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DISCRETE SEMICONDUCTORS DATA SHEET M3D743 BZA900AVL series Quadruple low capacitance ESD suppressor Product data sheet 2003 Oct 20 Supersedes data of 2003 Apr 15

NXP Semiconductors Product data sheet Quadruple low capacitance ESD BZA900AVL series suppressor FEATURES PINNING • Low diode capacitance PIN DESCRIPTION • Low leakage current 1 cathode 1 • SOT665 surface mount package 2 common anode • Common anode configuration. 3 cathode 2 4 cathode 3 APPLICATIONS 5 cathode 4 • Communication systems • Computers and peripherals • Audio and video equipment. DESCRIPTION handbook, halfpage5 4 1 Monolithic transient voltage suppressor diode in a five lead 3 SOT665 package for 4-bit wide ESD transient 2 suppression. 4 5 MARKING 1 2 3 MGW315 TYPE NUMBER MARKING CODE BZA956AVL V3 BZA962AVL V2 Fig.1 Simplified outline (SOT665) and symbol. BZA968AVL V1 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION BZA956AVL − plastic surface mounted package; 5 leads SOT665 BZA962AVL − plastic surface mounted package; 5 leads SOT665 BZA968AVL − plastic surface mounted package; 5 leads SOT665 2003 Oct 20 2

NXP Semiconductors Product data sheet Quadruple low capacitance ESD BZA900AVL series suppressor LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode I working current T = 25 °C − note 1 mA Z amb I continuous forward current T = 25 °C − 200 mA F amb I non-repetitive peak forward current t = 1 ms; square pulse − 3.5 A FSM p P total power dissipation T = 25 °C; note 2; see Fig.5 − 335 mW tot amb P non repetitive peak reverse power square pulse; t = 1 ms − 6 W ZSM p dissipation T storage temperature −65 +150 °C stg T junction temperature − 150 °C j ESD electrostatic discharge IEC 61000-4-2 (contact discharge) 15 − kV HBM MIL-Std 883 10 − kV Notes 1. DC working current limited by P . tot(max) 2. Device mounted on standard printed-circuit board. ESD STANDARDS COMPLIANCE STANDARD CONDITIONS IEC 61000-4-2, level 4 (ESD) >15 kV (air); >8 kV (contact discharge) HBM MIL-Std 883, class 3 >4 kV THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT R thermal resistance from junction to all diodes loaded 370 K/W th j-a ambient R thermal resistance from junction to one diode loaded 135 K/W th j-s solder point; note 1 all diodes loaded 125 K/W Note 1. Solder point of common anode (pin 2). 2003 Oct 20 3

NXP Semiconductors Product data sheet Quadruple low capacitance ESD BZA900AVL series suppressor ELECTRICAL CHARACTERISTICS T = 25 °C unless otherwise specified. j SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V forward voltage I = 200 mA − − 1.2 V F F I reverse current R BZA956AVL V = 3 V − − 200 nA R BZA962AVL V = 4 V − − 100 nA R BZA968AVL V = 4.3 V − − 20 nA R V working voltage I = 1 mA Z Z BZA956AVL 5.32 5.6 5.88 V BZA962AVL 5.89 6.2 6.51 V BZA968AVL 6.46 6.8 7.14 V r differential resistance I = 1 mA dif Z BZA956AVL − − 200 Ω BZA962AVL − − 150 Ω BZA968AVL − − 100 Ω S temperature coefficient I = 1 mA Z Z BZA956AVL − 1.3 − mV/K BZA962AVL − 2.4 − mV/K BZA968AVL − 2.9 − mV/K C diode capacitance f = 1 MHz; V = 0 d R BZA956AVL − 22 28 pF BZA962AVL − 18 22 pF BZA968AVL − 16 19 pF diode capacitance f = 1 MHz; V = 5 V R BZA956AVL − 12 17 pF BZA962AVL − 9 12 pF BZA968AVL − 8 11 pF I non-repetitive peak reverse current t = 1 ms; T = 25 °C ZSM p amb BZA956AVL − − 0.90 A BZA962AVL − − 0.85 A BZA968AVL − − 0.80 A 2003 Oct 20 4

NXP Semiconductors Product data sheet Quadruple low capacitance ESD BZA900AVL series suppressor 10 MLE001 102 MLE003 handbook, halfpage handbook, halfpage IZSM PZSM (A) (W) BZA956AVL BZA956AVL BZA962AVL 1 10 BZA968AVL BZA962AVL/BZA968AVL 10−1 1 10−2 10−1 1 10 10−2 10−1 1 10 tp (ms) tp (ms) Fig.3 Maximum non-repetitive peak reverse Fig.2 Maximum non-repetitive peak reverse power dissipation as a function of pulse current as a function of pulse time. duration (square pulse). MLE002 MGT586 26 400 handbook, halfpage handbook, halfpage Cd Ptot (pF) (mW) 22 300 18 200 BZA956AVL 14 BZA962AVL 100 10 BZA968AVL 6 0 0 1 2 3 4 5 0 50 100 150 VR (V) Tamb (°C) Tj = 25 °C; f = 1 MHz. Fig.4 Diode capacitance as a function of reverse voltage; typical values. Fig.5 Power derating curve. 2003 Oct 20 5

