics 30 1,000 TJ = 25°C C10 T = 25 °C J C12 F) VR = 1V p T (mA) 20 C15 NCE ( VR = 2V REN CITA R C18 A100 U P R C L CA VR = 1V E C22 A N 10 T E C27 O Z Test current IZ C39 T , Z 5mA C33 C36 , T V = 2V I C R 10 0 0 10 20 30 40 1 10 100 V , ZENER VOLTAGE (V) V , NOMINAL ZENER VOLTAGE (V) Z Z Fig. 3 Typical Zener Breakdown Characteristics Fig. 4 Typical Total Capacitance vs. Nominal Zener Voltage BZT52C2V0S - BZT52C39S 3 of 5 February 2017 Document number: DS30093 Rev. 20 - 2 www.diodes.com © Diodes Incorporated

BZT52C2V0S - BZT52C39S Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SOD323 A2 A1 SOD323 Dim Min Max Typ A1 -- 0.10 0.05 a A2 1.00 1.10 1.05 c L b 0.25 0.35 0.30 He c 0.10 0.15 0.11 E D 1.20 1.40 1.30 E 1.60 1.80 1.70 He 2.30 2.70 2.50 L 0.20 0.40 0.30 a 0º 8º -- b D All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SOD323 X1 Dimensions Value (in mm) X 0.590 Y X1 2.700 Y 0.450 X BZT52C2V0S - BZT52C39S 4 of 5 February 2017 Document number: DS30093 Rev. 20 - 2 www.diodes.com © Diodes Incorporated

BZT52C2V0S - BZT52C39S IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2017, Diodes Incorporated www.diodes.com BZT52C2V0S - BZT52C39S 5 of 5 February 2017 Document number: DS30093 Rev. 20 - 2 www.diodes.com © Diodes Incorporated