NXP Semiconductors Product data sheet Quadruple low capacitance ESD BZA900AVL series suppressor handbook, full pagewidth ESD TESTER RG 223/U DIGITIZING RZ 450 Ω 50 Ω coax 10× OSCILLOSCOPE ATTENUATOR CZ note 1 50 Ω IEC 1000-4-2 network 1/4 BZA900AVL Note 1: attenuator is only used for open CZ = 150 pF; RZ = 330 Ω socket high voltage measurements vertical scale = 200 V/div vertical scale = 5 V/div horizontal scale = 50 ns/div horizontal scale = 50 ns/div BZA968AVL GND3 BZA962AVL GND2 GND BZA956AVL GND1 unclamped +1 kV ESD voltage waveform clamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) (IEC 1000-4-2 network) GND GND vertical scale = 200 V/div vertical scale = 5 V/div horizontal scale = 50 ns/div horizontal scale = 50 ns/div unclamped −1 kV ESD voltage waveform clamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) (IEC 1000-4-2 network) MLE005 Fig.6 ESD clamping test set-up and waveforms. 2003 Oct 20 6

NXP Semiconductors Product data sheet Quadruple low capacitance ESD BZA900AVL series suppressor APPLICATION INFORMATION Typical common anode application A quadruple transient suppressor in a SOT665 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs.7 and 8. handbook, full pagewidth A B keyboard, C terminal, I/O D printer, etc. FUNCTIONAL DECODER BZA900AVL GND MLE008 Fig.7 Computer interface protection. handbook, full pagewidth VDD VGG address bus RAM ROM I/O data bus CPU CLOCK control bus BZA900AVL GND MLE009 Fig.8 Microprocessor protection. 2003 Oct 20 7

NXP Semiconductors Product data sheet Quadruple low capacitance ESD BZA900AVL series suppressor Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA900AVL is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors 2. Keep parallel signal paths to a minimum 3. Avoid running protection conductors in parallel with unprotected conductors 4. Minimize all printed-circuit board loop areas including power and ground loops 5. Minimize the length of the transient return path to ground 6. Avoid using shared transient return paths to a common ground point. 2003 Oct 20 8

NXP Semiconductors Product data sheet Quadruple low capacitance ESD BZA900AVL series suppressor PACKAGE OUTLINE Plastic surface mounted package; 5 leads SOT665 D A E X S Y S HE 5 4 A 1 2 3 c e1 bp w M A Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E e e1 HE Lp w y 0.6 0.27 0.18 1.7 1.3 1.7 0.3 mm 1.0 0.5 0.1 0.1 0.5 0.17 0.08 1.5 1.1 1.5 0.1 OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC EIAJ PROJECTION 01-01-04 SOT665 01-08-27 2003 Oct 20 9

NXP Semiconductors Product data sheet Quadruple low capacitance ESD BZA900AVL series suppressor DATA SHEET STATUS DOCUMENT PRODUCT DEFINITION STATUS(1) STATUS(2) Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings General ⎯ Information in this document is believed to be System of IEC 60134) may cause permanent damage to accurate and reliable. However, NXP Semiconductors the device. Limiting values are stress ratings only and does not give any representations or warranties, operation of the device at these or any other conditions expressed or implied, as to the accuracy or completeness above those given in the Characteristics sections of this of such information and shall have no liability for the document is not implied. Exposure to limiting values for consequences of use of such information. extended periods may affect device reliability. Right to make changes ⎯ NXP Semiconductors Terms and conditions of sale ⎯ NXP Semiconductors reserves the right to make changes to information products are sold subject to the general terms and published in this document, including without limitation conditions of commercial sale, as published at specifications and product descriptions, at any time and http://www.nxp.com/profile/terms, including those without notice. This document supersedes and replaces all pertaining to warranty, intellectual property rights information supplied prior to the publication hereof. infringement and limitation of liability, unless explicitly Suitability for use ⎯ NXP Semiconductors products are otherwise agreed to in writing by NXP Semiconductors. In not designed, authorized or warranted to be suitable for case of any inconsistency or conflict between information use in medical, military, aircraft, space or life support in this document and such terms and conditions, the latter equipment, nor in applications where failure or malfunction will prevail. of an NXP Semiconductors product can reasonably be No offer to sell or license ⎯ Nothing in this document expected to result in personal injury, death or severe may be interpreted or construed as an offer to sell products property or environmental damage. NXP Semiconductors that is open for acceptance or the grant, conveyance or accepts no liability for inclusion and/or use of NXP implication of any license under any copyrights, patents or Semiconductors products in such equipment or other industrial or intellectual property rights. applications and therefore such inclusion and/or use is at the customer’s own risk. Export control ⎯ This document as well as the item(s) described herein may be subject to export control Applications ⎯ Applications that are described herein for regulations. Export might require a prior authorization from any of these products are for illustrative purposes only. national authorities. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the Quick reference data ⎯ The Quick reference data is an specified use without further testing or modification. extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 2003 Oct 20 10

NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/03/pp11 Date of release: 2003 Oct 20 Document order number: 9397 750 11935